Laser cutting method

Abstract

The present application relates to the technical field of rigid-flex printed circuit board, and discloses a laser cutting method, which is applied to cutting single rigid-flex printed circuit board on an entire board respectively, the rigid-flex printed circuit board has a flexible area and a rigid area adjacent to the flexible area, and the rigid-flex printed circuit board has a boundary line, the boundary line includes a rigid area boundary line formed by the rigid area. The laser cutting method comprises the following steps: a laser processing device performs laser cutting on the entire board along the rigid area boundary line and the boundary line. The present application solves the technical problem that the rigid-flex printed circuit board is prone to displacement during the remaining cutting process due to partial cutting completion when cutting the rigid-flex printed circuit board, thereby affecting the cutting quality, and reduces the local heat accumulation during laser cutting and improves the cutting quality.

Description

Technical Field

[0001] This invention relates to the technical field of rigid-flex plates, and in particular to a laser cutting method. Background Technology

[0002] With the popularization and promotion of electronic products, the demand for rigid-flex PCBs is increasing. Rigid-flex PCBs combine flexible and rigid PCBs, laminating thin flexible and rigid layers into a single component. Therefore, they are flexible and foldable, allowing for the fabrication of custom circuits, maximizing the use of available indoor space and reducing the overall system footprint.

[0003] When laser-cutting rigid-flex plates, the flexible area is typically cut first, followed by the rigid area; or the rigid area is cut first, followed by the flexible area. In practical applications, the inventors discovered that using this cutting method can lead to displacement of the rigid-flex plate during the remaining cutting process due to partial cutting already being completed, thus affecting the cutting quality. Summary of the Invention

[0004] Based on this, the present invention provides a laser cutting method to solve the technical problems in the prior art where, when cutting rigid-flexible plates, the rigid-flexible plates are prone to displacement during the remaining cutting process because some parts have already been cut, thus affecting the cutting quality and causing local heat accumulation.

[0005] Based on this, the present invention provides a laser cutting method, which is applied to cut individual rigid-flex plates on a whole plate respectively. The rigid-flex plate includes a flexible region and a rigid region adjacent to the flexible region. The rigid-flex plate has a boundary line, which includes a rigid region boundary line formed by the rigid region.

[0006] The laser cutting method includes:

[0007] The laser processing device performs laser cutting on the entire plate along the boundary line of the rigid zone, and also performs laser cutting on the entire plate along the boundary line.

[0008] In one embodiment of the cutting method, the boundary line further includes a flexible region boundary line formed by the flexible region, the flexible region boundary line being connected to the rigid region boundary line, the flexible region boundary line including a first boundary line segment and a second boundary line segment, and the two ends of the rigid region boundary line being connected to the first boundary line segment and the second boundary line segment, respectively; the laser processing device performs laser cutting on the entire plate along the boundary line, specifically including:

[0009] The laser processing device performs laser cutting on the entire plate along the first boundary line, and also performs laser cutting on the entire plate along the rigid zone boundary line, and further performs laser cutting on the entire plate along the second boundary line.

[0010] In one embodiment of the cutting method, the first boundary line includes a first main boundary line and a first buffer boundary line connecting one end of the first main boundary line and one end of the rigid zone boundary line; wherein, the laser processing device performs laser cutting on the entire plate along the rigid zone boundary line, specifically including:

[0011] The galvanometer of the laser processing device vibrates rapidly along the first buffer boundary line to accelerate to the first preset cutting speed, and the laser processing device is in a closed-light state.

[0012] The galvanometer vibrates uniformly along the boundary line of the rigid region at the first preset cutting speed, and the laser processing device is in the light-emitting state.

[0013] In one embodiment of the cutting method, the second boundary line includes a second main boundary line and a second buffer boundary line connecting one end of the second main boundary line and the other end of the rigid zone boundary line; after the galvanometer of the laser processing device vibrates uniformly along the rigid zone boundary line at the first preset cutting speed, the laser processing device performs laser cutting on the entire plate along the rigid zone boundary line, specifically further including:

[0014] The galvanometer vibrates at a reduced speed along the second buffer boundary line, and the laser processing device is in a closed-light state.

[0015] In one embodiment of the cutting method, the rigid region includes a first rigid region and a second rigid region with a thickness greater than the first rigid region; the boundary line of the rigid region includes a first boundary line formed by the first rigid region and a second boundary line formed by the second rigid region; before the laser processing device cuts the entire plate along the boundary line of the rigid region, the cutting method further includes:

[0016] The laser processing device performs laser cutting on the entire plate along the second boundary line.

[0017] In one embodiment of the cutting method, the first boundary line includes a third boundary line and a fourth boundary line, the third boundary line and the fourth boundary line being respectively connected to both ends of the second boundary line; the laser processing device performs laser cutting on the entire plate along the rigid zone boundary line, specifically including:

[0018] The laser processing device cuts the entire plate along the third boundary line at a first preset cutting speed, cuts the entire plate along the second boundary line at the first preset cutting speed, and cuts the entire plate along the fourth boundary line at the first preset cutting speed.

[0019] In one embodiment of the cutting method, the boundary line further includes a flexible region boundary line formed by the flexible region, the flexible region boundary line being connected to the rigid region boundary line, the flexible region boundary line including a first boundary line segment and a second boundary line segment, the first boundary line segment being connected to the third boundary line segment, and the second boundary line segment being connected to the fourth boundary line segment; the laser processing device performs laser cutting on the entire plate along the boundary line, specifically including:

[0020] The laser processing device performs laser cutting on the entire plate sequentially along the first boundary line, the third boundary line, the second boundary line, the fourth boundary line, and the second boundary line at a second preset cutting speed.

[0021] In one embodiment of the cutting method, the third boundary line includes a third main boundary line connected to the first boundary line and a third buffer boundary line connecting one end of the third main boundary line and the second boundary line; the laser processing device performs laser cutting on the entire plate along the second boundary line, specifically including:

[0022] The galvanometer of the laser processing device accelerates and vibrates along the third buffer boundary line to the third preset cutting speed, and the laser processing device is in a closed-light state.

[0023] The galvanometer vibrates uniformly along the second boundary line at the third preset cutting speed, and the laser processing device is in the light-emitting state.

[0024] In one embodiment of the cutting method, the fourth boundary line includes a fourth main boundary line connected to the second boundary line, and a fourth buffer boundary line connecting the other end of the fourth main boundary line and the second boundary line; after the galvanometer of the laser processing device vibrates uniformly along the second boundary line at the third preset cutting speed, the laser processing device performs laser cutting on the entire plate along the second boundary line, specifically further including:

[0025] The galvanometer of the laser processing device decelerates and vibrates along the fourth buffer boundary line, and the laser processing device is in a closed-light state.

[0026] In one embodiment of the cutting method, the first segment boundary line includes a first main boundary line and a first buffer boundary line connecting the first main boundary line and the third segment boundary line;

[0027] Before the laser processing device cuts the entire plate along the third boundary line, the laser processing device performs laser cutting on the entire plate along the rigid zone boundary line, specifically including:

[0028] The galvanometer of the laser processing device accelerates along the first buffer boundary line to the first preset cutting speed, and the laser processing device is in a closed-light state.

[0029] In one embodiment of the cutting method, the second boundary line includes a second main boundary line and a second buffer boundary line connecting the second main boundary line and the fourth boundary line; after the laser processing device cuts the entire plate along the fourth boundary line, the laser processing device performs laser cutting on the entire plate along the rigid zone boundary line, specifically further including:

[0030] The galvanometer vibrates at a reduced speed along the second buffer boundary line, and the laser processing device is in a closed-light state.

[0031] The embodiments of the present invention have the following beneficial effects:

[0032] In this invention, the entire plate is first cut along the boundary line of the rigid zone. It should be noted that this first cutting wheel does not completely separate the rigid zone from the entire plate; its purpose is to reduce the cutting difficulty of the rigid zone, making the cutting difficulty of the rigid zone after one round of cutting essentially the same as that of the flexible zone. Then, the entire plate is cut again along the boundary line. During this first cutting wheel, the laser beam sequentially cuts the rigid and flexible zones along the overall contour of the plate. Both the rigid and flexible zones are cut away from the entire plate during this first cutting wheel, thus avoiding displacement. This technical solution adopts a method of partial contour cutting followed by overall contour cutting, solving the technical problem in the prior art where, when cutting rigid-flexible plates, the plates are prone to displacement during the remaining cutting process due to partial cutting, thus affecting the cutting quality. Furthermore, the adjustment of the cutting sequence allows for the release of locally accumulated heat during laser cutting, reducing heat in the cutting area and improving the cutting quality and processing efficiency of the entire plate. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] in:

[0035] Figure 1 A schematic diagram of the overall structure of the solid plate and the rigid-flexible plate provided according to an embodiment of the present invention is shown;

[0036] Figure 2 A flowchart of a cutting method provided according to an embodiment of the present invention is shown;

[0037] Figure 3 Another flowchart of a cutting method provided according to an embodiment of the present invention is shown;

[0038] Figure 4 Another flowchart of a cutting method provided according to an embodiment of the present invention is shown;

[0039] Figure 5 A flowchart of a cutting method provided according to another embodiment of the present invention is shown;

[0040] Figure 6 Another flowchart of a cutting method provided according to another embodiment of the present invention is shown;

[0041] Figure 7 Another flowchart of a cutting method provided according to another embodiment of the present invention is shown;

[0042] Figure 8 Another flowchart of a cutting method provided according to another embodiment of the present invention is shown;

[0043] Figure 9 Another flowchart of a cutting method provided according to another embodiment of the present invention is shown;

[0044] Figure 10 Another flowchart of a cutting method provided according to another embodiment of the present invention is shown.

[0045] Explanation of key component symbols:

[0046] 100. Rigid-flexible composite plate;

[0047] 10. Rigid zone;

[0048] 11. First rigid region;

[0049] 111. Third boundary line; 1111. Third main boundary line; 1112. Third buffer boundary line;

[0050] 112. Fourth boundary line; 1121. Fourth main boundary line; 1122. Fourth buffer boundary line;

[0051] 12. Second rigid region; 121. Second boundary line;

[0052] 20. Flexible area;

[0053] 21. First boundary line; 211. First main boundary line; 212. First buffer boundary line;

[0054] 22. Second boundary line; 221. Second main boundary line; 222. Second buffer boundary line;

[0055] 200. Whole board. Detailed Implementation

[0056] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many other different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0057] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0058] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0059] The embodiments of the present invention will now be described with reference to the accompanying drawings.

[0060] In existing technologies, when laser-cutting rigid-flex plates, the flexible area is typically cut first, followed by the rigid area; or the rigid area is cut first, followed by the flexible area. In practical applications, the inventors have found that using such cutting methods can lead to displacement of the rigid-flex plate during the remaining cutting process due to partial cutting already being completed, thus affecting the cutting quality. To address this problem, the inventive concept of this application was developed, as illustrated in the following embodiments.

[0061] This invention provides a laser cutting method applicable to cutting individual rigid-flexible plates 100 on a whole plate 200, such as... Figure 1As shown, the rigid-flex plate 100 includes a flexible region 20 and a rigid region 10 adjacent to the flexible region 20. The rigid-flex plate 100 has boundary lines, including a flexible region boundary line formed by the flexible region 20 and a rigid region boundary line formed by the rigid region 10. The rigid region boundary lines are connected to the flexible region boundary lines. It should be noted that the entire plate 200 includes at least a rigid layer and a flexible layer stacked together; therefore, the rigid region 10 is formed by stacking a portion of the rigid layer and a portion of the flexible layer, while the flexible region 20 is formed by a portion of the flexible layer. That is, the rigid region 10 is more difficult to cut than the flexible region 20.

[0062] See Figure 2 In one embodiment, the cutting method of this application may include:

[0063] S1. The laser processing device performs laser cutting on the entire plate 200 along the boundary line of the rigid zone;

[0064] S2. The laser processing device performs laser cutting on the entire plate 200 along the boundary line.

[0065] In this invention, the entire plate 200 is first cut along the boundary line of the rigid region. It should be noted that this round of cutting does not completely separate the rigid region 10 from the entire plate 200; its purpose is to reduce the cutting difficulty of the rigid region 10, making the cutting difficulty of the rigid region 10 after one round of cutting essentially the same as that of the flexible region 20. Then, the entire plate 200 is cut again along the boundary line. During this round of cutting, the laser beam sequentially cuts the rigid region 10 and the flexible region 20 along the overall contour of the entire plate 200. Both the rigid region 10 and the flexible region 20 are cut away from the entire plate 200 during this round of cutting, thus avoiding displacement. This technical solution adopts a method of partial contour cutting followed by overall contour cutting, solving the technical problem in the prior art where, when cutting the rigid-flexible plate 100, the plate is prone to displacement during the remaining cutting process due to partial cutting, thus affecting the cutting quality. Furthermore, the existing cutting methods also suffer from localized heat accumulation. This application also reduces the localized heat accumulation during laser cutting, improving the cutting quality.

[0066] It should be noted that when setting up the laser cutting program, the laser processing path is designed based on the rigid zone boundary line.

[0067] In one embodiment, the rigid layer includes a first rigid layer, meaning that the rigid region 10 is formed by stacking a portion of the first rigid layer and a portion of the flexible layer. See also Figure 1The flexible region boundary line includes a first boundary line 21 and a second boundary line 22. The two ends of the rigid region boundary line are connected to the first boundary line 21 and the second boundary line 22, respectively. Generally, there are at least two rigid regions 10, each with its own rigid region boundary line. One end of the first boundary line 21 and one end of the second boundary line 22 are connected to the two ends of one of the rigid region boundary lines, and the other end of the first boundary line 21 and the other end of the second boundary line 22 are connected to the two ends of the other rigid region boundary line. The following example, using one rigid region 10 and one flexible region 20, illustrates the specific cutting method.

[0068] In some specific embodiments, see Figure 3 The laser processing device performs laser cutting on the entire plate 200 along the boundary line, specifically including:

[0069] S21. The laser processing device performs laser cutting on the entire plate 200 along the first boundary line 21.

[0070] S22. The laser processing device performs laser cutting on the entire plate 200 along the boundary line of the rigid zone;

[0071] S23. The laser processing device performs laser cutting on the entire plate 200 along the second boundary line 22.

[0072] When cutting the overall contour, since the rigid area 10 has been cut once before, a large amount of heat is accumulated in the rigid area 10. Based on this, when cutting the overall contour along the boundary line, the starting point of the cutting is defined. Specifically, the laser processing device first cuts the whole plate 200 along the first boundary line 21, and then cuts the whole plate 200 along the boundary line of the rigid area, so as to allow time for heat dissipation for the rigid area 10, without delaying the cutting time. Finally, it cuts along the second boundary line 22.

[0073] Furthermore, the first boundary line 21 includes a first main boundary line 211 and a first buffer boundary line 212 connecting one end of the first main boundary line 211 and one end of the rigid zone boundary line.

[0074] Therefore, see Figure 4 The laser processing device performs laser cutting on the entire plate 200 along the boundary line of the rigid zone, specifically including:

[0075] S11. The galvanometer of the laser processing device accelerates and vibrates along the first buffer boundary line 212 to the first preset cutting speed, and the laser processing device is in a closed-light state.

[0076] S12. The galvanometer vibrates uniformly along the boundary line of the rigid zone at a first preset cutting speed, and the laser processing device is in the light-emitting state.

[0077] By dividing the first buffer boundary line 212 on the first section boundary line 21, the galvanometer of the laser device can complete acceleration along the first buffer boundary line 212 and only emit light after the acceleration of the galvanometer is completed. Through the cooperation of the acceleration stage corresponding to the first buffer boundary line 212 with the galvanometer and the light shutdown during the acceleration stage, there is no starting mark when cutting along the rigid area boundary line, avoiding the phenomenon of over-cutting due to excessive energy and ensuring the cutting quality.

[0078] In addition, the second section boundary line 22 includes a second main boundary line 221 and a second buffer boundary line 222 connected between one end of the second main boundary line 221 and the other end of the rigid area boundary line.

[0079] See Figure 4 , after the galvanometer vibrates uniformly along the rigid area boundary line at the first preset cutting speed, the laser processing device performs laser cutting on the whole plate 200 along the rigid area boundary line. Specifically, it further includes:

[0080] S13. The galvanometer performs decelerating vibration along the second buffer boundary line 222, and the laser processing device is in the light-shutdown state.

[0081] By dividing the second buffer boundary line 222 on the second section boundary line 22, the galvanometer of the laser device can complete deceleration along the second buffer boundary line 222, and the laser device shuts off the light when the galvanometer starts to decelerate. Through the cooperation of the deceleration stage corresponding to the second buffer boundary line 222 with the galvanometer and the light shutdown during the deceleration stage, there is no ending mark when cutting along the rigid area boundary line, avoiding the phenomenon of over-cutting due to excessive energy and ensuring the cutting quality.

[0082] In some specific embodiments, the cutting power of the laser processing device for laser cutting the whole plate 200 along the rigid area boundary line is P1, and the cutting power of the laser processing device for laser cutting the whole plate 200 along the boundary line is P2; where P1 > P2. As can be seen from the above, the hardness of the rigid area 10 is much greater than that of the flexible area 20. To ensure that the cutting difficulty of the rigid area 10 can be reduced as much as possible when cutting along the rigid area boundary line, the cutting power of the laser needs to be increased, that is, P1 > P2.

[0083] In some specific embodiments, the cutting speed of the laser processing device for laser cutting the whole plate 200 along the rigid area boundary line is V1, which can be understood as the first preset cutting speed, and the cutting speed of the laser processing device for laser cutting the whole plate 200 along the boundary line is V2; where V1 < V2. The cutting power of the laser cannot be increased infinitely. To ensure that the cutting difficulty of the rigid area 10 can be reduced as much as possible when cutting along the rigid area boundary line, in this embodiment, the energy of the laser when cutting the rigid area 10 is increased through time accumulation, and the time accumulation is achieved by slowing down the cutting speed, that is, making V1 < V2.

[0084] In another embodiment, such as Figure 1 As shown, the rigid region 10 also includes a second rigid layer with a thickness greater than the first rigid layer and stacked with it. The boundary line of the rigid region includes a first boundary line formed by the first rigid region 11 and a second boundary line 121 formed by the second rigid region 12. It should be noted that the first rigid region 11 is formed by stacking a portion of the first rigid layer and a portion of the flexible layer; the second rigid region 12 is formed by stacking a portion of the first rigid layer, a portion of the first rigid layer, and a portion of the flexible layer; that is, the second rigid region 12 is more difficult to cut than the first rigid region 11. The second rigid region 12 is generally used as a gold finger. In addition, there are generally at least two first rigid regions 11, which are respectively connected to the two ends of the flexible region 20. Each first rigid region 11 forms a first boundary line connected to the boundary line of the flexible region 20; the second rigid region 12 is generally connected to one of the first rigid regions 11. The following uses the sequentially connected second rigid region 12, one first rigid region 11, and flexible region 20 as examples to illustrate the specific cutting method.

[0085] Based on this, see Figure 5 The cutting method includes:

[0086] S1. The laser processing device performs laser cutting on the entire plate 200 along the second boundary line 121;

[0087] S2. The laser processing device performs laser cutting on the entire plate 200 along the boundary line of the rigid zone;

[0088] S3. The laser processing device performs laser cutting on the entire plate 200 along the boundary line.

[0089] First, the entire plate 200 is cut along the second boundary line 121 of the second rigid zone 12. It should be noted that this cutting process does not completely separate the second rigid zone 12 from the entire plate 200; its purpose is to reduce the cutting difficulty of the second rigid zone 12, making the cutting difficulty of the second rigid zone 12 after one round of cutting essentially the same as that of the first rigid zone 11. Then, the entire plate 200 is cut again along the rigid zone boundary lines, that is, along the first boundary line of the first rigid zone 11 and the second boundary line 121 of the second rigid zone 12. It should be noted that this cutting process does not completely separate the second rigid zone 12 from the first rigid zone 11 from the entire plate 200. The plate 200 is cut open, which reduces the cutting difficulty of the first rigid region 11 and further reduces the cutting difficulty of the second rigid region 12. After this round of cutting, the cutting difficulty of the second rigid region 12, the first rigid region 11 and the flexible region 20 are basically the same. Finally, the entire plate 200 is cut along the boundary line. During this round of cutting, the laser beam cuts the second rigid region 12, the first rigid region 11 and the flexible region 20 in sequence along the overall contour of the entire plate 200. The second rigid region 12, the first rigid region 11 and the flexible region 20 are all cut open relative to the entire plate 200 during this round of cutting, thereby avoiding displacement.

[0090] See Figure 1 The first boundary line includes a third boundary line 111 and a fourth boundary line 112, which are respectively connected to the two ends of the second boundary line 121.

[0091] See Figure 6 The laser processing device performs laser cutting on the entire plate 200 along the boundary line of the rigid zone, including:

[0092] S21. The laser processing device cuts the entire plate 200 along the third boundary line 111 at a first preset cutting speed;

[0093] S22. The laser processing device cuts the entire plate 200 along the second boundary line 121 at a first preset cutting speed;

[0094] S23. The laser processing device cuts the entire plate 200 along the fourth boundary line 112 at a first preset cutting speed.

[0095] When cutting the overall outline of the rigid region 10, since the second rigid region 12 has been cut once before, a large amount of heat is accumulated in the second rigid region 12. Based on this, when cutting the overall outline of the rigid region 10 along the boundary line of the rigid region, the starting point of the cutting is defined. Specifically, the laser processing device first cuts the whole plate 200 along the third boundary line 111 of the first rigid region 11, then cuts the whole plate 200 along the second boundary line 121 of the second rigid region 12, so as to allow time for heat dissipation for the second rigid region 12, without delaying the cutting time. Finally, it cuts along the fourth boundary line 112.

[0096] Among them, see Figure 1 The boundary line of the flexible zone 20 includes a first boundary line 21 and a second boundary line 22. The first boundary line 21 is connected to the third boundary line 111, and the second boundary line 22 is connected to the fourth boundary line 112.

[0097] Based on this, see Figure 7 The laser processing device performs laser cutting on the entire plate 200 along the boundary line, specifically including:

[0098] S31. The laser processing device performs laser cutting on the whole plate 200 along the first boundary line 21 at a second preset cutting speed.

[0099] S32. The laser processing device performs laser cutting on the entire plate 200 along the third boundary line 111 at a second preset cutting speed.

[0100] S33. The laser processing device performs laser cutting on the whole plate 200 along the second boundary line 121 at a second preset cutting speed.

[0101] S34. The laser processing device performs laser cutting on the entire plate 200 along the fourth boundary line 112 at a second preset cutting speed.

[0102] S35. The laser processing device performs laser cutting on the whole plate 200 along the second boundary line 22 at a second preset cutting speed.

[0103] When cutting the overall contour of the rigid-flexible plate 100, since the rigid region 10 (first rigid region 11 and second rigid region 12) has been cut once before, a large amount of heat is accumulated in the rigid region 10. Based on this, when cutting the overall contour along the boundary line of the rigid-flexible plate 100, the starting point of the cutting is defined. Specifically, the laser processing device first cuts the whole plate 200 along the first boundary line 21 of the flexible region 20, and according to the structural characteristics of the first rigid region 11 being sandwiched between the flexible region 20 and the second rigid region 12, it then cuts the whole plate 200 along the third boundary line 111 of the first rigid region 11, then laser-cuts the whole plate 200 along the second boundary line 121 and cuts the whole plate 200 along the fourth boundary line 112 of the first rigid region 11. This allows time for heat dissipation for the first rigid region 11 and the second rigid region 12, without delaying the cutting time. Finally, it cuts along the fourth boundary line 112.

[0104] Further, see Figure 1 The third boundary line 111 includes a third main boundary line 1111 connected to the first boundary line 21, and a third buffer boundary line 1112 connected between one end of the third main boundary line 1111 and the second boundary line 121.

[0105] See Figure 8 The laser processing device performs laser cutting on the entire plate 200 along the second boundary line 121, specifically including:

[0106] S11. The galvanometer of the laser processing device accelerates and vibrates along the third buffer boundary line 1112 to the third preset cutting speed, and the laser processing device is in a closed-light state.

[0107] S12, the galvanometer vibrates uniformly along the second boundary line 121 at a third preset cutting speed, and the laser processing device is in the light-emitting state.

[0108] By dividing the third buffer boundary line 1112 into the third boundary line 111, the galvanometer of the laser device can accelerate along the third buffer boundary line 1112 and emit light only after the galvanometer has completed acceleration. Through the coordination of the acceleration stage of the galvanometer corresponding to the third buffer boundary line 1112 and the light blocking during the acceleration stage, it is achieved that there is no starting mark when cutting along the second boundary line 121, avoiding the phenomenon of excessive energy and overcutting, and ensuring the cutting quality.

[0109] In addition, the fourth boundary line 112 includes a fourth main boundary line 1121 connected to the second boundary line 22, and a fourth buffer boundary line 1122 connecting the other end of the fourth main boundary line 1121 and the second boundary line 121.

[0110] See Figure 8After the galvanometer of the laser processing device vibrates uniformly along the second boundary line 121 at a third preset cutting speed, the laser processing device performs laser cutting on the entire plate 200 along the second boundary line 121, specifically including:

[0111] S13, the galvanometer decelerates and vibrates along the fourth buffer boundary line 1122, and the laser processing device is in a closed-light state.

[0112] By dividing the fourth buffer boundary line 1122 into the fourth boundary line 112, the galvanometer of the laser device can decelerate along the fourth buffer boundary line 1122. The laser device turns off the light when the galvanometer starts to decelerate. Through the coordination of the fourth buffer boundary line 1122 corresponding to the deceleration stage of the galvanometer and the turning off the light during the deceleration stage, it is achieved that there is no end mark when cutting along the second boundary line 121, avoiding the phenomenon of excessive energy and overcutting, and ensuring the cutting quality.

[0113] For example, if the processing power of the laser device is 10W and the third preset cutting speed is set to 600mm / s, then the laser device takes 175us to move along the third buffer boundary line 1112. During this 175us period, the galvanometer of the laser device needs to accelerate the vibration by 600mm / s during the movement process, and the laser device will only emit light after this 175us period.

[0114] The laser device takes 125us to move along the fourth buffer boundary line 1121. During this 175us period, the vibration speed of the galvanometer of the laser device decreases from 600mm / s to 0mm / s, and the laser device stops emitting light before the 125us period.

[0115] For example, if the third preset cutting speed is set to 500 mm / s, and the galvanometer needs to accelerate to 500 mm / s when the laser device moves along the third buffer boundary, then the length of the third buffer boundary line is set to 40.41 μm.

[0116] In some specific embodiments, the first boundary line 21 includes a first main boundary line 211 and a first buffer boundary line 212 connecting the first main boundary line 211 and the third boundary line 111;

[0117] See Figure 9 The laser processing device performs laser cutting on the entire plate 200 along the boundary line of the rigid zone, specifically including:

[0118] S21. The galvanometer of the laser processing device accelerates along the first buffer boundary line 212 to accelerate to the first preset cutting speed, and the laser processing device is in a closed-light state.

[0119] S22. The laser processing device cuts the entire plate 200 along the third boundary line 111 at a first preset cutting speed;

[0120] S23. The laser processing device cuts the entire plate 200 along the second boundary line 121 at a first preset cutting speed;

[0121] S24. The laser processing device cuts the entire plate 200 along the fourth boundary line 112 at a first preset cutting speed.

[0122] By dividing the first buffer boundary line 212 into the first boundary line 21, the galvanometer of the laser device can accelerate along the first buffer boundary line 212 and emit light only after the galvanometer has finished accelerating. Through the coordination of the acceleration stage of the galvanometer corresponding to the first buffer boundary line 212 and the light blocking during the acceleration stage, no starting mark is achieved when cutting along the boundary line of the rigid area, avoiding the phenomenon of excessive energy and overcutting, and ensuring the cutting quality.

[0123] In addition, the second boundary line 22 includes a second main boundary line 221 and a second buffer boundary line 222 connecting the second main boundary line 221 and the fourth boundary line 112.

[0124] See Figure 10 The laser processing device performs laser cutting on the entire plate 200 along the boundary line of the rigid zone, including:

[0125] S21. The galvanometer of the laser processing device accelerates along the first buffer boundary line 212 to accelerate to the first preset cutting speed, and the laser processing device is in a closed-light state.

[0126] S22. The laser processing device cuts the entire plate 200 along the third boundary line 111 at a first preset cutting speed;

[0127] S23. The laser processing device cuts the entire plate 200 along the second boundary line 121 at a first preset cutting speed;

[0128] S24. The laser processing device cuts the entire plate 200 along the fourth boundary line 112 at a first preset cutting speed.

[0129] S25, the galvanometer vibrates at a reduced speed along the second buffer boundary line 222, and the laser processing device is in a closed-light state.

[0130] By dividing the second boundary line 22 into a second buffer boundary line 22, the galvanometer of the laser device can decelerate along the second buffer boundary line 222. The laser device shuts off its light when the galvanometer begins to decelerate. Through the coordination of the second buffer boundary line 222 corresponding to the deceleration stage of the galvanometer and the shut-off of the light during the deceleration stage, no end mark is achieved when cutting along the boundary line of the rigid zone, avoiding the phenomenon of excessive energy and overcutting, and ensuring the cutting quality.

[0131] For example, if the laser power of the laser device is 8W and the first preset cutting speed is set to 800mm / s, then the laser device takes 190us to move along the first buffer boundary line 212. During this 190us period, the galvanometer of the laser device needs to accelerate its vibration to 800mm / s during the movement, and the laser device only emits light after this 190us period. When the laser device moves along the second buffer boundary line 222, it takes 110us. During this 110us period, the vibration speed of the galvanometer of the laser device decelerates from 800mm / s to 0mm / s, and the laser device stops emitting light before this 110us period.

[0132] In some specific embodiments, the laser cutting power of the laser processing device for laser cutting the entire plate 200 along the boundary line of the rigid region is P1, the laser cutting power of the laser processing device for laser cutting the entire plate 200 along the boundary line is P2, and the laser cutting power of the laser processing device for laser cutting the entire plate 200 along the second boundary line 121 is P3; wherein, P3>P1>P2; as mentioned above, the hardness of the first rigid region 11 is much greater than the hardness of the flexible region 20, and the hardness of the second rigid region 12 is greater than the hardness of the first rigid region 11. In order to ensure that the cutting difficulty of the second rigid region 12 can be reduced as much as possible when cutting along the second boundary line 121, the laser cutting power needs to be increased, i.e., P3>P2. In order to ensure that the cutting difficulty of the rigid region 10 can be reduced as much as possible when cutting along the boundary line of the rigid region, the laser cutting power needs to be increased, i.e., P1>P2. Therefore, P3>P1>P2. For example, the value of P1 is 8W, the value of P2 is 7W, and the value of P3 is 10W.

[0133] In some specific embodiments, the cutting speed of the laser processing device for laser cutting the whole plate 200 along the boundary line of the rigid region is V1, which can be understood as the first preset cutting speed. The cutting speed of the laser processing device for laser cutting the whole plate 200 along the boundary line is V2, which can be understood as the second preset cutting speed. The cutting speed of the laser processing device for laser cutting the whole plate 200 along the second boundary line 12 is V3, which can be understood as the third preset cutting speed; where V3 < V1 < V2. The cutting power of the laser is not increased infinitely. To ensure that the cutting difficulty of the second rigid region 12 can be reduced as much as possible when cutting along the second boundary line 121, in this embodiment, the energy of the laser cutting the second rigid region 12 is increased through time accumulation, and the time accumulation is achieved by slowing down the cutting speed, that is, making V3 < V1; To ensure that the cutting difficulty of the rigid region 10 can be reduced as much as possible when cutting along the boundary line of the rigid region, in this embodiment, the energy of the laser cutting the rigid region 10 is increased through time accumulation, and the time accumulation is achieved by slowing down the cutting speed. In this embodiment, the energy of the laser cutting the rigid region 10 is increased through time accumulation, and the time accumulation is achieved by slowing down the cutting speed, that is, making V1 < V2, so V3 < V1 < V2. For example, the value of V1 is 800 mm / s, the value of V2 is 1200 mm / s, and the value of V3 is 600 mm / s.

[0134] The above embodiments only represent several implementation manners of the present invention. Their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims. The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combinations of these technical features do not conflict, they should be considered as the scope described in this specification.

Claims

1. A laser cutting method, characterized by, The laser cutting method is applied to cutting a single rigid-flexible combined board on a whole board respectively, the rigid-flexible combined board comprises a flexible area and a rigid area adjacent to the flexible area, the rigid-flexible combined board has a boundary line, the boundary line comprises a rigid area boundary line formed by the rigid area; The laser cutting method comprises: The laser processing device performs laser cutting on the whole board along the rigid area boundary line, and performs laser cutting on the whole board along the boundary line; Wherein, the laser cutting on the whole board along the rigid area boundary line does not cut the rigid area relative to the whole board, so as to reduce the cutting difficulty of the rigid area.

2. The cutting method according to claim 1, wherein, The boundary line further comprises a flexible area boundary line formed by the flexible area, the flexible area boundary line is connected with the rigid area boundary line, the flexible area boundary line comprises a first section boundary line and a second section boundary line, and two ends of the rigid area boundary line are connected with the first section boundary line and the second section boundary line respectively; the laser processing device performs laser cutting on the whole board along the boundary line, specifically comprising: The laser processing device performs laser cutting on the whole board along the first section boundary line, and performs laser cutting on the whole board along the rigid area boundary line and the second section boundary line.

3. The cutting method according to claim 2, wherein, The first section boundary line comprises a first main boundary line and a first buffer boundary line connected between one end of the first main boundary line and one end of the rigid area boundary line; wherein, the laser processing device performs laser cutting on the whole board along the rigid area boundary line, specifically comprising: The galvanometer of the laser processing device accelerates vibration along the first buffer boundary line to a first preset cutting speed, and the laser processing device is in a light-off state; The galvanometer uniformly vibrates along the rigid area boundary line at the first preset cutting speed, and the laser processing device is in a light-emitting state.

4. The cutting method according to claim 3, wherein, The second section boundary line comprises a second main boundary line and a second buffer boundary line connected between one end of the second main boundary line and the other end of the rigid area boundary line; after the galvanometer uniformly vibrates along the rigid area boundary line at the first preset cutting speed, the laser processing device performs laser cutting on the whole board along the rigid area boundary line, specifically further comprising: The galvanometer decelerates vibration along the second buffer boundary line, and the laser processing device is in a light-off state.

5. The cutting method of claim 1 wherein, The rigid area comprises a first rigid area and a second rigid area with a thickness greater than that of the first rigid area; the rigid area boundary line comprises a first boundary line formed by the first rigid area and a second boundary line formed by the second rigid area; before the laser processing device performs cutting on the whole board along the rigid area boundary line, the cutting method further comprises: The laser processing device performs laser cutting on the whole board along the second boundary line.

6. The cutting method according to claim 5, wherein, The first boundary line comprises a third section boundary line and a fourth section boundary line, and the third section boundary line and the fourth section boundary line are connected at two ends of the second boundary line respectively; the laser processing device performs laser cutting on the whole board along the rigid area boundary line, specifically comprising: The laser processing device cuts the whole plate along the third segment boundary line at a first preset cutting speed, cuts the whole plate along the second boundary line at the first preset cutting speed, and cuts the whole plate along the fourth segment boundary line at the first preset cutting speed.

7. The cutting method according to claim 6, wherein, The boundary line further comprises a flexible area boundary line formed by the flexible area, the flexible area boundary line being connected with the rigid area boundary line, the flexible area boundary line comprising a first segment boundary line and a second segment boundary line, the first segment boundary line being connected with the third segment boundary line, and the second segment boundary line being connected with the fourth segment boundary line; the laser processing device performs laser cutting on the whole plate along the boundary line, specifically comprising: The laser processing device performs laser cutting on the whole plate along the first segment boundary line, the third segment boundary line, the second boundary line, the fourth segment boundary line and the second segment boundary line in sequence at a second preset cutting speed.

8. The cutting method according to claim 7, wherein, The third segment boundary line comprises a third main boundary line connected with the first segment boundary line, and a third buffer boundary line connected between the third main boundary line and one end of the second boundary line; the laser processing device performs laser cutting on the whole plate along the second boundary line, specifically comprising: The galvanometer of the laser processing device accelerates vibration along the third buffer boundary line to a third preset cutting speed, and the laser processing device is in a light-off state; The galvanometer uniformly vibrates along the second boundary line at the third preset cutting speed, and the laser processing device is in a light-on state.

9. The cutting method according to claim 8, wherein, The fourth segment boundary line comprises a fourth main boundary line connected with the second segment boundary line, and a fourth buffer boundary line connected between the fourth main boundary line and the other end of the second boundary line; after the galvanometer of the laser processing device uniformly vibrates along the second boundary line at the third preset cutting speed, the laser processing device performs laser cutting on the whole plate along the second boundary line, specifically further comprising: The galvanometer of the laser processing device decelerates vibration along the fourth buffer boundary line, and the laser processing device is in a light-off state.

10. The cutting method of claim 7, wherein, The first segment boundary line comprises a first main boundary line, and a first buffer boundary line connected between the first main boundary line and the third segment boundary line; before the laser processing device cuts the whole plate along the third segment boundary line, the laser processing device performs laser cutting on the whole plate along the rigid area boundary line, specifically further comprising: The galvanometer of the laser processing device accelerates vibration along the first buffer boundary line to the first preset cutting speed, and the laser processing device is in a light-off state.

11. The cutting method according to claim 10, wherein, The second segment boundary line comprises a second main boundary line, and a second buffer boundary line connected between the second main boundary line and the fourth segment boundary line; after the laser processing device cuts the whole plate along the fourth segment boundary line, the laser processing device performs laser cutting on the whole plate along the rigid area boundary line, specifically further comprising: The galvanometer vibrates at a deceleration along the second buffer boundary line, and the laser processing device is in a light-off state.

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