Spring selection method, device and storage medium

Abstract

The embodiments of the present application provide a method, device, and storage medium for spring selection, relating to, but not limited to, the field of automated equipment technology. The method is applied to a spring selection system, which is provided with a spring parameter input view. The method includes: obtaining the usage parameters of the spring to be selected from the spring parameter input view; determining spring selection information based on the spring usage parameters; matching the spring selection information with a preset spring specification table; when a matching spring model exists in the spring specification table, outputting the product information corresponding to the matching spring model; and when no matching spring model exists in the spring specification table, outputting the production parameters corresponding to the spring selection information. The device and storage medium implement the above method, and the embodiments of the present application can improve the convenience of spring selection.

Description

Technical Field

[0001] The present application relates to, but is not limited to, the field of automation equipment technology, and in particular to a method, device, and storage medium for spring selection. Background Art

[0002] Springs, as common mechanical components, are used in a variety of mechanical devices, such as machinery, ballpoint pens, lighters, and mobile phones. The selection of springs can directly impact the user experience of the mechanical device in which they are used. For example, a ballpoint pen uses a spring to return the refill to its barrel. If the spring is incorrectly selected, the refill cannot be restored after being pushed out of the barrel, resulting in poor performance. Another example is mechanical processing equipment, which requires a spring to return to its original position. If the spring malfunctions, repair is required. In this case, the performance of the spring directly affects the cost of repair. Therefore, spring selection is crucial, especially for a new mechanical device or a new use environment. Those who select springs are very familiar with the applications of various springs. When standard springs do not meet the application requirements, senior engineers must perform complex spring calculations or modeling to accurately determine the spring type. Consequently, spring selection is difficult in the related art. Consequently, there is an urgent need for a spring selection method that can improve the convenience of spring selection. Summary of the Invention

[0003] The main purpose of the embodiments of the present application is to propose a method, device and storage medium for spring selection, aiming to improve the convenience of spring selection.

[0004] To achieve the above objectives, a first aspect of an embodiment of the present application provides a spring selection method, which is applied to a spring selection system. The spring selection system is provided with a spring parameter input view. The method includes:

[0005] Obtaining the use parameters of the spring to be selected from the spring parameter input view;

[0006] Determining spring selection information based on the spring usage parameters;

[0007] Matching the spring selection information with a preset spring specification table;

[0008] When a matching spring model exists in the spring specification table, the product information corresponding to the matching spring model is output;

[0009] When there is no matching spring model in the spring specification table, the production parameters corresponding to the spring selection information are output.

[0010] To achieve the above-mentioned purpose, the second aspect of an embodiment of the present application proposes an electronic device, which includes a memory and a processor, wherein the memory stores a computer program, and the processor implements the method described in the first aspect when executing the computer program.

[0011] To achieve the above-mentioned purpose, the third aspect of an embodiment of the present application proposes a storage medium, which is a computer-readable storage medium and stores a computer program. When the computer program is executed by a processor, the method described in the first aspect is implemented.

[0012] The spring selection method, device, and storage medium proposed in this application automatically generate spring selection information by inputting the selected spring usage parameters in the spring parameter input view. This allows the user to focus only on the parameters of the spring when it is in use when selecting the spring, simplifying the spring selection process while reducing the professional knowledge required of the spring user. At the same time, after the spring selection information is determined, if there is an existing spring that matches the spring selection information, the product information of the existing spring can be directly output. If there is no existing spring product information, the spring can be determined based on the production parameters corresponding to the spring selection information. Therefore, the embodiments of this application can improve the convenience of spring selection by using spring usage parameters to achieve automatic spring selection. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 1 is a flow chart of a spring selection method provided in an embodiment of the present application;

[0014] Figure 2 1 is a schematic diagram of an embodiment of a method for selecting a spring provided in an embodiment of the present application;

[0015] Figure 3 Schematic diagram of theoretical parameter verification of the spring selection method provided in an embodiment of the present application;

[0016] Figure 4 It is a schematic diagram of product information in the spring selection method provided in an embodiment of the present application;

[0017] Figure 5 Schematic diagram of a spring parameter input view of a spring selection method provided in an embodiment of the present application;

[0018] Figure 6 Schematic diagram of the calculation process of spring selection information in the spring selection method provided in an embodiment of the present application;

[0019] Figure 7 This is a schematic diagram showing an input display of a spring parameter input view in one embodiment of the spring selection method provided in an embodiment of the present application;

[0020] Figure 8 The spring selection method provided in the embodiment of the present application Figure 7 Schematic diagram of the output display interface corresponding to the input shown;

[0021] Figure 9 This is a schematic diagram showing an input display of a spring parameter input view of another embodiment of the spring selection method provided in an embodiment of the present application;

[0022] Figure 10 The spring selection method provided in the embodiment of the present application Figure 9 Schematic diagram of the output display interface corresponding to the input shown;

[0023] Figure 11 This is a schematic diagram of the hardware structure of the electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0025] It should be noted that although the device schematics illustrate functional module divisions and the flowcharts illustrate logical sequences, in certain circumstances, the steps shown or described may be performed in a sequence that differs from the module divisions in the device or the sequence in the flowcharts. The terms "first," "second," and so on, in the specification, claims, and drawings, are used to distinguish similar items and are not necessarily used to describe a specific sequence or precedence.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein are for the purpose of describing the embodiments of this application only and are not intended to limit this application.

[0027] Springs, as a common mechanical component, can be used in a variety of mechanical devices, such as machinery and equipment, ballpoint pens, lighters, and mobile phones. The selection of springs can directly affect the experience of the mechanical device in which they are used. For example, in a ballpoint pen, a spring is used to return the pen core to the pen barrel. If the spring is not selected correctly, the pen core cannot be restored after being pressed out of the pen barrel, resulting in poor performance. Another example is that mechanical processing equipment requires the use of a spring to return to its original position. If the spring is abnormal, it needs to be repaired. In this case, the performance of the spring directly affects the cost of repair. Therefore, how to select a spring is very important, especially when selecting a new mechanical device or a new use environment. It often requires senior engineers to perform complex spring formula calculations or modeling to accurately determine the spring selection, or the person who needs to select the spring must be very familiar with the application of various springs. Therefore, in the related art, the selection of springs is relatively difficult. Therefore, there is an urgent need for a spring selection method that can improve the convenience of spring selection. Based on this, the present application proposes a spring selection method, device, and storage medium to improve the convenience of spring selection.

[0028] The spring selection method, device and storage medium provided in the embodiments of the present application are specifically described through the following embodiments. First, the spring selection method in the embodiments of the present application is described.

[0029] The spring selection method provided in the embodiment of the present application relates to the field of automation equipment technology. The spring selection method provided in the embodiment of the present application can be applied to a terminal, can also be applied to a server side, and can also be software running in a terminal or a server side. In some embodiments, the terminal can be a smart phone, a tablet computer, a laptop computer, a desktop computer, etc.; the server side can be configured as an independent physical server, or can be configured as a server cluster or a distributed system composed of multiple physical servers, or can be configured as a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, CDN, and big data and artificial intelligence platforms; the software can be an application that implements the spring selection method, etc., but is not limited to the above forms.

[0030] The present application can be used in many general or special computer system environments or configurations. For example: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputers, mainframe computers, distributed computing environments including any of the above systems or devices, and the like. The present application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, and the like that perform specific tasks or implement specific abstract data types. The present application can also be practiced in distributed computing environments in which tasks are performed by remote processing devices connected via a communication network. In a distributed computing environment, program modules can be located in local and remote computer storage media, including storage devices.

[0031] Figure 1 This is an optional flow chart of the spring selection method provided in the embodiment of the present application, which is applied to the spring selection system. The spring selection system is provided with a spring parameter input view; Figure 1 As shown, the elastic selection method provided by this application includes:

[0032] Step S100: Obtain the usage parameters of the spring to be selected from the spring parameter input view.

[0033] It should be noted that the spring usage parameters are parameters that can be directly determined by the user, such as the spring diameter, spring material, spring installation height, minimum compression height during use, installation force, and maximum force during use. Therefore, the spring usage parameters can include material parameters and working parameters. The material parameters are used to indicate parameters related to the material of the spring, such as the material and spring diameter; the material is such as stainless steel or carbon steel, and the spring diameter indicates the inner diameter or outer diameter of the spring. The working parameters are used to indicate the height and load of the spring during operation, such as the load installation force and the use force; the height during operation is such as the installation height and the use height. In some embodiments, the material parameters also include wire diameter, which indicates the diameter of the spring coil. The first wire diameter, the second wire diameter, and the third wire diameter mentioned below all indicate wire diameter;

[0034] Step S200: Determine spring selection information based on spring usage parameters.

[0035] It should be noted that the spring parameters include the spring's free height, total number of coils, effective number of coils, wire diameter, theoretical lifespan (i.e., the number of times it can be repeatedly compressed), spring diameter, and material. The choice of spring diameter and material is directly related to the usage environment, while the free height, total number of coils, effective number of coils, and wire diameter are indirectly related to the usage process. The multiple spring parameters corresponding to the spring selection information are all indirectly determined based on the spring usage parameters, thereby ensuring that the spring selected according to the spring selection information matches the usage process and is cost-effective. In some embodiments, the spring selection information includes the free height, total number of coils, effective number of coils, and wire diameter.

[0036] It should be noted that, when the spring usage parameters are determined, the spring selection information can be obtained based on the existing spring calculation formulas. The spring calculation formulas include the spring stiffness calculation formula, the spring free height formula, the spring effective coil calculation formula, the spring total coil calculation formula, the lower stress coefficient calculation formula, and the upper stress calculation formula. For the spring stiffness formula, it is used to characterize the relationship between the spring stiffness and the installation height, installation force, use height, and use force. The spring free height formula is used to characterize the relationship between the free height and the spring installation force, installation height, and spring stiffness. Since other formulas such as the spring effective coil calculation formula, the spring total coil calculation formula, the lower stress coefficient calculation formula, and the upper stress calculation formula can be calculated with reference to existing formulas, they will not be described in detail here.

[0037] Step S300: Match the spring selection information with a preset spring specification table.

[0038] It should be noted that the spring specification table records the various spring parameters of the existing springs. Therefore, a spring can be uniquely determined based on the spring selection information, spring diameter, etc.

[0039] Step S400: When a matching spring model exists in the spring specification table, the product information corresponding to the matching spring model is output.

[0040] It should be noted that, in some embodiments, when a matching spring signal exists, an engineering drawing corresponding to the matching spring model will also be output.

[0041] Step S500: When there is no matching spring model in the spring specification table, output the production parameters corresponding to the spring selection information.

[0042] It should be noted that the production parameters can be used to manufacture springs. Therefore, for some unconventional scenarios, the production parameters for springs can be quickly determined based on steps S100 to S500 in this application, and orders can be placed directly based on these production parameters, thereby shortening the time it takes to obtain the required springs. Furthermore, the entire spring selection process is automatically calculated by a computer, eliminating the need for human intervention, making the selection process faster.

[0043] Therefore, by inputting the selected spring usage parameters in the spring parameter input view, spring selection information is automatically generated. This allows one to focus only on the parameters of the spring when it is in use when selecting a spring, simplifying the spring selection process while reducing the professional knowledge required of the spring user. At the same time, after the spring selection information is determined, if there is an existing spring that matches the spring selection information, the product information of the existing spring can be directly output. If there is no existing spring product information, the spring can be determined based on the production parameters corresponding to the spring selection information. Therefore, the embodiments of the present application can improve the convenience of spring selection by utilizing spring usage parameters to achieve automatic spring selection.

[0044] It should be noted that in some embodiments, after calculating the spring selection information, the spring selection information is verified, and the spring selection information is matched only when the verification passes. In other embodiments, the spring selection system performs multiple calculations until the spring selection information meets the actual use requirements.

[0045] For example, refer to Figure 2 As shown, taking the production parameters as spring drawings as an example, after obtaining the usage parameters from the spring parameter input view, the shear modulus and tensile strength related to the material can be determined. At this point, the spring selection information can be calculated based on the preset spring calculation formula, and the spring selection information is subjected to theoretical parameter verification, where the theoretical parameter verification includes verification of the material allowable stress, verification of the pressed height, verification of the helix angle, and verification of the installation / use force. It should be noted that if the verification fails, the user is prompted to modify the spring material diameter and is given a suggested direction for the change, such as increasing or decreasing. If the verification passes, in some embodiments, product information and spring drawings that match existing springs are output. If no existing spring matching product information exists, the spring drawings are output. In other embodiments, product information that matches existing springs is output. If no existing spring matching product information exists, the spring drawings are output. Therefore, the present application improves the convenience of spring selection by programming the spring selection calculation process and providing a graphical spring parameter input view for easy operation. It can also output product information and spring drawings for different scenarios.

[0046] It is understood that the method further comprises:

[0047] Verify the theoretical parameters of spring selection information.

[0048] It should be noted that theoretical parameter verification is used to verify whether the spring selected meets the required operating parameters. During the calculation process within the spring selection system, the operating parameters and material parameters affect each other, and both material parameters and operating parameters are manually input. Therefore, during the actual calculation process, the spring selection information calculated based on the operating and material parameters may not meet the actual requirements. Therefore, the calculated spring selection information needs to be verified.

[0049] It should be noted that in some embodiments, when the theoretical parameter verification passes, the spring selection information is matched with a preset spring specification table. In other embodiments, when no matching spring model exists, the spring selection information is subjected to a theoretical parameter verification, and when the theoretical parameter verification passes, the corresponding operating parameters are output.

[0050] It should be noted that, in some embodiments, since the use environment has requirements on the material, and the use has requirements on the configuration load, installation height, and use height, and the installation space has requirements on the spring diameter (outer diameter or inner diameter), therefore, in actual applications, the wire diameter of the spring is often changed when the above conditions are met. Therefore, in some embodiments, when the wire diameter of the spring is one of the spring usage parameters, the suggestion to change the material diameter will be fed back as an error message.

[0051] It is understood that the spring usage parameters include material parameters, configuration load parameters, installation height, usage height and spring diameter; the theoretical parameter verification of the spring selection information includes:

[0052] Calculate the service stress, maximum compression spring clearance, helix angle and expected load parameters based on the selected spring information;

[0053] Perform stress verification based on the service stress and the allowable stress corresponding to the material parameters; the service stress is determined by configuring the load parameters;

[0054] Check the spring clearance according to the maximum compression spring clearance;

[0055] Perform helix angle calibration based on the helix angle;

[0056] Perform load verification based on expected load parameters and configured load parameters.

[0057] It should be noted that allowable stress is also called "permissible stress." In engineering design, it represents the maximum stress a component, part, or its connector can withstand during operation or operation. It is determined by dividing the material's mechanical properties by the corresponding material design factor.

[0058] It should be noted that spring clearance verification, stress verification and helix angle verification are all used to verify whether the spring corresponding to the spring selection information meets the use requirements during use.

[0059] It should be noted that the service stress is the maximum stress generated during actual use of the spring. The allowable stress of the spring is mainly related to the tensile strength and material type of the material. The service stress of the spring is mainly related to the spring force (that is, the maximum load configured). If the allowable stress is less than the service stress, the stress verification fails. When the allowable stress is greater than or equal to the service stress, the stress verification succeeds.

[0060] It should be noted that spring clearance verification is used to check whether the maximum compressed spring clearance is within the preset clearance range when the maximum solid height is met. Excessive coils in a spring will affect the solid height of the spring. For example, if the spring coils are tightened (compressed tightly), the solid height is greater than 20mm (i.e., the solid height is greater than 20mm), but the spring needs to be compressed to 20mm for actual use. In this case, the solid height is problematic. Therefore, a solid height verification is required. It should be noted that the clearance is the gap between adjacent spring coils after the spring reaches the maximum solid height. The preset clearance range is the clearance that should be retained after the spring reaches the maximum solid height to ensure normal operation.

[0061] It should be noted that the helix angle is calculated based on the spring's free height, outer diameter, and total number of turns. Helix angle verification verifies that the helix angle is within the preset range. However, if the helix angle is too large, the spring may shorten after compression; therefore, helix angle verification is necessary.

[0062] It should be noted that the load check is used to verify whether the expected load parameters corresponding to the spring selection information meet the requirements of the configured load, for example, whether the maximum load supported by the expected load parameters is greater than the maximum load in the configured load.

[0063] For example, refer to Figure 3 As shown in the figure, when the theoretical parameters are checked, stress check, spring clearance check, helical angle check and load check are performed respectively. If one of the stress check, spring clearance check, helical angle check and load check fails, an error message will be fed back.

[0064] It is understandable that when the theoretical parameter verification fails, the method further includes:

[0065] Determine the corresponding check items when theoretical parameter check fails;

[0066] Determining a change suggestion information for the first wire diameter based on the verification result of the theoretical parameter verification; wherein the first wire diameter is one of the spring usage parameters;

[0067] Based on the check items and suggested changes, identify the error information and provide feedback.

[0068] For example, refer to Figure 3 As shown, when the spring clearance is calibrated and the combined height does not meet the requirements, a feedback indicating that the combined height does not meet the requirements is provided, and based on the combined height, the first wire diameter is re-determined to be increased or decreased. In some embodiments, a range of changes in the first wire diameter is provided, and this application does not limit the change suggestion information.

[0069] It is understood that the production parameters are generated through the following steps:

[0070] According to the spring selection information, the parameters of the standard spring drawing are changed in the preset drawing area to obtain the engineering drawing corresponding to the spring selection information;

[0071] Export engineering drawings as production parameters.

[0072] It should be noted that making changes based on the standard spring drawing can improve drawing efficiency. At the same time, the efficiency of spring selection can be further improved by automatically calling the drawing interface to draw engineering drawings through the system.

[0073] It is understood that in step S400, the product information corresponding to the matched spring model is output, including at least one of the following:

[0074] Output the product model corresponding to the matching spring model;

[0075] Output the application scenario corresponding to the matching spring model;

[0076] The method also includes:

[0077] Output the inquiry link corresponding to the matching spring model.

[0078] It should be noted that the application scenario is output so that the selection operator can further determine whether the requirements are met based on the application scenario.

[0079] It should be noted that, in some embodiments, the type corresponding to the spring model will also be output. Figure 4 As shown, the information corresponding to the matching spring signals is product signal: "YFUR-D10-L40-B"; category name: "Outer diameter reference type compression spring"; type: "circular coil spring"; application scenario: "recessed table, sleeve scenario, use outer diameter fixation"; function: "rust-proof".

[0080] It should be noted that by setting up an inquiry link, procurement and selection can be integrated to further improve the convenience of use.

[0081] It is understandable that referring to Figure 5 As shown, before step S100, the method further includes:

[0082] In the spring parameter input view, several input items corresponding to the used spring parameters are displayed;

[0083] In the view for inputting spring parameters, several schematic diagrams of the spring are displayed and each input item is labeled in the schematic diagrams of the spring.

[0084] For example, refer to Figure 5 As shown in the figure, the left side of the spring parameter input view displays multiple spring schematics, and the right side of the view displays input items. The items marked with * are required, and the others are optional.

[0085] It is understood that the spring usage parameters include material parameters, configuration load parameters, installation height, usage height, spring diameter and first wire diameter; Figure 6 As shown, step S200, determining spring selection information according to spring usage parameters, includes:

[0086] Determine the spring stiffness and free height based on the configured load parameters, installation height and use height;

[0087] determining a second wire diameter based on material parameters, the first wire diameter, and the spring stiffness;

[0088] Determine the third wire diameter, shear modulus and tensile strength based on the material parameters and the second wire diameter;

[0089] Determine the effective number of turns and the total number of turns based on the third wire diameter, shear modulus and tensile strength;

[0090] Determine the stress parameters based on the configured load parameters, third wire diameter and spring diameter;

[0091] Determine the spring selection information based on the third wire diameter, free height, number of effective coils, total number of coils and stress parameters.

[0092] It should be noted that the configuration load parameters include the installation force and the use force. Therefore, the spring stiffness can be calculated based on the existing spring formula. It should be noted that the free height and the installation height, the installation force and the spring stiffness have a unique definite relationship. Therefore, the free height can be calculated based on the free height and the installation height, the installation force and the spring stiffness.

[0093] It should be noted that the first wire diameter is used as a reference quantity, and the expected effective number of turns corresponding to the first wire diameter can be determined based on the first wire diameter, spring diameter and spring stiffness; different end face forms (end face forms include polished and unpolished) and materials will affect the wire diameter, such as the material will affect the shear modulus; at this time, the second wire diameter can be determined based on the end face form, material parameters, expected effective number of turns and end face form; among them, when the shear modulus corresponding to different wire diameters of the same material is different, a standard value can be pre-set for each material to determine the second wire diameter.

[0094] It should be noted that since the wire diameter, configuration load parameters, installation height and use height are all manually input values, in some embodiments, the second wire diameter and the preset material specification table will be selected from the material specification table according to the preset selection rules. A third wire diameter close to the second wire diameter may be selected. The selection rule may be one level smaller than the second wire diameter. Specifically, for example, the wire diameters in the material specification table include d1>d2>d3. When the second wire diameter is between d1 and d2, d3, which is one level smaller, is selected as the third wire diameter.

[0095] It should be noted that when the third wire diameter is determined, the shear modulus and tensile strength corresponding to the third wire diameter can be determined respectively according to the preset shear modulus table and tensile strength table. At this time, the effective number of turns can be determined based on the shear modulus, spring diameter and spring stiffness corresponding to the third wire diameter, and thus the total number of turns can be determined based on the effective number of turns.

[0096] It should be noted that the stress parameters are determined based on the lower and upper stress coefficients, which are used to determine the theoretical service life within the working range. In this case, the lower stress coefficient has a unique relationship with the spring diameter, the third wire diameter, the installation force, and the tensile strength, while the upper stress coefficient has a unique relationship with the spring diameter, the operating force, the third wire diameter, and the tensile strength. After determining the lower and upper stress coefficients, the lower and upper stress coefficients can be compared with a preset fatigue limit table for compression springs to determine the theoretical service life within the working range. Therefore, the stress parameters can be determined based on the configured load parameters, the third wire diameter, and the spring diameter.

[0097] For example, refer to Figure 6As shown, according to the preset spring stiffness calculation formula, the spring stiffness F' can be determined based on the installation force F1, installation height H1, operating height H2, and operating force F2. In this case, the free height can be determined based on the spring stiffness F'. When the spring usage parameters include a first wire diameter, the first wire diameter serves as the reference shear modulus corresponding to the desired wire diameter and material, along with the spring stiffness and spring diameter, to determine the expected number of effective turns. When the spring usage parameters include an end face form, the second wire diameter can be determined based on whether the end face form is ground or unground. When the spring usage parameters do not include an end face form, the second wire diameter can be calculated for both ground and unground conditions. After determining the second wire diameter, the available third wire diameter is determined based on the material specification table, and the shear modulus and tensile strength are determined based on the third wire diameter and material. After determining the shear modulus, the effective number of turns is calculated based on the third wire diameter, spring diameter, shear modulus, and spring stiffness F, and the total number of turns is calculated based on the effective number of turns. After determining the tensile strength, the lower limit stress coefficient is determined based on the tensile strength, installation force F1, spring diameter, and third wire diameter. The upper limit stress coefficient is determined based on the tensile strength, operating force F2, spring diameter, and third wire diameter. The upper limit stress coefficient and the upper limit stress coefficient are then compared with the preset spring fatigue limit table to determine the stress parameters. It should be noted that if the spring operating parameters do not include the first wire diameter, the first wire diameter can be selected from a preset wire diameter range. This allows for multiple calculation cycles to output the available spring selection parameters.

[0098] Below Figure 5 The diagram below shows the input interface, which shows the output when the spring parameters do not correspond to a spring model and when they correspond to a spring model.

[0099] For example, refer to Figure 7 As shown, the spring parameters are set as follows: Material name is "stainless steel wire", Material grade is "SUS304", Type is "outer diameter", Outer diameter D2 is "12" mm, Wire diameter (preselected) d ’ The spring height is 1 mm, the installation height H1 is 40 mm, the use height H2 is 35 mm, the installation force F1 is 4 N, the use force F2 is 7 N, and the end face form is "Both ends are tightened and ground flat". At this time, select "Select product immediately". If the calculated spring model does not exist in the database, the following will be displayed: Figure 8 The diagram shown will display the spring's production parameters (as shown on the right side of the diagram), as well as the input spring's usage parameters and theoretical life. It also indicates that the model is non-standard and provides a link to download the drawing.

[0100] For example, refer to Figure 9As shown, the spring parameters are set as follows: Material name is "stainless steel wire", Material grade is "SUS304", Type is "outer diameter", Outer diameter D2 is "12" mm, Wire diameter (preselected) d ’ The value is "1" mm, the installation height H1 is "40" mm, the use height H2 is "35" mm, the installation force F1 is "5" N, the use force F2 is "10" N, and the end face form is "Both ends are tightened and ground flat". At this time, select "Select product immediately". If the calculated spring model exists in the database, the following will be displayed: Figure 10 The diagram shown will display the production parameters of the spring (such as the spring diagram on the right side of the diagram) as well as the spring usage parameters and theoretical life of the spring input. At the same time, the product model information such as Figure 10 The product models are shown in the table.

[0101] See also Figure 11 , Figure 11 The hardware structure of an electronic device according to another embodiment is shown. The electronic device includes:

[0102] The processor 601 may be implemented as a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application.

[0103] The memory 602 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 602 can store an operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program codes are stored in the memory 602 and are called by the processor 601 to execute the spring selection method of the embodiments of this application.

[0104] Input / output interface 603, used to implement information input and output;

[0105] Communication interface 604, used to implement communication interaction between this device and other devices, which can be achieved through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WiFi, Bluetooth, etc.);

[0106] Bus 605 , which transmits information between various components of the device (e.g., processor 601 , memory 602 , input / output interface 603 , and communication interface 604 );

[0107] The processor 601 , the memory 602 , the input / output interface 603 and the communication interface 604 are connected to each other in communication within the device via a bus 605 .

[0108] An embodiment of the present application further provides a storage medium, which is a computer-readable storage medium and stores a computer program. When the computer program is executed by a processor, the above-mentioned spring selection method is implemented.

[0109] The memory, as a non-transient computer-readable storage medium, can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0110] The embodiments described in the embodiments of this application are intended to more clearly illustrate the technical solutions of the embodiments of this application and do not constitute a limitation on the technical solutions provided by the embodiments of this application. Those skilled in the art will appreciate that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

[0111] Those skilled in the art will understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than shown in the figures, or a combination of certain steps, or different steps.

[0112] Those skilled in the art will appreciate that all or some of the steps in the methods, systems, and functional modules / units in the devices disclosed above may be implemented as software, firmware, hardware, or appropriate combinations thereof.

[0113] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0114] It should be understood that in this application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0115] The technical solution of this application, or the portion that contributes to the prior art, or all or part of the technical solution, may be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions for causing a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of various embodiments of this application. The aforementioned storage medium includes various media capable of storing programs, such as a USB flash drive, a mobile hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0116] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but are not intended to limit the scope of the present invention. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and essence of the present invention should be within the scope of the present invention.

Claims

1. A method for selecting a spring, characterized in that: Applied to a spring selection system, the spring selection system is provided with a spring parameter input view, the method comprising: Obtaining the use parameters of the spring to be selected from the spring parameter input view; Determining spring selection information based on the spring usage parameters; Matching the spring selection information with a preset spring specification table; When a matching spring model exists in the spring specification table, the product information corresponding to the matching spring model is output; When there is no matching spring model in the spring specification table, outputting production parameters corresponding to the spring selection information; The spring usage parameters include material parameters, configuration load parameters, installation height, usage height, spring diameter, and first wire diameter; determining the spring selection information based on the spring usage parameters includes: determining a spring stiffness and a free height according to the configuration load parameter, the installation height, and the use height; determining a second wire diameter according to the material parameters, the first wire diameter, and the spring stiffness; Determining a third wire diameter, shear modulus, and tensile strength based on the material parameters and the second wire diameter; Determining an effective number of turns and a total number of turns according to the third wire diameter, the shear modulus, and the tensile strength; determining a stress parameter based on the configured load parameter, the third wire diameter, and the spring diameter; The spring selection information is determined according to the third wire diameter, the free height, the effective number of turns, the total number of turns, and the stress parameter.

2. The spring selection method according to claim 1, characterized in that: The method further comprises: Perform theoretical parameter verification on the spring selection information.

3. The method for selecting a spring according to claim 2, wherein: The spring usage parameters include material parameters, configuration load parameters, installation height, usage height and spring diameter; the theoretical parameter verification of the spring selection information includes: Calculate the service stress, maximum compression spring clearance, helix angle and expected load parameters based on the spring selection information; Performing stress verification according to the service stress and the allowable stress corresponding to the material parameters; wherein the service stress is determined by the configured load parameters; Performing spring clearance calibration based on the maximum compression spring clearance; Performing helix angle calibration according to the helix angle; Load verification is performed based on the expected load parameters and the configured load parameters.

4. The method for selecting a spring according to claim 3, wherein: The method further comprises: When the theoretical parameter verification fails, determining a verification item corresponding to the theoretical parameter verification failure; Determining, based on a verification result of the theoretical parameter verification, information suggesting a change in the first wire diameter when the theoretical parameter verification fails; wherein the first wire diameter is one of the spring usage parameters; According to the verification items and the change suggestion information, the error information is determined and fed back.

5. The method for selecting a spring according to claim 1, wherein: The production parameters are generated by the following steps: According to the spring selection information, parameters of the standard spring drawing are modified in a preset drawing area to obtain an engineering drawing corresponding to the spring selection information; The engineering drawing is output as the production parameter.

6. The method for selecting a spring according to claim 1, wherein: The output of the product information corresponding to the matching spring model includes at least one of the following: Output the product model corresponding to the matching spring model; Output the application scenario corresponding to the matching spring model; The method further comprises: Output the inquiry link corresponding to the matching spring model.

7. The method for selecting a spring according to claim 1, wherein: Before obtaining the usage parameters of the spring to be selected, the method further includes: Displaying a plurality of input items corresponding to the spring usage parameters in the spring parameter input view; A plurality of spring schematic diagrams are displayed in the spring parameter input view, and each of the input items is marked in the plurality of spring schematic diagrams.

8. An electronic device, characterized in that: The electronic device includes a memory and a processor, the memory stores a computer program, and the processor implements the spring selection method according to any one of claims 1 to 7 when executing the computer program.

9. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method for selecting a spring according to any one of claims 1 to 7 is implemented.

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