Copper surface marking method, device, storage medium and computer equipment

Abstract

An embodiment of the present invention provides a copper surface marking method, apparatus, storage medium, and computer equipment. The method includes: obtaining a laser drawing file, performing a fill process on the laser graphics in the laser drawing file to generate a fill graphic, wherein the fill graphic is a first layer; setting the last line of the fill graphic as a repeating line, wherein the repeating line is a second layer; and sending a laser instruction to a laser device, wherein the laser instruction includes set laser parameters, so that the laser device responds to the laser instruction and performs laser processing on the first layer according to the laser parameters and performs laser supplementation processing on the second layer. In the technical solution provided by the embodiment of the present invention, by setting the last line of the fill graphic as a repeating line and performing laser supplementation processing on the repeating line, the laser whitening phenomenon during the laser marking process can be reduced, the effect of copper surface marking can be improved, and work efficiency can be improved.

Description

Technical field

[0001] The present invention relates to the field of laser application technology, and in particular to a copper surface marking method, device, storage medium and computer equipment. [Background Technology]

[0002] In existing scenarios, when laser marking a copper surface requires an overall marking, such as with radium black laser marking, the inventors have discovered that the final laser mark is prone to a laser whitening phenomenon. In practice, this laser whitening phenomenon can affect the identification of subsequent processing steps, resulting in poor radium black marking results and affecting work efficiency. Therefore, the existing technology presents problems that need to be addressed urgently. [Summary of the invention]

[0003] In view of this, embodiments of the present invention provide a copper surface marking method, apparatus, storage medium, and computer equipment to reduce the laser whitening phenomenon during the laser process, improve the effect of radium black marking on the copper surface, and improve work efficiency.

[0004] In one aspect, an embodiment of the present invention provides a copper surface marking method, comprising:

[0005] Acquire a laser image file, and perform filling processing on the laser pattern in the laser image file to generate a filled pattern, where the filled pattern is a first layer;

[0006] The last line of the fill pattern is set as a repeating line, and the repeating line is the second layer;

[0007] A laser instruction is sent to a laser device, wherein the laser instruction includes set laser parameters, so that the laser device responds to the laser instruction, and the laser device performs laser processing on the first layer and performs laser complement processing on the second layer according to the laser parameters.

[0008] Optionally, the filling process of the laser pattern in the laser image file to generate a filled pattern includes:

[0009] The frame of the laser pattern in the laser image file is deleted, and the laser pattern is filled according to the position of the frame to generate the filled pattern.

[0010] Optionally, before sending the laser instruction to the laser device, the method further includes:

[0011] Set the laser parameters of the first layer and the second layer.

[0012] Optionally, the laser parameters include cutting speed, laser pulse frequency, laser pulse width, laser power, light-on delay, light-off delay and number of cutting times;

[0013] Wherein, the laser pulse frequency of the first layer and the second layer is 20000HZ-50000HZ.

[0014] Optionally, the cutting speed of the second layer is half of the cutting speed of the first layer, wherein the cutting speed of the first layer is 700 mm / s-1500 mm / s, and the cutting speed of the second layer is 300 mm / s-700 mm / s.

[0015] Optionally, the laser power ranges from 5W to 7W.

[0016] On the other hand, an embodiment of the present invention provides a copper surface marking device, comprising:

[0017] a processing module for acquiring a laser image file, performing a filling process on the laser pattern in the laser image file, and generating a filled pattern, wherein the filled pattern is a first layer;

[0018] A first setting module is used to set the last line of the fill pattern as a repeated line, and the repeated line is a second layer;

[0019] The sending module is used to send a laser instruction to the laser device, wherein the laser instruction includes set laser parameters, so that the laser device responds to the laser instruction, and the laser device performs laser processing on the first layer and performs laser supplementation processing on the second layer according to the laser parameters.

[0020] Optionally, the processing module is specifically configured to delete a frame of the laser pattern in the laser image file, and perform a filling process on the laser pattern according to a position of the frame to generate the filled pattern.

[0021] On the other hand, an embodiment of the present invention provides a storage medium, which includes a stored program, wherein when the program is run, the device where the storage medium is located is controlled to execute the above-mentioned copper surface marking method.

[0022] On the other hand, an embodiment of the present invention provides a computer device comprising a memory and a processor, wherein the memory is used to store information including program instructions, and the processor is used to control the execution of the program instructions, characterized in that when the program instructions are loaded and executed by the processor, the steps of the above-mentioned copper surface marking method are implemented.

[0023] In the technical solution of the copper surface marking method provided by the embodiment of the present invention, a laser image is obtained, a filling process is performed on the laser image in the laser image to generate a filled image, and the filled image is a first layer; the last line of the filled image is set as a repeating line, and the repeating line is a second layer; a laser instruction is sent to a laser device, and the laser instruction includes set laser parameters for the laser device to respond to the laser instruction. The laser device performs laser processing on the first layer and performs laser supplementation processing on the second layer according to the laser parameters. In the technical solution provided by the embodiment of the present invention, by setting the last line of the filled image as a repeating line and performing laser supplementation processing on the repeating line, the laser whitening phenomenon during the laser process can be reduced, the effect of copper surface marking can be improved, and work efficiency can be improved.

Brief Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 A schematic diagram of the laser bleaching phenomenon provided by one embodiment of the present invention;

[0026] Figure 2 A flow chart of a copper surface marking method provided by one embodiment of the present invention;

[0027] Figure 3 A schematic diagram comparing laser treatment and radium supplementation treatment provided in one embodiment of the present invention;

[0028] Figure 4 A schematic diagram comparing laser treatment and radium supplementation treatment under an electron microscope provided in one embodiment of the present invention;

[0029] Figure 5 A schematic diagram of a laser slicing effect provided by an embodiment of the present invention;

[0030] Figure 6 A schematic diagram comparing laser treatment and radium supplementation treatment of a first material provided by one embodiment of the present invention;

[0031] Figure 7 A schematic diagram of radium supplementation treatment of a second material provided in one embodiment of the present invention;

[0032] Figure 8 A schematic structural diagram of a copper surface marking device provided by one embodiment of the present invention;

[0033] Figure 9 A schematic diagram of a computer device provided in an embodiment of the present invention. [Specific implementation method]

[0034] In order to better understand the technical solution of the present invention, the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0035] It should be understood that the embodiments described are only a portion of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative work are within the scope of protection of the present invention.

[0036] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The singular forms "a", "an", "the" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0037] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0038] In one embodiment of the present invention, copper surface marking can be applied to laser marking of integrated circuit (IC) substrates, carriers, and other products. When the copper surface needs to be entirely laser-black, the final laser mark position is prone to laser whitening. Figure 1 A schematic diagram of the laser bleaching phenomenon provided by an embodiment of the present invention is shown in FIG. Figure 1 As shown, the laser graphics include rectangles, circles, triangles, crosses, check marks, etc. When the laser graphics is a rectangle, the left, right, upper or lower edges of the rectangle have laser whitish phenomenon; when the laser graphics is a circle, the left or right edge of the circle has laser whitish phenomenon; when the laser graphics is a triangle, the upper or lower edge of the triangle has laser whitish phenomenon; when the laser graphics is a cross, the edge of the cross has laser whitish phenomenon; when the laser graphics is a check mark, the edge of the check mark has laser whitish phenomenon.

[0039] The whitening of laser bleaching often occurs at the edge of the image. This location can be confirmed by using laser horizontal and vertical lines, as well as rotating lines. When the fill lines are horizontal or vertical, the whitening often occurs at the last vertical or horizontal line on the edge. When the fill lines are rotating, the whitening occurs at the outer circle or center (corresponding to the rotating method, rotating outward or inward).

[0040] Laser bleaching is caused by the following reasons:

[0041] A. Carbonization and oxidation of copper surface.

[0042] B. Energy accumulates during laser irradiation and cannot be dissipated in time.

[0043] C. The surface roughness of the copper surface is abnormal.

[0044] Observation under a three-dimensional (3D) microscope reveals that the greater the surface roughness of the copper surface, the more pronounced the radium blackening effect. No significant chemical changes were observed on the surface of the laser material after alcohol cleaning or prolonged storage. However, a noticeable whitening phenomenon was observed during laser irradiation, when heat dissipation was accelerated.

[0045] In order to solve the technical problems in the related art, an embodiment of the present invention provides a copper surface marking method. Figure 2 A flow chart of a copper surface marking method provided by one embodiment of the present invention is as follows: Figure 2 As shown, the method includes:

[0046] Step 102: Obtain a laser image file, perform filling processing on the laser pattern in the laser image file, and generate a filled pattern, which is the first layer.

[0047] In one embodiment of the present invention, each step is performed by a computer device that processes the laser drawing using computer-aided design (CAD) software. For example, CAD software includes Trans, a graphics processing software used for auxiliary machining. Trans primarily imports, analyzes, and processes files in DXF, Gerber, and ROU formats, and exports them as processed (*.PRG) files and target (*.FID) files.

[0048] In one embodiment of the present invention, a plurality of laser patterns may be stored in the laser image file, and a filling process is performed on each laser pattern.

[0049] Specifically, the frame of the laser pattern in the laser image file is deleted, and the laser pattern is filled according to the position of the frame to generate a filled pattern.

[0050] In one embodiment of the present invention, the filling lines include horizontal lines, vertical lines, horizontal and vertical lines, oblique lines, or spiral lines, and the spacing of the filling lines can be set.

[0051] In one embodiment of the present invention, the laser pattern may be filled with horizontal lines, vertical lines, horizontal and vertical lines, oblique lines, or spiral lines to generate a filled pattern.

[0052] In one embodiment of the present invention, an appropriate filling method can be adaptively selected based on the position of the frame. For example, if the laser pattern corresponding to the frame position is an X-shape, the filling method is diagonal filling. In the X-shape, diagonal filling can reduce the number of filling lines compared to horizontal or vertical filling, thereby improving filling efficiency.

[0053] In one embodiment of the present invention, when filling the laser pattern, the border must be deleted, otherwise the entire border will easily turn white during laser processing.

[0054] Step 104: Set the last line of the filled shape as a repeating line, and the repeating line is the second layer.

[0055] Step 106: Set the laser parameters of the first layer and the second layer.

[0056] In one embodiment of the present invention, the laser parameters include cutting speed, laser pulse frequency, laser pulse width, laser power, on delay, off delay, number of cutting times, etc.

[0057] In one embodiment of the present invention, the laser pulse frequency of the first layer and the second layer is 20000 Hz-50000 Hz.

[0058] In one embodiment of the present invention, the laser parameters of the first layer are shown in Table 1 below:

[0059] Table 1

[0060]

[0061] As shown in Table 1 above, the cutting speed for the first layer is 700 mm / s, the laser pulse frequency is 20,000 Hz, the laser pulse width is 19 μs, the number of cuts is 1, the focal length offset is 0 μm, the light-on delay is 0 μs, the light-off delay is 230 μs, the cutting delay is 250 μs, and the laser power is 5 W. In one embodiment of the present invention, the laser parameters for the second layer are shown in Table 2 below:

[0062] Table 2

[0063]

[0064] As shown in Table 2 above, the cutting speed of the second layer is 300mm / s, the laser pulse frequency is 20000HZ, the laser pulse width is 19us, the number of cuts is 1, the focal length offset is 0um, the light-on delay is 0us, the light-off delay is 230us, the cutting delay is 250us, and the laser power is 5W.

[0065] In one embodiment of the present invention, the cutting speed of the second layer may be half of the cutting speed of the first layer, wherein the cutting speed of the first layer may be 700 mm / s-1500 mm / s, and the cutting speed of the second layer may be 300 mm / s-700 mm / s.

[0066] In one embodiment of the present invention, the laser power ranges from 5W to 7W (the laser power may vary slightly under different laser pulse frequencies and laser pulse widths).

[0067] In one embodiment of the present invention, a low-frequency 532-pulse nanosecond laser is used, operating at a frequency of 20-50 kHz, with a laser spot size of 30-50 μm and a laser pattern fill spacing of 40 μm. Laser parameters include a power of 5W-7W and a cutting speed of 700-1500 mm / s. Only under these specific laser parameters will the copper surface achieve a radium-black effect; otherwise, it will tend to turn white.

[0068] Step 108: Send a laser instruction to the laser device, where the laser instruction includes set laser parameters, so that the laser device responds to the laser instruction and performs laser processing on the first layer and laser supplementation processing on the second layer according to the laser parameters.

[0069] In one embodiment of the present invention, the laser device includes an X-out device, which is used to automatically identify the scrapped units on the strip board after the defect detection process and mark them with various laser patterns (X shapes).

[0070] Figure 3 A schematic diagram comparing laser treatment and radium supplementation treatment provided in one embodiment of the present invention is shown in FIG. Figure 3 As shown, the figure on the left is a schematic diagram of a single laser treatment. After the single laser treatment, the whitening width of the copper surface is 50um. The figure on the right is a schematic diagram of a radium supplementation treatment. After the radium supplementation treatment, the whitening width of the copper surface is 30um. After the radium supplementation treatment, the whitening width is reduced, and the radium black effect of the copper surface is also significantly darkened.

[0071] In one embodiment of the present invention, after step 108, the process further includes: confirming the laser effect, specifically, determining the whitening effect of the copper surface under a microscope, inspecting the roughness of the copper surface, and cutting the copper surface into slices for cross-sectional depth comparison.

[0072] Figure 4 A schematic diagram comparing laser treatment and radium supplementation treatment under an electron microscope provided in one embodiment of the present invention is shown in FIG. Figure 4 As shown, after laser treatment under an electron microscope, the last filling line of the filled figure is white; after radium supplementation treatment, the last filling line of the filled figure is black.

[0073] The copper surface sectioning process involves sampling, sealing, grinding, and polishing. The laser-blasted material is cut into small sections, placed in a fixed mold, and sealed with a material like epoxy resin to protect the sample. The sample is then ground with a grinder, polished, and finally observed under a Keyence electron microscope.

[0074] Figure 5 A schematic diagram of a laser slicing effect provided by an embodiment of the present invention is shown in FIG. Figure 5 As shown in the figure, the white part is the copper surface actually radiated, the line segment 51 is the depth of the radium supplement, and the line segment 52 is the depth of the primary radium treatment. The length of the line segment 51 is 5.2 μm, and the length of the line segment 52 is 3.3 μm.

[0075] Figure 6 A schematic diagram comparing the laser treatment and the radium supplementation treatment of the first material provided in one embodiment of the present invention is shown in FIG. Figure 6 As shown, the copper surface of the first material is smaller and is separated by other materials. The left side shows the actual effect of laser treatment of the first material, and the right side shows the actual effect of radium supplementation treatment of the last filling line. After radium supplementation, the area of ​​the last filling line is blackened.

[0076] Figure 7 A schematic diagram of the radium supplementation treatment of the second material provided in one embodiment of the present invention is shown in FIG. Figure 7 As shown, the copper surface of the second material is larger and connected into a whole piece. There is no other material filling in the middle of the copper surface. After the radium filling treatment of the second material, all the patterns are black, and there is no obvious laser whitening phenomenon.

[0077] In one embodiment of the present invention, the radium-replenished treatment of the entire copper surface material is more likely to turn black, while the radium-replenished treatment of the partial copper surface material will slightly turn red.

[0078] In the technical solution provided by the embodiment of the present invention, a laser image is obtained, a fill process is performed on the laser image in the laser image to generate a fill pattern, which is the first layer; the last line of the fill pattern is set as a repeating line, which is the second layer; a laser instruction is sent to a laser device, the laser instruction including set laser parameters for the laser device to respond to the laser instruction, and the laser device performs laser processing on the first layer and performs radium supplementation processing on the second layer according to the laser parameters. In the technical solution provided by the embodiment of the present invention, by setting the last line of the fill pattern as a repeating line and performing radium supplementation processing on the repeating line, the laser whitening phenomenon during the laser process can be reduced, the radium black effect of the copper surface can be improved, and work efficiency can be improved.

[0079] An embodiment of the present invention provides a copper surface marking device. Figure 8 A schematic structural diagram of a copper surface marking device provided by an embodiment of the present invention is shown in FIG. Figure 8As shown, the device includes: a processing module 11, a first setting module 12 and a sending module 13.

[0080] The processing module 11 is used to obtain a laser image file, perform filling processing on the laser pattern in the laser image file, and generate a filled pattern, which is a first layer.

[0081] The first setting module 12 is used to set the last line of the filled graphic as a repeated line, and the repeated line is the second layer.

[0082] The sending module 13 is used to send a laser instruction to the laser device. The laser instruction includes set laser parameters, so that the laser device responds to the laser instruction. The laser device performs laser processing on the first layer and performs laser supplementation processing on the second layer according to the laser parameters.

[0083] In one embodiment of the present invention, the processing module 11 is specifically configured to delete the frame of the laser pattern in the laser image file, and perform a filling process on the laser pattern according to the position of the frame to generate a filled pattern.

[0084] In one embodiment of the present invention, the device further includes: a second setting module 14 .

[0085] The second setting module 14 is used to set the laser parameters of the first layer and the second layer.

[0086] In one embodiment of the present invention, the laser parameters include cutting speed, laser pulse frequency, laser pulse width, laser power, on delay, off delay and number of cutting times;

[0087] Among them, the cutting speed of the first layer is 700mm / s-1500mm / s, and the laser pulse frequency is 20000HZ-50000HZ;

[0088] The cutting speed of the second layer is 300mm / s-700mm / s, and the laser pulse frequency is 20000HZ-50000HZ.

[0089] In one embodiment of the present invention, the cutting speed of the second layer is half of the cutting speed of the first layer.

[0090] In one embodiment of the present invention, the laser power ranges from 5W to 7W.

[0091] In the technical solution provided by the embodiment of the present invention, a laser image is obtained, a fill process is performed on the laser image in the laser image to generate a fill pattern, which is the first layer; the last line of the fill pattern is set as a repeating line, which is the second layer; a laser instruction is sent to a laser device, the laser instruction includes set laser parameters for the laser device to respond to the laser instruction, and the laser device performs laser processing on the first layer and performs laser supplementation processing on the second layer according to the laser parameters. In the technical solution provided by the embodiment of the present invention, by setting the last line of the fill pattern as a repeating line and performing laser supplementation processing on the repeating line, the laser whitening phenomenon during the laser marking process can be reduced, the effect of copper surface marking can be improved, and work efficiency can be improved.

[0092] The copper surface marking device provided in this embodiment can be used to achieve the above Figure 2 The copper surface marking method in the embodiment of the copper surface marking method can be specifically described in detail, and will not be repeated here.

[0093] An embodiment of the present invention provides a storage medium, which includes a stored program. When the program is running, the device where the storage medium is located is controlled to execute the steps of the embodiment of the above-mentioned copper surface marking method. For specific description, please refer to the embodiment of the above-mentioned copper surface marking method.

[0094] An embodiment of the present invention provides a computer device including a memory and a processor, wherein the memory is used to store information including program instructions, and the processor is used to control the execution of the program instructions. When the program instructions are loaded and executed by the processor, the steps of the embodiment of the above-mentioned copper surface marking method are implemented. For a specific description, please refer to the embodiment of the above-mentioned copper surface marking method.

[0095] Figure 9 Schematic diagram of a computer device provided by an embodiment of the present invention. Figure 9 As shown, the computer device 20 of this embodiment includes: a processor 21, a memory 22, and a computer program 23 stored in the memory 22 and executable by the processor 21. When executed by the processor 21, the computer program 23 implements the copper surface marking method of the embodiment. To avoid repetition, a detailed description is not given here. Alternatively, when executed by the processor 21, the computer program implements the functions of each model / unit in the copper surface marking device of the embodiment. To avoid repetition, a detailed description is not given here.

[0096] The computer device 20 includes, but is not limited to, a processor 21 and a memory 22. Those skilled in the art will understand that Figure 9This is merely an example of the computer device 20 and does not constitute a limitation of the computer device 20 . The computer device 20 may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, the computer device may also include input and output devices, network access devices, buses, etc.

[0097] The processor 21 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor.

[0098] The memory 22 can be an internal storage unit of the computer device 20, such as the hard disk or memory of the computer device 20. The memory 22 can also be an external storage device of the computer device 20, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) card, a flash memory card, etc. equipped on the computer device 20. Furthermore, the memory 22 can include both the internal storage unit of the computer device 20 and an external storage device. The memory 22 is used to store computer programs and other programs and data required by the computer device. The memory 22 can also be used to temporarily store data that has been output or is about to be output.

[0099] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0100] In the several embodiments provided by the present invention, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, which may be electrical, mechanical or other forms.

[0101] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0102] In addition, the functional units in various embodiments of the present invention may be integrated into a single processing unit, each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or hardware plus software functional units.

[0103] The above-mentioned integrated unit implemented in the form of a software functional unit can be stored in a computer-readable storage medium. The above-mentioned software functional unit is stored in a storage medium and includes a number of instructions for causing a computer device (which can be a personal computer, server, or network device, etc.) or a processor to perform some steps of the method described in various embodiments of the present invention. The aforementioned storage medium includes: a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, etc., various media that can store program code.

[0104] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A copper surface marking method, characterized in that: include: Acquire a laser image file, and perform filling processing on the laser pattern in the laser image file to generate a filled pattern, where the filled pattern is a first layer; The last line of the fill pattern is set as a repeating line, and the repeating line is the second layer; Sending a laser instruction to a laser device, wherein the laser instruction includes set laser parameters, so that the laser device responds to the laser instruction, and the laser device performs laser processing on the first layer and performs laser supplementation processing on the second layer according to the laser parameters; The copper surface is marked by radium blackening the copper surface; The filling process is performed on the laser pattern in the laser image file to generate a filled pattern, including: The frame of the laser pattern in the laser image file is deleted, and the laser pattern is filled according to the position of the frame to generate the filled pattern.

2. The method according to claim 1, characterized in that Before sending the laser instruction to the laser device, the method further includes: Set the laser parameters of the first layer and the second layer.

3. The method according to claim 2, characterized in that The laser parameters include cutting speed, laser pulse frequency, laser pulse width, laser power, on delay, off delay and number of cuts; Wherein, the laser pulse frequency of the first layer and the second layer is 20000HZ-50000HZ.

4. The method according to claim 3, characterized in that The cutting speed of the second layer is half of the cutting speed of the first layer, wherein the cutting speed of the first layer is 700 mm / s-1500 mm / s, and the cutting speed of the second layer is 300 mm / s-700 mm / s.

5. The method according to claim 3, characterized in that The laser power ranges from 5W to 7W.

6. A copper surface marking device, characterized in that: include: a processing module for acquiring a laser image file, performing a filling process on the laser pattern in the laser image file, and generating a filled pattern, wherein the filled pattern is a first layer; A first setting module is used to set the last line of the fill pattern as a repeated line, and the repeated line is a second layer; a sending module, configured to send a laser instruction to a laser device, wherein the laser instruction includes set laser parameters, so that the laser device responds to the laser instruction and performs laser processing on the first layer and laser supplementation processing on the second layer according to the laser parameters; The copper surface is marked by radium blackening the copper surface; The processing module is specifically used to delete the frame of the laser pattern in the laser image file, and perform filling processing on the laser pattern according to the position of the frame to generate the filled pattern.

7. A storage medium, characterized in that: The storage medium includes a stored program, wherein when the program is run, the device where the storage medium is located is controlled to execute the copper surface marking method according to any one of claims 1 to 5.

8. A computer device comprising a memory and a processor, wherein the memory is used to store information including program instructions, and the processor is used to control the execution of the program instructions, characterized in that: When the program instructions are loaded and executed by the processor, the steps of the copper surface marking method according to any one of claims 1 to 5 are implemented.

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