A single-crystalline silicon rod diamond wire saw cutting device and cutting method

Abstract

The present invention discloses a single-crystal silicon rod diamond wire saw cutting device and a cutting method. The cutting device includes: a loading platform, a mechanical clamping mechanism, a guide wheel cutting mechanism, a blanking platform, a base, a vision detection unit, and a controller; the mechanical clamping mechanism is placed above the loading platform; the guide wheel cutting mechanism includes: a diamond wire saw and a plurality of guide wheels; the plurality of guide wheels are symmetrically arranged, one side of the diamond wire saw is wound around the outside of the plurality of guide wheels, and the guide wheels drive the diamond wire saw to rotate; the loading platform, the mechanical clamping mechanism, the guide wheel cutting mechanism, and the blanking platform are all arranged on the top of the base, and the mechanical clamping mechanism is slidably connected to the base; the vision detection unit is arranged on the top of the base and faces the guide wheel cutting mechanism; the mechanical clamping mechanism, the guide wheel cutting mechanism, and the vision detection unit are respectively connected to the controller. The cutting device of the present invention can avoid chipping during cutting, and the workpiece processing quality is good.

Description

Technical Field

[0001] The present invention relates to the technical field of brittle and hard material cutting, and more specifically to a diamond wire saw cutting device and method for single crystal silicon rods. Background Art

[0002] In the photovoltaic industry, the processes of truncating, squaring, and slicing single crystal silicon rods mostly adopt the diamond wire saw cutting method. Compared with other traditional methods, it has many advantages such as narrow cut seams, high cutting dimension accuracy, and good cutting surface. Due to the pursuit of cutting efficiency in the existing cutting process, relatively large fixed process parameters are mostly used for cutting. As a result, when the cutting of the single crystal silicon rod is almost completed, the cutting force on the single crystal silicon rod will exceed the stress limit, leading to chipping of the crystal rod. The width of the cut seam during the cutting process of the single crystal silicon rod is significantly related to the vibration of the diamond wire saw. A larger amplitude of the diamond wire saw will exacerbate the fluctuation of the cutting trajectory, which is manifested as a wider cut seam on the silicon rod. At the same time, the larger vibration of the wire saw also causes instability in cutting. A large amplitude is likely to cause a large surface waviness on the cutting surface, reducing the surface quality of the cut surface.

[0003] Currently, the high cost of single crystal silicon rod raw materials makes it of great significance to consider solutions to the above problems.

[0004] Therefore, it is an urgent problem for those skilled in the art to develop a diamond wire saw cutting device and method for single crystal silicon rods that can avoid chipping and have good processing quality. Summary of the Invention

[0005] In view of this, the present invention provides a diamond wire saw cutting device and method for single crystal silicon rods that can avoid chipping, have good processing quality, and have good adaptability to workpieces of different sizes within a certain range without changing the structure.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A diamond wire saw cutting device for single crystal silicon rods, comprising:

[0008] A loading platform, on which the workpiece is placed at the top;

[0009] A mechanical clamping mechanism, which is placed above the loading platform;

[0010] A guide wheel cutting mechanism, which includes: a diamond wire saw and a plurality of guide wheels; the plurality of guide wheels are symmetrically arranged, and one side of the diamond wire saw is wound around the outside of the plurality of guide wheels, and the guide wheels drive the diamond wire saw to rotate;

[0011] A unloading platform, and the guide wheel cutting mechanism is arranged between the loading platform and the unloading platform;

[0012] A base, on which the loading platform, the mechanical clamping mechanism, the guide wheel cutting mechanism and the unloading platform are all arranged at the top of the base, and the mechanical clamping mechanism is slidably connected to the base;

[0013] A vision detection unit, which is arranged at the top of the base and is directly opposite to the guide wheel cutting mechanism;

[0014] A controller, to which the mechanical clamping mechanism, the guide wheel cutting mechanism and the vision detection unit are respectively connected.

[0015] The beneficial effects of adopting the above technical solution are that in the present invention, the mechanical clamping mechanism clamps the workpiece from the top of the loading platform, drives the workpiece to be cut at the guide wheel cutting mechanism, and then places the workpiece on the unloading platform after cutting. The vision detection unit can monitor the position of the workpiece in real time and send the information to the controller, making the cutting process of the workpiece more accurate and the processing effect better.

[0016] Preferably, the mechanical clamping mechanism includes: columns, connecting rods and workpiece clamping rods; there are two columns, which are placed on the top of the base and are slidably connected to the base; the connecting rod is arranged between the two columns, and the end of the connecting rod is slidably connected to the column; there are two workpiece clamping rods, and both are slidably connected to the connecting rod.

[0017] Preferably, a base slider is provided at the bottom of the column, and the base slider slides on the top of the base; column sliders are provided at both ends of the connecting rod, and the column sliders slide on the surface of the column. The sliding of the base slider drives the column to move, and the sliding of the column slider drives the connecting rod to move, so as to adjust the position of the workpiece, drive the workpiece to feed parallelly, and thus realize the cutting process of the workpiece.

[0018] Preferably, the workpiece clamping rod is L-shaped and is placed above the loading platform; a workpiece moving slider is provided at the top of the workpiece clamping rod, and the workpiece moving slider slides on the surface of the connecting rod; a clamping member is provided at the other end of the workpiece clamping rod; the clamping members of the two workpiece clamping rods are arranged oppositely, and the workpiece is clamped between the two clamping members. The L-shaped workpiece clamping rod is convenient for moving and adjusting the position on the surface of the connecting rod and is also convenient for clamping the workpiece.

[0019] Preferably, the mechanical clamping mechanism further includes a plurality of servo motors, which are respectively connected to the base slider, the column slider and the workpiece moving slider and drive them to move; the plurality of servo motors are correspondingly connected to servo motor drivers, and the servo motor drivers are connected to the controller.

[0020] Preferably, the guide wheel cutting mechanism further includes a servo motor, which is connected to the guide wheel and drives the guide wheel to rotate; the servo motor is correspondingly connected to a servo motor driver, and the servo motor driver is connected to the controller.

[0021] Preferably, an electrical cabinet is further provided on the top of the base, and the servo motor, the servo motor driver, the vision detection unit, and the controller are respectively connected to the electrical cabinet.

[0022] A cutting method for a single crystal silicon rod diamond wire saw cutting device includes the following cutting steps:

[0023] 1) Set the transverse length of the workpiece single crystal silicon rod as L and the longitudinal width as W. The vision detection unit detects the position of the workpiece and sends the information to the controller. The controller calculates the displacement amounts of the base slider, the column slider, and the workpiece moving slider, and sends the displacement amount information to the corresponding servo motor driver to control the corresponding servo motor. After the mechanical clamping mechanism moves to the workpiece position, the workpiece is clamped along the transverse length L direction of the workpiece;

[0024] 2) The mechanical clamping mechanism drives the workpiece to move horizontally to a position 30%-50%L away from the diamond wire saw cutting position;

[0025] 3) After the vision detection unit obtains the upper and lower edges of the workpiece and the upper and lower boundaries of the guide wheel at the cutting position, the mechanical clamping mechanism drives the workpiece to rotate and move longitudinally to ensure that there is no interference between the workpiece and the upper and lower boundaries of the guide wheel during subsequent cutting;

[0026] 4) Use the first given feed speed set in the controller to perform the first-stage cutting, and the mechanical clamping mechanism drives the workpiece to feed horizontally to cut one side of the workpiece;

[0027] 5) When the controller detects that the remaining cutting section length is 5%L, use the second given feed speed set in the PLC to perform the second-stage cutting, and the mechanical clamping mechanism drives the workpiece to feed horizontally for cutting until the workpiece cutting is completed;

[0028] 6) After the workpiece cutting is completed, the mechanical clamping mechanism rotates the workpiece to the horizontal position and transports the workpiece to the top of the blanking platform.

[0029] The beneficial effect of adopting the above technical solution is that in the present invention, the workpiece is cut after being tilted, which increases the contact length of the diamond wire saw. The vibration amplitude of the diamond wire saw decreases as the contact length between the diamond wire saw and the workpiece increases. This improves the service life of the diamond wire saw, makes the cutting seam of the cut workpiece narrower, and also improves the surface quality of the cut workpiece.

[0030] Preferably, in step 3), the upper edge line and lower edge line of the workpiece are obtained through the vision detection unit, the dotted line of the lower boundary of the guide wheels is calculated by the lowest edge points of the upper row of guide wheels in the guide wheel cutting mechanism, and the dotted line of the upper boundary of the guide wheels is calculated by the uppermost edge points of the lower row of guide wheels in the guide wheel cutting mechanism, and the information is sent to the controller; the controller calculates the movement amounts of the workpiece moving slider and the column sliding block according to the information of the upper edge line, lower edge line, the dotted line of the lower boundary of the guide wheels and the dotted line of the upper boundary of the guide wheels to adjust the posture of the workpiece, preventing the workpiece from interfering with the guide wheels during subsequent cutting. The controller sends the calculated displacement information to the servo motor driver to control the corresponding servo motor to work, driving the workpiece moving slider and the column sliding block to move to the specified position.

[0031] Preferably, in steps 4) and 5), the controller sets the feed speed, calculates the synchronous movement amount of the base slider, and transmits the output information to the servo motor controller corresponding to the base slider. The servo motor controller controls the corresponding servo motor to drive the base slider to move, thereby controlling the feed speed of the column to drive the workpiece to move during cutting.

[0032] As can be seen from the above technical solutions, compared with the prior art, the present invention discloses a single crystal silicon rod diamond wire saw cutting device and a cutting method, and its beneficial effects are as follows:

[0033] (1) Adjust the position of the workpiece, and then perform cutting after it is in an inclined state, increasing the contact length with the diamond wire saw during cutting. The vibration amplitude of the diamond wire saw decreases as the contact length between the diamond wire saw and the workpiece increases. The vibration of the diamond wire saw is reduced, the service life of the diamond wire saw is improved, the cutting seam of the cut workpiece becomes narrower, and the surface quality of the workpiece is better;

[0034] (2) By significantly reducing the feed speed of the workpiece when the workpiece cutting is about to be completed, the cutting force on the workpiece is reduced. Since the workpiece is cut obliquely, the contact length between the workpiece and the diamond wire saw continuously decreases, and the workpiece is in a gradually unloaded state. The gradually decreasing shear stress avoids the workpiece edge chipping phenomenon caused by the shear stress exceeding the shear strength due to the fixed force when not inclined.

[0035] (3) The vision detection unit can detect the inclination angle of workpieces of different sizes, and can adapt to the cutting of workpieces of different sizes and obtain better cutting quality without changing the mechanical structure, having good processing adaptability;

[0036] (4) The mechanical clamping mechanism is flexible in operation and can drive the workpiece to perform a planar movement to any suitable blanking position. Description of the Drawings

[0037] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the provided drawings.

[0038] Figure 1 Structural schematic diagram of the cutting device provided by the present invention;

[0039] Figure 2 Schematic diagram of the state structures of different stages of the workpiece and the guide wheel cutting mechanism provided by the present invention;

[0040] Figure 3 Top view of the cutting device provided by the present invention;

[0041] Figure 4 Schematic diagram of the control system of the cutting device provided by the present invention.

[0042] Among them, in the figure,

[0043] 1 - Loading platform;

[0044] 2 - Mechanical clamping mechanism;

[0045] 21 - Column; 22 - Connecting rod; 23 - Workpiece clamping rod; 24 - Base slider; 25 - Column sliding block; 26 - Workpiece moving slider; 27 - Clamping piece;

[0046] 3 - Guide wheel cutting mechanism;

[0047] 31 - Diamond wire saw; 32 - Guide wheel;

[0048] 4 - Unloading platform; 5 - Base; 6 - Electrical cabinet; 7 - Upper edge line of the workpiece; 8 - Lower edge line of the workpiece; 9 - Dashed line of the lower boundary of the guide wheel; 10 - Dashed line of the upper boundary of the guide wheel; 11 - Vision camera. Detailed implementation manners

[0049] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0050] An embodiment of the present invention discloses a single - crystal silicon rod diamond wire saw cutting device, including:

[0051] A loading platform 1, with the workpiece placed on the top of the loading platform 1;

[0052] The mechanical clamping mechanism 2 is placed above the loading platform 1;

[0053] The guide wheel cutting mechanism 3 includes: a diamond wire saw 31 and a plurality of guide wheels 32; the plurality of guide wheels 32 are symmetrically arranged, one side of the diamond wire saw 31 is wound around the outside of the plurality of guide wheels 32, and the guide wheels 32 drive the diamond wire saw 31 to rotate;

[0054] The unloading platform 4, and the guide wheel cutting mechanism 3 is arranged between the loading platform 1 and the unloading platform 4;

[0055] The base 5, the loading platform 1, the mechanical clamping mechanism 2, the guide wheel cutting mechanism 3 and the unloading platform 4 are all arranged on the top of the base 5, and the mechanical clamping mechanism 2 is slidably connected to the base 5;

[0056] The vision detection unit is arranged on the top of the base 5 and faces the guide wheel cutting mechanism 3;

[0057] The controller, the mechanical clamping mechanism 2, the guide wheel cutting mechanism 3 and the vision detection unit are respectively connected to the controller. The vision detection unit includes a vision camera 11. By facing the guide wheel cutting mechanism 3 through the vision camera 11, the position of the workpiece can be detected. The controller selects a PLC controller.

[0058] To further optimize the above technical solution, the mechanical clamping mechanism 2 includes: a column 21, a connecting rod 22 and a workpiece clamping rod 23; there are two columns 21, the columns 21 are placed on the top of the base 5 and are slidably connected to the base 5; the connecting rod 22 is arranged between the two columns 21, and the end of the connecting rod 22 is slidably connected to the column 21; there are two workpiece clamping rods 23, and both are slidably connected to the connecting rod 22.

[0059] To further optimize the above technical solution, a base slider 24 is provided at the bottom of the column 21, and the base slider 24 slides on the top of the base 5; column sliders 25 are provided at both ends of the connecting rod 22, and the column sliders 25 slide on the surface of the column 21. The positions of the two column sliders 25 are different, and the inclination angle of the workpiece can be adjusted. The two base sliders 24 drive the two columns 21 to move, and then drive the workpiece to move horizontally.

[0060] To further optimize the above technical solution, the workpiece clamping rod 23 is L-shaped and is placed above the loading platform 1; a workpiece moving slider 26 is provided at the top of the workpiece clamping rod 23, and the workpiece moving slider 26 slides on the surface of the connecting rod 22; a clamping member 27 is provided at the other end of the workpiece clamping rod 23; the clamping members 27 of the two workpiece clamping rods 23 are arranged oppositely, and the workpiece is clamped between the two clamping members 27.

[0061] To further optimize the above technical solution, the mechanical clamping mechanism 2 further includes a plurality of servo motors. The plurality of servo motors are respectively connected to the base slider 24, the column slider 25, and the workpiece moving slider 26, and drive them to move. The plurality of servo motors are correspondingly connected to servo motor drivers, and the servo motor drivers are connected to the controller. The servo motors control the base slider 24, the column slider 25, and the workpiece moving slider 26 to move. The servo motor drivers receive signals from the controller and control the corresponding servo motors.

[0062] To further optimize the above technical solution, the guide wheel cutting mechanism 3 further includes a servo motor. The servo motor is connected to the guide wheel 32 and drives the guide wheel 32 to rotate. The servo motor is correspondingly connected to a servo motor driver, and the servo motor driver is connected to the controller. The servo motor controls the guide wheel 32 to rotate. The servo motor driver receives signals from the controller and controls the corresponding servo motor.

[0063] To further optimize the above technical solution, an electrical cabinet 6 is further provided on the top of the base 5. The servo motors, the servo motor drivers, the vision detection unit, and the controller are respectively connected to the electrical cabinet. The electrical cabinet supplies power to each electrical structure.

[0064] A cutting method for a single crystal silicon rod diamond wire saw cutting device includes the following cutting steps:

[0065] 1) Set the horizontal length of the workpiece single crystal silicon rod as L and the vertical width as W. The vision detection unit detects the center positions of the front and rear clamping end faces of the workpiece and sends the information to the controller. The controller calculates the displacement amounts of the base slider 24, the column slider 25, and the workpiece moving slider 26, and sends the displacement amount information to the corresponding servo motor drivers to control the corresponding servo motors. After the mechanical clamping mechanism 2 moves to the workpiece position, it clamps the workpiece along the horizontal length L direction of the workpiece.

[0066] 2) The controller calculates the synchronous movement amount of the base slider 24, sends the information to the corresponding servo motor driver, and controls the corresponding servo motor to act, driving the workpiece to move horizontally to a position 29%L away from the cutting position 29 of the diamond wire saw 31.

[0067] 3) After the vision detection unit obtains the upper and lower edge positions of the workpiece and the upper and lower boundary positions of the cutting position guide wheel 32, the mechanical clamping mechanism 2 drives the workpiece to rotate and move longitudinally to ensure that there is no interference between the workpiece and the upper and lower boundaries of the guide wheel during subsequent cutting.

[0068] 4) Perform the first-stage cutting at a first given feed speed of 30 mm / min set in the controller. The mechanical clamping mechanism 2 drives the workpiece to feed horizontally to cut one side of the workpiece.

[0069] 5) When the controller detects that the remaining cutting segment length is 5%L, the second given feed rate of 3 mm / min set in the PLC is used for the second-stage cutting. The mechanical clamping mechanism 2 drives the workpiece to feed horizontally for cutting until the workpiece cutting is completed;

[0070] 6) After the workpiece cutting is completed, the vision camera 11 detects the position of the blanking platform 4 and sends the information to the controller. The controller calculates the movement amount of the workpiece moving slider 26 on the connecting rod 22, the movement amount of the column sliding block 25, and the synchronous movement amount of the base slider 24, and sends the information to the corresponding servo motor driver, and controls the corresponding servo motor to act to convey the workpiece to the top of the blanking platform 4.

[0071] Figure 2 The state diagrams of S1 - S5 correspond to the state diagrams of the workpiece cutting process in steps 2) to 6).

[0072] To further optimize the above technical solution, in step 3), the upper edge line 7 of the workpiece, the lower edge line 8 of the workpiece are obtained through the vision detection unit, the virtual guide wheel lower boundary line 9 formed by the lowest edge points of the upper row of guide wheels in the guide wheel cutting mechanism is calculated, the virtual guide wheel upper boundary line 10 formed by the uppermost edge points of the lower row of guide wheels in the guide wheel cutting mechanism is calculated, and the information is sent to the controller; according to the information of the upper edge line 7 of the workpiece, the lower edge line 8 of the workpiece, the virtual guide wheel lower boundary line 9 and the virtual guide wheel upper boundary line 10, the controller calculates the movement amounts of the workpiece moving slider 26 and the column sliding block 25 to adjust the posture of the workpiece to prevent the workpiece from interfering with the guide wheel 32 in subsequent cutting. The controller sends the calculated displacement information to the servo motor driver to control the corresponding servo motor to work and drive the workpiece moving slider 26 and the column sliding block 25 to move to the specified position.

[0073] To further optimize the above technical solution, in steps 4) and 5), the controller sets the feed rate, calculates the synchronous movement amount of the base slider 24, and transmits the output information to the servo motor controller corresponding to the base slider 24. The servo motor controller controls the corresponding servo motor to drive the base slider 24 to move, thereby controlling the feed rate of the column 21 to drive the workpiece to move during cutting.

[0074] In the research process, it is found that the cutting edge chipping of single crystal silicon rods mostly occurs at the end of cutting, which is caused by the small shear strength of single crystal silicon; the cutting width during the cutting process of single crystal silicon rods is significantly related to the surface quality and the vibration of the diamond wire saw. Due to the large vibration amplitude of the diamond wire saw, the excessive cutting increases the cutting width, and the fluctuation of the cutting trajectory leads to the decline of the surface quality of the cut workpiece. Therefore, in step 3), step 4), and step 5) of the present invention, segmented cutting is carried out; in step 4) and step 5, the vibration amplitude of the diamond wire saw decreases as the contact length between the diamond wire saw and the workpiece increases. In step 3), the contact length between the inclined workpiece and the diamond wire saw during cutting is greater than that before inclination, thus reducing the wire saw vibration, increasing the wire saw life, making the cutting width of the cut workpiece narrower, and the surface quality of the workpiece better; in step 5), when the workpiece cutting is about to be completed, the feeding speed of the workpiece is reduced, reducing the force exerted on the workpiece by the diamond wire saw. Due to the inclination, the contact length between the workpiece and the diamond wire saw continuously decreases, and the workpiece is in a gradually unloading state. The gradually decreasing shear stress avoids the chipping phenomenon of the crystal rod caused by the shear stress exceeding the shear strength due to the fixed force without inclination.

[0075] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same or similar parts among the various embodiments, reference can be made to each other.

[0076] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A single-crystal silicon rod diamond wire saw cutting device, characterized in that, Including: A loading platform (1) with workpieces placed on top of the loading platform (1); A mechanical clamping mechanism (2) placed above the loading platform (1). The mechanical clamping mechanism (2) includes: columns (21), connecting rods (22), and workpiece clamping rods (23). There are two columns (21) which are placed on top of a base (5) and are slidably connected to the base (5). The connecting rod (22) is arranged between the two columns (21), and the end of the connecting rod (22) is slidably connected to the column (21). There are two workpiece clamping rods (23), both of which are slidably connected to the connecting rod (22). At the bottom of the column (21) there is a base slider (24) which slides on top of the base (5). At both ends of the connecting rod (22) there are column sliders (25) which slide on the surface of the column (21). The positions of the two column sliders (25) are different, capable of adjusting the inclination angle of the workpiece. The two base sliders (24) drive the two columns (21) to move, thereby driving the workpiece to move horizontally. Adjust the position of the workpiece, and after it is in an inclined state, cut it. When the workpiece cutting is almost completed, greatly reduce the workpiece feed speed; A guide wheel cutting mechanism (3) which includes: a diamond wire saw (31) and multiple guide wheels (32). The multiple guide wheels (32) are symmetrically arranged. One side of the diamond wire saw (31) is wound around the outside of the multiple guide wheels (32), and the guide wheels (32) drive the diamond wire saw (31) to rotate; A blanking platform (4) with the guide wheel cutting mechanism (3) arranged between the loading platform (1) and the blanking platform (4); A base (5) with the loading platform (1), the mechanical clamping mechanism (2), the guide wheel cutting mechanism (3), and the blanking platform (4) all arranged on top of the base (5). The mechanical clamping mechanism (2) is slidably connected to the base (5); A vision detection unit arranged on top of the base (5) and facing the guide wheel cutting mechanism (3); A controller, with the mechanical clamping mechanism (2), the guide wheel cutting mechanism (3), and the vision detection unit respectively connected to the controller.

2. The single-crystalline silicon rod diamond wire saw cutting equipment according to claim 1, wherein, The workpiece clamping rod (23) is L-shaped and placed above the loading platform (1). At the top of the workpiece clamping rod (23) there is a workpiece moving slider (26) which slides on the surface of the connecting rod (22). At the other end of the workpiece clamping rod (23) there is a clamping piece (27). The clamping pieces (27) of the two workpiece clamping rods (23) are arranged oppositely, and the workpiece is clamped between the two clamping pieces (27).

3. The single-crystal silicon rod diamond wire saw cutting equipment according to claim 2, characterized in that, The mechanical clamping mechanism (2) further includes multiple servo motors which are respectively connected to the base slider (24), the column slider (25), and the workpiece moving slider (26) and drive them to move; The multiple servo motors are correspondingly connected to servo motor drivers, and the servo motor drivers are connected to the controller.

4. A monocrystalline silicon rod diamond wire saw cutting device according to claim 1, characterized in that The guide wheel cutting mechanism (3) further includes a servo motor, which is connected to the guide wheel (32) and drives the guide wheel (32) to rotate; the servo motor is correspondingly connected to a servo motor driver, and the servo motor driver is connected to the controller.

5. A single-crystalline silicon rod diamond wire saw cutting device according to claim 3 or 4, characterized in that, An electrical cabinet (6) is further provided on the top of the base (5), and the servo motor, the servo motor driver, the vision detection unit, and the controller are respectively connected to the electrical cabinet.

6. A cutting method using a single-crystalline silicon rod diamond wire saw cutting device according to any one of claims 1-5, characterized in that, The following cutting steps are included: 1) Set the horizontal length of the workpiece single crystal rod as L and the vertical width as W. The vision detection unit detects the position of the workpiece and sends the information to the controller. The controller calculates the displacement amounts of the base slider (24), the column slider (25), and the workpiece moving slider (26), and sends the displacement amount information to the corresponding servo motor driver to control the corresponding servo motor. After the mechanical clamping mechanism (2) moves to the workpiece position, the workpiece is clamped along the horizontal length L direction of the workpiece. 2) The mechanical clamping mechanism (2) drives the workpiece to move horizontally to a position 30%-50%L away from the cutting position of the diamond wire saw (31). 3) After the vision detection unit obtains the upper and lower edge positions of the workpiece and the upper and lower boundary positions of the cutting position guide wheel (32), the mechanical clamping mechanism (2) drives the workpiece to rotate and move longitudinally to ensure that there is no interference between the workpiece and the upper and lower boundaries of the guide wheel during subsequent cutting. 4) The first given feed speed set in the controller is used for the first-stage cutting, and the mechanical clamping mechanism (2) drives the workpiece to feed horizontally to cut one side of the workpiece. 5) When the controller detects that the remaining cutting section length is 5%L, the second given feed speed set in the PLC is used for the second-stage cutting, and the mechanical clamping mechanism (2) drives the workpiece to feed horizontally for cutting until the workpiece cutting is completed. 6) After the workpiece cutting is completed, the mechanical clamping mechanism (2) rotates the workpiece to the horizontal position and conveys the workpiece to the top of the blanking platform (4). The first given feed speed is 30 mm / min; the second given feed speed is 3 mm / min.

7. The cutting method of a single-crystal silicon rod diamond wire saw cutting device according to claim 6, characterized in that, In step 3), the upper edge line (7) of the workpiece, the lower edge line (8) of the workpiece, the dotted line of the lower boundary of the guide wheel (9) formed by calculating the lowest edge points of the upper row of guide wheels in the guide wheel cutting mechanism, and the dotted line of the upper boundary of the guide wheel (10) formed by calculating the uppermost edge points of the lower row of guide wheels in the guide wheel cutting mechanism are obtained through the vision detection unit, and the information is sent to the controller; the controller calculates the movement amounts of the workpiece moving slider (26) and the column slider (25) according to the information of the upper edge line (7) of the workpiece, the lower edge line (8) of the workpiece, the dotted line of the lower boundary of the guide wheel (9), and the dotted line of the upper boundary of the guide wheel (10) to adjust the posture of the workpiece to prevent the workpiece from interfering with the guide wheel (32) during subsequent cutting. The controller sends the calculated displacement information to the servo motor driver to control the corresponding servo motor to work and drive the workpiece moving slider (26) and the column slider (25) to move to the specified position.

8. The cutting method of a single-crystalline silicon rod diamond wire saw cutting device according to claim 6, characterized in that, In steps 4) and 5), the controller sets the feed rate, calculates the synchronous movement amount of the base slider (24), transmits the output information to the servo motor controller corresponding to the base slider (24), and the servo motor controller controls the corresponding servo motor to drive the base slider (24) to move, thereby controlling the feed rate at which the column (21) drives the workpiece to move during cutting.

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