Method for manufacturing a display device and display device

Abstract

The present application provides a method for manufacturing a display device and a display device. The method for manufacturing a display device includes: providing a color filter substrate and an array substrate; coating a sealant raw material having photothermal conversion particles on the color filter substrate and / or the array substrate; aligning the color filter substrate and the array substrate; irradiating the sealant raw material from a side of the array substrate facing away from the color filter substrate with a preset light beam to cure the sealant raw material into a sealant; and the photothermal conversion particles convert at least part of the preset light beam into heat energy to promote the curing of the sealant raw material, so as to form a display device. The sealant raw material of the present application can be cured by light and heat during the photocuring stage through the photothermal conversion particles. Compared with the sealant raw material in the related art that can only be cured by light during the photocuring stage, the method for manufacturing a display device of the present application can improve the curing rate of the sealant raw material during the photocuring stage.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a method for manufacturing a display device and a display device. Background Art

[0002] With the development of optoelectronic display technologies and semiconductor manufacturing technologies, LCD display devices (Thin Film Transistor-Liquid Crystal Display, TFT-LCD) equipped with thin film transistors have become increasingly mature. Due to their advantages such as being thin, light, and convenient to carry, they have been more and more widely used.

[0003] In the manufacturing process of LCD display devices, it is necessary to coat sealant to bond the color filter substrate and the array substrate of the LCD. After the sealant is coated, the color filter substrate and the array substrate need to be aligned in a timely manner, and the sealant needs to be photocured and subsequently thermally cured to complete the assembly of the color filter substrate and the array substrate. However, in related technologies, the curing rate of the sealant is relatively low, and how to improve the curing rate of the sealant has become a technical problem to be solved. Summary of the Invention

[0004] The purpose of the present application is to provide a method for manufacturing a display device and a display device, so as to solve the technical problem of how to improve the curing rate of the sealant.

[0005] In a first aspect, the present application provides a method for manufacturing a display device, including:

[0006] Providing a color filter substrate and an array substrate;

[0007] Coating a sealant raw material with photothermal conversion particles on the color filter substrate and / or the array substrate;

[0008] Aligning the color filter substrate and the array substrate;

[0009] Irradiating the sealant raw material with a preset light from a side of the array substrate facing away from the color filter substrate, so that the sealant raw material is cured into a sealant; and the photothermal conversion particles convert at least part of the preset light into heat energy to promote the curing of the sealant raw material, so as to form a display device.

[0010] In the method for manufacturing a display device provided by the present application, a sealant raw material containing photothermal conversion particles is coated on the color filter substrate and / or the array substrate. After the color filter substrate and the array substrate are aligned, a preset light is used to irradiate the sealant raw material from the side of the array substrate facing away from the color filter substrate, so that the sealant raw material is cured into a sealant. The photothermal conversion particles convert at least part of the preset light into heat energy, causing the sealant raw material to be cured to form a display device. In the photo-curing stage, ultraviolet light of the preset light irradiates the sealant raw material, and the sealant raw material undergoes photo-curing. The photothermal conversion particles convert at least part of the preset light into heat energy and increase the temperature of the sealant raw material, causing the sealant raw material to undergo thermal curing. The sealant raw material of the present application can undergo photo-curing and thermal curing to form a sealant through photothermal conversion particles. Compared with the sealant raw material in the related art that can only undergo photo-curing in the photo-curing stage, the method for manufacturing a display device of the present application can improve the curing rate of the sealant raw material in the photo-curing stage.

[0011] Before "coating the sealant on the color filter substrate and / or the array substrate", it further includes:

[0012] Stir and mix the sealant raw material and the photothermal conversion particles evenly and remove bubbles to form the sealant raw material containing the photothermal conversion particles.

[0013] In "using a preset light to irradiate the sealant raw material from the side of the array substrate facing away from the color filter substrate", it includes:

[0014] Irradiate the side of the array substrate facing away from the color filter substrate with a first preset light for a first period of time, and the wavelength of the first preset light is 10 nm - 380 nm;

[0015] Irradiate the side of the array substrate facing away from the color filter substrate with a second preset light for a second period of time, and the wavelength of the second preset light is 380 nm - 1000 nm.

[0016] Before "stir and mix the sealant raw material and the photothermal conversion particles evenly and remove bubbles", it further includes:

[0017] Hydrophobically treat the photothermal conversion particles.

[0018] The percentage of the mass of the photothermal conversion particles in the mass of the sealant raw material is 0.5% - 1%.

[0019] The material of the photothermal conversion particles is one or more of nano-precious metals, nano-carbon materials, and nano-semiconductor materials.

[0020] Before the method for manufacturing a display device, it further includes:

[0021] Manufacture a light-shielding layer, and the light-shielding layer is disposed on the side of the array substrate facing away from the color filter substrate.

[0022] Among them, the first time is less than the second time.

[0023] In a second aspect, the present application provides a display device manufactured by the method for manufacturing a display device.

[0024] Among them, the display device further includes a black matrix layer, the black matrix layer is disposed on a side of the color filter substrate facing away from the array substrate, and the black matrix layer is disposed corresponding to the sealant, and the black matrix layer is used to block external light from entering the sealant. Description of the Drawings

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0026] Figure 1 It is a flowchart of a method for manufacturing a display device provided in Embodiment 1 of the present application;

[0027] Figure 2 It is a schematic structural diagram of a part of a display device irradiated with a preset light provided in Embodiment 1 of the present application;

[0028] Figure 3 It is a schematic cross-sectional structure of a display device before being irradiated with a preset light provided in Embodiment 1 of the present application Figure 1 ;

[0029] Figure 4 It is a schematic cross-sectional structure of a display device after being irradiated with a preset light provided in Embodiment 1 of the present application Figure 2 ;

[0030] Figure 5 It is a partial process of a method for manufacturing a display device provided in Embodiment 2 of the present application Figure 1 ;

[0031] Figure 6 It is a partial process of a method for manufacturing a display device provided in Embodiment 3 of the present application Figure 2 ;

[0032] Figure 7 It is a partial process of a method for manufacturing a display device provided in Embodiment 4 of the present application Figure 3 ;

[0033] Figure 8 It is a flowchart of a method for manufacturing a display device provided in Embodiment 5 of the present application;

[0034] Figure 9 It is a schematic structural diagram of a display device provided in the first embodiment of the present application;

[0035] Figure 10 It is a partial process of a method for manufacturing a display device provided in the sixth embodiment of the present application Figure 4 ;

[0036] Figure 11 It is a top view schematic diagram of a display device provided in the seventh embodiment of the present application;

[0037] Figure 12 It is a top view schematic diagram of a sealant provided in the first embodiment of the present application;

[0038] Figure 13 It is a schematic cross-sectional structure of a display device provided in the eighth embodiment of the present application Figure 1 ;

[0039] Figure 14 It is a top view schematic diagram of a light-shielding layer provided in the ninth embodiment of the present application;

[0040] Figure 15 It is a schematic cross-sectional structure of a display device provided in the ninth embodiment of the present application Figure 2 。

[0041] Label description:

[0042] Display device - 1000, display area - 101, non-display area - 102, backlight module - 200, color filter substrate - 10, array substrate - 20, metal wiring layer - 21, sealant - 30, photothermal conversion particles - 31, light-shielding layer - 40, black matrix layer - 50. Specific embodiments

[0043] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0044] In this article, referring to "embodiment" or "embodiment" means that a specific feature, structure, or characteristic described in connection with the embodiment or embodiment may be included in at least one embodiment of the present application. The phrase appears in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.

[0045] It should be noted that the terms "first", "second", etc. in the description, claims and the above-mentioned drawings of this application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion.

[0046] In this specification, for convenience, terms indicating orientation or positional relationship such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are used to describe the positional relationship of the constituent elements with reference to the drawings. This is only for the convenience of describing this specification and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present disclosure. The positional relationship of the constituent elements is appropriately changed according to the direction of the described constituent elements. Therefore, it is not limited to the terms described in the specification and can be appropriately replaced according to the situation.

[0047] In this specification, unless otherwise clearly specified and limited, the terms "installed", "connected", and "coupled" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate member, or the communication inside two elements. For those of ordinary skill in the art, the meanings of the above terms in the present disclosure can be understood according to the situation.

[0048] With the development of optoelectronic display technology and semiconductor manufacturing technology, the LCD display device (Thin Film Transistor-Liquid Crystal Display, TFT-LCD) equipped with thin film transistors has become increasingly mature. Due to its advantages such as being thin, light, and easy to carry, it has been more and more widely used.

[0049] In the manufacturing process of the LCD display device, it is necessary to coat sealant to bond the color filter substrate and the array substrate of the LCD. After the sealant is coated, the color filter substrate and the array substrate need to be aligned in a timely manner, and the sealant needs to be photo-cured and subsequently thermally cured to complete the assembly of the color filter substrate and the array substrate.

[0050] Among them, photo-curing is a pre-curing means for sealant curing. If the curing rate of the sealant in the photo-curing stage is low, impurities in the sealant are likely to precipitate and contaminate the liquid crystal during the subsequent thermal curing of the sealant. Since the thermal curing heats the entire display device to above 120°C and the entire sealant is heated, contaminants are likely to precipitate. Therefore, how to improve the curing rate in the photo-curing stage is a very important issue.

[0051] However, in the related art, the curing rate of the frame adhesive is relatively low. When the frame adhesive is cured by light, generally light is irradiated from the side of the array substrate. Since there are metal traces related to GDL on the array substrate, most of the ultraviolet light irradiated on the array substrate will be blocked by the metal wires, and only a part of the ultraviolet light can irradiate the frame adhesive. Therefore, there is a problem of low curing rate of the frame adhesive in the light curing stage. How to improve the curing rate of the frame adhesive has become a technical problem to be solved.

[0052] Please refer to Figure 1 and Figure 2 , the present application provides a method for manufacturing a display device to solve the problem of how to improve the curing rate of the frame adhesive.

[0053] The method for manufacturing the display device includes but is not limited to steps S100, S200, S300, and S400. The detailed descriptions of steps S100, S200, S300, and S400 are as follows.

[0054] S100: Provide a color filter substrate 10 and an array substrate 20.

[0055] S200: Coat a frame adhesive raw material having photothermal conversion particles 31 on the color filter substrate 10 and / or the array substrate 20.

[0056] Optionally, in this embodiment, a frame adhesive raw material having photothermal conversion particles 31 is coated on the color filter substrate 10. In other embodiments, it may also be coating a frame adhesive raw material having photothermal conversion particles 31 on the array substrate 20, or coating a frame adhesive raw material having photothermal conversion particles 31 on both the color filter substrate 10 and the array substrate 20. The present application does not limit this.

[0057] Specifically, the array substrate 20 includes a metal trace layer 21. When coating a frame adhesive raw material having photothermal conversion particles 31 on the array substrate 20, the frame adhesive raw material having photothermal conversion particles 31 can be coated on the metal trace layer 21.

[0058] The photothermal conversion particles 31 can utilize visible light and near-infrared light and convert the energy of visible light and near-infrared light into heat energy.

[0059] S300: Pair the color filter substrate 10 and the array substrate 20.

[0060] The color film substrate 10 and the array substrate 20 are aligned. Specifically, in this embodiment, after applying the sealant 30 on the color film substrate 10, one side of the metal trace layer 21 in the array substrate 20 is oriented towards the side of the color film substrate 10 where the sealant 30 is applied. Then, the peripheries of the color film substrate 10 and the array substrate 20 are aligned, and finally, the array substrate 20 and the color film substrate 10 are bonded through the sealant 30.

[0061] S400: Irradiate the sealant raw material from the side of the array substrate 20 facing away from the color film substrate 10 with a preset light beam, so that the sealant raw material cures into the sealant 30; and the photothermal conversion particles 31 convert at least part of the preset light beam into heat energy to promote the curing of the sealant raw material, thereby forming the display device 1000.

[0062] Specifically, the preset light beam includes ultraviolet light, and the sealant raw material further includes a photo-curing agent. The photo-curing agent can photo-cure the sealant raw material through the irradiation of ultraviolet light, thereby forming the sealant frame 30.

[0063] The preset light beam further includes visible light or near-infrared light. The photothermal conversion particles 31 can utilize visible light and near-infrared light and convert the energy of visible light and near-infrared light into heat energy. The photothermal conversion particles 31 release heat in the sealant raw material and perform local thermal curing on the sealant raw material at the micro-nano scale, so that the sealant raw material undergoes photo-curing and thermal curing simultaneously during the photo-curing stage.

[0064] In the method for manufacturing the display device provided in this application, a sealant raw material with photothermal conversion particles 31 is applied on the color film substrate 10 and / or the array substrate 20. After aligning the color film substrate 10 and the array substrate 20, the sealant raw material is irradiated from the side of the array substrate 20 facing away from the color film substrate 10 with a preset light beam, so that the sealant raw material cures into a sealant. The photothermal conversion particles 31 convert at least part of the preset light beam into heat energy to cure the sealant raw material, thereby forming the display device 1000. During the photo-curing stage, the ultraviolet light of the preset light beam irradiates the sealant raw material, and the sealant raw material undergoes photo-curing. The photothermal conversion particles 31 convert at least part of the preset light beam into heat energy and increase the temperature of the sealant raw material, so that the sealant raw material undergoes thermal curing. The sealant raw material in this application can undergo photo-curing and thermal curing to form a sealant through the photothermal conversion particles 31 during the photo-curing stage. Compared with the sealant raw material in the related art that can only undergo photo-curing during the photo-curing stage, the method for manufacturing the display device in this application can improve the curing rate of the sealant raw material during the photo-curing stage.

[0065] It should be noted that increasing the curing rate of the sealant raw material in the photo-curing stage can also make the sealant raw material precipitate fewer impurities in the subsequent thermal-curing stage, reduce the probability of the liquid crystal being contaminated by impurities, and improve the manufacturing yield of the display device 1000.

[0066] And, please refer to Figure 3 and Figure 4 , after multiple photo-thermal conversion particles 31 absorb the preset light, a polymer network structure is formed between the multiple photo-thermal conversion particles. The polymer network structure can also block the precipitation of impurities, further reducing the probability of the liquid crystal being contaminated by impurities and improving the manufacturing yield of the display device 1000.

[0067] The sealant 30 contains photo-thermal conversion particles 31, which further enhances the strength of the sealant 30 and improves the service life of the display device 1000. The sealant raw material contains the photo-thermal conversion particles 31, which can also improve the fluidity of the sealant raw material and the coating accuracy of the sealant raw material.

[0068] Please refer to Figure 5 , before the step S200 of "coating the sealant raw material with photo-thermal conversion particles 31 on the color filter substrate 10 or the array substrate 20", there is also an S150, and the detailed description of the step S150 is as follows.

[0069] S150: Stir and mix the sealant raw material and the photo-thermal conversion particles 31 evenly and remove bubbles to form the sealant raw material with the photo-thermal conversion particles 31.

[0070] Specifically, the sealant raw material and the photo-thermal conversion particles 31 are stirred and mixed evenly, so that the photo-thermal conversion particles 31 can be evenly distributed in each area of the sealant raw material. When the back side of the array substrate 20 facing away from the color filter substrate 10 is irradiated with the preset light, the photo-thermal conversion particles 31 in each area absorb the preset light and release heat energy, making the temperature of the sealant raw material rise more evenly and improving the heating efficiency of the sealant raw material.

[0071] The sealant raw material includes materials such as resin, photo-curing agent, solvent, and silica spheres.

[0072] Optionally, in other embodiments, the sealant 30 can also include a dispersant, and the dispersant can make the photo-thermal conversion particles more evenly distributed in the sealant raw material.

[0073] Stir and mix the sealant raw material and the photo-thermal conversion particles 31 evenly and remove bubbles, which improves the bonding performance of the sealant 30 and enhances the stability between the array substrate 20 and the color filter substrate 10.

[0074] Specifically, the side of the array substrate 20 facing away from the color filter substrate 10 is irradiated with a preset light. If the percentage of the mass of the photothermal conversion particles 31 in the mass of the frame adhesive raw material is greater than 1%, it may cause the ultraviolet light of the preset light to be blocked by the photothermal conversion particles 31, reducing the curing rate of the frame adhesive raw material during photocuring and also reducing the fluidity of the frame adhesive raw material. If the percentage of the mass of the photothermal conversion particles 31 in the mass of the frame adhesive raw material is less than 0.5%, it may lead to a decrease in the heating rate of the frame adhesive raw material, increasing energy consumption.

[0075] In this embodiment, the percentage of the mass of the photothermal conversion particles 31 in the mass of the frame adhesive raw material is 0.5% - 1%. It can cause the frame adhesive raw material to undergo thermal curing while the curing rate of the frame adhesive raw material during photocuring fluctuates less, so as to improve the curing rate of the frame adhesive raw material.

[0076] For example, the percentage of the mass of the photothermal conversion particles 31 in the mass of the frame adhesive raw material can be 0.5%, or 0.6%, or 0.7%, or 0.8%, or 0.9%, or 1.0%, or other values within 0.5% - 1%. The present application does not limit this.

[0077] Optionally, the material of the photothermal conversion particles 31 is one or more of MOF-based graphene nanocomposites, nano-precious metals, nano-carbon materials, and nano-semiconductor materials.

[0078] For example, the nano-precious metal can be nano-gold, nano-platinum or other nano-precious metals, the nano-carbon material can be graphene or other materials, and the nano-semiconductor material can be carbon nanotubes, nano-CuS or other materials.

[0079] The morphology of the photothermal conversion particles 31 can be nanorods, nanospheres, nanotubes, nanoflowers, nanocages, small-sized nano two-dimensional materials, etc.

[0080] If the size of the photothermal conversion particles 31 is greater than 1 μm, it may cause the ultraviolet light of the preset light to be blocked by the photothermal conversion particles 31, reducing the curing rate of the frame adhesive raw material during photocuring and also reducing the fluidity of the frame adhesive raw material. Therefore, the size of the photothermal conversion particles 31 is less than 1 μm.

[0081] Please refer to Figure 6 In step S400, in the step of "irradiating the frame adhesive raw material with a preset light from the side of the array substrate 20 facing away from the color filter substrate 10", there are also steps S410 and S420. The detailed descriptions of steps S410 and S420 are as follows.

[0082] S410: Irradiate the side of the array substrate 20 facing away from the color filter substrate 10 with a first preset light for a first period of time, where the wavelength of the first preset light is 10 nm - 380 nm.

[0083] The first preset light is the ultraviolet light, and the first preset light is used to photocure the sealant 30.

[0084] Optionally, the wavelength of the first preset light can be 10 nm, or 30 nm, or 50 nm, or 100 nm, or 140 nm, or 180 nm, or 210 nm, or 290 nm, or 300 nm, or 350 nm, or 380 nm, or other values within 10 nm - 380 nm.

[0085] S420: Irradiate the side of the array substrate 20 facing away from the color filter substrate 10 with a second preset light for a second period of time, where the wavelength of the second preset light is 380 nm - 1000 nm.

[0086] The second preset light is the visible light and / or the near-infrared light. Optionally, the second preset light can be visible light, the second preset light can also be near-infrared light, and the second preset light can also be a mixed light of the visible light and the near-infrared light. The present application does not limit this. The second preset light is used to be absorbed by the photothermal conversion particles 31 and converted into heat energy to increase the temperature of the sealant 30, thereby enabling the sealant 30 to be thermally cured.

[0087] It should be noted that when the second preset light is visible light, the wavelength of the second preset light is 380 nm - 780 nm. Optionally, the wavelength of the second preset light can be 380 nm, or 400 nm, or 450 nm, or 470 nm, or 500 nm, or 590 nm, or 600 nm, or 610 nm, or 620 nm, or 700 nm, or 780 nm, or other values within 380 nm - 780 nm.

[0088] When the second preset light is near-infrared light, the wavelength of the second preset light is 780 nm - 1000 nm. Optionally, the wavelength of the second preset light can be 780 nm, or 790 nm, or 800 nm, or 810 nm, or 850 nm, or 900 nm, or 960 nm, or 970 nm, or 980 nm, or 990 nm, or 1000 nm, or other values within 780 nm - 1000 nm.

[0089] Among them, the steps of "irradiating the side of the array substrate 20 facing away from the color filter substrate 10 with the first preset light" in step S410 and "irradiating the side of the array substrate 20 facing away from the color filter substrate 10 with the second preset light" in step S420 can be carried out simultaneously or step by step. In other words, the side of the array substrate 20 facing away from the color filter substrate 10 can be irradiated with the first preset light and the second preset light simultaneously. For the convenience of distinction in this application, they are artificially named two steps, which should not be construed as a limitation to this application. In other words, it is also possible to first irradiate the side of the array substrate 20 facing away from the color filter substrate 10 with the first preset light, and then irradiate the side of the array substrate 20 facing away from the color filter substrate 10 with the second preset light.

[0090] Specifically, when irradiating the side of the array substrate 20 facing away from the color filter substrate 10 with the first preset light, the irradiation time of the first preset light is the first time. When irradiating the side of the array substrate 20 facing away from the color filter substrate 10 with the second preset light, the irradiation time of the second preset light is the second time, and the first time is shorter than the second time. The time required for the photo-curing of the sealant 30 is less than the time for the thermal curing of the sealant 30 through the photothermal conversion particles 31, so as to control the first time to be less than the second time and reduce the energy loss during the preparation process of the display device 1000.

[0091] Optionally, the first light source for emitting the first preset light and the second light source for emitting the second preset light can be integrated into one component or split into two components.

[0092] Please refer to Figure 7 , before step S150 of "stirring and mixing the sealant raw material and the photothermal conversion particles 31 evenly and defoaming", there is step S120, and the detailed description of step S120 is as follows.

[0093] S120: Perform hydrophobic treatment on the photothermal conversion particles 31.

[0094] Performing hydrophobic treatment on the photothermal conversion particles 31, and then stirring and mixing the sealant raw material and the photothermal conversion particles 31 evenly and defoaming to form the sealant 30 can further improve the waterproof performance of the sealant 30 and extend the service life of the display device 1000.

[0095] After irradiating the side of the array substrate 20 facing away from the color filter substrate 10 with the second preset light, it is necessary to make the photothermal conversion particles 31 in the sealant 30 ineffective or the photothermal conversion particles 31 no longer receive light irradiation during the subsequent operation of the display device 1000.

[0096] It should be noted that, in this embodiment, the display device 1000 may be a reflection type display device without a backlight module (using ambient light reflection to achieve screen display). In other embodiments, the display device 1000 may further include a backlight module 200. Hereinafter, an example will be given with the display device 1000 including the backlight module 200.

[0097] Please refer to Figure 8 and Figure 9 , in another embodiment, compared with Figure 1 the embodiment shown, the manufacturing method of the display device further includes S500, and the detailed description of step S500 is as follows.

[0098] S500: Provide the backlight module 200 and fix it to the display device 1000.

[0099] The backlight module 200 is used to provide backlight light to the display device 1000, and the display device 1000 forms a display screen with the backlight light. The way of fixing the backlight module 200 to the display device 1000 includes but is not limited to bonding, screw connection or other connection methods.

[0100] Please refer to Figure 10 , the manufacturing method of the display device further includes S430, and the detailed description of step S430 is as follows.

[0101] S430: Fabricate a light-shielding layer 40, and the light-shielding layer 40 is disposed on the side of the array substrate 20 facing away from the color filter substrate 10.

[0102] The light-shielding layer 40 is disposed on the side of the array substrate 20 facing away from the color filter substrate 10, and the position of the light-shielding layer 40 corresponds to the position of the sealant 30. The light-shielding layer 40 can be used to block ambient light or light emitted by the backlight module 200 from irradiating the sealant 30.

[0103] Please refer to Figure 2 , Figure 9 , Figure 11 and Figure 12 , this application also provides a display device 1000, and the display device 1000 is manufactured by the manufacturing method of the display device.

[0104] The display device 1000 has a display area 101 and a non-display area 102.

[0105] The display device 1000 includes the array substrate 20, the color filter substrate 10, and the sealant 30, and the array substrate 20 and the color filter substrate 10 are disposed opposite to each other. The sealant 30 is disposed between the array substrate 20 and the color filter substrate 10 in the non-display area 102, and the sealant 30 includes photothermal conversion particles 31.

[0106] The display area 101 of the display device 1000 is used for displaying a picture, and the non-display area 102 of the display device 1000 does not display a picture. The non-display area 102 surrounds the display area 101.

[0107] The sealant 30 is disposed in the non-display area 102 and between the array substrate 20 and the color filter substrate 10 in the non-display area 102, improving the display quality of the display device 1000.

[0108] The sealant 30 further includes a photo-curing agent, and the photo-curing agent can photo-cure the sealant 30 through the irradiation of ultraviolet light. The photothermal conversion particles 31 can utilize visible light and near-infrared light, convert the energy of the visible light and the near-infrared light into heat energy, and increase the temperature of the sealant 30 itself, so that the sealant 30 is thermally cured.

[0109] In the display device 1000 provided in the present application, ultraviolet light, visible light, and near-infrared light with three wavelengths can be irradiated on the sealant 30, and the sealant 30 can be photo-cured and thermally cured during the photo-curing stage through the photothermal conversion particles 31. Compared with the sealant in the related art that can only be photo-cured during the photo-curing stage, the sealant 30 of the display device 1000 in the present application has a higher curing rate.

[0110] Moreover, a polymer network structure is formed between the plurality of photothermal conversion particles, and the polymer network structure can also block the precipitation of impurities, further reducing the probability of the liquid crystal being contaminated by impurities and improving the production yield of the display device 1000.

[0111] The sealant 30 includes the photothermal conversion particles 31, further enhancing the strength of the sealant 30 and increasing the service life of the display device 1000. The sealant 30 includes the photothermal conversion particles 31, and can also improve the fluidity of the sealant 30 and the coating accuracy of the sealant 30.

[0112] Please refer to Figure 13, the display device 1000 further includes a black matrix layer 50, the black matrix layer 50 is disposed on a side of the color filter substrate 10 facing away from the array substrate 20, and the black matrix layer 50 is disposed corresponding to the sealant 30, and the black matrix layer 50 is configured to block external light from entering the sealant 30.

[0113] So that the external light cannot irradiate the photothermal conversion particles 31 of the sealant 30 from the front, and avoid the photothermal conversion particles in the sealant 30 from converting the external light into heat energy to increase the temperature of the display device 1000.

[0114] Please refer to Figure 14 and Figure 15 , the display device 1000 further includes a light shielding layer 40, the light shielding layer 40 is disposed on a side of the array substrate 20 facing away from the color filter substrate 10, and the light shielding layer 40 is configured to block ambient light or light emitted by the backlight module 200 from entering the sealant 30.

[0115] Optionally, in the present embodiment, the light shielding layer 40 is disposed in the non-display area 102, and the light shielding layer 40 is disposed at an edge of the optical film layer closest to the display device 1000 in the backlight module 200.

[0116] Optionally, in the present embodiment, the light shielding layer 40 is an opaque black glue.

[0117] The backlight module 200 further includes a side frame, and the side frame is configured to block external light, so that the external light cannot irradiate the photothermal conversion particles 31 of the sealant 30 from the side.

[0118] The above are some embodiments of the present application. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and refinements can be made, and these improvements and refinements are also regarded as the protection scope of the present application.

Claims

1. A method for manufacturing a display device, characterized in that, comprising: providing a color filter substrate and an array substrate; coating a sealant raw material with photothermal conversion particles on the color filter substrate and / or the array substrate; pairing the color filter substrate and the array substrate; irradiating the sealant raw material with a preset light beam from a side of the array substrate facing away from the color filter substrate to cure the sealant raw material into a sealant; and the photothermal conversion particles convert at least part of the preset light beam into heat energy to promote curing of the sealant raw material to form a display device; In the step of "irradiating the sealant raw material with a preset light beam from a side of the array substrate facing away from the color filter substrate", it includes: irradiating the side of the array substrate facing away from the color filter substrate with a first preset light beam for a first time, the wavelength of the first preset light beam being 10 nm - 380 nm; irradiating the side of the array substrate facing away from the color filter substrate with a second preset light beam for a second time, the wavelength of the second preset light beam being 380 nm - 1000 nm, and the first time being less than the second time.

2. The method for manufacturing a display device according to claim 1, characterized in that, before the step of "coating a sealant on the color filter substrate and / or the array substrate", it further includes: stirring and mixing the sealant raw material and the photothermal conversion particles evenly and removing bubbles to form the sealant raw material with the photothermal conversion particles.

3. The method for manufacturing a display device according to claim 1, characterized in that, before the step of "stirring and mixing the sealant raw material and the photothermal conversion particles evenly and removing bubbles", it further includes: performing a hydrophobic treatment on the photothermal conversion particles.

4. The method for manufacturing a display device according to claim 1, characterized in that, the percentage of the mass of the photothermal conversion particles to the mass of the sealant raw material is 0.5% - 1%.

5. The method for manufacturing a display device according to claim 1, characterized in that, the material of the photothermal conversion particles is one or more of nano-precious metals, nano-carbon materials, and nano-semiconductor materials.

6. The method for manufacturing a display device according to claim 1, characterized in that, the method for manufacturing a display device further includes: fabricating a light-shielding layer, and the light-shielding layer is disposed on a side of the array substrate facing away from the color filter substrate.

7. A display device, characterized in that, it is manufactured by the method for manufacturing a display device according to any one of claims 1 - 6.

8. The display device according to claim 7, characterized in that, the display device further includes a black matrix layer, the black matrix layer is disposed on a side of the color filter substrate facing away from the array substrate, and the black matrix layer corresponds to the sealant, and the black matrix layer is used to block external light from entering the sealant.

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