A chip packaging structure and a packaging method

Abstract

The present invention provides a packaging structure and a packaging method for a chip, including a chip body, a base and a top cover; the chip is disposed between the base and the top cover, the chip body is provided with gold wires, one end of the gold wire is welded to a contact point of the chip body, the base is fixedly installed with pins, the other end of the gold wire is welded to the pins, a cavity is provided in the top cover, and nitrogen is provided in the cavity. By filling nitrogen in the cavity, the present invention can improve the protection of the chip, enhance the heat dissipation effect, and enhance the antioxidant capacity, so that the chip has a better use effect.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and particularly to a packaging structure and a packaging method for a chip. Background Art

[0002] Chip packaging technology is a process technology that wraps memory chips to avoid contact between the chips and the outside world and prevent damage to the chips from the outside. Impurities and bad gases in the air, and even water vapor will corrode the delicate circuits on the chips, thereby causing a decline in electrical performance. Different packaging technologies vary greatly in manufacturing processes and techniques, and also play a crucial role in the performance of memory chips themselves after packaging.

[0003] For example, in the patent with the application number: 202111402815.9, the packaging structure of a semiconductor chip includes a wafer, an insulating structure, a metal shielding layer, and a conductive member. A functional area and electrodes are provided on the first surface of the wafer; the insulating structure covers the first surface and has a receiving space opened on the side facing the wafer. A cavity is formed between the receiving space and the first surface, and the functional area is placed in the cavity; the metal shielding layer covers the insulating structure; one end of the conductive member is electrically connected to the electrode, and the other end sequentially penetrates the insulating structure and the metal shielding layer, and the conductive member is insulated from the metal shielding layer. The packaging structure and the packaging method for the semiconductor chip provided by the present invention can improve the structural strength of the chip and also improve the anti-interference ability of the chip.

[0004] This design can improve the structural strength of the chip and also improve the anti-interference ability of the chip.

[0005] However, this design cannot further enhance its protection, especially the heat dissipation, insulation protection, and antioxidant protection of the chip.

[0006] The purpose of the present invention is to provide a packaging structure and a packaging method for a chip to solve the problems mentioned in the above background art. Summary of the Invention

[0007] To achieve the above object, the present invention provides a packaging structure for a chip, including a chip body, a base, and a top cover; the chip is arranged between the base and the top cover. The chip body is provided with gold wires, one end of the gold wire is welded to the contact point of the chip body, the base is fixedly installed with pins, the other end of the gold wire is welded to the pins, a cavity is provided in the top cover, and nitrogen gas is provided in the cavity.

[0008] Preferably: a trachea is installed on the rear end surface of the top cover, the trachea is communicated with the cavity, and a one-way intake component is provided in the trachea.

[0009] Preferably, the unidirectional air intake assembly includes a mounting plate, a sealing plate, and a sealing disc. The left and right ends of the mounting plate are fixedly connected to the inner wall of the air pipe. The upper and lower walls of the mounting plate do not contact the inner wall of the air pipe, thus forming a channel. The sealing plate is fixedly installed at the rear end of the mounting plate. The outer wall of the sealing plate is fixedly connected to the inner wall of the air pipe. A groove is provided on the front end face of the sealing plate. The sealing disc fits into the groove. The sealing disc is arranged in the groove. A spring piece is installed on the front end face of the mounting plate. The other end of the spring piece is fixedly connected to the front end face of the sealing disc. A through hole is provided on the rear end face of the sealing plate. The through hole communicates with the groove.

[0010] A packaging method for a chip, and the steps of the packaging method for the chip are as follows:

[0011] Step 1: Place the chip body into the base mold. Prepare two portions of epoxy resin. Prepare the top cover mold. Place the chip into the mold, pour the epoxy resin, and pour the other portion of epoxy resin into the top cover mold. After solidification, form the base and the top cover. Install the top cover into the base to complete the packaging of the chip.

[0012] Step 2: Open an opening on the rear end face of the top cover. The size of the opening is the same as the size of the inner wall of the air pipe.

[0013] Step 3: Connect the air pipe to the opening, so that the inner wall of the air pipe is completely aligned with the opening.

[0014] Step 4: Inject nitrogen into the cavity. When injecting, push the sealing disc through the injection nozzle, so that the sealing disc squeezes the spring piece and the sealing disc disengages from the groove. Nitrogen passes through the through hole, the groove, and the channel formed by the upper and lower ends of the mounting plate in sequence and enters the cavity. After the nitrogen filling is completed, the injection nozzle disengages from the sealing disc, and the spring piece rebounds to push the sealing disc into the groove to seal the through hole.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0016] By filling nitrogen in the cavity, the present invention can improve the protection of the chip, enhance the heat dissipation effect, and enhance the antioxidant ability, making the chip have better use effects. Description of the Drawings

[0017] Figure 1 is a structural schematic diagram of the present invention;

[0018] Figure 2 is a side sectional view of the present invention;

[0019] Figure 3 is an enlarged view of area A of the present invention.

[0020] In the figure: 1. Chip body; 11. Gold wire; 2. Base; 21. Pin; 3. Top cover; 31. Cavity; 32. Air pipe; 4. Unidirectional air intake component; 41. Mounting plate; 411. Elastic piece; 42. Sealing plate; 421. Groove; 422. Through hole; 43. Sealing disc. Detailed implementation mode

[0021] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in different forms and is not limited to the embodiments described in the text. On the contrary, these embodiments are provided to make the disclosure of the present invention more thorough and comprehensive.

[0022] It should be noted that when an element is referred to as being "fixedly provided on" another element, it can be directly on the other element or there can be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are only for the purpose of illustration.

[0023] Unless otherwise defined, all technical and scientific terms used in this article have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention in this article are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this article includes any and all combinations of one or more of the related listed items.

[0024] The following further describes the present invention in detail with reference to the drawings.

[0025] Embodiment 1

[0026] Please refer to Figure 1 - Figure 3 , the present invention provides a packaging structure for a chip, including a chip body 1, a base 2 and a top cover 3; the chip is arranged between the base 2 and the top cover 3. The chip body 1 is provided with a gold wire 11. One end of the gold wire 11 is welded to the contact point of the chip body 1. The base 2 is fixedly installed with pins 21. The other end of the gold wire 11 is welded to the pins 21. A cavity 31 is provided in the top cover 3, and nitrogen gas is provided in the cavity 31. By filling nitrogen gas in the cavity 31, the protection of the chip can be improved, the heat dissipation effect can be enhanced, the antioxidant ability can be improved, and the use effect of the chip can be better.

[0027] It should be noted that filling nitrogen gas is only one method, and gases or liquids with the same effect can also be used.

[0028] Among them, filling with nitrogen is the preferred one. Nitrogen has the characteristics of good heat dissipation and non-conductivity, which can ensure that it will not cause a short circuit to the chip.

[0029] See also Figure 1 : The air pipe 32 and the one-way air inlet assembly 4 are provided to facilitate filling with nitrogen, and the nitrogen will not flow back.

[0030] See also Figure 1 : By arranging the mounting plate 41, the sealing plate 42, the sealing disk 43, the spring piece 411, the groove 421 and the through hole 422, the function of one-way air intake is facilitated.

[0031] A chip packaging method, the chip packaging method steps are as follows:

[0032] Step 1: Place the chip body 1 into the base 2 mold, prepare two portions of epoxy resin, prepare the top cover 3 mold, place the chip into the mold and pour the epoxy resin, and pour another portion of epoxy resin into the top cover 3 mold, after solidification, form the base 2 and the top cover 3, install the top cover 3 into the base 2, and complete the chip packaging;

[0033] Step 2: Open an opening on the rear end surface of the top cover 3, the size of the opening being the same as the inner wall of the trachea 32;

[0034] Step 3: Connect the air pipe 32 to the opening so that the inner wall of the air pipe 32 is completely aligned with the opening;

[0035] Step 4: Inject nitrogen into the cavity 31. During the injection, the sealing disk 43 is pushed by the gas injection nozzle so that the sealing disk 43 squeezes the spring piece 411 and the sealing disk 43 is separated from the groove 421. The nitrogen enters the cavity 31 through the through hole 422, the groove 421, and the channels formed at the upper and lower ends of the mounting plate 41 in sequence. After the nitrogen filling is completed, the gas injection nozzle is separated from the sealing disk 43, the spring piece 411 rebounds, and the sealing disk 43 is pushed into the groove 421 to seal the through hole 422.

[0036] The above is an exemplary description of the present invention in combination with the accompanying drawings. It is obvious that the specific implementation of the present invention is not limited to the above-mentioned method. As long as such non-substantial improvements are made by adopting the method concept and technical solution of the present invention, or the concept and technical solution of the present invention are directly applied to other occasions without improvement, they are all within the protection scope of the present invention.

Claims

1. A packaging structure of a chip, characterized in that: It includes a chip body (1), a base (2) and a top cover (3); The chip is arranged between the base (2) and the top cover (3). The chip body (1) is provided with a gold wire (11). One end of the gold wire (11) is welded to the contact point of the chip body (1). The base (2) is fixedly installed with pins (21). The other end of the gold wire (11) is welded to the pins (21). A cavity (31) is arranged inside the top cover (3), and nitrogen is arranged inside the cavity (31); An air pipe (32) is installed on the rear end face of the top cover (3). The air pipe (32) is communicated with the cavity (31), and a one-way air inlet assembly (4) is arranged inside the air pipe (32); The one-way air inlet assembly (4) includes a mounting plate (41), a sealing plate (42) and a sealing disc (43). The left and right ends of the mounting plate (41) are fixedly connected to the inner wall of the air pipe (32). The upper and lower walls of the mounting plate (41) do not contact the inner wall of the air pipe (32), thus forming a channel. The sealing plate (42) is fixedly installed at the rear end of the mounting plate (41). The outer wall of the sealing plate (42) is fixedly connected to the inner wall of the air pipe (32). A groove (421) is arranged on the front end face of the sealing plate (42). The sealing disc (43) fits with the groove (421). The sealing disc (43) is arranged inside the groove (421). A spring piece (411) is installed on the front end face of the mounting plate (41). The other end of the spring piece (411) is fixedly connected to the front end face of the sealing disc (43). A through hole (422) is arranged on the rear end face of the sealing plate (42). The through hole (422) communicates with the groove (421); The encapsulation method of the above chip encapsulation structure is as follows: Step 1: Place the chip body (1) into the base (2) mold. Prepare two portions of epoxy resin. Prepare the top cover (3) mold. Place the chip into the mold, pour the epoxy resin, and pour the other portion of epoxy resin into the top cover (3) mold. After solidification, form the base (2) and the top cover (3). Install the top cover (3) into the base (2) to complete the encapsulation of the chip; Step 2: Open an opening on the rear end face of the top cover (3). The size of the opening is the same as the inner wall size of the air pipe (32); Step 3: Connect the air pipe (32) to the opening, so that the inner wall of the air pipe (32) is completely aligned with the opening; Step 4: Inject nitrogen into the cavity (31). When injecting, push the sealing disc (43) through the injection nozzle, so that the sealing disc (43) squeezes the spring piece (411) and the sealing disc (43) disengages from the groove (421). Nitrogen sequentially passes through the through hole (422), the groove (421), and the channel formed by the upper and lower ends of the mounting plate (41) and enters the cavity (31). After the nitrogen filling is completed, the injection nozzle disengages from the sealing disc (43), and the spring piece (411) rebounds, pushing the sealing disc (43) into the groove (421) to seal the through hole (422).

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