Apparatus for transferring electronic components from a flexible carrier substrate to a flexible target substrate and method of transferring electronic components

Abstract

This invention provides an apparatus for transferring an electronic component from a flexible carrier substrate to a flexible target substrate. The apparatus includes a first frame, a second frame, a stop assembly, and a deformation generating mechanism. The first frame supports the flexible carrier substrate. The second frame supports the flexible target substrate. The stop assembly is disposed adjacent to the first frame and controlled by a braking mechanism, allowing it to move repeatedly toward and away from the second frame. The deformation generating mechanism is adjacent to the second frame and disposed opposite to the stop assembly. When the stop assembly moves toward the second frame, the deformation generating mechanism generates a relative force toward the stop assembly at a position on the surface of the flexible target substrate supported by the second frame relative to the stop assembly.

Description

Technical Field

[0001] The present invention relates to an apparatus and a method for transferring an electronic component from a flexible carrier substrate to a flexible target substrate. Background Technology

[0002] In the manufacturing process of electronic products, there are often steps involving the transfer of electronic components. For example, in the manufacturing process of LED displays, LEDs are often transferred from one flexible substrate to another using a pick-and-place apparatus. However, the throughput or yield of this method may be relatively low. Summary of the Invention

[0003] This invention relates to an apparatus and a method for transferring electronic components from a self-flexible carrier substrate to a flexible target substrate.

[0004] According to an embodiment of the present invention, an apparatus for transferring an electronic component from a flexible carrier substrate to a flexible target substrate includes a first frame, a second frame, a stop assembly, and a deformation generating mechanism. The first frame supports the flexible carrier substrate. The second frame supports the flexible target substrate. The stop assembly is disposed adjacent to the first frame and controlled by a braking mechanism, allowing it to move repeatedly toward and away from the second frame. The deformation generating mechanism is disposed adjacent to the second frame and opposite to the stop assembly, and when the stop assembly moves toward the second frame, it generates a relative force toward the stop assembly at a position on the surface of the flexible target substrate supported by the second frame relative to the stop assembly.

[0005] According to an embodiment of the present invention, a method for transferring an electronic component includes the following steps: providing a flexible carrier substrate on which an electronic component is mounted; providing a flexible target substrate; arranging the flexible carrier substrate and the flexible target substrate opposite to each other, with the side of the flexible carrier substrate carrying the electronic component facing the flexible target substrate; applying a force to the side of the flexible carrier substrate not carrying the electronic component to move the electronic component toward the flexible target substrate; applying a relative force to the flexible target substrate to deform it, thereby defining a receiving point on the flexible target substrate and moving the peripheral area of ​​the flexible target substrate away from the electronic component at the receiving point; contacting and transferring the electronic component to the receiving point; and stopping the application of the force and the relative force to allow the flexible carrier substrate and the flexible target substrate to return to their original state.

[0006] Based on the above, the apparatus and method of the present invention are suitable for transferring the self-flexible carrier substrate of electronic components to the flexible target substrate. Attached Figure Description

[0007] Figure 1A This is a partial side view schematic diagram of an apparatus for transferring an electronic component self-flexible carrier substrate to a flexible target substrate according to a first embodiment of the present invention.

[0008] Figures 1B to 1D This is a partial side view schematic diagram of a portion of the operation mode of an apparatus for transferring an electronic component self-flexible carrier substrate to a flexible target substrate according to a first embodiment of the present invention.

[0009] Figure 1E This is a partial bottom view schematic diagram of a device for transferring an electronic component from a flexible carrier substrate to a flexible target substrate according to an embodiment of the present invention.

[0010] Figure 2A This is a partial side view schematic diagram of an apparatus for transferring an electronic component self-flexible carrier substrate to a flexible target substrate according to a second embodiment of the present invention.

[0011] Figures 2B to 2D This is a partial side view schematic diagram of a portion of the operation mode of an apparatus for transferring an electronic component self-flexible carrier substrate to a flexible target substrate according to a second embodiment of the present invention.

[0012] Figure 3A This is a partial side view schematic diagram of an apparatus for transferring an electronic component self-flexible carrier substrate to a flexible target substrate according to a third embodiment of the present invention.

[0013] Figures 3B to 3D This is a partial side view schematic diagram of a portion of the operation mode of an apparatus for transferring an electronic component self-flexible carrier substrate to a flexible target substrate according to a third embodiment of the present invention.

[0014] Explanation of reference numerals in the attached figures

[0015] 100, 200, 300: Device;

[0016] 111: Top and bottom components;

[0017] 111b: Bearing top abutment surface;

[0018] 112: Braking mechanism;

[0019] 120, 220, 320: Deformation generating mechanism;

[0020] 121: Needle plug;

[0021] 121b: Target top contact surface;

[0022] 122: Braking mechanism;

[0023] 130: Flexible bearing substrate;

[0024] 130a, 130b: Load-bearing surfaces;

[0025] 140: Flexible target substrate;

[0026] 140a, 140b: Target surfaces;

[0027] 150, 260, 360: Shell;

[0028] 151, 261: air chambers;

[0029] 152, 262: Gas channels;

[0030] 153, 263: Gas openings;

[0031] 154, 264: Top and bottom openings;

[0032] 171: First Frame;

[0033] 181: Second Frame;

[0034] 172, 182: Carrier frame;

[0035] 174, 284: Gas pipelines;

[0036] 175, 285: Negative pressure generating device;

[0037] 190: Control system;

[0038] 191: Signal line;

[0039] 365: Protrusion;

[0040] 810, 811, 812, 813: Electronic components;

[0041] D1: First direction;

[0042] D2: Second direction;

[0043] R1, R2, R3, R4, R5, R6: Regions. Detailed Implementation

[0044] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0045] The following embodiments are for illustrative purposes only and not for limitation. Furthermore, descriptions of well-known apparatus, methods, and materials may be omitted to avoid obscuring the various principles of the invention. Directional terms used herein (e.g., up, down, top, bottom) are used only with reference to the accompanying drawings or corresponding conventional terms and are not intended to imply absolute orientation. Additionally, unless explicitly indicated by the content, the singular forms “a,” “an,” “the,” or forms that do not specifically indicate quantity may include one or more forms, i.e., including “at least one.”

[0046] In some of the accompanying drawings, for clarity, some components or membranes may be shown enlarged, reduced, or omitted. For example, in... Figure 1A , Figure 2A or Figure 3A In the image, the electronic component 810 may be shown in magnified form, and / or the thickness of the flexible carrier substrate 130 or the flexible target substrate 140 may be shown in magnified form.

[0047] Similar components are designated by the same reference numerals and have similar functions, materials, or forms, and descriptions are omitted. It will be apparent to those skilled in the art that the invention can be practiced in other embodiments, departing from the specific details disclosed herein, by way of the description of the embodiments and the corresponding illustrations.

[0048] Figure 1A This is a partial side view schematic diagram of an apparatus for transferring an electronic component self-flexible carrier substrate to a flexible target substrate according to a first embodiment of the present invention. Figures 1B to 1D This is a partial side view schematic diagram of a portion of the operation mode of an apparatus for transferring an electronic component self-flexible carrier substrate to a flexible target substrate according to a first embodiment of the present invention. Figure 1E This is a partial bottom view schematic diagram of a portion of the operation mode of an apparatus for transferring an electronic component from a flexible carrier substrate to a flexible target substrate according to an embodiment of the present invention. For example, Figure 1B or Figure 1C It can correspond to Figure 1A A magnified view of part of the central region R1. Figure 1D It can correspond to Figure 1C A magnified view of a portion of region R2. In one embodiment, Figure 1E It can correspond to Figure 1C A bottom view diagram.

[0049] Please refer to Figure 1AAn electronic component transfer apparatus (referred to simply as the apparatus) 100 is adapted to transfer an electronic component 810 from a flexible support substrate 130 to a flexible target substrate 140 (details below). The electronic component transfer apparatus 100 includes a first frame 171, a second frame 181, abutting assembly 111, and a deformation generating mechanism 120. The first frame 171 supports the flexible support substrate 130. The second frame 181 supports the flexible target substrate 140. The first frame 171 or the second frame 181 allows the flexible target substrate 140 and the flexible support substrate 130 to be disposed opposite each other. The abutting assembly 111 is disposed adjacent to the first frame 171. The abutting assembly 111 is controllable by a braking mechanism 112 and can be repeatedly moved in a direction toward the second frame 181 (referred to as: second direction D2) and away from the second frame 181 (referred to as: first direction D1). The deformation generating mechanism 120 is adjacent to the second frame 181. The deformation generating mechanism 120 and the abutting assembly 111 are disposed opposite to each other. When the abutting assembly 111 moves toward the second frame 181, the deformation generating mechanism 120 can generate a relative force toward the abutting assembly 111 at the position of the flexible target substrate 140 supported by the second frame 181 relative to the abutting assembly 111. The detailed structure of the abutting assembly 111 and / or the deformation generating mechanism 120 and / or their corresponding operating methods are described in detail below.

[0050] In this embodiment, the electronic component transfer device 100 may further include a control system 190. The control system 190 may be signal-connected to corresponding components, assemblies, or units (e.g., the first frame 171, the second frame 181, the braking mechanism 112, the braking mechanism 122, and / or other devices described later, but not limited thereto) via corresponding signal lines 191, but the invention is not limited thereto. In one embodiment, the control system 190 may be signal-connected to the corresponding components, assemblies, or units via wireless signal transmission. That is, the electronic component transfer device 100, including the control system 190 and the first frame 171, the second frame 181, the braking mechanism 112, the braking mechanism 122, and / or other devices described later connected thereto, is the same device or machine. Furthermore, the signal connection mentioned in this invention can refer to either wired or wireless signal transmission connection methods. Additionally, this invention does not limit all signal connection methods to being the same or different.

[0051] In one embodiment, the first frame 171 can indirectly fix the flexible carrier substrate 130 via the carrier frame 172, but the present invention is not limited thereto.

[0052] In this embodiment, the flexible carrier substrate 130 may include ultraviolet tape or blue tape, but the invention is not limited thereto. In one embodiment, the carrier frame 172 may be referred to as a blue tape frame, but the invention is not limited thereto.

[0053] In one embodiment, the flexible carrier substrate 130 may be a composite material. For example, the flexible carrier substrate 130 may have a polymer film covered thereon with an adhesive layer.

[0054] In this embodiment, the flexible carrier substrate 130 may have a first carrier surface 130a and a second carrier surface 130b relative to the first carrier surface 130a. The electronic component 810 may be located on the first carrier surface 130a of the flexible carrier substrate 130. The first carrier surface 130a of the flexible carrier substrate 130 may be configured opposite to the first target surface 140a of the flexible target substrate 140.

[0055] In this embodiment, the electronic component 810 may include a light-emitting chip (such as a light-emitting diode (LED) chip; but not limited thereto) or an integrated circuit (IC), but the present invention is not limited thereto. Furthermore, for clarity, ... Figure 1A All electronic components 810 are not shown or labeled in subsequent accompanying drawings.

[0056] In one embodiment, the second frame 181 can indirectly flexibly target the substrate 140 via the carrier frame 182, but the invention is not limited thereto.

[0057] In one embodiment, the flexible target substrate 140 may be made of the same or similar material as the flexible bearing substrate 130, and therefore will not be described in detail here.

[0058] The electronic component 810 can be transferred from the flexible carrier substrate 130 to the flexible target substrate 140 by the electronic component transfer device 100 as described below. However, it is worth noting that the present invention is not limited to the methods described below. Furthermore, for clarity, some of the following figures (e.g.: Figures 1B to 1C In the diagram, only the corresponding symbols are shown schematically. Figure 1A A side sectional view of a portion of the components in region R1. Additionally, for clarity, some components or parts may be omitted from subsequent drawings.

[0059] Please refer to Figure 1AAn electronic component transfer device 100, a flexible support substrate 130 carrying an electronic component 810, and a flexible target substrate 140 are provided. The flexible support substrate 130 and the flexible target substrate 140 are arranged opposite each other, with the side of the flexible support substrate 130 carrying the electronic component 810 facing the flexible target substrate 140. Then, the following steps are performed in any order: a force is applied to the side of the flexible support substrate 130 not carrying the electronic component 810, causing the electronic component 810 to move toward the flexible target substrate 140; and a relative force is applied to the flexible target substrate 140, causing the flexible target substrate 140 to deform, thereby defining a receiving point on the flexible target substrate 140, and moving the area around the receiving point of the flexible target substrate 140 away from the electronic component 810. In this way, the electronic component 810 can be contacted and transferred to the receiving point. Afterward, the application of the force and the relative force are stopped in any order, so that the flexible support substrate 130 and the flexible target substrate 140 return to their original state.

[0060] It is worth noting that, Figure 1A The number and / or configuration of the electronic components 810 disposed on the flexible carrier substrate 130 are shown only as examples and are not limited in the present invention.

[0061] It is worth noting that, Figure 1A The arrangement of the flexible bearing substrate 130 on the first frame 171 and / or the arrangement of the flexible target substrate 140 on the second frame 181 are merely illustrative examples and are not intended to limit the scope of the invention.

[0062] Please refer to Figures 1A to 1B This brings the abutting component 111 of the electronic component transfer device 100 closer to the flexible carrier substrate 130, so as to further bring the carrier abutting surface 111b of the abutting component 111 (marked on) closer together. Figure 1D or Figure 1E The abutting component 111 is moved along the second direction D2 by means of the braking mechanism 112 so that the abutting component 111 contacts at least the second bearing surface 130b of the flexible carrier substrate 130.

[0063] In this embodiment, the abutment component 111 may include a needle plug.

[0064] In this embodiment, the bearing abutment surface 111b of the abutment component 111 can be planar or nearly planar. In this way, when the bearing abutment surface 111b of the abutment component 111 abuts against the flexible support substrate 130, the possibility of damage or destruction to the flexible support substrate 130 can be reduced. That is, the abutment component 111 (e.g., a pin) essentially does not penetrate the flexible support substrate 130.

[0065] Please continue to refer to Figures 1A to 1B This brings at least a portion of the deformation generating mechanism 120 of the electronic component transfer device 100 close to the flexible target substrate 140. The deformation generating mechanism 120 may include a pin 121 and a corresponding braking mechanism 122. The braking mechanism 122 can move the pin 121 along a first direction D1 to at least bring the target top surface 121b of the pin 121 (marked on) into contact with the flexible target substrate 140. Figure 1D or Figure 1E The second target surface 140b of the flexible target substrate 140 comes into contact with and resists the contact.

[0066] In this embodiment, the target abutment surface 121b of the pin 121 can be a plane or nearly a plane. In this way, when the target abutment surface 121b of the pin 121 abuts against the flexible target substrate 140, the possibility of damage or breakage to the flexible target substrate 140 can be reduced. That is, the pin 121 of the deformation generating mechanism 120 essentially does not penetrate the flexible target substrate 140.

[0067] It is worth noting that the present invention does not limit the order in which the pin 121 of the deformation generating mechanism 120 contacts the flexible target substrate 140 and the abutment component 111 contacts the flexible support substrate 130. For example, the pin 121 and the abutment component 111 may contact the flexible target substrate 140 and the flexible support substrate 130 simultaneously or at different times.

[0068] Please refer to Figures 1B to 1C Or 1D, apply force to the side of the flexible carrier substrate 130 that does not support the electronic component 810, so that the corresponding electronic component 811 (e.g., one of the electronic components 810; marked on) on the flexible carrier substrate 130 Figure 1D It moves toward the flexible target substrate 140.

[0069] For example, the braking mechanism 112 can move the abutting component 111 so that the abutting component 111, which contacts the flexible support substrate 130, applies a corresponding force to the flexible support substrate 130, causing the flexible support substrate 130 to flex in the direction of the flexible target substrate 140, so that the corresponding electronic component 811 on the flexible support substrate 130 can move in the direction of the flexible target substrate 140. In other words, the force applied to the flexible support substrate 130 can be generated by the abutting component 111 abutting against the flexible support substrate 130.

[0070] Please continue to refer to Figures 1B to 1CAlternatively, a relative force is applied to the flexible target substrate 140, causing the flexible target substrate 140 to deform. Furthermore, a receiving point can be defined on the deformed flexible target substrate 140 (e.g., the location on the flexible target substrate 140 corresponding to the target abutment surface 121b of the pin 121 of the deformation generating mechanism 120), wherein the peripheral region of the flexible target substrate 140 at the receiving point is far from the electronic component 811. That is, in the deformed flexible target substrate 140, the receiving point is closer to the electronic component 811 to be transferred compared to other regions (i.e., the peripheral region) that are different from the receiving point.

[0071] For example, the pin 121 can be moved by the braking mechanism 122 so that the pin 121 in contact with the flexible target substrate 140 applies a corresponding relative force to the flexible target substrate 140, causing the flexible target substrate 140 to flex accordingly in the direction of the flexible support substrate 130. That is, the relative force applied to the flexible target substrate 140 can be generated by the pin 121 of the deformation generating mechanism 120 pressing against the flexible target substrate 140.

[0072] It is worth noting that the present invention does not limit the order in which the flexible bearing substrate 130 is subjected to force to produce deformation and the flexible target substrate 140 is subjected to relative force to produce deformation.

[0073] Please refer to Figure 1C Alternatively, after the flexible carrier substrate 130 is deformed by applying a force and the flexible target substrate 140 is deformed by applying a relative force, the electronic component 811 on the flexible carrier substrate 130 can contact the receiving point of the flexible target substrate 140 to be further transferred to the receiving point of the flexible target substrate 140.

[0074] In this embodiment, the electronic component transfer device 100 may further include a housing 150. The housing 150 may have a gas chamber 151, a gas channel 152, and at least one gas opening 153. The gas channel 152 and the gas opening 153 are connected to the gas chamber 151. The position of the gas opening 153 corresponds to the flexible support substrate 130. When the abutment component 111 applies a corresponding force to the flexible support substrate 130, the negative pressure generating device 175 can draw air through the gas conduit 174 connected to the gas channel 152, thereby reducing the range of deformation of the flexible support substrate 130.

[0075] by Figure 1C and 1DFor example, the housing 150 may also have a top-abutting opening 154 communicating with the air chamber 151. The top-abutting component 111, fitted inside the housing 150, can abut against the flexible support substrate 130 through the top-abutting opening 154. When the top-abutting component 111 applies a corresponding force to the flexible support substrate 130, the negative pressure generating device 175 can evacuate air. In this way, a portion of the flexible support substrate 130 corresponding to the top-abutting opening 154 can undergo corresponding deformation due to the abutting of the top-abutting component 111, allowing the corresponding electronic component 811 to move towards the flexible target substrate 140. Furthermore, the pressure difference generated by the aforementioned evacuation (e.g., the air pressure outside the housing 150 is greater than the air pressure inside the air chamber 151 of the housing 150) ensures that other portions of the flexible support substrate 130 corresponding to the gas opening 153 remain substantially undeformed. Therefore, the precision of the transfer of the electronic component 811 can be improved.

[0076] In one embodiment, the air pressure in the air chamber 151 of the housing 150 may be reduced when the electronic component 811 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140.

[0077] In one embodiment, the air pressure in the air chamber 151 of the housing 150 may be reduced before the electronic component 811 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140.

[0078] In one embodiment, the second bearing surface 130b of the flexible bearing substrate 130 may touch the outer surface of the housing 150 before the air pressure in the air chamber 151 of the housing 150 begins to decrease, but the invention is not limited thereto. In an embodiment not shown, a gap may exist between the second bearing surface 130b of the flexible bearing substrate 130 and the outer surface of the housing 150 before the air pressure in the air chamber 151 of the housing 150 begins to decrease.

[0079] Please refer to Figure 1E When the electronic component 811 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140, the contact area between the electronic component 811 and the flexible target substrate 140 can be made larger than the contact area between the electronic component 810 and the flexible carrier substrate 130 by means of the above method. In this way, the transfer efficiency and / or transfer yield of the electronic component 811 can be improved.

[0080] Please refer to Figure 1EIn one embodiment, when the electronic component 811 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140, the contact area between the pin 121 of the deformation generating mechanism 120 and the flexible target substrate 140 can be greater than the contact area between the electronic component 811 and the flexible carrier substrate 130. This reduces the offset of the electronic component 811 on the flexible target substrate 140 during transfer, thereby improving the transfer efficiency and / or transfer yield of the electronic component 811.

[0081] Please refer to Figure 1D and Figure 1E In one embodiment, when the electronic component 811 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140, the contact area between the electronic component 810 and the flexible carrier substrate 130 is substantially equal to the contact area between the abutting component 111 and the flexible carrier substrate 130. Furthermore, by means of the above method, both the flexible carrier substrate 130 and the flexible target substrate 140 can have corresponding deformations, thereby reducing the possibility of contact between other electronic components 812 on the flexible carrier substrate 130 (e.g., electronic components 810 that have not yet been transferred) and other electronic components 813 on the flexible target substrate 140 (e.g., electronic components 810 that have already been transferred).

[0082] In one embodiment, after the electronic component 810 on the flexible support substrate 130 contacts the receiving point of the flexible target substrate 140, the aforementioned force (e.g., moving the abutting component 111 away from the flexible support substrate 130) and / or the aforementioned relative force (e.g., moving the pin 121 of the deformation generating mechanism 120 away from the flexible target substrate 140) can be stopped. Furthermore, when or after the abutting component 111 moves away from the flexible support substrate 130 and / or when the pin 121 moves away from the flexible target substrate 140, the flexible support substrate 130 and / or the flexible target substrate 140 can return to their original shape due to their own elasticity / flexibility, thereby completely separating the flexible support substrate 130 from the electronic component 811.

[0083] Figure 2A This is a partial side view schematic diagram of an apparatus for transferring an electronic component self-flexible carrier substrate to a flexible target substrate according to a second embodiment of the present invention. Figures 2B to 2D This is a partial side view schematic diagram of a portion of the operation mode of an apparatus for transferring an electronic component from a flexible carrier substrate to a flexible target substrate according to a second embodiment of the present invention. For example, Figure 2B or Figure 2C It can correspond to Figure 2A A magnified view of part of the central region R3. Figure 2D It can correspond to Figure 2CA magnified view of a portion of region R4 in one embodiment. Figure 1E It can correspond to Figure 2C A bottom view diagram.

[0084] Please refer to Figure 2A and Figure 1A The electronic component transfer device 200 of this embodiment is similar to the electronic component transfer device 100 of the first embodiment. That is, the electronic component transfer device 200 may include a first frame 171, a second frame 181, a top abutment component 111, and a deformation generating mechanism 220.

[0085] The electronic component transfer apparatus 200 can be adapted to transfer the electronic component 810 from the flexible carrier substrate 130 to the flexible target substrate 140 in a manner similar to that described above, as follows. However, it is worth noting that the present invention is not limited to the manner described below. Furthermore, for clarity, some of the following figures (e.g.: Figures 2B to 2C In the diagram, only the corresponding symbols are shown schematically. Figure 2A A side sectional view of a portion of the components in region R3. Additionally, for clarity, some components or parts may be omitted from subsequent drawings.

[0086] Please refer to Figure 2A and Figure 2B In this embodiment, the electronic component transfer device 200 may further include a housing 260. The housing 260 may have a gas chamber 261, a gas channel 262, and at least one gas opening 263. The gas channel 262 and the gas opening 263 communicate with the gas chamber 261. The position of the gas opening 263 corresponds to the flexible target substrate 140.

[0087] Please refer to Figure 2B and Figure 2C or Figure 2D When the needle 121 applies a corresponding relative force to the flexible target substrate 140, the negative pressure generating device 285 can draw air through the gas pipe 284 connected to the gas channel 262, thereby reducing the range of deformation of the flexible target substrate 140. In other words, at least the needle 121, braking mechanism 122, housing 260, and negative pressure generating device 285, which are suitable for generating corresponding deformation of the flexible target substrate 140, can be considered as a deformation generating mechanism 220. In other words, the deformation generating mechanism 220 may include the needle 121, braking mechanism 122, housing 260, and negative pressure generating device 285.

[0088] by Figure 2C and 2DFor example, the housing 260 may also have a top opening 264 communicating with the air chamber 261. The pin 121 fitted inside the housing 260 can abut against the flexible target substrate 140 through the top opening 264. When the pin 121 of the deformation generating mechanism 220 applies a corresponding relative force to the flexible target substrate 140, the negative pressure generating device 285 can draw air through the gas pipe 284 communicating with the gas channel 262. In this way, the portion of the flexible target substrate 140 corresponding to the top opening 264 can be deformed due to the abutment of the pin 121, so that the corresponding portion abutted by the pin 121 can move toward the flexible support substrate 130. Furthermore, the pressure difference generated by the aforementioned air extraction (e.g., the air pressure outside the housing 260 is greater than the air pressure inside the air chamber 261 of the housing 260) can ensure that other portions of the flexible target substrate 140 corresponding to the gas opening 263 will not be deformed. Therefore, the accuracy of electronic component 811 transfer can be improved.

[0089] In one embodiment, the air pressure in the air chamber 261 of the housing 260 may be reduced when the electronic component 811 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140.

[0090] In one embodiment, the air pressure in the air chamber 261 of the housing 260 may be reduced before the electronic component 811 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140.

[0091] In one embodiment, the second target surface 140b of the flexible target substrate 140 may touch the outer surface of the housing 260 before the air pressure in the air chamber 261 of the housing 260 begins to decrease, but the invention is not limited thereto. In an embodiment not shown, a gap may exist between the second target surface 140b of the flexible target substrate 140 and the outer surface of the housing 260 before the air pressure in the air chamber 261 of the housing 260 begins to decrease.

[0092] Similar to the foregoing, in one embodiment, after the electronic component 811 on the flexible support substrate 130 contacts the receiving point of the flexible target substrate 140, the aforementioned force and / or the aforementioned relative force can be stopped. Furthermore, when or after the abutting component 111 moves away from the flexible support substrate 130 and / or when the pin 121 of the deformation generating mechanism 220 moves away from the flexible target substrate 140, the flexible support substrate 130 and / or the flexible target substrate 140 can return to their original shape by their own elasticity / flexibility, thereby completely separating the flexible support substrate 130 from the electronic component 810.

[0093] Figure 3AThis is a partial side view schematic diagram of an apparatus for transferring an electronic component self-flexible carrier substrate to a flexible target substrate according to a third embodiment of the present invention. Figures 3B to 3D This is a partial side view schematic diagram of a portion of the operation mode of an apparatus for transferring an electronic component from a flexible carrier substrate to a flexible target substrate according to a third embodiment of the present invention. For example, Figure 3B or Figure 3C It can correspond to Figure 3A A magnified view of part of the central region R5. Figure 3D It can correspond to Figure 3C A magnified view of a portion of region R6 in the middle. In one embodiment, Figure 1E It can correspond to Figure 3C A bottom view diagram.

[0094] Please refer to Figure 3A and Figure 2A The electronic component transfer device 300 of this embodiment is similar to the electronic component transfer device 200 of the second embodiment. That is, the electronic component transfer device 300 may include a first frame 171, a second frame 181, a top abutment component 111, and a deformation generating mechanism 320.

[0095] The electronic component transfer apparatus 300 can be adapted to transfer the electronic component 810 from the flexible carrier substrate 130 to the flexible target substrate 140 in a manner similar to that described above, as follows. However, it is worth noting that the present invention is not limited to the manner described below. Furthermore, for clarity, some of the following figures (e.g.: Figures 3B to 3C In the diagram, only the corresponding symbols are shown schematically. Figure 3A A side sectional view of a portion of the components in region R5. Additionally, for clarity, some components or parts may be omitted from subsequent drawings.

[0096] Please refer to Figure 3A and Figure 3B In this embodiment, the electronic component transfer device 300 may further include a housing 360. The housing 360 may have a gas chamber 261, a gas channel 262, at least one gas opening 263, and a protrusion 365. The protrusion 365 may correspond to the flexible target substrate 140, and the protrusion 365 may be located at the edge of the housing 360.

[0097] Please continue to refer to Figures 3B to 3C or Figure 3DA force is applied to the flexible target substrate 140, causing it to deform. A receiving point can be defined on the deformed flexible target substrate 140, wherein the peripheral region of the flexible target substrate 140 around the receiving point is far from the electronic component 811. In other words, in the deformed flexible target substrate 140, the receiving point is closer to the electronic component 811 to be transferred, compared to other regions (i.e., the peripheral region) that are different from the receiving point.

[0098] For example, the negative pressure generating device 285 can evacuate air. Thus, for instance: Figures 3B to 3C As shown, a portion of the flexible target substrate 140 corresponding to the gas opening 263 may be relatively concave in the second direction D2 due to the pressure difference. Furthermore, a portion of the flexible support substrate 130 corresponding to the abutment opening 154 may be relatively convex in the first direction D1 due to the abutment of the abutment component 111. In other words, the relative force applied to the flexible target substrate 140 can be formed by evacuating air from the flexible target substrate 140 and the abutment of the pin 121. That is, at least the pin 121, braking mechanism 122, housing 360, and negative pressure generating device 285, which are suitable for generating corresponding deformation of the flexible target substrate 140, can be considered as a deformation generating mechanism 320. In other words, the deformation generating mechanism 320 may include the pin 121, braking mechanism 122, housing 360, and negative pressure generating device 285. By means of the aforementioned method, the accuracy of the transfer of the electronic component 810 can be improved.

[0099] In one embodiment, the air pressure in the air chamber 261 of the housing 360 may be reduced before the electronic component 810 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140.

[0100] In one embodiment, before the air pressure in the air chamber 261 of the housing 360 is reduced, the second target surface 140b of the flexible target substrate 140 may contact the outer surface of the housing 360 (e.g., the protrusion 365 of the housing 360) or the target abutment surface 121b of the pin 121, but the invention is not limited thereto. In an embodiment not shown, before the air pressure in the air chamber 261 of the housing 360 is reduced, there may be a gap between the second bearing surface 130b of the flexible bearing substrate 130 and the outer surface of the housing 360 (e.g., the protrusion 365 of the housing 360) and / or the target abutment surface 121b of the pin 121.

[0101] The components or parts in all the accompanying drawings can be transformed into components presented in another drawing (not shown) by suitable flipping, rotation, arrangement, and / or combination. For example, in one drawing or embodiment (not shown), the configuration may be... Figure 1A , Figure 2A or Figure 3AThe rotation or flipping. For example, in a drawing or embodiment not shown, the housing corresponding to the abutment component 111 may be the same as or similar to the housing corresponding to the pin 121.

[0102] The electronic component transfer method described above can be applied to the manufacturing process of any suitable electronic device. For example, electronic component 720 may include a light-emitting diode chip, and the transfer method described above may be part of the manufacturing process of a light-emitting diode panel.

[0103] In summary, the electronic component transfer apparatus and electronic component transfer method of the present invention are suitable for transferring electronic components on a flexible carrier substrate to a flexible target substrate.

[0104] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An apparatus for transferring an electronic component's self-flexible carrier substrate to a flexible target substrate, characterized in that, include: The first frame is used to support the flexible support substrate; The second frame is used to support the flexible target substrate; The abutment component is located adjacent to the first frame and is controlled by the braking mechanism, and can move repeatedly toward and away from the second frame; as well as A deformation generating mechanism is located adjacent to the second frame and is disposed opposite to the abutting component. When the abutting component moves toward the second frame, it generates a relative force toward the abutting component at the position of the flexible target substrate surface supported by the second frame relative to the abutting component.

2. The apparatus of claim 1, wherein, The relative force is formed by the movement of the needle bolt toward the abutment assembly.

3. The apparatus of claim 1, wherein, The relative force is formed by drawing a vacuum onto the flexible target substrate supported by the second frame, in the same direction as the pin moves toward the abutment assembly.

4. The apparatus of claim 3, wherein, The needle bolt moves toward the abutment assembly.

5. The apparatus of claim 3, wherein, The needle plug remains stationary.

6. The apparatus of claim 1, wherein, The electronic component mentioned above is an LED chip.

7. A method of transferring an electronic assembly, characterized by, include: A flexible carrier substrate is provided on which electronic components are mounted; Provide flexible target substrates; The flexible carrier substrate and the flexible target substrate are arranged opposite to each other, with the side of the flexible carrier substrate carrying the electronic component facing the flexible target substrate. A force is applied to the side of the flexible support substrate that does not support the electronic component, causing the electronic component to move toward the flexible target substrate; A relative force is applied to the flexible target substrate to deform the flexible target substrate, and the deformation defines a receiving point on the flexible target substrate, and the area around the receiving point of the flexible target substrate is moved away from the electronic component. The electronic component is brought into contact with and transferred to the receiving point; as well as Stop applying the applied force and the relative force, so that the flexible bearing substrate and the flexible target substrate return to their original state.

8. The method of claim 7, wherein, The force is generated by the ejector pin pressing against the flexible support substrate.

9. The method of claim 8, wherein, The ejector pin does not penetrate the flexible support substrate when it is abutting.

10. The method of claim 7, wherein, The relative force is generated by the pin pressing against the flexible target substrate.

11. The method of claim 10, wherein, The relative force is also formed by evacuating the flexible target substrate and abutting against the pin.

12. The method of claim 7, wherein, The electronic component mentioned above is an LED chip.

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