Cooling structure assembly and power module device

Abstract

The application relates to a cooling structure assembly and a power module device. The cooling structure assembly is used for a power module. The cooling structure assembly comprises a cooling body and a heat dissipation assembly. The cooling body comprises a first surface, a recessed part, a containing space, an inlet and an outlet. The first surface is located on one side of the cooling body along the thickness direction of the cooling body, the side of the cooling body opposite to the first surface is recessed to form the recessed part, the containing space is arranged between the recessed part and the first surface, and the inlet and the outlet are both communicated with the containing space. The heat dissipation assembly is arranged in the recessed part. The application can improve the heat dissipation effect of the cooling structure assembly while reducing the overall volume of the cooling structure assembly.

Description

Technical Field

[0001] This application relates to the field of heat transfer technology, and in particular to a cooling structure component and a power module device. Background Technology

[0002] Power semiconductor modules are crucial semiconductor components used in power electronic circuits, typically found in vehicles, solar energy, and industrial applications such as inverters and rectifiers. During operation, the chips in power semiconductor modules generate significant heat, and this heat accumulation can severely impact device performance. As power modules evolve towards higher power and higher integration, heat generation issues become increasingly prominent, leading to ever-increasing demands on heat dissipation.

[0003] A heat sink is a device used to absorb heat generated during product operation and then dissipate that heat to the external environment to ensure the product maintains a normal operating temperature. Most heat sinks absorb heat through thermal conduction by contacting the surface of the heat-generating component, and then transfer the heat to the external environment through various methods. Common heat dissipation methods include liquid cooling and air cooling. Traditional water cooling channels have a single heat dissipation path and poor heat dissipation efficiency, especially for high-power modules. Not only do they fail to achieve timely heat dissipation, but the heat sink also occupies a large portion of the space, resulting in poor space utilization. Summary of the Invention

[0004] The cooling structure component and power module device provided in this application embodiment can improve the heat dissipation effect of the cooling structure component while reducing the overall volume of the cooling structure component.

[0005] On one hand, according to an embodiment of this application, a cooling structure assembly for a power module is proposed, comprising: a cooling body including a first surface, a recess, a receiving space, an inlet, and an outlet; the first surface is located on one side of the cooling body along its thickness direction; the side of the cooling body opposite to the first surface is recessed to form the recess; a receiving space is provided between the recess and the first surface; and both the inlet and outlet are connected to the receiving space. A heat dissipation assembly is located within the recess.

[0006] According to one aspect of the embodiments of this application, the cooling body further includes a flow guiding assembly located within a receiving space. The flow guiding assembly includes a plurality of flow guiding elements spaced apart, at least a portion of which forms a flow channel with the inner wall of the receiving space.

[0007] According to one aspect of the embodiments of this application, the flow guiding component includes a plurality of first flow guiding elements and a plurality of second flow guiding elements, the plurality of first flow guiding elements and the plurality of second flow guiding elements are alternately distributed along a first direction, a gap is formed between the first flow guiding elements and at least one of the inner walls on both sides of the accommodating space opposite to each other along a second direction, and the second flow guiding elements are abutted against the inner walls on both sides of the accommodating space opposite to each other along a second direction.

[0008] The second guide element includes a guide hole, which connects the flow channel between the adjacent first guide element and the second guide element. The thickness direction, the first direction and the second direction of the cooling body intersect each other.

[0009] According to one aspect of the embodiments of this application, the flow guiding assembly includes a plurality of first flow guiding elements and a plurality of second flow guiding elements, wherein the plurality of first flow guiding elements and the plurality of second flow guiding elements are alternately distributed along a first direction, the first flow guiding elements are located on the inner wall of the accommodating space near the first surface and have a gap between them and the inner wall of the accommodating space on the side opposite to the first surface, and the second flow guiding elements are located on the inner wall of the accommodating space on the side opposite to the first surface and have a gap between them and the inner wall of the accommodating space near the first surface.

[0010] According to one aspect of the embodiments of this application, the guide extends in a wave-like or square-wave shape along its own extension direction.

[0011] According to one aspect of the embodiments of this application, the heat dissipation assembly includes a plurality of heat dissipation elements spaced apart, the plurality of heat dissipation elements extending from the recess in a direction away from the first surface.

[0012] According to one aspect of the embodiments of this application, the heat sink includes a storage space, which is connected in communication with the receiving space.

[0013] According to one aspect of the embodiments of this application, a preset area is provided on the side of the recess facing away from the first surface, and a plurality of heat dissipation components are distributed at intervals around the preset area. The heat dissipation component also includes a fan located in the preset area.

[0014] According to one aspect of the embodiments of this application, the cooling body further includes a mounting hole located on the side wall of the cooling body and communicating with a recess. The heat dissipation assembly also includes a fan located inside the mounting hole.

[0015] On the other hand, embodiments of this application also provide a power module device, including the cooling structure assembly as described above, and a power module located on a first surface of the cooling structure assembly.

[0016] According to the cooling structure component and power module device provided in this application, by providing a receiving space, an inlet, and an outlet on the cooling body, a flowable heat transfer channel is created inside the cooling body, which can carry away the heat absorbed by the power module. Furthermore, forming a recess on the cooling body can further improve the heat dissipation effect of the cooling body while also allowing for higher integration of the cooling structure component. Attached Figure Description

[0017] The features, advantages, and technical effects of exemplary embodiments of this application will now be described with reference to the accompanying drawings.

[0018] Figure 1 This application provides a schematic diagram of the structure of a cooling structure assembly according to some embodiments;

[0019] Figure 2 A cross-sectional structural schematic diagram of a cooling structure assembly provided for some embodiments of this application;

[0020] Figure 3 A cross-sectional structural schematic diagram of another cooling structure component provided in some embodiments of this application;

[0021] Figure 4 A top view schematic diagram of a cooling structure assembly (hidden cover) provided for some embodiments of this application;

[0022] Figure 5 A top view schematic diagram of another cooling structure assembly (hidden cover plate) provided in some embodiments of this application;

[0023] Figure 6 A schematic diagram of another cooling structure assembly (hidden cover plate) provided in some embodiments of this application;

[0024] Figure 7 A cross-sectional structural schematic diagram of another cooling structure component provided in some embodiments of this application;

[0025] Figure 8 A top view schematic diagram of another cooling structure assembly (hidden cover plate) provided in some embodiments of this application;

[0026] Figure 9 A bottom view of a cooling structure assembly provided in some embodiments of this application;

[0027] Figure 10 A bottom view of a cooling structure assembly provided in some embodiments of this application;

[0028] Figure 11 A cross-sectional structural schematic diagram of another cooling structure component provided in some embodiments of this application;

[0029] Figure 12 This is a side view of a cooling structure assembly provided in some embodiments of this application.

[0030] Marker explanation:

[0031] 1. Cooling body; 11. First surface; 12. Recess; 13. Accommodation space; 14. Inlet; 15. Outlet; 16. Flow guide; 161. First flow guide; 162. Second flow guide; 163. Flow guide hole; 164. Gap; 17. Cover plate; 18. Extension;

[0032] 2. Heat dissipation components; 21. Heat sink; 22. Preset area; 23. Fan; 24. Mounting holes;

[0033] X, the first direction; Y, the second direction.

[0034] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not drawn to scale. Detailed Implementation

[0035] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0037] To better understand this application, on the one hand, the following will combine... Figures 1 to 12 The cooling structure components and power modules according to embodiments of this application will be described in detail.

[0038] Figure 1 This is a schematic diagram of a cooling structure component provided in some embodiments of this application. Figure 2 This is a cross-sectional structural schematic diagram of a cooling structure component provided for some embodiments of this application. Figure 3 This is a cross-sectional structural schematic diagram of another cooling structure component provided in some embodiments of this application.

[0039] like Figures 1 to 3As shown, this application embodiment provides a cooling structure assembly. The cooling structure assembly is used in a power module. The cooling structure assembly includes a cooling body 1 and a heat dissipation assembly 2. The cooling body 1 includes a first surface 11, a recess 12, a receiving space 13, an inlet 14, and an outlet 15. The first surface 11 is located on one side of the cooling body 1 along its own thickness direction. The side of the cooling body 1 facing away from the first surface 11 forms a recess 12. A receiving space 13 is provided between the recess 12 and the first surface 11. Both the inlet 14 and the outlet 15 communicate with the receiving space 13. The heat dissipation assembly 2 is located within the recess 12.

[0040] In some optional examples, a power module may be disposed on the first surface 11 of the cooling body 1. Optionally, the power module may be one or more. In some examples, the cooling body 1 may also include a cover plate 17 located on one side of the first surface 11, and the cover plate 17 may cover the receiving space 13. Optionally, the cover plate 17 and the cooling body 1 may be separate structures to simplify the manufacturing process of the receiving space 13 of the cooling body 1.

[0041] The cooling body 1 includes a receiving space 13, an inlet 14, and an outlet 15. The shape of the cooling body 1 can be any one of a rectangle, a square, or a circle. Of course, the shape of the cooling body 1 can also be other shapes. The shape of the receiving space 13 in the cooling body 1 can match the shape of the cooling body 1, or the shape of the receiving space 13 can also be other shapes, as long as it can ensure that the cooling medium in the receiving space 13 can flow from the inlet 14 through the receiving space 13 and out of the outlet 15.

[0042] Optionally, the inlet 14 and the outlet 15 may be located on the same side of the cooling body 1, or on adjacent sides of the cooling body 1, or on opposite sides of the cooling body 1.

[0043] Optionally, the receiving space 13 may be located close to the first surface 11. For example, the wall thickness between the receiving space 13 and the first surface 11 may be less than the wall thickness between the receiving space 13 and other surfaces of the cooling body 1.

[0044] Optionally, the inlet 14 and outlet 15 can be coplanar with the receiving space 13, that is, the inlet 14, outlet 15, and receiving space 13 are located on the same horizontal plane. The inlet 14 and outlet 15 can be located on the side of the receiving space 13 away from the first surface 11, that is, the inlet 14 and outlet 15 need to be connected to the receiving space 13 through an inclined channel so that the external interface has more space to match and connect with the inlet 14 and outlet 15.

[0045] The cooling body 1 also includes a recess 12, which is formed by a surface recess on the cooling body 1 opposite to the first surface 11. Optionally, as... Figure 3 As shown, the number of recesses 12 can be one, of course, as Figure 2 As shown, there can also be multiple recesses. Optionally, the recessed area of ​​the recessed portion 12 can be the same as the area occupied by the receiving space 13, so as to improve the heat dissipation effect of the cooling medium in the receiving space 13.

[0046] The heat dissipation component 2 in the cooling structure assembly is located inside the recess 12. Optionally, the heat dissipation component 2 can be fixedly connected to the recess 12 by bolts, welding, or other means. Optionally, the heat dissipation component 2 can also be an integral structure with the recess 12. Optionally, the heat dissipation component 2 can be disposed on the bottom wall of the recess 12, or it can be disposed on the side wall of the recess 12.

[0047] According to the cooling structure assembly provided in this application, by providing a receiving space 13, an inlet 14, and an outlet 15 on the cooling body 1, a flowable heat transfer channel is formed inside the cooling body 1, which can carry away the heat absorbed by the power module. Furthermore, forming a recess 12 on the cooling body 1 can further improve the heat dissipation effect of the cooling body 1, while also increasing the integration of the cooling structure assembly.

[0048] Figure 4 This is a top view of a cooling structure assembly (hidden cover) provided for some embodiments of this application. Figure 5 This is a top view schematic diagram of another cooling structure component (hidden cover) provided for some embodiments of this application.

[0049] like Figures 3 to 5 As shown, in some optional embodiments, the cooling body 1 further includes a flow guiding assembly located within the receiving space 13. The flow guiding assembly includes a plurality of spaced-apart flow guiding elements 16, at least a portion of which form a flow channel with the inner wall of the receiving space 13.

[0050] Optionally, the flow guiding assembly includes a flow guiding member 16, which may include a plate-shaped structural member, a columnar structural member, or other shaped structural member. Exemplarily, the flow guiding member 16 is a plate-shaped structural member, with multiple plate-shaped structural members spaced apart in the receiving space 13, and some or all of the plate-shaped structural members forming a flow channel with the inner wall, for example, such as... Figure 4 The "Z"-shaped flow channel is shown. Of course, the flow guide 16 can also be a columnar structure, with multiple columnar structures spaced apart in the receiving space 13, forming flow channels between the multiple columnar structures and between the columnar structures and the sidewalls.

[0051] Optionally, the airflow guiding component and the cooling body 1 can be an integral structure. Alternatively, the airflow guiding component and the cooling body 1 can be separate structures.

[0052] The embodiments of this application increase the contact area between the cooling body 1 and the cooling medium through the above-described method, thereby further improving the heat dissipation effect of the cooling structure components.

[0053] Figure 6 This is a schematic diagram of another cooling structure component (hidden cover) provided in some embodiments of this application.

[0054] like Figure 5 and Figure 6 As shown, in some optional embodiments, the flow guiding assembly includes a plurality of first flow guiding elements 161 and a plurality of second flow guiding elements 162. The plurality of first flow guiding elements 161 and the plurality of second flow guiding elements 162 are alternately distributed along a first direction X. A gap 164 is formed between the first flow guiding elements 161 and at least one of the inner walls of the accommodating space 13 on opposite sides along a second direction Y. The second flow guiding elements 162 are abutted against the inner walls of the accommodating space 13 on opposite sides along the second direction Y. The second flow guiding element 162 includes a flow guiding hole 163, which connects the flow channel between adjacent first flow guiding elements 161 and second flow guiding elements 162. The thickness direction of the cooling body 1, the first direction X, and the second direction Y intersect each other.

[0055] Optionally, the first guide member 161 and the second guide member 162 can be plate-shaped structures.

[0056] Optionally, the extension lengths of the first guide member 161 and the second guide member 162 can be different. For example, the extension length of the first guide member 161 can be less than the extension length of the second guide member 162.

[0057] Optionally, the first guide member 161 and the second guide member 162 can be an integral structure with the inner wall of the accommodating space 13 on the side near the first surface 11.

[0058] Optionally, a plurality of first guide members 161 and a plurality of second guide members 162 are alternately distributed along a first direction X in the receiving space 13, such that the receiving space 13 has a plurality of flow channels extending along a second direction Y. A gap 164 is formed between the first guide member 161 and at least one of the inner walls of the receiving space 13 on opposite sides along the second direction Y. For example, a flow channel along the second direction Y is formed between the first guide member 161 and the second guide member 162. For instance, a gap 164 is formed between the first guide member 161 and one of the inner walls of the receiving space 13 on opposite sides along the second direction Y, allowing adjacent flow channels to communicate through the gap 164. Of course, the first guide member 161 may have gaps 164 on both inner walls of the receiving space 13 on opposite sides along the second direction Y, which can further increase the flow velocity of the cooling medium in the flow channels. The second guide member 162 includes a guide hole 163, allowing the cooling medium flowing in from the gap 164 to flow into the adjacent flow channel through the guide hole 163. Optionally, the guide hole 163 can be located at the center of the second guide member 162, so that the cooling medium flowing in from one or both ends of the gap 164 along the second direction Y flows from the center of the flow channel to the adjacent flow channel. This helps to balance the flow velocity of the cooling medium in the flow channel and achieve uniformity of the cooling medium temperature in the flow channel. Of course, the guide hole 163 can also be located at other positions of the second guide member 162, as long as it can ensure that the two adjacent flow channels are connected.

[0059] The embodiments of this application increase the contact area between the cooling body 1 and the cooling medium through the above-described settings, thereby further improving the heat dissipation effect of the cooling structure components.

[0060] Figure 7 This is a cross-sectional structural schematic diagram of another cooling structure component provided in some embodiments of this application.

[0061] like Figure 7 As shown, in some optional embodiments, the flow guiding assembly includes a plurality of first flow guiding elements 161 and a plurality of second flow guiding elements 162, the plurality of first flow guiding elements 161 and the plurality of second flow guiding elements 162 being alternately distributed along a first direction X. The first flow guiding elements 161 are located on the inner wall of the receiving space 13 near the first surface 11 and have a gap 164 between them and the inner wall of the receiving space 13 on the side opposite to the first surface 11. The second flow guiding elements 162 are located on the inner wall of the receiving space 13 on the side opposite to the first surface 11 and have a gap 164 between them and the inner wall of the receiving space 13 near the first surface 11.

[0062] Taking the first guide member 161 and the second guide member 162 as plate-shaped structures as an example, optionally, the dimensions of the first guide member 161 and the second guide member 162 along the thickness direction of the cooling body 1 can be smaller than the dimensions of the accommodating space 13 along the thickness direction of the cooling body 1.

[0063] Multiple first flow guides 161 and multiple second flow guides 162 are alternately distributed along a first direction X in the receiving space 13, resulting in multiple flow channels extending along a second direction Y in the receiving space 13. The first flow guides 161 are located on the inner wall of the receiving space 13 near the first surface 11, and a gap 164 exists between the first flow guide 161 and the inner wall of the receiving space 13 opposite to the first surface 11, allowing communication between two adjacent flow channels. Furthermore, the second flow guides 162 are located on the inner wall of the receiving space 13 opposite to the first surface 11, and a gap 164 exists between the second flow guide 162 and the inner wall of the receiving space 13 near the first surface 11, as shown in the figure, causing the flow path of the cooling medium in the flow channels to be bent along the cross-section in the thickness direction of the cooling body 1.

[0064] The embodiments of this application increase the flow area between two adjacent flow channels by the above-described settings, thereby increasing the flow speed of the cooling medium and improving the heat dissipation effect of the cooling body 1.

[0065] Figure 8 This is a top view schematic diagram of another cooling structure component (hidden cover) provided for some embodiments of this application.

[0066] like Figure 8 As shown, in some alternative embodiments, the guide member 16 extends in a wavy or square wave shape along its own extension direction.

[0067] Taking the second direction Y as the extension direction of the guide member 16 as an example, the guide member 16 can extend in a wave-like or square-wave shape along the second direction Y. Taking the guide member 16 extending in a square-wave shape along the second direction Y as an example, the square-wave structure of the guide member 16 is planar, which makes the guide member 16 and the cooling body 1 have more contact area, thereby improving the connection strength between the guide member 16 and the cooling body 1.

[0068] The embodiments of this application, through the above-described configuration, enable the guide member 16 to have a larger contact area with the cooling medium, thereby further improving the heat dissipation effect of the cooling body 1.

[0069] Figure 9 This is a bottom view of a cooling structure assembly provided in some embodiments of this application.

[0070] like Figure 9 As shown, in some optional embodiments, the heat dissipation assembly 2 includes a plurality of heat dissipation elements 21 spaced apart, the plurality of heat dissipation elements 21 extending from the recess 12 in a direction away from the first surface 11.

[0071] Optionally, the heat sink 21 can be a plate-shaped structure, for example, the heat sink 21 can be a finned structure. Alternatively, the heat sink 21 can be a block-shaped structure.

[0072] Optionally, multiple heat sinks 21 can be spaced apart along a first direction X. For example, multiple heat sinks 21 can be equally spaced along the first direction X. Alternatively, some heat sinks 21 can be spaced apart along the first direction X, and some heat sinks 21 can be spaced apart along a second direction Y. The first direction X and the second direction Y are intersecting.

[0073] In some examples, the cooling body 1 further includes a second surface disposed opposite to the first surface 11, and the recess 12 is formed by the recess of the second surface. Optionally, the heat sink 21 extends from the recess 12 in a direction away from the first surface 11 until it is flush with the second surface. Alternatively, the heat sink 21 extends from the recess 12 in a direction away from the first surface 11 to a preset position, which may be within the recess 12 or extend beyond the recess 12.

[0074] The embodiments of this application improve the heat dissipation effect of the cooling structure components and enhance the temperature uniformity of the cooling medium within the accommodating space 13 through the above-described settings.

[0075] In some alternative embodiments, the heat sink 21 includes a storage space that is connected to the accommodating space 13.

[0076] With the above configuration, the heat sink 21 includes a storage space, and the cooling medium in the receiving space 13 can flow into the storage space, thereby increasing the contact area between the cooling medium and the cooling body 1 and further improving the heat dissipation effect of the cooling structure component.

[0077] Figure 10 This is a bottom view of a cooling structure assembly provided in some embodiments of this application.

[0078] like Figure 10 As shown, in some optional embodiments, the recessed portion 12 has a preset area 22 on the side opposite to the first surface 11, and a plurality of heat sinks 21 are distributed at intervals around the preset area 22. The heat sink assembly 2 also includes a fan 23, which is located in the preset area 22.

[0079] Optionally, the preset region 22 can be one or more. For example, multiple preset regions 22 are sequentially distributed within the recess 12.

[0080] Optionally, multiple heat sinks 21 radiate around a preset region 22. For example, the preset region 22 may be circular or rectangular in shape, and the multiple heat sinks 21 are distributed in a circular or rectangular pattern around the preset region 22.

[0081] In this embodiment of the application, the fan 23 can improve the heat dissipation effect of the heat sink 21 by setting the heat sink 21 around the preset area 22, thereby maximizing the use of the recessed space of the recessed portion 12.

[0082] Figure 11 This is a cross-sectional structural schematic diagram of another cooling structure component provided in some embodiments of this application. Figure 12 This is a side view of a cooling structure assembly provided in some embodiments of this application.

[0083] like Figure 11 and Figure 12 As shown, in some optional embodiments, the cooling body 1 further includes a mounting hole 24 located on the side wall of the cooling body 1 and communicating with the recess 12. The heat dissipation assembly 2 also includes a fan 23 located inside the mounting hole 24.

[0084] In some examples, the cooling body 1 further includes an extension 18, which is a peripheral structure of the recess 12. Exemplarily, the extension 18 is a portion of the second surface of the cooling body 1 that is not recessed in the thickness direction of the recess 12. Optionally, the mounting hole 24 may extend from the outer wall of the extension 18 into the recess 12.

[0085] Optionally, the number of mounting holes 24 can be one or more.

[0086] Optionally, the mounting hole 24 can be located on the same side as either the inlet 14 or the outlet 15. Alternatively, the mounting hole 24 can be located on opposite sides of the inlet 14 and the outlet 15.

[0087] The embodiments of this application, through the above-described settings, enable the fan 23 to dissipate heat from the heat sink 21 in a preset direction, which is beneficial to improving the heat dissipation effect of the fan 23 on the heat sink 21.

[0088] On the other hand, embodiments of this application also provide a power module device, including any of the cooling structure components described above, and a power module located on the first surface of the cooling structure component.

[0089] Since the wireless communication device provided in this application includes the power amplification module of any of the above embodiments, the wireless communication device provided in this application has the beneficial effects of the power amplification module of any of the above embodiments, and the repeated parts will not be described again here.

[0090] Optionally, the power module includes a power chip, which includes semiconductor chips. Exemplarily, the power chip includes an insulated-gate bipolar transistor (IGBT), a fast recovery diode (FRD), or a metal-oxide-semiconductor field-effect transistor (MOSFET). Of course, the power chip may also include chips of other structures; the power chip can be composed of any one or multiple of the above-mentioned chips.

[0091] Optionally, the power module can be directly fixed to the first surface of the cooling body. For example, the power module can be fixed to the first surface by welding, for example, using solder with good thermal conductivity.

[0092] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A cooling structure assembly for a power module, characterized in that, include: A cooling body includes a first surface, a recess, a receiving space, an inlet, and an outlet. The first surface is located on one side of the cooling body along its own thickness direction. The side of the cooling body opposite to the first surface is recessed to form a recess. A receiving space is provided between the recess and the first surface. The inlet and the outlet are both connected to the receiving space. A heat dissipation assembly is located within the recessed portion. The heat dissipation assembly includes a plurality of heat dissipation components spaced apart. The plurality of heat dissipation components extend from the recessed portion in a direction away from the first surface. The heat dissipation component includes a storage space, which is connected to the receiving space. A preset area is provided on the side of the recessed portion away from the first surface. The plurality of heat dissipation components are spaced apart around the preset area. The heat dissipation assembly also includes a fan located in the preset area. The cooling body further includes a flow guiding assembly located within the accommodating space. The flow guiding assembly includes a plurality of second flow guiding elements spaced apart along a first direction. The second flow guiding elements are abutted against the inner walls of the accommodating space on both sides opposite to each other along a second direction. The second direction intersects with the first direction. The second flow guiding elements include flow guiding holes.

2. The cooling structure assembly according to claim 1, characterized in that, The flow guiding assembly includes a plurality of flow guiding elements spaced apart, at least a portion of which forms a flow channel with the inner wall of the accommodating space.

3. The cooling structure assembly according to claim 2, characterized in that, The flow guiding assembly includes a plurality of first flow guiding elements, which are alternately distributed with a plurality of second flow guiding elements along a first direction, and there is a gap between the first flow guiding elements and at least one of the inner walls on both sides of the accommodating space opposite to each other along the second direction; The flow guide hole connects the flow channel between the adjacent first flow guide and the second flow guide, and the thickness direction of the cooling body, the first direction, and the second direction intersect each other.

4. The cooling structure assembly according to claim 2, characterized in that, The flow guiding assembly includes a plurality of first flow guiding elements and a plurality of second flow guiding elements, wherein the plurality of first flow guiding elements and the plurality of second flow guiding elements are alternately distributed along a first direction. The first flow guiding elements are located on the inner wall of the accommodating space near the first surface and have a gap between them and the inner wall of the accommodating space on the side opposite to the first surface. The second flow guiding elements are located on the inner wall of the accommodating space on the side opposite to the first surface and have a gap between them and the inner wall of the accommodating space near the first surface.

5. The cooling structure assembly according to claim 2, characterized in that, The guide element extends in a wave-like or square-wave shape along its own extension direction.

6. The cooling structure assembly according to claim 1, characterized in that, The cooling body also includes a mounting hole located on the side wall of the cooling body and communicating with the recess. The heat dissipation assembly also includes a fan located inside the mounting hole.

7. A power module device, characterized in that, include: The cooling structure assembly as described in any one of claims 1-6; as well as The power module is located on the first surface of the cooling structure assembly.

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