Energy-saving method for cooling GPU chip and the like by closed cycle high-pressure cold gas

Abstract

The energy-saving method for cooling GPU chip by closed cycle high-pressure cold gas, in the circulating gas sealed loop, the cooling gas for cooling GPU chip and radiator becomes the heat-absorbed gas, the heat-absorbed gas is divided into high-temperature gas and low-temperature gas by a heat pump, the high-temperature gas is cooled by a cooling device, and then is mixed with the low-temperature gas to form the cooling gas for heat dissipation, and the cooling gas is reused for heat dissipation. Advantage: the cooling gas can be recycled, the temperature of the cooling gas is reduced without increasing energy consumption, the GPU can work in a better temperature environment, the inert gas sealed cycle solves the pollution and oxidation problems, improves the temperature difference, saves the energy consumption of water spray cooling, the GPU works in a better state, protects the GPU chip from the influence of fog and dew, saves energy, reduces noise and improves operation efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of computer server cooling technology, in particular to an energy-saving cooling method using closed-cycle high-pressure cold air flow to efficiently cool GPU, which can recycle refrigeration energy and reduce noise without using fans. BACKGROUND

[0002] At present, the main methods for cooling the GPU [or CPU, motherboard, circuit board, etc.] of a computer server are air cooling and liquid cooling.

[0003] Regarding the air cooling method, the fan draws air from the indoor cold gas in the environment outside the cabinet of the computer room, which is used to cool the GPU above 40℃. The disadvantages are low efficiency, high cost, and large fan noise in the use of indoor cold gas refrigeration energy. The reasons are as follows: first, if the temperature of the computer room environment is 10℃, a large amount of space in the computer room will be unnecessarily cooled, which will consume a lot of energy, and the temperature difference between the computer room operator entering and leaving the computer room will be large, which will easily cause illness; second, if the temperature of the computer room environment is 35℃, the cooling effect on the GPU will be very poor, which will easily cause the GPU and other heat generating components to overheat and shut down, or even be damaged; third, if the temperature of the commonly used computer room environment is 25℃, the temperature difference between the cold air 25℃ and the GPU 40℃ is small, so the fan needs to be large and functional to generate rapid airflow, which will cause large noise in the computer room, affect the operation personnel, and damage the server due to vibration.

[0004] However, the existing air cooling device can cause the dust in the air to enter the inside of the device and corrode the chip, thereby reducing the service life of the chip. In addition, long-term placement can cause some dust to accumulate inside the cooling port, which can cause the dust to enter the inside of the device and contaminate the chip, thereby affecting the use of the chip.

[0005] The liquid cooling method can solve the problems of large fan noise, air corrosion of the chip and motherboard, but the following liquid cooling methods have different defects:

[0006] The server chip gravity type heat pipe and heat pipe backboard combined server heat dissipation system and device of Sichuan Chengguan Energy Saving and Environmental Protection Technology Co., Ltd. 202020343248.9 relates to a server chip gravity type heat pipe and heat pipe backboard combined server heat dissipation system and device. A gravity type heat pipe chip radiator is arranged in a data center to realize server chip level heat dissipation. Heat pipe backboard heat dissipation units are used for auxiliary heat dissipation, effectively improving the space utilization efficiency of the data center, arranging more servers, improving economic benefits, and achieving the purpose of energy saving. The system has the characteristics of high heat exchange efficiency, low thermal resistance, low energy consumption, fast heat exchange response speed, high reliability, low noise, long service life, etc. The chip level cooling technology is combined with the outdoor cooling unit to directly and more reasonably and efficiently dissipate heat from the server chip. The heat pipe backboard cooling technology is combined with the outdoor cooling unit to directly and more reasonably and efficiently dissipate heat from other heat sources other than the server chip. The technical characteristics of this patent are that an evaporator containing liquid refrigerant is arranged on the chip or the server shell. Since the liquid refrigerant becomes gaseous refrigerant after absorbing heat, the liquid refrigerant is sucked out into the refrigeration device to become liquid refrigerant again. The technical defects are that the liquid refrigerant or gaseous refrigerant is sealed in the box, and the box directly contacts the chip or server shell. Once the box or pipeline has a hole gap to leak the liquid refrigerant or gaseous refrigerant, it will damage the chip and server and cause the data center to stop working, which is a high risk. This equipment is complex and has high cost. If the cooling liquid leaks, it will damage the GPU and circuit board.

[0007] A new type of integrated high-density GPU heat dissipation method is disclosed in China Patent 201610058267.5 of Inspur Information Technology Co., Ltd. The specific implementation process is as follows: first, the server system is divided into two independent heat dissipation spaces by a board card, the GPU display card is placed in the upper space, and the exchange chip is placed in the lower space, and the two independent spaces are cooled by the heat dissipation fan arranged at the rear of the server case; the GPU display card in the upper layer is cooled by the heat dissipation fan arranged at the rear of the server case; the gap between the front row of GPU display cards is connected to the gap between the corresponding rear row of GPU display cards through the air duct cover. Compared with the prior art, the new type of integrated high-density GPU heat dissipation method solves the problem of heat dissipation of the rear GPU display card through the layered architecture and the isolated heat dissipation design, and ensures the heat dissipation of the exchange chip, thereby ensuring the optimal heat dissipation of the entire server system; the independent air duct cover can highly integrate the display card, and is widely applicable and can be applied to the heat dissipation design of all electronic products. The patent solves the problem of uniform heat dissipation of multiple GPU display cards at different positions in a case, but the air cooling gas used for heat dissipation is still the gas in the computer room. The temperature permission range of the C-level computer room gas is 10-35℃, and the lower the temperature is, the more energy is consumed in a large space, such as 10℃ in the computer room environment. If the temperature in the computer room environment is 35℃, the heat dissipation effect of the GPU is poor, and the GPU chip and other heat generating components are easily damaged.

[0008] A new type of server heat dissipation design method for high-density integrated display cards is disclosed in China Patent 201510901883.8 of Inspur Information Technology Co., Ltd. The technical problem to be solved by the present application is how to satisfy the heat dissipation of high-power GPU cards while ensuring the heat dissipation of high-power exchange chips. The technical solution comprises the following steps: 1. Position of display card: high-power display cards are placed in the system, half in the front row and half in the rear row; the display cards in the front and rear rows are placed at the same height, and the display cards in the front and rear rows are staggered; 2. Heat dissipation channel: containing two independent air ducts, channel A and channel B; 3. 1U space of server case system for placing exchange module: separated from the upper 3U space.

[0009] In summary, the cooling liquid immersion cooling method uses expensive cooling liquid and complex equipment, and it is not convenient to remove the repair from the immersion liquid, and the cost is higher. If the cooling liquid leaks, the cooling liquid will cause damage to the GPU and the circuit board. SUMMARY

[0010] The purpose of the present application is to provide a sealed gas circulation cooling method for GPU chips and the like, in which gaseous refrigerant, i.e., cooling gas, directly contacts the chips, the cooling gas is repeatedly cooled and absorbs heat in a circulation system, and unused refrigeration energy is not lost, thereby saving electricity, efficiently using energy for refrigeration, reducing noise in a machine room, keeping GPU chips and the like clean, lowering the operating temperature of GPU chips and the like, and increasing the actual computing power of GPU chips and the like.

[0011] The gaseous refrigerant, i.e., cooling gas, in the summary of the present application refers to air, and preferably inert gas, such as nitrogen or carbon oxide gas.

[0012] The GPU chips and the like in the present application refer to GPU chips, CPU chips, and heat sinks on chips, and are simply referred to as GPU chips for the sake of simplicity.

[0013] GPU refers to GPU chips or CPU chips, which are heat-generating calculators, and is simply referred to as GPU for the sake of simplicity.

[0014] GPU box 4 refers to a box or cabinet body in which GPU chips or CPU chips are installed, and has an air inlet and an air outlet.

[0015] Air pressure pump refers to an air compressor, which is the same meaning.

[0016] High-pressure cooling gas refers to high-pressure cooling gas, high-pressure cooling gas, high-pressure cooling gas, and high-pressure cooling gas, which refer to the same concept, and are used in different words for the sake of convenience in different places. The high pressure of the high-pressure cooling gas is greater than one atmosphere to a pressure slightly smaller than the pressure of an ordinary household high-pressure pot, so that the gas flow rate of the blown-out gas to the GPU chips and the like is 5-40 m / s. Due to the influence of the size, length, and bending of the gas pipe from the high-pressure cooling gas tank to the GPU chips and the like, different pressure values are adopted, so the specific meaning of high pressure is recommended to be a variable pressure in the range of 105-150 KPa. The cooling gas is a refrigeration gas with a recommended temperature of 10-17°C lower than the ambient temperature output by a refrigeration device. Compared with the negative pressure of the fan, the high pressure of the high-pressure cooling gas in the present application means that the refrigeration gas has a positive pressure. The fan power of the GPU box and the case is limited due to noise and vibration problems in the existing fan negative pressure air extraction and heat dissipation technology, and the fan power is limited. The sound and vibration of the air pressure pump generating positive pressure can be placed outside the machine room, and the power of the air pressure pump will not be limited due to sound and vibration. The size of the positive pressure can be greater than the size of the negative pressure generated by the fan, and can provide higher pressure and faster airflow than the fan.

[0017] Closed cycle refers to: closed GPU cooling system and closed gas cooling system consisting of cooling and cooling combined system; that is, the gas refrigeration energy is closed in the system and is recycled in the energy-saving system.

[0018] The present application suggests that the temperature of various circulating positions of gas is: the heat-absorbed gas in the GPU box 4 is 25-35℃, the low-temperature gas separated by the heat pump 40 is 5-17℃, the high-temperature gas separated by the heat pump 40 is 60-65℃, the external environment temperature gas, or the normal temperature gas, discharged by the cooling device 41, and the cooling gas for GPU cooling, which is sucked and discharged by the gas pressure pump 1, is 10-17℃.

[0019] The present application is suitable for use when the external environment temperature or normal temperature is above 5-10℃. When the external environment temperature or normal temperature is lower than 5-10℃, the heat pump 40 in the present application can not be used, and the heat-absorbed gas of 25-35℃ or 35-45℃ discharged from the GPU box 4 can be directly cooled to 10-17℃ by the cooling device 41, and after being pressurized by the gas pressure pump 1, it is repeatedly used as high-pressure cooling gas for cooling the GPU box 4.

[0020] The reason for selecting the cooling gas temperature range of 10-17℃ is as follows: the first reason is about energy saving and noise reduction. The cooling gas with high pressure gap can be used to reduce the temperature to 10-17℃, because the machine room is at room temperature, not high pressure cooling gas. When the high pressure cooling gas is blown to the GPU chip, the temperature difference is greater than the gas cooled by the fan, and the cooling can be faster. When the temperature rises to the rated value, the cooling gas can be stopped, and the remaining 10-17℃ cooling gas in the GPU box and the machine case can be used to continue to cool the newly generated heat of the GPU chip, and the energy of the refrigeration is fully utilized. The refrigeration machine and the air pressure machine can be placed outside the machine room, so there is no noise in the machine room. Therefore, the present application can reduce the total energy consumption of the GPU chip cooling, reduce the cooling cost, improve the working temperature of the GPU chip, enhance the calculation ability, and reduce the noise. The second reason is about fog and dew. The national standard GB2887-89 of the existing technology stipulates that the fan cooling technology stipulates that the GPU chip environment temperature A is 22±2℃, B is 15-30℃, and C is 10-35℃. When the environmental humidity A is 45%-65%, the maximum dew point temperature suitable for the data center environment is 17℃. The standard stipulates that the minimum temperature is 10℃, so the minimum temperature of the cooling gas used for heat dissipation is selected as 10℃, and the maximum temperature is selected as 17℃, i.e. the cooling gas is 10-17℃. The technical scheme of the present application uses high pressure to blow in cooling gas, and the flow rate of the cooling gas is much greater than that of the existing technology fan generated at room temperature. Therefore, the present application can use high pressure to blow in cooling gas to disperse fog and dew, so the present application can use low temperature gas above 10℃ and below 17℃ to cool the GPU chip. Because the present application uses high pressure to blow in cooling gas to disperse fog and dew at any time, the existing fan cooling cannot be used to select the temperature of 10-17℃ which is easy to produce fog and dew. The reason for selecting the low limit temperature of the cooling gas as 10℃ is that the existing technology stipulates that the low limit of the cooling is 10℃. If the actual specific normal working temperature of the GPU chip is lower than 10℃, such as 5℃, the present application provides a technical scheme that can select the low limit value of the high pressure cooling gas temperature as 5℃. Because the present application solves the problem of fog and dew generated by 5℃ cooling gas.

[0021] The idea of the present application is:

[0022] The first cooling gas sealed cycle for heat dissipation is recycled, solving the problems of recycling of refrigeration energy and reducing the working temperature of GPU: the open air cooling method is to discharge the heated gas in the GPU box 4 to the external environment. In order to save refrigeration energy, the highest temperature of the heated gas before discharge is increased as much as possible under the condition that the GPU and the mainboard components can basically maintain normal working conditions. The highest temperature of the heated gas in the open air cooling method is 35-45℃, and even reaches 60℃. The maximum working temperature of the GPU and the mainboard components is 22±2℃ according to the national standard GB2887-89. The refrigeration energy in the heated gas in the recycling system can be recycled, so that the highest temperature of the heated gas can be reduced to 25-35℃, or even lower to 20-25℃. Although the heated gas at 25-35℃ carries more refrigeration energy than the heated gas at 35-45℃ leaving the GPU box 4, the refrigeration energy consumed by the heated gas at 25-35℃ in the heat pump 40 is less than that consumed by the heated gas at 35-45℃ reduced to 5-17℃. That is, in the sealed gas recycling for heat dissipation, the heat pump 40 has two functions of recycling refrigeration energy and separating high and low temperature gases. The recycling of refrigeration energy by the heat pump 40 allows the heated gas to be selected at a lower temperature than the open air cooling method, i.e. the highest temperature of the heated gas is changed from 35-45℃ to 25-35℃, which is more conducive to the GPU and the mainboard components to basically maintain normal working conditions.

[0023] The second sealed gas recycling for heat dissipation solves the problems of preventing pollution and reducing oxidation: the GPU box or the case has two holes for gas inlet and outlet. The pipeline connecting the two holes and the refrigeration device are connected into a sealed circulating gas channel. The sealed circulating gas channel is preferably filled with inert gas, which solves the problems of dust pollution and oxidation of the GPU and the mainboard components by using external air.

[0024] The third heat pump separates the heated gas into high and low temperature gases: the low temperature gas discharged by the heat pump is repeatedly used for cooling the GPU and the mainboard components. The high temperature gas discharged by the heat pump is cooled by a cooling device such as a water shower, mixed with the low temperature gas, and then repeatedly used for cooling the GPU and the mainboard components. The heat pump separates the 25-35℃ heated gas flowing out of the GPU box into 5-17℃ low temperature gas and 60-65℃ high temperature gas with a large temperature difference. The efficiency of the water shower for cooling the 60-65℃ high temperature gas is higher than that for cooling the 25-35℃ gas. In fact, the water shower alone cannot obtain the required 5-17℃ low temperature gas.

[0025] Fourth, the principle of saving cooling water consumption of electricity with large temperature difference and high cooling efficiency: the cooling of the separated 60-65℃ high temperature gas with normal temperature water has a larger temperature difference than the cooling of 25-35℃ heat absorbed gas with normal temperature water; because the total amount of 25-35℃ heat absorbed gas is much larger than the total amount of 60-65℃ high temperature gas, and the larger the temperature difference, the faster the cooling, the energy consumption of using all 25-35℃ heat absorbed gas to spray with normal temperature water is much larger than the amount of water and the amount of electricity used to separate the small amount of 60-65℃ high temperature gas, so using a heat pump to separate high temperature gas to spray with water to cool down not only saves time and is efficient, but also saves electricity to obtain 5-17℃ low temperature gas.

[0026] Fifth, the reason for choosing the cooling system of the present application instead of air conditioning to cool the heat absorbed gas: if water cooling is chosen, the cooling of 25-35℃ heat absorbed gas with normal temperature water cannot obtain 10-17℃ cooled gas if the normal temperature is higher than 10-17℃; if air conditioning is chosen, a large amount of 10-17℃ cold air energy is wasted and lost because a large amount of 10-17℃ cold air energy is not utilized but dissipated when the air conditioning blows 25-35℃ heat absorbed gas. Therefore, the present application separates the heat absorbed gas into high and low temperature gases using a heat pump, cools the high temperature gas with water having a large heat capacity and a large temperature difference, and mixes the low temperature gas to obtain cooled gas, which is more energy-saving.

[0027] Other reasons for choosing the concept of the present application:

[0028] First, high pressure injection cooling can remove fog and reduce noise: the air pressure pump 1 outside the machine room generates air pressure, the power of the air pressure pump 1 is not limited and can provide higher air pressure and faster air flow than the fan, and the high air pressure can effectively remove fog, so the GPU chip can be cooled with lower gas temperature than the fan, and lower gas temperature can improve cooling efficiency, better protect the GPU chip, and improve the operation capacity of the GPU chip. The use of high pressure gas can remove fog, and the gas used for cooling can be 10-17℃, which is lower than the fan.

[0029] Second, lower temperature gas can be used for cooling: the commonly used machine room temperature for existing fan cooling is normal temperature or about 25℃, which is relatively energy-saving for the fan continuous exhaust working mode, but has the disadvantages of small temperature difference between 25℃ and the heat generating elements such as GPU chip, low cooling efficiency, low energy utilization rate of refrigeration, high cooling cost, and large noise of the fan, especially when the GPU chip has a large workload and high temperature, the fan cooling is slow, the cooling effect is poor, the GPU chip is overheated, the operation capacity is reduced, and the GPU chip is prone to shutdown or damage.

[0030] The present application can solve the problem with lower cooling air heat dissipation: to solve the problem of small temperature difference between the cooling air and the GPU chip, the present application blows 10-17℃ cooling air directly to the GPU chip and the like in a high-pressure gap mode to increase the temperature difference between the cooling air and the heat generating elements such as the GPU chip, improve the heat dissipation efficiency, increase the energy utilization rate of refrigeration, reduce the cooling cost, and eliminate the need for a low-temperature noise fan. Thus, the present application places the refrigeration equipment outside the computer room to prevent the noise from affecting the computer room, especially to reduce the working temperature of the GPU chip and the like, prevent shutdown, increase the service life of the GPU chip and the like, and enhance the computing capacity.

[0031] Reasons why existing fan cooling cannot use 10-17℃: The existing fan cooling continuously discharges air, and the negative pressure generated by the fan is very low, which cannot generate high-speed airflow around the GPU chip and the like that mainly generate heat, resulting in poor heat dissipation effect. For example, a room air conditioner uses 10-17℃, and the low temperature of a large space in the computer room is too wasteful of refrigeration energy. The continuous discharge of 10-17℃ air causes a large amount of refrigeration energy to be not fully utilized, resulting in a computer room temperature that is too low and the GPU chip and the like not being able to fully utilize the airflow refrigeration energy, a large amount of refrigeration power being wasted, and thus the existing fan cooling room air conditioner does not use 10-17℃ cooling temperature.

[0032] The reason for selecting the cooling gas temperature range of 10-17°C: the first reason, regarding energy saving and noise reduction, the cooling gas of 10-17°C can be used to cool the GPU chip, because the machine room is at room temperature, not high-pressure cooling gas. When the high-pressure cooling gas is blown into the GPU chip, the temperature difference is greater than the gas cooled by the fan, and the cooling can be faster. When the temperature rises to the rated value, the cooling gas can be stopped, and the remaining 10-17°C cooling gas in the GPU box and the machine case can be used to continue to cool the newly generated heat of the GPU chip, making full use of the energy of the refrigeration. The refrigeration machine and air pressure machine can be placed outside the machine room, so there is no noise in the machine room. Therefore, the present application can reduce the total energy consumption of the GPU chip cooling, reduce the cooling cost, improve the working temperature of the GPU chip, enhance the calculation ability, and reduce the noise. The second reason, regarding the problem of preventing fog and dew, the existing technology stipulates that the fan cooling technology national standard GB2887-89 stipulates that the GPU chip environment temperature A level 22±2℃, B level 15-30℃, C level 10-35℃; the maximum dew point temperature suitable for the data center environment is 17℃ when the environmental humidity A level is 45%-65%. The standard stipulates that the minimum temperature is 10℃, so the minimum temperature of the cooling gas used for heat dissipation is selected as 10℃, and the maximum temperature is selected as 17℃, i.e. the cooling gas is 10-17℃. The technical scheme of the present application uses high-pressure cooling gas, and the flow rate of the cooling gas is much greater than that of the existing technology fan-generated room temperature gas, so the present application uses high-pressure cooling gas to disperse fog and dew, so the present application can use low-temperature gas above 10℃ and below 17℃ to cool the GPU chip. Because the present application uses high-pressure cooling gas to disperse fog and dew at any time, the existing fan cooling cannot be used for the temperature of 10-17℃ which is easy to produce fog and dew, but the present application can be used. The reason for the low limit temperature of the cooling gas of the present application is 10℃ is that the existing technology stipulates that the low limit of cooling is 10℃. If the actual specific normal working temperature of the GPU chip is lower than 10℃, such as 5℃, the present application provides a technical scheme that can select the low limit value of the high-pressure cooling gas temperature as 5℃. Because the present application solves the problem of fog and dew at 5℃.

[0033] The reason for selecting the high pressure range of the cooling gas 105KPa-150KPa: The selection of the high pressure value of the cooling gas and the temperature of the cooling gas is related to various factors such as the length and diameter of the gas outlet pipe 8 of the gas storage tank and the gas outlet pipe 19 of the equal distribution box, and also related to the heat generation of the GPU chip and the like. The gas pressure range is selected between 105KPa-150KPa, and the low value of the gas pressure is greater than one atmosphere [100KPa]. After the GPU chip and the like are lowered to the rated low temperature, a small gas flow can be used to compensate for the heat generation of the GPU chip and the like for cooling. The high limit of the gas pressure is less than the gas pressure of the household pressure cooker, which is considered from the safety point of view, so the high pressure limit is selected as 150KPa. The high pressure cooling gas of the present application blows to the GPU chip and the like at different time periods, and the temperature of the GPU chip and the like is different. A specific value in the range of 105KPa-150KPa can also be selected at different time periods, that is, the gas pressure is selected in the range of 105KPa-150KPa at different temperatures of the GPU chip and the like.

[0034] The invention point of the present application: First, the cooling gas for heat dissipation is sealed and recycled. The main cooperation technology is to separate the heated gas into high and low temperature gases by using a heat pump for separate treatment, thereby increasing the temperature difference of the gas to be cooled and the cooling medium of the cooling device, that is, a small part of the high temperature gas of 60℃-65℃ is separated from the 25℃-35℃ or 35℃-45℃ heated gas discharged from the server in the pipeline, and is cooled by external water shower to increase the temperature difference between the water temperature and the gas temperature, thereby improving the cooling efficiency. The high temperature gas is cooled by using water with large heat capacity and large temperature difference, and is mixed with the low temperature gas separated by the heat pump to form the cooling gas for cooling, and is repeatedly used for heat dissipation and cooling of the GPU and the main board components. The refrigeration energy in the gas for heat dissipation is recovered, the power consumption for refrigeration is saved, and it is a more preferred cooling technology scheme for energy-saving data center GPU and main board components.

[0035] In addition, the present application solves the problem of fog and dew by using positive high pressure cold gas, which can greatly reduce the noise without using a fan, and can provide cold gas in a gap mode to fully utilize the cold gas and save refrigeration energy. The problem of fog and dew can be solved by using low temperature 10℃-17℃ cold gas for cooling the GPU chip, which cannot be used by the current technology. The GPU chip can work in a lower temperature environment than the fan cooling method, which better protects the GPU chip and improves the operation efficiency of the GPU chip. The invention also achieves the purpose of energy saving, noise reduction and operation efficiency improvement.

[0036] In addition, first, high-pressure cooling gas that can produce airflow faster than general GPU box fan or case fan is used for cooling GPU chips and the like. Since high-pressure gas is blown onto the GPU in the GPU box or the GPU heat sink, not only rapid cooling is achieved, but also the mist that can exist in the GPU box is blown out of the GPU box, the GPU and the like are protected, the mist is blown out of the GPU box, the mist problem is solved, and the high-pressure gas can be selected to have a lower cooling temperature of 10-17°C that cannot be used by the fan cooling, thereby becoming a high-pressure gas cooling body that can be used in the application. Since a large amount of cooling energy can be reserved and used in the GPU box after the first blown high-pressure gas cooling body 10-17°C cools the GPU and the heat sink, the blowing of the high-pressure gas cooling body can be temporarily stopped, the cooling gas is intermittently blown out, or the high-pressure gas cooling body is provided in an intermittent manner with a large flow rate at a small flow rate, thereby reducing the amount of the gas cooling body and saving energy. In short, the method for cooling the GPU chips and the like in an intermittent manner with high-pressure cooling gas is that the high pressure makes the cooling gas flow at a high speed to remove the mist, and the refrigeration and gas pressure equipment can be placed outside the computer room without the fan, thereby greatly reducing the noise of the computer room.

[0037] In summary, the application points are that the heat pump 40 and the cooling device 41 are used in cooperation to solve the problem of recycling more refrigeration energy in the sealed circulation of the heated gas, the high-pressure cooling gas is used to solve the mist problem in the GPU box 4, and the GPU and the main board and the like can be cooled at a lower temperature of 10-17°C than the existing fan cooling method, so that the GPU and the main board and the like can basically work in the A-level 22±2°C national standard GB2887-89 GPU chip working environment, and the application purpose of energy saving, noise reduction, and operation efficiency improvement is achieved.

[0038] The content of the application is:

[0039] The energy-saving method for cooling the GPU chips with the closed circulation high-pressure cooling gas comprises a gas pressure pump 1, a high-pressure gas storage tank 2, a GPU chip and a heat sink 3, a chip temperature sensor 16, and an automatic controller 13. The chip temperature sensor 16 and the GPU chip and the heat sink 3 are arranged in a GPU box 4, the GPU box 4 is provided with an air inlet hole 5 and an air outlet hole 6, and the gas pressure pump 1 is provided with a gas pump power switch 11. The energy-saving method is characterized in that:

[0040] The energy-saving method further comprises a heat pump 40 and a cooling device 41. The pressure pump 1, the high-pressure gas storage tank 2, the GPU chip and the heat sink 3, the heat pump 40, the cooling device 41, and the pressure pump 1 are sequentially connected by a pipeline to form a gas circulation sealed loop channel.

[0041] In the circulating gas seal loop, the high pressure cooling gas discharged from the high pressure cold gas storage tank 2 is used to cool the GPU chip and the heat sink 3, and the high pressure cooling gas becomes the heat absorbed gas which is discharged from the GPU box 4. The heat absorbed gas is divided into high and low temperature gases by the heat pump 40, and the high temperature gas is cooled by the cooling device 41 and mixed with the low temperature gas to become the cooling gas for cooling. The cooling gas is pressurized by the gas pressure pump 1 to become the high pressure cooling gas which is repeatedly used by the high pressure cold gas storage tank 2 to cool the GPU chip and the heat sink 3, so that the GPU chip and the heat sink 3 are controlled within the set temperature variation range. The specific process is as follows:

[0042] The high pressure cooling gas in the high pressure cold gas storage tank 2 is blown into the GPU box 4 to cool the GPU chip and the heat sink 3, so that the high pressure cooling gas becomes the heat absorbed gas. After the heat absorbed gas is sucked into the heat pump 40, the heat pump 40 divides the heat absorbed gas into high and low temperature gases, i.e. into high temperature gas and low temperature gas. The high temperature gas in the high temperature gas pipeline enters the cooling device 41, and the cooling device 41 cools the high temperature gas into normal temperature gas. The low temperature gas and the normal temperature gas enter the two-gas merging pipeline 47 to be mixed into cooling gas. The cooling gas is pressurized by the gas pressure pump 1 to become the high pressure cooling gas which is stored in the high pressure cold gas storage tank 2 for standby, and is used as the standby high pressure cooling gas for reducing the temperature of the GPU chip and the heat sink 3. When the temperature of the GPU chip and the heat sink 3 reaches or exceeds the specified high temperature, the signals of the chip temperature sensor 16 and the automatic controller 13 make the gas pipe pressure valve 15 on the gas tank outlet pipe 8 of the high pressure cold gas storage tank 2 open, and the high pressure cooling gas is blown into the GPU box 4 again to cool the GPU chip and the heat sink 3. When the temperature of the GPU chip and the heat sink 3 drops to or exceeds the specified low temperature, the signals of the chip temperature sensor 16 and the automatic controller 13 make the gas pipe pressure valve 15 on the gas tank outlet pipe 8 of the high pressure cold gas storage tank 2 close or slightly open. At the same time, the automatic controller 13 makes the heat pump 40 suck the heat absorbed gas in the GPU box 4. The heat absorbed gas is divided into high and low temperature gases by the heat pump 40. The high temperature gas is cooled by the cooling device 41 to become normal temperature gas, and the normal temperature gas is mixed with the low temperature gas to become the cooling gas which is used to cool the GPU chip and the heat sink 3 again. The cooling gas is pressurized by the pressure pump 1 to become the high pressure cooling gas which is stored in the high pressure cold gas storage tank 2 for repeated use.

[0043] According to the temperature variation of the GPU chip and the heat sink 3 at different times, the high pressure cooling gas is discharged in an intermittent manner to achieve energy saving. The temperature sensor 16 controls the opening, slight opening or closing of the gas pipe electromagnetic valve 15 through the automatic controller 13 to control the output amount and output time of the high pressure cooling gas in the high pressure cold gas storage tank 2 to the GPU chip and the heat sink 3, so that the high pressure cooling gas is discharged in an intermittent manner to cool the GPU chip and the heat sink 3.

[0044] GPU chip and heat sink 3 continuously produce heat, high pressure cooling gas in the sealed cycle from the complex in turn from high pressure cooling gas, heat absorbing gas, high temperature gas and low temperature gas, high temperature gas into normal temperature gas, low temperature gas and normal temperature gas mixed into cooling gas, cooling gas into high pressure cooling gas, cycle continuously cooling GPU chip and heat sink 3 cooling.

[0045] The preferred range of high pressure cooling gas: the temperature of the high pressure cooling gas discharged by the storage high pressure cooling gas tank 2 is 10-17℃.

[0046] The preferred range of cooling gas high pressure: the pressure of the high pressure cooling gas discharged by the storage high pressure cooling gas tank 2 is 105-150KPa.

[0047] Two choices in the preferred range of cooling gas high pressure:

[0048] When the temperature of the chip temperature sensor 16 near the GPU chip and heat sink 3 reaches the rated high temperature set value set by the automatic controller 13, the pressure of the high pressure cooling gas discharged by the storage tank outlet pipe 8 of the storage high pressure cooling gas tank 2 is 130-150KPa, and the temperature is 10-17℃;

[0049] When the temperature of the chip temperature sensor 16 near the GPU chip and heat sink 3 reaches the rated low temperature set value set by the automatic controller 13, the gas pipe electromagnetic valve 15 is slightly opened, the pressure of the high pressure cooling gas discharged by the storage tank outlet pipe 8 of the storage high pressure cooling gas tank 2 is 105-130KPa, and the temperature is 10-17℃; or when the temperature of the chip temperature sensor 16 reaches the rated low temperature set value set by the automatic controller 13, the gas pipe electromagnetic valve 15 is closed, and no high pressure cooling gas is discharged.

[0050] The preferred range of low and high temperature separated by heat pump: the low temperature gas separated by heat pump 40 is 5-17℃, and the high temperature gas separated by heat pump 40 is 60-65℃.

[0051] The main components of the closed cycle gas cooling system include a gas pressure pump 1, a high-pressure cold gas storage tank 2, a GPU box 4, a heat pump 40, a cooling device 41, and a sealed circulation gas channel connected by pipelines. The sealed gas channel is clean and dust-free air, preferably inert gas such as nitrogen or carbon dioxide gas, or other inert gas. The gas pressure pump 1 pressurizes the cooling gas at 10-17°C and stores it in the high-pressure cold gas storage tank 2 for standby. According to the instructions of the automatic controller 13, the intake pipe pressure valve 15 is intermittently opened and closed, and the high-pressure cooling gas at 10-17°C is intermittently discharged from the gas storage tank outlet pipe 8 to the GPU box 4, which can also be a server case. When the gas temperature in the GPU box 4, which can also be a server case, rises to 25-35°C, it becomes a heated gas. The intake pipe pressure valve 15 is opened again to discharge the high-pressure cooling gas at 10-17°C from the gas storage tank outlet pipe 8 to the GPU box 4. The subsequent high-pressure cooling gas pushes the original 25-35°C heated gas out of the GPU box 4, and the heated gas enters the heat pump 40. The heat pump 40 itself can also suck in the 25-35°C heated gas. In the heat pump 40, the heat pump 40 changes the 25-35°C heated gas into low and high temperature gases. The separated 60-65°C high temperature gas passes through the water shower cooling device 41 to become normal temperature gas, i.e. water temperature gas. The normal temperature gas mixes with the 5-17°C low temperature gas separated from the heat pump 40 to become 10-17°C cooling gas. The 10-17°C cooling gas enters the gas pressure pump 1 again to be pressurized into 10-17°C high pressure cooling gas for standby. The process is repeated to cool the GPU box 4, which can also be a server case, so that the GPU, CPU, mainboard and other heat generating components in the data center operate in a constant temperature state below 25-35°C. The automatic controller 13 adjusts the power of the various power controllers 49 according to the temperature of the combined pipe temperature sensor 48, so that the heat pump 40 selects different working power, and the cooling gas is kept at 10-17°C.

[0052] With the improvement of the heat pump 40 technology, if the high temperature gas separated by the heat pump 40 can be higher than 60-65°C in the future, the present application selects the higher temperature gas separated by the improved heat pump 40.

[0053] The energy saving principle of the present application is as follows. The present application first requires a sealed circulation gas system, which does not lose gas, and the purpose is to have clean gas and use high-priced inert gas. It also provides conditions for using lower temperature cooling gas than existing fans, so that the GPU, CPU, mainboard and other heat generating components can operate in a constant temperature state below 25-35°C, improving the working efficiency of the GPU, CPU, mainboard and other heat generating components.

[0054] First, only sealed circulating gas system can be used. If the high-temperature gas at 60-65℃ separated by the heat pump 40 is discharged and the inert gas at normal temperature is added again, the cost of the newly added inert gas is much higher than the cooling cost of the water spray cooling device 41, and the time flow value of the high-temperature gas removal is difficult to equal to that of the newly added inert gas, so the air pressure in the sealed system is difficult to control. Therefore, only the sealed circulating gas system can be used for the inert gas.

[0055] Second, the reason for selecting the heat pump 40 and the water spray cooling device 41 for cooling instead of air conditioning cooling: if water is selected as the medium for cooling, the heat capacity of water is large, water is recyclable, and the cost is low; if air conditioning cold air is used as the medium for cooling, the heat capacity of air is small, and the cold air cannot be reused, which consumes more energy and has a higher cost. [1] If the heat pump 40 is not used and only water at normal temperature is used to cool the 25-35℃ heated gas, if the normal temperature is higher than 10-17℃, the cooling gas at 10-17℃ cannot be obtained, so the water spray cooling device 41 must be used with the heat pump 40; [2] if the heat pump 40 and the water spray cooling device 41 are not used, only air conditioning cold air at 10-17℃ or lower temperature is selected to cool the 25-35℃ heated gas from the server, and a large amount of air conditioning cold air energy is not fully utilized but is dissipated, and a large amount of air conditioning refrigeration energy is wasted. Therefore, the heat pump is used to separate the 25-35℃ heated gas into high-temperature gas and low-temperature gas, the high-temperature gas is cooled by water with large heat capacity and large temperature difference, and then mixed with the low-temperature gas to form cooling gas, the gas in the pipe and the water outside the pipe can be reused, which is a more energy-saving preferred technical solution for cooling GPU and mainboard components in data centers.

[0056] Third, improve the temperature difference to save water shower cooling energy, GPU works in a better state: 25℃-35℃ from the GPU box becomes a small temperature difference between the heat-absorbing gas and the normal temperature water, and the high-temperature gas of 60℃-65℃ separated by heat pump 40 has a large temperature difference with the normal temperature water, increasing the temperature difference of about 30℃. Because the heat pump 40 can only separate the high-temperature gas of 60℃-65℃, the high-temperature gas parameter is 60℃-65℃. The greater the temperature difference between the water and the gas in the pipeline that needs to be cooled, the more total heat carried by the heat-absorbing gas in unit time, and the more efficient the water shower cooling of the high-temperature gas of 60℃-65℃, the less water consumption, and the more total heat carried by the heat-absorbing gas in unit time. If 25℃-35℃ is directly used as the heat-absorbing gas for water shower cooling, the efficiency is low, the temperature difference is small, the water consumption is large, and direct cooling cannot be reduced to 10℃-17℃. This 10℃-17℃ is more conducive to the GPU, CPU, and motherboard of the data center to work in a better state, and the normal temperature gas is not as good as the working state of the 10℃-17℃ cooling.

[0057] Fourth, the circulating gas can recycle refrigeration energy, reduce the temperature of the circulating cooling gas without increasing energy consumption, and make the GPU work in a better temperature environment: The gas for cooling the GPU chip in the present application is sealed and circulated, so that the refrigeration energy of the heat pump for the normal temperature gas can be recycled, and the temperature of the heat-absorbing gas flowing out of the GPU box can be lower than 35℃-45℃ of the existing fan open cooling air cooling. The present application can select the temperature of the heat-absorbing gas flowing out of the GPU box as 25℃-35℃. Because the refrigeration energy can be recycled, the present application has the condition to select and control the temperature of the heat-absorbing gas flowing out of the GPU box as 25℃-35℃, which is the best temperature environment for the working temperature of the GPU, CPU. When the low-temperature gas of 5℃-17℃ and the normal temperature gas after water showering are mixed into the cooling gas of 10℃-17℃ and blown into the GPU box 4, the GPU, CPU, and motherboard are cooled, and the cooling gas of 10℃-17℃ is blown into the GPU box 4 again when the temperature of the GPU box 4 is 25℃-35℃. The heat-absorbing gas of 25℃-35℃ is discharged from the GPU box 4, and these heat-absorbing gases of 25℃-35℃ enter the heat pump 40. In the closed system where the cooling gas is circulated, the total energy required for the heat pump 40 to change the heat-absorbing gas of 25℃-35℃ into the low-temperature gas of 5℃-17℃ is the same as the total energy required to change the heat-absorbing gas of 35℃-45℃ into the low-temperature gas of 5℃-17℃. This is the advantage of sealed and circulating gas, which uses lower temperature gas to cool the GPU chip and does not increase energy consumption.

[0058] To prevent the high-pressure cold gas from flowing backward, a one-way valve 14 that allows gas to flow only from the air pressure pump 1 to the high-pressure cold gas storage tank 2 is arranged on the air outlet pipe 7 of the air pressure pump.

[0059] The one-way valve 14 prevents the high-pressure cold gas stored in the high-pressure cold gas storage tank 2 from flowing back into the air pressure pump 1 after the air pressure pump 1 stops working.

[0060] The automatic controller 13 is connected to the air inlet pipe air pressure valve 15 by wires. The air inlet pipe air pressure valve 15 is a physical control component for the high-pressure cold gas storage tank 2 to output high-pressure cold gas in an intermittent manner. The opening or slight opening or closing of the air inlet pipe air pressure valve 15 is controlled by the automatic controller 13. The automatic controller 13 can be fixed time setting or use the chip temperature sensor 16 as the source of control information.

[0061] When the workload of the GPU chip and the like changes from large to small, the heat generated by the GPU chip and the like changes from much to little, and the temperature of the gas in the two-gas merging pipe 47 is lower than 10-17℃, the signal transmitted by the merging pipe temperature sensor 48 to the automatic controller 13 causes the multiple power controllers 49 to reduce power, thereby reducing the use of refrigeration energy and saving electricity.

[0062] Because the air inlet of the heat pump 40 has a suction function, it can suck the gas in the GPU box 4 into the heat pump 40. The suction function of the heat pump 40 can not only suck the already heated gas in the GPU box 4, but also suck the to-be-sucked heated gas in the GPU box 4 that has not reached the set temperature. In order to save the energy of the to-be-sucked heated gas and make the to-be-sucked heated gas continue to absorb the heat of the GPU and the like in the GPU box 4, a heated gas pipe air pressure valve 50 is arranged on the heat pump air inlet pipe 42 of the heat pump 40, and the heated gas pipe air pressure valve 50 is connected to the automatic controller 13 by wires. Only when the chip temperature sensor 16 and the merging pipe temperature sensor 48 transmit the signal that the temperature of the gas reaches the set value, the automatic controller 13 sends an instruction to open the heated gas pipe air pressure valve 50. When the heated gas pipe air pressure valve 50 is opened, the heat pump 40 sucks the already heated gas in the GPU box 4. When the heat pump 40 sucks enough or a fixed amount of already heated gas, the heated gas pipe air pressure valve 50 is closed. The automatic controller 13 then starts the air inlet pipe air pressure valve 15 to open and blow 10-17℃ cooling gas into the GPU box 4. In this way, the temperature information of the chip temperature sensor 16 is transmitted to the automatic controller 13 to control the air inlet pipe air pressure valve 15 and the heated gas pipe air pressure valve 50 of the GPU box 4, so as to adjust the temperature in the GPU box 4 to keep it within the set range, and save refrigeration energy, electricity and cost.

[0063] The normal refrigeration control circuit for temperature, the significance of setting the rated gas pressure or the rated time output of high-pressure cold gas by the inlet pipe gas pressure valve 15: the gas pressure sensor 9 is mainly used to set the rated gas pressure in the high-pressure cold gas storage tank 2, especially to set the highest rated gas pressure, the method is to control the power switch 11 of the gas pressure pump 1 by the gas pressure information of the gas pressure sensor 9 through the automatic controller 13, and the gas pressure in the high-pressure cold gas storage tank 2 is controlled not to exceed the rated pressure value. Set the rated pressure or the rated time, and the cooling gas with pressure flow can be intermittently or fluctuatingly rushed to the GPU chip and the heat sink 3, which can quickly remove the high-temperature gas adhering to the GPU chip and the heat sink 3, so as to achieve the purpose of rapid cooling of the GPU chip and the heat sink 3. With the same energy consumption, such as using 10℃ lower temperature cooling gas to rush to the GPU chip and the heat sink 3 and the surrounding high-temperature gas, the cooling effect is better than that of continuously using the fan to suck 25℃ normal temperature dispersed cooling effect. That is, the cooling effect of the low-temperature gas blowing cooling method of the present application is better than that of the existing fan sucking high-temperature gas cooling method, and the energy saving is better. The inlet pipe gas pressure valve 15 is intermittently opened, so that the GPU fan and the case fan are no longer continuously used, and the noise of the computer room is greatly reduced; because the gas pressure pump 1 can be placed outside the room, there is only slight, low-frequency, intermittent airflow sound in the computer room, instead of a large amount of, high-frequency, even resonant, even metal rubbing, continuous fan sound. Therefore, the cooling effect of the GPU chip and the heat sink 3 is better, the cooling energy is saved, and the noise in the computer room is low.

[0064] The automatic control mode of the high-pressure cooling gas is that the gas pressure pump 1 pressurizes the cold gas into the high-pressure cold gas storage tank 2, and the chip temperature sensor 16 controls the opening, slight opening and closing of the inlet pipe gas pressure valve 15 through the automatic controller 13 to control the delivery and time of the high-pressure cold gas in the high-pressure cold gas storage tank 2 to the GPU chip and the heat sink 3, so that the high-pressure cold gas discharged in the gap mode controls the GPU chip and the heat sink 3 within the set temperature and humidity change range; the specific mode is as follows:

[0065] When the temperature of the chip temperature sensor 16 reaches the high-temperature setting value, the chip temperature sensor 16 drives the automatic controller 13 to open the inlet pipe gas pressure valve 15, and the gas outlet pipe 8 of the gas storage tank releases a large amount of high-pressure cold gas to the GPU chip and the heat sink 3 in the GPU box 4, so as to rapidly cool the GPU chip and the heat sink 3.

[0066] When the chip temperature sensor 16 is reduced to the rated low temperature set value, the chip temperature sensor 16 drives the automatic controller 13 to drive the air inlet pipe pressure valve 15 to open slightly, and the air outlet pipe 8 of the gas storage tank releases a small amount of cold air to the GPU chip and the heat sink 3 in the GPU box 4, so as to maintain the GPU chip and the heat sink 3; or when the chip temperature sensor 16 is reduced to the low temperature set value, the chip temperature sensor 16 drives the automatic controller 13 to drive the air inlet pipe pressure valve 15 to close, and the GPU chip and the heat sink 3 are slowly heated.

[0067] The air pressure of the high-pressure cooling gas is preferably 105KPa-150KPa, and the temperature is 10℃-17℃.

[0068] The air inlet pipe pressure valve 15 provided on the air outlet pipe 8 of the gas storage tank is a key technical setting for providing high-pressure cold air in a gap mode. The gap mode provides high-pressure cold air, so that the temperature of the cold air can be lower than the indoor normal temperature or the air temperature of 17℃-35℃ of the existing fan continuous air exhaust mode. The present application preferably provides a high-pressure cooling gas with a temperature of 10℃-17℃, and the cooling effect is obviously better than the existing fan normal temperature of 17℃-35℃. Moreover, the gap mode provides high-pressure cold air during the gap charging period, and can fully utilize the energy source of the 10℃-17℃ air temperature in the box or the cabinet, instead of the existing technology of continuous air exhaust and waste of cold air energy. The existing continuous air exhaust cannot fully utilize the energy source of the room air conditioner.

[0069] Temperature setting and advantages of gap type low temperature: Because the present application is high pressure gap type blowing cooling gas, the high pressure cold gas temperature can be selected as 10-17℃, which is much lower than the indoor normal temperature or 17-35℃ of the existing fan continuous type exhaust gas mode of the machine room cabinet. The fan continuous type exhaust gas can only use higher "indoor normal temperature or 17-35℃", and the machine room air conditioner generally does not have lower than 17℃. If 10-17℃ low temperature is used, the low temperature gas of the fan continuous exhaust will waste too much energy. Therefore, in order to use 10-17℃ low temperature cooling gas with better cooling efficiency of GPU, without wasting energy, only the gap blowing 10-17℃ cooling gas of the present application can be used. When the GPU chip and other power consuming elements are heated to the rated high temperature such as 50-65℃, a large amount of 10-17℃ low temperature cooling gas is blown in to cool the GPU chip and other power consuming elements to 10-17℃. Then the blowing of 10-17℃ low temperature cooling gas is stopped or a small amount of low temperature cooling gas is blown in. When the GPU chip and other power consuming elements are heated to 50-65℃ again, a large amount of 10-17℃ low temperature cooling gas is blown in to cool the GPU chip and other power consuming elements to 10-17℃. In this way, when a large amount of 10-17℃ low temperature cooling gas is blown in, the temperature difference between the cooling gas and the GPU chip is large, and the cooling is faster than the indoor normal temperature gas of the fan. Therefore, the energy utilization efficiency of the cooling gas of the present application for cooling the GPU chip is higher, the energy is more saved, the GPU chip has a longer low temperature working time, and the operation capacity of the GPU chip is higher. The cooling gas blowing type cooling can also blow away dust and water mist at any time, without damaging the GPU chip and other elements, so that the GPU chip and other elements can use 10-17℃ low temperature cooling gas lower than the fan type.

[0070] The focus of the present application is that the gap type high pressure cold gas can be used for cooling: the gap type cooling blowing high pressure cold gas is realized by using the air inlet pipe pressure valve 15 and the like. When the gap type cooling blowing high pressure cold gas is at a temperature of 10-17℃, a lower temperature of 10℃ or below can also be used to cool the GPU chip and the heat sink 3, which can cool faster and prolong the gap time between the minimum temperature and the maximum starting temperature. However, the water mist of the gas at a temperature of 10℃ or below will appear quickly, and it is difficult to completely blow away the water mist of the 130-150KPa high pressure gas flow, so it is not recommended to use it. After the GPU chip and the heat sink 3 are cooled to 10-17℃ by the 10-17℃ high pressure cold gas, the blowing of high pressure cold gas is stopped or a small amount of high pressure cold gas is blown in. The GPU chip and the heat sink 3 are heated to a certain temperature of 35-45℃ or 50-60℃. During the time when the blowing of high pressure cold gas is stopped or a small amount of high pressure cold gas is blown in, the 10-17℃ cold gas energy in the GPU box 4 is fully utilized, the energy consumption for cooling is reduced, and the cooling cost is saved.

[0071] And the prior art continuous fan exhaust, such as using normal temperature or constant 25℃ gas heat dissipation, the heat dissipation gas is continuously extracted by the fan, the heat dissipation gas temperature is high, the temperature difference between the heat dissipation gas and the GPU chip and the radiator 3 is small, the cooling efficiency is low, and the power consumption of the fan and the energy of the refrigeration gas are wasted; If the prior art changes the heat dissipation gas to low temperature 15℃, although the temperature difference with the GPU chip and the radiator 3 is higher, the energy of the 15℃ heat dissipation gas is more consumed in the large amount of useless space of the machine room, and is continuously extracted by the fan, which is more romantic energy; If the prior art changes the heat dissipation gas to high temperature 40℃, the temperature difference with the GPU chip and the radiator 3 is too small, the cooling effect is too poor, and it cannot be used, which is meaningless. Therefore, the gap mode high pressure cold gas cooling used in the present application is a method of high cooling efficiency and energy saving.

[0072] The automatic controller 13 mainly controls the heat dissipation and dehumidification of the GPU chip and the radiator 3, and the refrigeration power consumption and pressure process of the heated gas, four processes: heat dissipation process, dehumidification process, power consumption refrigeration process, and gas pressure process.

[0073] The first heat dissipation process, the chip temperature sensor 16 controls the heat dissipation process of the GPU chip and the radiator 3 through the automatic controller 13 as follows:

[0074] A power switch 11 is arranged on the power line 10 of the gas pressure pump 1;

[0075] A gas pressure sensor 9 is arranged in the high pressure cooling gas tank 2,

[0076] A gas pipe electromagnetic valve 15 is arranged on the gas tank outlet pipe 8 of the high pressure cooling gas tank 2,

[0077] A chip temperature sensor 16 and a humidity sensor 17 are arranged in the GPU box 4,

[0078] A combined pipe temperature sensor 48 is arranged in the cooling gas pipe, i.e. the two gas combined pipe 47 into the gas pressure pump 1,

[0079] A variety of power controllers 49 are arranged in the heat pump 40,

[0080] A hot gas pipe pressure valve 50 is arranged on the heat pump inlet pipe 42 connected with the GPU box 4 and the heat pump 40,

[0081] The automatic controller 13 is respectively connected with the gas pressure sensor 9, the power switch 11, the gas pipe electromagnetic valve 15, the chip temperature sensor 16, the humidity sensor 17, the combined pipe temperature sensor 48, the variety of power controllers 49, and the hot gas pipe pressure valve 50 through wires;

[0082] The temperature adjustment method of the chip temperature sensor 16 in the GPU box 4 is as follows:

[0083] The chip temperature sensor 16 controls the amount and time of the high-pressure cooling gas in the high-pressure cooling gas storage tank 2 to the GPU chip and the heat sink 3 through the automatic controller 13 to control the GPU chip and the heat sink 3 in the set temperature and humidity change range by opening, slightly opening or closing the cooperation of the air pipe electromagnetic valve 15 and the hot air pipe pressure valve 50. The specific method is as follows:

[0084] When the temperature of the chip temperature sensor 16 reaches the rated high temperature set value set by the automatic controller 13, the chip temperature sensor 16 drives the automatic controller 13 to drive the air pipe electromagnetic valve 15 and the hot air pipe pressure valve 50 to open, and the heat pump 40 absorbs the heated gas in the GPU box 4; the GPU chip and the heat sink 3 in the GPU box 4 are discharged by the high-pressure cooling gas in the gas tank outlet pipe 8, and the GPU chip and the heat sink 3 are quickly cooled;

[0085] When the temperature of the chip temperature sensor 16 reaches the rated low temperature set value set by the automatic controller 13, the chip temperature sensor 16 drives the automatic controller 13 to drive the air pipe electromagnetic valve 15 and the hot air pipe pressure valve 50 to slightly open, and the GPU chip and the heat sink 3 in the GPU box 4 are discharged by a small amount of high-pressure cooling gas in the gas tank outlet pipe 8, and the GPU chip and the heat sink 3 are kept at low temperature or slowly heated; or when the temperature of the chip temperature sensor 16 reaches the rated low temperature set value set by the automatic controller 13, the automatic controller 13 drives the hot air pipe pressure valve 50 to slightly open, and the chip temperature sensor 16 drives the automatic controller 13 to drive the air pipe electromagnetic valve 15 to close.

[0086] The second dehumidification process, the humidity sensor 17 in the box controls the dehumidification process of the GPU chip and the heat sink 3 through the automatic controller 13 as follows:

[0087] The humidity adjustment method of the humidity sensor 17 in the box is as follows:

[0088] The humidity sensor 17 in the box controls the amount and time of the high-pressure cooling gas in the high-pressure cooling gas storage tank 2 to the GPU chip and the heat sink 3 through the automatic controller 13 to control the humidity in the GPU box 4 in the set humidity change range by opening, slightly opening or closing the cooperation of the air pipe electromagnetic valve 15 and the hot air pipe pressure valve 50. The specific method is as follows:

[0089] When the humidity of the humidity sensor 17 in the box reaches the rated high humidity set value set by the automatic controller 13, the humidity sensor 17 in the box makes the automatic controller 13 drive the air pipe electromagnetic valve 15 and the hot air pipe pressure valve 50 to open, and the heat pump 40 absorbs the heated air in the GPU box 4; the gas outlet pipe 8 of the high-pressure cooling gas tank releases a large amount of high-pressure cooling gas to the GPU chip and the heat sink 3 in the GPU box 4, rapidly reducing the humidity on the surface of the GPU chip and the heat sink 3 and the environment in the GPU box 4.

[0090] When the humidity of the humidity sensor 17 in the box reaches the rated low humidity set value set by the automatic controller 13, the humidity sensor 17 in the box makes the automatic controller 13 drive the air pipe electromagnetic valve 15 and the hot air pipe pressure valve 50 to open slightly, and the gas outlet pipe 8 of the high-pressure cooling gas tank releases a small amount of high-pressure cooling gas to the GPU chip and the heat sink 3 in the GPU box 4; or when the humidity of the humidity sensor 17 in the box reaches the rated low humidity set value set by the automatic controller 13, the automatic controller 13 drives the hot air pipe pressure valve 50 to open slightly, and the humidity sensor 17 in the box makes the automatic controller 13 drive the air pipe electromagnetic valve 15 to close.

[0091] The third power consumption refrigeration process uses the combined pipe temperature sensor 48 to control the working power of the heat pump 40 through the automatic controller 13 as follows:

[0092] When the temperature of the combined pipe temperature sensor 48 in the two-gas combined pipe 47 is higher than the set temperature value, the combined pipe temperature sensor 48 makes the automatic controller 13 drive the multiple power controllers 49 to switch to a larger power gear, and the working power consumption of the heat pump 40 increases.

[0093] When the temperature of the combined pipe temperature sensor 48 in the two-gas combined pipe 47 is lower than the set temperature value, the combined pipe temperature sensor 48 makes the automatic controller 13 drive the multiple power controllers 49 to switch to a smaller power gear, and the working power consumption of the heat pump 40 decreases.

[0094] The fourth gas pressurization process uses the gas pressure sensor 9 to control whether the gas pressure pump 1 is started to work through the automatic controller 13 as follows:

[0095] The gas pressure sensor 9 is provided in the high-pressure cooling gas tank 2, and the power automatic switch 11 is provided on the power supply line 10 of the gas pressure pump 1; the gas pressure sensor 9 is connected with the power automatic switch 11 and the automatic controller 13 to form a control loop for normal rated gas pressure or rated time output of high-pressure cooling gas.

[0096] The three meanings of the above four control processes are as follows:

[0097] The significance of using a heat pump to separate high-temperature gas and reduce the temperature can save the electricity used for temperature reduction: with the change of outdoor temperature and water temperature used for cooling, the power of heat pump 40 is increased or decreased to save the heat dissipation energy of GPU chip and other components, and to save the electricity and cost of data center. The automatic controller 13 adjusts multiple power controllers 49 according to the temperature of the combined pipe temperature sensor 48, so that the heat pump 40 selects different working power, and the cooling gas is kept at 10-17℃. When the working load of GPU chip and other components changes from large to small, and the heat generated by GPU chip and other components changes from much to little, the temperature of the gas in the combined pipe 47 is lower than 10-17℃, and the signal transmitted by the combined pipe temperature sensor 48 to the automatic controller 13 makes the multiple power controllers 49 reduce the power, so as to recycle the energy of the cooling gas and save the energy of the cooling gas.

[0098] The second significance is to save the cooling energy and reduce the noise in the machine room: the normal cooling control circuit of the temperature uses the gas pipe pressure valve 15 to set the rated gas pressure or the rated time to output high-pressure cooling gas: the gas pressure sensor 9 is mainly used to set the rated gas pressure in the high-pressure cooling gas storage tank 2, especially to set the highest rated gas pressure, and the method is to control the power switch 11 of the gas pressure pump 1 through the automatic controller 13 according to the gas pressure information of the gas pressure sensor 9, so as to control the gas pressure in the high-pressure cooling gas storage tank 2 not to exceed the rated pressure value. By setting the rated pressure or the rated time, the cooling gas with high pressure and fast flow can be intermittently or fluctuationally used to rush to the GPU chip and the radiator 3, so as to quickly remove the high-temperature gas adhering to the GPU chip and the radiator 3, and to achieve the purpose of quickly cooling the GPU chip and the radiator 3. With the same energy consumption, the cooling effect of using 10℃ low-temperature cooling gas to rush to the GPU chip and the radiator 3 and the surrounding high-temperature gas is better than that of continuously using the fan to suck 25℃ normal-temperature gas for dispersion and cooling. That is to say, the cooling method of using the low-temperature gas of the present application is better than the existing cooling method of using the fan to suck the high-temperature gas in terms of cooling effect and energy saving. The gas pipe pressure valve 15 is intermittently opened, so that the GPU fan and the case fan are no longer continuously used, and the noise in the machine room is greatly reduced; because the gas pressure pump 1 can be placed outside the room, there is only slight, low-frequency, intermittent airflow sound in the room, instead of a large amount of high-frequency, even resonant, even metal rubbing, continuous fan sound. Therefore, the method of using high-pressure cooling gas to intermittently blow air to the GPU chip and the radiator 3 has better cooling effect, saves the cooling energy, and reduces the noise in the machine room.

[0099] The third meaning is that the fog can be driven away by using low-temperature gas to dissipate heat. The fog can be driven away by using low-temperature cooling gas to cool the GPU chip and the like, so that the GPU chip and the like can have a better working temperature environment. An emergency dehumidification and fog driving control loop: The working environment of the GPU chip and the like has a specified range for temperature and humidity. According to the national standard B2887-89, under the condition that the environmental humidity is A level 45% to 65%, the maximum dew point temperature is 17℃. Under the condition that the humidity is 45% to 65%, the temperature rated value of the chip temperature sensor 16 is 10℃ to 45℃, that is, when the temperature of the chip temperature sensor 16 reaches 45℃, the high-pressure cooling gas with a temperature of 10℃ to 17℃ is blown into the GPU box 4 to cool, and when the temperature drops to 10℃, the blowing of the high-pressure cooling gas is stopped. When the temperature of the chip temperature sensor 16 reaches 45℃ again, the high-pressure cooling gas is blown in to cool, forming a cycle of blowing and stopping. In the cycle of cooling and stopping, if the fog is generated in the GPU box 4, it is also driven out of the GPU box 4 by the high-pressure cooling gas blown in next time, so that the fog cannot exist in the GPU box 4 for a long time. Therefore, under the condition that the environmental humidity is 45% to 65%, the fog will not affect the GPU chip and the like. However, under the special bad condition that the environmental humidity is 85% or more, the fog generated in the GPU box 4 is prolonged and the amount is also increased, which may be harmful to the GPU chip and the like for a long time. To solve the problem that the fog is prolonged and the amount is also increased, the box humidity sensor 17 is arranged in the GPU box 4. The box humidity sensor 17 uses the fog data of the length of time and the amount of fog to control the closing of the air pipe pressure valve 15 through the automatic controller 13, that is, the air pipe pressure valve 15 can be opened in advance by the fog data before the temperature of the chip temperature sensor 16 reaches 45℃, so that the fog in the GPU box 4 is forcibly driven out by the high-pressure cooling gas in advance, and the fog is driven out in an emergency under the special bad condition that the environmental humidity is 85% or more, so as to protect the GPU chip and the like from the influence of the fog.

[0100] Advantages of the present application:

[0101] First, the energy of the recovered refrigeration: the cooling gas for circulation and heat dissipation can be energy recovered, the temperature of the cooling gas is reduced without increasing the energy consumption, and the GPU can work in a better temperature environment. The gas for cooling the GPU chip and the like is sealed and used in circulation, the energy of the refrigeration gas can be recycled, and the temperature of the heat absorption gas flowing out of the GPU box can be selected to be 25℃ to 35℃, which is lower than 50℃ to 60℃ of the fan cooling technology at present, and the temperature of the heat absorption gas flowing out of the GPU box is selected to be 25℃ to 35℃, which is the most suitable working temperature for the GPU and CPU, and a better temperature environment.

[0102] Second, the heat dissipation gas seal cycle solves the pollution and oxidation problems: GPU box or chassis has two holes for gas in and out, the pipeline and refrigeration settings are connected into a sealed circulating gas channel, preferably inert gas in the sealed circulating gas channel, solving the dust pollution and oxidation of GPU and mainboard components using external air.

[0103] Third, the cost of adding new inert gas is high: the inert gas is selected as the normal temperature gas of GPU and CPU, and the sealed circulating gas system is used to solve the problem of not needing to add inert gas at any time to reduce the cost, and if adding, the discharge of high-temperature gas at any time is difficult to equal the same time flow value of the newly added inert gas, and the gas pressure in the sealed system is difficult to control.

[0104] Fourth, 10-17℃ cooling gas can be obtained by using normal temperature water: the energy consumption of heat absorption gas cooling is reduced, the heat pump water spray cooling device is selected for cooling, and the water for cooling can be reused to reduce the cost; while using cold air as a medium for cooling, the cold air cannot be reused and the cost is low. 10-17℃ cooling gas can be obtained, and the cold air energy is not fully utilized when the air conditioner cools the heat absorption gas, and the air conditioner's large amount of refrigeration energy is wasted.

[0105] Fifth, improve the temperature difference to save water spray cooling energy consumption, and GPU works in a better state: the temperature difference between the high-temperature gas separated by the heat pump at 60-65℃ and the normal temperature water is large, and the temperature difference between the 25-35℃ or 35-45℃ heat absorption gas and the normal temperature water is small, so the high-temperature gas separated by the heat pump is used for water spray cooling, which is more energy-saving than directly using 25-35℃ or 35-45℃ heat absorption gas and normal temperature water for cooling. From the perspective of reducing the temperature of all heat absorption gas to the specified temperature per unit time, the use of normal temperature water for cooling with 60-65℃ high-temperature gas separated by the heat pump requires less water and is more energy-efficient.

[0106] In addition,

[0107] The present application uses positive high-pressure cooling gas to solve the problem of fog and dew in the GPU box 4, and the high-pressure generated gas flow rate is 20-40m / s, which is greater than the fan air flow rate, so that the fan can be omitted to greatly reduce the noise of the machine room; 10-17℃ high-pressure cooling gas can be used to select the gap mode to provide cold air, which can fully utilize the cold air and save refrigeration energy; solving the fog and dew problem can use low-temperature 10-17℃ cold air to cool the GPU chip and other components faster, and the fan gas temperature is lower and better protects the GPU chip and other components, ensuring that the working temperature of the GPU chip and other components does not exceed the temperature, and the operation efficiency of the GPU chip is improved; that is, energy saving and noise reduction, and operation efficiency is improved.

[0108] The high-pressure cooling gas is used to realize the heat dissipation of the GPU chip and the heat sink 3 in the gap mode, save the heat dissipation energy consumption, improve the operation efficiency, save the computing power cost, and reduce the noise of the machine room.

[0109] The temperature and humidity control loop outputs cooling gas in the gap mode, and the chip temperature sensor 16 and the humidity sensor 17 in the box control the gas pipe pressure valve 15, whether the cooling gas is output to the GPU chip and the heat sink 3, which is the key component of the cooling gas output in the gap mode, and is the final component of the cooling gas output in the gap mode, which realizes the automatic gap mode of the high-pressure cooling gas and protects the GPU chip from the influence of fog and dew.

[0110] The heat dissipation energy consumption control loop selects the working energy consumption power according to the temperature of the cooling water, and the combined pipe temperature sensor controls the multiple power controllers to determine the heat dissipation energy consumption power according to the high and low temperature of the external environment. BRIEF DESCRIPTION OF DRAWINGS

[0111] Figure 1 The figure is a schematic diagram of the connection and control relationship of the equipment used by the server of the application for the heat dissipation of the GPU chip and the heat sink.

[0112] Figure 2 The figure is a schematic diagram of the high-pressure cooling gas flow sequence of each component of the application.

[0113] In the figure, 1 is a gas pressure pump, 2 is a high-pressure gas storage tank, 3 is a GPU chip and a heat sink, 4 is a GPU box, 5 is an air inlet hole, 6 is an air outlet hole, 7 is a gas pressure pump outlet pipe, 8 is a gas tank outlet pipe, 9 is a gas pressure sensor, 10 is a power line, 11 is a gas pump electric original switch, 13 is an automatic controller, 14 is a one-way valve, 15 is a gas pipe pressure valve, 16 is a chip temperature sensor, 17 is a humidity sensor in the box, 40 is a heat pump, 41 is a cooling device, 42 is a heat pump air inlet pipe, 43 is a low-temperature air outlet pipe, 44 is a gas pump air inlet, 45 is a high-temperature air outlet pipe, 56 is a cooling device air outlet pipe, 47 is a two-gas combined pipe, 48 is a combined pipe temperature sensor, 49 is a multiple power controller, and 50 is a hot gas pipe pressure valve. DETAILED DESCRIPTION

[0114] Example 1, energy-saving method for cooling GPU chip with closed-loop high-pressure cold gas

[0115] As Figure 1 , 2 ,

[0116] The energy-saving method for cooling GPU chip by closed cycle high-pressure cold gas, comprising a gas pressure pump 1, a high-pressure cold gas storage tank 2, a GPU chip and a radiator 3, a chip temperature sensor 16 and an automatic controller 13; the chip temperature sensor 16 and the GPU chip and the radiator 3 are arranged in a GPU box 4, the GPU box 4 is provided with an air inlet hole 5 and an air outlet hole 6, the gas pressure pump 1 is provided with a gas pump power switch 11, characterized in that:

[0117] Further comprising a heat pump 40 and a cooling device 41; the pressure pump 1, the high-pressure cold gas storage tank 2, the GPU chip and the radiator 3, the heat pump 40, the cooling device 41 and the pressure pump 1 are sequentially communicated by pipes to form a gas circulation sealed loop channel;

[0118] In the circulating gas sealed loop, the high-pressure cooling gas discharged from the high-pressure cold gas storage tank 2 is used to cool the GPU chip and the radiator 3, the high-pressure cooling gas becomes a heat-absorbed gas which is discharged from the GPU box 4, the heat-absorbed gas is divided into high-temperature gas and low-temperature gas by the heat pump 40, the high-temperature gas is cooled by the cooling device 41 and then mixed with the low-temperature gas to form cooling gas for cooling, the cooling gas is pressurized by the gas pressure pump 1 to become high-pressure cooling gas, the high-pressure cooling gas is repeatedly used for cooling the GPU chip and the radiator 3 by the high-pressure cold gas storage tank 2, and the GPU chip and the radiator 3 are controlled within a set temperature variation range; the specific process is as follows:

[0119] The high-pressure cooling gas in the high-pressure cooling gas storage tank 2 is blown into the GPU box 4 to cool the GPU chip and the heat sink 3, and the high-pressure cooling gas becomes heat-absorbed gas. After the heat-absorbed gas is sucked into the heat pump 40, the heat pump 40 discharges the heat-absorbed gas into high-temperature gas and low-temperature gas. The high-temperature gas in the high-temperature gas pipeline enters the cooling device 41, and the cooling device 41 cools the high-temperature gas into normal-temperature gas. The low-temperature gas and the normal-temperature gas enter the two-gas combination pipeline 47 to be mixed into cooling gas. The cooling gas is pressurized by the gas pressure pump 1 into high-pressure cooling gas and stored in the high-pressure cooling gas storage tank 2 for standby. The high-pressure cooling gas is used as standby high-pressure cooling gas to reduce the temperature of the GPU chip and the heat sink 3. When the temperature of the GPU chip and the heat sink 3 reaches or exceeds the specified high temperature, the chip temperature sensor 16 and the automatic controller 13 send signals to open the gas pipeline pressure valve 15 on the gas tank outlet pipeline 8 of the high-pressure cooling gas storage tank 2. The high-pressure cooling gas is blown into the GPU box 4 again to cool the GPU chip and the heat sink 3. When the temperature of the GPU chip and the heat sink 3 drops to or exceeds the specified low temperature, the chip temperature sensor 16 and the automatic controller 13 send signals to close or slightly open the gas pipeline pressure valve 15 on the gas tank outlet pipeline 8 of the high-pressure cooling gas storage tank 2. At the same time, the automatic controller 13 causes the heat pump 40 to suck the heat-absorbed gas in the GPU box 4. The heat-absorbed gas is discharged by the heat pump 40 into high-temperature gas and low-temperature gas. The high-temperature gas is cooled by the cooling device 41 into normal-temperature gas. The normal-temperature gas is mixed with the low-temperature gas into cooling gas, which is used to cool the GPU chip and the heat sink 3. The cooling gas is pressurized by the gas pressure pump 1 into high-pressure cooling gas and stored in the high-pressure cooling gas storage tank 2 for repeated use.

[0120] According to the temperature changes of the GPU chip and the heat sink 3 at different times, the high-pressure cooling gas is discharged in an intermittent manner to achieve energy saving. The temperature sensor 16 controls the opening, slight opening, or closing of the gas pipeline electromagnetic valve 15 through the automatic controller 13 to control the output amount and output time of the high-pressure cooling gas in the high-pressure cooling gas storage tank 2 to the GPU chip and the heat sink 3, so that the high-pressure cooling gas is discharged in an intermittent manner to cool the GPU chip and the heat sink 3.

[0121] The GPU chip and the heat sink 3 continuously generate heat. The high-pressure cooling gas is continuously converted into heat-absorbed gas, high-temperature gas and low-temperature gas, high-temperature gas into normal-temperature gas, low-temperature gas and normal-temperature gas into cooling gas, and cooling gas into high-pressure cooling gas in a sealed cycle to continuously cool and lower the temperature of the GPU chip and the heat sink 3.

[0122] The energy-saving method for cooling GPU chip by using closed cycle high-pressure cold gas, characterized in that: in the circulating gas sealed loop, the cooling gas for cooling the GPU chip and the heat sink 3 becomes the heat-absorbed gas discharged from the GPU box 4, the heat-absorbed gas is divided into high-temperature and low-temperature gases by the heat pump 40, the high-temperature gas is cooled by the cooling device 41, and then mixed with the low-temperature gas to become the cooling gas for cooling and is reused for cooling, and the specific process is as follows:

[0123] The high-pressure cooling gas with 105KPa-150KPa and temperature of 10℃-17℃ is blown into the GPU box 4 to cool the GPU chip and the heat sink 3 to become the heat-absorbed gas with 25℃-35℃, the heat-absorbed gas is sucked into the heat pump 40, and then the heat pump 40 divides the heat-absorbed gas into high-temperature and low-temperature gases, i.e. 60℃-65℃ high-temperature gas and 5℃-17℃ low-temperature gas, the high-temperature gas enters the cooling device 41 in the high-temperature gas pipeline, the high-temperature gas in the high-temperature gas pipeline is cooled to become normal-temperature gas, and then the two kinds of gases enter the two-gas combination pipeline 47 to be mixed into 10℃-17℃ cooling gas, which is pressurized by the gas pressure pump 1 into 105KPa-150KPa high-pressure cooling gas with temperature of 10℃-17℃, and is stored in the high-pressure cooling gas storage tank 2 as standby gas for reducing the temperature of the GPU chip and the heat sink 3, when the temperature of the GPU chip and the heat sink 3 reaches 25℃-35℃ or 35℃-45℃, the gas pipe pressure valve 15 on the gas tank outlet pipe 8 connecting the GPU chip and the heat sink 3 and the high-pressure cooling gas storage tank 2 is pressed, and the 105KPa-150KPa high-pressure cooling gas with temperature of 10℃-17℃ is blown into the GPU box 4 again to cool the GPU chip and the heat sink 3, the high-pressure cooling gas continuously and sequentially changes from high-pressure cooling gas, heat-absorbed gas, high-temperature gas and low-temperature gas, high-temperature gas to normal-temperature gas, low-temperature gas and normal-temperature gas mixed into cooling gas, and cooling gas to high-pressure cooling gas in the sealed cycle, and the GPU chip and the heat sink 3 are continuously and continuously cooled.

[0124] The sealed gas channel is clean and dust-free air, preferably inert gas such as nitrogen or carbon dioxide gas, or other inert gas.

[0125] The purpose of this embodiment is to use clean gas and inert gas, and also to recycle refrigeration energy to provide conditions for using lower temperature cooling gas than existing fans, so that the GPU, CPU, mainboard and other heat generating components can operate in a constant temperature state below 25℃-35℃, and the working efficiency of the GPU, CPU, mainboard and other heat generating components is improved,

[0126] The first requirement of this embodiment is a sealed circulating gas system, the purpose is that the gas is clean and can be used with inert gas, and it can also recover the refrigeration energy and provide conditions for using gas with lower temperature than the existing fan for heat dissipation, so that the GPU, CPU, motherboard and other heat generating components can operate in a constant temperature state below 25°C-35°C, and the working efficiency of the GPU, CPU, motherboard and other heat generating components is improved.

[0127] Parameter setting: the low temperature rating of the GPU chip and the heat sink 3 can be selected as 25°C or 35°C, and the high temperature rating can be selected as 45°C or 65°C, in order to realize this temperature rating combination, the high-pressure cooling gas used in this embodiment has a pressure of 105KPa-150KPa and a temperature of 10°C-17°C, and the values of various parameters such as the diameter and length of the gas delivery pipe and the degree of bending are determined according to whether the GPU is in a small space such as the GPU box 4 or in a large space such as the case.

[0128] More specific temperature control of the GPU chip and the heat sink is as follows:

[0129] The chip temperature sensor 16 controls the opening, slight opening or closing of the gas pipe electromagnetic valve 15 through the automatic controller 13 to control the delivery amount and time of the high-pressure cooling gas in the high-pressure cooling gas tank 2 to the GPU chip and the heat sink 3, and to realize the heat dissipation of the high-pressure cooling gas to the GPU chip and the heat sink 3 in a gap mode, so as to control the GPU chip and the heat sink 3 within the set temperature and humidity variation range; the specific mode is as follows:

[0130] When the temperature of the chip temperature sensor 16 reaches the rated high temperature set value set by the automatic controller 13, the chip temperature sensor 16 drives the automatic controller 13 to open the gas pipe electromagnetic valve 15, and the gas outlet pipe 8 of the gas tank releases a large amount of high-pressure cooling gas to the GPU chip and the heat sink 3 in the GPU box 4, so as to quickly cool the GPU chip and the heat sink 3;

[0131] When the temperature of the chip temperature sensor 16 reaches the rated low temperature set value set by the automatic controller 13, the chip temperature sensor 16 drives the automatic controller 13 to slightly open the gas pipe electromagnetic valve 15, and the gas outlet pipe 8 of the gas tank releases a small amount of high-pressure cooling gas to the GPU chip and the heat sink 3 in the GPU box 4, so as to maintain the low temperature of the GPU chip and the heat sink 3 or slowly raise the temperature of the GPU chip and the heat sink 3;

[0132] Or when the temperature of the chip temperature sensor 16 reaches the rated low temperature set value set by the automatic controller 13, the chip temperature sensor 16 drives the automatic controller 13 to close the gas pipe electromagnetic valve 15.

[0133] The chip temperature sensor 16 is generally provided with the GPU chip and does not need to be additionally installed. Only the connection pin of the temperature sensor on the GPU chip or the temperature sensor connection on the mainboard is welded with a wire, and the wire is welded with the automatic controller 13.

[0134] The air pipe electromagnetic valve 15 is selected to have a gradually changing valve from small to large, so that after the cooling of the GPU chip and the radiator 3 reaches the rated value, it can not be completely closed, and a small gap is left to flow out a small amount of cooling gas, as compensation for the part of heat consumed by the temperature rise of the GPU chip and the radiator 3, and to prolong the time for the GPU chip and the radiator 3 to reach the high temperature rated value again.

[0135] Example 2, energy-saving method for cooling GPU chip with closed-loop high-pressure cold gas

[0136] As Figure 1 , 2 ,

[0137] In the method of example 1, when the temperature of the chip temperature sensor 16, i.e. the temperature of the already absorbed heat gas, reaches the rated high temperature setting value of 35℃, the temperature of the chip temperature sensor 16 near the GPU chip and the radiator 3 reaches the rated high temperature setting value set by the automatic controller 13, the pressure of the high-pressure cooling gas released from the gas tank outlet pipe 8 of the high-pressure cooling gas storage tank 2 is 130KPa-150KPa, and the temperature is 10℃-17℃; that is, the temperature of the already absorbed heat gas is high, and the pressure of the high-pressure cooling gas is large.

[0138] If the temperature of the chip temperature sensor 16, i.e. the temperature of the already absorbed heat gas, reaches the rated low temperature setting value of 25℃, when the temperature of the chip temperature sensor 16 near the GPU chip and the radiator 3 reaches the rated low temperature setting value set by the automatic controller 13, the air pipe electromagnetic valve 15 is slightly opened, the pressure of the small amount of high-pressure cooling gas released from the gas tank outlet pipe 8 of the high-pressure cooling gas storage tank 2 is 105KPa-130KPa, and the temperature is 10℃-17℃; that is, the temperature of the already absorbed heat gas is low, and the pressure of the high-pressure cooling gas is small. Or when the temperature of the chip temperature sensor 16 reaches the rated low temperature setting value set by the automatic controller 13, the air pipe electromagnetic valve 15 is closed and no high-pressure cooling gas is released.

[0139] Example 3, energy-saving method for cooling GPU chip with closed-loop high-pressure cold gas

[0140] As Figure 1 , 2 ,

[0141] In the methods of examples 1 and 2, the automatic controller 13 controls the GPU chip and the radiator 3 as follows:

[0142] The power switch 11 is arranged on the power line 10 of the air pressure pump 1.

[0143] The gas pressure sensor 9 is arranged in the high-pressure cooling gas storage tank 2.

[0144] The gas pipe electromagnetic valve 15 is arranged on the gas tank outlet pipe 8 of the high-pressure cooling gas storage tank 2.

[0145] The chip temperature sensor 16 and the humidity sensor 17 are arranged in the GPU box 4.

[0146] The combined pipe temperature sensor 48 is arranged in the cooling gas pipe, i.e. the two-gas combined pipe 47, entering the air pressure pump 1.

[0147] The multiple power controllers 49 are arranged in the heat pump 40.

[0148] The hot gas pipe pressure valve 50 is arranged on the heat pump inlet pipe 42 connecting the GPU box 4 and the heat pump 40.

[0149] The automatic controller 13 is electrically connected to the gas pressure sensor 9, the power switch 11, the gas pipe electromagnetic valve 15, the chip temperature sensor 16, the humidity sensor 17, the combined pipe temperature sensor 48, the multiple power controllers 49, and the hot gas pipe pressure valve 50.

[0150] Firstly, the temperature adjustment method of the chip temperature sensor 16 in the GPU box 4 is as follows:

[0151] The chip temperature sensor 16 controls the opening, slight opening, or closing of the gas pipe electromagnetic valve 15 and the hot gas pipe pressure valve 50 through the automatic controller 13 to control the amount and time of the high-pressure cooling gas in the high-pressure cooling gas storage tank 2 to the GPU chip and the heat sink 3, so as to realize the gap mode of the high-pressure cooling gas to the GPU chip and the heat sink 3, and control the GPU chip and the heat sink 3 within the set temperature variation range. The specific method is as follows:

[0152] When the temperature of the chip temperature sensor 16 reaches the rated high temperature set value set by the automatic controller 13, the chip temperature sensor 16 drives the automatic controller 13 to drive the gas pipe electromagnetic valve 15 and the hot gas pipe pressure valve 50 to be opened, and the heat pump 40 absorbs the heated gas in the GPU box 4; the gas tank outlet pipe 8 releases a large amount of high-pressure cooling gas to the GPU chip and the heat sink 3 in the GPU box 4, so as to rapidly cool the GPU chip and the heat sink 3.

[0153] When the temperature of the chip temperature sensor 16 reaches the rated low temperature set value set by the automatic controller 13, the chip temperature sensor 16 drives the automatic controller 13 to drive the air pipe electromagnetic valve 15 and the hot air pipe pressure valve 50 to be slightly opened, and the high-pressure cooling gas in the gas tank outlet pipe 8 is discharged to the GPU chip and the heat sink 3 in the GPU box 4, so as to keep the GPU chip and the heat sink 3 at low temperature or slowly heat up the GPU chip and the heat sink 3; or when the temperature of the chip temperature sensor 16 reaches the rated low temperature set value set by the automatic controller 13, the automatic controller 13 drives the hot air pipe pressure valve 50 to be slightly opened, and the chip temperature sensor 16 drives the automatic controller 13 to drive the air pipe electromagnetic valve 15 to be closed.

[0154] Secondly, the humidity adjusting method of the humidity sensor 17 in the box is as follows:

[0155] The humidity sensor 17 in the box controls the opening, slight opening or closing of the air pipe electromagnetic valve 15 and the hot air pipe pressure valve 50 through the automatic controller 13, so as to control the amount and time of the high-pressure cooling gas in the high-pressure cooling gas tank 2 to the GPU chip and the heat sink 3, and realize the removal of the high-pressure cooling gas in the gap to remove the dew on the GPU chip and the heat sink 3, so as to control the humidity in the GPU box 4 in the set humidity change range; the specific method is as follows:

[0156] When the humidity of the humidity sensor 17 in the box reaches the rated high humidity set value set by the automatic controller 13, the humidity sensor 17 in the box drives the automatic controller 13 to drive the air pipe electromagnetic valve 15 and the hot air pipe pressure valve 50 to be opened, and the heat pump 40 absorbs the heated gas in the GPU box 4; the high-pressure cooling gas in the gas tank outlet pipe 8 is discharged to the GPU chip and the heat sink 3 in the GPU box 4, so as to quickly reduce the humidity on the surface of the GPU chip and the heat sink 3 and in the environment in the GPU box 4;

[0157] When the humidity of the humidity sensor 17 in the box reaches the rated low humidity set value set by the automatic controller 13, the humidity sensor 17 in the box drives the automatic controller 13 to drive the air pipe electromagnetic valve 15 and the hot air pipe pressure valve 50 to be slightly opened, and the high-pressure cooling gas in the gas tank outlet pipe 8 is discharged to the GPU chip and the heat sink 3 in the GPU box 4; or when the humidity of the humidity sensor 17 in the box reaches the rated low humidity set value set by the automatic controller 13, the automatic controller 13 drives the hot air pipe pressure valve 50 to be slightly opened, and the humidity sensor 17 in the box drives the automatic controller 13 to drive the air pipe electromagnetic valve 15 to be closed.

[0158] Embodiment 4, energy-saving method for cooling GPU chip by using closed-loop high-pressure cooling gas

[0159] As Figure 1 , 2 ,

[0160] In the method of embodiment 1 and 2 and 3, the automatic controller 13 regulates the heat pump 40 and the air pressure pump 1 as follows:

[0161] The automatic controller 13 regulates the heat pump 40 as follows:

[0162] When the temperature of the combined pipe temperature sensor 48 in the two gas combined pipe 47 is higher than the set 17℃ temperature value, the combined pipe temperature sensor 48 drives the automatic controller 13 to drive the multiple power controller 49 to change to a larger power gear, and the heat pump 40 works with less power consumption;

[0163] When the temperature of the combined pipe temperature sensor 48 in the two gas combined pipe 47 is lower than the set 10℃ temperature value, the combined pipe temperature sensor 48 drives the automatic controller 13 to drive the multiple power controller 49 to change to a smaller power gear, and the heat pump 40 works with less power consumption.

[0164] The automatic controller 13 regulates the air pressure pump 1 as follows:

[0165] A gas pressure sensor 9 is arranged in the high-pressure cooling gas tank 2, and a power automatic switch 11 is arranged on the power supply line 10 of the air pressure pump 1; the gas pressure sensor 9 is connected with the power automatic switch 11 and the automatic controller 13 to form a control loop of 105KPa-150KPa normal rated gas pressure, or the power automatic switch 11 is turned on for 10 seconds and turned off for 5 seconds to form a cycle rated working time, to achieve the output of high-pressure cooling gas.

Claims

1. An energy-saving method for cooling a GPU chip using closed-loop high-pressure cold air, comprising a pressure pump (1), a high-pressure cold air storage box (2), a GPU chip and a heat sink (3), a chip temperature sensor (16), and an automatic controller (13); the chip temperature sensor (16) and the GPU chip and heat sink (3) are all located inside a GPU housing (4), the GPU housing (4) is provided with an air inlet (5) and an air outlet (6), and the pressure pump (1) is provided with a pump power switch (11), characterized in that: It also includes a heat pump (40) and a cooling device (41); the pressure pump (1), the high-pressure cold air box (2), the GPU chip and heat sink (3), the heat pump (40), the cooling device (41) and the pressure pump (1) are connected in sequence by pipes to form a gas circulation sealed loop channel; In the closed-loop gas circulation, the high-pressure cooling gas discharged from the high-pressure cold gas tank (2) dissipates heat from the GPU chip and heat sink (3). The high-pressure cooling gas becomes heat-absorbing gas and is discharged from the GPU box (4). The heat-absorbing gas is separated into high and low temperature gases by the heat pump (40) and discharged. The high-temperature gas is cooled by the cooling device (41) and then mixed with the low-temperature gas to form cooling gas for heat dissipation. This cooling gas is pressurized again by the air pressure pump (1) to become high-pressure cooling gas. This high-pressure cooling gas is then reused by the high-pressure cold gas tank (2) to dissipate heat from the GPU chip and heat sink (3), keeping the GPU chip and heat sink (3) within the set temperature variation range. The specific process is as follows: High-pressure cooling gas from the high-pressure cooling gas storage tank (2) is blown into the GPU box (4) to cool the GPU chip and heat sink (3), turning the high-pressure cooling gas into heat-absorbing gas. After the heat-absorbing gas is drawn in by the heat pump (40), the heat pump (40) separates the heat-absorbing gas into two types of gas, namely high-temperature gas and low-temperature gas, and discharges them. The high-temperature gas enters the cooling device (41) in the high-temperature gas pipe. After the cooling device (41) cools the high-temperature gas to room temperature, both the low-temperature gas and the room-temperature gas enter the two-gas merging pipe (47) to mix into cooling gas. The cooling gas is then pressurized by the air pressure pump (1) into high-pressure cooling gas and stored in the high-pressure cooling gas storage tank (2) for later use as backup high-pressure cooling gas to reduce the temperature of the GPU chip and heat sink (3). When the temperature of the GPU chip and heat sink (3) reaches or exceeds the specified high temperature, the signals from the chip temperature sensor (16) and the automatic controller (13) are activated. The gas pressure valve (15) on the gas outlet pipe (8) of the high-pressure cooling gas tank (2) is opened, and the high-pressure cooling gas is blown back into the GPU box (4) to cool the GPU chip and the heat sink (3). When the temperature of the GPU chip and the heat sink (3) drops to or exceeds the specified low temperature, the signal from the chip temperature sensor (16) and the automatic controller (13) causes the gas pressure valve (15) on the gas outlet pipe (8) of the high-pressure cooling gas tank (2) to close or slightly open. At the same time, the automatic controller (13) causes the heat pump (40) to draw in the heat-absorbing gas in the GPU box (4). The heat-absorbing gas is separated into high and low temperature gases by the heat pump (40) and discharged. The high temperature gas is cooled by the cooling device (41) to become room temperature gas. The room temperature gas and the low temperature gas are mixed to form cooling gas for cooling the GPU chip and the heat sink (3). The cooling gas is then pressurized by the pressure pump (1) into high-pressure cooling gas and stored in the high-pressure cooling gas tank (2) for reuse. According to the temperature changes of the GPU chip and heat sink (3) at different times, the high-pressure cooling gas is discharged intermittently to achieve energy saving: the temperature sensor (16) controls the opening, slight opening or closing of the gas pipe solenoid valve (15) through the automatic controller (13) to control the output amount and output time of the high-pressure cooling gas in the high-pressure cold gas box (2) to the GPU chip and heat sink (3), thereby generating high-pressure cooling gas discharged intermittently to dissipate heat from the GPU chip and heat sink (3); The GPU chip and heat sink (3) continuously generate heat. The high-pressure cooling gas continuously cycles through high-pressure cooling gas, heat-absorbing gas, high-temperature gas and low-temperature gas, high-temperature gas becomes room-temperature gas, low-temperature gas and room-temperature gas mix to form cooling gas, and cooling gas becomes high-pressure cooling gas in a sealed cycle, continuously cooling the GPU chip and heat sink (3).

2. The energy-saving method for cooling a GPU chip using closed-loop high-pressure cold air according to claim 1, characterized in that: The temperature of the high-pressure cooling gas released from the high-pressure cooling gas storage box (2) is 10℃-17℃.

3. The energy-saving method for cooling a GPU chip using closed-loop high-pressure cold air according to claim 2, characterized in that: The pressure of the high-pressure cooling gas released from the high-pressure cooling gas storage box (2) is 105KPa-150KPa.

4. The energy-saving method for cooling a GPU chip using closed-loop high-pressure cold air according to claim 3, characterized in that: When the temperature of the chip temperature sensor (16) near the GPU chip and heat sink (3) reaches the rated high temperature setting value set by the automatic controller (13), a large amount of high pressure cooling gas is released from the gas storage tank outlet pipe (8) of the high pressure cooling gas tank (2) at a pressure of 130KPa-150KPa and a temperature of 10℃-17℃. When the temperature of the chip temperature sensor (16) near the GPU chip and heat sink (3) reaches the rated low temperature setting value set by the automatic controller (13), the gas pipe solenoid valve (15) opens slightly, and a small amount of high-pressure cooling gas with a pressure of 105KPa-130KPa and a temperature of 10℃-17℃ is released from the gas storage tank outlet pipe (8) of the high-pressure cooling gas tank (2); or when the temperature of the chip temperature sensor (16) reaches the rated low temperature setting value set by the automatic controller (13), the gas pipe solenoid valve (15) closes and no high-pressure cooling gas is released.

5. The energy-saving method for cooling a GPU chip using closed-loop high-pressure cold air according to claim 2, 3, or 4, characterized in that: The low-temperature gas separated by the heat pump (40) is 5℃-17℃, and the high-temperature gas separated by the heat pump (40) is 60℃-65℃.

6. The energy-saving method for cooling a GPU chip using closed-loop high-pressure cold air according to claim 5, characterized in that: A power switch (11) is provided on the power cord (10) connected to the air pressure pump (1). A gas pressure sensor (9) is installed in the high-pressure cooling gas storage box (2). A gas pipe solenoid valve (15) is provided on the gas outlet pipe (8) of the high-pressure cooling gas storage box (2). A chip temperature sensor (16) and a humidity sensor (17) are provided in the GPU box (4). A temperature sensor (48) for the combined pipe is installed in the cooling gas pipe (47) that enters the air pressure pump (1). The heat pump (40) is equipped with multiple power controllers (49). An exhaust pipe pressure valve (50) is provided on the heat pump inlet pipe (42) connecting the GPU box (4) and the heat pump (40). The automatic controller (13) is connected by wires to the gas pressure sensor (9), power switch (11), gas tube solenoid valve (15), chip temperature sensor (16), humidity sensor (17), combined tube temperature sensor (48), multiple power controller (49), and outlet gas pressure valve (50). The chip temperature sensor (16) regulates the temperature inside the GPU casing (4) as follows: The chip temperature sensor (16) controls the opening, slight opening, or closing of the air pipe solenoid valve (15) and the outlet air pressure valve (50) through the automatic controller (13), thereby controlling the flow rate and time of the high-pressure cooling gas in the high-pressure cooling gas tank (2) to the GPU chip and heat sink (3), realizing the intermittent discharge of high-pressure cooling gas to dissipate heat from the GPU chip and heat sink (3), and controlling the GPU chip and heat sink (3) within the set temperature change range; the specific method is as follows: When the temperature of the chip temperature sensor (16) reaches the rated high temperature set value of the automatic controller (13), the chip temperature sensor (16) causes the automatic controller (13) to drive the air pipe solenoid valve (15) and the air outlet pressure valve (50) to open. The heat pump (40) sucks away the heat-absorbing gas in the GPU box (4). The air storage box outlet pipe (8) releases a large amount of high-pressure cooling gas to the GPU chip and heat sink (3) in the GPU box (4) to quickly cool down the GPU chip and heat sink (3). When the temperature of the chip temperature sensor (16) reaches the rated low temperature setting value set by the automatic controller (13), the chip temperature sensor (16) causes the automatic controller (13) to drive the air pipe solenoid valve (15) and the air outlet pressure valve (50) to open slightly. The air outlet pipe (8) of the air storage box releases a small amount of high-pressure cooling gas to the GPU chip and heat sink (3) in the GPU box (4) to keep the GPU chip and heat sink (3) at a low temperature or to slowly heat up the GPU chip and heat sink (3); or when the temperature of the chip temperature sensor (16) reaches the rated low temperature setting value set by the automatic controller (13), the automatic controller (13) drives the air outlet pressure valve (50) to open slightly, and the chip temperature sensor (16) causes the automatic controller (13) to drive the air pipe solenoid valve (15) to close.

7. The energy-saving method for cooling a GPU chip using closed-loop high-pressure cold air according to claim 6, characterized in that: The humidity adjustment method of the in-box humidity sensor (17) for the GPU box (4) is as follows: The humidity sensor (17) inside the box controls the opening, slight opening, or closing of the air pipe solenoid valve (15) and the air outlet pressure valve (50) through the automatic controller (13), thereby controlling the flow rate and time of the high-pressure cooling gas in the high-pressure cooling gas tank (2) to the GPU chip and heat sink (3), so as to remove the mist and condensation from the GPU chip and heat sink (3) by the high-pressure cooling gas that is discharged intermittently, and control the humidity inside the GPU box (4) within the set humidity variation range; the specific method is as follows: When the humidity of the humidity sensor (17) inside the box reaches the rated high humidity setting value set by the automatic controller (13), the humidity sensor (17) inside the box causes the automatic controller (13) to drive the air pipe solenoid valve (15) and the air outlet pressure valve (50) to open. The heat pump (40) sucks away the heat-absorbing gas inside the GPU box (4). The air outlet pipe (8) of the air storage box releases a large amount of high-pressure cooling gas to the GPU chip and heat sink (3) inside the GPU box (4), which quickly dehumidifies the surface of the GPU chip and heat sink (3) and the environment inside the GPU box (4). When the humidity of the humidity sensor (17) inside the box reaches the rated low humidity setting value set by the automatic controller (13), the humidity sensor (17) inside the box causes the automatic controller (13) to drive the air pipe solenoid valve (15) and the air outlet pressure valve (50) to open slightly, and the air outlet pipe (8) of the air storage box releases a small amount of high-pressure cooling gas to the GPU chip and heat sink (3) inside the GPU box (4); or when the humidity of the humidity sensor (17) inside the box reaches the rated low humidity setting value set by the automatic controller (13), the automatic controller (13) drives the air outlet pressure valve (50) to open slightly, and the humidity sensor (17) inside the box causes the automatic controller (13) to drive the air pipe solenoid valve (15) to close.

8. The energy-saving method for cooling a GPU chip using closed-loop high-pressure cold air according to claim 7, characterized in that: When the temperature of the combined pipe temperature sensor (48) in the combined pipe (47) is higher than the set temperature value, the combined pipe temperature sensor (48) causes the automatic controller (13) to drive the multiple power controller (49) to switch to a larger power level, and the power consumption of the heat pump (40) increases. When the temperature of the combined pipe temperature sensor (48) in the combined pipe (47) is lower than the set temperature value, the combined pipe temperature sensor (48) causes the automatic controller (13) to drive the multiple power controller (49) to switch to a lower power level, and the power consumption of the heat pump (40) is reduced.

9. The energy-saving method for cooling a GPU chip using closed-loop high-pressure cold air according to claim 5, characterized in that: A gas pressure sensor (9) is installed in the high-pressure cooling gas storage tank (2), and an automatic power switch (11) is installed on the power line (10) connected to the gas pressure pump (1); the gas pressure sensor (9), the automatic power switch (11), and the automatic controller (13) are connected to form a control loop that outputs high-pressure cooling gas at normal rated gas pressure or rated time.

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