A spray liquid circulation treatment device and a copper foil surface treatment system

Abstract

The present invention provides a spray liquid circulation treatment device, including a pickling tank for receiving the spray liquid used in the surface treatment of copper foil; an electrolytic tank, the inlet of which is communicated with the outlet of the pickling tank to electrolyze the high-concentration Cu<supgt;2+< / supgt; in the spray liquid in the form of metallic copper; a turbulent flow electrolytic circulation tank and a turbulent flow electrolytic device which are communicated, the inlet of the turbulent flow electrolytic circulation tank is communicated with the overflow port of the electrolytic tank, and the turbulent flow electrolytic device can stabilize the Cu<supgt;2+< / supgt> concentration of the spray liquid at 2-3 g / L; and a coarse filter and a fine filter which are communicated, wherein the inlet of the coarse filter is communicated with the outlet of the turbulent flow electrolytic device, and the outlet of the fine filter is communicated with the inlet of the pickling tank. The present invention solves the problem that the Cu<supgt;2+< / supgt> concentration in the pickling solution gradually increases, reduces the number of times of wiping the conductive roller, reduces the waste of copper foil, prolongs the continuous working time of the surface treatment machine, and improves the yield.

Description

Technical Field

[0001] The present invention relates to the technical field of copper foil surface treatment, and particularly relates to a spray liquid circulation treatment device and a copper foil surface treatment system. Background Art

[0002] Electrolytic copper foil is widely used in industries such as new energy batteries and 5G communications due to its comprehensive advantages such as excellent electrical conductivity, rich resources, easy processing, and low cost. In recent years, due to the increasingly serious environmental pollution and energy crisis, the development and use of new energy are particularly important, and electrolytic copper foil production enterprises have achieved unprecedented development, and the market demand for electrolytic copper foil is also increasing day by day. The production of electrolytic copper foil mainly includes five processes: copper melting, foil making, solution making, surface treatment, and slitting. Among them, surface treatment is the key technology in the copper foil production process, that is, the green foil from the foil making process is transported to the surface treatment machine, and after steps such as pre-washing, pickling, roughening, curing, heat-resistant barrier layer, anti-oxidation layer, organic treatment, and drying, it is then slit and packaged into finished products. In the above process, roughening and curing are important steps that determine the key performance of the copper foil. Curing is divided into two steps of curing, which are respectively called the first curing and the second curing. Roughening and the second curing are prone processes of copper plating on the conductive roller, which makes it easy for the copper foil surface to generate surface defects such as black spots, bright spots, and pits.

[0003] During the operation of the surface treatment equipment, the conductive roller is always in a working state and is always in contact with the conductive roller spray liquid. During the process of rinsing the green foil, the copper content in the spray liquid will gradually increase, resulting in an increased risk of copper plating on the conductive roller. Once copper particles adhere to the conductive roller, when the copper particles run into contact with the conductive roller, the solution at that point will be extruded, resulting in no liquid film protection at that point, causing problems such as easy oxidation, and the conductivity at that point is different from that of the normal part during the subsequent surface treatment process, resulting in different corrosion resistance and other properties between that point and other surfaces of the copper foil. Copper plating on the conductive roller occurs in different treatment processes, and the resulting consequences are also different, thus resulting in surface defects such as black spots, bright spots, and pits.

[0004] Since the pickling solution, spray on the foil, spray under the foil, and spray on the conductive roller all used roughening solution before, with a copper content of 8 - 14 g / L. During the pickling process, the pickling solution washes away CuO on the copper foil surface, resulting in an increase in the Cu 2+ concentration in the pickling solution; on the other hand, the Cu 2+ concentration in the curing solution is as high as 45 - 55 g / L. After the first curing process, since the squeezing roller cannot completely squeeze out the curing solution remaining on the copper foil surface, the curing solution containing a high concentration of Cu 2+ remaining on the copper foil surface will be washed by the spray on the foil, spray under the foil, and spray on the conductive roller during the second curing process and enter the pickling solution circulation tank together, resulting in a further increase in the Cu 2+ concentration.

[0005] Cu2+ High concentration is the main factor for copper plating on the conductive roller. To eliminate this influence, usually, the conductive roller is regularly wiped with sandpapers of different precisions to reduce copper plating on the surface of the conductive roller. After processing 2 - 5 rolls of copper foil, it is necessary to wipe the conductive roller with sandpaper to prevent copper crystallization on its surface, which is time-consuming and laborious. If there is a problem during the operation of the machine, it is also necessary to stop the machine, connect the spare foil, start the machine, and one person controls the exposure of the wiped part of the conductive roller by tearing the foil at the unwinding place, while two others cooperate to wash and wipe the conductive roller with water at the same time. The process is cumbersome, requires multiple people to cooperate, and will reduce the continuous working time of the surface treatment machine. In addition, each time the machine is restarted, about 70m of unqualified products will be produced. Therefore, wiping the conductive roller will also cause waste of copper foil. The more times the conductive roller is wiped, the more serious the copper foil waste is, and the yield cannot be improved. Summary of the Invention

[0006] The present invention provides a spray liquid circulation treatment device and a copper foil surface treatment system for reducing copper plating on the surface of a conductive roller and improving the surface treatment efficiency of copper foil, especially related to improving the continuous working time of the surface treatment machine.

[0007] To solve the above technical problems, the present invention adopts the following technical solutions:

[0008] A spray liquid circulation treatment device includes:

[0009] An acid pickling tank for receiving the spray liquid used for copper foil surface treatment;

[0010] An electrolytic tank, the inlet of which is connected to the outlet of the acid pickling tank, and electrolyzes the high-concentration Cu in the spray liquid 2+ in the form of metallic copper;

[0011] A turbulent flow electrolytic circulation tank and a turbulent flow electrolytic device connected in communication, the inlet of the turbulent flow electrolytic circulation tank is connected to the overflow port of the electrolytic tank, and the turbulent flow electrolytic device can stabilize the Cu 2+ concentration in the spray liquid at 2 - 3 g / L; and

[0012] A coarse filter and a fine filter connected in communication, wherein the inlet of the coarse filter is connected to the outlet of the turbulent flow electrolytic device, and the outlet of the fine filter is connected to the inlet of the acid pickling tank.

[0013] Further, the electrolytic tank includes a box body, in which at least one set of oppositely arranged anode plates and cathode plates are provided. One side of the box body is provided with an inlet, the other side of the box body is provided with an overflow port and a sewage discharge port. The height of the overflow port is greater than that of the inlet, and the height of the sewage discharge port is lower than that of the inlet.

[0014] Also provided is a copper foil surface treatment system, including a pickling device, a roughening device, a first curing device and a second curing device connected in sequence. Wherein trays are arranged below the on-foil spraying, under-foil spraying and conductive roller spraying of the roughening device and the second curing device, and the trays are connected to the spraying liquid circulation treatment device described in any one of claims 1-4.

[0015] As can be seen from the above technical solutions, the present invention reforms and optimizes the treatment of the on-foil spraying, under-foil spraying and conductive roller spraying liquid of the roughening device and the second curing device of the surface treatment equipment, and solves the problem that the Cu 2+ concentration in the pickling solution gradually increases. At the same time, the number of times of wiping the conductive roller is reduced, the waste of copper foil is reduced, the continuous working time of the surface treatment machine is extended, and the yield is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of the spraying liquid circulation treatment device of the present invention;

[0017] Figure 2 is a schematic structural diagram of the electrolytic cell in the present invention;

[0018] Figure 3 is a schematic structural diagram of the turbulent flow electrolysis equipment in the present invention;

[0019] Figure 4 is a schematic structural diagram of the copper foil surface treatment system of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0020] The following will give a detailed description of a preferred embodiment of the present invention with reference to the drawings.

[0021] The spraying liquid circulation treatment device of the present invention mainly reforms the roughening device of the copper foil surface treatment equipment and the on-foil spraying, under-foil spraying and conductive roller spraying processes in the second curing process. By adding an electrolytic cell to preliminarily electrolyze the spraying liquid, the high-concentration Cu in the electrolytic solution 2+ can be electrolyzed out in the form of metallic copper. After secondary electrolysis by the turbulent flow electrolysis equipment, the Cu 2+ concentration can be stabilized at 2-3 g / L.

[0022] Such as Figure 1As shown in the figure, the spray liquid circulation treatment device 30 includes a pickling tank 18, an electrolytic tank 19, a turbulent electrolysis circulation tank 6, a turbulent electrolysis device 9, a coarse filter 15, and a fine filter 16 that are connected in sequence. The water outlet 20 of the pickling tank 18 is connected to the liquid inlet 1 of the electrolytic tank 19, the overflow outlet 4 of the electrolytic tank 19 is connected to the liquid inlet 7 of the turbulent electrolysis circulation tank 6, the liquid outlet 8 of the turbulent electrolysis circulation tank 6 is connected to the liquid inlet 10 of the turbulent electrolysis device 9, the liquid outlet 13 of the turbulent electrolysis device 9 is connected to the liquid inlet 14 of the coarse filter 15, the coarse filter 15 is connected to the fine filter 16, and the liquid outlet 17 of the fine filter 16 is connected to the liquid inlet 21 of the pickling tank 18, thus forming a complete technological process.

[0023] As Figure 2 shown in the figure, the electrolytic tank 19 includes a box body 191, and two groups of oppositely arranged anode plates 2 and cathode plates 3 are arranged in the box body. The anode plate 2 is made of titanium and iridium, and the cathode plate 3 is made of 316L stainless steel.

[0024] One side of the box body 191 is provided with a liquid inlet 1, and the other side of the box body is provided with an overflow outlet 4 and a sewage outlet 5. The height of the overflow outlet 4 is greater than that of the liquid inlet 1, and the height of the sewage outlet 5 is lower than that of the liquid inlet 1. During operation, the anode plate is connected to the positive pole of the power supply, and the cathode plate is connected to the negative pole of the power supply. The total current is 200 - 500A, preferably 300 - 400A.

[0025] Referring to the attached Figure 3 , the cathode plate 12 of the turbulent electrolysis device 9 has an area of 0.25m 2 , is made of 316L stainless steel, and the anode 11 is coated with titanium and precious metals. By controlling the direction and flow rate of the electrolyte entering, the electrolyte spirals upward, reducing concentration polarization and weakening the influence of PH, and then enters the filter system from the liquid outlet 13.

[0026] As Figure 4 shown in the figure, the present invention also provides a copper foil surface treatment system. The original pickling solution, spraying on the foil, spraying under the foil, and spraying on the conductive roller during the second curing process are all changed to dilute sulfuric acid. The copper foil surface treatment system includes a pickling device 40, a roughening device 50, a first curing device 60, and a second curing device 70 that are connected in sequence. Among them, trays 80 are arranged below the spraying on the foil, spraying under the foil, and spraying on the conductive roller of the roughening device 50 and the second curing device 70. The trays are connected to the pickling tank 18 of the above spray liquid circulation treatment device 30 through pipelines, and the pickling tank 18 is used to receive the spray liquid used for copper foil surface treatment.

[0027] The above-described embodiments are only descriptions of the preferred embodiments of the present invention, and do not limit the scope of the present invention. Without departing from the design spirit of the present invention, various deformations and improvements made by those of ordinary skill in the art to the technical solutions of the present invention shall fall within the protection scope determined by the claims of the present invention.

Claims

1. A spray liquid circulation treatment device, characterized in that, Comprising: A pickling tank for receiving the spraying liquid used for copper foil surface treatment; Electrolytic cell, the liquid inlet of the electrolytic cell is communicated with the water outlet of the pickling tank, and high-concentration Cu in the spray liquid is 2+ electrolyzed out in the form of metallic copper; Connected turbulent electrolysis circulation tank and turbulent electrolysis equipment, the liquid inlet of the turbulent electrolysis circulation tank is connected to the overflow port of the electrolysis tank, and the turbulent electrolysis equipment can stabilize the Cu 2+ concentration of the spray liquid at 2-3 g / L; and A connected coarse filter and a fine filter, wherein the liquid inlet of the coarse filter is connected to the liquid outlet of the turbulent electrolysis device, and the liquid outlet of the fine filter is connected to the liquid inlet of the pickling tank.

2. The spray liquid circulation treatment device according to claim 1, characterized in that The electrolytic cell includes a box body, in which at least one set of oppositely arranged anode plates and cathode plates are arranged. A liquid inlet is provided on one side of the box body, and an overflow port and a sewage discharge port are provided on the other side of the box body. The height of the overflow port is greater than that of the liquid inlet, and the height of the sewage discharge port is lower than that of the liquid inlet.

3. The spray liquid circulation treatment device according to claim 2, characterized in that, The current magnitude accessed by the anode plate and the cathode plate is 200 - 500A.

4. The spray liquid circulation treatment device according to claim 1, characterized in that The spraying liquid is dilute sulfuric acid.

5. A copper foil surface treatment system, characterized in that, Including a pickling device, a roughening device, a first curing device, and a second curing device connected in sequence. Among them, trays are arranged below the on-foil spraying, under-foil spraying, and conductive roll spraying of the roughening device and the second curing device, and the trays are connected to the spraying liquid circulation treatment device according to any one of claims 1 - 4.

6. The copper foil surface treatment system according to claim 5, characterized in that, The tray is communicated with the pickling tank through a pipeline.

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