Antenna flexible circuit board manufacturing method and antenna flexible circuit board
By attaching a cover film and reinforcement to the substrate of the flexible circuit board for high-frequency antennas, the complexity and quality risks of traditional methods are avoided by eliminating the need for inner layer patterning and stacking pressure transmission processes, thus achieving simplified processes and cost savings.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHUHAI ALL WINNER FPC
- Filing Date
- 2023-01-05
- Publication Date
- 2026-05-08
AI Technical Summary
Traditional methods for manufacturing flexible circuit boards for high-frequency antennas involve complex and difficult processes, and carry the risk of board delamination and breakage.
The substrate includes a base material and a first copper layer and a second copper layer respectively disposed on both sides of the base material. The antenna flexible circuit board is manufactured by attaching a cover film to the side of the copper layer away from the base material, attaching reinforcement in the bonding area, and finally attaching a shielding film, thus avoiding the inner layer patterning and stacking pressure transmission process.
It simplifies the manufacturing process, reduces the difficulty, improves product quality, saves processing and material costs, and increases material utilization.
Smart Images
Figure CN116075069B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of antenna flexible circuit board manufacturing technology, and in particular to a method for manufacturing an antenna flexible circuit board and an antenna flexible circuit board. Background Technology
[0002] Generally, high-frequency antenna flexible circuit boards are manufactured using traditional multilayer antenna flexible circuit board technology. This involves sequentially processing the high-frequency substrate through processes such as inner layer patterning, stacking and pressure transfer, laser blind vias, mechanical drilling, plasma desmearing, black shadowing, copper plating, and outer layer circuitry to create the high-frequency antenna flexible circuit board.
[0003] Traditional methods for manufacturing flexible circuit boards for high-frequency antennas involve complex and difficult processes due to the use of inner layer patterns and stacked pressure transfer technology. These methods also place high demands on the heat resistance of the substrate material and pose a risk of board delamination. Summary of the Invention
[0004] This application provides a method for manufacturing a flexible antenna circuit board and a flexible antenna circuit board, which can solve the problems of complex process flow, high difficulty and quality risk in traditional methods for manufacturing flexible antenna circuit boards.
[0005] In a first aspect, embodiments of this application provide a method for manufacturing a flexible antenna circuit board, including:
[0006] A substrate is provided, the substrate including a substrate and a first copper layer and a second copper layer respectively disposed on opposite sides of the substrate, the substrate having a through hole penetrating the substrate, the first copper layer and the second copper layer, a conductive layer electrically connecting the first copper layer and the second copper layer being disposed on the wall of the through hole, a first outer layer circuit being disposed on the first copper layer, the first outer layer circuit including a device pad and an antenna PAD, a second outer layer circuit being disposed on the second copper layer, and the side of the substrate opposite to the first copper layer having a bonding area opposite to the antenna PAD;
[0007] A first cover film is attached to the side of the first copper layer facing away from the substrate, and a second cover film is attached to the side of the second copper layer facing away from the substrate. The first cover film has a first opening window that exposes the device pads and a second opening window that exposes the antenna PAD. The second cover film has a third opening window that exposes the bonding area.
[0008] Reinforcement is applied to the bonding area;
[0009] A shielding film is attached to the side of the second cover film opposite to the second copper layer, and the shielding film covers the reinforcement.
[0010] In some embodiments, after attaching a first cover film to the side of the first copper layer facing away from the substrate and attaching a second cover film to the side of the second copper layer facing away from the substrate, and before attaching reinforcement in the bonding area, the method for manufacturing the antenna flexible circuit board further includes: performing a solder resist treatment on the substrate, such that a solder resist layer is formed on the side of the first copper layer facing away from the substrate, the solder resist layer being located within a first opening window, and the solder resist layer having a fourth opening window exposing the device pads.
[0011] In some embodiments, an anti-oxidation layer is formed on both the device pads and the antenna PAD before reinforcement is applied to the bonding area.
[0012] In some embodiments, an anti-oxidation layer is formed on both the device pads and the antenna PAD, specifically including: chemical nickel-gold treatment of the substrate, such that a nickel layer and a gold layer are sequentially deposited on both the device pads and the antenna PAD.
[0013] In some embodiments, the nickel layer has a thickness of 3µm-6µm, and the gold layer has a thickness of 0.05µm-0.10µm.
[0014] In some embodiments, the thickness of the second covering film is greater than the thickness of the first covering film.
[0015] In some embodiments, the thickness of the second cover film is greater than 50 μm, and the thickness of the first cover film is 25 μm-30 μm.
[0016] In some embodiments, the first copper layer includes a first base copper layer and a first copper plating layer stacked together, the first base copper layer being located between the first copper plating layer and the substrate; the second copper layer includes a second base copper layer and a second copper plating layer stacked together, the second base copper layer being located between the second copper plating layer and the substrate.
[0017] In some embodiments, reinforcement is applied to the bonding area by rapid pressing, wherein the pressing temperature is 170℃-180℃, the pressing pressure is 20kg-30kg, the pressing time is 120s-200s, and the vacuuming time during the pressing process is 5s-10s.
[0018] Secondly, embodiments of this application provide an antenna flexible circuit board, which is manufactured by the antenna flexible circuit board manufacturing method described in the first aspect.
[0019] The antenna flexible circuit board manufacturing method provided in this application has the following advantages: Since the substrate includes a base material and a first copper layer and a second copper layer respectively disposed on opposite sides of the base material, and the antenna flexible circuit board is manufactured by first attaching a first cover film to the side of the first copper layer away from the base material, and then attaching a second cover film to the side of the second copper layer away from the base material, then attaching reinforcement in the bonding area, and finally attaching a shielding film covering the reinforcement to the side of the second cover film away from the second copper layer, the entire manufacturing process does not require the inner layer patterning and stacking pressure transfer process. Therefore, it can solve the problems of complex process flow, high difficulty and quality risk in the traditional antenna flexible circuit board manufacturing method.
[0020] The advantages of the flexible antenna circuit board provided in this application compared to the prior art, and the advantages of the flexible antenna circuit board manufacturing method provided in this application compared to the prior art, will not be repeated here. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a flowchart of a method for manufacturing a flexible antenna circuit board in one embodiment of this application;
[0023] Figure 2 (a) is a schematic diagram of the substrate structure in one embodiment of this application;
[0024] Figure 2 (b) in the middle is... Figure 2 The schematic diagram of the substrate after copper plating is shown in (a) in the figure.
[0025] Figure 2 (c) in the middle is... Figure 2 The schematic diagram of the substrate after the outer layer circuitry is fabricated, as shown in (b) of the diagram.
[0026] Figure 3 (a) in Figure 2 (c) shows a schematic diagram of the substrate structure after the first and second cover films are attached to the substrate.
[0027] Figure 3 (b) in the middle is... Figure 3 The schematic diagram of the substrate after solder resist treatment is shown in (a).
[0028] Figure 4(a) in Figure 3 (b) shows a schematic diagram of the structure of the substrate after reinforcement of the bonding area on the substrate.
[0029] Figure 4 (b) in the middle is Figure 4 The schematic diagram of the substrate structure after the shielding film is attached to the second cover film on the substrate shown in (a) is shown in the figure.
[0030] The markings in the diagram mean:
[0031] 10. Substrate; 11. Base material; 111. Bonding area; 12. First base copper layer; 13. Second base copper layer; 14. Via; 15. Conductive layer; 16. First copper plating layer; 17. Second copper plating layer; 18. Device pad; 19. Antenna PAD; 20. First cover film; 30. Second cover film; 40. Solder resist layer; 50. Reinforcement; 60. Reinforcing adhesive; 70. Shielding film. Detailed Implementation
[0032] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0033] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0035] In this specification, references to "one embodiment," "some embodiments," or simply "embodiment" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, in one or more embodiments, specific features, structures, or characteristics may be combined in any suitable manner.
[0036] To illustrate the technical solution of this application, the following description is provided in conjunction with specific accompanying drawings and embodiments.
[0037] Please refer to Figure 1 and Figure 2 In aspect (c), the first aspect of this application provides a method for manufacturing a flexible antenna circuit board, comprising:
[0038] S100: A substrate 10 is provided. The substrate 10 includes a base material 11 and a first copper layer and a second copper layer respectively disposed on opposite sides of the base material 11. A through hole 14 is provided on the substrate 10, penetrating the base material 11, the first copper layer and the second copper layer. A conductive layer 15 electrically connecting the first copper layer and the second copper layer is provided on the wall of the through hole 14. A first outer layer circuit is provided on the first copper layer. The first outer layer circuit includes a device pad 18 and an antenna PAD 19. A second outer layer circuit is provided on the second copper layer. The side of the base material 11 facing away from the first copper layer has a bonding area 111 opposite to the antenna PAD 19.
[0039] Specifically, the first copper layer may include a first base copper layer 12 and a first copper plating layer 16 stacked together, with the first base copper layer 12 located between the first copper plating layer 16 and the substrate 11; the second copper layer may include a second base copper layer 13 and a second copper plating layer 17 stacked together, with the second base copper layer 13 located between the second copper plating layer 17 and the substrate 11.
[0040] Please refer to this as well. Figure 2 (a) and Figure 2 In (b), substrate 10 can be fabricated in the following manner:
[0041] First, a base board is provided, which includes a substrate 11 and a first base copper layer 12 and a second base copper layer 13 respectively disposed on opposite sides of the substrate 11.
[0042] Secondly, through holes 14 are drilled on the original board, and the through holes 14 penetrate the substrate 11, the first base copper layer 12 and the second base copper layer 13.
[0043] Next, the original board is subjected to a black shadow and electroplating copper process, so that a first copper plating layer 16 is formed on the first base copper layer 12, a second copper plating layer 17 is formed on the second base copper layer 13, and a conductive layer 15 is formed on the hole wall of the via 14.
[0044] Finally, the outer layer circuitry is fabricated on the original board. Through the processes of film application, exposure, development, etching, and film removal, the first outer layer circuitry and the second outer layer circuitry are fabricated on the first copper layer and the second copper layer, respectively, to obtain the substrate 10.
[0045] Optionally, the original board can be made of double-sided high-frequency substrate.
[0046] S200: Please refer to this as well. Figure 3 (a) and Figure 3 In (b), a first cover film 20 is attached to the side of the first copper layer away from the substrate 11, and a second cover film 30 is attached to the side of the second copper layer away from the substrate 11. The first cover film 20 is provided with a first opening window that exposes the device pad 18 and a second opening window that exposes the antenna PAD 19. The second cover film 30 is provided with a third opening window that exposes the bonding area 111.
[0047] Specifically, the first cover film 20 and the second cover film 30 can be attached to the side of the first copper layer facing away from the substrate 11 and the side of the second copper layer facing away from the substrate 11, respectively, by means of lamination and rapid pressing.
[0048] S300: Please refer to this as well. Figure 4 In (a), reinforcement 50 is applied to the bonding area 111.
[0049] Specifically, an automatic reinforcing bonding machine can be used to attach a reinforcing 50 to the bonding area 111. The reinforcing 50 is bonded to the bonding area 111 with reinforcing adhesive 60. The reinforcing 50 needs to be designed according to the graphic design of the antenna PAD19. After attaching the reinforcing adhesive 60, the reinforcing 50 is punched into the required shape using a die-cutting method. Then, the automatic reinforcing bonding machine automatically attaches the reinforcing 50 to the bonding area 111. Finally, the reinforcing 50 is pressed and tightly attached to the bonding area 111 using a rapid pressing method.
[0050] Optionally, reinforcement 50 is applied to the bonding area 111 by rapid pressing. The pressing temperature is 170℃-180℃ (e.g., 170℃, 175℃, or 180℃), the pressing pressure is 20-30 kg (e.g., 20 kg, 25 kg, or 30 kg), the pressing time is 120s-200s (e.g., 120s, 160s, or 200s), and the vacuuming time during the pressing process is 5s-10s (e.g., 5s, 8s, or 10s). This allows for a tighter bond between reinforcement 50 and the bonding area 111.
[0051] Optionally, reinforcement 50 can be made of high-frequency materials such as LCP (Liquid crystal polymer) or PTFE (Polytetrafluoroethylene), and reinforcing adhesive 60 can be made of high-frequency pure adhesive.
[0052] S400: Please refer to this as well. Figure 4 In (b), a shielding film 70 is attached to the side of the second cover film 30 that is away from the second copper layer, and the shielding film 70 covers the reinforcement 50.
[0053] Specifically, a shielding film 70, pre-cut to the required shape, can be temporarily attached to the side of the second cover film 30 away from the second copper layer using a stacking fixture. Then, the shielding film 70 can be temporarily attached to the side of the second cover film 30 away from the second copper layer using a rapid pressing method. The shielding film 70 can be a shielding film 70 with a pure copper foil shielding layer, such as an EMI (Electromagnetic Interference) shielding film with a pure copper foil shielding layer, to improve the shielding effect and avoid antenna interference.
[0054] Understandably, the shielding film 70 can serve as a reference layer, enabling the processed substrate 10 to ultimately form a high-frequency antenna flexible circuit board product.
[0055] The antenna flexible circuit board manufacturing method provided in this application embodiment, since the substrate 10 includes a base material 11 and a first copper layer and a second copper layer respectively disposed on opposite sides of the base material 11, and the antenna flexible circuit board is manufactured by first attaching a first cover film 20 to the side of the first copper layer away from the base material 11, and then attaching a second cover film 30 to the side of the second copper layer away from the base material 11, then attaching a reinforcement 50 to the bonding area 111, and finally attaching a shielding film 70 covering the reinforcement 50 to the side of the second cover film 30 away from the second copper layer, the entire manufacturing process does not require the inner layer patterning and stacking pressure transfer process, so it can solve the problems of complex process flow, high difficulty and quality risk of traditional antenna flexible circuit board manufacturing methods.
[0056] The antenna flexible circuit board manufacturing method provided in this application embodiment can be used to manufacture high-frequency antenna flexible circuit boards, realize the function of multi-layer flexible circuit high-frequency antenna products, and eliminate the need for stacked board pressure transmission, inner layer circuit diagram and laser blind hole processes. The process flow is simple, and the multi-layer board manufacturing process is made into double-sided board manufacturing. Reinforcement 50 is applied to other layers for bonding processing, saving processing costs and making the quality more reliable and stable. At the same time, reinforcement 50 is only applied to the bonding area 111 corresponding to the antenna position, which improves material utilization and saves material costs, and can solve the problem of high material cost of high-frequency antenna multi-layer antenna flexible circuit boards.
[0057] Please refer to Figure 4In (b), since the area occupied by the device pad 18 is often small and the accuracy of opening the first opening window on the first cover film 20 is limited, in order to expose the device pad 18 more accurately and cover as much of the non-device pad 18 area on the side of the first copper layer away from the substrate 11 as possible, in some embodiments, after attaching the first cover film 20 to the side of the first copper layer away from the substrate 11 and attaching the second cover film 30 to the side of the second copper layer away from the substrate 11, and before attaching the reinforcement 50 to the bonding area 111, the antenna flexible circuit board manufacturing method further includes: performing solder resist treatment on the substrate 10 so that a solder resist layer 40 is formed on the side of the first copper layer away from the substrate 11, the solder resist layer 40 is located in the first opening window, and the solder resist layer 40 is provided with a fourth opening window that exposes the device pad 18.
[0058] By adopting the above scheme, the device pads 18 can be exposed more precisely using the fourth opening on the solder resist layer 40, and the non-device pad 18 area on the side of the first copper layer facing away from the substrate 11 can be covered as much as possible.
[0059] Optionally, the substrate 10 may be subjected to solder resist treatment, which may specifically include processes such as printing ink, pre-baking, exposure, development and curing.
[0060] Please refer to Figure 3 In (b) of some embodiments, an anti-oxidation layer is formed on both the device pad 18 and the antenna PAD 19 before the reinforcement 50 is attached to the bonding area 111.
[0061] By adopting the above solution, oxidation of the surface of the device pad 18 and the antenna PAD 19 can be prevented.
[0062] Optionally, an anti-oxidation layer is formed on both the device pad 18 and the antenna PAD 19. Specifically, this includes chemical nickel-gold treatment of the substrate 10, so that a nickel layer and a gold layer are deposited sequentially on both the device pad 18 and the antenna PAD 19.
[0063] The nickel layer has a thickness of 3um-6um, such as 3um, 3um, 4um, 5um, or 6um, while the gold layer has a thickness of 0.05um-0.10um, such as 0.05um, 0.05um, 0.07um, 0.08um, or 0.10um. This results in a better anti-oxidation effect of the anti-oxidation layer at a lower cost.
[0064] Please refer to Figure 4In (b) of some embodiments, the thickness of the second cover film 30 is greater than the thickness of the first cover film 20. This increases the dielectric thickness of the back reference layer of the device pad 18 and the antenna PAD 19, thereby increasing the dielectric thickness of the back reference layer of the transmission lines of the device pad 18 and the antenna PAD 19, and reducing transmission line losses.
[0065] Optionally, the first covering film 20 may be a thinner ordinary covering film, and the second covering film 30 may be a thicker high-frequency covering film.
[0066] It is understandable that the thickness of the second covering film 30 and the thickness of the first covering film 20 can be selected based on the loss requirements and actual simulation results.
[0067] In this embodiment, the thickness of the second cover film 30 is greater than 50um, such as 51um, 53um, 57um or 60um, and the thickness of the first cover film 20 is 25um-30um, such as 25um, 27um, 28um or 30um.
[0068] Secondly, embodiments of this application provide an antenna flexible circuit board, which is manufactured by the antenna flexible circuit board manufacturing method of the first aspect.
[0069] The flexible antenna circuit board provided in this application embodiment uses a substrate 10 that includes a base material 11 and a first copper layer and a second copper layer respectively disposed on opposite sides of the base material 11. The flexible antenna circuit board is manufactured by first attaching a first cover film 20 to the side of the first copper layer away from the base material 11, then attaching a second cover film 30 to the side of the second copper layer away from the base material 11, then attaching a reinforcement 50 to the bonding area 111, and finally attaching a shielding film 70 covering the reinforcement 50 to the side of the second cover film 30 away from the second copper layer. The entire manufacturing process does not require the inner layer patterning and stacking pressure transfer process, so the manufacturing process is simple, less difficult, and the quality of the flexible antenna circuit board is high.
[0070] The flexible circuit board for antennas provided in this application embodiment can be a flexible circuit board for high-frequency antennas.
[0071] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.
Claims
1. A method for manufacturing a flexible antenna circuit board, characterized in that, include: A substrate is provided, the substrate including a substrate and a first copper layer and a second copper layer respectively disposed on opposite sides of the substrate, the substrate having a through hole penetrating the substrate, the first copper layer and the second copper layer, a conductive layer electrically connecting the first copper layer and the second copper layer being disposed on the wall of the through hole, a first outer layer circuit being disposed on the first copper layer, the first outer layer circuit including a device pad and an antenna PAD, a second outer layer circuit being disposed on the second copper layer, and the side of the substrate opposite to the first copper layer having a bonding area opposite to the antenna PAD; A first cover film is attached to the side of the first copper layer facing away from the substrate, and a second cover film is attached to the side of the second copper layer facing away from the substrate. The first cover film has a first opening window that exposes the device pads and a second opening window that exposes the antenna PAD. The second cover film has a third opening window that exposes the bonding area. A reinforcement is applied to the bonding area, and the reinforcement is bonded to the bonding area with a reinforcing adhesive. The reinforcement is a high-frequency reinforcement, and the reinforcing adhesive is a high-frequency pure adhesive. A shielding film is attached to the side of the second cover film opposite to the second copper layer, and the shielding film covers the reinforcement.
2. The method for manufacturing a flexible antenna circuit board according to claim 1, characterized in that, After attaching a first cover film to the side of the first copper layer away from the substrate and attaching a second cover film to the side of the second copper layer away from the substrate, and before attaching reinforcement in the bonding area, the method for manufacturing the flexible antenna circuit board further includes: performing solder resist treatment on the substrate so that a solder resist layer is formed on the side of the first copper layer away from the substrate, the solder resist layer is located within a first opening window, and the solder resist layer is provided with a fourth opening window that exposes the device pads.
3. The method for manufacturing a flexible antenna circuit board according to claim 1, characterized in that, Before applying reinforcement to the bonding area, an anti-oxidation layer is formed on both the device pads and the antenna PAD.
4. The method for manufacturing a flexible antenna circuit board according to claim 3, characterized in that, An anti-oxidation layer is fabricated on both the device pads and the antenna PAD. Specifically, this involves performing a chemical nickel-gold treatment on the substrate, thereby depositing a nickel layer and a gold layer sequentially on both the device pads and the antenna PAD.
5. The method for manufacturing a flexible antenna circuit board according to claim 4, characterized in that, The thickness of the nickel layer is 3um-6um, and the thickness of the gold layer is 0.05um-0.10um.
6. The method for manufacturing a flexible antenna circuit board according to claim 1, characterized in that, The thickness of the second covering film is greater than the thickness of the first covering film.
7. The method for manufacturing a flexible antenna circuit board according to claim 6, characterized in that, The thickness of the second cover film is greater than 50 μm, and the thickness of the first cover film is 25 μm-30 μm.
8. The method for manufacturing a flexible antenna circuit board according to any one of claims 1 to 7, characterized in that, The first copper layer includes a first base copper layer and a first copper plating layer stacked together, with the first base copper layer located between the first copper plating layer and the substrate; the second copper layer includes a second base copper layer and a second copper plating layer stacked together, with the second base copper layer located between the second copper plating layer and the substrate.
9. The method for manufacturing a flexible antenna circuit board according to any one of claims 1 to 7, characterized in that, The bonding area is reinforced by rapid pressing, wherein the pressing temperature is 170℃-180℃, the pressing pressure is 20kg-30kg, the pressing time is 120s-200s, and the vacuuming time during the pressing process is 5s-10s.
10. A flexible antenna circuit board, characterized in that, The antenna flexible circuit board is manufactured by the antenna flexible circuit board manufacturing method as described in any one of claims 1 to 9.
Citation Information
Patent Citations
High density flexible line way board for camera that is fit for chip package
CN207753917U
Shielded flat cable
JP2011146150A