Substrate carrying structure and substrate detection device

Abstract

A substrate carrying structure and a substrate detecting device are disclosed. The substrate carrying structure is used to carry a substrate, and includes a carrier and an elastic supporting member. The carrier has a carrying surface, wherein a receiving groove is formed on the carrying surface and surrounds the center of the carrier. The elastic supporting member is disposed in the receiving groove and protrudes from the carrying surface. The substrate contacts the elastic supporting member to form a closed space, and causes the elastic supporting member to deform and be located below the carrying surface. Thus, the substrate carrying structure provided by the present application can improve the warping problem of the substrate, so as to improve the accuracy and stability of the process.

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate carrying structure, in particular to a substrate carrying structure and a substrate detecting device for improving substrate warpage. BACKGROUND

[0002] In the process of semiconductor manufacturing, a wafer is carried by a wafer carrier and is fixed by vacuum suction. However, when the wafer is suctioned by the existing wafer carrier, the wafer often warps and deforms by itself, resulting in uneven suction and causing the wafer to be unable to be attached flat on the wafer carrier.

[0003] Therefore, how to overcome the above-mentioned defects by improving the structure design has become one of the important topics that the field wants to solve. SUMMARY

[0004] The present application provides a substrate carrying structure and a substrate detecting device to solve the technical problems of the prior art.

[0005] To solve the above-mentioned technical problems, one of the technical solutions adopted by the present application is to provide a substrate carrying structure for carrying a substrate, the substrate carrying structure comprising a carrier and at least one elastic support member. The carrier has a carrying surface, wherein at least one accommodating groove is formed on the carrying surface and surrounds the center of the carrier. At least one elastic support member is arranged in the corresponding at least one accommodating groove, and the elastic support member protrudes from the carrying surface. Wherein, the substrate contacts at least one elastic support member to form at least one closed space, and makes at least one elastic support member deformed and located below the carrying surface.

[0006] To solve the above-mentioned technical problems, another technical solution adopted by the present application is to provide a substrate detecting device for detecting a substrate, the substrate detecting device comprising a carrier, at least one elastic support member, an image capturing device and a detecting device. The carrier has a carrying surface for placing the substrate, wherein at least one accommodating groove is formed on the carrying surface and surrounds the center of the carrier. At least one elastic support member is arranged in the corresponding at least one accommodating groove, and the elastic support member protrudes from the carrying surface. The image capturing device captures the image of the substrate on the carrying surface. The detecting device is coupled to the image capturing device, and the detecting device analyzes the image of the substrate to generate a detection result. Wherein, the substrate contacts at least one elastic support member to form at least one closed space, and makes at least one elastic support member deformed and located below the carrying surface.

[0007] The substrate bearing structure and the substrate detection device can improve the warping problem of the substrate and improve the accuracy and stability of the process.

[0008] For further understanding of the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application. However, the drawings provided are only for reference and illustration, and are not used to limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 It is a schematic diagram of the substrate bearing structure of the first embodiment of the present application.

[0010] Figure 2 It is a schematic diagram of the substrate bearing structure of the first embodiment of the present application.

[0011] Figure 3 It is a schematic diagram of the first elastic support component of the substrate bearing structure of the first embodiment of the present application.

[0012] Figure 4 It is a schematic diagram of the first use state of the substrate bearing structure of the first embodiment of the present application.

[0013] Figure 5 It is a schematic diagram of the second use state of the substrate bearing structure of the first embodiment of the present application.

[0014] Figure 6 It is a schematic diagram of the first elastic support component of the substrate detection device of the first embodiment of the present application. Figure 4 It is an enlarged schematic diagram of the VI part.

[0015] Figure 7 It is a schematic diagram of the VII part. Figure 5 It is an enlarged schematic diagram of the VII part.

[0016] Figure 8 It is a schematic diagram of the VIII part. Figure 4 It is an enlarged schematic diagram of the VIII part.

[0017] Figure 9 It is a schematic diagram of the IX part. Figure 5 It is an enlarged schematic diagram of the IX part.

[0018] Figure 10 It is a schematic diagram of the first elastic support component and the second elastic support component of the substrate detection device of the first embodiment of the present application.

[0019] Figure 11 It is a schematic diagram of one of the use states of the first elastic support component of the substrate detection device of the first embodiment of the present application. It also corresponds to the VII part. Figure 5

[0020] Figure 12 ​This is a schematic diagram of one usage state of the second elastic support member of the substrate detection device according to the first embodiment of the present invention; it also corresponds to... Figure 5 Part IX.

[0021] Figure 13 This is a schematic diagram of the substrate detection device in use according to the first embodiment of the present invention.

[0022] Figure 14 This is a top view of the substrate support structure according to the second embodiment of the present invention.

[0023] Figure 15 This is a partial cross-sectional schematic diagram of the substrate support structure according to the second embodiment of the present invention.

[0024] Figure 16 This is a schematic diagram of the substrate support structure in use according to the second embodiment of the present invention. Detailed Implementation

[0025] The following specific embodiments illustrate the implementation of the "substrate support structure and substrate testing device" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0026] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components, these components should not be limited by these terms. These terms are primarily used to distinguish one component from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more related listed items.

[0027] First Embodiment

[0028] Please see Figures 1 to 13 The first embodiment of the present invention provides a substrate support structure Z, including a stage 1, a first elastic support member 2, and a second elastic support member 3. The substrate support structure Z of the present invention can be applied to equipment for semiconductor packaging or wafer inspection, but is not limited thereto.

[0029] First, cooperate Figure 1 and Figure 2As shown in FIG. 1 and FIG. 2, respectively, are a perspective view and a top view of a substrate carrying structure according to a first embodiment of the present application. The carrier 1 of the present application can have a carrying surface 10, which can include at least one suction area, wherein the range of the at least one suction area is defined by a corresponding accommodation groove. For example, the carrying surface 10 can include a first accommodation groove 100 and a second accommodation groove 101, which surround the center of the carrier 1. The upper surface of the carrier 1 can be the carrying surface 10 for placing a substrate B (which can be a wafer, but is not limited thereto, and can also be other types of substrates), which has the first accommodation groove 100 and the second accommodation groove 101 spaced apart from each other by a predetermined distance W, and the first accommodation groove 100 and the second accommodation groove 101 can be annular grooves. The carrying surface 10 can have a first suction area 102 located at the center of the carrying surface 10 and surrounded by the first accommodation groove 100, and a second suction area 103 located between the first accommodation groove 100 and the second accommodation groove 101 and surrounding the first suction area 102.

[0030] Further, as shown in FIG. 3 and FIG. 4, respectively, Figure 1 、 Figure 2 and Figure 4 wherein, Figure 4 is a first use state diagram of the substrate carrying structure according to the first embodiment of the present application. The carrier 1 of the present application can also have a central passage 11, at least one first passage 12, and at least one second passage 13. The central passage 11, the at least one first passage 12, and the at least one second passage 13 pass through the body of the carrier 1, the central passage 11 and the at least one first passage 12 correspond to the first suction area 102, and the at least one second passage 13 corresponds to the second suction area 103; and the first accommodation groove 100 surrounds the central passage 11 and the at least one first passage 12, and the at least one second passage 13 is located between the first accommodation groove 100 and the second accommodation groove 101. In this embodiment, the central passage 11 is located at the center of the carrying surface 10 (i.e., the carrier 1), the first passages 12 are a plurality of and surround the central passage 11, and the second passages 13 are a plurality of and surround the first accommodation groove 100, but are not limited thereto. Furthermore, one end of the central passage 11, one end of the first passage 12, and one end of the second passage 13 can be connected to an external vacuum source S of a machine device, and the other end of the central passage 11, the other end of the first passage 12, and the other end of the second passage 13 are connected to the carrying surface 10; in other words, the central passage 11 and the at least one suction area are connected to the external vacuum source S, which is used to generate a suction force to allow the substrate B to be adsorbed on the elastic support member. In addition, the central passage 11, one of the first passages 12, and one of the second passages 13 can be located on the same straight line (or arranged in a straight line), but are not limited thereto.

[0031] Next, as shown in FIG. 5 and FIG. 6, respectively,Figures 1 to 7 Fig. 1 shows a schematic view of a substrate support structure according to a first embodiment of the present application, wherein Figure 3 Fig. 2 shows a schematic view of a cross-section of a first elastic support member of the substrate support structure according to the first embodiment of the present application, and Figures 5 to 7 Fig. 3 shows a schematic view of a second use state of the substrate support structure according to the first embodiment of the present application, Figure 4 Fig. 4 shows a schematic view of a magnified portion VI of Fig. 3, and Figure 5 Fig. 5 shows a schematic view of a magnified portion VII of Fig. 3. The first elastic support member 2 of the present application can be located in the first accommodating groove 100 and surround the center of the support platform 1. In one preferred embodiment, the first elastic support member 2 protrudes from the support surface 10, and the height range of the first elastic support member 2 protruding from the support surface 10 is between 1 mm and 10 mm, preferably 3 mm. For example, the first elastic support member 2 can be a sleeve structure of a soft material with elasticity, and the first elastic support member 2 can include a first bending element 20 and a first positioning element 21; wherein the first bending element 20 and the first positioning element 21 can be a single member, i.e., the first bending element 20 and the first positioning element 21 are integrated structures. One end of the first bending element 20 can be used to support the substrate B, and the other end of the first bending element 20 is connected to the first positioning element 21, and the first positioning element 21 is sleeved in the first accommodating groove 100; wherein, in cooperation with Figure 6 Fig. 4, the structure on one side of the first accommodating groove 100 can be stepped, and the first positioning element 21 can abut against two mutually perpendicular wall surfaces in the first accommodating groove 100. In addition, the cross-section of the first bending element 20 can be V-shaped, and the cross-section of the first positioning element 21 can be L-shaped, but not limited thereto. Wherein, the substrate B contacts the first elastic support member 2 to form a closed space (i.e., a closed space formed between the substrate B, the first elastic support member 2 and the support platform 1), and the first elastic support member 2 is deformed and located below the support surface 10.

[0032] Next, in cooperation with Figures 1 to 5 , Figure 8 and Figure 9 Fig. 6 shows a schematic view of a second elastic support member of the substrate support structure according to the first embodiment of the present application, wherein Figure 8 Fig. 7 shows a schematic view of a magnified portion VIII of Fig. 6, and Figure 4 Fig. 8 shows a schematic view of a magnified portion IX of Fig. 6, Figure 9 Fig. 9 shows a schematic view of a magnified portion X of Fig. 6, and Figure 5An enlarged schematic diagram of part IX. The second elastic support member 3 of the present invention can be located in the second receiving groove 101 and surround the center of the stage 1. The second elastic support member 3 protrudes from the bearing surface 10, and the height of the second elastic support member 3 protruding from the bearing surface 10 ranges from 1 mm to 10 mm, preferably 3 mm. For example, the second elastic support member 3 can be a collar structure made of a flexible material, and the diameter D2 of the second elastic support member 3 is larger than the diameter D1 of the first elastic support member 2. The second elastic support member 3 may include a second bending element 30 and a second positioning element 31. The second bending element 30 and the second positioning element 31 can be a single component, i.e., the second bending element 30 and the second positioning element 31 are an integrated structure. One end of the second bending element 30 can be used to support the substrate B, and the other end of the second bending element 30 is connected to the second positioning element 31, which is sleeved in the second receiving groove 101. Figure 7 As shown, the structure on one side of the second receiving groove 101 can be stepped, and the second positioning element 31 can abut against two mutually perpendicular walls in the second receiving groove 101. Furthermore, the cross-section of the second bending element 30 can be V-shaped, the cross-section of the second positioning element 31 can be L-shaped, and the cross-sectional area of ​​the second elastic support member 3 can be greater than or equal to the cross-sectional area of ​​the first elastic support member 2, but is not limited thereto. The substrate B contacts the second elastic support member 3 to form a sealed space (i.e., a sealed space formed between the substrate B, the second elastic support member 3, and the stage 1), causing the second elastic support member 3 to deform and be positioned below the bearing surface 10.

[0033] The substrate B is supported by the first elastic support member 2 and the second elastic support member 3. In the unadsorbed state, there is a predetermined height H between the substrate B and the bearing surface 10 of the stage 1. The predetermined height H can be between 1 mm and 10 mm, preferably 3 mm. That is, in conjunction with... Figure 4 and Figure 6 As shown, in the unadsorbed state, a portion of the body of the first bending element 20 of the first elastic support member 2 (i.e., a portion of the first upper support 200 and the first lower support 201) is higher than the surface of the platform 1 (i.e., the bearing surface 10) by a predetermined height H, or in conjunction with... Figure 4 and Figure 8As shown, a portion of the body of the second bending element 30 of the second elastic support member 3 (i.e. a portion of the second upper support portion 300) is higher than the surface of the platform 1 (i.e. the bearing surface 10) by a predetermined height H. Thus, the warped substrate and the elastic support member are in contact, which facilitates the establishment of a vacuum- sealed space (i.e. the first closed space E1 and the second closed space E2) to generate an adsorbing force, and the elastic support member is easily bent below the surface of the platform 1, so that the substrate B (e.g. a wafer) is adsorbed and leveled on the platform 1, thereby reducing or eliminating the need to apply a force to press the wafer down, and reducing the probability of damage to the substrate (particularly some thin wafers, which are only about 0.2 to 0.3 mm thick).

[0034] Furthermore, if the height of the elastic support member (i.e. the first elastic support member 2 and the second elastic support member 3) is too high, the elastic support member will naturally sag (e.g. the first upper support portion 200 of the first bending element 20 and the second upper support portion 300 of the second bending element 30); and if the height of the elastic support member is too low, the elastic support member cannot effectively contact the warped wafer. Moreover, if the setting mode of the present application is not used, and the hardness of the material of the elastic support member is increased to maintain a higher height of the elastic support member to effectively contact a substrate with a large warpage, the elastic support member will not be easily bent, and thus, additional force or / and vacuum suction is required to adsorb the wafer on the platform 1, and excessive force will increase the probability of damage to the wafer.

[0035] Therefore, during use of the platform device (not shown in the figure), the substrate bearing structure Z of the present application can be arranged on the top of the platform device. Then, the substrate B (e.g. a wafer, but not limited thereto) is placed on the substrate bearing structure Z. Figures 1 to 4 As shown, the substrate bearing structure Z can bear the substrate B (e.g. a wafer, but not limited thereto) by the first elastic support member 2 and the second elastic support member 3. Since the first elastic support member 2 and the second elastic support member 3 are soft and elastic, the top of the first elastic support member 2 and the second elastic support member 3 can uniformly contact the bottom surface of the substrate B, which facilitates subsequent vacuum adsorption. Moreover, the first elastic support member 2, the substrate B and the bearing surface 10 form the first closed space E1, and the first elastic support member 2, the second elastic support member 3, the substrate B and the bearing surface 10 form the second closed space E2.

[0036] Next, the substrate B is adsorbed on the platform 1 by vacuum suction. Figures 1 to 9As shown, when the external vacuum source S draws gas from the first enclosed space E1 and the second enclosed space E2 through the central channel 11, the first channel 12 and the second channel 13, and establishes a vacuum state in the first enclosed space E1 and the second enclosed space E2, the substrate B is attracted by the external vacuum source S and moves towards the bearing surface 10; at this time, the first elastic support member 2 and the second elastic support member 3 will change from the first type to the second type.

[0037] Furthermore, in coordination Figures 3 to 9 As shown, when the substrate B approaches the bearing surface 10, the first bending element 20 will bend under the pressure of the substrate B and change from a first unfolded state (as shown in the figure). Figure 4 , Figure 6 (as shown) transforms into the first closed state (as shown) Figure 5 , Figure 7 As shown), and the second bending element 30 is also bent by the pressure of the substrate B and forms a second unfolded shape (as shown). Figure 4 , Figure 8 (as shown) transforms into a second closed state (such as) Figure 5 , Figure 9 As shown in the diagram, at this time, the first elastic support member 2 and the second elastic support member 3 will deform and be located below the bearing surface 10; that is, the first bending element 20 and the second bending element 30 will be located below the bearing surface 10, and one end of the first bending element 20 that contacts the substrate B and one end of the second bending element 30 that contacts the substrate B will be flush with the bearing surface 10, and the side of the substrate B facing the bearing surface 10 will be flush with the bearing surface 10. Since the second elastic support member 3 is closer to the edge of the substrate B, the flatness of the substrate B can be effectively adjusted after the external vacuum source S is evacuated; moreover, the present invention can also use the first elastic support member 2 to assist in supporting the substrate B, so that the substrate B can float downwards and parallel to the bearing surface 10 after the external vacuum source S is evacuated.

[0038] It is worth noting that although this embodiment uses multiple elastic support components and multiple receiving slots as examples, it is not limited thereto; in actual implementation, only the first receiving slot 100 and the first elastic support component 2 or the second receiving slot 101 or the second elastic support component 3 may be provided, or more than two elastic support components and receiving slots may be provided.

[0039] Therefore, the substrate support structure Z of the present invention, through the above-described technical solution, by providing the first elastic support member 2 and the second elastic support member 3, can enhance the vacuum adsorption capability and effectively solve the problem of substrate B warping.

[0040] Furthermore, in coordination Figures 1 to 7As shown, the first bending element 20 can have a first upper support portion 200 and a first lower support portion 201, the first lower support portion 201 being connected to the first upper support portion 200 and the first positioning element 21, and the first upper support portion 200 and the first lower support portion 201 being connected to each other at a first predetermined included angle A1; wherein when the first bending element 20 is in the first unfolded state, the first predetermined included angle A1 is greater than or equal to 90 degrees, and when the first bending element 20 is in the first folded state, the first predetermined included angle A1 is less than 90 degrees. In addition, the first accommodating groove 100 can be divided into a first adsorption space 100a and a first buffer space 100b by the first elastic support member 2. For example, the first adsorption space 100a can be located at the outer side of the first elastic support member 2 (i.e. the side away from the center of the carrier 1), and the first buffer space 100b can be located at the inner side of the first elastic support member 2 (i.e. the side adjacent to the center of the carrier 1). One end of the first upper support portion 200 abuts against the substrate B, and when the external vacuum source S establishes a vacuum state in the first closed space E1, the first bending element 20 will be compressed by the substrate B to generate a bending action, so that the side of the first upper support portion 200 facing away from the central passage 11 will be displaced downward, and at the same time, the side of the first lower support portion 201 facing the central passage 11 will also be displaced downward, thereby reducing the angle of the first predetermined included angle A1; and one part of the first upper support portion 200 can be accommodated in the first adsorption space 100a, and the first buffer space 100b can be used as an accommodation space for the deformation of the first bending element 20 (i.e. the other part of the first upper support portion 200 and the first lower support portion 201). Conversely, when the external vacuum source S releases the vacuum state in the first closed space E1, the first bending element 20 can return to the first unfolded state (as shown in Figure 5 ) from the first folded state (as shown in Figure 4 ) by the elastic restoring force of itself, at the same time, the side of the first upper support portion 200 facing away from the central passage 11 will be displaced upward, and the side of the first lower support portion 201 facing the central passage 11 will also be displaced upward, thereby increasing the angle of the first predetermined included angle A1. Wherein the length of the first upper support portion 200 is greater than the length of the first lower support portion 201, when the first elastic support member 2 is located below the carrier surface 10, in order to increase the area of supporting the substrate B.

[0041] In addition, in cooperation with Figures 1 to 9As shown, the second bending element 30 can have a second upper support portion 300 and a second lower support portion 301, the second lower support portion 301 is connected to the second upper support portion 300 and the second positioning element 31, and a second predetermined included angle A2 is formed between the second upper support portion 300 and the second lower support portion 301; wherein when the second bending element 30 is in the second unfolded state, the second predetermined included angle A2 is greater than or equal to 90 degrees, and when the second bending element 30 is in the second folded state, the second predetermined included angle A2 is less than 90 degrees. In addition, the second accommodating groove 101 can be divided into a second adsorption space 101a and a second buffer space 101b by the second elastic support member 3. For example, the second adsorption space 101a can be located on the outer side of the second elastic support member 3 (i.e. the side away from the center of the carrier 1), and the second buffer space 101b can be located on the inner side of the second elastic support member 3 (i.e. the side adjacent to the center of the carrier 1). One end of the second upper support portion 300 abuts against the substrate B; wherein when the external vacuum source S establishes a vacuum state in the second closed space E2, the second bending element 30 will be compressed by the substrate B to generate a bending action, so that the side of the second upper support portion 300 facing away from the first elastic support member 2 will be displaced downward, and at the same time, the side of the second lower support portion 301 facing the first elastic support member 2 will also be displaced downward, thereby reducing the angle of the second predetermined included angle A2; and one part of the second upper support portion 300 can be accommodated in the second adsorption space 101a, and the second buffer space 101b can be used as an accommodation space for the deformation of the second bending element 30 (i.e. the other part of the second upper support portion 300 and the second lower support portion 301). Conversely, when the external vacuum source S releases the vacuum state in the second closed space E2, the second bending element 30 can recover from the second folded state to the second unfolded state by its own elastic restoring force, at the same time, the side of the second upper support portion 300 facing away from the first elastic support member 2 will be displaced upward, and the side of the second lower support portion 301 facing the first elastic support member 2 will also be displaced upward, thereby increasing the angle of the second predetermined included angle A2. Wherein the length of the second upper support portion 300 is greater than the length of the second lower support portion 301, and when the second elastic support member 3 is located below the bearing surface 10, the area for supporting the substrate B is increased.

[0042] In other preferred embodiments, the first bending element 20 of the present application can also have a bending characteristic in addition to the above-mentioned Figure 7 bending mode of the first upper support portion 200 of the first bending element 20. For example, in combination with Figures 10 to 12As shown, the first and second elastic support members of the substrate detection device of the first embodiment of the present application are shown in a schematic view of the range of attraction, a schematic view of one of the first elastic support members in use, and a schematic view of one of the second elastic support members in use. When the external vacuum source S establishes a vacuum state in the first enclosed space E1, in addition to the first bending element 20 being pressed by the substrate B to produce a bending action, when the substrate B approaches the loading surface 10 of the stage 1, the first upper support portion 200 of the first bending element 20 is also pressed by the substrate B and the first lower support portion 201 to produce a bending action, and changes from a straight shape to a curved shape. The first upper support portion 200 can further include an extension portion 200a, which, when the extension portion 200a is located below the loading surface 10, increases the area for supporting the substrate B. When the first upper support portion 200 is in a curved shape, the body of the first upper support portion 200 can be divided into two parts, one part of the body in contact with the substrate B being the extension portion 200a, and the other part of the body being connected to the first lower support portion 201. At this time, the end of the first upper support portion 200 in contact with the substrate B is displaced in a direction away from the center of the stage 1, so that the area of the first upper support portion 200 of the first bending element 20 around the surface of the substrate B is increased, expanded, and further increases the area of attraction and the stability of attraction of the substrate B. Further, when the first bending element 20 is in a first unfolded shape (i.e., an uncurved state), the area range AR1 of the inside of the first upper support portion 200 around the surface of the substrate B is smaller than the area range AR2 of the inside of the first upper support portion 200 around the surface of the substrate B when the first bending element 20 is in a first folded shape.

[0043] When the external vacuum source S establishes a vacuum state for the second closed space E2, in addition to the second bending element 30 being pressed by the substrate B to generate a bending action, when the substrate B approaches the bearing surface 10 of the stage 1, the second upper support portion 300 of the second bending element 30 is also pressed by the substrate B and the second lower support portion 301 to generate a bending action, and is converted from a straight shape to a curved shape. The second upper support portion 300 can further include an extension portion 300a, which, when the extension portion 300a is located below the bearing surface 10, is used to increase the area for supporting the substrate B. When the second upper support portion 300 is in a curved shape, the body of the second upper support portion 300 can be divided into two parts, one part of the body in contact with the substrate B being the extension portion 300a, and the other part of the body being connected to the second lower support portion 301. At this time, the end of the second upper support portion 300 in contact with the substrate B is displaced in a direction away from the center of the stage 1, so that the second upper support portion 300 of the second bending element 30 surrounds an increased and expanded surface area of the substrate B, thereby increasing the area of the substrate B that is adsorbed and the adsorption stability. Further, when the second bending element 30 is in a second unfolded shape (i.e., an uncurved state), the area range AR3 of the inner side of the second upper support portion 300 of the second bending element 30 surrounding the surface of the substrate B is smaller than the area range AR4 of the inner side of the second upper support portion 300 of the second bending element 30 surrounding the surface of the substrate B when the second bending element 30 is in a second folded shape.

[0044] Notably, Figure 7 Compared with Figure 11 and Figure 9 Compared with Figure 12 , the first upper support portion 200 and the second upper support portion 300 of the present application have different change patterns when the substrate B approaches the stage 1, but the first upper support portion 200 and the second upper support portion 300 of the present application can both Figure 7 and Figure 9 , and can both increase and expand the surface area surrounding the substrate B, thereby increasing the area of the substrate B that is adsorbed and the adsorption stability. Figure 11 and Figure 12 .

[0045] In addition, according to the above-mentioned implementation content, in combination with Figures 1 to 13 , wherein Figure 13Figure 1 is a schematic diagram showing the use state of the substrate detection device of the first embodiment of the present application. The present application further provides a substrate detection device D for detecting a substrate B, the substrate detection device D comprising a carrier 1, at least one elastic support member, an image capturing device 4, and a detection device 5. The carrier 1 has a bearing surface 10 for placing the substrate B, wherein at least one accommodating groove is formed on the bearing surface 10 and surrounds the center of the carrier 1. The at least one elastic support member is arranged in the corresponding at least one accommodating groove and protrudes from the bearing surface 10. The image capturing device 4 captures the image of the substrate B on the bearing surface 10. The detection device 5 is coupled to the image capturing device 4, and the detection device 5 analyzes the image of the substrate B to generate a detection result. Wherein, the substrate B contacts the at least one elastic support member to form at least one closed space and make the at least one elastic support member deformed and located below the bearing surface 10. Wherein, the image capturing device 4 can be a camera or other same type of image capturing device, and the detection device 5 can be a computer or other operation device with processing function, but is not limited thereto.

[0046] However, the above-mentioned example is only one possible embodiment and does not limit the present application.

[0047] Second embodiment

[0048] Please refer to Figures 14 to 16 , and please refer to Figures 1 to 13 . As shown, the substrate bearing structure Z of the present embodiment is substantially similar to the substrate bearing structure Z of the above-mentioned embodiments, and thus the same elements are not described here. The difference between the substrate bearing structure Z of the present embodiment and the substrate bearing structure Z of the above-mentioned first embodiment is that, in the present embodiment, the bearing surface 10 further comprises at least one flow channel region corresponding to the at least one adsorption region, wherein the range of the at least one flow channel region is defined by the corresponding adsorption region.

[0049] For example, as shown in Figures 6 to 9 , and Figures 14 to 16 . Wherein, Figures 14 to 16 are respectively a schematic diagram, a partial cross-sectional schematic diagram, and a schematic diagram showing the use state of the substrate bearing structure of the second embodiment of the present application. The bearing surface 10 of the present application further has a plurality of first flow channels 104 and a plurality of second flow channels 105, the plurality of first flow channels 104 are located in the first adsorption region 102 and communicate with each other, the plurality of second flow channels 105 are located in the second adsorption region 103 and communicate with each other, and the plurality of first flow channels 104 and the plurality of second flow channels 105 surround the center of the carrier 1. Wherein, the at least one first channel 12 corresponds to one of the first flow channels 104, and the at least one second channel 13 corresponds to one of the second flow channels 105.

[0050] Furthermore, the first adsorption area 102 of the bearing surface 10 may be recessed, forming a plurality of first flow channels 104. Some of the first flow channels 104 are concentric and interconnected, and the first channel 12 is located on the first flow channels 104. A portion of the first flow channels 104 are connected to the first receiving groove 100, that is, the first buffer space 100b of the first receiving groove 100 is connected to a portion of the first flow channels 104. Additionally, the second adsorption area 103 of the bearing surface 10 may also be recessed, forming a plurality of second flow channels 105. Some of the second flow channels 105 are also concentric and interconnected, and the second channel 13 is located on the second flow channels 105. A portion of the second flow channels 105 are connected to the second receiving groove 101, that is, the second buffer space 101b of the second receiving groove 101 is connected to a portion of the second flow channels 105. Therefore, the substrate support structure Z of the present invention, by uniformly arranging vacuum source holes (center channel 11, first channel 12, second channel 13) and vacuum flow channels (first flow channel 104, second flow channel 105) on the support surface 10, can not only release vacuum and transmit vacuum through the vacuum flow channels, but also release vacuum source in the order of vacuum source holes (center channel 11 → first channel 12 → second channel 13), so that the substrate B can be adsorbed from the center outward, thereby improving the success rate of complete adsorption of substrate B and preventing substrate B from protruding or deforming.

[0051] Furthermore, the substrate support structure Z of the present invention also includes an air source unit 6, which is connected to one end of the central channel 11, one end of at least one first channel 12 and one end of at least one second channel 13, and the other end of at least one first channel 12 and the other end of at least one second channel 13 are connected to the support surface 10; wherein, when the air source unit 6 applies suction force to the substrate B through the central channel 11, at least one first channel 12 and at least one second channel 13, the substrate B approaches the support surface 10.

[0052] For example, coordination Figure 14 and Figure 15 As shown, the gas source unit 6 can be a vacuum device, and it can be connected to the central channel 11, the first channel 12, and the second channel 13. Therefore, when the substrate support structure Z is performing the adsorption of the substrate B, the gas source unit 6 can draw gas from the first enclosed space E1 and the second enclosed space E2 through the central channel 11, the first channel 12, and the second channel 13, thereby establishing a vacuum state in the first enclosed space E1 and the second enclosed space E2. This causes the substrate B to move closer to the support surface 10 under the suction force of the gas source unit 6. At the same time, the first elastic support member 2 and the second elastic support member 3 can also be used to support the substrate B, so that the substrate B floats parallel to the support surface 10.

[0053] However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0054] The substrate carrying structure Z provided by the present application can avoid the warping of the substrate and improve the accuracy and stability of the process by the technical scheme of "the carrier 1 has a carrying surface 10, at least one accommodating groove is formed on the carrying surface 10 and surrounds the center of the carrier 1, at least one elastic supporting component is arranged in the corresponding at least one accommodating groove, and the elastic supporting component protrudes from the carrying surface 10; the substrate B contacts the at least one elastic supporting component to form at least one closed space and make the at least one elastic supporting component deformed and located below the carrying surface 10".

[0055] The substrate detection device D provided by the present application can improve the warping of the substrate and improve the accuracy and stability of the process by the technical scheme of "the carrier 1 has a carrying surface 10 to place the substrate B, at least one accommodating groove is formed on the carrying surface 10 and surrounds the center of the carrier 1; at least one elastic supporting component is arranged in the corresponding at least one accommodating groove, and the elastic supporting component protrudes from the carrying surface 10; the image capturing device 4 captures the image of the substrate B on the carrying surface 10; the detection device 5 is coupled to the image capturing device 4, the detection device 5 analyzes the image of the substrate B to generate a detection result; wherein the substrate B contacts the at least one elastic supporting component to form at least one closed space and make the at least one elastic supporting component deformed and located below the carrying surface 10".

[0056] Further, the substrate carrying structure Z provided by the present application can effectively adjust the flatness of the substrate B after vacuumizing by arranging the first elastic supporting component 2 and the second elastic supporting component 3 and designing the structure and position of the first elastic supporting component 2 and the second elastic supporting component 3, and the first elastic supporting component 2 can assist in supporting the substrate B, so that the substrate B can be parallelly floated on the carrying surface 10 after vacuumizing, thereby strengthening the vacuum adsorption capacity and effectively solving the warping problem of the substrate B.

[0057] The above disclosed content is only the preferred feasible embodiment of the present application, and does not limit the protection scope of the claims of the present application, so that any equivalent technical change made according to the content of the specification and drawings of the present application is included in the protection scope of the claims of the present application.

Claims

1. A substrate support structure, comprising: A substrate supporting structure for supporting a substrate, the substrate supporting structure comprising: a stage having a supporting surface, wherein at least one accommodating groove is formed on the supporting surface and surrounds a center of the stage; and at least one elastic supporting member, at least one of the elastic supporting members is disposed in a corresponding at least one of the accommodating grooves, and at least one of the elastic supporting members protrudes from the supporting surface, at least one of the elastic supporting members comprising: a positioning element, the positioning element being sleeved in the accommodating groove; and a bending element having an upper supporting portion and a lower supporting portion, wherein the lower supporting portion is connected to the positioning element and the upper supporting portion, and the upper supporting portion is used for supporting the substrate; wherein the substrate contacts at least one of the elastic supporting members to form at least one closed space, and to cause at least one of the elastic supporting members to be deformed and located below the supporting surface; wherein a length of the upper supporting portion is greater than a length of the lower supporting portion, and the upper supporting portion further comprises an extension portion, when at least one of the elastic supporting members is located below the supporting surface, the upper supporting portion is also subjected to compression from the substrate and the lower supporting portion to generate a bending action, and a portion of the upper supporting portion that is bent forms the extension portion, to increase an area for supporting the substrate.

2. The substrate support structure of claim 1, wherein, A height range of at least one of the elastic supporting members protruding from the supporting surface is between 1 millimeter and 10 millimeters.

3. The substrate support structure of claim 1, wherein, One end and the other end of the bending element form a predetermined included angle, wherein when the bending element is in an unfolded state, the predetermined included angle is greater than or equal to 90 degrees, and when the bending element is in a folded state, the predetermined included angle is less than 90 degrees.

4. The substrate support structure of claim 1, wherein, The supporting surface comprises: at least one adsorption area, a range of at least one of the adsorption areas being defined by a corresponding at least one of the accommodating grooves; a central passage located at the center of the stage and penetrating through a body of the stage; and at least one flow channel area, at least one of the flow channel areas corresponding to at least one of the adsorption areas, wherein a range of at least one of the flow channel areas is defined by a corresponding at least one of the adsorption areas.

5. The substrate support structure of claim 4, wherein, The central passage and at least one of the adsorption areas are connected to an external vacuum source to generate an adsorption force, so that the substrate is adsorbed on the elastic supporting member.

6. A substrate inspection apparatus characterized by comprising: A substrate detecting device for detecting a substrate, the substrate detecting device comprising: a stage having a supporting surface for placing the substrate, wherein at least one accommodating groove is formed on the supporting surface and surrounds a center of the stage; at least one elastic supporting member, at least one of the elastic supporting members is disposed in a corresponding at least one of the accommodating grooves, and at least one of the elastic supporting members protrudes from the supporting surface, at least one of the elastic supporting members comprising: a positioning element, the positioning element being sleeved in the accommodating groove; and a bending element having an upper supporting portion and a lower supporting portion, wherein the lower supporting portion is connected to the positioning element and the upper supporting portion, and the upper supporting portion is used for supporting the substrate; an image capturing device, the image capturing device capturing an image of the substrate on the supporting surface; and a detection device coupled to the image capturing device, the detection device analyzing the image of the substrate to generate a detection result; wherein the substrate contacts at least one of the elastic support members to form at least one enclosed space and to deform at least one of the elastic support members and position it below the support surface; wherein the upper support portion has a length greater than that of the lower support portion, and the upper support portion further comprises an extension portion, when at least one of the elastic support members is positioned below the support surface, the upper support portion is also subjected to compression from the substrate and the lower support portion to generate a bending action, and the portion of the upper support portion that is bent forms the extension portion to increase the area for supporting the substrate.

7. The substrate detecting apparatus according to claim 6, wherein The height of at least one of the elastic support members protruding from the support surface is between 1 mm and 10 mm.

8. The substrate detecting apparatus according to claim 6, characterized by One end of the bending element forms a predetermined included angle with the other end, wherein the predetermined included angle is greater than or equal to 90 degrees when the bending element is in an unfolded state, and the predetermined included angle is less than 90 degrees when the bending element is in a folded state. One end of the bending element forms a predetermined included angle with the other end, wherein the predetermined included angle is greater than or equal to 90 degrees when the bending element is in an unfolded state, and the predetermined included angle is less than 90 degrees when the bending element is in a folded state.

Images