A semiconductor chip splitting auxiliary tool and a splitting method using the tool

Abstract

The present invention discloses a semiconductor chip cracking auxiliary tool, comprising a frame, wherein the right portion of the frame is formed with a right support frame portion, the left portion of the frame is formed with a left support frame portion, the top surface of the right support frame portion is mounted with a clamping plate, the inner side wall of the top of the right support frame portion is mounted with a detachable rotating platform, the top surface of the detachable rotating platform is flush with the top surface of the right support frame portion; the upper portion of the left support frame portion is mounted with a sliding member for forward and backward movement, the sliding member is fixed with a sliding arm, the right portion of the sliding arm is mounted with a cracking pen, the tip of the cracking pen faces the top surface of the detachable rotating platform. The tool has a simple structure, is easy to manufacture, has a low manufacturing cost, is easy to operate, and dust generated during operation can be promptly processed, thereby reducing pollution to the surrounding environment. The tool solves the problems of poor cracking effect and injury to the operator caused by manual cracking, and reduces the experience requirement for the cracking personnel.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip detection equipment, and more particularly to a semiconductor chip splitting auxiliary tool and a splitting method using the tool. Background Art

[0002] Analysis of failed semiconductor chips and wafers typically involves surface and cross-sectional analysis. Compared to surface analysis, cross-sectional analysis typically involves preparing the chip section, which involves chip cleaving. Since the chips being cleaved are typically small in size, current chip cleaving methods typically rely on manual cleavage or automated mechanical cutting.

[0003] The former requires the operator to have a high level of finger feel and rich experience in order to achieve the desired effect on the splinter cross section. Improper operation may cause damage to the splinter cross section, requiring subsequent grinding to compensate. In addition, there is a risk of injury to the operator's body due to debris generated by the splinters.

[0004] The latter requires the purchase of related equipment, such as a chip production splitting machine with Chinese patent application number 202221927500.6, which drives the threaded rod to rotate through a driving motor, and the rotation of the threaded rod drives the moving block to move back and forth. The moving block drives the diamond pen to move back and forth through a hydraulic telescopic rod, and at the same time, the diamond pen is controlled to move up and down by the hydraulic telescopic rod, so that the diamond pen draws cracks on the surface of the chip, and then the electric telescopic rod is controlled to shorten. The shortening of the electric telescopic rod drives the sliding sleeve to move downward, and the downward movement of the sliding sleeve pulls the two positioning plates downward through the connecting rod. At this time, the positioning plate makes the chip evenly stressed. Under the action of the positioning plate, the chip breaks at the crack mark. Its structure is complex, and it is also driven by components such as a driving motor and an electric telescopic rod, which makes its manufacturing cost quite high. Summary of the Invention

[0005] The purpose of the present invention is to overcome the shortcomings of the existing technology and provide a semiconductor chip cracking auxiliary tool and a cracking method using this tool. It has a simple structure, is easy to manufacture, has low manufacturing cost, is easy to operate, and the dust generated during the operation can be handled in time to reduce pollution to the surrounding environment. It solves the problems of poor cracking effect and the risk of injury to the operator due to manual cracking, and reduces the experience requirements for the cracking personnel.

[0006] The solution of the present invention to the technical problem is:

[0007] A semiconductor chip cracking auxiliary tool includes a frame body, a right support frame portion is formed on the right portion of the frame body, a left support frame portion is formed on the left portion of the frame body, a clamping plate is installed on the top surface of the right support frame portion, and a detachable rotating platform is installed on the inner side wall of the top of the right support frame portion, and the top surface of the detachable rotating platform is flush with the top surface of the right support frame portion;

[0008] A sliding member for moving back and forth is installed on the upper part of the left supporting frame, a sliding arm is fixed on the sliding member, a scratching pen is installed on the right part of the sliding arm, and the tip of the scratching pen faces the top surface of the detachable rotating platform.

[0009] Furthermore, the front and rear parts of the clamping plate are formed with through holes, and the top surface of the right support frame corresponding to the through holes is formed with connecting screw holes, and the screw portion of the first adjusting bolt is inserted into the corresponding through hole and screwed into the corresponding connecting screw hole.

[0010] Furthermore, a buffer spring is inserted in the middle of the screw portion of the first adjusting bolt, an upper annular groove is formed on the bottom surface of the clamping plate around the through hole, and a lower annular groove is formed on the top surface of the right support frame portion around the screw connection hole. The upper annular groove corresponds to the lower annular groove up and down, and the top of the buffer spring is inserted in the corresponding upper annular groove, and the top of the buffer spring relies on the top surface of the upper annular groove. The bottom of the buffer spring is inserted in the corresponding lower annular groove, and the bottom end of the buffer spring relies on the bottom surface of the lower annular groove.

[0011] Furthermore, a sliding rail extending forward and backward is fixed on the upper right side wall of the left support frame part, a sliding groove is formed in the middle of the left side wall of the sliding part, the sliding rail is inserted into the sliding groove, and the top and bottom surfaces of the sliding groove are formed with protrusions, which are inserted into the guide groove formed on the top or bottom surface of the sliding rail.

[0012] Furthermore, a vertical screw-on through-hole is formed on the top plate of the sliding part, and the screw portion of the upper locking bolt is screwed into the vertical screw-on through-hole. The bottom end of the screw portion of the upper locking bolt extends into the slide groove and is fixed with an anti-skid plate. The bottom surface of the anti-skid plate is pressed against the top surface of the slide rail, and the bottom surface of the slide rail is pressed against the bottom surface of the slide groove.

[0013] Furthermore, a vertically penetrating adjustment hole is formed on the right portion of the sliding arm, the middle portion of the splitting pen is inserted into the adjustment hole, and a transversely extending screw hole is formed on the right side wall of the adjustment hole, the screw portion of the side locking bolt is screwed into the screw hole, the inner end of the screw portion of the side locking bolt extends into the adjustment hole and presses against the right side wall of the splitting pen, and the left side wall of the splitting pen presses against the left side wall of the adjustment hole.

[0014] Furthermore, the adjustment through hole is a rectangular through hole, an anti-slip layer is fixed on its left side wall, an anti-slip plate is fixed to the inner end of the screw portion of the side locking bolt, and the middle body of the splitting pen is a rectangular column, which cooperates with the adjustment through hole, the left side wall of the middle body of the splitting pen is pressed against the anti-slip layer, and the anti-slip plate is pressed against the right side wall of the middle body of the splitting pen.

[0015] Furthermore, the detachable rotating platform includes a vertical plate body, the rear side wall of the vertical plate body is formed with a left extension plate portion extending to the left, the middle portion of the vertical plate body is formed with a connecting through hole, the screw portion of the fixing bolt is inserted into the connecting through hole and screwed into the screw hole formed on the left side wall of the right support frame portion, and the vertical plate body is clamped between the rotating portion of the fixing bolt and the left side wall of the right support frame portion.

[0016] Furthermore, the rear wall of the left extension plate is formed with a material receiving groove, the bottom surface of the material receiving groove is formed with a first through hole, a connecting head is fixed on the inner side wall of the first through hole, the front end of the connecting head extends out of the front wall of the left extension plate, and the connecting head is communicated with the material receiving groove.

[0017] Furthermore, a filter screen is installed in the material receiving trough.

[0018] A method for splitting using the above-mentioned tool comprises the following steps:

[0019] The first step is to determine the chip splitting direction and position under a metallographic microscope, and then use the first adjusting bolt to rotate and clamp the chip between the top surface of the right support frame and the clamping plate;

[0020] Step 2: Align the top surface of the vertical plate of the detachable rotating platform with the top surface of the right support frame at the same level;

[0021] The third step is to loosen the upper locking bolts between the slide rail and the slide member so that the slide member remains in a sliding state; the tip of the scratching pen is facing downward and the scratching pen is tightened and fixed with the side locking bolts, and the slide member is moved back and forth along the slide rail so that the tip of the scratching pen forms a scratch on the chip where it is needed to be cracked;

[0022] Step 4: Remove the fixing bolts, disassemble the vertical plate and rotate it 90 degrees so that the left extension plate is at the top, forming a height difference between the top surface of the left extension plate and the top surface of the right support frame;

[0023] Step 5. After selecting the splitting position, fix the slide rail and the slide with the upper locking bolts; the splitting pen's splitting head is facing downward, aligned with the end of the chip to be split, and the side locking bolts are loosened to keep the splitting pen in an upward and downward movable state;

[0024] Step 6: Hold the tip of the chip-splitting pen and apply downward pressure to split the chip.

[0025] In the seventh step, the fragments and chips fall into the receiving trough, and the dust suction structure connected to the receiving trough sucks air to absorb the powder generated by the chipping and other processing. The fragments are taken out of the receiving trough. If there is still powder on the surface, the fragments are blown away with an ear bulb to obtain a sample that can be observed in cross section.

[0026] The outstanding effects of the present invention are:

[0027] It has a simple structure, is easy to manufacture, has a low manufacturing cost, is easy to operate, and the dust generated during operation can be handled in a timely manner to reduce pollution to the surrounding environment. It solves the problem of poor splitting effect and the risk of injury to operators caused by manual splitting, and reduces the experience requirements for splitting personnel. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a partial structural schematic diagram of the present invention;

[0029] Figure 2 It is a partial top view of the present invention;

[0030] Figure 3 yes Figure 1 A partial enlarged view of

[0031] Figure 4 It is a partial structural diagram of another use state of the present invention;

[0032] Figure 5 yes Figure 4 A partial enlarged view of

[0033] Figure 6 yes Figure 1 a partial enlarged view of another part;

[0034] Figure 7 It is a schematic diagram of the partial structure of the left side wall of the right supporting frame part. DETAILED DESCRIPTION

[0035] For example, see Figures 1 to 7 As shown, a semiconductor chip cracking auxiliary tool includes a frame body 10, the right part of the frame body 10 is formed with a right support frame part 11, the left part of the frame body 10 is formed with a left support frame part 12, the frame body 10 includes a transverse part at the bottom, the left end top surface of the transverse part is formed with the left support frame part 12, and the right end top surface of the transverse part is formed with the right support frame part 11, and the whole is U-shaped.

[0036] The top surface of the right support frame 11 is mounted with a clamping plate 20. The front and rear portions of the clamping plate 20 are formed with through holes 21. The top surface of the right support frame 11 corresponding to the through holes 21 is formed with connecting screw holes. The screw portion of the first adjusting bolt 1 is inserted into the corresponding through hole 21 and screwed into the corresponding connecting screw hole. A buffer spring 2 is inserted into the middle portion of the screw portion of the first adjusting bolt 1. The bottom surface of the clamping plate 20 around the through hole 21 is formed with an upper annular groove. The top surface of the right support frame 11 around the connecting screw hole is formed with a lower annular groove. The upper annular groove corresponds to the lower annular groove. The top of the buffer spring 2 is inserted into the corresponding upper annular groove. The top of the buffer spring 2 is supported on the top surface of the upper annular groove. The bottom of the buffer spring 2 is inserted into the corresponding lower annular groove. The bottom of the buffer spring 2 is supported on the bottom surface of the lower annular groove. The bottom surface of the rotating portion of the first adjusting bolt 1 is pressed against the top surface of the clamping plate 20 , and the left side wall of the clamping plate 20 and the left side wall of the right supporting frame portion 11 are in the same vertical plane.

[0037] Furthermore, a detachable rotating platform 30 is installed on the inner side wall of the top of the right supporting frame portion 11, and the top surface of the detachable rotating platform 30 is flush with the top surface of the right supporting frame portion 11;

[0038] The detachable rotating platform 30 includes a vertical plate 31, the top surface of which is flush with the top surface of the right support frame portion 11. A left extension plate portion 32 extending to the left is formed on the rear side wall of the vertical plate 31. A connecting through-hole is formed in the middle of the vertical plate 31. The screw portion of the fixing bolt 6 is inserted into the connecting through-hole and screwed into the screw hole formed on the left side wall of the right support frame portion 11. The vertical plate 31 is clamped between the rotating portion of the fixing bolt 6 and the left side wall of the right support frame portion 11. A material receiving groove 33 is formed on the rear wall of the left extension plate 32. A first through-hole is formed on the bottom surface of the material receiving groove 33. A connector 34 is fixed to the inner side wall of the first through-hole. The front end of the connector 34 extends out of the front wall of the left extension plate 32 and is in communication with the material receiving groove 33.

[0039] A filter screen plate 35 is installed in the material receiving trough 33. The front wall surface of the outer side of the filter screen plate 35 is formed with a bent edge, and the outer side wall of the bent edge is pressed against the inner side wall of the material receiving trough 33 to achieve clamping and fixing. The filter screen plate 35 is covered with mesh holes.

[0040] Furthermore, a slide rail 13 extending forward and backward is fixed to the upper right side wall of the left support frame portion 12. A slide groove is formed in the middle of the left side wall of the slider 40. The slide rail 13 is inserted into the slide groove. The top and bottom surfaces of the slide groove are both formed with protrusions, which are inserted into the guide groove formed on the top or bottom surface of the slide rail 13. A vertical threaded through hole is formed on the top plate of the slider 40. The screw portion of the upper locking bolt 3 is screwed into the vertical threaded through hole. The bottom end of the screw portion of the upper locking bolt 3 extends into the slide groove and is fixed to the anti-skid plate 4. The bottom surface of the anti-skid plate 4 presses against the top surface of the slide rail 13, and the bottom surface of the slide rail 13 presses against the bottom surface of the slide groove.

[0041] Furthermore, the right part of the sliding arm 41 is formed with a vertically penetrating adjustment hole 42, and the adjustment hole 42 is a rectangular through hole with an anti-slip layer fixed on its left side wall. The middle body of the splitting pen 50 is a rectangular cylinder, the middle part of which is inserted into the adjustment through hole 42, and cooperates with the adjustment through hole 42. A transversely extending screw-in hole is formed on the right side wall of the adjustment through hole 42, and the screw portion of the side locking bolt 5 is screwed in the screw-in hole. The inner end of the screw portion of the side locking bolt 5 extends into the adjustment through hole 42 and is fixed with an anti-slip plate. The left side wall of the middle body of the splitting pen 50 is pressed against the anti-slip layer, and the anti-slip plate is pressed against the right side wall of the middle body of the splitting pen 50.

[0042] The bottom of the middle body of the scratching pen 50 is formed with a pen tip, and a diamond is fixed at the end of the pen tip, which faces the top surface of the detachable rotating platform 30. The top of the middle body of the scratching pen 50 is fixed with a scratching head, which can be made of epoxy resin, rubber and other materials.

[0043] A transverse protrusion block 7 is formed or fixed on the right side wall of the vertical plate body 31, and a transverse limiting groove 111 and a vertical limiting groove 112 are formed on the left side wall of the right support frame part 11. The transverse protrusion block 7 corresponds to and cooperates with the transverse limiting groove 111 and the vertical limiting groove 112.

[0044] The clamping plate 20 can be made of epoxy resin, glass fiber, wood or other materials to prevent it from damaging the chip surface.

[0045] A method for splitting using the above-mentioned tool comprises the following steps:

[0046] The first step is to determine the chip cracking direction and position under the metallographic microscope, and then use the first adjusting bolt 1 to rotate and clamp the chip between the top surface of the right support frame 11 and the clamping plate 20. The specific process is to place the chip to be cracked on the top surface of the right support frame 11, so that the chip cracking position is directly below the tip of the cracking pen 50, and then rotate the first adjusting bolt 1 on the clamping plate 20 so that the chip is clamped between the top surface of the right support frame 11 and the clamping plate 20 to achieve fixation.

[0047] The second step is to align the top surface of the vertical plate 31 of the detachable rotating platform 30 with the top surface of the right support frame 11 at the same level; by removing the fixing bolts 6, the top surface of the vertical plate 31 is aligned with the top surface of the right support frame 11 at the same level. At this time, the left extension plate 32 is at the rear, and the fixing bolts 6 are tightened to fix the vertical plate 31. At the same time, its transverse protrusions 7 are inserted into the corresponding transverse limiting grooves 111.

[0048] The third step is to loosen the upper locking bolts 3 at the slide rail 13 and the slide member 40 so that the slide member 40 remains in a slidable state; the tip of the scratching pen 50 is facing downward, the tip of the tip is in close contact with the chip's cracking position and generates a certain amount of pressure, and the side locking bolts 5 are tightened to fix the scratching pen 50. The slide member 40 is moved back and forth along the slide rail 13 so that the tip of the scratching pen 50 moves back and forth from one end of the front or rear side wall of the chip along the position where the chip is to be cracked, so that a scratch is formed at the position where the chip is to be cracked;

[0049] Step 4: Remove the fixing bolts 6, disassemble the vertical plate 31 and rotate it 90 degrees so that the left extension plate 32 is at the top, forming a height difference between the top surface of the left extension plate 32 and the top surface of the right support frame 11;

[0050] The specific method is to rotate the fixing bolt 6 to separate the vertical plate 31 from the right support frame portion 11, then rotate it 90 degrees so that the left extension plate portion 32 faces upward, then insert the horizontal protrusion block 7 into the vertical limiting groove 112 (the horizontal protrusion block 7 makes the vertical plate 31 accurately positioned and improves the fixing effect), and then tighten the fixing bolt 6 to fix the vertical plate 31 to the right support frame portion 11. Figure 4 As shown, the top surface of the left extension plate portion 32 is now lower than the top surface of the right support frame portion 11 (the distance from the top surface of the vertical plate body 31 to the central axis of the connecting through hole is greater than the distance from the rear wall surface of the left extension plate portion 32 to the central axis of the connecting through hole, so that after rotating 90 degrees, the top surface of the left extension plate portion 32 is lower than the top surface of the right support frame portion 11);

[0051] Step 5. After selecting the splitting position, fix the slide rail 13 and the sliding member 40 with the upper locking bolt 3; loosen the side locking bolt 5, remove the splitting pen 50 from the adjustment hole 42, rotate it 180 degrees, with the splitting head of the splitting pen 50 facing downward, and then insert it into the adjustment hole 42. Turn the side locking bolt 5 so that the anti-slip sheet is close to the right side wall of the splitting pen 50, so that the splitting pen 50 can move up and down along the adjustment hole 42, but keep it from deviating.

[0052] Step 6: Hold the tip of the scratch pen 50 and apply downward pressure so that the scratch pen 50 can break the slices into pieces along the scratch mark.

[0053] In the seventh step, the fragments and chips fall into the receiving trough 33, and the dust suction structure connected to the receiving trough 33 sucks air to absorb the powder generated by the chipping and other processing, and also absorbs some fragments on the surface of the fragments. The fragments are taken out from the receiving trough 33. When there is still powder on the surface, the fragments are blown away with an ear bulb to obtain a sample that can be observed in cross section.

[0054] The dust collecting device in this embodiment can adopt the existing dust collecting structure, or can adopt the structure as shown in FIG. Figure 1 The structure shown includes a main box body 60, a cover plate is fixed on the top of the main box body 60, a material receiving bucket 61 is placed in the main box body 60, the upper outer wall of the material receiving bucket 61 is pressed against the upper inner wall of the main box body 60, and a sealing ring can be installed between the two to achieve sealing.

[0055] A plurality of buffer springs 62 are fixed to the bottom surface of the bottom plate of the main box body 60, and a horizontal plate 63 is fixed to the top surface of the transverse portion of the frame body 10. A mounting groove is formed in the middle of the top surface of the horizontal plate 63. The bottoms of all buffer springs 62 are inserted into the mounting grooves, and the bottom ends of all buffer springs 62 are fixed to the bottom surface of the mounting grooves. The top ends of the buffer springs 62 are applied to the bottom surface of the bottom plate of the main box body 60. An extension sleeve is formed on the bottom edge of the main box body 60, and the upper part of the horizontal plate 63 and the buffer springs 62 are both inserted into the extension sleeve.

[0056] The upper side wall of the main box body 60 is connected to the air inlet pipe 64, and the top of the material receiving barrel 61 is covered with an upper connecting cover 65. A through groove is formed on the side wall of the upper connecting cover 65, which is connected to the air inlet pipe 64, and the through groove is connected to the material receiving barrel 61. An upwardly extending upper connecting sleeve 66 is formed on the top plate of the upper connecting cover 65, and the upper connecting sleeve 66 is connected to the material receiving barrel 61. An air pump 67 is fixed to the top surface of the cover plate, and the air inlet end of the air pump 67 is inserted into the through hole of the cover plate, and the bottom end of the air pump 67 is clamped in the upper connecting sleeve 66. A sealing ring can be clamped between the bottom end and the inner side wall of the upper connecting sleeve 66 to achieve sealing, and the air outlet end of the air pump 67 is outside the cover body.

[0057] A baffle portion 68 extending downward is formed on the bottom surface of the top plate of the upper connecting cover 65 between the upper connecting sleeve 66 and the through groove.

[0058] When in use, the connector 34 is connected to the air inlet pipe 64 through the connecting air pipe (indicated by a dotted line in the accompanying drawings), and it realizes suction by turning on the switch of the air pump 67 (the air pump 67 is connected to the power supply through an electrical connection line, and can be connected with a socket or an external independent power supply. It is a conventional structure and will not be described in detail here), so as to absorb the fragments and some fragments in the receiving trough 33. The fragments are blocked by the filter plate 35, and the fragments enter the main box body 60 through the mesh of the filter plate 35, and are blocked by the baffle part 68, so that they fall into the receiving bucket 61, and the remaining gas is discharged through the air outlet end of the air pump 67.

[0059] This embodiment has a simple structure, is easy to manufacture, and has a low cost. It is also easy to split and will not hurt people's hands during splitting. It is safe and the generated fragments will be directly absorbed to reduce pollution to the surrounding environment. It has good effects and high efficiency.

Claims

1. A semiconductor chip splitting auxiliary tool, comprising a frame (10), characterized in that: The right portion of the frame body (10) is formed with a right support frame portion (11), the left portion of the frame body (10) is formed with a left support frame portion (12), a clamping plate (20) is installed on the top surface of the right support frame portion (11), and a detachable rotating platform (30) is installed on the inner side wall of the top of the right support frame portion (11); A sliding member (40) for forward and backward movement is installed on the upper portion of the left support frame (12), a sliding arm (41) is fixed on the sliding member (40), a fragmentation pen (50) is installed on the right portion of the sliding arm (41), and the tip of the fragmentation pen (50) faces the top surface of the detachable rotating platform (30); The detachable rotating platform (30) includes a vertical plate body (31), the top surface of the vertical plate body (31) is flush with the top surface of the right support frame part (11), the rear side wall of the vertical plate body (31) is formed with a left extension plate part (32) extending to the left, the middle part of the vertical plate body (31) is formed with a connecting through hole, the screw part of the fixing bolt (6) is inserted into the connecting through hole and screwed into the screw hole formed on the left side wall of the right support frame part (11), and the vertical plate body (31) is clamped between the rotating part of the fixing bolt (6) and the left side wall of the right support frame part (11); The rear wall of the left extension plate (32) is formed with a material receiving groove (33), the bottom surface of the material receiving groove (33) is formed with a first through hole, a connector (34) is fixed on the inner side wall of the first through hole, the front end of the connector (34) extends out of the front wall of the left extension plate (32), and the connector (34) is communicated with the material receiving groove (33); A buffer device is fixed to the top surface of the transverse portion of the frame (10), a dust suction structure is fixed on the buffer device, and the connector (34) is connected to the air inlet pipe (64) of the dust suction structure via a connecting air pipe.

2. A semiconductor chip splitting auxiliary tool according to claim 1, characterized in that: The front and rear portions of the clamping plate (20) are both formed with through holes (21), and a connecting screw hole is formed on the top surface of the right support frame portion (11) corresponding to the through hole (21), and the screw portion of the first adjusting bolt (1) is inserted into the corresponding through hole (21) and screwed into the corresponding connecting screw hole.

3. The semiconductor chip splitting auxiliary tool according to claim 1, wherein: A slide rail (13) extending forward and backward is fixed on the upper right side wall of the left support frame portion (12), a slide groove is formed in the middle of the left side wall of the sliding member (40), the slide rail (13) is inserted into the slide groove, and a protrusion is formed on the top and bottom surfaces of the slide groove, and the protrusion is inserted into the guide slide groove formed on the top or bottom surface of the slide rail (13).

4. The semiconductor chip splitting auxiliary tool according to claim 1, wherein: The right part of the sliding arm (41) is formed with a vertically penetrating adjustment hole (42), the middle part of the splitting pen (50) is inserted into the adjustment hole (42), and a transversely extending screw hole is formed at the right side wall of the adjustment hole (42), the screw portion of the side locking bolt (5) is screwed into the screw hole, the inner end of the screw portion of the side locking bolt (5) extends into the adjustment hole (42) and presses against the right side wall of the splitting pen (50), and the left side wall of the splitting pen (50) presses against the left side wall of the adjustment hole (42).

5. The semiconductor chip splitting auxiliary tool according to claim 1, wherein: A filter screen plate (35) is installed in the material receiving trough (33).

6. The semiconductor chip splitting auxiliary tool according to claim 1, wherein: The clamping plate (20) is made of a material with a lower hardness than the chip.

7. A method for splitting using the tool according to any one of claims 1 to 6, characterized in that: The following steps are involved: The first step is to determine the chip splitting direction and position under a metallographic microscope, and then use the first adjusting bolt (1) to rotate and clamp the chip between the top surface of the right support frame (11) and the clamping plate (20); The second step is to place the top surface of the vertical plate (31) of the detachable rotating platform (30) and the top surface of the right support frame (11) at the same level; The third step is to loosen the upper locking bolts (3) at the slide rail (13) and the sliding member (40) so that the sliding member (40) remains in a slidable state; the tip of the scratching pen (50) is directed downward and the scratching pen (50) is tightened and fixed by the side locking bolts (5); the sliding member (40) is moved back and forth along the slide rail (13) so that the tip of the scratching pen (50) forms a scratch on the chip where the chip needs to be split; Step 4: Remove the fixing bolts (6), disassemble the vertical plate (31) and rotate it 90 degrees so that the left extension plate (32) is at the top, so that a height difference is formed between the top surface of the left extension plate (32) and the top surface of the right support frame (11); Step 5: After selecting the splitting position, fix the slide rail (13) and the sliding member (40) with the upper locking bolt (3); the splitting head of the splitting pen (50) is facing downward, aligned with the end of the chip to be split, and the side locking bolt (5) is loosened, so that the splitting pen (50) remains in an upward and downward movable state; Step 6: Hold the tip of the chip-splitting pen (50) and apply downward pressure to split the chip; In the seventh step, the fragments and the chips fall into the receiving trough (33), and the dust suction structure connected to the receiving trough (33) sucks air to absorb the powder generated by the processing, and the fragments are taken out from the receiving trough (33). If there is still powder on the surface, the fragments are blown away by the ear cleaning bulb to obtain a sample that can be observed in cross section.

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