Display substrate and manufacturing method, display panel and device

Abstract

The present invention relates to a display substrate and its preparation method, display panel and device. The preparation method of the display substrate includes: step S1, applying conductive glue to multiple transfer surfaces on a fixture; the multiple transfer surfaces on the fixture are connected in sequence, and the multiple transfer surfaces have linear protrusions; step S2, correspondingly engaging the fixture with the display substrate so that the multiple transfer surfaces are respectively correspondingly attached to the multiple target surfaces on the display substrate; the multiple target surfaces of the display substrate include the surfaces of the display substrate where the first device and the second device to be connected are located, and the connection surfaces where the surface where the first device is located and the surface where the second device is located are connected; step S3, curing the conductive glue to form conductive lines connecting the first device and the second device on the multiple target surfaces. The above-mentioned preparation method of the display substrate can achieve good electrical connection between the first device and the second device on different target surfaces of the display substrate.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display substrate and a preparation method thereof, a display panel and a device thereof. Background Art

[0002] A display panel typically consists of a display area and a frame area. The display area has multiple pixels for displaying images, while the frame area houses structures such as driver ICs, which are essential for displaying images in the display area. The driver ICs and other structures located in the frame area inevitably occupy a certain area, which limits the further reduction of the frame width.

[0003] In some new display products, driver ICs and other components are placed on the back or sides of the display panel. This effectively eliminates the driver ICs and other components from the front of the display panel, further reducing the width of the bezel and helping to achieve a narrow or no bezel. Such display products can not only function as standalone narrow-bezel or no-bezel displays, but can also be combined to create a spliced ​​display product with a larger display area.

[0004] However, for this type of product, how to achieve good connection between various structures in the display area on the front of the display panel (such as pixel arrays, gate lines, signal lines, etc.) and the driver IC on the back of the display panel is a problem that must be solved. Summary of the Invention

[0005] The present invention provides a display substrate and a method for preparing the same, a display panel and a device, to solve the technical problem in the prior art that good electrical connection cannot be achieved between devices such as driver ICs and pixel arrays on different surfaces of the display substrate.

[0006] The present invention provides a method for preparing a display substrate, which comprises:

[0007] Step S1, applying conductive adhesive to a plurality of transfer surfaces on a fixture; the plurality of transfer surfaces on the fixture are sequentially connected, and the plurality of transfer surfaces have linear protrusions;

[0008] Step S2: engaging the fixture with the display substrate so that the plurality of transfer surfaces are respectively attached to a plurality of target surfaces on the display substrate; the plurality of target surfaces of the display substrate include a surface on the display substrate where the first device and the second device to be connected are located, and a connection surface where the surface where the first device is located is connected to the surface where the second device is located;

[0009] Step S3 , curing the conductive adhesive to form conductive lines connecting the first device and the second device on the plurality of target surfaces.

[0010] Wherein, the first device includes a pixel array of the display substrate, and the second device includes a driver IC of the display substrate;

[0011] In step S2 , a plurality of transfer surfaces are respectively attached to the surface of the display substrate where the pixel array is located and the surface where the driver IC is located.

[0012] The surface where the first device is located is the front surface of the display substrate, and the second device is arranged on the back surface of the display substrate; the clamp has a U-shaped groove, and the multiple transfer surfaces of the clamp include a first transfer surface, a second transfer surface, and a third transfer surface, the first transfer surface and the third transfer surface are two opposite side walls of the U-shaped groove, and the second transfer surface is the bottom surface of the U-shaped groove;

[0013] In step S2, the groove of the clamp is clamped on the side of the display substrate, so that the first transfer surface and the third transfer surface of the groove are respectively aligned with the front and back sides of the display substrate, and the bottom surface of the groove is aligned with the side surface of the display substrate in the thickness direction.

[0014] In step S1 , a glue coating rod having multiple glue coating surfaces is used to coat conductive glue onto multiple transfer surfaces of the fixture; the multiple glue coating surfaces of the glue coating rod correspond one-to-one to the multiple transfer surfaces of the fixture.

[0015] The display substrate provided by the present invention has a pixel array and a conductive line. The pixel array is arranged on the front side of the display substrate, and the conductive line extends from the front side of the display substrate to the back side or side of the display substrate. The conductive line is connected to the pixel array on the front side of the display substrate and is used to connect to the driver IC on the back side or side of the display substrate.

[0016] Wherein, the conductive lines are provided on one or more sides of the display substrate.

[0017] The pixel array includes multiple lines, each of which is connected to the conductive lines. The conductive lines of the odd-numbered lines are arranged on one side of the display substrate, and the conductive lines of the even-numbered lines are arranged on the opposite side of the display substrate.

[0018] The clamp provided by the present invention has a plurality of transfer surfaces, which are connected in sequence and have linear protrusions.

[0019] In which, the clamp has a U-shaped groove shape, and the multiple transfer surfaces of the clamp include a first transfer surface, a second transfer surface and a third transfer surface, the first transfer surface and the third transfer surface are two opposite side walls of the groove, and the second transfer surface is the bottom surface of the groove; or, the clamp has a V-shaped groove shape, and the multiple transfer surfaces of the clamp include a first transfer surface and a second transfer surface, and the first transfer surface and the second transfer surface are two connected side walls of the V-shaped groove.

[0020] Among the multiple transfer surfaces of the clamp, at least one transfer surface can be rotated to change the angle between the transfer surface and the adjacent transfer surface.

[0021] The present invention provides a method for preparing a clamp, which comprises:

[0022] The transfer surface of the jig is etched to form linear protrusions.

[0023] The display panel provided by the present invention includes the above-mentioned display substrate; the display panel is any one of a liquid crystal display panel, an OLED display panel, a Mini LED display panel, and a Micro LED display panel.

[0024] The display device provided by the present invention includes multiple display panels, which can be spliced ​​in sequence along a first direction and / or a second direction, where the first direction and the second direction are respectively the length direction and the width direction of the display panel; the display panel adopts the above-mentioned display panel.

[0025] Wherein, the interface between two display panels adjacent to each other along the first direction or the second direction has no conductive wires, or has conductive wires of one of the display panels, or has conductive wires of both display panels;

[0026] In the interface having conductive lines of two display panels, the conductive lines of the two display panels are staggered; or, the conductive lines of the two display panels are positioned corresponding to each other, and an insulating layer is provided between the conductive lines of the two display panels to separate them.

[0027] The display substrate and its preparation method, display panel and device provided by the present invention have the following advantages over the prior art:

[0028] The present invention provides a method for preparing a display substrate. This method involves applying a conductive adhesive to multiple transfer surfaces of a fixture, transferring the conductive adhesive to multiple target surfaces of the display substrate, and curing the adhesive to form conductive lines that span the multiple target surfaces, connecting a first device and a second device located on different surfaces. This method thereby achieves electrical connection between devices located on different surfaces of the display substrate. This solution can be used to connect a pixel array on the front of a display substrate with structures such as a driver IC on the back or side. In this case, when the driver IC is located on the back or side of the display substrate, a good electrical connection between the pixel array and the driver IC can be achieved.

[0029] The display substrate provided by the present invention is prepared according to the above-mentioned method for preparing the display substrate, and has the same beneficial effects as the above-mentioned method for preparing the display substrate, which will not be described in detail.

[0030] The display panel and the display device provided by the present invention include the above-mentioned display substrate, and naturally have the same beneficial effects as the above-mentioned display substrate, which will not be described in detail. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0033] Figure 1 is a flow chart of a method for preparing a display substrate in an embodiment of the present invention;

[0034] Figure 2 Schematic diagram of the three-dimensional structure of the transfer rod and the clamp;

[0035] Figure 3 It is a schematic diagram of the structure of the transfer rod and the clamp in the side view direction;

[0036] Figure 4 It is a structural diagram of the fixture and display substrate;

[0037] Figure 5 is a structural diagram of the fixture;

[0038] Figure 6 A schematic diagram of the arrangement of conductive lines between adjacent display panels in a display device;

[0039] Figure 7A schematic diagram of a staggered arrangement of conductive lines of adjacent display panels;

[0040] Figure 8 is a schematic diagram of another staggered arrangement of conductive lines in adjacent display panels;

[0041] Figure 9 A schematic diagram showing the connection between the traces and conductive lines connecting the pixel array in the display substrate.

[0042] In the picture:

[0043] 10-glue stick; 100-glue surface;

[0044] 20-clamp; 200-transfer surface; 200a-first transfer surface; 200b-second transfer surface; 200c-third transfer surface; 201-linear protrusion;

[0045] 30 - display substrate; 300 - target surface; 300a - first target surface; 300b - second target surface; 300c - third target surface. DETAILED DESCRIPTION

[0046] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0047] Embodiments of the display substrate, the manufacturing method thereof, the display panel, and the device provided by the present invention are described below with reference to the accompanying drawings.

[0048] In one embodiment of the method for preparing a display substrate, Figure 1 As shown, the method for preparing the display substrate includes the following steps S1 to S3.

[0049] Step S1 : Applying conductive adhesive to the multiple transfer surfaces 200 on the fixture 20 .

[0050] The jig 20 used in step S1 is as follows: Figure 2 、 Figure 3 and Figure 5 As shown, it has multiple transfer surfaces 200, and the multiple transfer surfaces 200 are connected in sequence. The multiple transfer surfaces 200 have linear protrusions 201 (see Figure 5, for illustration only; omitted in other figures), the linear protrusions 201 on the transfer surface 200 are sequentially connected (it can be understood that the linear protrusions 201 on the transfer surface 200 form multiple lines). In addition, the linear protrusions 201 on the transfer surface 200 have a high degree of fineness. These high-fineness linear protrusions 201 can be achieved by etching the transfer surface 200 of the fixture 20.

[0051] In step S1, the conductive glue can specifically be Ag glue. A glue coating tool, such as a glue coating rod 10, can be used to apply the conductive glue to the transfer surface 200 of the fixture 20. The glue coating rod 10 can have multiple glue coating surfaces 100, and the multiple glue coating surfaces 100 correspond one to one to the multiple transfer surfaces on the fixture 20. In this way, when applying glue, the conductive glue can be applied to the multiple transfer surfaces 200 of the fixture 20 respectively by using the glue coating rod 10 with multiple glue coating surfaces 100, that is, the glue coating of the multiple transfer surfaces 200 of the fixture 20 can be completed at one time. Of course, in addition to the above-mentioned glue coating method, it is also possible to apply glue multiple times, each time applying glue to each transfer surface 200.

[0052] Step S2: engage the fixture 20 with the display substrate 30 so that the multiple transfer surfaces 200 are respectively attached to the multiple target surfaces on the display substrate 30. Figure 4 shown.

[0053] The display substrate 30 used in step S2 has a plurality of target surfaces, and the plurality of target surfaces include the surface on the display substrate where the first device and the second device to be connected are located, and the connection surface connecting the surface where the first device is located and the surface where the second device is located. Generally, the first device may include a pixel array, gate lines, data lines, etc. of the display substrate, and the second device may include a driver IC, etc. of the display substrate. It should be noted that the surface where the second device is located here should be understood in a broad sense, and it should not be understood as a driver IC, etc. being provided on the surface. It may be that only a conductive line connected to the driver IC is provided on the surface where the second device is located (applicable to splicing display products). For splicing display products, it may have only one total driver IC, which is respectively connected to the surface where the second device of each display panel as an independent splicing unit is located, and then connected to the pixel array on the surface where the first device is located.

[0054] When the above-mentioned first device is arranged on the front side of the display substrate 30 and the above-mentioned second device is arranged on the back side of the display substrate 30, the display substrate has three target surfaces 300, namely the first target surface 300a, the second target surface 300b and the third target surface 300c. The first target surface 300a is the front side of the display substrate 30, the third target surface 300c is the back side of the display substrate 30, and the second target surface 300b is a side surface of the display substrate 30, which connects the front and back sides of the display substrate 30. Correspondingly, the clamp 20 can have a U-shaped groove shape, which corresponds to the edge portion of the display substrate (the edge portion of the display substrate can be regarded as a protrusion or insertion portion matching the U-shaped groove), so that three transfer surfaces 200 can be set in the U-shaped groove, namely the first transfer surface 200a, the second transfer surface 200b and the third transfer surface 200c. The first transfer surface 200a and the third transfer surface 200c can be two opposite side walls of the U-shaped groove, and the second transfer surface 200b can be the bottom surface of the U-shaped groove; the above-mentioned three transfer surfaces 200 can respectively correspond to the above-mentioned three target surfaces 300. In this case, in step S2, the multiple transfer surfaces 200 (the first transfer surface 200a, the second transfer surface 200b, and the third transfer surface 200c) are respectively aligned with the pixel array surface (the first target surface 300a), the driver IC surface (the third target surface 300c), and the connection surface (the second target surface 300b) between the two of the display substrate 30. During the specific alignment process, the U-shaped groove of the fixture 20 is engaged with the side of the display substrate 30, so that the first transfer surface 200a and the third transfer surface 200c of the U-shaped groove are aligned with the front and back surfaces of the display substrate, and the bottom surface of the U-shaped groove is aligned with the side surface of the display substrate 30 in the thickness direction.

[0055] In the case where the first device is disposed on the front surface of the display substrate 30 and the second device is disposed on a side surface of the display substrate 30, the display substrate has two target surfaces 300, namely, a first target surface 300a and a second target surface 300b. The first target surface 300a is the front surface of the display substrate 30, and the second target surface 300b is the side surface of the display substrate 30 (the side surface where the second device is located). Accordingly, the fixture 20 may have a V-shaped groove, which corresponds to the upper edge of the edge of the display substrate (the junction of the front and side surfaces of the display substrate). In this way, two transfer surfaces 200, namely, a first transfer surface 200a and a second transfer surface 200b, may be disposed within the V-shaped groove. The first transfer surface 200a and the second transfer surface 200b may be the two sidewall surfaces of the V-shaped groove, respectively. The two transfer surfaces 200 correspond to the two target surfaces 300, respectively. In this case, in step S2, the multiple transfer surfaces 200 (the first transfer surface 200a and the second transfer surface 200b) are aligned with the pixel array surface (the first target surface 300a) and the driver IC surface (the second target surface 300b) of the display substrate 30. During the specific alignment process, the V-shaped groove of the fixture 20 is engaged with the upper edge of the side of the display substrate 30, so that the first transfer surface 200a and the second transfer surface 200b of the V-shaped groove are aligned with the front and side surfaces of the display substrate 30, respectively.

[0056] When the transfer surface 200 on the jig 20 and the corresponding target surface 300 on the display substrate 30 are bonded together, the linear protrusions on the transfer surface 200 come into contact with the target surface 300. The conductive adhesive has both viscosity and fluidity, so the conductive adhesive on the transfer surface 200 (particularly the conductive adhesive on the linear protrusions) is transferred to the target surface 300, resulting in conductive adhesive adhering to the target surface 300. Furthermore, because the linear protrusions on the transfer surface 200 are continuous, the conductive adhesive adhering to the corresponding target surface 300 also appears as a continuous line.

[0057] Step S3 , curing the conductive adhesive to form conductive lines connecting the first device and the second device on the plurality of target surfaces 300 .

[0058] In step S3 , the conductive adhesive may be accelerated to cure by irradiating it with ultraviolet light (UV), or other methods may be used to accelerate the curing of the conductive adhesive, or the conductive adhesive may be allowed to cure naturally.

[0059] After curing, the conductive adhesive completes the attachment and curing molding on the target surface 300, and the conductive line connection spans multiple target surfaces 300 to connect the first device and the second device, which can play the role of power supply, signal transmission, etc. between the first device and the second device.

[0060] In the method for preparing a display substrate according to an embodiment of the present invention, conductive adhesive is applied to multiple transfer surfaces 200 of a fixture 20, and then transferred and cured onto multiple target surfaces 300 of a display substrate 30 to form conductive lines that connect a first device and a second device located on different surfaces across the multiple target surfaces 300, thereby achieving electrical connection between devices located on different surfaces of the display substrate. This solution can be used to connect a pixel array on the front of a display substrate with a structure such as a driver IC on the back or side. In this case, when the driver IC is located on the back or side of the display substrate, a good electrical connection between the pixel array and the driver IC can be achieved.

[0061] The present invention also provides a display substrate comprising a pixel array and conductive lines. The pixel array is disposed on the front surface of the display substrate, and the conductive lines extend from the front surface of the display substrate to the back surface or side surface of the display substrate. The conductive lines are connected to the pixel array on the front surface of the display substrate and are connected to a driver IC on the back surface or side surface of the display substrate. In essence, the display substrate is manufactured using the display substrate manufacturing method described in the above embodiment.

[0062] In this embodiment, the signal lines connected to the pixel array of the display substrate can be fanned out from one side of the display substrate, or can be fanned out from both sides or more sides of the display substrate. Correspondingly, conductive lines are formed on one side, both sides or more sides of the display substrate. Taking fanning out from the left and right sides of the display substrate as an example, Figure 8 As shown, conductive lines also need to be formed on the left and right sides of the display substrate (C2 and D2 in the figure represent the display substrate, and the small rectangles on the left and right sides represent the conductive lines). The conductive lines on the left and right sides respectively serve to connect the pixel array and the driver IC.

[0063] Specifically, the pixel array of the display substrate includes multiple lines, which can be scan lines or data lines; the multiple lines are respectively connected to the conductive lines, and the conductive lines of the odd-numbered lines are arranged on one side of the display substrate, and the conductive lines of the even-numbered lines are arranged on the opposite side of the display substrate. Figure 9 In the example structure shown, the traces connecting the first, third, and fifth pixel rows connect to the conductive line on the right side of the display substrate, while the traces connecting the second and fourth pixel rows connect to the conductive line on the left side of the display substrate. If these traces are scan lines, the operation of each of the multiple pixel rows can be independently controlled. For example, only the pixels in the odd-numbered rows can be turned on, while the pixels in the even-numbered rows are continuously turned off.

[0064] In this embodiment, the display substrate naturally has the same beneficial effects as the above-mentioned method for preparing the display substrate, which will not be described in detail.

[0065] The present invention further provides a clamp, which can be used in the method for preparing a display substrate described in the above embodiment to transfer a conductive adhesive onto a target surface 300 of the display substrate 30 .

[0066] In one embodiment of the clamp of the present invention, the clamp 20 has a plurality of transfer surfaces 200 . The plurality of transfer surfaces 200 are connected to each other in sequence, and each of the plurality of transfer surfaces 200 has linear protrusions.

[0067] In this embodiment, when the multiple transfer surfaces 200 of the clamp 20 are attached to the corresponding multiple target surfaces 300 on the display substrate 30, the conductive glue at the linear protrusions on the transfer surface 200 will flow and adhere to the target surface 300 to form a continuous, linear conductive glue. The conductive glue line spans the multiple target surfaces of the display substrate 30, connecting the first device and the second device on the display substrate 30. After the conductive glue is cured, the conductive glue line becomes a conductive line connecting the first device and the second device, which can transmit electrical energy or signals between the first device and the second device.

[0068] In one embodiment of the fixture, the fixture 20 has a U-shaped groove. The multiple transfer surfaces 200 of the fixture 20 include a first transfer surface 200a, a second transfer surface 200b, and a third transfer surface 200c. The first transfer surface 200a and the third transfer surface 200c are two opposing sidewalls of the U-shaped groove, and the second transfer surface 200b is the bottom surface of the U-shaped groove. Specifically, the fixture 20 has a U-shaped groove. The fixture 20 may be formed as a U-shaped member as a whole, or the U-shaped groove may be formed in a local area or on a surface of the fixture 20.

[0069] In this embodiment, the U-shaped groove on the fixture 20 can be snapped into place with the side edge of the display substrate 30, so that the upper edge (where the front and side edges of the display substrate meet) and the lower edge (where the back and side edges of the display substrate meet) of the side edge of the display substrate 30 are both inserted into the U-shaped groove. After snapping in place, the first transfer surface 200a and the third transfer surface 200c can respectively connect with the front and back edges of the display substrate 30, while the second transfer surface 200b can connect with the side edge of the display substrate 30. The first and second components, respectively disposed on the front and back edges of the display substrate 30, can be connected by conductive lines formed by transferring and curing conductive adhesive. This is particularly useful in products where a driver IC, etc., is disposed on the back edge of the display substrate.

[0070] In one embodiment of the fixture, the fixture 20 has a V-shaped groove. The multiple transfer surfaces 200 of the fixture 20 include a first transfer surface 200a and a second transfer surface 200b. The first transfer surface 200a and the second transfer surface 200b are two adjacent sidewalls of the V-shaped groove. Specifically, the V-shaped groove of the fixture 20 can be formed as a V-shaped member as a whole, or a local area or surface of the fixture 20 can have the V-shaped groove.

[0071] In this embodiment, the V-shaped groove on the clamp 20 can be engaged with the upper edge of the side of the display substrate 30 (the junction of the front and side surfaces of the display substrate). After engagement, a portion of the front and side surfaces of the display substrate are located within the V-shaped groove. Regarding the V-shaped groove, its first transfer surface 200a can be in contact with the front surface of the display substrate 30, and the second transfer surface 200b can be in contact with the side surface of the display substrate 30. For the first and second components respectively disposed on the front and side surfaces of the display substrate, a connection between the first and second components can be achieved by transferring conductive adhesive and curing the resulting conductive wire. This is particularly suitable for products in which the driver IC is disposed on the side surface of the display substrate.

[0072] In a further embodiment, at least one of the multiple transfer surfaces 200 of the fixture 20 can rotate to change the angle between the transfer surfaces 200 and the adjacent transfer surfaces 200. This configuration allows for adjustment of the angles and other relative positions of the multiple transfer surfaces 200 when applying conductive adhesive to the multiple transfer surfaces 200 and when contacting the multiple transfer surfaces 200 with the multiple target surfaces 300 on the display substrate 30, thereby facilitating the application of the conductive adhesive and lamination to the target surfaces 300.

[0073] The present invention also provides a method for preparing a clamp, which is used to prepare the clamp described in the above embodiment. In its embodiment, the method for preparing the clamp includes:

[0074] The transfer surface 200 of the jig 20 is etched to form linear protrusions.

[0075] In this embodiment, linear protrusions are formed on the transfer surface 200 by an etching method, and linear protrusions with higher fineness can be formed. In this way, the conductive lines formed after applying the conductive glue and curing are fine, thereby better realizing the connection between the first device and the second device located on different target surfaces 300 of the display substrate 30.

[0076] The present invention further provides a display panel. In an embodiment thereof, the display panel includes the display substrate described in the above embodiment.

[0077] The display panel can specifically be any one of a liquid crystal display panel, an OLED display panel, a Mini LED display panel, and a Micro LED display panel.

[0078] Taking the liquid crystal display panel as an example, the above-mentioned display substrate can specifically be an array substrate. In addition to the array substrate, the liquid crystal display panel also includes a matching substrate for matching with the array substrate (because the color film is usually arranged on the matching substrate, the matching substrate is also called a color film substrate), and a liquid crystal layer filled between the matching substrate and the array substrate.

[0079] The display panel provided by the present invention includes the above-mentioned display substrate, and of course has the same beneficial effects as the above-mentioned display substrate, which will not be described in detail.

[0080] The present invention further provides a display device, which includes the display panel described in the above embodiment.

[0081] In one specific embodiment, a display device may include multiple display panels as described in the above embodiments. The multiple display panels may be sequentially spliced ​​along a first direction and / or a second direction, where the first direction and the second direction are respectively the length and width directions of the display panels. This arrangement allows the multiple display panels to be spliced ​​together to form a display device with a larger display area, thereby achieving a larger display area.

[0082] In this embodiment, if Figure 6 As shown, in the case of two display panels adjacent to each other along the first direction or the second direction, there may be no conductive line at the interface between the two, or there may be conductive lines of one of the display panels, or there may be conductive lines of both display panels. It is understandable that for multiple display panels in a display device, they may have the above three different relationships with each other at the same time, that is, in some adjacent display panels, there is no conductive line at the interface between the two, such as Figure 6 As shown in A and B (A, B, C, D in the figure represent display panels, and the small rectangles on A, B, C, D represent conductive wires); in other adjacent display panels, the interface between the two has a conductive wire of one of the display panels, such as Figure 8 As shown in B and C; in other parts of the adjacent display panels, the interface between the two has conductive lines of two display panels, such as Figure 8 As shown in C and D.

[0083] In the interface with the conductive lines of two display panels, the conductive lines of the two display panels are staggered with each other, such as Figure 7 and Figure 8As shown, such an arrangement prevents the conductive lines of the two display panels from being electrically connected, thereby preventing poor display or display errors. Of course, this embodiment is not limited to this. In addition, the conductive lines of the two display panels can also correspond to each other in position, such as Figure 6 As shown in C and D, in this case, an insulating layer is provided between the conductive lines of the two display panels to separate the two, and the insulating layer is used to prevent the conductive lines of the two display panels from being conductive (in fact, for the sake of safety, in the example Figure 7 and Figure 8 In the staggered solution shown, an insulating layer may also be provided on the outside of the conductive wire to prevent the conductive wire from accidentally conducting electricity with external objects).

[0084] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0085] The foregoing description is intended only to provide specific embodiments of the present invention, which will enable those skilled in the art to understand and implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not intended to be limited to the embodiments shown herein, but is intended to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A method for preparing a display substrate, characterized in that: The method for preparing the display substrate includes: Step S1, applying conductive adhesive to multiple transfer surfaces on a fixture; the multiple transfer surfaces on the fixture are sequentially connected, the multiple transfer surfaces have linear protrusions, and the linear protrusions on the multiple transfer surfaces are sequentially connected, so that the linear protrusions on the multiple transfer surfaces form a plurality of spaced-apart lines; Step S2: Engaging the fixture with the display substrate so that the plurality of transfer surfaces are respectively attached to the plurality of target surfaces on the display substrate; the plurality of target surfaces of the display substrate include a surface on the display substrate where the first device and the second device to be connected are located, and a connection surface where the surface where the first device is located and the surface where the second device is located are connected; when the transfer surface on the fixture and the corresponding target surface on the display substrate are attached, the linear protrusions on the transfer surface contact the target surface, causing the conductive adhesive on the linear protrusions to transfer to the target surface, so that the target surface is adhered to a continuous linear conductive adhesive; Step S3 , curing the conductive adhesive to form a plurality of conductive lines spaced apart and connecting the first device and the second device on the plurality of target surfaces.

2. The method for preparing a display substrate according to claim 1, wherein: The first device includes a pixel array of the display substrate, and the second device includes a driver IC of the display substrate; In step S2 , a plurality of transfer surfaces are respectively attached to the surface of the display substrate where the pixel array is located and the surface where the driver IC is located.

3. The method for preparing a display substrate according to claim 2, wherein: The surface where the first device is located is the front surface of the display substrate, and the second device is arranged on the back surface of the display substrate; the clamp has a U-shaped groove, and the multiple transfer surfaces of the clamp include a first transfer surface, a second transfer surface, and a third transfer surface, the first transfer surface and the third transfer surface are two opposite side walls of the U-shaped groove, and the second transfer surface is the bottom surface of the U-shaped groove; In step S2, the groove of the clamp is clamped on the side of the display substrate, so that the first transfer surface and the third transfer surface of the groove are respectively aligned with the front and back sides of the display substrate, and the bottom surface of the groove is aligned with the side surface of the display substrate in the thickness direction.

4. The method for preparing a display substrate according to claim 1, wherein: In step S1 , a glue coating rod having multiple glue coating surfaces is used to coat conductive glue onto multiple transfer surfaces of the fixture; the multiple glue coating surfaces of the glue coating rod correspond one-to-one to the multiple transfer surfaces of the fixture.

5. A display substrate, characterized in that: The display substrate is prepared by the method for preparing a display substrate according to any one of claims 1 to 4, wherein the display substrate has a pixel array and a conductive line, wherein the pixel array is arranged on the front side of the display substrate, and the conductive line extends from the front side of the display substrate to the back side or side of the display substrate; the conductive line is connected to the pixel array on the front side of the display substrate, and is used to connect to the driver IC on the back side or side of the display substrate.

6. The display substrate according to claim 5, wherein: The conductive lines are disposed on one or more sides of the display substrate.

7. The display substrate according to claim 6, wherein: The pixel array includes multiple lines, each of which is connected to the conductive lines. The conductive lines of the odd-numbered lines are arranged on one side of the display substrate, and the conductive lines of the even-numbered lines are arranged on the opposite side of the display substrate.

8. A display panel, characterized in that: The display panel includes the display substrate according to any one of claims 5 to 7; the display panel is any one of a liquid crystal display panel, an OLED display panel, a Mini LED display panel, and a Micro LED display panel.

9. A display device, characterized in that: The display device includes a plurality of display panels, and the plurality of display panels can be sequentially spliced ​​along a first direction and / or a second direction, where the first direction and the second direction are respectively a length direction and a width direction of the display panels; The display panel is the display panel according to claim 8.

10. The display device according to claim 9, wherein: Two display panels adjacent to each other along the first direction or the second direction have no conductive lines on their interface, or have conductive lines of one of the display panels, or have conductive lines of both display panels; In the interface having conductive lines of two display panels, the conductive lines of the two display panels are staggered; or, the conductive lines of the two display panels are positioned corresponding to each other, and an insulating layer is provided between the conductive lines of the two display panels to separate them.

Images