A semiconductor wafer double-sided electroplating hanger

Abstract

The application discloses a semiconductor wafer double-sided electroplating hanger, which comprises an A-surface hanger body and a B-surface hanger body, the A-surface hanger body and the B-surface hanger body are provided with conductive mechanisms and ventilation mechanisms, the outer sides of the A-surface hanger body and the B-surface hanger body are provided with detachable annular conductive upper covers, the A-surface hanger body and the B-surface hanger body are respectively provided with quick locking mechanisms for connecting the conductive upper covers and the corresponding A-surface hanger body or B-surface hanger body together, the A-surface hanger body is provided with a wafer bottom plate between the A-surface hanger body and the corresponding conductive upper cover, the B-surface hanger body is provided with a wafer bottom plate between the B-surface hanger body and the corresponding conductive upper cover, and the semiconductor wafers to be electroplated are fixed between the wafer bottom plates and the corresponding conductive upper covers, the conductive mechanisms are in electrical conduction with the conductive upper covers and the semiconductor wafers to be electroplated, and the ventilation mechanisms are in gas conduction with the quick locking mechanisms. The conductive upper cover of the hanger and the hanger body can be quickly closed and opened.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor wafer electroplating processing, in particular to a semiconductor wafer double-sided electroplating hanger. BACKGROUND

[0002] During the surface treatment process of the semiconductor wafer, especially the surface treatment process of electroplating or chemical plating, a good conductive jig and a supporting hanger need to be matched. At present, the wafer electroplating process developed on the market has more and more complex switching cover actions of the conductive hanger, and most of them still use manual feeding and discharging mode for production, so the production convenience is not enough.

[0003] The sealing and unsealing modes of the conductive hanger are roughly as follows: the first is a rotary sealing and unsealing, the second is a screw locking sealing and unsealing, and the third is an air bag sealing and unsealing. The first rotary conductive hanger needs to match the folding action of the inner cover and the outer cover of the hanger, and requires accurate torque control during screwing. The precision of wafer feeding and the quality of personnel are required to be very high, otherwise it is easy to cause wafer fragments. The second screw locking conductive hanger needs to control multiple screwdrivers for synchronous operation, and the gap matching and service life management of the screw and nut are required to be very high, and the risk of failure is high. The third air bag conductive hanger needs to match the air bag and the rotating action of the outer cover of the hanger during the switching cover process, and the precision requirement is very high, resulting in high cost of the hanger and its automatic equipment. The opening and closing structure of the hanger of the present application is a quick positioning sealing and unsealing mechanism, which can overcome the above problems of the conductive hanger.

[0004] The patent with the authorized publication number CN 214655335 U discloses an electroplating hanger and an electroplating device. The electroplating hanger includes a download plate, a fixing structure, a conductive structure, a cathode interface and a protruding part. The download plate is provided with a wafer groove for placing a wafer. The fixing structure is used to fix the wafer in the wafer groove, seal the back surface of the wafer, and expose the front surface of the wafer. The conductive structure is used to adhere to the back surface of the wafer. The protruding part is arranged outside the wafer groove, connected with the download plate or the fixing structure, and protrudes from the download plate and the fixing structure towards the electroplating surface of the wafer. In this way, after the electroplating hanger is placed in the plating tank and immersed in the electroplating solution, when the electroplating hanger adheres to the plating tank, the protruding part can separate the electroplating surface of the wafer from the plating tank, prevent the electroplating surface of the wafer from being blocked, and make the electroplating surface of the wafer fully contact with the electroplating solution. In this way, the electroplating hanger will not affect the electroplating of the wafer no matter how it is placed in the plating tank. However, the patent does not discuss the quick opening and closing problem of the fixing structure and the hanger body, and it is not clear how to solve the opening and closing efficiency problem of the fixing structure and the hanger body. SUMMARY

[0005] The technical problem solved by the present application is to provide a semiconductor wafer double-sided electroplating hanger, which can realize quick covering and uncovering of the conductive upper cover and the hanger body, quick sealing and unsealing of the conductive upper cover and the hanger body, and can improve the efficiency of loading and unloading of the semiconductor wafer during electroplating and facilitate the automation of the electroplating process of the semiconductor wafer.

[0006] To solve the above technical problems, one technical solution adopted by the present application is to provide a semiconductor wafer double-sided electroplating hanger, which comprises an A-surface hanger body and a B-surface hanger body, the A-surface hanger body and the B-surface hanger body are attached together, the A-surface hanger body and the B-surface hanger body are made of non-conductive materials, the A-surface hanger body and the B-surface hanger body are provided with conductive mechanisms and ventilation mechanisms, the outer side of the A-surface hanger body and the outer side of the B-surface hanger body are provided with detachable annular conductive upper covers, the A-surface hanger body and the B-surface hanger body are respectively provided with quick locking mechanisms for connecting the conductive upper cover and the corresponding A-surface hanger body or B-surface hanger body together, the A-surface hanger body and the corresponding conductive upper cover are provided with a wafer bottom plate, the B-surface hanger body and the corresponding conductive upper cover are provided with a wafer bottom plate, the semiconductor wafer to be electroplated is fixed between the wafer bottom plate and the corresponding conductive upper cover, the conductive mechanism is in electrical conduction with the conductive upper cover and the semiconductor wafer to be electroplated, and the ventilation mechanism is in gas conduction with the quick locking mechanism.

[0007] Preferably, the conductive upper cover comprises an annular upper cover conductive bottom plate, a plurality of upper cover positioning pins and upper cover conductive avoiding holes are arranged on the upper cover conductive bottom plate, the plurality of upper cover positioning pins are annularly distributed on the upper cover conductive bottom plate, a positioning pin groove is radially arranged on the outer circumferential surface of the middle part of the upper cover positioning pin, the positioning pin groove surrounds the upper cover positioning pin for one turn, a plurality of conductive springs and conductive spring avoiding holes are arranged at the inner side edge of the upper cover conductive bottom plate, the materials of the upper cover conductive bottom plate, the upper cover positioning pin and the conductive spring are all metal conductive materials, one end of the conductive spring is provided with an elastic terminal, and the elastic terminal is in conductive contact with the outer circumferential edge of the semiconductor wafer to be electroplated.

[0008] Preferably, an arc-shaped wafer limiting edge is arranged at the inner side edge of the upper cover conductive bottom plate, a chemical-resistant rubber coating layer is arranged outside the conductive upper cover, the chemical-resistant rubber coating layer forms an annular upper cover outer sealing ring protruding towards the inner side of the conductive upper cover at the outermost side of the outer edge of the conductive upper cover, the chemical-resistant rubber coating layer forms an annular upper cover middle sealing ring at the root position of the conductive spring, the chemical-resistant rubber coating layer forms an upper cover inner sealing ring at the outer end of the elastic terminal, and the upper cover inner sealing ring is in contact and sealing with the outer circumferential edge of the semiconductor wafer to be electroplated.

[0009] Preferably, the conductive mechanism comprises a conductive pin and a conductive sheet, the conductive sheet is located outside the A-side hanger body or the B-side hanger body, the conductive pin is connected with a conductive wire, the A-side hanger body and the B-side hanger body are both provided with a threading hole, and the conductive wire is connected with the conductive sheet by passing through the threading hole.

[0010] Preferably, the inner side of the A-side hanger body and the inner side of the B-side hanger body are both provided with a main wire slot, a needle wire slot and a needle, a part of the conductive wire is embedded in the main wire slot and the needle wire slot, the needle is located beside the needle wire slot, the conductive wire is connected with the needle by passing through the main wire slot and the needle wire slot, and the needle is electrically connected with the conductive upper cover by passing through the conductive avoiding hole of the upper cover.

[0011] Preferably, the conductive sheet comprises an arc-shaped conductive sheet, a plurality of fin-shaped elastic sheets are arranged on the arc-shaped conductive sheet and extend to the inner side of the arc-shaped conductive sheet, the fin-shaped elastic sheets are used to hold the edges of the semiconductor wafer to be electroplated, a plurality of arc-shaped conductive sheet positioning holes are arranged on the arc-shaped conductive sheet and used to position the arc-shaped conductive sheet on the outer edge of the wafer bottom plate, a conductive sheet contact point is arranged on the arc-shaped conductive sheet, a conductive screw and a conductive spring are arranged in the conductive sheet contact point, the outer side of the A-side hanger body and the outer side of the B-side hanger body are both provided with a conductive sheet wire slot, the wafer bottom plate covers the outside of the conductive sheet wire slot, the conductive pin is connected with the conductive wire, the bottom of the conductive pin is connected with the conductive wire by being connected in series from the inside of the A-side hanger body and the B-side hanger body, the conductive wire passes through the main wire slot to reach the threading hole, is folded to the outside of the A-side hanger body and the B-side hanger body from the threading hole, and extends through the conductive sheet wire slot and the conductive screw, the conductive screw is connected with the conductive sheet contact point on the conductive sheet above the outer edge of the wafer bottom plate in series, the conductive current is conducted through the fin-shaped elastic sheet and the invalid zone on the bottom of the semiconductor wafer to be electroplated, the invalid zone is the edge part of the semiconductor wafer, the conductive screw is pressed against the conductive spring, the conductive spring is electrically connected with the conductive spring avoiding hole on the conductive bottom plate of the upper cover, and the current is conducted through the elastic terminal of the conductive bottom plate of the upper cover and the invalid zone on the upper part of the semiconductor wafer.

[0012] Preferably, the ventilation mechanism comprises a ventilation port arranged on the A-side hanger body and the B-side hanger body, the inner side of the A-side hanger body and the inner side of the B-side hanger body are both provided with a unlocking gas path, one end of the ventilation port is in communication with the external atmosphere, the other end is in communication with the unlocking gas path, and the unlocking gas path is in gas communication with the quick locking mechanism.

[0013] Preferably, the quick lock mechanism includes a quick lock mechanism barrel, the bottom of the quick lock mechanism barrel is provided with a quick lock mechanism base, the quick lock mechanism base of the A-face hanger body is installed on the outside of the B-face hanger body, the quick lock mechanism base of the B-face hanger body is installed on the outside of the A-face hanger body, the inside of the quick lock mechanism barrel is provided with a cylindrical inner core, the top of the inner core is provided with a pin hole, the lower part of the inner core is provided with a radially protruding boss, the upper part of the inner core is sleeved with a ring-shaped locking sliding block, the upper part of the quick lock mechanism barrel is fixed with an upper cover with a middle opening, the upper cover positioning pin on the upper cover conductive bottom plate can pass through the middle opening of the upper cover and enter the pin hole, the quick lock mechanism barrel is provided with a plurality of unlocking air holes, the plurality of unlocking air holes are respectively communicated with the unlocking air path, the unlocking air hole is located below the locking sliding block, a plurality of air-tight sealing rings are installed between the quick lock mechanism barrel, the inner core, the locking sliding block and the upper cover, the bottom of the locking sliding block has a plurality of supporting springs, the supporting springs are located between the locking sliding block and the boss, the top of the inner hole of the locking sliding block is a tapered hole, the upper end diameter of the tapered hole is larger than the lower end diameter of the tapered hole, an annular steel ball movable groove is formed between the upper cover and the tapered hole of the locking sliding block, the steel ball movable groove is a cavity, a plurality of locking steel balls are installed around the cavity, the bottom of the upper cover near the middle opening is a steel ball stop edge, the joint between the steel ball stop edge and the middle opening protrudes from the bottom surface of the upper cover, the plurality of locking steel balls are limited in the space between the bottom of the upper cover and the steel ball stop edge and the tapered hole wall of the locking sliding block, under the condition of normal atmosphere, the locking sliding block is in the upper limit position, that is, the locking sliding block is in the highest position, due to the supporting force of the supporting spring, the locking steel ball is pushed into the positioning pin groove on the upper cover positioning pin, at this time, the conductive upper cover is buckled on the A-face hanger body or the B-face hanger body, the air inlet connected to the unlocking air hole is vacuumized, under the action of negative pressure, the locking sliding block is pulled down to the lower limit position, that is, the lowest position of the locking sliding block, at this time, the cavity space of the steel ball movable groove is increased, the locking steel ball is pushed into the inside of the cavity during the process that the locking sliding block moves downward and pulls the upper cover positioning pin upward, the locking steel ball is separated from the positioning pin groove on the upper cover positioning pin, the upper cover positioning pin can be pulled out of the pin hole, so that the conductive upper cover is separated from the A-face hanger body or the B-face hanger body.

[0014] Preferably, the A-face hanger body and the B-face hanger body are respectively provided with a resistance tester for testing the conductive performance of the circuit and a gas leakage test port for testing whether the air path leaks.

[0015] Preferably, the outside of the A-face hanger body or the outside of the B-face hanger body is provided with a cover plate, the cover plate covers the outside of the A-face hanger body or the outside of the B-face hanger body, so that only the A-face hanger body or the B-face hanger body can be used for semiconductor wafer electroplating.

[0016] Preferably, one end of the A-side hanger body and the B-side hanger body is provided with a handle mechanism, the handle mechanism comprises a handle, both ends of the handle are provided with a crown block clamp jaw positioning hole, both sides of the A-side hanger body and the B-side hanger body are processed with a side guide groove, and the A-side hanger body and the B-side hanger body are provided with a hanger positioning hole.

[0017] The semiconductor wafer double-sided electroplating hanger has the advantages that the conductive upper cover of the hanger can be quickly combined with and separated from the hanger body, and the semiconductor wafer can be electroplated in the hanger, so that the efficiency of loading and unloading of the semiconductor wafer during electroplating is improved, and the automation degree of the electroplating process of the semiconductor wafer is facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0019] Figure 1 is a structural schematic diagram of the semiconductor wafer double-sided electroplating hanger according to the present application in a front view;

[0020] Figure 2 is a structural schematic diagram of the semiconductor wafer double-sided electroplating hanger according to the present application in a side view;

[0021] Figure 3 is a structural schematic diagram of the semiconductor wafer double-sided electroplating hanger according to the present application in a perspective view;

[0022] Figure 4 is a structural schematic diagram of the semiconductor wafer double-sided electroplating hanger according to the present application in a front view after rotation;

[0023] Figure 5 is an A-A sectional view in Figure 4

[0024] Figure 6 is an enlarged view of A in Figure 5

[0025] Figure 7 is a partial enlarged view in Figure 5

[0026] Figure 8 is a structural schematic diagram of the conductive upper cover of the semiconductor wafer double-sided electroplating hanger according to the present application before encapsulation;

[0027] Figure 9 ​​​It is the structure schematic view of the conductive elastic sheet of the upper cover in the semiconductor wafer double-sided electroplating hanger of the present application;

[0028] Figure 10 It is the structure schematic view of the conductive upper cover after encapsulation in the semiconductor wafer double-sided electroplating hanger of the present application;

[0029] Figure 11 It is the partial sectional view of the conductive upper cover in the semiconductor wafer double-sided electroplating hanger of the present application;

[0030] Figure 12 It is the front view of the outer side of the A-face hanger body in the semiconductor wafer double-sided electroplating hanger of the present application;

[0031] Figure 13 It is the front view of the outer side of the B-face hanger body in the semiconductor wafer double-sided electroplating hanger of the present application;

[0032] Figure 14 It is the front view of the outer side of the A-face hanger body in the semiconductor wafer double-sided electroplating hanger of the present application;

[0033] Figure 15 It is the front view of the inner side of the A-face hanger body in the semiconductor wafer double-sided electroplating hanger of the present application;

[0034] Figure 16 It is the structure schematic view of the conductive sheet in the semiconductor wafer double-sided electroplating hanger of the present application;

[0035] Figure 17 It is the structure schematic view of the quick locking mechanism in the semiconductor wafer double-sided electroplating hanger of the present application;

[0036] Figure 18 It is the sectional view of the structure schematic view of the quick locking mechanism in the semiconductor wafer double-sided electroplating hanger of the present application;

[0037] Figure 19 It is the structure schematic view of the cover plate in the semiconductor wafer double-sided electroplating hanger of the present application. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0039] Embodiments of the present application:

[0040] Please refer to Figures 1 to 7The semiconductor wafer double-sided electroplating hanger of the present application comprises an A-surface hanger body 301 and a B-surface hanger body 302, the A-surface hanger body 301 and the B-surface hanger body 302 are attached together, the A-surface hanger body 301 and the B-surface hanger body 302 are made of non-conductive material, the A-surface hanger body 301 and the B-surface hanger body 302 are provided with a conductive mechanism 70 and a ventilation mechanism 60, the outer side of the A-surface hanger body 301 and the outer side of the B-surface hanger body 302 are provided with a detachable annular conductive upper cover 40, the A-surface hanger body 301 and the B-surface hanger body 302 are respectively provided with a quick lock mechanism 50 for connecting the conductive upper cover 40 and the corresponding A-surface hanger body 301 or B-surface hanger body 302 together, the A-surface hanger body 301 and the corresponding conductive upper cover 40 are provided with a wafer bottom plate 34, the B-surface hanger body 302 and the corresponding conductive upper cover 40 are also provided with a wafer bottom plate 34, the semiconductor wafer 10 to be electroplated is fixed between the wafer bottom plate 34 and the corresponding conductive upper cover 40, the conductive mechanism 70 is in electrical conduction with the conductive upper cover 40 and the semiconductor wafer 10 to be electroplated, and the ventilation mechanism 60 is in gas conduction with the quick lock mechanism 50.

[0041] The A-surface hanger body 301 and the B-surface hanger body 302 are mirror image attached with the center line of the hanger, the A-surface hanger body 301 and the B-surface hanger body 302 can be two-piece back-to-back attached, the attachment mode can be attached with waterproof glue or screw connection and attachment mode; or integrally formed by injection molding; or two-piece attached, and then embedded injection molding is supplemented. The material of the A-surface hanger body 301 and the B-surface hanger body 302 is mainly engineering plastic material with resistance and not easy to deform, such as PEEK, PTFE, HDPE, PP, PET, PETP, PVC, etc., or composite material (such as glass fiber, carbon fiber, nanometer material, etc.), but not limited to. The upper of the hanger body is fixed with a handle mechanism 20, which includes a handle 21, which facilitates manual taking and placing of the hanger when necessary; the two ends of the handle 21 are provided with a crown block clamp jaw positioning hole 22, which can be matched with the pin (not shown in the figure) on the crown block clamp jaw of the electroplating line to perform clamping action, realize the positioning of the clamp jaw and the automatic taking and placing function of the hanger. The two side edges of the A-surface hanger body 301 and the B-surface hanger body 302 are processed with side guide grooves 31, and the hanger positioning holes 32 are arranged on the A-surface hanger body 301 and the B-surface hanger body 302. The side guide grooves 31 can facilitate the positioning of the crown block clamp jaw and the upper and lower electroplating tank body by matching with guide rollers (not shown in the figure), and the lower part of the two side edges of the A-surface hanger body 301 and the B-surface hanger body 302 can be appropriately milled with a guide edge 311. The hanger positioning hole 32 can be penetrated or not penetrated, mainly for matching with the automatic sheet feeding machine to position the hanger.

[0042] Preferably, as Figures 8 to 10As shown, the conductive upper cover 40 includes an annular upper cover conductive base plate 41, which is provided with a plurality of upper cover positioning pins 42 and upper cover conductive avoiding holes 451. The plurality of upper cover positioning pins 42 are annularly distributed on the upper cover conductive base plate 41. The middle portion of the outer circumferential surface of the upper cover positioning pin 42 is provided with a positioning pin groove 421 in the radial direction. The positioning pin groove 421 surrounds the upper cover positioning pin 42. The inner side edge of the upper cover conductive base plate 41 is provided with a plurality of conductive spring sheets 43 and conductive spring avoiding holes 452. The materials of the upper cover conductive base plate 41, the upper cover positioning pin 42 and the conductive spring sheet 43 are all metal conductive materials, such as titanium, stainless steel, copper or metal alloy, but are not limited thereto. One end of the conductive spring sheet 43 is provided with an elastic terminal 432, which is in conductive contact with the outer circumferential edge of the semiconductor wafer 10 to be electroplated, i.e., the ineffective zone of the wafer (i.e., the range of ≦3mm from the outer edge of the semiconductor wafer). The conductive upper cover 40 is locked in the quick locking mechanism 50 by the upper cover positioning pin 42 to fix and compress the ineffective zone of the semiconductor wafer. A plurality of annular sealing rings 33 are arranged between the semiconductor wafer 10 and the wafer base plate 34, and between the conductive upper cover 40 and the A-face hanger body 301 or the B-face hanger body 302, as a buffer when the wafer is compressed, to avoid wafer fragments and achieve a sealing effect.

[0043] The upper cover positioning pin 42 and the upper cover conductive spring sheet 43 can be fixed on the upper cover conductive base plate 41 by welding or locking. The upper cover positioning pin 42 is arranged in an equidistant annular manner on the upper cover conductive base plate 41 and corresponds to the pin hole 56 of the quick locking mechanism 50 of each surface. The upper cover positioning pin 42 is processed with a circular arc positioning pin groove 421, which corresponds to the position of the locking steel ball 552.

[0044] Preferably, as Figures 10 to 11As shown, the conductive upper cover 40 is coated with a chemical-resistant rubber coating layer 44, which serves to prevent corrosion and water sealing. The material of the chemical-resistant rubber coating layer 44 can be rubber, plastic, Teflon, silicone or composite material, but is not limited thereto. The chemical-resistant rubber coating layer 44 forms an annular upper cover outer sealing ring 441 on the outermost side of the conductive upper cover 40, which protrudes inwardly. The chemical-resistant rubber coating layer 44 forms an annular upper cover middle sealing ring 442 at the root of the conductive spring 43. The chemical-resistant rubber coating layer 44 forms an upper cover inner sealing ring 443 at the outer end of the elastic terminal 432, which contacts and seals the outer peripheral edge of the semiconductor wafer 10, i.e. the ineffective band of the wafer. The upper cover positioning pin 42 is exposed to the chemical-resistant rubber coating layer 44. The conductive spring 43 is also not coated with rubber, so as to expose the elastic terminal and facilitate replacement of the conductive spring. The upper cover conductive avoidance hole 451 and the conductive spring avoidance hole 452 are also not coated with rubber. These avoidance holes can contact the plurality of spring needles 76 and the conductive spring 782 on the main body of the hanger after being sealed, thereby indirectly enabling the entire set of metal of the conductive upper cover 40 to be electrified. Between the upper cover middle sealing ring 442 and the upper cover inner sealing ring 443, a plurality of wafer limiting stop edges 444 are provided to facilitate the guiding and limiting functions of the wafer during placement.

[0045] Preferably, as shown in Figures 12 to 16 As shown, the conductive mechanism 70 includes a conductive pin 71 and a conductive sheet 77. The conductive sheet 77 is located on the outside of the A-face hanger body 301 or the B-face hanger body 302. The conductive pin 71 is connected with a conductive wire 72. The A-face hanger body 301 and the B-face hanger body 302 are both provided with a threading through hole 35. The conductive wire 72 passes through the threading through hole 35 and is connected with the conductive sheet 77. The material of the conductive pin 71 is generally a conductive material such as copper, stainless steel or metal alloy.

[0046] After the conductive upper cover 40 is removed, a plurality of quick lock mechanisms 50 are exposed inside the A-face hanger body 301 and the B-face hanger body 302. The A-face quick lock mechanism 501 and the B-face quick lock mechanism 502 are staggered and placed at equal distances at the head and tail, and are not mirror images, thereby reducing the thickness of the hanger body. The hanger body can also be configured as mirror images, but the thickness of the hanger body will increase. The wafer placement is the wafer bottom plate 34, which is processed with a plurality of annular grooves and radial grooves to avoid the vacuum suction effect during wafer removal.

[0047] Preferably, as shown in Figure 7 and Figure 15As shown, the inner side of the A-side hanger body 301 and the inner side of the B-side hanger body 302 are provided with a main wire slot 73, a needle wire slot 75, and a needle 76. After the wafer bottom plate 34 is taken out from the outer side of the A-side hanger body 301 and the B-side hanger body 302, the threading-through hole 35 and the conductive sheet wire slot 74 are exposed. Part of the conductive wire 72 is embedded in the main wire slot 73 and the needle wire slot 75. The needle 76 is located beside the needle wire slot 75. The conductive wire 72 is connected with the needle 76 through the main wire slot 73 and the needle wire slot 75. The needle 76 passes through the upper cover conductive avoiding hole 451 and is electrically connected with the conductive upper cover 40.

[0048] Preferably, as shown in Figure 6 and Figure 16 As shown, the conductive sheet 77 includes an arc-shaped conductive sheet 771. A plurality of fin-shaped elastic sheets 772 are arranged on the arc-shaped conductive sheet 771 and extend inward. The fin-shaped elastic sheets 772 are used to hold the edge of the semiconductor wafer 10 to be electroplated. A plurality of arc-shaped conductive sheet positioning holes 773 are arranged on the arc-shaped conductive sheet 771 and are used to position the arc-shaped conductive sheet 771 on the outer edge of the wafer bottom plate 34. The arc-shaped conductive sheet 773 is arranged on the arc-shaped conductive sheet 771 and is used to position the arc-shaped conductive sheet 771 on the outer edge of the wafer bottom plate 34. The arc-shaped conductive sheet 773 is provided with a conductive sheet contact point 774. The conductive sheet contact point 774 is provided with a conductive screw 781 and a conductive spring 782. The outer side of the A-side hanger body 301 and the outer side of the B-side hanger body 302 are provided with a conductive sheet wire slot 74. The wafer bottom plate 34 is arranged on the outer side of the conductive sheet wire slot 74. The conductive pin 71 is connected with the bottom of the conductive pin 71 through the conductive wire 72. The conductive wire 72 passes through the main wire slot 73 and reaches the threading-through hole 35. The conductive wire 72 is bent from the threading-through hole 35, extends outward from the A-side hanger body 301 and the B-side hanger body 302, and passes through the conductive sheet wire slot and the conductive screw 781. The conductive screw 781 is connected with the conductive sheet contact point 774 on the arc-shaped conductive sheet 77 on the outer edge above the wafer bottom plate 34. The conductive current passes through the fin-shaped elastic sheet 772 and the invalid band on the bottom of the semiconductor wafer 10 to be electroplated. The invalid band refers to the edge part of the semiconductor wafer. The conductive screw 781 is pressed against the conductive spring 782. After the conductive upper cover 40 is combined with the A-side hanger body 301 or the B-side hanger body 302, the conductive spring 782 passes through the conductive spring avoiding hole 452 on the upper cover conductive bottom plate 41 and is electrically connected with the upper cover conductive bottom plate 41. The current passes through the elastic terminal 432 on the upper cover conductive bottom plate 41 and the invalid band on the upper part of the semiconductor wafer 10.

[0049] The conductive cover 40 has two electrical conduction paths, which can serve as a foolproof method in case of conduction failure, or only one path can be used. One path is the output of a rectifier (not shown) corresponding to multiple electroplating lines, with multiple conductive pins 71. The conductive wires 72 are connected to the bottom of the conductive pins 71 from the inside of the A-side mounting body 301 or the B-side mounting body 302, passing through the main wire groove 73 to the through hole 35. The conductive wires 72 are folded from the through hole 35 to the outside of the A-side mounting body 301 or the B-side mounting body 302, and extend through four conductive plate grooves 74 and conductive screws 781. The conductive screws 781 are connected in series with the outer edge of the wafer substrate. The conductive contact 774 on the conductive sheet 77 has a conductive screw 781 pressing against a conductive spring 782. After the conductive cover 40 is closed with the A-side hanger body 301 or the B-side hanger body 302, the conductive spring 782 passes through the conductive spring clearance hole 452 on the conductive base plate 41 of the cover and is electrically connected to the conductive cover 40. Another path involves multiple conductive pins 71 connected to conductive wires 72 at their bottoms. The conductive wires 72 pass through the main wire groove 73, reach the through hole 35, and then pass through the spring needle groove 75 to reach the spring needle 76 at the end. The spring needle passes through the conductive clearance hole 451 of the cover and is electrically connected to the conductive cover 40. As described above, there can be one conductive pin, corresponding to one annular conductive sheet; three, corresponding to three sets of arc-shaped conductive sheets; four, corresponding to four sets of arc-shaped conductive sheets, and so on.

[0050] Preferred, such as Figures 14 to 15 As shown, the ventilation mechanism 60 includes ventilation ports 61 disposed on the A-side hanging body 301 and the B-side hanging body 302. Unlocking air passages 62 are provided on the inner sides of both the A-side hanging body 301 and the B-side hanging body 302. One end of each ventilation port 61 is connected to the external atmosphere, and the other end is connected to the unlocking air passage 62. The unlocking air passage 62 is connected to the quick-lock mechanism 50 via gas. The unlocking air passage 62 connects all the unlocking air holes 52 of the A-side unlocking mechanism 501 and the B-side unlocking mechanism 50 in series. When a negative or positive pressure air supply system is connected externally, the quick-lock mechanism 50 can be opened or closed synchronously. Waterproof grooves 36 can be provided on the inner sides of the A-side hanging body 301 and the B-side hanging body 302 around the periphery of each component. A sealing ring is placed inside the waterproof groove to provide a sealing effect.

[0051] Preferred, such as Figures 17 to 18As shown, the quick locking mechanism 50 in the view is in a horizontally placed state, the quick locking mechanism 50 includes a quick locking mechanism barrel 511, the bottom of the quick locking mechanism barrel 511 is provided with a quick locking mechanism base 512, the quick locking mechanism base 512 of the A-side hanger body 301 is installed on the outside of the B-side hanger body 302, the quick locking mechanism base 512 of the B-side hanger body 302 is installed on the outside of the A-side hanger body 301, the inside of the quick locking mechanism barrel 511 is provided with a cylindrical inner core 55, the top of the inner core 55 is provided with a pin hole 56, the lower part of the inner core 55 is provided with a radially protruding boss 51, the upper part of the inner core 55 is sleeved with a ring-shaped locking sliding block 551, the upper part of the quick locking mechanism barrel 511 is fixed with an upper cover 53 with a middle opening, the upper cover positioning pin 42 on the upper cover conductive bottom plate 41 can pass through the middle opening of the upper cover 53 to enter the pin hole 56, the quick locking mechanism barrel 511 is provided with a plurality of unlocking air holes 52, the plurality of unlocking air holes 52 are respectively communicated with the unlocking air path 62, the unlocking air hole 52 is located below the locking sliding block 551, a plurality of air-tight sealing rings 57 are installed between the quick locking mechanism barrel 511, the inner core 55, the locking sliding block 551 and the upper cover 53, to prevent air leakage, the bottom of the locking sliding block 551 has a plurality of supporting springs 54, the supporting springs 54 are located between the locking sliding block 551 and the boss 51, the top of the inner hole of the locking sliding block 551 is a tapered hole, the upper end diameter of the tapered hole is larger than the lower end diameter of the tapered hole, an annular steel ball movable groove 553 is formed between the upper cover 53 and the tapered hole of the locking sliding block 551, the steel ball movable groove 553 is a cavity, a plurality of locking steel balls 552 are installed around the cavity, the bottom of the upper cover 53 near the middle opening is a steel ball stop edge 554, the joint between the steel ball stop edge 554 and the middle opening protrudes downward from the bottom surface of the upper cover 53, the plurality of locking steel balls 552 are limited in the space between the bottom of the upper cover 53 and the steel ball stop edge 554 and the tapered hole wall of the locking sliding block 551, under normal atmospheric conditions, the locking sliding block 551 is in the upper limit position due to the supporting force of the supporting springs 54, i.e. the locking sliding block 551 is in the highest position, the locking steel balls 552 are pushed into the positioning pin groove 421 on the upper cover positioning pin 42 by the tapered hole wall and the steel ball stop edge 554, at this time, the conductive upper cover 40 is buckled on the A-side hanger body 301 or the B-side hanger body 302, to realize quick and synchronous locking, and the conductive upper cover 40 will not be loosened due to abnormal conditions such as power failure or gas failure.Through the air vent 61 connected to the unlocking air hole 52, vacuumizing the air vent 61, under the action of negative pressure, the locking sliding block 551 is pulled down to the lower limit, that is, the lowest position of the locking sliding block 551. At this time, the cavity space of the steel ball movable groove 553 is enlarged, and the locking sliding block 551 moves downward while pulling the upper cover positioning pin 42 upward. In the process, the locking steel ball 552 is pushed into the cavity, the locking steel ball 552 is separated from the positioning pin groove 421 on the upper cover positioning pin 42, the upper cover positioning pin 42 can be pulled out of the pin hole 56 to separate the conductive upper cover 40 from the A-face hanger body 301 or the B-face hanger body 302, and the fast synchronous unlocking is realized. The above principle can also be set in reverse as a fast unlocking and locking mechanism, and an electromagnet can also be arranged below the fast locking mechanism to pull the locking sliding block tightly by electricity and perform the locking and unlocking action. The fast locking mechanism can also be connected to the conductive wire respectively, and the electricity can be transmitted to the upper cover conductive spring 43 and the invalid band of the wafer through the locking of the upper cover positioning pin 42.

[0052] Preferably, as shown in Figures 17 to 18 The A-face hanger body 301 and the B-face hanger body 302 are respectively provided with a test mechanism, including a resistance tester (not marked in the figure) for testing the conductive performance of the circuit and a gas leakage test port 82 for testing whether the gas circuit leaks, and a code reading system. The resistance tester connected to the conductive pins 71 of the conductive mechanism is externally arranged between the plurality of conductive pins 71, and after the conductive upper cover 40 is combined with the A-face hanger body 301 or the B-face hanger body 302, the relative resistance test of multi-thread is carried out to determine whether the resistance is lower than the set value, thereby determining whether the wafer is correctly placed to avoid the abnormality of subsequent electroplating process; the wire slot of the conductive wire is connected to the inside of the gas leakage test port 82. When the wafer is placed and the conductive upper cover 40 is locked, vacuumizing through the gas leakage test port 82 can detect whether the air flow is lower than the set value, thereby determining whether the wafer is correctly placed and whether the conductive upper cover 40 is locked; the RFID code reading system installed on the A-face hanger body 301 and the B-face hanger body 302 can be used to trace the production history of the wafer, and facilitate the electroplating line production program to determine the single-sided or double-sided production mode. The code reader can be installed on the automatic feeding machine, the overhead crane clamp jaw or the electroplating line tank body of the electroplating line.

[0053] Preferably, as shown in Figure 13 and Figure 19As shown, the outer side of the A-side hanger body 301 or the outer side of the B-side hanger body 302 is provided with a cover plate 37, which covers the outer side of the A-side hanger body 301 or the outer side of the B-side hanger body 302, so that only the A-side hanger body 301 or the B-side hanger body 302 can be used for electroplating of semiconductor wafers, i.e. the double-sided hanger is changed into a single-sided hanger for use, to meet the needs of some single-sided electroplating lines. The cover plate 37 can also be a non-perforated disc with positioning pins to replace the conductive upper cover 40.

[0054] When the semiconductor wafer double-sided electroplating hanger of the present application is in operation, the air source mechanism (not shown in the figure) is in contact with the air vent 61 to seal and perform vacuum extraction, the A-side quick locking mechanism 501 and the B-side quick locking mechanism 502 are unlocked synchronously, the conductive upper cover 40 of both sides of the hanger is moved out of the hanger, the semiconductor wafers 10 are placed on the A / B sides of the hanger respectively, and the conductive upper cover 40 is covered respectively (this action can be combined with an automatic wafer loading machine to facilitate synchronous operation), vacuum extraction is closed, and a certain positive pressure of air or nitrogen is introduced, the quick locking mechanisms of both sides of the hanger are locked synchronously, the air source mechanism is removed, the wafer rapid loading action is completed, or the reverse unloading action is performed, the RFID reading code system on the electroplating hanger is read, then the electrical conduction and air leakage test is performed, the test is normal, the wafer electroplating operation is performed, the above opening and closing cover and taking and placing material actions are repeated until the electroplating production operation is completed.

[0055] The above description is only an embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation using the content of the present application specification, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A double-sided electroplating fixture for semiconductor wafers, comprising an A-side fixture body and a B-side fixture body, wherein the A-side fixture body and the B-side fixture body are attached together, characterized in that, Both the A-side and B-side mounting bodies are made of non-conductive materials. Each body is equipped with a conductive mechanism and a ventilation mechanism. A detachable annular conductive top cover is provided on the outer side of both the A-side and B-side mounting bodies. Each body has a quick-lock mechanism for connecting the conductive top cover to the corresponding A-side or B-side mounting body. A wafer base plate is provided between the A-side mounting body and the corresponding conductive top cover, and the same applies to the B-side mounting body. The semiconductor wafer to be electroplated is fixed between the wafer base plate and the corresponding conductive top cover. The conductive mechanism is electrically connected to the conductive top cover and the semiconductor wafer to be electroplated, and the ventilation mechanism is gas-connected to the quick-lock mechanism. The ventilation mechanism includes ventilation ports provided on the A-side hanger body and the B-side hanger body. The inner side of the A-side hanger body and the inner side of the B-side hanger body are provided with unlocking air passages. One end of the ventilation port is connected to the outside atmosphere and the other end is connected to the unlocking air passage. The unlocking air passage is connected to the gas of the quick-lock mechanism. The conductive top cover includes an annular conductive bottom plate. The conductive bottom plate is provided with a plurality of top cover positioning pins and conductive clearance holes. The plurality of top cover positioning pins are distributed in an annular pattern on the conductive bottom plate. A positioning pin groove is radially provided on the outer peripheral surface of the middle part of the top cover positioning pin. The positioning pin groove surrounds the top cover positioning pin for one circumference. The quick-lock mechanism includes a quick-lock mechanism barrel, with a quick-lock mechanism base at the bottom. The quick-lock mechanism base of the A-side hanger body is installed on the outside of the B-side hanger body, and the quick-lock mechanism base of the B-side hanger body is installed on the outside of the A-side hanger body. Inside the quick-lock mechanism barrel is a columnar inner core with a pin hole at the top and a radially protruding boss at the bottom. An annular locking sliding block is fitted onto the upper part of the inner core. A top cover with a central opening is fixed to the top of the quick-lock mechanism barrel. The top cover positioning pin on the conductive base plate of the top cover can pass through... The central opening of the cap leads to the pin hole. Multiple unlocking air holes are provided on the quick-lock mechanism barrel, each connected to an unlocking air path. These air holes are located below the locking sliding block. Multiple airtight sealing rings are installed between the quick-lock mechanism barrel, inner core, locking sliding block, and upper cap. Multiple support springs are located at the bottom of the locking sliding block between the locking sliding block and the boss. The top of the inner hole of the locking sliding block is a conical hole, with the upper diameter larger than the lower diameter. A ring is formed between the upper cap and the conical hole of the locking sliding block. The upper cover has a ball bearing groove, which is a cavity around which multiple locking balls are installed. Near the central opening at the bottom of the upper cover is a ball bearing retainer, the junction of which protrudes from the bottom surface of the upper cover. The multiple locking balls are confined within the space between the bottom of the upper cover, the ball bearing retainer, and the conical hole wall of the locking sliding block. Under normal atmospheric conditions, due to the supporting force of the spring, the locking sliding block is at its upper limit position (i.e., at its highest position). The locking balls are pushed against the positioning pin on the upper cover by the conical hole wall and the ball bearing retainer. Inside the groove, the conductive top cover is fastened to the A-side hanger body or the B-side hanger body. A vacuum is drawn through the vent connected to the unlocking air hole. Under negative pressure, the locking sliding block is pulled down to the lower limit, i.e., the lowest position of the locking sliding block. At this time, the cavity space of the steel ball moving groove increases. As the locking sliding block moves downward and the top cover positioning pin is pulled upward, the locking steel ball is pushed into the inner side of the cavity. The locking steel ball disengages from the positioning pin groove on the top cover positioning pin. The top cover positioning pin can be pulled upward to remove the pin hole, thus detaching the conductive top cover from the A-side hanger body or the B-side hanger body.

2. The semiconductor wafer double-sided electroplating fixture according to claim 1, characterized in that, Multiple conductive springs and conductive spring clearance holes are provided on the inner edge of the conductive base plate of the upper cover. The conductive base plate of the upper cover, the positioning pin of the upper cover and the conductive springs are all made of conductive metal. One end of the conductive spring is provided with an elastic terminal, which makes conductive contact with the outer peripheral edge of the semiconductor wafer to be electroplated.

3. The semiconductor wafer double-sided electroplating fixture according to claim 2, characterized in that, An arc-shaped wafer limiting stop is provided on the inner edge of the conductive base plate of the upper cover. A chemical-resistant adhesive coating layer is provided on the outside of the conductive upper cover. The chemical-resistant adhesive coating layer forms an annular outer sealing ring that protrudes towards the inner side of the conductive upper cover at the outermost edge of the conductive upper cover. The chemical-resistant adhesive coating layer forms an annular middle sealing ring at the root of the conductive spring piece. The chemical-resistant adhesive coating layer forms an inner sealing ring at the outer end of the elastic terminal. The inner sealing ring of the upper cover contacts and seals the outer peripheral edge of the semiconductor wafer to be electroplated.

4. The semiconductor wafer double-sided electroplating fixture according to claim 3, characterized in that, The conductive mechanism includes a conductive pin and a conductive sheet. The conductive sheet is located on the outside of the A-side hanger body or the B-side hanger body. The conductive pin is connected to a conductive wire. Both the A-side hanger body and the B-side hanger body are provided with through holes for wires to pass through. The conductive wire passes through the through holes and connects to the conductive sheet.

5. The semiconductor wafer double-sided electroplating fixture according to claim 4, characterized in that, Both the inner side of the A-side hanging fixture body and the inner side of the B-side hanging fixture body are provided with a main wire groove, a spring needle groove, and a spring needle. A portion of the conductive wire is embedded in the main wire groove and the spring needle groove. The spring needle is located next to the spring needle groove. The conductive wire is connected to the spring needle through the main wire groove and the spring needle groove. The spring needle passes through the conductive clearance hole of the top cover and is electrically connected to the conductive top cover.

6. The semiconductor wafer double-sided electroplating fixture according to claim 5, characterized in that, The conductive sheet includes an arc-shaped conductive sheet with multiple fin-shaped springs extending inward from the arc-shaped conductive sheet. These fin-shaped springs support the edge of the semiconductor wafer to be electroplated. The arc-shaped conductive sheet also has multiple arc-shaped conductive sheet positioning holes for positioning it on the outer edge of the wafer substrate. The arc-shaped conductive sheet has conductive sheet contacts, each containing a conductive screw and a conductive spring. Conductive sheet grooves are provided on the outer sides of both the A-side and B-side mounting bodies. The wafer substrate covers the outer side of the conductive sheet grooves. Conductive pins are connected to the A-side and B-side mounting bodies via conductive wires. The bottom of the side-connected conductive pin and the conductive wire pass through the main wire groove to the through hole. The wire is turned towards the outside of the A-side hanger body and the B-side hanger body and extends through the conductive sheet groove and the conductive screw. The conductive screw is connected to the conductive sheet contact on the conductive sheet on the outer edge of the upper part of the wafer base plate. The conductive current passes through the fin-shaped spring and conducts to the ineffective strip on the bottom of the semiconductor wafer to be electroplated. The ineffective strip is the edge part of the semiconductor wafer. The conductive screw presses against the conductive spring. The conductive spring passes through the conductive spring clearance hole on the upper cover conductive base plate and is electrically connected to the upper cover conductive base plate. The current passes through the elastic terminal of the upper cover conductive base plate and conducts to the ineffective strip on the upper part of the semiconductor wafer.

7. The semiconductor wafer double-sided electroplating fixture according to claim 1, characterized in that, The A-side mounting body and the B-side mounting body are respectively equipped with a resistance tester for testing the conductivity of the circuit and a leakage test port for testing whether the air circuit is leaking.

8. The semiconductor wafer double-sided electroplating fixture according to claim 1, characterized in that, A cover plate is provided on the outer side of the A-side fixture body or the outer side of the B-side fixture body. The cover plate covers the outer side of the A-side fixture body or the outer side of the B-side fixture body, so that only the A-side fixture body or the B-side fixture body can be used for semiconductor wafer electroplating.

9. The semiconductor wafer double-sided electroplating fixture according to claim 8, characterized in that, The A-side hanger body and the B-side hanger body are provided with a handle mechanism at one end. The handle mechanism includes a handle, and the two ends of the handle are provided with crane gripper positioning holes. The two sides of the A-side hanger body and the B-side hanger body are machined with side guide grooves, and the A-side hanger body and the B-side hanger body are provided with hanger positioning holes.

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