Laser power-on test device and method thereof

Abstract

The application relates to the technical field of lasers, and provides a laser power-on testing device and a method thereof. The method comprises the following steps: confirming the model of a to-be-tested laser to be tested currently, confirming a group of pin holes matched with through holes according to the model of the to-be-tested laser, and fixing a rotating cover plate and a pressing nut part by inserting pins or twisting in a screw rod through the through holes of the rotating cover plate; after assembling a component main body and a component base, rotating in a specified direction by a preset distance to fix the to-be-tested laser by a pressing component. The application can guarantee the accurate pressing degree of the laser power-on and can be finely adjusted.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser, in particular to a laser power-on testing device and method thereof. BACKGROUND

[0002] The optical device is the core part of the optical module, and the testing device of the optical device is extremely important. The power-on contact of the device pin must be good, and the device heat dissipation must be ensured. The device can ensure the good power-on contact of the device pin, and the power-on pressure can be fine-tuned. The device also has a self-locking foolproof device to ensure that the power-on contact is good during the device power-on testing process.

[0003] Prior art one: the optical device is directly welded on the test board, and the device is disassembled at high temperature after testing. This method is complex to operate and easy to damage the device.

[0004] Prior art two: a pressing block is used to directly press the optical device pin. This method is easy to press the optical device and difficult to control the pressing force.

[0005] Therefore, overcoming the defects of the prior art is an urgent problem to be solved in the technical field. SUMMARY

[0006] The technical problem to be solved by the present application is to overcome the defects of the prior art. The optical device is directly welded on the test board, and the device is disassembled at high temperature after testing. This method is complex to operate and easy to damage the device. Prior art two: a pressing block is used to directly press the optical device pin. This method is easy to press the optical device and difficult to control the pressing force.

[0007] The present application adopts the following technical solutions:

[0008] In a first aspect, the present application provides a laser power-on testing device, comprising a pressure applying assembly 1 and a test board 2, the pressure applying assembly 1 being arranged on the test board 2, and the test board 2 providing a peripheral driving circuit for a to-be-tested laser 3, in particular:

[0009] The pressure applying assembly 1 comprises an assembly base 11, an assembly body 12, a pressure nut 13 and a rotating cover plate 14.

[0010] The assembly base 11 is fixed on the test board 2 to form a space for accommodating the to-be-tested laser 3; the assembly body 12 is coupled to the assembly base 11 in a detachable structure; the pressure nut 13 is arranged in the vertical cavity 121 of the assembly body 12, and the rotation of the rotating cover plate 14 arranged at the top of the assembly body 12 drives the pressure nut 13 coupled to the rotating cover plate 14 to complete the up-down displacement of the pressure nut 13 in the vertical cavity 121 of the assembly body 12.

[0011] The bottom of the pressure nut 13 forms a fixed pressure on the laser to be tested during the up and down displacement.

[0012] Preferably, the top of the pressure nut 13 for coupling with the rotating cover plate 14 is provided with a ring of pin hole array 131; the rotating cover plate 14 is provided with at least two through holes 141 matching the positions of the pin holes in the ring of pin hole array 131; the initial height of the bottom of the pressure nut 13 is adjusted by selecting a group of pin holes in the pin hole array 131 to pair with the through holes 141.

[0013] Preferably, each pin hole in the pin hole array 131 is arranged on a circumference at equal intervals; the diameter of the circumference and the interval of the pin holes meet the requirement of selecting a group of pin holes in the pin hole array 131 to pair with the through holes 141, so as to adapt to the pressure requirement of different models of lasers to be tested.

[0014] Preferably, the top surface of the main body is further provided with a positioning pin 122, which is coupled with a rotating distance sliding groove 142 on the rotating cover plate 14, so that each time the laser to be tested 3 is pressed, the positioning pin 122 moves from one end to the other end of the rotating distance sliding groove 142.

[0015] Preferably, the assembly main body further comprises a limiting plate 123 and / or a clamping tongue 124, and the corresponding pressure nut 13 comprises a first body 132 and a second body 133, and the corresponding thread and pin hole array are arranged on the first body 132; the second body 133 passes through the bottom surface of the vertical through cavity 121 of the assembly main body 12, and the limiting of the downward movement of the pressure nut 13 in the assembly main body is completed by the limiting plate 123 and / or the clamping tongue 124.

[0016] Preferably, at least one side of the assembly main body 12 is provided with a clamping plate groove 125, and a clamping plate 126 is connected to the clamping plate groove 125 in a seesaw structure; the clamping plate 126 is provided with a barb 1261 at the bottom side of the assembly main body 12, which is used to hold the assembly base 11 when the assembly main body 12 is fixed with the assembly base 11; the clamping plate 126 is provided with a rebound assembly 127 at the top side of the assembly main body, which forms the required thrust based on the seesaw structure.

[0017] Preferably, the assembly main body 12 is coupled with the assembly base 11 in a detachable structure, which specifically comprises:

[0018] The clamping plate groove 125 and the matched seesaw structure are symmetrically arranged on both sides of the assembly main body 12; or,

[0019] The assembly body 12 is provided with the clamping plate groove and the matched seesaw structure on one side, and is coupled with the assembly base 11 through the shaft connection on the other side.

[0020] Preferably, the bottom of the pressing nut part 13 and the laser to be tested are further provided with a plastic pressing block assembly 15, which includes a plurality of structures adapted to the housings of corresponding models of lasers.

[0021] Preferably, the heat sink 4 is further included, which is arranged below the test board 2 and is used to provide heat dissipation characteristics for the test board 2 and the laser to be tested 3.

[0022] The area of the test board 2 for arranging the laser to be tested 3 forms a through groove 21, so that the heat dissipation surface of the laser to be tested 3 is directly coupled with the heat sink 4.

[0023] In the second aspect, the present application provides a laser power-on test method using the laser power-on test device as described in the first aspect, which comprises the following steps.

[0024] Confirming the model of the laser to be tested to be tested at present, confirming the group of pin holes currently selected and matched with the through hole 141 according to the model of the laser to be tested, and completing the fixation between the rotating cover plate 14 and the pressing nut part 13 by inserting the pin or twisting the screw through the through hole 141 of the rotating cover plate 14.

[0025] Arranging the laser to be tested 3 in the space area of the assembly base 11 for accommodating the laser to be tested 3.

[0026] After the assembly body 12 and the assembly base 11 are assembled, the assembly is rotated in a specified direction by a preset distance, and the fixation of the laser to be tested 3 by the pressing assembly 1 is completed.

[0027] The present application can ensure the accurate and fine-tuned power-on pressing force of the laser, and in the preferred implementation, the corresponding structure characteristics can be adapted to different initial heights according to the model of the laser, so as to generate the target pressure of each laser. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0029] Figure 1 is a schematic structural diagram of a laser power-on test device provided by the embodiments of the present application;

[0030] Figure 2 is a kind of laser power-on test device structural schematic diagram provided by the embodiment of the application;

[0031] Figure 3 is a kind of laser power-on test device in the structure schematic diagram of pressure nut spare part;

[0032] Figure 4 is a kind of laser power-on test device in the surface structure schematic diagram of rotating cover plate;

[0033] Figure 5 is a kind of laser power-on test device in the structure schematic diagram of bolt array;

[0034] Figure 6 is a kind of laser power-on test device in the structure schematic diagram of bolt array;

[0035] Figure 7 is a kind of laser power-on test device in the structure schematic diagram of component main body;

[0036] Figure 8 is a kind of laser power-on test device in the structure schematic diagram of rotating cover plate bottom;

[0037] Figure 9 is a kind of laser power-on test device structural schematic diagram provided by the embodiment of the application;

[0038] Figure 10 is a kind of laser power-on test device in the structure schematic diagram of seesaw;

[0039] Figure 11 is a kind of laser power-on test device in the structure schematic diagram of pressure component bottom;

[0040] Figure 12 is a kind of laser power-on test device structural schematic diagram provided by the embodiment of the application;

[0041] Figure 13 is a kind of laser power-on test method flow chart provided by the embodiment of the application. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical scheme and advantages of the application clearer, the application is further described in detail below with reference to the drawings and examples.It should be understood that the specific examples described herein are only used to explain the application, and are not used to limit the application.

[0043] In the description of this invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and do not require that this invention must be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0044] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0045] Example 1:

[0046] Embodiment 1 of the present invention provides a laser power-on testing device, such as... Figure 1 As shown, the system includes a pressure application component 1 and a test board 2. The pressure application component 1 is disposed on the test board 2, and the test board 2 provides a peripheral driving circuit for the laser under test 3. It should be noted that the accompanying drawings are merely one example of many solutions that can be implemented in this embodiment, and should be used as a reference example for understanding the text of this embodiment, rather than limiting the scope of the technology described herein. The theoretical basis here can be partially referenced in the following text. Figure 1 The structure is reflected in, such as Figure 2 As shown, specifically:

[0047] The pressure application component 1 includes a component base 11, a component body 12, a pressure application nut 13, and a rotating cover plate 14;

[0048] The component base 11 is fixed on the test plate 2, forming a space to accommodate the laser under test 3; the component body 12 is coupled to the component base 11 with a detachable structure; the pressure nut 13 is disposed in the vertical cavity 121 of the component body 12, and by rotating the rotating cover plate 14 disposed on the top of the component body 12, the pressure nut 13 coupled to the rotating cover plate 14 is driven to complete the vertical displacement of the pressure nut 13 in the vertical cavity 121 of the component body 12.

[0049] During the up-and-down displacement, the bottom of the pressure nut 13 applies a fixing pressure to the laser under test.

[0050] The embodiments of the present invention can ensure precise voltage application to the laser and allow for fine-tuning. Furthermore, in the preferred implementation, different initial heights can be adapted to the corresponding structural characteristics based on the laser model, thereby generating their respective target pressures.

[0051] like Figure 3 and Figure 4As shown, the top of the pressure nut member 13 for coupling with the rotating cover plate 14 is provided with a ring of pin hole array 131; the rotating cover plate 14 has at least two pin hole positions in the ring of pin hole array matched with the through hole 141; by selecting a group of pin holes in the pin hole array 131 to pair with the through hole 141, the initial height of the bottom of the pressure nut member 13 is adjusted. It should be noted that the relevant threads are not visually displayed in the drawings of the present application, but the description of the threads can be clearly defined based on the text, and should not be considered as unclear technical disclosure.

[0052] As a most simple embodiment recommended by the present application, and from the diversity of the combination mode and the subtlety of the initial height difference of the bottom of the corresponding pressure nut member 13 after the assembly body 12 is fixed, the angle of the adjacent combination mode is shown as Figure 3 The pin hole array 131 mode shown is the most optimal, and each pin hole in the pin hole array 131 is arranged on a circumference with equal spacing; wherein the diameter of the circumference and the pin hole spacing satisfy the process of selecting a group of pin holes in the pin hole array 131 to pair with the through hole 141, which can adapt to the pressure requirements of different models of lasers to be tested. It should be noted that the above-mentioned pin holes are only a way of expression, and in actual implementation, they can be called screw holes, etc. according to different fixing modes.

[0053] As shown in Figure 5 and Figure 6 , a structure diagram of 12 pin holes arranged on a circumference is given, and the corresponding values are marked in each pin hole. Further, the table presented by Figure 6 presents the relationship between the suitable laser shell height under the combination of each pin hole, wherein, Figure 6 the first column shows the combination mode in Figure 5 by connecting two numbers of a group of pin holes with a symbol "-", and the second column uses 1-7 combination as 0 offset state, and the laser shell height used in the corresponding 0 offset state is A, and each row in the table forms a height offset one by one downward. As shown in Figure 5 , the pin holes are evenly distributed, and every 30° has a pair of pin holes, which can be selected according to the application scenario to cooperate with the through hole 141, Figure 6The distance relationship is presented by taking the pitch of the inner thread in the vertical through cavity 121 of the pressing nut member 13 and its matched vertical through cavity 121 as an example, i.e. the pressing depth of the adjacent two pairs of pin holes is different by 1.5 / 12=0.125mm, after rotating the pressing nut member 13 by 30° clockwise, the pressing depth can be reduced by 0.125mm when cooperating with the through hole 141 on the rotating cover plate 14, and vice versa, according to the feature to adjust the pressing depth, i.e. the pressing force.

[0054] As shown in Figure 7 and Figure 8 , the top surface of the main body is also provided with a positioning pin 122, which is coupled with the rotating distance sliding groove 142 on the rotating cover plate 14, so that each time the laser to be tested 3 is pressed, the positioning pin 122 is moved from one end to the other end in the rotating distance sliding groove 142.

[0055] In the embodiment of the application, in order to effectively control the pressing nut member 13 and prevent it from falling off during disassembly and assembly of the assembly main body 12 and the base 11, etc., damage the body is tooth marks. In combination with the preferred embodiment of the application, as shown in Figure 9 , the assembly main body further comprises a limiting plate 123 and / or a clamping tongue 124, and the corresponding pressing nut member 13 comprises a first body 132 and a second body 133, and the corresponding thread and pin hole array are arranged on the first body 132; the second body 133 passes through the bottom surface of the vertical through cavity 121 of the assembly main body 12, and the limiting plate 123 and / or the clamping tongue 124 complete the limiting of the downward movement of the pressing nut member 13 in the assembly main body.

[0056] In order to realize the detachable coupling of the assembly main body 12 with the assembly base 11, the embodiment of the application also gives the corresponding implementation structure features, as shown in Figure 7 , Figure 9 and Figure 10 , at least one side of the assembly main body 12 is provided with a clamping plate groove 125, a clamping plate 126 is connected in the clamping plate groove 125 in a seesaw structure (in Figure 7 and Figure 9 , the seesaw structure is directly realized by the pin passing through the pin holes 128 arranged on both sides of the clamping plate groove 125, and the pin holes 129 matched in the clamping plate 126), the clamping plate 126 is provided with a barb 1261 at the bottom side of the assembly main body 12, which is used to hold the assembly base 11 when the assembly main body 12 and the assembly base 11 are fixed; the clamping plate 126 is provided with a rebound assembly 127 at the top side of the assembly main body 12. Figure 9The required pushing force for buckling is formed based on the seesaw structure (the pair of springs is directly embodied in the embodiment). In the specific implementation process, in order to further improve the integration, when the corresponding clamping plate 126 performs the seesaw operation, the part of the upper surface of the component base 11 that is beyond the clamping plate 126 needs to not only achieve the pressing comfort, but also needs to consider not colliding with the rotating cover plate 14. As shown in the preferred embodiment, the bottom area of the rotating cover plate 14 is also excavated to form a avoiding groove 143. Figure 8

[0057] Further, the clamping plate groove 125 and the symmetrical seesaw structure matched with the clamping plate groove 125 are arranged on both sides of the component main body 12, as shown in the embodiment. Figure 7 Figure 9 Figure 10 However, there is also a parallel alternative implementation mode, that is, the clamping plate groove and the matched seesaw structure are arranged on one side of the component main body 12, and the other side of the component main body 12 is coupled with the component base 11 through the shaft connection mode. This mode is not directly shown in the figure, but the corresponding structure can be clearly and unambiguously obtained according to the above description.

[0058] In order to improve the balance of the pressure generated by the pressing nut part 13 on the laser shell to be tested, the embodiment of the application also has a preferred implementation mode, as shown in the embodiment. Figure 11 The bottom of the pressing nut part 13 and the laser to be tested are further provided with a plastic pressing block assembly 15, and the plastic pressing block assembly 15 includes a plurality of structures matched with the shells of corresponding models of lasers.

[0059] Further, in consideration of the heat dissipation of the laser and the heat dissipation of the test board during the test, so as to provide continuous test endurance, the embodiment of the application also has a preferred implementation scheme, as shown in the embodiment. Figure 12 The heat dissipation device 4 is arranged below the test board 2 and is used for providing heat dissipation characteristics for the test board 2 and the laser to be tested 3.

[0060] The area of the test board 2 for arranging the laser to be tested 3 forms a through groove 21, so that the heat dissipation surface of the laser to be tested 3 is directly coupled with the heat dissipation device 4.

[0061] Example 2:

[0062] The embodiment of the application also provides a laser power-on test method, and the method needs to use the laser power-on test device as described in the embodiment 1, as shown in the embodiment. Figure 13 The method includes the following steps.

[0063] ​​​In step 201, the model of the laser to be tested 3 is confirmed, and according to the model of the laser to be tested 3, a group of pin holes paired with the through hole 141 is selected, and the fixing between the rotating cover plate 14 and the pressing nut part 13 is completed by inserting the pin through the through hole 141 of the rotating cover plate 14 or by screwing the screw.

[0064] In step 202, the laser to be tested 3 is arranged in the assembly base 11 in the space area for accommodating the laser to be tested 3.

[0065] In step 203, after the assembly body 12 and the assembly base 11 are assembled, the assembly body 12 is rotated in a specified direction by a preset distance, and the fixing of the laser to be tested 3 by the pressing assembly 1 is completed.

[0066] In combination with Figure 7 and Figure 8 , the preset distance of rotation here refers to that the rotating cover plate 14 is rotated by 18 degrees. The corresponding actual sinking distance of the pressing nut part 13 in the vertical direction can be calculated by combining the related theory in embodiment 1 with the pitch adopted in the actual situation, which will not be specifically elaborated here.

[0067] Since the present application is a method embodiment based on the common inventive concept of embodiment 1, the related expansion content in embodiment 1 is also applicable to the present application, for example, the expansion scheme of the pressing distance for adapting to different laser models presented in combination with Figure 5 and Figure 6 in embodiment 1 is also applicable to the present application, which will not be repeated here.

[0068] The above only describes the preferred embodiments of the present application and does not limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A laser power-up test apparatus, characterized by, The utility model provides a kind of laser testing device, including pressing assembly (1) and test plate (2), the pressing assembly (1) is arranged on the test plate (2), the test plate (2) provides peripheral drive circuit for laser (3) to be measured, specifically: The pressing assembly (1) includes assembly base (11), assembly body (12), pressing nut piece (13) and rotating cover plate (14); The assembly base (11) is fixed on the test plate (2), forming the space containing laser (3) to be measured;The assembly body (12) is coupled with the assembly base (11) in a detachable structure;The pressing nut piece (13) is arranged in the vertical cavity (121) of the assembly body (12), and by rotating the rotating cover plate (14) arranged at the top of the assembly body (12), the pressing nut piece (13) coupled with the rotating cover plate (14) is driven to complete the up-down displacement of the pressing nut piece (13) in the vertical cavity (121) of the assembly body (12); Wherein, the bottom of the pressing nut piece (13) forms a fixed pressure on the laser to be measured during the up-down displacement;The top surface of the assembly body (12) is also provided with a positioning pin (122), and the positioning pin (122) is coupled with the rotating distance sliding groove (142) on the rotating cover plate (14), so that each time the laser (3) is pressed, the displacement of the positioning pin (122) from one end to the other end in the rotating distance sliding groove (142) is completed.

2. The laser power-up test apparatus of claim 1, wherein, The top of the pressing nut piece (13) for coupling with the rotating cover plate (14) is provided with an array of pinhole holes (131);The rotating cover plate (14) has at least two pinhole holes positionally matched with the array of pinhole holes in the array of pinhole holes (131);By selecting a group of pinhole holes in the array of pinhole holes (131) and pairing with the through hole (141), the initial height of the bottom of the pressing nut piece (13) is adjusted.

3. The laser power-up test apparatus of claim 2, wherein, Each pinhole hole in the array of pinhole holes (131) is arranged on a circumference at equal intervals;Wherein, the diameter of the circumference and the pinhole hole spacing satisfy the pairing process of selecting a group of pinhole holes in the array of pinhole holes (131) and the through hole (141), which can adapt to the pressure requirements of different models of lasers to be measured.

4. The laser power-up test apparatus of claim 2, wherein, The assembly body further includes a limiting plate (123) and / or a clamping tongue (124), and the corresponding pressing nut piece (13) includes a first body (132) and a second body (133), and the corresponding thread and array of pinhole holes are arranged on the first body (132);The second body (133) penetrates the bottom surface of the vertical cavity (121) of the assembly body (12), and the limiting plate (123) and / or the clamping tongue (124) complete the limiting of the downward movement of the pressing nut piece (13) in the assembly body.

5. The laser power-up test apparatus of any of claims 1-4, wherein, At least one side of the assembly body (12) is provided with a clamping plate slot (125), and a clamping plate (126) is connected to the clamping plate slot (125) in a seesaw structure. The clamping plate (126) is provided with a barb (1261) at the bottom side of the assembly body (12) for buckling the assembly base (11) when the assembly body (12) is fixed with the assembly base (11). The clamping plate (126) is provided with a rebound assembly (127) at the top side of the assembly body (12) to form the required thrust based on the seesaw structure.

6. The laser power-up test apparatus of claim 5, wherein, The assembly body (12) is coupled with the assembly base (11) in a detachable structure, specifically including: The clamping plate slot (125) and the matched seesaw structure are symmetrically arranged on both sides of the assembly body (12); or, The clamping plate slot and the matched seesaw structure are arranged on one side of the assembly body (12), and the other side of the assembly body (12) is coupled with the assembly base (11) by a shaft connection.

7. The laser power-up test apparatus of any of claims 1-4, wherein, A plastic pressing block assembly (15) is further arranged between the bottom of the pressing nut member (13) and the laser to be tested, and the plastic pressing block assembly (15) includes a plurality of structures matched with the shells of corresponding models of lasers.

8. The laser power-up test apparatus of any of claims 1-4, wherein, A heat sink (4) is further included, which is arranged below the test board (2) to provide heat dissipation characteristics for the test board (2) and the laser to be tested (3). The area of the test board (2) for arranging the laser to be tested (3) forms a through slot (21) so that the heat dissipation surface of the laser to be tested (3) is directly coupled with the heat sink (4).

9. A method of testing a laser upon power-up, the method comprising: The method includes: Confirming the model of the laser to be tested to be tested currently, confirming a group of pin holes matched with the through hole (141) according to the model of the laser to be tested, and inserting the pin into the through hole (141) of the cover plate (14) or twisting the screw to complete the fixation between the cover plate (14) and the pressing nut member (13); Arranging the laser to be tested (3) in the space area of the assembly base (11) for accommodating the laser to be tested (3); After assembling the assembly body (12) and the assembly base (11), rotating in a specified direction by a preset distance to complete the fixation of the laser to be tested (3) by the pressing assembly (1).

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