Inductor components and mounting components

Abstract

The present application relates to an inductor component and a mounting component. The inductor component includes a base having a main surface, a coil disposed in the base and extending along the main surface, and first and second vertical wirings disposed in the base so as to have end surfaces exposed from the main surface of the base and connected to each of both ends of the coil. The coil has a coil wiring portion having first and second end portions and extending in a circumferential direction for one turn or less, a first land portion connected to the first end portion and connected to the first vertical wiring, and a second land portion connected to the second end portion and connected to the second vertical wiring. When viewed in a direction orthogonal to the main surface, at least a portion of the first land portion extends in a direction intersecting a direction connecting the first end portion and the second end portion and in a direction approaching an inner circumferential surface of the coil wiring portion, and at least a portion of the second land portion extends in a direction intersecting the direction connecting the first end portion and the second end portion and in a direction approaching the inner circumferential surface of the coil wiring portion.

Description

Technical Field

[0001] This disclosure relates to inductor components and mounting components. Background Technology

[0002] Conventionally, the technology described in Japanese Patent Application Publication No. 2014-13815 (Patent Document 1) exists as an inductor component. This inductor component includes a substrate, helical conductors disposed on both sides of the substrate, a magnetic layer covering the helical conductors, an external electrode disposed on the surface of the magnetic layer, a lead-out conductor connected to the outer peripheral end of the helical conductors, and a connecting conductor connecting the lead-out conductors and the external electrode. The helical conductors and the lead-out conductors constitute a coil. The lead-out conductors are disposed radially outside the helical conductors and extend along the edge of the substrate.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2014-13815

[0004] However, in the aforementioned existing inductor components, in order to increase the allowable DC superposition current in order to carry a large current, the spiral conductor is kept to have one or fewer turns in order to suppress magnetic saturation. It has been found that when attempting to actually manufacture such an inductor component, the following problems exist.

[0005] Because the two ends of the helical conductor are close together, the two leads connected to each end of the helical conductor are also close to each other, raising concerns about a short circuit between the two leads with the greatest potential difference in the coil. Additionally, because the two leads are positioned radially outward from the helical conductor, there is a concern that the inductor components will become too large. Summary of the Invention

[0006] Therefore, the purpose of this disclosure is to provide an inductor component and mounting component that can reduce the possibility of coil short circuits and achieve miniaturization of the inductor component.

[0007] To address the aforementioned issues, an inductor component according to one embodiment of this disclosure comprises: a substrate having a main surface; a coil disposed within the substrate and extending along the main surface; and a first vertical wiring and a second vertical wiring disposed within the substrate with end faces exposed from the main surface of the substrate and connected to each end of the coil. The coil comprises: a coil wiring portion having a first end and a second end, extending circumferentially for one turn or less; a first pad portion for connecting the first vertical wiring and connected to the first end; and a second pad portion for connecting the second vertical wiring and connected to the second end. When viewed from a direction orthogonal to the main surface, at least a portion of the first pad portion extends along a direction intersecting the direction connecting the first end and the second end and approaching the inner circumferential surface of the coil wiring portion. When viewed from a direction orthogonal to the main surface, at least a portion of the second pad portion extends along a direction intersecting the direction connecting the first end and the second end and approaching the inner circumferential surface of the coil wiring portion.

[0008] Here, "less than one turn of coil wiring" means that, when viewed from a direction orthogonal to the main plane, the coil wiring portion does not have portions that are adjacent in the radial direction of the coil and parallel in the winding direction (i.e., portions that are adjacent and overlap in the radial direction). "More than one turn of coil wiring" means that, when viewed from a direction orthogonal to the main plane, the coil wiring portion has portions that are adjacent in the radial direction of the coil and parallel in the winding direction. That is, "less than one turn of coil wiring" means that the aforementioned parallel portions do not exist, or that, when viewed from the axial direction of the coil, the two end faces of the coil wiring portion are connected to the same plane along the radial direction of the coil.

[0009] Furthermore, when viewed from a direction orthogonal to the main surface, the direction connecting the first end and the second end refers to the direction connecting the center of the width direction of the first end's edge and the center of the width direction of the second end's edge when viewed from a direction orthogonal to the main surface.

[0010] According to the above method, the first pad portion extends in a direction intersecting the direction connecting the first end and the second end and approaching the inner circumferential surface of the coil wiring portion, and the second pad portion extends in a direction intersecting the direction connecting the first end and the second end and approaching the inner circumferential surface of the coil wiring portion. This suppresses the mutual approach of the first pad portion and the second pad portion, reducing the possibility of a short circuit between the first pad portion and the second pad portion, which have the largest potential difference in the coil. Furthermore, it suppresses the radial outward extension of the first pad portion and the second pad portion of the coil, enabling miniaturization of the inductor component.

[0011] Preferably, in one embodiment of the inductor component, the matrix comprises magnetic powder and a resin containing the magnetic powder.

[0012] According to the above implementation method, the inductance can be improved.

[0013] Preferably, in one embodiment of the inductor component, it further comprises: a first external terminal that contacts the main surface and the end face of the first vertical wiring; and a second external terminal that contacts the main surface and the end face of the second vertical wiring.

[0014] According to the above embodiment, the first external terminal spans the main surface and the first vertical wiring, and the second external terminal spans the main surface and the second vertical wiring. Therefore, the size of the first external terminal and the second external terminal can be controlled, and the design of the first external terminal and the second external terminal can be selected from the viewpoint of installability and mechanical strength.

[0015] Preferably, in one embodiment of the inductor component, the substrate comprises magnetic powder, and the first external terminal and the second external terminal are in contact with the magnetic powder.

[0016] According to the above embodiments, the bonding strength between the first external terminal and the second external terminal and the substrate is improved.

[0017] Preferably, in one embodiment of the inductor component, a coating film disposed on the main surface is further provided, the coating film comprising a black colorant.

[0018] According to the above embodiment, by providing a coating film on the main surface, insulation between the external terminals can be reliably ensured when multiple external terminals are provided on the main surface. Furthermore, since the coating film is black, it can conceal surface damage to the substrate, thereby improving the appearance pass rate.

[0019] Preferably, in one embodiment of the inductor component, when viewed from a direction orthogonal to the main surface, the first pad portion has a straight first plane, which is the end face of the extension direction of the first pad portion and faces the inner peripheral face of the coil wiring portion. The shortest distance between the first plane and the inner peripheral face of the coil wiring portion is not the smallest distance between the outer surface of the first pad portion and the inner peripheral face of the coil wiring portion.

[0020] Here, the distance between the outer surface of the first pad portion and the inner circumferential surface of the coil wiring portion refers to the shortest distance between each of the multiple surfaces constituting the outer surface of the first pad portion and the inner circumferential surface of the coil wiring portion.

[0021] According to the above embodiment, the possibility of a short circuit between the first plane of the first pad portion and the inner peripheral surface of the coil wiring portion can be reduced.

[0022] Preferably, in one embodiment of the inductor component, when viewed from a direction orthogonal to the main surface, the first pad portion has: a straight first plane extending in a direction connecting the first end and the second end and facing the inner peripheral surface of the coil wiring portion; and a straight second plane extending in a direction orthogonal to the direction connecting the first end and the second end and facing the inner peripheral surface of the coil wiring portion. When a surface parallel to the first plane and in contact with the portion of the inner peripheral surface of the coil wiring portion that faces the first plane is designated as a first imaginary surface, and a surface parallel to the second plane and in contact with the portion of the inner peripheral surface of the coil wiring portion that faces the second plane is designated as a second imaginary surface, the distance a between the second imaginary surface and the second plane is less than the distance b between the first imaginary surface and the first plane.

[0023] According to the above embodiment, since distance a is smaller than distance b, the possibility of a short circuit between the first plane of the first pad portion and the portion of the inner peripheral surface of the coil wiring portion opposite to the first plane can be reduced. Even if a short circuit occurs between the second imaginary surface and the second plane, the variation in coil length can be suppressed compared to a short circuit occurring between the first imaginary surface and the first plane, thus suppressing the effect of interlayer short circuits.

[0024] Preferably, in one embodiment of the inductor component, when viewed from a direction orthogonal to the main surface, the first pad portion has: a straight first plane extending in a direction connecting the first end and the second end and facing the inner peripheral surface of the coil wiring portion; and a straight second plane extending in a direction orthogonal to the direction connecting the first end and the second end and facing the inner peripheral surface of the coil wiring portion. When a surface parallel to the first plane and in contact with the portion of the inner peripheral surface of the coil wiring portion that faces the first plane is designated as a first imaginary surface, and a surface parallel to the second plane and in contact with the portion of the inner peripheral surface of the coil wiring portion that faces the second plane is designated as a second imaginary surface, the distance a between the second imaginary surface and the second plane is equal to or greater than the distance b between the first imaginary surface and the first plane.

[0025] According to the above embodiment, since distance a is equal to or greater than distance b, the first pad portion can be enlarged in its extending direction. This increases the size of the first pad portion and improves the connection reliability between the first pad portion and the first vertical wiring.

[0026] Preferably, in one embodiment of the inductor component, the substrate comprises magnetic powder, and the distance 'a' between the second imaginary surface and the second plane is equal to or greater than twice the particle size D50 of the magnetic powder.

[0027] According to the above embodiments, by making the distance between the second imaginary surface and the second plane wider than that between the magnetic powder, the possibility of a short circuit between the second imaginary surface and the second plane can be further reduced.

[0028] Preferably, in one embodiment of the inductor component, when viewed from a direction orthogonal to the main surface, the shortest distance c between the first pad portion and the second pad portion is greater than the distance a between the second imaginary surface and the second plane.

[0029] According to the above embodiment, the possibility of a short circuit between the first pad portion and the second pad portion, which have the largest potential difference in the coil, can be further reduced. Even if a short circuit occurs between the second imaginary surface and the second plane, the variation in coil length can be suppressed compared to a short circuit occurring between the first pad portion and the second pad portion, thus suppressing the effect of interlayer short circuits.

[0030] Preferably, in one embodiment of the inductor component, when viewed from a direction orthogonal to the main surface, the shortest distance c between the first pad portion and the second pad portion is equal to or less than the distance a between the second imaginary surface and the second plane.

[0031] According to the above embodiment, since the first pad portion and the second pad portion can be brought closer together, the length of the coil wiring portion can be increased. Therefore, the coil length can be increased, thereby improving the inductance.

[0032] Preferably, in one embodiment of the inductor component, the substrate comprises magnetic powder, and the shortest distance c between the first pad portion and the second pad portion is equal to or greater than twice the particle size D50 of the magnetic powder.

[0033] According to the above embodiment, by making the distance between the first pad portion and the second pad portion wider than the magnetic powder, the possibility of a short circuit between the first pad portion and the second pad portion can be further reduced.

[0034] Preferably, in one embodiment of the inductor component, when viewed from a direction orthogonal to the main surface, the first pad portion has: a first portion extending from the first end along the direction connecting the first end and the second end; and a second portion extending from the first portion side along a direction intersecting the direction connecting the first end and the second end and approaching the inner peripheral surface of the coil wiring portion. When viewed from a direction orthogonal to the main surface, the second pad portion has: a first portion extending from the second end along the direction connecting the first end and the second end; and a second portion extending from the first portion side along a direction intersecting the direction connecting the first end and the second end and approaching the inner peripheral surface of the coil wiring portion.

[0035] According to the above embodiments, the area of ​​the first pad portion can be increased, thereby improving the connection reliability between the first pad portion and the first vertical wiring. Similarly, the area of ​​the second pad portion can be increased, thereby improving the connection reliability between the second pad portion and the second vertical wiring.

[0036] Preferably, in one embodiment of the inductor component, when viewed from a direction orthogonal to the main surface, the first portion of the first pad portion does not protrude inward from the inner circumferential surface of the coil wiring portion.

[0037] According to the above embodiment, the distance between the inner peripheral surface of the coil wiring portion and the first pad portion in the direction connecting the first end and the second end can be increased, and the possibility of short circuit between the coil wiring portion and the first pad portion in the direction connecting the first end and the second end can be reduced.

[0038] Preferably, in one embodiment of the inductor component, the thickness of the coil is thinner than the thickness of each of the first vertical wiring and the second vertical wiring.

[0039] According to the above embodiments, the volume of the substrate can be increased, thereby improving the inductance.

[0040] Preferably, in one embodiment of the inductor component, an insulating layer of non-magnetic material covering at least a portion of the coil is further provided.

[0041] According to the above implementation method, the insulation of the coil can be improved.

[0042] Preferably, in one embodiment of the inductor component, the substrate has a first magnetic layer and a second magnetic layer sequentially stacked along a first direction orthogonal to the main surface, the first vertical wiring and the second vertical wiring extend from both ends of the coil along the first direction, the first magnetic layer exists in the coil in a direction opposite to the first direction, the second magnetic layer exists in the coil in the first direction and in a direction orthogonal to the first direction, the first vertical wiring and the second vertical wiring penetrate the second magnetic layer, and the thickness of the first magnetic layer is thicker than the thickness of the second magnetic layer.

[0043] According to the above embodiment, since the thickness of the first vertical wiring and the second vertical wiring is limited in terms of processes such as resist thickness, the thickness of the second magnetic layer is also limited. In contrast, by thickening the first magnetic layer, the inductance can be improved.

[0044] Preferably, in one embodiment of the mounting component, a substrate and an inductor component of the above embodiment disposed within the substrate are included.

[0045] According to the above embodiment, the inductor component is built into the substrate, thus increasing the mounting area on the surface of the substrate.

[0046] According to the inductor component and mounting component as one aspect of this disclosure, the possibility of coil short circuit can be reduced and the inductor component can be miniaturized. Attached Figure Description

[0047] Figure 1 This is a top view showing a first embodiment of the inductor component.

[0048] Figure 2 yes Figure 1 AA sectional view.

[0049] Figure 3 This is a top view of the inductor component.

[0050] Figure 4A This is an explanatory diagram illustrating the manufacturing process of an inductor component.

[0051] Figure 4B This is an explanatory diagram illustrating the manufacturing process of an inductor component.

[0052] Figure 4C This is an explanatory diagram illustrating the manufacturing process of an inductor component.

[0053] Figure 4D This is an explanatory diagram illustrating the manufacturing process of an inductor component.

[0054] Figure 4E This is an explanatory diagram illustrating the manufacturing process of an inductor component.

[0055] Figure 4F This is an explanatory diagram illustrating the manufacturing process of an inductor component.

[0056] Figure 4G This is an explanatory diagram illustrating the manufacturing process of an inductor component.

[0057] Figure 4H This is an explanatory diagram illustrating the manufacturing process of an inductor component.

[0058] Figure 4I This is an explanatory diagram illustrating the manufacturing process of an inductor component.

[0059] Figure 4J This is an explanatory diagram illustrating the manufacturing process of an inductor component.

[0060] Figure 4K This is an explanatory diagram illustrating the manufacturing process of an inductor component.

[0061] Figure 4L This is an explanatory diagram illustrating the manufacturing process of an inductor component.

[0062] Figure 4M This is an explanatory diagram illustrating the manufacturing process of an inductor component.

[0063] Figure 5A This is a top view showing the inductor component of the first comparative example.

[0064] Figure 5B This is a top view showing the inductor component of the second comparative example.

[0065] Figure 5C This is a top view showing the inductor component of the first embodiment.

[0066] Figure 5D This is a top view showing the inductor component of the second embodiment.

[0067] Figure 6 It is a graph showing the relationship between the relative value of L and the extension amount of the pad portion in the first comparative example, the second comparative example, the first embodiment, and the second embodiment.

[0068] Figure 7 It is Figure 6 A portion of the chart that has been enlarged.

[0069] Figure 8 This is a top view showing a second embodiment of the inductor component.

[0070] Figure 9 This is a top view showing a third embodiment of the inductor component.

[0071] Figure 10 This is a cross-sectional view showing one embodiment of the mounting components.

[0072] Explanation of reference numerals in the attached figures

[0073] 1, 1A~1E…Inductor components; 3…Mounting components; 10…Base; 10a…First main surface; 10b…Second main surface; 11…First magnetic layer; 12…Second magnetic layer; 15, 15C, 15D…Coil; 20…Coil wiring portion; 20a…First end; 20b…Second end; 20c…Inner peripheral surface; 21, 21A~21D…First pad portion; 21a…First part; 21b…Second part; 211…First plane; 212…Second plane; 22, 22A~22D…The… Two pads; 22a…first part; 22b…second part; 221…first plane; 222…second plane; 31…first columnar wiring (vertical wiring); 32…second columnar wiring (vertical wiring); 41, 41A…first external terminal; 42, 42A…second external terminal; 50…cladding film; 60…insulating layer; 300…substrate; L…direction for connecting the first end and the second end (connection direction); S211, S221…first imaginary surface; S212, S222…second imaginary surface. Detailed Implementation

[0074] Hereinafter, an inductor component and mounting component, which are embodiments of the present disclosure, will be described in detail with reference to the illustrated embodiments. Furthermore, the drawings contain some schematic components and may not reflect actual dimensions or proportions.

[0075] <First Implementation>

[0076] (structure)

[0077] Figure 1 This is a top view showing a first embodiment of the inductor component. Figure 2 yes Figure 1 AA sectional view.

[0078] The inductor component 1 is used in electronic devices such as personal computers, DVD players, digital cameras, TVs, mobile phones, and automotive electronics, and is, for example, a component with an overall cuboid shape. However, the shape of the inductor component 1 is not particularly limited, and it can also be cylindrical, polygonal cylindrical, frustum conical, or polygonal frustum conical.

[0079] like Figure 1 and Figure 2As shown, the inductor component 1 includes: a substrate 10; a coil 15 disposed within the substrate 10; a non-magnetic insulating layer 60 covering at least a portion of the coil 15; a first columnar wiring 31 and a second columnar wiring 32 disposed within the substrate 10 with their end faces exposed from the first main surface 10a of the substrate 10, and connected to each of the two ends of the coil 15; a first external terminal 41 exposed on the first main surface 10a of the substrate 10 and connected to the first columnar wiring 31; a second external terminal 42 exposed on the first main surface 10a of the substrate 10 and connected to the second columnar wiring 32; and a covering film 50 disposed on the first main surface 10a and the second main surface 10b of the substrate 10.

[0080] In the figure, the thickness direction of inductor component 1 is defined as the Z direction, the positive Z direction is defined as the upper side, and the negative Z direction is defined as the lower side. In the plane orthogonal to the Z direction of inductor component 1, the length direction of inductor component 1, that is, the direction in which the first external terminal 41 and the second external terminal 42 are arranged, is defined as the X direction, and the direction orthogonal to the length direction, that is, the width direction of inductor component 1, is defined as the Y direction.

[0081] The substrate 10 has a first main surface 10a and a second main surface 10b, and a first side surface 10c, a second side surface 10d, a third side surface 10e and a fourth side surface 10f located between the first main surface 10a and the second main surface 10b and connecting the first main surface 10a and the second main surface 10b.

[0082] The first main surface 10a and the second main surface 10b are arranged on opposite sides of each other in the Z direction, with the first main surface 10a arranged in the positive Z direction and the second main surface 10b arranged in the negative Z direction. The first side surface 10c and the second side surface 10d are arranged on opposite sides of each other in the X direction, with the first side surface 10c arranged in the negative X direction and the second side surface 10d arranged in the positive X direction. The third side surface 10e and the fourth side surface 10f are arranged on opposite sides of each other in the Y direction, with the third side surface 10e arranged in the negative Y direction and the fourth side surface 10f arranged in the positive Y direction.

[0083] The substrate 10 has a first magnetic layer 11 and a second magnetic layer 12 stacked sequentially along the positive Z direction. The term "sequentially" only indicates the positional relationship between the first magnetic layer 11 and the second magnetic layer 12, and is unrelated to the order in which they are formed. The positive Z direction is an example of "a first direction orthogonal to the main surface" as described in the technical solution.

[0084] The first magnetic layer 11 and the second magnetic layer 12 each contain magnetic powder and a resin containing the magnetic powder. The magnetic powder improves inductance. The resin is, for example, an organic insulating material composed of epoxy, phenolic, liquid crystal polymer, polyimide, acrylic, or mixtures thereof. The magnetic powder is, for example, an FeSi alloy such as FeSiCr, an FeCo alloy, an Fe alloy such as NiFe, or an amorphous alloy thereof. Therefore, compared to a magnetic layer composed of ferrite, the magnetic powder improves DC superposition characteristics, and the resin insulates the magnetic powder particles, thus reducing losses (iron losses) at high frequencies. Alternatively, the magnetic layer may be a sintered body of ferrite or magnetic powder that does not contain organic resin.

[0085] The coil 15 extends along the first main surface 10a between the first magnetic layer 11 and the second magnetic layer 12. Specifically, the first magnetic layer 11 exists in the anti-Z direction of the coil 15, and the second magnetic layer 12 exists in the positive Z direction of the coil 15 and in a direction orthogonal to the positive Z direction.

[0086] The coil 15 has a coil wiring portion 20, a first pad portion 21, and a second pad portion 22. The coil wiring portion 20 has a first end portion 20a and a second end portion 20b. The first pad portion 21 is connected to the first end portion 20a. The second pad portion 22 is connected to the second end portion 20b.

[0087] The coil wiring portion 20 extends circumferentially with one or fewer turns. Because the coil wiring portion 20 has one or fewer turns, magnetic saturation can be suppressed, the allowable DC superposition current can be increased, and large currents can flow. The coil wiring portion 20 preferably has 0.5 or more turns. The coil wiring portion 20 is configured symmetrically with respect to the centerline in the X direction of the substrate 10. A first end portion 20a is disposed on the first side surface 10c and the third side surface 10e of the substrate 10, and a second end portion 20b is disposed on the second side surface 10d and the third side surface 10e of the substrate 10. In this embodiment, the coil wiring portion 20 is formed in a generally C-shape.

[0088] The coil wiring portion 20 has the same width along its extension direction. Width refers to the dimension in a direction orthogonal to the extension direction. The first end 20a is the portion connected to the first pad portion 21. The second end 20b is the portion connected to the second pad portion 22. The linewidth of the coil wiring portion 20 is smaller than the linewidth of the first pad portion 21 and the linewidth of the second pad portion 22. Alternatively, the linewidths of the first pad portion 21 and the second pad portion 22 may be the same as the linewidth of the coil wiring portion 20.

[0089] The first pad portion 21 is the portion connected to the first columnar wiring 31. The first pad portion 21, when viewed from a direction orthogonal to the first main surface 10a, overlaps with the first columnar wiring 31 and has a shape corresponding to the outer peripheral surface of the first columnar wiring 31, slightly larger than the first columnar wiring 31. When viewed from a direction orthogonal to the first main surface 10a, the first pad portion 21 extends along a direction intersecting the direction L (hereinafter also referred to as the connection direction L) that connects the first end portion 20a and the second end portion 20b, and is close to the inner peripheral surface 20c of the coil wiring portion 20. The connection direction L refers to the direction that connects the center of the width direction of the end edge of the first end portion 20a and the center of the width direction of the end edge of the second end portion 20b when viewed from a direction orthogonal to the first main surface 10a. The end edges of the first end portion 20a and the second end portion 20b are... Figure 1 The middle part is represented by a dashed line.

[0090] In this embodiment, the first pad portion 21 extends in a direction orthogonal to the connection direction L. The connection direction L is parallel to the X direction, and the direction orthogonal to the connection direction L is parallel to the Y direction. That is, the first pad portion 21 is disposed on the first side surface 10c side of the substrate 10 and extends along the first side surface 10c of the substrate 10. Viewed from a direction orthogonal to the first main surface 10a, the first pad portion 21 is formed in a straight line. Alternatively, the first pad portion 21 may extend in a direction that intersects the connection direction L at an angle other than perpendicular to it.

[0091] The width of the first pad portion 21 is larger than the width of the coil wiring portion 20. The width of the first pad portion 21 is the same except for the end that is connected to the first end portion 20a of the coil wiring portion 20. The width of the end portion of the first pad portion 21 gradually increases along the extending direction of the first pad portion 21.

[0092] The second pad portion 22 is the portion for connecting the second columnar wiring 32. The second pad portion 22, when viewed from a direction orthogonal to the first main surface 10a, overlaps with the second columnar wiring 32, and has a shape corresponding to the outer peripheral surface of the second columnar wiring 32, and is slightly larger than the second columnar wiring 32. When viewed from a direction orthogonal to the first main surface 10a, the second pad portion 22 extends along a direction intersecting the direction L (hereinafter also referred to as the connection direction L) that connects the first end portion 20a and the second end portion 20b, and is close to the inner peripheral surface 20c of the coil wiring portion 20.

[0093] In this embodiment, the second pad portion 22 extends in a direction orthogonal to the connection direction L. That is, the second pad portion 22 is disposed on the second side surface 10d side of the substrate 10 and extends along the second side surface 10d of the substrate 10. Viewed from a direction orthogonal to the first main surface 10a, the second pad portion 22 is formed in a straight line. Alternatively, the second pad portion 22 may extend in a direction that intersects the connection direction L at an angle other than perpendicular to it.

[0094] The width of the second pad portion 22 is the same as the width of the first pad portion 21, and is greater than the width of the coil wiring portion 20. The width of the second pad portion 22 is the same except for the end that connects to the second end portion 20b of the coil wiring portion 20. The width of the end portion of the second pad portion 22 gradually increases along the extending direction of the second pad portion 22.

[0095] The first pad portion 21 is connected to the first columnar wiring 31, and the second pad portion 22 is connected to the second columnar wiring 32. The first columnar wiring 31 and the second columnar wiring 32 extend from both ends of the coil 15 in a direction orthogonal to the first main surface 10a.

[0096] In this embodiment, the first pad portion 21 and the second pad portion 22 are not included in the turns of the coil 15. This is because the first pad portion 21 and the second pad portion 22 are not parts that affect the wiring length of the coil 15. Specifically, the current flowing through the first pad portion 21 and the second pad portion 22 flows directly through the first columnar wiring 31 and the second columnar wiring 32. That is, the current flowing through the first pad portion 21 and the second pad portion 22 does not flow along the circumference of the coil wiring portion 20, but flows along the first columnar wiring 31 and the second columnar wiring 32 in a direction orthogonal to the first main surface 10a.

[0097] The thickness of the coil wiring portion 20, the first pad portion 21, and the second pad portion 22 is preferably 40 μm or more and 120 μm or less. As an example of the coil wiring portion 20, the thickness is 35 μm and the wiring width is 50 μm.

[0098] The coil wiring section 20, the first pad section 21, and the second pad section 22 are made of conductive materials, such as low-resistance metals like Cu, Ag, Au, and Al. In this embodiment, the inductor component 1 has only one layer of coil wiring section 20, enabling a reduction in the size of the inductor component 1. Furthermore, the coil wiring section can also be a two-layer structure consisting of a seed layer and an electroplated layer; the seed layer may also contain Ti or Ni.

[0099] The first lead wire 201 is connected to a portion of the coil wiring section 20 in the opposite X direction, and the first lead wire 201 is exposed from the first side 10c. The second lead wire 202 is connected to a portion of the coil wiring section 20 in the positive X direction, and the second lead wire 202 is exposed from the second side 10d.

[0100] The first lead wire 201 and the second lead wire 202 are wirings that connect to the power supply wiring for additional electroplating after the coil wiring portion 20 has been formed during the manufacturing process of the inductor component 1. Through these power supply wirings, electroplating can be easily performed on the inductor substrate before the inductor component 1 is diced, and the line width of the coil 15 can be adjusted. Furthermore, by providing the first lead wire 201 and the second lead wire 202, strength can be ensured when the substrate 10 is cut during the dicing of the inductor component 1, thereby improving the yield rate during manufacturing.

[0101] The first columnar wiring 31 and the second columnar wiring 32 extend from the coil 15 along the Z direction and penetrate the interior of the second magnetic layer 12. The columnar wiring is an example of "vertical wiring" described in the technical solution.

[0102] A first columnar wiring 31 extends from the upper surface of the first pad portion 21 to the first main surface 10a of the substrate 10, with the end face of the first columnar wiring 31 exposed from the first main surface 10a of the substrate 10. A second columnar wiring 32 extends from the upper surface of the second pad portion 22 to the first main surface 10a of the substrate 10, with the end face of the second columnar wiring 32 exposed from the first main surface 10a of the substrate 10.

[0103] Therefore, the first columnar wiring 31 and the second columnar wiring 32 extend linearly from the coil 15 to the first main surface 10a in a direction orthogonal to it. This allows the first external terminal 41 and the second external terminal 42 to be connected to the coil 15 with a shorter distance, enabling low resistance and high inductance in the inductor component 1. The first columnar wiring 31 and the second columnar wiring 32 are made of a conductive material, for example, the same material as the coil 15.

[0104] Viewed from a direction orthogonal to the first main surface 10a, the first columnar wiring 31 is approximately the same size as the first pad portion 21 and has a shape corresponding to the first pad portion 21. The second columnar wiring 32 is approximately the same size as the second pad portion 22 and has a shape corresponding to the second pad portion 22.

[0105] Furthermore, when the upper surface of the coil 15 is covered with the insulating layer 60, the first columnar wiring 31 and the second columnar wiring 32 can also be electrically connected to the coil 15 via through-hole wiring penetrating the insulating layer 60. Through-hole wiring is a conductor with a line width (diameter, cross-sectional area) smaller than that of the columnar wiring. In this case, the "vertical wiring" described in the technical solution consists of through-hole wiring and columnar wiring.

[0106] At this time, the first pad portion 21 is the portion for connecting the first vertical wiring (the first columnar wiring 31 and the via wiring). The first pad portion 21 includes not only the portion connected to the via wiring, but also the portion that overlaps with the first columnar wiring 31 when viewed from a direction orthogonal to the first main surface 10a. That is, when viewed from a direction orthogonal to the first main surface 10a, the first pad portion 21 has a shape corresponding to the outer peripheral surface of the first vertical wiring and is slightly larger than the first vertical wiring.

[0107] The second pad portion 22 is a portion for connecting the second vertical wiring (the second columnar wiring 32 and the via wiring). The second pad portion 22 includes not only the portion connecting to the via wiring, but also the portion overlapping the second columnar wiring 32 when viewed from a direction orthogonal to the first main surface 10a. That is, when viewed from a direction orthogonal to the first main surface 10a, the second pad portion 22 has a shape corresponding to the outer peripheral surface of the second vertical wiring and is slightly larger than the second vertical wiring.

[0108] Preferably, the thickness of the coil 15 is thinner than the thickness of both the first columnar wiring 31 and the second columnar wiring 32. This increases the volume of the substrate 10 and improves the inductance.

[0109] Preferably, the thickness of the first magnetic layer 11 is greater than the thickness of the second magnetic layer 12. Therefore, the thickness of the first columnar wiring 31 and the second columnar wiring 32 is limited in terms of processes such as resist thickness, and thus the thickness of the second magnetic layer 12 is also limited. In contrast, by making the first magnetic layer 11 thicker, the inductance can be improved.

[0110] The first external terminal 41 and the second external terminal 42 are disposed on the first main surface 10a of the substrate 10. The first external terminal 41 and the second external terminal 42 are made of conductive materials, such as Cu with low resistance and excellent stress resistance, Ni with excellent corrosion resistance, and Au with excellent solder wettability and reliability, arranged in a three-layer structure from the inside to the outside.

[0111] The first external terminal 41 contacts the end face of the first columnar wiring 31 exposed from the first main surface 10a of the substrate 10 and is electrically connected to the first columnar wiring 31. Thus, the first external terminal 41 is electrically connected to the first end (first pad portion 21) of the coil 15. The second external terminal 42 contacts the end face of the second columnar wiring 32 exposed from the first main surface 10a of the substrate 10 and is electrically connected to the second columnar wiring 32. Thus, the second external terminal 42 is electrically connected to the second end (second pad portion 22) of the coil 15.

[0112] The first external terminal 41 contacts the end face of the first main surface 10a and the first columnar wiring 31. The second external terminal 42 contacts the end face of the first main surface 10a and the second columnar wiring 32. Thus, the first external terminal 41 spans the first main surface 10a and the first columnar wiring 31, and the second external terminal 42 spans the first main surface 10a and the second columnar wiring 32. Therefore, the size of the first external terminal 41 and the second external terminal 42 can be controlled, and the design of the first external terminal 41 and the second external terminal 42 can be selected from the viewpoints of installability and mechanical strength.

[0113] The first external terminal 41 and the second external terminal 42 are preferably in contact with the magnetic powder of the substrate 10. As a result, the adhesion strength between the first external terminal 41 and the second external terminal 42 and the substrate 10 is improved.

[0114] An insulating layer 60 covers the lower surface of the coil 15. This improves the insulation of the coil 15. The insulating layer 60 is made of an insulating material that does not contain magnetic materials. Examples of the insulating layer 60 include organic resins such as epoxy resin, phenolic resin, polyimide resin, liquid crystal polymer, or combinations thereof; sintered bodies such as glass or alumina; thin films such as silicon oxide films, silicon nitride films, and silicon oxynitride films.

[0115] The coating film 50 is made of an insulating material. The material of the coating film 50 is, for example, the same as that of the insulating layer 60. The coating film 50 exposes the end faces of the first external terminal 41 and the second external terminal 42. The coating film 50 helps to prevent short circuits between the first external terminal 41 and the second external terminal 42. Preferably, the coating film 50 contains a black colorant. This allows for the concealment of surface damage to the substrate 10, improving the appearance pass rate. The black colorant is, for example, a colorant whose color index includes the color number black, specifically, carbon black pigments such as carbon black, Ketjen black, perylene black, and titanium dioxide, graphite pigments, iron oxide pigments, cobalt oxide pigments, anthraquinone pigments, etc.

[0116] According to the above structure, the first pad portion 21 extends in a direction intersecting the connection direction L and close to the inner peripheral surface 20c of the coil wiring portion 20, and the second pad portion 22 extends in a direction intersecting the connection direction L and close to the inner peripheral surface 20c of the coil wiring portion 20. This suppresses the first pad portion 21 and the second pad portion 22 from approaching each other, reducing the possibility of a short circuit between the first pad portion 21 and the second pad portion 22, which have the largest potential difference in the coil 15. Furthermore, it suppresses the first pad portion 21 and the second pad portion 22 from extending radially outward from the coil 15, enabling miniaturization of the inductor component 1. Additionally, it increases the area of ​​the first pad portion 21, improving the connection reliability between the first pad portion 21 and the first columnar wiring 31.

[0117] Conversely, for example, if the first and second pad portions extend along the connection direction L, they will approach each other, increasing the likelihood of a short circuit. Furthermore, when the first and second pad portions extend radially outward from the coil, the substrate needs to be increased, making the inductor component larger.

[0118] Figure 3 This is a top view of the inductor component. Figure 3 For simplicity, only the base 10 and coil 15 are depicted, represented by solid lines. (See diagram below.) Figure 3 As shown, viewed from a direction orthogonal to the first main surface 10a, the first pad portion 21 has a straight first plane 211, which is the end face of the first pad portion 21 in its extending direction and faces the inner peripheral surface 20c of the coil wiring portion 20. The shortest distance between the first plane 211 and the inner peripheral surface 20c of the coil wiring portion 20 is not the smallest distance among the distances between the outer surface of the first pad portion 21 and the inner peripheral surface 20c of the coil wiring portion 20. Therefore, the possibility of a short circuit between the first plane 211 of the first pad portion 21 and the inner peripheral surface 20c of the coil wiring portion 20 can be reduced.

[0119] Specifically, viewed from a direction orthogonal to the first main surface 10a, the first pad portion 21 has: a straight first plane 211 extending along the connection direction L and opposite the inner peripheral surface 20c of the coil wiring portion 20; and a straight second plane 212 extending along a direction orthogonal to the connection direction L and opposite the inner peripheral surface 20c of the coil wiring portion 20. The first plane 211 refers to the plane among a plurality of planes extending parallel to the connection direction L that is closest to the inner peripheral surface 20c of the coil wiring portion 20. The second plane 212 refers to the plane among a plurality of planes extending along a direction orthogonal to the connection direction L that is closest to the inner peripheral surface 20c of the coil wiring portion 20.

[0120] The surface parallel to the first plane 211 and in contact with the portion of the inner peripheral surface 20c of the coil wiring section 20 that faces the first plane 211 is designated as the first imaginary surface S211. The surface parallel to the second plane 212 and in contact with the portion of the inner peripheral surface 20c of the coil wiring section 20 that faces the second plane 212 is designated as the second imaginary surface S212. In this case, the distance 'a' between the second imaginary surface S212 and the second plane 212 is smaller than the distance 'b' between the first imaginary surface S211 and the first plane 211.

[0121] According to the above structure, since distance a is smaller than distance b, the possibility of a short circuit between the first plane 211 of the first pad portion 21 and the portion of the inner peripheral surface 20c of the coil wiring portion 20 opposite to the first plane 211 can be reduced. Even if a short circuit occurs between the second imaginary surface S212 and the second plane 212, the variation in coil length can be suppressed compared to a short circuit occurring between the first imaginary surface S211 and the first plane 211, thus suppressing the effect of interlayer short circuits.

[0122] Furthermore, distance a can be equal to or greater than distance b. In this case, the first pad portion 21 can be made larger in its extending direction. As a result, the size of the first pad portion 21 can be increased, and the connection reliability between the first pad portion 21 and the first columnar wiring 31 can be improved.

[0123] Alternatively, the second pad portion 22 can also have the same structure as the first pad portion 21, and have the same effect as the first pad portion 21. That is, viewed from a direction orthogonal to the first main surface 10a, the second pad portion 22 has a straight first plane 221, which is the end face of the extension direction of the second pad portion 22 and is opposite to the inner peripheral surface 20c of the coil wiring portion 20. The shortest distance between the first plane 221 and the inner peripheral surface 20c of the coil wiring portion 20 is not the smallest distance among the distances between the outer surface of the second pad portion 22 and the inner peripheral surface 20c of the coil wiring portion 20.

[0124] Specifically, the second pad portion 22 has: a straight first plane 221 extending along the connection direction L and opposite the inner peripheral surface 20c of the coil wiring portion 20; and a straight second plane 222 extending in a direction orthogonal to the connection direction L and opposite the inner peripheral surface 20c of the coil wiring portion 20. A first imaginary surface S221 is defined as the surface parallel to the first plane 221 and in contact with the portion of the inner peripheral surface 20c of the coil wiring portion 20 that faces the first plane 221. A second imaginary surface S222 is defined as the surface parallel to the second plane 222 and in contact with the portion of the inner peripheral surface 20c of the coil wiring portion 20 that faces the second plane 222. In this case, the distance a between the second imaginary surface S222 and the second plane 222 is smaller than the distance b between the first imaginary surface S221 and the first plane 221. Alternatively, the distance a may be equal to or greater than the distance b.

[0125] like Figure 3 As shown, preferably in the first pad portion 21, the distance a between the second imaginary surface S212 and the second plane 212 is equal to or greater than twice the particle size D50 of the magnetic powder.

[0126] Here, unless otherwise specified, the particle size D50 of the magnetic powder is determined based on a SEM (scanning electron microscope) image of a cross-section at the center of the substrate 10 of the inductor component 1 along its length. Preferably, the SEM image includes 10 or more magnetic powder particles, obtained, for example, at a magnification of 2000x. Three or more SEM images of the aforementioned cross-section are obtained, and the magnetic powder and other particles are classified using binarization or similar methods. The equivalent circle diameter of each magnetic powder particle within the SEM image is calculated, and the median diameter (the median diameter) of these equivalent circle diameters arranged in ascending order is set as the particle size D50 of the magnetic powder.

[0127] According to the above structure, by making the distance between the second imaginary surface S212 and the second plane 212 wider than the magnetic powder, the possibility of a short circuit between the second imaginary surface S212 and the second plane 212 can be further reduced.

[0128] Alternatively, the second pad portion 22 can also have the same structure as the first pad portion 21, and have the same effect as the first pad portion 21. That is, in the second pad portion 22, the distance 'a' between the second imaginary surface S222 and the second plane 222 is equal to or greater than twice the particle size D50 of the magnetic powder.

[0129] like Figure 3 As shown, preferably, in the first pad portion 21, when viewed from a direction orthogonal to the first main surface 10a, the shortest distance c between the first pad portion 21 and the second pad portion 22 is greater than the distance a between the second imaginary surface S212 and the second plane 212.

[0130] Based on the above structure, the possibility of a short circuit between the first pad portion 21 and the second pad portion 22, which have the largest potential difference in the coil 15, can be further reduced. Even if a short circuit occurs between the second imaginary surface S212 and the second plane 212, the variation in coil length can be suppressed compared to a short circuit occurring between the first pad portion 21 and the second pad portion 22, thus suppressing the effect of interlayer short circuits.

[0131] Furthermore, the shortest distance c can be equal to or less than the distance a. In this case, since the first pad portion 21 and the second pad portion 22 can be brought closer together, the length of the coil wiring portion 20 can be increased. As a result, the coil length can be increased, and the inductance can be improved.

[0132] Alternatively, the second pad portion 22 can also have the same structure as the first pad portion 21, and have the same effect as the first pad portion 21. That is, in the second pad portion 22, the shortest distance c is greater than the distance a. Furthermore, the shortest distance c can also be equal to or less than the distance a.

[0133] like Figure 3As shown, preferably, the shortest distance c between the first pad portion 21 and the second pad portion 22 is equal to or greater than twice the particle size D50 of the magnetic powder. According to the above structure, by making the distance between the first pad portion 21 and the second pad portion 22 wider than the magnetic powder, the possibility of a short circuit between the first pad portion 21 and the second pad portion 22 can be further reduced.

[0134] like Figure 3 As shown, preferably in the first pad portion 21, distance a is smaller than distance b, and distance b is smaller than the shortest distance c. For example, distance a is 200 μm, distance b is 210 μm, and the shortest distance c is 720 μm. According to the above structure, since the shortest distance c is larger than distances a and b, the possibility of a short circuit between the first pad portion 21 and the second pad portion 22, which have the largest potential difference, can be further reduced. Furthermore, regardless of the magnitudes of distances a and b, distance b can be smaller than the shortest distance c.

[0135] Alternatively, the second pad portion 22 may have the same structure as the first pad portion 21 and have the same effect as the first pad portion 21.

[0136] (Manufacturing method)

[0137] Next, the manufacturing method of inductor component 1 will be described. Figures 4A to 4M Corresponding to Figure 1 AA section ( Figure 2 ).

[0138] like Figure 4A As shown, a substrate 70 is prepared. The substrate 70 is made of inorganic materials such as ceramic, glass, or silicon. An insulating layer 71 is coated on the substrate 70. Figure 4B As shown, a predetermined pattern is formed on the insulating layer 71 using photolithography and then cured to form the insulating layer 60.

[0139] like Figure 4C As shown, a seed layer (Ti / Cu, not shown) is formed on the main surface of the substrate 70, which includes the insulating layer 60, using a known method such as sputtering or vapor deposition. Then, a dry film resist (DFR) 75 is attached, and an opening of a predetermined shape is formed in the DFR 75 using photolithography. Next, power is supplied to the seed layer, and a coil wiring portion 20, a first pad portion 21, and a second pad portion 22 are formed on the insulating layer 60 using electroplating.

[0140] like Figure 4D As shown, DFR75 is stripped. At this point, the seed layer can be used for electroplating of the columnar wiring without etching, or the seed layer can be etched to form a seed layer for forming the columnar wiring again.

[0141] like Figure 4EAs shown, the DFR75 is reattached, and an opening of a specified shape is formed on the DFR75 using photolithography. The opening is a through-hole corresponding to the position of the first columnar wiring 31 on the first pad portion 21 and the second columnar wiring 32 on the second pad portion 22. Electroplating is used to form the first columnar wiring 31 on the first pad portion 21 and the second columnar wiring 32 on the second pad portion 22. (As shown...) Figure 4F As shown, DFR75 is stripped and the seed layer is etched.

[0142] like Figure 4G As shown, the magnetic sheet that will become the second magnetic layer 12 is pressed from above the main surface of the substrate 70 toward the coil wiring portion 20, and the second magnetic layer 12 covers the coil wiring portion 20, the first pad portion 21, the second pad portion 22, the first columnar wiring 31, and the second columnar wiring 32. Then, the upper surface of the second magnetic layer 12 is ground so that the end faces of the first columnar wiring 31 and the second columnar wiring 32 are exposed from the upper surface of the second magnetic layer 12.

[0143] like Figure 4H As shown, a coating film 50 is coated on the upper surface of the second magnetic layer 12. Then, the coating film 50 is formed into a predetermined pattern using photolithography and cured. The predetermined pattern is a shape with openings at positions corresponding to the first external terminal 41 and the second external terminal 42.

[0144] like Figure 4I As shown, the substrate 70 is removed by grinding. At this time, part or all of the insulating layer 60 may also be removed. Figure 4J As shown, other magnetic sheets that will become the first magnetic layer 11 are pressed from below the coil wiring portion 20 toward the coil wiring portion 20, and the first magnetic layer 11 covers the coil wiring portion 20. Then, the first magnetic layer 11 is ground to a specified thickness.

[0145] like Figure 4K As shown, a first external terminal 41 and a second external terminal 42 are formed at the opening of the coating film 50. The first external terminal 41 contacts the end face of the first columnar wiring 31 and the upper surface of the second magnetic layer 12. The second external terminal 42 contacts the end face of the second columnar wiring 32 and the upper surface of the second magnetic layer 12. In addition, the coating film 50 is coated on the lower surface of the first magnetic layer 11 and cured.

[0146] like Figure 4L As shown, the inductor component is segmented along the cut line D, as follows: Figure 4M As shown, inductor component 1 is manufactured.

[0147] (Example)

[0148] Next, the embodiments will be described.

[0149] Figure 5A Indicating the inductor component 100A of the first comparative example, Figure 5B The inductor component 100B represents the second comparative example. Figure 5C This refers to the inductor component 1A of the first embodiment. Figure 5D This refers to the inductor component 1B of the second embodiment. Figures 5A to 5D For simplicity, only the substrate, coil, and external terminals are depicted. Solid lines represent the substrate and coil, and double-dotted lines represent the external terminals. Although the columnar wiring is omitted, when viewed from the Z-direction, the columnar wiring is approximately the same size as the pad area and has a shape corresponding to the pad area.

[0150] like Figure 5A As shown, in the inductor component 100A of the first comparative example, the first pad portion 121A and the second pad portion 122A are quadrilaterals with a size of 100μm × 100μm. The distance between the first external terminal 141A and the second external terminal 142A is 200μm.

[0151] like Figure 5B As shown, in the inductor component 100B of the second comparative example, the first pad portion 121B and Figure 5A Compared to the first pad portion 121A, it extends in the positive X direction, and the second pad portion 122B extends in the positive X direction. Figure 5A Compared to the second pad portion 122A, it extends in the opposite X direction. Hereinafter, the difference in length in the X direction between the first pad portion 121B and the first pad portion 121A, and the difference in length in the X direction between the second pad portion 122B and the second pad portion 122A, will be referred to as the pad portion extension amount. The distance between the first external terminal 141B and the second external terminal 142B is equal to... Figure 5A The distance between the first external terminal 141A and the second external terminal 142A.

[0152] like Figure 5C As shown, in the inductor component 1A of the first embodiment, the first pad portion 21A and Figure 5A Compared to the first pad portion 121A, it extends in the positive Y direction, and the second pad portion 22A extends in the positive Y direction. Figure 5A Compared to the second pad portion 122A, it extends in the positive Y direction. Hereinafter, the difference in length of the first pad portion 21A relative to the first pad portion 121A in the Y direction and the difference in length of the second pad portion 22A relative to the second pad portion 122A in the Y direction will be referred to as the extension amount of the pad portion. The distance between the first external terminal 41A and the second external terminal 42A is equal to... Figure 5A The distance between the first external terminal 141A and the second external terminal 142A.

[0153] like Figure 5DAs shown, in the inductor component 1B of the second embodiment, the first pad portion 21B is connected to... Figure 5C The first pad portion 21A has the same shape, and the second pad portion 22B is the same as... Figure 5C The second pad portion 22A has the same shape. The distance between the first external terminal 41B and the second external terminal 42B is 600μm, which is greater than... Figure 5C The distance between the first external terminal 41A and the second external terminal 42A is wide.

[0154] Figure 6 This indicates the relationship between the relative value of L and the extension amount of the pad portion in the first comparative example, the second comparative example, the first embodiment, and the second embodiment described above. Figure 7 It is Figure 6 A portion of the chart that has been enlarged.

[0155] exist Figure 6 and Figure 7 In the diagram, an × symbol indicates a first comparative example, a triangle symbol indicates a second comparative example, a square symbol indicates a first embodiment, and a circle indicates a second embodiment. The relative value of L indicates the relative value when the L value of the first comparative example is 1. As described above, the extension of the pad portion refers to the difference in length between the pad portion of the first comparative example and the pad portion of the first comparative example.

[0156] like Figure 6 and Figure 7 As shown, in the second comparative example and the first embodiment, as the extension of the pad portion increases, the relative value of L decreases slightly. This is believed to be due to the reduction in the volume of the magnetic layer. This decrease in the relative value of L is within the allowable range during manufacturing and does not pose a quality problem. On the other hand, in the second comparative example and the first embodiment, as the extension of the pad portion increases, the area of ​​the columnar wiring also increases, resulting in a larger contact area with the external terminals and improved connection reliability.

[0157] In the second embodiment, the relative value of L is larger compared to the first embodiment. This is because, since the distance between the two external terminals in the second embodiment is wider than that in the first embodiment, the obstruction of the external terminals to the flow of magnetic flux in the coil can be reduced in the second embodiment.

[0158] In the first comparative example, the second comparative example, the first embodiment, and the second embodiment, the L value can be ensured. However, in the first comparative example, because the pad portion is small, the contact area with the external terminal is smaller, resulting in reduced connection reliability. Furthermore, in the second comparative example, the possibility of a short circuit due to the two pad portions being close together increases. On the other hand, in the first and second embodiments, the contact area with the external terminal is larger, improving connection reliability, and the two pad portions are not close together, thus reducing the possibility of a short circuit. Additionally, in the second embodiment, the obstruction to magnetic flux flow can be reduced, suppressing the decrease in the L value.

[0159] <Second Implementation>

[0160] Figure 8 This is a top view showing a second embodiment of the inductor component. Figure 8 For simplicity, only the base and coil are depicted, represented by solid lines. The second embodiment differs from the first embodiment in the structure of the coil's solder pad portion. This different structure will be described below. Other structures are the same as in the first embodiment, and are labeled with the same reference numerals as in the first embodiment, with their descriptions omitted.

[0161] like Figure 8 As shown, in the inductor component 1C of the second embodiment, when viewed from a direction orthogonal to the first main surface 10a, the first pad portion 21C of the coil 15C has a first portion 21a, a second portion 21b, and a corner portion 21c between the first portion 21a and the second portion 21b. The corner portion 21c is an extension of the first portion 21a and is included in the first portion 21a.

[0162] The first portion 21a extends from the first end 20a along the connection direction L. The second portion 21b extends from the side of the first portion 21a along a direction intersecting the connection direction L and approaching the inner circumferential surface 20c of the coil wiring portion 20. The first portion 21a and the second portion 21b are portions extending with the same width. Figure 8 For convenience, the boundaries of the first portion 21a, the second portion 21b, and the corner portion 21c are represented by double-dotted lines. In this embodiment, the second portion 21b extends in a direction orthogonal to the connection direction L. That is, when viewed from a direction orthogonal to the first main surface 10a, the first pad portion 21C is formed in an L-shape.

[0163] Viewed from a direction orthogonal to the first main surface 10a, the first columnar wiring connected to the first pad portion 21C has a shape corresponding to the first pad portion 21C. Therefore, the area of ​​the first pad portion 21C can be increased, and the connection reliability between the first pad portion 21C and the first columnar wiring can be improved.

[0164] Viewed from a direction orthogonal to the first main surface 10a, the first portion 21a of the first pad portion 21C protrudes radially inward from the inner peripheral surface 20c of the coil wiring portion 20 towards the coil 15C. The first plane 211 is the plane of the first pad portion 21C that extends parallel to the connection direction L and is located closest to the inner peripheral surface 20c of the coil wiring portion 20; therefore, it corresponds to the end face of the second portion 21b. The second plane 212 is the plane of the first pad portion 21C that extends in a direction orthogonal to the connection direction L and is located closest to the inner peripheral surface 20c of the coil wiring portion 20; therefore, it corresponds to the base end face (first end 20a side) of the first portion 21a. At this time, it is easy to make the distance a between the second imaginary surface S212 and the second plane 212 smaller than the distance b between the first imaginary surface S211 and the first plane 211. Distance a can also be the same as distance b. For example, distance a is 100μm, distance b is 100μm, and the shortest distance c is 200μm.

[0165] Similarly, when viewed from a direction orthogonal to the first main surface 10a, the second pad portion 22C of the coil 15C has a first portion 22a, a second portion 22b, and a corner portion 22c between the first portion 22a and the second portion 22b.

[0166] The first portion 22a extends from the second end 20b along the connection direction L. The second portion 22b extends from the side of the first portion 22a along a direction intersecting the connection direction L and close to the inner peripheral surface 20c of the coil wiring portion 20. In this embodiment, the second portion 22b extends in a direction orthogonal to the connection direction L. That is, when viewed from a direction orthogonal to the first main surface 10a, the second pad portion 22C is formed in an L-shape and is formed symmetrically to the first pad portion 21C.

[0167] Viewed from a direction orthogonal to the first main surface 10a, the second columnar wiring connected to the second pad portion 22C has a shape corresponding to the second pad portion 22C. Therefore, the area of ​​the second pad portion 22C can be increased, and the connection reliability between the second pad portion 22C and the second columnar wiring can be improved.

[0168] Viewed from a direction orthogonal to the first main surface 10a, the first portion 22a of the second pad portion 22C protrudes radially inward from the inner peripheral surface 20c of the coil wiring portion 20 towards the coil 15C. The first plane 221 corresponds to the end side of the second portion 22b. The second plane 222 corresponds to the base side (second end 20b side) of the first portion 22a.

[0169] <Third Implementation Method>

[0170] Figure 9 This is a top view showing a third embodiment of the inductor component. Figure 9For convenience, only the base and coil are depicted, represented by solid lines. The third embodiment differs from the second embodiment in the structure of the coil's pad portion. This different structure will be described below. Other structures are the same as in the second embodiment, and the same reference numerals are used as in the second embodiment, with their descriptions omitted. Furthermore, although the structure of the pad portion differs from the second embodiment, the first and second portions of the pad portion are defined in the same way as in the second embodiment.

[0171] like Figure 9 As shown, in the inductor component 1D of the third embodiment, when viewed from a direction orthogonal to the first main surface 10a, the first portion 21a of the first pad portion 21D of the coil 15D does not protrude radially inward from the inner peripheral surface 20c of the coil wiring portion 20. That is, the first portion 21a protrudes radially outward from the outer peripheral surface of the coil wiring portion 20. At this time, the first plane 211 corresponds to the end side surface of the second portion 21b, and the second plane 212 corresponds to the side surface of the second portion 21b.

[0172] According to the above structure, the distance between the inner peripheral surface 20c of the coil wiring portion 20 and the first pad portion 21D in the connection direction L can be increased, which can further reduce the possibility of a short circuit between the coil wiring portion 20 and the first pad portion 21D in the connection direction L. For example, it is easy to make the distance a between the second imaginary surface S212 and the second plane 212 greater than the distance b between the first imaginary surface S211 and the first plane 211. For example, the distance a is 200 μm, the distance b is 100 μm, and the shortest distance c is 200 μm.

[0173] Similarly, when viewed from a direction orthogonal to the first main surface 10a, the first portion 22a of the second pad portion 22D of the coil 15D does not protrude radially inward from the inner peripheral surface 20c of the coil wiring portion 20. That is, the first portion 22a protrudes radially outward from the outer peripheral surface of the coil wiring portion 20. At this time, the first plane 221 corresponds to the end side surface of the second portion 22b, and the second plane 222 corresponds to the side surface of the second portion 22b.

[0174] According to the above structure, the distance between the inner peripheral surface 20c of the coil wiring portion 20 and the second pad portion 22D in the connection direction L can be increased, and the possibility of short circuit between the coil wiring portion 20 and the second pad portion 22D in the connection direction L can be further reduced.

[0175] <Fourth Implementation>

[0176] Figure 10 This is a cross-sectional view showing one embodiment of the mounting components. For example... Figure 10 As shown, the mounting component 3 has a substrate 300 and an inductor component 1E disposed within the substrate 300.

[0177] The inductor component 1E is a structure that does not include the first external terminal 41, the second external terminal 42, and the covering film 50 in the inductor component 1 shown in the first embodiment.

[0178] The substrate 300 has a main body 310, internal wiring 320, and external wiring 330. The main body 310 is made of, for example, an insulating material. The internal wiring 320 is disposed within the main body 310. The external wiring 330 is disposed on the main surface 310a of the main body 310. The internal wiring 320 is connected to the first columnar wiring 31 and the second columnar wiring 32 of the inductor component 1E. The internal wiring 320 is connected to the external wiring 330. Thus, the inductor component 1E is electrically connected to the external wiring 330.

[0179] According to the above structure, since the inductor component 1E is built into the substrate 300, the mounting area of ​​the surface of the substrate 300 can be increased.

[0180] Furthermore, this disclosure is not limited to the above-described embodiments, and design changes can be made without departing from the spirit of this disclosure. For example, the feature points of each of the first to fourth embodiments can be combined in various ways.

[0181] In the above embodiment, at least a portion of the first pad portion extends in a direction orthogonal to the connection direction L, but it may also extend in a direction intersecting the connection direction L at an angle other than perpendicular. Similarly, at least a portion of the second pad portion extends in a direction orthogonal to the connection direction L, but it may also extend in a direction intersecting the connection direction L at an angle other than perpendicular.

[0182] In the above embodiments, the first pad portion and the second pad portion are respectively formed in a straight line shape or an L-shape, but as long as they have a portion extending in a direction that intersects with the connecting direction L and is close to the inner peripheral surface of the coil wiring portion, they can be any shape.

Claims

1. An inductor component, wherein, Possessing: a base body having a main surface; a coil disposed in the base body and extending along the main surface; and a first vertical wiring and a second vertical wiring disposed in the base body so as to have end surfaces exposed from the main surface of the base body and connected to each of both ends of the coil, the coil having: a coil wiring portion having a first end portion and a second end portion and extending in a circumferential direction for one turn or less; a first land portion that is a portion for connection of the first vertical wiring and is connected to the first end portion; and a second land portion that is a portion for connection of the second vertical wiring and is connected to the second end portion, at least a portion of the first land portion extends in a direction intersecting a direction connecting the first end portion and the second end portion and in a direction approaching an inner peripheral surface of the coil wiring portion when viewed in a direction orthogonal to the main surface, at least a portion of the second land portion extends in a direction intersecting a direction connecting the first end portion and the second end portion and in a direction approaching an inner peripheral surface of the coil wiring portion when viewed in a direction orthogonal to the main surface.

2. The inductor component according to claim 1, wherein the inductor component further possesses: a first external terminal that contacts the main surface and the end surface of the first vertical wiring; and a second external terminal that contacts the main surface and the end surface of the second vertical wiring.

3. The inductor component according to claim 2, wherein the base body contains a magnetic powder, the first external terminal and the second external terminal contact the magnetic powder.

4. The inductor component according to any one of claims 1 to 3, wherein the inductor component further possesses a coating film provided on the main surface, the coating film containing a black colorant.

5. The inductor component according to any one of claims 1 to 3, wherein when viewed in a direction orthogonal to the main surface, the first land portion has a first flat surface that is linear and that is a terminal surface of an extending direction of the first land portion and that opposes an inner peripheral surface of the coil wiring portion, a shortest distance between the first flat surface and the inner peripheral surface of the coil wiring portion does not become a smallest distance between an outer surface of the first land portion and the inner peripheral surface of the coil wiring portion.

6. The inductor component according to any one of claims 1 to 3, wherein when viewed in a direction orthogonal to the main surface, the first land portion has: a first flat surface that is linear and that extends in a direction connecting the first end portion and the second end portion and that opposes an inner peripheral surface of the coil wiring portion; and a second flat surface that is linear and that extends in a direction orthogonal to the direction connecting the first end portion and the second end portion and that opposes the inner peripheral surface of the coil wiring portion, ​ ​ When a face parallel to the first plane and meeting a portion of the inner circumferential face of the coil wiring portion opposite the first plane is set as a first imaginary face, and a face parallel to the second plane and meeting a portion of the inner circumferential face of the coil wiring portion opposite the second plane is set as a second imaginary face, a distance a between the second imaginary face and the second plane is smaller than a distance b between the first imaginary face and the first plane.

7. The inductor component according to any one of claims 1 to 3, wherein when viewed from a direction orthogonal to the main face, the first pad portion has: a first plane extending in a direction connecting the first end portion and the second end portion and facing the inner circumferential face of the coil wiring portion; and a second plane extending in a direction orthogonal to the direction connecting the first end portion and the second end portion and facing the inner circumferential face of the coil wiring portion, when viewed from a direction orthogonal to the main face, the first pad portion has: a first plane extending in a direction connecting the first end portion and the second end portion and facing the inner circumferential face of the coil wiring portion; and a second plane extending in a direction orthogonal to the direction connecting the first end portion and the second end portion and facing the inner circumferential face of the coil wiring portion, when a face parallel to the first plane and meeting a portion of the inner circumferential face of the coil wiring portion opposite the first plane is set as a first imaginary face, and a face parallel to the second plane and meeting a portion of the inner circumferential face of the coil wiring portion opposite the second plane is set as a second imaginary face, a distance a between the second imaginary face and the second plane is equal to or greater than a distance b between the first imaginary face and the first plane.

8. The inductor component according to claim 6, wherein the base body contains magnetic powder, the distance a between the second imaginary face and the second plane is equal to or greater than twice the particle diameter D50 of the magnetic powder.

9. The inductor component according to claim 6, wherein when viewed from a direction orthogonal to the main face, a shortest distance c between the first pad portion and the second pad portion is greater than the distance a between the second imaginary face and the second plane.

10. The inductor component according to claim 6, wherein when viewed from a direction orthogonal to the main face, a shortest distance c between the first pad portion and the second pad portion is equal to or smaller than the distance a between the second imaginary face and the second plane.

11. The inductor component according to claim 9, wherein the base body contains magnetic powder, the shortest distance c between the first pad portion and the second pad portion is equal to or greater than twice the particle diameter D50 of the magnetic powder.

12. The inductor component according to any one of claims 1 to 3, wherein when viewed from a direction orthogonal to the main face, the first pad portion has: a first portion extending from the first end portion in a direction connecting the first end portion and the second end portion; and a second portion extending from the first portion side in a direction intersecting the direction connecting the first end portion and the second end portion and in a direction approaching the inner circumferential face of the coil wiring portion, when viewed from a direction orthogonal to the main face, the second pad portion has: a first portion extending from the second end portion in a direction connecting the first end portion and the second end portion; and a second portion extending from the first portion side in a direction intersecting the direction connecting the first end portion and the second end portion and in a direction approaching the inner circumferential face of the coil wiring portion, The second portion extends from the first portion in a direction intersecting a direction in which the first end portion and the second end portion are connected and in a direction approaching an inner peripheral surface of the coil wiring portion.

13. The inductor component according to claim 12, wherein The first portion of the first pad portion does not protrude inward from the inner peripheral surface of the coil wiring portion when viewed in a direction orthogonal to the main surface.

14. The inductor component according to any one of claims 1 to 3, wherein The thickness of the coil is thinner than the thickness of each of the first vertical wiring and the second vertical wiring.

15. The inductor component according to any one of claims 1 to 3, wherein The base body has a first magnetic layer and a second magnetic layer stacked in a first direction orthogonal to the main surface, The first vertical wiring and the second vertical wiring extend from both ends of the coil in the first direction, The first magnetic layer is present in a direction opposite to the first direction of the coil, The second magnetic layer is present in the first direction of the coil and a direction orthogonal to the first direction, and the first vertical wiring and the second vertical wiring pass through the second magnetic layer, The thickness of the first magnetic layer is thicker than the thickness of the second magnetic layer.

16. A mounting member, wherein, comprise: a substrate; and The inductor component according to any one of claims 1 to 15 is arranged in the substrate.

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