LED light panels

Abstract

A light-emitting diode (LED) light panel comprises a substrate, a plurality of LEDs, and a colloid layer. The substrate has a plurality of adjacent light-emitting areas. The LEDs are located in the light-emitting areas, respectively. The colloid layer is disposed on the light-emitting areas. The LEDs are disposed between the substrate and the colloid layer and are covered by the colloid layer. The colloid layer in any of the light-emitting areas has a plurality of grooves, and the grooves expose the upper surface of the substrate corresponding to the grooves. At least a portion of the grooves in any of the light-emitting areas surround the corresponding LED. The LED light panel of the present invention has a good light-emitting effect.

Description

Technical Field

[0001] The present invention relates to a light emitting device, and in particular to a light emitting diode (LED) light panel. Background Art

[0002] Most display devices use flat-panel display modules to display images. For non-self-luminous display media, a backlight module is required to provide a light beam. Common backlight modules can be mainly divided into edge-entry backlight modules and direct-type backlight modules. Direct-type backlight modules require the use of more light-emitting diodes, resulting in a higher price. In order to reduce the number of light-emitting diodes, optical films are used to increase the amount of forward light and the uniformity of the light output. However, optical films increase the thickness and cost of the backlight module, and there will also be alignment tolerances during assembly, which may fail to produce the expected effect.

[0003] The "Background" section is intended only to facilitate understanding of the present invention. Therefore, the information disclosed in this section may contain information that is not generally known to those skilled in the art. The information disclosed in this section does not imply that the information or the problems to be solved by one or more embodiments of the present invention were known or understood by those skilled in the art prior to the filing of this application. Summary of the Invention

[0004] The present invention provides a light emitting diode lamp panel with good light emitting effect.

[0005] According to one embodiment of the present invention, a light-emitting diode (LED) light panel is provided, comprising a substrate, a plurality of LEDs, and a colloid layer. The substrate has a plurality of adjacent light-emitting regions. The LEDs are spaced apart on the substrate and located in each of the light-emitting regions. The colloid layer is disposed on the light-emitting regions, with the LEDs disposed between the substrate and the colloid layer and covered by the colloid layer. The colloid layer in each of the light-emitting regions has a plurality of grooves, with the grooves exposing the upper surface of the substrate. At least a portion of the grooves in each of the light-emitting regions surrounds the corresponding LED.

[0006] Based on the above, the LED light panel provided in the embodiment of the present invention uses a colloidal layer and a groove structure to guide light. Compared with the accumulated tolerances of each optical film layer in the prior art, the process method can be used to minimize the position deviation between the LED and the groove, thereby achieving better light uniformity and reducing the number of LEDs set.

[0007] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1AFIG. 1 is a schematic diagram of a light emitting diode (LED) light panel according to an embodiment of the present invention.

[0009] Figure 1B It is along Figure 1A Cross-sectional view of line segment AA'.

[0010] Figure 2 FIG. 1 is a schematic diagram of a light emitting diode (LED) light panel according to an embodiment of the present invention.

[0011] Figure 3 FIG. 1 is a schematic diagram of a light emitting diode (LED) light panel according to an embodiment of the present invention. DETAILED DESCRIPTION

[0012] The foregoing and other technical aspects, features, and benefits of the present invention will be more clearly understood in the following detailed description of a preferred embodiment with reference to the accompanying drawings. Directional terms such as up, down, left, right, front, and back, used in the following embodiments, are merely references to the accompanying drawings. Therefore, the directional terms used are for illustrative purposes only and are not intended to limit the present invention.

[0013] Reference Figure 1A and Figure 1B The light-emitting diode light board 1 includes a substrate 100, a plurality of light-emitting diodes 20A to 20D, and a colloid layer 200. The substrate 100 has a plurality of light-emitting areas 10A to 10D arranged adjacent to each other. The light-emitting diodes 20A to 20D are arranged at intervals on the substrate 100 and are respectively located in the light-emitting areas 10A to 10D. The colloid layer 200 is configured on the light-emitting areas 10A to 10D, and the light-emitting diodes 20A to 20D are arranged between the substrate 100 and the colloid layer 200 and are covered by the colloid layer 200, wherein the colloid layer 200 is, for example, a light-transmitting adhesive material. The colloid layer 200 of the light-emitting areas 10A to 10D all has a plurality of grooves 201, and these grooves 201 expose the upper surface 100U of the substrate 100. The grooves 201 of the light-emitting area 10A at least partially surround the light-emitting diode 20A, and the grooves 201 of the light-emitting area 10B at least partially surround the light-emitting diode 20B. The grooves 201 of the light-emitting region 10C at least partially surround the light-emitting diode 20C, and the grooves 201 of the light-emitting region 10D at least partially surround the light-emitting diode 20D.

[0014] In one embodiment of the present invention, LEDs 20A, 20B, 20C, and 20D may be sub-millimeter light-emitting diodes (mini LEDs). Due to the small size of the pins of mini LEDs, after they are mounted on substrate 100, they may become detached due to impact during transportation, causing them to fail. In this embodiment, a colloid layer 200 is used to cover the mini LEDs, thereby increasing their maximum push-pull force resistance and preventing damage to the LED light panel 1 during transportation.

[0015] exist Figure 1A In the embodiment shown, the LED light board 1 is illustrated as having four light-emitting areas 10A to 10D on a substrate 100, and the light-emitting areas 10A to 10D are arranged on the substrate 100 in a 2×2 array. The light-emitting diodes 20A to 20D are respectively arranged on the light-emitting areas 10A to 10D. The line connecting the light-emitting diode 20A corresponding to the light-emitting area 10A and the light-emitting diode 20B corresponding to the light-emitting area 10B is orthogonal to the line connecting the light-emitting diode 20A corresponding to the light-emitting area 10A and the light-emitting diode 20C corresponding to the light-emitting area 10C. That is, the line connecting the light-emitting diode 20A corresponding to the light-emitting area 10A and the light-emitting diode 20B corresponding to the light-emitting area 10B is parallel to the light-emitting area 10A. Figure 1A In the direction D1, the line connecting the light emitting diode 20A corresponding to the light emitting area 10A and the light emitting diode 20C corresponding to the light emitting area 10C is parallel to Figure 1A The direction D2 is perpendicular to the direction D1. However, the present invention is not limited thereto. In other embodiments, the LED light panel 1 may have M×N light-emitting areas and M×N corresponding light-emitting diodes, that is, one light-emitting area corresponds to one light-emitting diode, M and N are positive integers, and M may be equal to or different from N, and the lines connecting different light-emitting diodes may not be orthogonal to each other.

[0016] like Figure 1A As shown, each groove 201 is rectangular in the plan view (top view of the LED light board 1), and each groove 201 has at least one light-facing side wall 201W, which is defined as the side wall of the groove 201 facing or closest to the corresponding LED 20A, 20B, 20C or 20D. Figure 1A and Figure 1B . The light beam L1 emitted by the light-emitting diode 20A travels in the colloidal layer 200 corresponding to the light-emitting area 10A. The light beam L1 that travels to the light-facing side wall 201W of the groove 201 will undergo a change in behavior because the refractive index of the colloidal layer 200 is different from the refractive index of the air. For example, it will be reflected at the light-facing side wall 201W and continue to travel in the colloidal layer 200, or it will be refracted at the light-facing side wall 201W and emitted from the colloidal layer 200 of the groove 201. The above-mentioned change in the behavior of the light beam L1 depends on the refractive index of the colloidal layer 200, the angle between the light-facing side wall 201W and the upper surface 100U of the substrate 100, the angle between the light beam L1 and the light-facing side wall 201W, and the roughness of the light-facing side wall 201W. In other words, the luminous characteristics of the light-emitting diode light board 1 can be changed by appropriately designing the light-facing side wall 201W.

[0017] In this embodiment, the light-emitting diodes 20A to 20D are covered by the colloidal layer 200 and all emit light laterally. In addition, each groove 201 penetrates the colloidal layer 200 and exposes the upper surface 100U of the substrate 100 corresponding to the groove 201, that is, each groove 201 is filled with air and has no colloidal layer. The depth of each groove 201 is at least greater than the height of the corresponding light-emitting diode 20A, 20B, 20C or 20D, wherein the depth of each groove 201 refers to the distance from the upper surface 100U of the substrate 100 to the upper surface (unnumbered) of the colloidal layer 200 in the direction D3, and the height of the light-emitting diode 20A, 20B, 20C or 20D refers to the distance from the upper surface 100U of the substrate 100 to the upper surface (unnumbered) of the light-emitting diode in the direction D3. In this case, referring to Figure 1B The light beam L1 traveling to the light-facing side wall 201W will be reflected or refracted by the light-facing side wall 201W, and will not pass through the groove 201 and be incident on the Figure 1B That is, by providing the groove 201 penetrating the colloidal layer 200, the light beams emitted by the LEDs 20A-20D can be blocked, so that the light is confined to the light-emitting areas 10A-10D corresponding to the LEDs 20A-20D.

[0018] Therefore, if Figure 1A As shown, a plurality of grooves 201 are provided between the connection line of LED 20A and LED 20B. A plurality of grooves 201 are provided between the connection line of LED 20A and LED 20C. A plurality of grooves 201 are provided between the connection line of LED 20A and LED 20D. Similarly, a plurality of grooves 201 are provided between the connection line of LED 20B and LED 20C. A plurality of grooves 201 are provided between the connection line of LED 20B and LED 20D. A plurality of grooves 201 are provided between the connection line of LED 20C and LED 20D. The above configuration utilizes the "light confinement" property of the grooves 201 to prevent the light emitted by LEDs 20A to 20D from coupling with each other and reduce the halo phenomenon. In some embodiments of the present invention, the grooves 201 are configured to surround the corresponding LEDs 20A, 20B, 20C or 20D to fully prevent light from being coupled between different light-emitting areas 10A, 10B, 10C and 10D.

[0019] exist Figure 1AIn the illustrated embodiment, the light-facing sidewalls 201W of two adjacent grooves 201 are also designed. Specifically, the grooves 201 extending through the colloidal layer 200 in each of the light-emitting areas 10A-10D are arranged adjacent to each other, such that an angle θ1 is formed between the light-facing sidewalls 201W of two adjacent grooves 201. In some embodiments of the present invention, the angle θ1 ranges from 77 degrees to 103 degrees. In some embodiments of the present invention, the angle θ1 ranges from 85 degrees to 95 degrees, or is a right angle of 90 degrees. By utilizing the above-mentioned design, the direction of travel of the light beam L1 after being reflected at the light-facing side wall 201W is controlled to increase the length of the travel path of the light beam L1 in the colloidal layer 200, thereby improving the brightness uniformity of the LED light board 1, and the light-facing side walls 201W of the two adjacent grooves 201 are designed to have a specific angle θ1 range, so that the light beam L1 incident on one of the light-facing side walls 201W along a transmission direction will be reflected to the other light-facing side wall 201W, and then reflected by the other light-facing side wall 201W and travel in the opposite direction of the transmission direction, thereby confining the light beam L1 emitted by the light-emitting diodes 20A~20D to their respective corresponding light-emitting areas 10A~10D. In addition, as Figure 1A As shown, the distances between different grooves 201 and their corresponding LEDs 20A, 20B, 20C or 20D can be different, so that the LED light board 1 can achieve desired luminous characteristics.

[0020] In this embodiment, an angle θ2 is formed between the light-facing sidewall 201W and the exposed upper surface 100U of the substrate 100 , as shown in FIG. Figure 1B As shown. The amount of light emitted from the light-facing side wall 201W can be controlled by controlling the size of the angle θ2, so that the light-emitting diode light board 1 can achieve the desired luminous characteristics. In some embodiments of the present invention, the angle θ2 falls within the range of 90 degrees to 110 degrees. In some embodiments of the present invention, the angle θ2 falls within the range of 95 degrees to 105 degrees. If the angle θ2 between the light-facing side wall 201W and the exposed upper surface 100U of the substrate 100 is 90 degrees, it means that the light-facing side wall 201W and the exposed upper surface 100U of the substrate 100 are perpendicular to each other, and the upper surface 100U of the substrate 100 is parallel to Figure 1B The direction D1 in the image, the light-facing side wall 201W is parallel to Figure 1B Direction D3.

[0021] In some embodiments of the present invention, Figure 1ATaking the LED light board 1 of the present invention as an example, the substrate 100 is, for example, a printed circuit board (PCB), the LEDs 20A, 20B, 20C, and 20D are, for example, sub-millimeter LEDs, and the colloid layer 200 is, for example, a UV curing adhesive. The LEDs 20A to 20D are fixed on the substrate 100, and then a UV curing adhesive (colloid layer 200) is coated on the substrate 100 and the LEDs 20A to 20D. Maskless exposure is performed on the UV curing adhesive (colloid layer 200) based on an image of a preset position having a plurality of grooves 20, and then development is performed to remove the adhesive in the grooves 201 at the preset position. Then, the UV curing adhesive (colloid layer 200) is subjected to a second curing (postcuring), thereby obtaining the LED light board 1 of the present invention.

[0022] In order to fully illustrate the various embodiments of the present invention, other embodiments of the present invention will be described below. It must be noted that the following embodiments use the component numbers and some of the content of the previous embodiments, wherein the same reference numerals are used to represent the same or similar components, and the description of the same technical content is omitted. For the description of the omitted parts, please refer to the previous embodiments, and the following embodiments will not be repeated.

[0023] Reference Figure 2 and Figure 3 , which illustrates a plan view of a light emitting diode light board according to an embodiment of the present invention. It should be noted that, for the convenience of explanation, Figure 2 and Figure 3 Only part of the LED light panel is shown.

[0024] exist Figure 2 In FIG. 1 , the light emitting diode light board 2 includes a substrate (not shown), light emitting diodes 20, and a colloid layer 200. The colloid layer 200 covers the light emitting diodes 20 and has a plurality of grooves 201A. Figure 1A and Figure 1B In the embodiment shown, the light-facing sidewalls 201W of two adjacent grooves 201A have an included angle θ1 therebetween. Figure 1A and Figure 1B The embodiment shown is different in that the groove 201A is a triangle in the plan view (top view of the LED light board 2), and the light-facing side wall 201W corresponds to one side of the triangle, that is, the light-facing side wall 201W corresponds to one surface of the triangular groove.

[0025] exist Figure 3 In the embodiment, the light emitting diode light board 3 includes a substrate (not shown), light emitting diodes 20 and a colloid layer 200. The colloid layer 200 covers the light emitting diodes 20 and has a plurality of grooves 201B. Figure 1A and Figure 1B The illustrated embodiment differs in that the groove 201B is circular in the plan view (top view of the LED panel 3), with the light-facing sidewall 201W corresponding to a portion of the circumference of the circle. Tangents to the light-facing sidewalls 201W of two adjacent grooves 201B form an angle θ1. The grooves of the embodiments of the present invention are not limited to the rectangular, triangular, and circular shapes described above; in other embodiments, the grooves may be other polygonal shapes.

[0026] In summary, the LED light board provided by the embodiments of the present invention utilizes a colloid layer to cover the LEDs, thereby increasing the maximum push-pull forces the LEDs can withstand. Furthermore, the LED light board utilizes a colloid layer and a groove structure to guide light. Compared to the tolerances accumulated by each optical film layer in the prior art, this manufacturing method can minimize the positional deviation between the LEDs and the grooves, achieving better light uniformity. This reduces the number of LEDs and optical film layers required, thereby reducing costs.

[0027] The foregoing description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All simple equivalent variations and modifications made in accordance with the claims and description of the present invention are still within the scope of the present invention. Furthermore, no embodiment or claim of the present invention is required to achieve all of the objectives, advantages, or features disclosed herein. Furthermore, the abstract and title are intended solely to assist in searching patent documents and are not intended to limit the scope of the present invention. Furthermore, the terms "first," "second," etc., mentioned in the specification are merely used to designate component names and are not intended to limit the upper or lower limits on the number of components.

[0028] Description of Reference Numerals

[0029] 1, 2, 3: LED light panels

[0030] 10A, 10B, 10C, 10D: Luminous area

[0031] 20, 20A, 20B, 20C, 20D: Light-emitting diodes

[0032] 100:Substrate

[0033] 100U: Upper surface

[0034] 200:Colloid layer

[0035] 201, 201A, 201B: groove

[0036] 201W: side wall facing the light

[0037] D1, D2, D3: Direction

[0038] L1: Beam

[0039] θ1, θ2: angles.

Claims

1. A light emitting diode light board, characterized in that: include: A substrate, a plurality of light-emitting diodes and a colloid layer; wherein, The substrate has a plurality of adjacently arranged light-emitting areas; The plurality of light emitting diodes are arranged on the substrate at intervals and are respectively located in the plurality of light emitting areas; The colloid layer is a UV-curable adhesive and is disposed on the plurality of light-emitting areas. The plurality of light-emitting diodes are disposed between the substrate and the colloid layer and are covered by the colloid layer. The colloid layer of any of the plurality of light-emitting areas has a plurality of grooves, and the plurality of grooves expose the upper surface of the substrate. At least a portion of the plurality of grooves of any of the plurality of light-emitting areas surrounds the corresponding light-emitting diode. Any of the multiple grooves has a light-facing side wall facing the corresponding light-emitting diode. In a cross-section parallel to the substrate, the multiple grooves are arranged adjacent to each other in pairs, and the two light-facing side walls of the two adjacent grooves are adjacent and have an angle therebetween, and the angle is in the range of 77 degrees to 103 degrees.

2. The light emitting diode lamp panel according to claim 1, characterized in that: Any one of the plurality of grooves has a light-facing side wall facing the corresponding light-emitting diode, and an angle is formed between the light-facing side wall and the exposed upper surface of the substrate, and the angle is in a range of 90 degrees to 110 degrees.

3. The light emitting diode lamp panel according to claim 1, characterized in that: The distances between the plurality of grooves and the corresponding light emitting diodes are different.

4. The light emitting diode lamp panel according to claim 1, characterized in that: The depth of any one of the plurality of grooves is at least greater than the height of the corresponding light emitting diode.

5. The light emitting diode lamp panel according to claim 1, characterized in that: At least one of the plurality of grooves is provided between two adjacent lines connecting the plurality of light emitting diodes.

6. The light emitting diode lamp panel according to claim 1, characterized in that: Any of the plurality of light emitting diodes emits light sideways.

7. The light emitting diode lamp panel according to claim 1, characterized in that: A horizontal projection of the plurality of grooves on the substrate is at least one of a circle, a triangle, a rectangle or a polygon.

8. The light emitting diode lamp panel according to claim 1, characterized in that: The light emitting diode is a sub-millimeter light emitting diode (mini LED).

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