Complex surface polishing process and polishing apparatus

Abstract

This invention discloses a complex surface polishing process and polishing equipment, relating to the field of complex surface polishing processes. The polishing equipment includes a base, a pressurizing mechanism for applying pressure to the abrasive material for polishing, a polishing chamber located at the lower end of the pressurizing mechanism for placing the workpiece, and a chip-removing and stirring mechanism located at the bottom of the polishing chamber. This provides a dual function: stirring the abrasive material before polishing and removing chips during polishing. The complex surface polishing process and equipment of this invention, through the pressurizing mechanism (which uses a straight-up-down feeding method), combined with the weight of the abrasive material, ensures more uniform and comprehensive coverage of the abrasive material during the pre-polishing feeding process. A hydraulic cylinder drives a top pressure block to initially pressurize the material, filling the polishing chamber with abrasive material. Further pressurization is achieved through a booster mechanism, causing the abrasive material to flow at high speed, thus achieving polishing and offering better application prospects.

Description

Technical Field

[0001] This invention relates to the field of complex surface polishing processes, specifically complex surface polishing processes and polishing equipment. Background Technology

[0002] Polishing refers to a processing method that uses mechanical, chemical, or electrochemical actions to reduce the surface roughness of a workpiece in order to obtain a bright and smooth surface; it is a finishing process that uses polishing tools and abrasive particles or other polishing media to modify the surface of a workpiece.

[0003] For workpieces with regular shapes, an angle grinder is generally sufficient for polishing. For polishing the inner walls of pipes with small apertures, abrasive flow polishing is the preferred polishing process.

[0004] The grinding process for irregular or complex surface workpieces is not limited. Instead, it is based on the specific complexity of the workpiece surface and is gradually ground using an angle grinder. The grinding effect is not ideal and it is relatively labor-intensive. Abrasive flow is only suitable for tubular workpieces and the size of the workpieces must be small. The types of workpieces that can be ground are relatively limited.

[0005] For workpieces with high surface complexity, such as alloy workpieces with diamond-shaped grooves, angle grinders cannot be used directly for polishing. Abrasive flow technology can polish the inner wall of workpieces with small apertures, but it cannot polish the outer wall of the workpiece. Therefore, we propose that a polishing process and polishing equipment for complex surfaces are particularly necessary. Summary of the Invention

[0006] (a) Technical problems to be solved

[0007] To address the shortcomings of existing technologies, this invention provides a complex surface polishing process and polishing equipment, which has advantages such as complex surface polishing, pre-stirred feeding, circulating feeding, multi-dimensional workpiece fixation, and chip removal during grinding, and can effectively solve the problems in the background technology.

[0008] (II) Technical Solution

[0009] To achieve the above objectives, the technical solution adopted by the present invention is: a complex surface polishing process and polishing equipment, wherein the polishing equipment includes a base and further includes...

[0010] A pressure mechanism for applying pressure to abrasive materials to achieve polishing and grinding, so that the abrasive materials are evenly pressed onto the workpiece being ground;

[0011] The polishing chamber, located at the lower end of the pressurizing mechanism, is used to place the workpiece and serves as the main active chamber for polishing and grinding.

[0012] And the chip removal and stirring mechanism located at the bottom of the polishing chamber has the dual function of stirring the abrasive material before grinding and removing chips from the abrasive material during grinding.

[0013] The pressurizing mechanism includes a main pressurizing chamber, and a hydraulic cylinder for pressurizing is provided at the upper end of the pressurizing chamber.

[0014] Preferably, a fixing frame for fixing is provided between the hydraulic cylinder and the pressure chamber, and a top pressure block that fits the structure of the pressure chamber is provided at the mechanical output end of the hydraulic cylinder;

[0015] The pressurizing mechanism also includes a circulating feeding mechanism for circulating feeding and a pressurizing mechanism for secondary pressurization, and the main bodies of the circulating feeding mechanism and the pressurizing mechanism are both located at the upper end of the machine base.

[0016] Preferably, the circulating feeding mechanism includes its main fluid booster pump, and the mechanical input end of the fluid booster pump is provided with a feeding tray facing the lower end of the chip removal and stirring mechanism for receiving material. A feeding pipe for connection is provided between the feeding tray and the fluid booster pump, and a feeding pipe for feeding material is provided at the mechanical output end of the fluid booster pump.

[0017] The pressurization mechanism includes a main pressurization air pump, and the mechanical output end of the pressurization air pump is provided with a high-pressure air pipe connected to the pressurization chamber.

[0018] Preferably, the polishing chamber includes a main chamber body, and the interior of the chamber body is provided with a lockable slide chamber. The bottom end of the chamber body is provided with a conical bottom chamber for pressurization, and the slide chamber is equipped with a fixing component for fixing the workpiece. The fixing component is arranged in two sets symmetrically on the left and right sides of the slide chamber.

[0019] Preferably, the fixing assembly includes a clamping plate located inside the slide for clamping the workpiece, and a connecting rod for connecting the clamping plate. The connecting rod extends from one side of the slide into its interior and connects with the clamping plate, and a fastening rod for adjustment is provided at the end of the connecting rod away from the clamping plate.

[0020] Preferably, the fixing component also includes a fixing bracket located in the middle section of the outer surface of one side of the slide, and the middle section of the fixing bracket is provided with a fastening toothed sleeve for locking the fastening rod. The outer wall of the fastening toothed sleeve is provided with a fastening threaded sleeve for engaging and fastening. The end of the fastening rod away from the connecting rod is provided with a handwheel for easy operation by hand.

[0021] Preferably, the chip removal and stirring mechanism includes a main centrifugal stirring chamber, and the upper end of the centrifugal stirring chamber is provided with a chamber cover that is connected and communicates with the bottom end of the conical bottom chamber. A fixing buckle is provided between the chamber cover and the centrifugal stirring chamber for fixing. The centrifugal stirring chamber is provided with centrifugal blades for centrifugation and stirring, and the bottom end of the centrifugal blades is provided with a connecting shaft for connecting to the transmission.

[0022] Preferably, the bottom end of the centrifugal mixing chamber is concave spherical, and a centrifugal motor for driving the connecting shaft is provided at the bottom end of the centrifugal mixing chamber. A motor frame for fixing the centrifugal motor is provided between the centrifugal motor and the centrifugal mixing chamber.

[0023] Preferably, the middle section of the inner wall of the centrifugal mixing chamber is provided with an adsorption magnetic ring for adsorbing alloy debris, and the lower section of the inner wall of the centrifugal mixing chamber is provided with a magnetic ring support for supporting the adsorption magnetic ring. The lower end of the centrifugal mixing chamber is provided with a discharge port for discharging material.

[0024] The present invention also provides a polishing process for a complex surface polishing equipment, specifically including the following steps:

[0025] S100, Feeding and Infeeding: The operator starts the centrifugal motor, which drives the centrifugal blades to rotate at a low and uniform speed. Then, a semi-solid carrier with viscoelasticity, softness and cutting properties, along with a certain amount of abrasive, is put into the pressure chamber from the top. The grinding material then falls into the centrifugal mixing chamber through the chamber body and the conical bottom chamber to achieve preliminary mixing. The uniformly mixed grinding material falls into the feeding tray through the discharge port. After the workpiece is placed and fixed, the feeding is achieved through the fluid booster pump.

[0026] The weight ratio of the semi-solid carrier to the abrasive is 1:0.75, and the ratio can be adjusted according to the different grinding requirements of different workpieces.

[0027] S200. Workpiece fixing: Before the feeding process in the above steps, the workpiece must be placed and fixed. The operator first pulls open the slide chamber based on the chamber body using the fixing component, and then places the workpiece to be ground between the two clamps. Then, the two handwheels are used to control the two clamps to hold the workpiece and fix it in a suitable position. Then, the slide chamber is returned to the chamber body, and the fluid booster pump is started to feed the workpiece.

[0028] S300, Pressurization, Polishing: After the abrasive material is supplied, it is located inside the pressurization chamber, chamber body, and conical bottom chamber. The hydraulic cylinder is started, and the hydraulic cylinder uses the top pressure block to press the abrasive material evenly onto the workpiece until the top pressure block is located between the feed inlet and the air inlet. The booster air pump is started to pressurize the inside of the pressurization chamber, thereby polishing the workpiece.

[0029] S400, chip removal, and circulation: After grinding, the abrasive material enters the centrifugal mixing chamber through the conical bottom chamber and the chamber cover. At this time, the centrifugal motor drives the centrifugal blades to rotate at high speed to achieve centrifugal dispersion. The centrifuged abrasive material is dispersed to the inner wall of the adsorption magnetic ring, where the alloy debris is effectively adsorbed by the adsorption magnetic ring. The abrasive material then leaks out from the outlet to the feed tray to achieve recycling and feeding for the next batch of grinding.

[0030] (III) Beneficial Effects

[0031] Compared with the prior art, the present invention provides a complex surface polishing process and polishing equipment, which has the following beneficial effects:

[0032] 1. This complex surface polishing process and polishing equipment, through the setting of a pressurizing mechanism, the pressurizing mechanism is a straight up and down feeding mechanism. Combined with the self-weight of the abrasive, during the feeding process before polishing, the abrasive coverage is made more uniform and comprehensive. The hydraulic cylinder drives the top pressure block to initially pressurize, so that the abrasive fills the interior of the polishing chamber. The pressurizing mechanism further pressurizes, so that the abrasive flows at high speed to achieve polishing.

[0033] 2. This complex surface polishing process and polishing equipment uses a top pressure block with rounded corners on both sides of the bottom end. During the feeding process, the hydraulic cylinder drives the block to press down evenly. The abrasive material under pressure is dispersed to both sides of the bottom end of the top pressure block, rather than overflowing from the feed port after being pressed by the top pressure block, which would cause a loss of abrasive material and thus affect the subsequent polishing effect.

[0034] 3. This complex surface polishing process and polishing equipment, through the set circulating feeding mechanism, the feeding tray can receive the abrasive material that leaks from the pressurizing mechanism, polishing chamber and chip removal and stirring mechanism, and the abrasive material is fed in through the feeding pipe by the fluid booster pump to realize the systematic circulating grinding of this equipment, making the workpiece grinding process more automated and greatly saving manpower.

[0035] 4. This complex surface polishing process and equipment, through the setting of a conical bottom chamber, the internal space of the conical bottom chamber is coarser at the top and thinner at the bottom. During the polishing and grinding process of the workpiece, because the opening of the slide chamber is small, after being pressurized by the pressurizing mechanism located at the top of the chamber, the pressure of the abrasive inside the polishing chamber is relatively large. At the same time, the abrasive is ejected at high speed from the bottom of the conical bottom chamber, resulting in a faster flow rate of the abrasive inside the polishing chamber, achieving a better polishing effect.

[0036] 5. This complex surface polishing process and polishing equipment, through the setting of a fixing component, has a simple structure, a direct locking step, and is easy to operate. Controlled by a handwheel, the workpiece can be clamped and rotated to a suitable position via the connecting rod, so that the surface of the workpiece to be polished is maximally aligned with the flow direction of the abrasive, thereby maximizing the polishing efficiency of the equipment.

[0037] 6. This complex surface polishing process and polishing equipment, through the setting of clamps, the overall streamlined design of the clamps, because the clamps are located inside the polishing chamber, effectively avoids the clamps from bearing excessive grinding pressure of abrasive due to the large force surface, and indirectly extends the service life of the fixing components.

[0038] 7. This complex surface polishing process and polishing equipment, through the set chip removal and stirring mechanism, can be used as a pre-stirring of the abrasive material before the workpiece is ground and polished. In this state, the centrifugal motor drives the centrifugal blade to rotate at a low and uniform speed through the connecting shaft, so that the semi-solid carrier with viscoelasticity, softness and cutting properties is stirred more evenly with the abrasive, thus saving the manual mixing process and further improving the processing efficiency of the workpiece.

[0039] 8. This complex surface polishing process and polishing equipment, through the set chip removal and stirring mechanism, can be used as an intermediate process for the abrasive material during the workpiece grinding and polishing process. In this state, the centrifugal motor drives the centrifugal blade to rotate at high speed through the connecting shaft. After grinding and polishing, the alloy debris in the abrasive material can be efficiently separated from the abrasive material and dispersed to the inner wall of the adsorption magnetic ring by centrifugal force for adsorption, so as to achieve the effect of chip removal.

[0040] 9. This complex surface polishing process and equipment uses a semi-solid polymer abrasive as a carrier, which has a certain degree of elasticity to ensure the contact stress between the abrasive and the surface being processed; it has a high self-cohesion force to make the abrasive become a whole and not disperse; it has a small adhesion force so that it does not stick to the workpiece and is difficult to clean; the abrasive particles and the carrier can be well combined during the service life to avoid a large amount of dispersion and contamination of the workpiece, which would reduce efficiency and quality. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of the overall structure of the complex surface polishing process and polishing equipment of the present invention.

[0042] Figure 2 This is a second view of the overall structure of the complex surface polishing process and polishing equipment of the present invention.

[0043] Figure 3 This is a partial structural schematic diagram of the pressure mechanism for the complex surface polishing process and polishing equipment of the present invention.

[0044] Figure 4 This is a schematic diagram of the circulating feeding mechanism and the pressurizing mechanism in the pressurizing mechanism of the complex surface polishing process and polishing equipment of the present invention.

[0045] Figure 5 This is a schematic diagram of the structure of the polishing chamber for the complex surface polishing process and polishing equipment of the present invention.

[0046] Figure 6 This is a partial structural diagram of the fixing component in the polishing chamber of the complex surface polishing process and polishing equipment of the present invention.

[0047] Figure 7 This is a diagram showing the locking state of the fixing components in the polishing chamber of the complex surface polishing process and polishing equipment of the present invention.

[0048] Figure 8 This is a structural cross-sectional diagram of the chip removal and stirring mechanism used in the complex surface polishing process and polishing equipment of this invention.

[0049] Figure 9 This is a diagram showing the air intake pressurization state of the pressurization mechanism for the complex surface polishing process and polishing equipment of the present invention.

[0050] Figure 10 This is a schematic diagram of the structure of the clamping plate in the polishing chamber of the complex surface polishing process and polishing equipment of the present invention.

[0051] In the picture:

[0052] 1. Base; 2. Pressurization mechanism; 3. Polishing chamber; 4. Chip removal and stirring mechanism;

[0053] 21. Pressure chamber; 22. Hydraulic cylinder; 23. Fixing frame; 24. Top pressure block; 25. Circulating feeding mechanism; 26. Pressurization mechanism;

[0054] 251. Fluid booster pump; 252. Feed tray; 253. Feed pipe; 254. Feeding pipe;

[0055] 261. Booster air pump; 262. High-pressure air hose;

[0056] 31. Silo body; 32. Sump; 33. Conical bottom silo; 34. Fixed components;

[0057] 341. Clamping plate; 342. Connecting rod; 343. Fixing bracket; 344. Fastening nut; 345. Fastening toothed sleeve; 346. Fastening rod; 347. Handwheel;

[0058] 41. Centrifugal mixing chamber; 42. Chamber cover; 43. Fixing buckle; 44. Adsorption magnetic ring; 45. Centrifugal motor; 46. Motor frame; 47. Connecting shaft; 48. Magnetic ring placement rack; 49. Centrifugal blade; 50. Discharge port. Detailed Implementation

[0059] To make the technical means, creative features, and achieved objectives and effects of this invention readily understandable, the invention will be further described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are merely some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention. Specific Implementation Example 1

[0061] To address the shortcomings of existing technologies, such as Figure 1 , 2As shown, the present invention provides a complex surface polishing device, the main body of which and a partial structure of the pressurizing mechanism 2 are fixedly connected to the upper end of the base 1, and the lower end of the main body of the pressurizing mechanism 2 is fixedly connected to the upper end of the main body of the polishing chamber 3. The lower end of the main body of the polishing chamber 3 is fixedly connected to and communicates with the upper end of the chip removal and stirring mechanism 4. A support frame for support is provided between the polishing chamber 3 and the base 1, and the lower end of the main body of the polishing chamber 3 is fixedly connected to the upper outer surface of the base 1 through the support frame.

[0062] It should be noted that the present invention also provides a polishing process for a complex surface polishing device, specifically including the following steps:

[0063] S100, Feeding: The operator starts the centrifugal motor 45, which drives the centrifugal blade 49 to rotate at a low and uniform speed. Then, a semi-solid carrier with viscoelasticity, softness and cutting properties and a certain amount of abrasive are put into the pressure chamber 21 from the top. The grinding material is then put into the centrifugal mixing chamber 41 through the chamber body 31 and the conical bottom chamber 33 to achieve preliminary mixing. The uniformly mixed grinding material falls into the feeding tray 252 through the discharge port 50. After the workpiece is placed and fixed, the feeding is achieved by the fluid booster pump 251.

[0064] The weight ratio of the semi-solid carrier to the abrasive is 1:0.75, and the ratio can be adjusted according to the different grinding requirements of different workpieces.

[0065] S200, workpiece fixing: Before the feeding process in the above steps, the workpiece must be placed and fixed. The operator first pulls open the slide 32 based on the chamber 31 using the fixing component 34, and then places the workpiece to be ground between the two clamping plates 341. Then, the two handwheels 347 are used to control the two clamping plates 341 to clamp the workpiece and fix it in a suitable position. Then, the slide 32 is returned to the chamber 31, and the fluid booster pump 251 is started to feed the workpiece.

[0066] S300, Pressurization and Polishing: After the abrasive material is supplied, it is located inside the pressurization chamber 21, the chamber body 31, and the conical bottom chamber 33. The hydraulic cylinder 22 is started, and the hydraulic cylinder 22 uses the top pressure block 24 to press the abrasive material evenly onto the workpiece until the top pressure block 24 is located between the feed port and the air inlet. The booster air pump 261 is started to pressurize the inside of the pressurization chamber 21, thereby polishing the workpiece.

[0067] S400, chip removal, circulation: The grinding material after grinding enters the centrifugal mixing chamber 41 through the conical bottom chamber 33 and the chamber cover 42. At this time, the centrifugal motor 45 drives the centrifugal blade 49 to rotate at high speed to achieve centrifugal dispersion. The grinding material after centrifugation is dispersed to the inner wall of the adsorption magnetic ring 44. The alloy debris inside is effectively adsorbed by the adsorption magnetic ring 44. The grinding material then leaks out from the discharge port 50 to the feed tray 252 to achieve recycling and feeding for the next batch of grinding.

[0068] Specifically, such as Figure 3 , 4 As shown, the pressure mechanism 2 used in the complex surface polishing equipment has a fixed frame 23 with an "n"-shaped structure in frontal view. The lower ends of the two sides of the fixed frame 23 are respectively fixedly connected to the left and right sides of the upper end of the pressure chamber 21. The upper end of the main body of the hydraulic cylinder 22 is fixedly connected to the lower end of the middle section of the fixed frame 23, and the top pressure block 24 is fixedly connected to the mechanical output end of the hydraulic cylinder 22.

[0069] The lower ends of the fluid booster pump 251 and the booster air pump 261 are both fixedly connected to the upper outer surface of the base 1, and one end of the high-pressure air pipe 262 is fixedly connected to the mechanical output end of the booster air pump 261, and the other end of the high-pressure air pipe 262 is fixedly connected to the air inlet on the pressurization chamber 21.

[0070] The horizontal section of the feed pipe 253 is fixedly connected to the mechanical input end of the fluid booster pump 251, and the vertical section of the feed pipe 253 is fixedly connected to the bottom end of the feed tray 252. One end of the feed pipe 254 is fixedly connected to the mechanical output end of the fluid booster pump 251, and the other end of the feed pipe 254 is fixedly connected to the feed inlet on the pressurization chamber 21.

[0071] It should be noted that the present invention is a complex surface polishing device. Before polishing a complex surface workpiece, the operator first puts a semi-solid carrier with viscoelasticity, softness and cutting properties and a certain amount of abrasive into the chip removal and stirring mechanism 4 through the pressure mechanism 2 and the polishing chamber 3 to form abrasive material. Then the workpiece to be polished is placed inside the polishing chamber 3 for fixation.

[0072] The well-mixed grinding material falls into the feed tray 252 and enters the fluid booster pump 251 through the feed pipe 253. Simultaneously, the fluid booster pump 251 is activated, driving the grinding material through the feed pipe 254 and into the pressure chamber 21 via the feed inlet.

[0073] After the abrasive material is fed into the pressure chamber 21 through the feed pipe 254 and inlet, the hydraulic cylinder 22 is activated. The hydraulic cylinder 22 drives the top pressure block 24 to continuously press down, causing the abrasive material to fill the interior of the polishing chamber 3. At this time, the top pressure block 24 is located below the feed inlet. Figure 9 As shown in the status, the booster air pump 261 is started, and the booster air pump 261 pressurizes the interior of the pressurization chamber 21 through the high-pressure air pipe 262;

[0074] Under the pressurized state inside the pressurized chamber 21, the abrasive material flows under high pressure inside the polishing chamber 3, thereby achieving surface polishing of the workpiece.

[0075] Among them, the pressurizing mechanism 2 is a straight up and down feeding method. Combined with the weight of the abrasive, it makes the abrasive coverage more uniform and comprehensive during the pre-polishing feeding process. The hydraulic cylinder 22 drives the top pressure block 24 to initially pressurize, so that the abrasive fills the interior of the polishing chamber 3. The pressurizing mechanism 26 further pressurizes the abrasive to make it flow at high speed and achieve polishing.

[0076] Using a semi-solid polymer abrasive as a carrier, it has a certain degree of elasticity to ensure the contact stress between the abrasive and the machined surface; it has a high self-cohesion and fusion force to make the abrasive become a whole and not disperse; it has a small adhesion force to prevent it from sticking to the workpiece and being difficult to clean; the abrasive particles and the carrier can be well combined during the service life to avoid a large amount of dispersion and contamination of the workpiece, which would reduce efficiency and quality.

[0077] The bottom sides of the top pressure block 24 are rounded. During the feeding process, the hydraulic cylinder 22 drives it to press down evenly. The abrasive material after being pressed is dispersed to the bottom sides of the top pressure block 24, rather than being lost due to overflow from the feed port after being pressed by the top pressure block 24, which would affect the subsequent grinding effect.

[0078] The feed tray 252 can receive the abrasive material leaking from the pressurizing mechanism 2, polishing chamber 3, and chip removal and stirring mechanism 4, and feed the abrasive material through the feed pipe 254 via the fluid booster pump 251 to achieve systematic cyclic grinding of the equipment, making the workpiece grinding process more automated and greatly saving manpower.

[0079] Specifically, and such as Figure 5 As shown, the polishing chamber 3 used in the complex surface polishing equipment has its upper end of chamber body 31 fixedly connected to the lower end of pressure chamber 21, sliding chamber 32 slidably connected to and locked to the inner wall of chamber body 31, and the upper end of conical bottom chamber 33 fixedly connected to the lower end of chamber body 31.

[0080] Furthermore, and such Figures 5-7 As shown, in the polishing chamber 3 of the complex surface polishing equipment, the fixed component 34 and the fixed bracket 343 are respectively welded to the left and right sides of the middle section of the outer surface of the slide chamber 32, and the fastening tooth sleeve 345 is welded to the middle section of the fixed bracket 343, and the fastening screw sleeve 344 is threaded to the outer wall of the fastening tooth sleeve 345.

[0081] The clamping plate 341 is welded to one end of the connecting rod 342, and the other end of the connecting rod 342 is welded to one end of the fastening rod 346. The other end of the fastening rod 346 is welded to the handwheel 347. The fastening toothed sleeve 345 is fitted onto the outer wall of the fastening rod 346 and fits its structure. The connecting rod 342 passes through one side of the slide chamber 32 and is slidably connected to it.

[0082] It should be noted that this invention is a complex surface polishing device. Before polishing a complex surface workpiece, the workpiece must be fixed by the polishing chamber 3.

[0083] During the process of fixing the workpiece, the operator first pulls the slide 32 out from the inside of the chamber 31, and then fixes the workpiece inside the slide 32 through the fixing component 34.

[0084] During the process of fixing the workpiece, the operator places the workpiece between the two clamping plates 341. Previously, the two fastening screw sleeves 344 should be in a loose state and the two fastening toothed sleeves 345 have not been locked. The operator can move the two fastening rods 346 respectively through the handwheel 347. The two fastening rods 346 then drive the two connecting rods 342 to slide relative to each other on the slide 32 until the two clamping plates 341 are both in contact with the two sides of the workpiece.

[0085] The operator then rotates two handwheels 347 to adjust the workpiece's placement angle to optimize the polishing angle based on the abrasive's flow direction. Once the workpiece angle is adjusted, the operator rotates two fastening sleeves 344. During rotation, the two fastening toothed sleeves 345 tighten relative to each other, and their locking teeth engage with the outer walls of the two fastening rods 346. Figure 7 In this state, the fastening rod 346 can be locked, thus fixing the workpiece.

[0086] The conical bottom chamber 33 has a coarser upper section and a narrower lower section. During the polishing process, due to the smaller opening of the slide chamber 32, the pressure of the abrasive material inside the polishing chamber 3 is greater after being pressurized by the pressurizing mechanism 2 located at the upper end of the chamber body 31. At the same time, the abrasive material is ejected at high speed from the bottom of the conical bottom chamber 33, resulting in a faster flow rate of the abrasive material inside the polishing chamber 3, thus achieving a better polishing effect.

[0087] The fixed component 34 has a simple structure, a direct locking step, and is easy to operate. It can be controlled by the handwheel 347 and the connecting rod 342 can be used to clamp and rotate the workpiece to a suitable position so that the surface of the workpiece to be polished is in maximum alignment with the flow direction of the abrasive material, thereby maximizing the polishing efficiency of the equipment.

[0088] The clamping plate 341 has a streamlined design. Since the clamping plate 341 is located inside the polishing chamber 3, it effectively avoids the clamping plate 341 from bearing excessive grinding pressure of the abrasive due to its large force-bearing surface, thereby indirectly extending the service life of the fixing component 34.

[0089] Specifically, and such as Figure 8 As shown, the chip removal and stirring mechanism 4 is used in complex surface polishing equipment.

[0090] It should be noted that the present invention is a complex surface polishing equipment. The chip removal and stirring mechanism 4 is used for stirring the abrasive material before polishing. During the stirring of the abrasive material, the operator directly puts a semi-solid carrier with viscoelasticity, softness and cutting properties and a certain amount of abrasive into the upper end of the pressure chamber 21. At this time, the workpiece to be polished is not placed inside the slide chamber 32. The abrasive material material falls directly into the centrifugal stirring chamber 41 through the pressure chamber 21, the chamber body 31 and the conical bottom chamber 33 located at its lower end.

[0091] After the abrasive material has completely fallen into the centrifugal mixing chamber 41, the centrifugal motor 45 is started. The centrifugal motor 45 drives the centrifugal blade 49 to rotate at a low and uniform speed inside the centrifugal mixing chamber 41 through the connecting shaft 47, so as to achieve the mixing of the abrasive. The mixed abrasive falls into the feed tray 252 at the same time for subsequent polishing feeding.

[0092] Among them, the chip removal and stirring mechanism 4 can be used as a pre-stirring of the abrasive material before grinding and polishing the workpiece. In this state, the centrifugal motor 45 drives the centrifugal blade 49 to rotate at a low and uniform speed through the connecting shaft 47, so that the semi-solid carrier with viscoelasticity, softness and cutting properties is stirred more evenly with the abrasive, thereby saving the manual mixing process and further improving the processing efficiency of the workpiece. Specific Implementation Example 2

[0094] This embodiment is proposed for use in cyclic grinding after the abrasive material has been removed during polishing and grinding. It further improves the structure of the chip-removing and stirring mechanism 4 in Embodiment 1:

[0095] Specifically, for example Figure 8 As shown, the chip removal and stirring mechanism 4 used in complex surface polishing equipment has one side of the bin cover 42 rotatably connected to one side of the upper end of the centrifugal stirring bin 41, and the side of the bin cover 42 away from the centrifugal stirring bin 41 and its connection point is fixedly connected to the centrifugal stirring bin 41 by a fixing buckle 43. The magnetic ring placement rack 48 is opened from the lower section of the inner wall of the centrifugal stirring bin 41, and the adsorption magnetic ring 44 is placed at the upper end of the magnetic ring placement rack 48.

[0096] The centrifugal motor 45 is fixedly connected to the bottom of the centrifugal mixing chamber 41 via two motor frames 46, and the mechanical output end of the centrifugal motor 45 is fixedly connected to the lower end of the connecting shaft 47. The connecting shaft 47 passes through the bottom of the centrifugal mixing chamber 41 and is rotatably connected to it. The upper end of the connecting shaft 47 is detachably connected to the centrifugal blade 49.

[0097] It should be noted that the present invention is a complex surface polishing device. Through the chip removal and stirring mechanism 4, during the polishing process, the abrasive material after the previous complete polishing contains alloy debris. In order to effectively remove the alloy debris in the abrasive material to avoid affecting the polishing effect in the subsequent cycle polishing process.

[0098] The operator starts the centrifugal motor 45, which drives the centrifugal blade 49 to rotate at high speed inside the centrifugal mixing chamber 41 through the connecting shaft 47, so as to centrifuge and disperse the grinding material. After high-speed centrifugation, the alloy debris in the grinding material is effectively separated from it and dispersed on the inner wall of the adsorption magnetic ring 44 in the middle section of the centrifugal mixing chamber 41. The alloy debris is effectively adsorbed by the adsorption magnetic ring 44, and the grinding material falls straight down through the discharge port 50.

[0099] After the grinding and polishing are completed, the magnetic adsorption ring 44 needs to be cleaned in order to prepare for the subsequent polishing and grinding of the workpiece. The operator opens the fixing buckle 43 and then opens the chamber cover 42 relative to the centrifugal mixing chamber 41. At this time, the magnetic adsorption ring 44 can be removed from the magnetic ring placement rack 48 for cleaning.

[0100] Among them, the chip removal and stirring mechanism 4 can be used as an intermediate process for the abrasive material during the workpiece grinding and polishing process. In this state, the centrifugal motor 45 drives the centrifugal blade 49 to rotate at high speed through the connecting shaft 47. After grinding and polishing, the alloy chips in the abrasive material can be efficiently separated from the abrasive material and dispersed to the inner wall of the adsorption magnetic ring 44 by centrifugal force for adsorption, so as to achieve the effect of chip removal.

[0101] The chip removal and stirring mechanism 4 has a simple structure, reasonable design, and is easy to disassemble and assemble. It has the dual function of stirring and chip removal, further improving the performance of the polishing equipment.

[0102] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A complex surface polishing device, wherein the polishing device includes a base (1), characterized in that: Also includes The pressure mechanism (2) used for applying pressure abrasive to achieve polishing and grinding makes the abrasive uniformly pressed onto the workpiece being ground; The polishing chamber (3) located at the lower end of the pressurizing mechanism (2) is used to place the workpiece and serves as the main active chamber for polishing and grinding. And the chip removal and stirring mechanism (4) located at the bottom of the polishing chamber (3) has the dual function of stirring the abrasive material before grinding and removing chips from the abrasive material during grinding. The pressurizing mechanism (2) includes its main pressurizing chamber (21), and a hydraulic cylinder (22) for pressurizing is provided at the upper end of the pressurizing chamber (21). A fixing frame (23) for fixing is provided between the hydraulic cylinder (22) and the pressure chamber (21), and a top pressure block (24) that fits the structure of the pressure chamber (21) is provided at the mechanical output end of the hydraulic cylinder (22). The pressurizing mechanism (2) also includes a circulating feeding mechanism (25) for circulating feeding and a pressurizing mechanism (26) for secondary pressurization, and the main bodies of the circulating feeding mechanism (25) and the pressurizing mechanism (26) are both located at the upper end of the machine base (1); The circulating feeding mechanism (25) includes its main fluid booster pump (251), and the mechanical input end of the fluid booster pump (251) is provided with a feeding tray (252) facing the lower end of the chip removal and stirring mechanism (4) for receiving materials. A feeding pipe (253) for connection is provided between the feeding tray (252) and the fluid booster pump (251), and a feeding pipe (254) for feeding materials is provided at the mechanical output end of the fluid booster pump (251). The pressurization mechanism (26) includes its main pressurization air pump (261), and the mechanical output end of the pressurization air pump (261) is provided with a high-pressure air pipe (262) connected to the pressurization chamber (21). The polishing chamber (3) includes its main chamber body (31), and the chamber body (31) is provided with a lockable slide chamber (32). The bottom end of the chamber body (31) is provided with a conical bottom chamber (33) for pressurization. The slide chamber (32) is equipped with a fixing component (34) for fixing the workpiece. The fixing component (34) is arranged in two sets symmetrically on the left and right sides of the slide chamber (32).

2. The complex surface polishing equipment according to claim 1, characterized in that: The fixing assembly (34) includes a clamping plate (341) for clamping the workpiece located inside the slide (32), and a connecting rod (342) for connecting the clamping plate (341). The connecting rod (342) extends from one side of the slide (32) into its interior and is connected to the clamping plate (341). A fastening rod (346) for adjustment is provided at one end of the connecting rod (342) away from the clamping plate (341).

3. The complex surface polishing equipment according to claim 2, characterized in that: The fixing component (34) also includes a fixing bracket (343) located in the middle section of the outer surface of one side of the slide (32), and the middle section of the fixing bracket (343) is provided with a fastening toothed sleeve (345) for locking the fastening rod (346). The outer wall of the fastening toothed sleeve (345) is provided with a fastening threaded sleeve (344) for fastening. The end of the fastening rod (346) away from the connecting rod (342) is provided with a handwheel (347) for easy operation by hand.

4. The complex surface polishing equipment according to claim 3, characterized in that: The chip removal and stirring mechanism (4) includes its main centrifugal stirring chamber (41), and the upper end of the centrifugal stirring chamber (41) is provided with a chamber cover (42) that is connected to and communicates with the bottom end of the conical bottom chamber (33). A fixing buckle (43) for fixing is provided between the chamber cover (42) and the centrifugal stirring chamber (41). The centrifugal stirring chamber (41) is provided with a centrifugal blade (49) for centrifugation and stirring, and the bottom end of the centrifugal blade (49) is provided with a connecting shaft (47) for connecting the transmission.

5. The complex surface polishing equipment according to claim 4, characterized in that: The bottom end of the centrifugal mixing chamber (41) is concave spherical, and a centrifugal motor (45) for driving the connecting shaft (47) is provided at the bottom end of the centrifugal mixing chamber (41). A motor frame (46) for fixing is provided between the centrifugal motor (45) and the centrifugal mixing chamber (41).

6. The complex surface polishing equipment according to claim 5, characterized in that: The centrifugal mixing chamber (41) has an adsorption magnetic ring (44) for adsorbing alloy debris in the middle section of its inner wall, and a magnetic ring holder (48) for supporting the adsorption magnetic ring (44) in the lower section of its inner wall. The centrifugal mixing chamber (41) has a discharge port (50) for discharging material at its lower end.

7. A polishing process for the complex surface polishing equipment of claim 6, characterized in that: Specifically, the steps include the following: S100, Feeding and Feeding: The operator starts the centrifugal motor (45), which drives the centrifugal blade (49) to rotate at a low and uniform speed. Then, a semi-solid carrier with viscoelasticity, softness and cutting properties and a certain amount of abrasive are put into the upper end of the pressure chamber (21). The grinding material is then put into the centrifugal mixing chamber (41) through the chamber body (31) and the conical bottom chamber (33) to achieve preliminary mixing. The uniformly mixed grinding material falls into the feeding tray (252) through the discharge port (50). After the workpiece is placed and fixed, the feeding is achieved by the fluid booster pump (251). The weight ratio of the semi-solid carrier to the abrasive is 1:0.75, and the ratio can be adjusted according to the different grinding requirements of different workpieces. S200, workpiece fixing: Before the feeding process in the above steps, the workpiece must be placed and fixed. The operator first uses the fixing component (34) to pull open the slide (32) based on the chamber body (31), and then places the workpiece to be ground between the two clamps (341). Then, the two handwheels (347) are used to control the two clamps (341) to clamp the workpiece and fix the workpiece in a suitable position. Then, the slide (32) is returned to the chamber body (31), and the fluid booster pump (251) is started to feed the workpiece. S300, pressurization, polishing: After the abrasive material is supplied, the abrasive material is located inside the pressurization chamber (21), the chamber body (31), and the conical bottom chamber (33). Start the hydraulic cylinder (22). The hydraulic cylinder (22) presses the abrasive material evenly onto the workpiece through the top pressure block (24) until the top pressure block (24) is located between the feed port and the air inlet. Start the booster air pump (261) to pressurize the inside of the pressurization chamber (21) and then polish the workpiece. S400, chip removal, circulation: The grinding material after grinding enters the interior of the centrifugal mixing chamber (41) through the conical bottom chamber (33) and the chamber cover (42). At this time, the centrifugal motor (45) drives the centrifugal blade (49) to rotate at high speed to achieve centrifugal dispersion. The grinding material after centrifugation is dispersed to the inner wall of the adsorption magnetic ring (44). The alloy debris inside is effectively adsorbed by the adsorption magnetic ring (44). The grinding material then leaks out from the discharge port (50) to the feed tray (252) to achieve circulating feeding so as to carry out the next batch of grinding.

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