A cleaning and packaging apparatus for diode high voltage silicon stacks

Abstract

The application discloses a kind of diode high pressure silicon stack's cleaning and packaging equipment, including work stand, the bottom surface inside of work stand is equipped with the conveyor belt for conveying raw materials, the outer top surface of work stand one side is equipped with servo motor one of driving conveyor belt, the belt surface of conveyor belt is also fixed with rubber connecting block, rubber connecting block one end is fixed with mounting block, mounting block is connected in work stand with rolling, the bottom surface of mounting block is also rotatably connected with fixed rod, the bottom surface of fixed rod is equipped with the fixing mechanism for temporarily fixing diode heart with all mounting block.The application has reasonable design, and device runs stably, when using, it realizes the transposition transfer of diode high pressure silicon stack by means of conveyor belt, realizes the automatic spray cleaning and laser sintering operation of diode high pressure silicon stack during transfer, it is easy to operate, thereby greatly improves the efficiency of diode high pressure silicon stack processing, at the same time, it also reduces the contact time of worker and diode high pressure silicon stack, thereby reach the purpose of protecting worker's health.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of diode high-voltage silicon stack production equipment, and particularly relates to a cleaning and packaging device for diode high-voltage silicon stacks. BACKGROUND

[0002] The high-voltage silicon stack, also known as a silicon column, is a silicon high-frequency high-voltage rectifier diode, and its working voltage is between several thousand volts and several ten thousand volts. It is commonly used in black-and-white television sets or other electronic instruments as a high-frequency high-voltage rectifier. The reason why it can have such high voltage resistance is that it is composed of a plurality of silicon high-frequency diode cores in series inside, and is packaged with high-frequency ceramics outside. It is commonly used in direct current high-voltage equipment as a basic rectifier element.

[0003] When the diode high-voltage silicon stack is cleaned and packaged, the diode high-voltage silicon stack core is first placed in an acid mixture for degumming, taken out, and left to stand for 2-4 hours for standby. A first cleaning liquid capable of removing the oxide film on the front surface of the diode high-voltage silicon stack core is sprayed onto the front surface of the diode high-voltage silicon stack core, while nitric acid and hydrofluoric acid are sprayed onto the back surface of the diode high-voltage silicon stack core. Ultra-pure water is sprayed onto the front surface of the diode high-voltage silicon stack core. An organic material layer is evaporated on the substrate of the high-voltage silicon stack. An outer ring packaging material layer is coated on the edge of the display area on the back cover plate. An inner ring packaging material layer is coated on the inner side of the annular pattern layer on the back cover plate. The back cover plate is installed on the high-voltage silicon stack substrate. The outer ring packaging material layer is bonded to the substrate and the back cover plate by laser sintering.

[0004] The existing device places the diode in the spraying chamber for spraying and cleaning. After spraying, the diode is taken out, glued, and placed in the laser sintering chamber for fixation. The processing is slow, which affects the efficiency of the diode high-voltage silicon stack processing. The liquid residue on the surface of the diode high-voltage silicon stack after spraying is harmful to the human body. It is difficult to meet the use requirements of people. Therefore, it is necessary to study a cleaning and packaging device for diode high-voltage silicon stacks. SUMMARY

[0005] The purpose of the present application is to solve the problem of low efficiency and high labor cost in the prior art, and to provide a cleaning and packaging device for diode high-voltage silicon stacks.

[0006] In order to achieve the above purpose, the present application adopts the following technical scheme:

[0007] The utility model provides a kind of cleaning and packaging equipment of diode high-voltage silicon stack, including workbench, the bottom inside of workbench is equipped with the conveyer belt for conveying raw materials, the outer top surface of workbench is equipped with servo motor one for driving conveyer belt on one side, the belt surface of conveyer belt is also fixed with rubber connecting block, rubber connecting block one end is fixed with mounting block, and mounting block is connected in workbench with rolling, the bottom surface of mounting block is also rotatably connected with fixed rod, the bottom surface of fixed rod is equipped with the fixing mechanism for temporarily fixing diode core, and the front lower end of the middle part of conveyer belt is provided with the spray cleaning component for cleaning diode core, the upper side of spray cleaning component is also provided with electric telescopic rod one, and the output end of electric telescopic rod one is fixed with the clamping clamp for clamping mounting block, and the top is also provided with the clamping groove that is consistent with clamping clamp, the outer wall of the lower side of fixed rod is also fixed with driven gear, the both sides in the inside of workbench are equipped with feeding ladder, and the top side of feeding ladder is placed with the temporary storage dish for storing raw materials and finished products, and the rear side of spray cleaning component is also equipped with the positioning assembly for diode high-voltage silicon stack laser sintering chamber.

[0008] Preferably, the spray cleaning assembly includes a cleaning tank, mounting strips are welded between the inner walls of the rear ends of the cleaning tank, a servo motor two is fixed to the top surface of the mounting strips, a connecting rod is rotatably connected to the top surface of the cleaning tank in front of the mounting strips, the servo motor two and the connecting rod are rotatably connected by a synchronous conveyor belt, a driving gear is fixed to the outer wall of the upper side of the connecting rod, a flow guide hopper is fixed to the middle of the cleaning tank, a collection dish one, a collection dish two and a collection dish three are sequentially and slidably connected to the bottom surface of the cleaning tank from front to back, a screening net is rotatably installed on the upper side of each of the collection dishes, a spray pipe one and a spray pipe two are fixed to the rear ends of the flow guide hopper, a connecting pipe is connected through the spray pipe one and the spray pipe two, a spray head is installed on the end of the spray pipe one and the spray pipe two close to the center of the flow guide hopper, a pump body one and a pump body two are installed on the both sides of the outer end of the cleaning tank, a reflux fixed pipe one and a reflux fixed pipe two are connected through one side of the lower end of the collection dish one and the collection dish three, a material conveying hose is connected through the input end of the pump body one and the input end of the pump body two, an extraction pipe one and an extraction pipe two are connected through the output end of the pump body one and the output end of the pump body two, a support is fixed to the front side of the cleaning tank, an electric telescopic rod two is fixed to the top surface of the support by screws, and the output end of the electric telescopic rod two is fixedly connected with the side wall of the collection dish one.

[0009] Preferably, the driven gear is engaged with the driving gear when rotating into the cleaning box, collecting dish one, collecting dish two and collecting dish three are welded and fixed, collecting dish one, collecting dish two and collecting dish three are consistent in specification, the shower head is provided with a plurality of vertical row spray pipes one and two on the side wall of the spray pipe, the one end of the backflow fixed pipe one and the backflow fixed pipe two is slidably connected to the side wall of the cleaning box, the movable distance of the conveying hose is greater than the center distance of the collecting dish one and the collecting dish two, the upper end of the cleaning box is also provided with a groove on both sides for the fixation mechanism and the high pressure silicon stack of the diode to walk, and the front and back sides of the cleaning box are provided with rectangular grooves for the collecting dish one and the collecting dish three to extend out.

[0010] Preferably, the positioning assembly comprises a base, strip grooves are formed on the top surface of the base, cylindrical rods are rotatably connected to the inner walls of the strip grooves, thread parts with opposite screw directions are formed on the outer walls of the two sides of the cylindrical rods, strip blocks are threadedly connected to the outer walls of the two sides of the cylindrical rods, hinge seats are fixed to the top ends of the strip blocks, a laser sintering chamber body is further arranged on the upper side of the middle part of the base, jacks are rotatably connected to the four corners of the laser sintering chamber body and the hinge seats, a laser heating element is fixed to the inner wall of the laser sintering chamber body, electric telescopic rods three are fixed to the two sides of the outer top surface of the laser sintering chamber body, push blocks are fixed to the output ends of the electric telescopic rods three, sealing plates are fixed to the bottom sides of the push blocks, a groove is formed in the middle part of the top surface of the laser sintering chamber body for the insertion of the high pressure silicon stack of the diode, recesses are formed in the two sides of the groove for the temporary storage of the sealing plates, a drive box is further arranged on one side of the base, the output end of the drive box is fixed to one of the cylindrical rods, and the two cylindrical rods are further rotatably connected by a synchronous transmission chain.

[0011] Preferably, the fixation mechanism comprises fixation blocks, the fixation blocks are fixed to the bottom surface of the fixation rod, a cylindrical groove is formed in the middle part of the inner bottom surface of the fixation block, a circular hole is further formed in the inner wall of the cylindrical groove, a plurality of circular holes are formed in the inner wall of the cylindrical groove and evenly distributed in three layers, each layer of the circular holes is provided with three circular holes and evenly distributed on the inner wall of the cylindrical groove, clamping blocks are slidably connected to the inner walls of the circular holes, soft pads are fixed to the one end of the clamping block close to the cylindrical groove, clamping springs are fixed between the clamping blocks and the bottom surface of the circular hole, pull ropes are further fixed to one end of the clamping block, the pull ropes are pulled out from the inside of the clamping block and fixed to the pulling blocks at the end, and the pulling directions of the pull ropes in the pulling blocks are consistent.

[0012] Preferably, the bottom surface of the workbench is provided with a mounting groove, a conveying belt is rotatably mounted on the top surface of the mounting groove, a ring groove is further formed in the side wall of the mounting groove, mounting blocks are rollingly connected in the ring groove, and a ring groove is further formed in the bottom surface of the ring groove for the sliding of the fixation rod.

[0013] Compared with the prior art, the cleaning and packaging equipment for the diode high pressure silicon stack has the following advantages:

[0014] 1、The present application is designed rationally, and the device runs stably. When in use, the device realizes the transposition and transfer of the diode high-voltage silicon stack by means of the conveying belt, and realizes the automatic spray cleaning and laser sintering of the diode high-voltage silicon stack during the transfer, which is simple to operate, thereby greatly improving the efficiency of the diode high-voltage silicon stack processing, and at the same time, reducing the contact time of workers with the diode high-voltage silicon stack, so as to achieve the purpose of protecting the health of workers;

[0015] 2、When cleaning the diode core, the present application adjusts the position by translating the collecting dish one, the collecting dish two and the collecting dish three through the electric telescopic rod two, so that the collecting dish one, the collecting dish two and the collecting dish three collect waste liquid at different cleaning stages of the diode core, and after collection, the corresponding cleaning liquid is pumped back by the pump body one and the pump body two and the spray flushing operation is completed, and the impurities in the cleaning liquid are screened out by the screening net during the spray flushing, so that the cleaning liquid is recycled, thereby greatly saving the cleaning liquid;

[0016] 3、When spraying, the present application rotates the connecting rod by the synchronous conveying belt driven by the servo motor two, at this time, the driving gear drives the driven gear to mesh and drive the fixed rod to rotate, at this time, the plurality of spray heads realize the full and dead angle-free spray operation of the diode core, thereby providing a certain guarantee for the high-quality production of the diode high-voltage silicon stack;

[0017] 4、When laser sintering the diode high-voltage silicon stack, at this time, the electric telescopic rod three drives the push block to translate to open the upper sealing plate of the laser sintering chamber body, when the diode high-voltage silicon stack moves to the upper side of the laser sintering chamber body, at this time, the driving box drives the two cylindrical rods to rotate synchronously, thereby moving the laser sintering chamber body upward to realize the laser sintering operation of the diode high-voltage silicon stack, after sintering, the laser sintering chamber body is moved downward, and the diode high-voltage silicon stack continues to move downward to the next station to complete the efficient processing;

[0018] 5、When fixing the diode core, the present application pulls out the pull block, the pull block pulls the pull rope to move to make the clamping block leave the cylindrical groove, then people place the diode core in the cylindrical groove, at this time, the diode core is quickly clamped and positioned under the action of the clamping spring, which is simple to operate, thereby providing a certain guarantee for the efficient processing of the diode core. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a front structure schematic diagram of the present application;

[0020] Figure 2 It is an A-A enlarged view in the present application Figure 1

[0021] Figure 3 It is a rear structure schematic diagram of the present application;

[0022] ​Figure 4 For the invention Figure 1 Enlarged view at B in the invention;

[0023] Figure 5 Front view of the spray cleaning assembly in the invention;

[0024] Figure 6 Side view of the spray cleaning assembly in the invention;

[0025] Figure 7 Top view of the cleaning box in the invention;

[0026] Figure 8 Plan view of the positioning assembly in the invention;

[0027] Figure 9 Front view of the fixing mechanism in the invention.

[0028] In the figure: working frame 1, conveying belt 2, servo motor 1 3, rubber connecting block 4, mounting block 5, fixing rod 6, fixing mechanism 7, spray cleaning assembly 8, electric telescopic rod 1 9, clamping clamp 10, clamping groove 11, driven gear 12, feeding ladder 13, temporary storage dish 14, positioning assembly 15, fixing block 71, clamping block 72, soft pad 73, clamping spring 74, pull rope 75, pulling block 76, cleaning box 81, mounting strip 82, servo motor 2 83, connecting rod 84, driving gear 85, flow guide funnel 86, collection dish 1 87, collection dish 2 88, collection dish 3 89, screening net 810, spray pipe 1 811, spray pipe 2 812, connecting pipe 813, spray head 814, pump body 1 815, pump body 2 816, backflow fixed pipe 1 817, backflow fixed pipe 2 818, material conveying hose 819, liquid suction pipe 1 820, liquid suction pipe 2 821, support 822, electric telescopic rod 2 823, base 151, cylindrical rod 152, strip-shaped block 154, hinged seat 155, laser sintering chamber body 156, top rod 157, laser electric heating element 158, electric telescopic rod 3 159, pushing block 1510, sealing plate 1511, drive box 1512. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all embodiments.

[0030] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. Embodiment

[0031] Reference Figures 1-4 A cleaning and packaging device for diode high-voltage silicon stacks includes a workbench 1, a conveying belt 2 for conveying raw materials is installed on the inner side of the bottom surface of the workbench 1, a servo motor 3 for driving the conveying belt 2 is installed on one side of the outer top surface of the workbench 1, rubber connecting blocks 4 are also fixed on the belt surface of the conveying belt 2, mounting blocks 5 are fixed on one end of the rubber connecting blocks 4, the mounting blocks 5 are rollingly connected in the workbench 1, fixed rods 6 are also rotatably connected to the bottom surface of the mounting blocks 5, fixing mechanisms 7 for temporarily fixing diode cores are installed on the bottom surface of the fixed rods 6, a spray cleaning assembly 8 for cleaning diode cores is arranged at the lower end of the front side of the middle part of the conveying belt 2, an electric telescopic rod 9 is also arranged on the upper side of the spray cleaning assembly 8, clamping clamps 10 for clamping the mounting blocks 5 are fixed on the output end of the electric telescopic rod 9, clamping grooves 11 matching the clamping clamps 10 are also arranged on the top surface, driven gears 12 are also fixed on the outer wall of the lower side of the fixed rods 6, feeding ladders 13 are installed on both sides of the inside of the workbench 1, temporary storage dishes 14 for storing raw materials and finished products are placed on the top side of the feeding ladders 13, and a positioning assembly 15 for the laser sintering chamber of the diode high-voltage silicon stack is also installed on the rear side of the spray cleaning assembly 8.

[0032] In this embodiment, the diode high-voltage silicon stack is transported by means of the conveying belt 2 during use, the spray cleaning assembly 8 and the positioning assembly 15 complete the automatic spray cleaning and laser sintering operation of the diode high-voltage silicon stack, and the operation is simple, thereby greatly improving the efficiency of the diode high-voltage silicon stack processing. Embodiment

[0033] As Figure 1 , 5, 6 and 7, the embodiment is basically same with embodiment 1, preferably, the spraying cleaning assembly 8 comprises a cleaning box 81, mounting strips 82 are welded between the inner walls of the rear end of the cleaning box 81, a servo motor two 83 is fixed to the top of the middle of the mounting strips 82, a connecting rod 84 is rotatably connected to the inner top of the front side of the mounting strips 82, the servo motor two 83 is rotatably connected with the connecting rod 84 through a synchronous transmission belt, a driving gear 85 is fixed to the upper outer wall of the connecting rod 84, a flow guide hopper 86 is also fixed to the middle of the cleaning box 81, a collection dish one 87, a collection dish two 88 and a collection dish three 89 are sequentially and slidably connected to the inner bottom of the cleaning box 81 from front to back, a screening net 810 is rollingly installed on the upper side of each of the collection dish one 87, the collection dish two 88 and the collection dish three 89, a spraying pipe one 811 and a spraying pipe two 812 are fixed to the rear end of each of the two sides of the flow guide hopper 86, a connecting pipe 813 is throughly connected between each of the two spraying pipe ones 811 and the two spraying pipe twos 812, a spraying head 814 is installed at the end of each of the spraying pipe one 811 and the spraying pipe two 812 close to the center of the flow guide hopper 86, a pump body one 815 and a pump body two 816 are respectively installed on the outer end of each of the two sides of the cleaning box 81, a backflow fixed pipe one 817 and a backflow fixed pipe two 818 are respectively throughly connected to the lower end of each of the two sides of the collection dish one 87 and the collection dish three 89, a material conveying hose 819 is throughly connected between the backflow fixed pipe one 817 and the input end of the pump body one 815 and between the backflow fixed pipe two 818 and the input end of the pump body two 816, a liquid pumping pipe one 820 and a liquid pumping pipe two 821 are respectively throughly connected between the output end of the pump body one 815 and one of the spraying pipe ones 811 and between the output end of the pump body two 816 and one of the spraying pipe twos 812, a support 822 is further fixed to the front side of the cleaning box 81, an electric telescopic rod two 823 is fixed to the top of the support 822 through screws, and the output end of the electric telescopic rod two 823 is fixedly connected with the side wall of the collection dish one 87.

[0034] In the embodiment, when the diode core is cleaned, the collection dish one 87, the collection dish two 88 and the collection dish three 89 are pushed by the electric telescopic rod two 823 to realize the adjustment of the position, so that the collection dish one 87, the collection dish two 88 and the collection dish three 89 can collect the waste liquid in different cleaning stages of the diode core, after the collection, the corresponding cleaning liquid is back-pumped by the pump body one 815 and the pump body two 816 to complete the spraying and flushing work, and the impurities in the cleaning liquid are screened out by the screening net 810 during the spraying and flushing, so that the recycling use of the cleaning liquid is realized, and the purpose of saving the cleaning liquid is greatly achieved. Embodiment

[0035] As Figure 1 , 5, 6 and 7, the embodiment is basically same as embodiment 1, preferably, preferably, when the driven gear 12 rotates into the cleaning box 81, it is connected in mesh with the driving gear 85, the collection tray one 87, the collection tray two 88 and the collection tray three 89 are all welded and fixed, the collection tray one 87, the collection tray two 88 and the collection tray three 89 are consistent in specification, the spray head 814 is provided with multiple vertical spray pipes 811 and 812 on the side wall, the return flow fixed pipe 817 and 818 are both connected with the side wall of the cleaning box 81 through sliding clearance, the material conveying hose 819 can move a distance greater than the center distance of the collection tray one 87 and the collection tray two 88, the upper end of the cleaning box 81 is also provided with a groove on both sides for the fixation of the mechanism 7 and the diode high-voltage silicon stack, and the front and back sides of the cleaning box 81 are provided with rectangular grooves for the extension of the collection tray one 87 and the collection tray three 89.

[0036] In this embodiment, the servo motor 83 drives the connecting rod 84 to rotate through the synchronous belt, at this time, the driving gear 85 drives the driven gear 12 to mesh and drive the fixed rod 6 to rotate, at this time, the multiple spray heads 814 realize the full-coverage and dead-angle-free spraying of the diode core, thereby providing a certain guarantee for the high-quality production of the diode high-voltage silicon stack. Embodiment

[0037] As shown in Figure 1 and 8 , the embodiment is basically same as embodiment 1, preferably, preferably, the positioning assembly 15 includes a base 151, the top surface of the base 151 is provided with a strip-shaped groove on both sides, the inner wall of the strip-shaped groove is rotatably connected with a cylindrical rod 152, the outer wall of the cylindrical rod 152 is provided with thread parts with opposite screw directions, the outer wall of the cylindrical rod 152 is connected with a strip-shaped block 154 through threads on both sides, the top end of the strip-shaped block 154 is fixed with a hinged seat 155, the upper side of the middle part of the base 151 is further provided with a laser sintering chamber body 156, the hinged seat 155 is rotatably connected with a jacking rod 157 at four corners of the laser sintering chamber body 156, the inner wall of the laser sintering chamber body 156 is further fixed with a laser heating element 158, the outer top surface of the laser sintering chamber body 156 is fixed with an electric telescopic rod three 159 on both sides, the output end of the electric telescopic rod three 159 is fixed with a pushing block 1510, the bottom side of the pushing block 1510 is fixed with a sealing plate 1511, the top surface of the middle part of the laser sintering chamber body 156 is provided with a groove for the insertion of the diode high-voltage silicon stack, grooves for the temporary storage of the sealing plate 1511 are provided on both sides of the groove, and the base 151 is further provided with a drive box 1512, the output end of the drive box 1512 is fixed with one of the cylindrical rods 152, and the two cylindrical rods 152 are further rotatably connected through a synchronous transmission chain.

[0038] In this embodiment, when the diode high-voltage silicon stack is laser sintered, the electric telescopic rod 3 159 drives the push block 1510 to translate to open the upper sealing plate 1511 of the laser sintering chamber body 156, and when the diode high-voltage silicon stack moves to the upper side of the laser sintering chamber body 156, the driving box 1512 drives the two cylindrical rods 152 to rotate synchronously, thereby moving the laser sintering chamber body 156 upward to realize the laser sintering operation of the diode high-voltage silicon stack. After sintering, the laser sintering chamber body 156 is lowered, and the diode high-voltage silicon stack continues to move to the next station to complete the high-efficiency processing. EMBODIMENT

[0039] As shown in Figure 1 and 9 , this embodiment is basically the same as embodiment 1, preferably, the fixing mechanism 7 comprises fixing blocks 71, which are fixed on the bottom surface of the fixing rod 6, and a cylindrical groove is formed in the middle of the inner bottom surface of the fixing block 71, and a circular hole is formed in the inner wall of the cylindrical groove, and a plurality of circular holes are arranged in three layers on the inner wall of the cylindrical groove, and each layer of circular holes is evenly distributed on the inner wall of the cylindrical groove, and the inner wall of the circular hole is slidably connected with a clamping block 72, and the clamping block 72 is fixed with a soft pad 73 near one end of the cylindrical groove, and a clamping spring 74 is fixed between the clamping block 72 and the bottom surface of the circular hole, and a pull rope 75 is fixed at one end of the clamping block 72, and the pull rope 75 is pulled out from the inside of the clamping block 72 and is fixed with a pulling block 76 at the end, and the winding direction of the pull rope 75 in the pulling block 76 is consistent.

[0040] In this embodiment, when fixing the diode core, pull out the pulling block 76, pull the pull rope 75 to move the clamping block 72 away from the cylindrical groove, then place the diode core in the cylindrical groove, and the clamping spring 74 can quickly clamp and position the diode core, which is simple to operate, thereby providing a certain guarantee for the efficient processing of the diode core. EMBODIMENT

[0041] As shown in Figure 1 and 2 , this embodiment is basically the same as embodiment 1, preferably, the bottom surface of the workbench 1 is provided with a mounting groove, the conveying belt 2 is rotatably mounted on the top surface of the mounting groove, and the side wall of the mounting groove is also provided with an annular groove, and the mounting blocks 5 are rollingly connected in the annular groove, and the bottom surface of the annular groove is also provided with an annular groove for the sliding of the fixing rod 6.

[0042] In this embodiment, the mounting blocks 5 are rollingly connected in the annular groove, so that the translation of the mounting blocks 5 is more smooth and stable, thereby providing a certain guarantee for the high-stability production of the diode high-voltage silicon stack.

[0043] The above merely describes preferred embodiments of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can make equivalent replacements or changes within the technical scope disclosed by the present application and according to the technical solutions and inventive concept of the present application, which should be covered within the protection scope of the present application.

Claims

1. A cleaning and packaging device for high-voltage silicon diode stacks, comprising a work stand (1), a conveyor belt (2) for conveying raw materials is installed on the inner side of the bottom surface of the work stand (1), and a servo motor (3) for driving the conveyor belt (2) is installed on one side of the outer top surface of the work stand (1), characterized in that, The conveyor belt (2) is also fixed with rubber connecting blocks (4), and each rubber connecting block (4) is fixed with an installation block (5) at one end. The installation block (5) is rotatably connected in the work frame (1). The bottom surface of the installation block (5) is also rotatably connected with a fixing rod (6). The bottom surface of the fixing rod (6) is equipped with a fixing mechanism (7) for temporarily fixing the diode core. The lower front end of the middle section of the conveyor belt (2) is provided with a spray cleaning assembly (8) for cleaning diode cores. The upper side of the spray cleaning assembly (8) is also provided with an electric telescopic rod (9). The output end of the electric telescopic rod (9) is fixed with a locking clip (10) for locking the mounting block (5). The top surface is also provided with a locking groove (11) that matches the locking clip (10). The lower outer wall of the fixing rod (6) is also fixed with a driven gear (12). The work frame (1) is equipped with a feeding ladder (13) on both sides inside. The top side of the feeding ladder (13) is equipped with a temporary storage dish (14) for storing raw materials and finished products. The spray cleaning assembly (8) is also equipped with a positioning assembly (15) for the laser sintering chamber of diode high voltage silicon stack.

2. The cleaning and packaging equipment for a high-voltage silicon diode stack according to claim 1, characterized in that, The spray cleaning assembly (8) includes a cleaning tank (81). An installation strip (82) is welded between the inner walls of the two rear sides of the cleaning tank (81). A servo motor (83) is fixed in the middle of the top surface of the installation strip (82). A connecting rod (84) is rotatably connected to the front side of the installation strip (82) on the top surface inside the cleaning tank (81). The servo motor (83) and the connecting rod (84) are rotatably connected by a synchronous conveyor belt. A drive gear (85) is fixed on the upper outer wall of the connecting rod (84). A guide funnel is also fixed in the middle of the cleaning tank (81). (86) The bottom surface of the washing tank (81) is connected in sequence from front to back by a collection dish 1 (87), a collection dish 2 (88), and a collection dish 3 (89). A screen (810) is rolled on the upper side of each of the collection dishes 1 (87), 2 (88), and 3 (89). Spray pipe 1 (811) and spray pipe 2 (812) are fixed on both sides of the rear end of the guide funnel (86). A connecting pipe (813) is connected between the two spray pipes 1 (811) and the two spray pipes 2 (812). Spray heads (814) are installed at the ends of both the first (811) and the second (812) near the center of the guide funnel (86). Pump body one (815) and pump body two (816) are installed on the outer sides of the cleaning box (81), respectively. Return pipe one (817) and return pipe two (818) are respectively connected to the lower side of the collection dish one (87) and the collection dish three (89). There is a connection between the return pipe one (817) and the input end of the pump body one (815) and between the return pipe two (818) and the input end of the pump body two (816). A conveying hose (819) is connected through the pump body (815) and pump body (816). The output ends of the pump body (815) and pump body (816) are respectively connected to one of the spray pipes (811) and one of the spray pipes (812) by a liquid extraction pipe (820) and a liquid extraction pipe (821). A support (822) is also fixed on the front side of the cleaning tank (81). An electric telescopic rod (823) is fixed on the top surface of the support (822) by screws. The output end of the electric telescopic rod (823) is fixedly connected to the side wall of the collection dish (87).

3. The cleaning and packaging equipment for a diode high-voltage silicon stack according to claim 2, characterized in that, When the driven gear (12) rotates into the cleaning box (81), it meshes with the driving gear (85). The first collection dish (87), the second collection dish (88), and the third collection dish (89) are all welded and fixed together. The first collection dish (87), the second collection dish (88), and the third collection dish (89) have the same specifications.

4. A cleaning and packaging device for a diode high-voltage silicon stack according to claim 2 or 3, characterized in that, Each of the spray heads (814) is provided with multiple spray pipes (811) and spray pipe (812) arranged in a vertical row on the side wall. One end of the return pipe (817) and the return pipe (818) are slidably connected to the side wall of the cleaning tank (81). The movable distance of the conveying hose (819) is greater than the center distance between the collection dish (87) and the collection dish (88).

5. The cleaning and packaging equipment for a diode high-voltage silicon stack according to claim 2, characterized in that, The upper sides of the cleaning box (81) are also provided with slots to facilitate the movement of the fixing mechanism (7) and the high voltage silicon stack of diodes. The front and rear sides of the cleaning box (81) are provided with rectangular slots to facilitate the extension of the first collection dish (87) and the third collection dish (89).

6. The cleaning and packaging equipment for a high-voltage silicon diode stack according to claim 1, characterized in that, The positioning component (15) includes a base (151). The top and rear sides of the base (151) are provided with strip grooves. A cylindrical rod (152) is rotatably connected to the inner wall of the strip groove. The outer walls of both sides of the cylindrical rod (152) are tapped with threads of opposite directions. Strip blocks (154) are threaded to both sides of the outer walls of the cylindrical rod (152). A hinge seat (155) is fixed to the top of each strip block (154). A laser sintering chamber body (156) is also provided on the upper side of the middle of the base (151). The hinge seat (155) and the laser sintering chamber body (156) are connected by four... A top rod (157) is rotatably connected at each corner. A laser heating element (158) is also fixed on the inner wall of the laser sintering chamber body (156). Electric telescopic rods (159) are fixed on both sides of the outer top surface of the laser sintering chamber body (156). A push block (1510) is fixed at the output end of the electric telescopic rod (159). A sealing plate (1511) is fixed on the bottom side of the push block (1510). A groove is opened in the middle of the top surface of the laser sintering chamber body (156) to facilitate the insertion of the high voltage silicon stack of the diode. Grooves for temporary storage of the sealing plate (1511) are opened on both sides of the groove.

7. The cleaning and packaging equipment for a diode high-voltage silicon stack according to claim 6, characterized in that, A drive box (1512) is also provided on one side of the base (151). The output end of the drive box (1512) is fixed to one of the cylindrical rods (152). The two cylindrical rods (152) are also connected by a synchronous transmission chain.

8. A cleaning and packaging apparatus for a diode high-voltage silicon stack according to claim 1 or 2, characterized in that, The fixing mechanism (7) includes a fixing block (71), which is fixed on the bottom surface of the fixing rod (6). A cylindrical groove is provided in the middle of the bottom surface of the fixing block (71), and a circular hole is provided in the inner wall of the cylindrical groove. A clamping block (72) is slidably connected to the inner wall of the circular hole. A soft pad (73) is fixed to one end of the clamping block (72) near the cylindrical groove. A clamping spring (74) is fixed between the clamping block (72) and the bottom surface of the circular hole. A pull rope (75) is also fixed to one end of the clamping block (72). One end of the pull rope (75) passes through the inside of the clamping block (72) and a pulling block (76) is fixed to the end.

9. The cleaning and packaging equipment for a diode high-voltage silicon stack according to claim 8, characterized in that, The circular holes are provided in multiple layers and are evenly distributed in three layers on the inner wall of the cylindrical groove. Each layer of the circular holes is provided in three layers and is evenly distributed on the inner wall of the cylindrical groove. The direction of the pull rope (75) within the pull block (76) is consistent.

10. A cleaning and packaging apparatus for a diode high-voltage silicon stack according to claim 1 or 4, characterized in that, The bottom surface of the work frame (1) is provided with an installation groove, and the conveyor belt (2) is rotatably installed on the top surface of the installation groove. The side wall of the installation groove is also provided with an annular groove, and the installation blocks (5) are all rotatably connected in the annular groove. The bottom surface of the annular groove is also provided with an annular groove to facilitate the sliding of the fixing rod (6).

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