Heat plate and electronic device

Abstract

The application belongs to the technical field of electronics, and discloses a vapor chamber and electronic equipment. The vapor chamber comprises a shell, a capillary structure, a working medium, a medium driver and a thermoelectric module; the shell is provided with an accommodating cavity; the capillary structure, the working medium and the medium driver are arranged in the accommodating cavity; the capillary structure has an evaporation end and a condensation end; the evaporation end and the condensation end are connected with the thermoelectric module; the thermoelectric module and the medium driver are electrically connected; a temperature difference exists between the evaporation end and the condensation end; the thermoelectric module generates electricity according to the temperature difference to drive the medium driver to work; and the medium driver is used for driving at least part of the working medium to flow from the evaporation end to the condensation end.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electronics, and particularly relates to a vapor chamber and an electronic device. BACKGROUND

[0002] With the improvement of the performance of electronic devices, various functional devices are integrated on the electronic devices, and the electronic devices face increasingly serious heat problems in use. In order to reduce the heat temperature of the electronic device in operation, a vapor chamber is usually used to dissipate heat for the electronic device.

[0003] However, the existing vapor chamber mainly utilizes the phase change cycle of a working medium to achieve passive heat dissipation of the internal heat source of the electronic device, and has the problem of low heat dissipation efficiency, which is difficult to be applied to the heat dissipation scene with large heat generation of the heat source. SUMMARY

[0004] The present application aims to provide a vapor chamber and an electronic device, which at least solve the problem that the existing vapor chamber has low heat dissipation efficiency and is difficult to be applied to the heat dissipation scene with large heat generation of the heat source.

[0005] In order to solve the above technical problems, the present application is implemented as follows:

[0006] In a first aspect, the embodiments of the present application provide a vapor chamber, comprising: a shell, a capillary structure, a working medium, a medium driver and a thermoelectric module;

[0007] The shell has an accommodation cavity formed therein, and the capillary structure, the working medium and the medium driver are arranged in the accommodation cavity;

[0008] The capillary structure has an evaporation end and a condensation end, and the evaporation end and the condensation end are connected with the thermoelectric module, and the thermoelectric module is electrically connected with the medium driver;

[0009] The evaporation end and the condensation end have a temperature difference, the thermoelectric module generates electricity according to the temperature difference to drive the medium driver to work, and the medium driver is used to drive at least part of the working medium to flow from the evaporation end to the condensation end.

[0010] According to the vapor chamber provided by the embodiments of the present application, the flow rate of the working medium when the temperature difference is a first threshold value is greater than the flow rate of the working medium when the temperature difference is a second threshold value, and the first threshold value is greater than the second threshold value.

[0011] According to the vapor chamber provided by the embodiments of the present application, the capillary structure comprises a plurality of conductive bodies, the plurality of conductive bodies are arranged side by side, one end of the plurality of conductive bodies forms the evaporation end, and the other end of the plurality of conductive bodies forms the condensation end.

[0012] According to an embodiment of the present application, a heat plate is provided, the thermoelectric module comprises a P-type semiconductor and an N-type semiconductor;

[0013] The electric conductor comprises a first electric conductor and a second electric conductor, the first electric conductor and the second electric conductor are arranged alternately in sequence;

[0014] Both ends of the first electric conductor are provided with the P-type semiconductor, both ends of the second electric conductor are provided with the N-type semiconductor; the P-type semiconductor and the N-type semiconductor are connected in series through the first electric conductor and the second electric conductor to form a thermocouple pair.

[0015] According to an embodiment of the present application, a heat plate is provided, at least one of the first electric conductor and the second electric conductor comprises a metal conductor.

[0016] According to an embodiment of the present application, a heat plate is provided, the P-type semiconductor is arranged at the evaporation end, the N-type semiconductor is arranged at the condensation end; the medium driver is connected in series between the P-type semiconductor and the N-type semiconductor.

[0017] According to an embodiment of the present application, a heat plate is provided, the medium driver comprises at least one of an air circulation fan, an air suction pump and a blower.

[0018] According to an embodiment of the present application, a heat plate is provided, along the extension direction of the capillary structure, the medium driver is arranged between the evaporation end and the condensation end of the capillary structure.

[0019] According to an embodiment of the present application, a heat plate is provided, the shell comprises a first cover plate and a second cover plate; the first cover plate and the second cover plate are arranged in a stack, the accommodation cavity is surrounded between the first cover plate and the second cover plate; the capillary structure is arranged on the side of the second cover plate facing the first cover plate, and the medium driver is arranged between the capillary structure and the first cover plate.

[0020] In a second aspect, an electronic device is provided, comprising the heat plate as described above.

[0021] In the embodiments of the present application, by arranging the medium driver and the thermoelectric module in the heat plate, since there is a temperature difference between the evaporation end and the condensation end of the capillary structure in the heat plate, the thermoelectric module can generate electricity by using the temperature difference to provide power for the operation of the medium driver, and then drive the working medium in the heat plate to flow from the evaporation end to the condensation end by the medium driver, which helps to improve the phase change circulation efficiency of the working medium, thereby strengthening the heat dissipation effect of the heat plate and ensuring that the heat plate can be applied to the heat dissipation scene with large heat generation of the heat source.

[0022] Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will become apparent to those having ordinary skill in the art upon examination of the following or can be learned from practice of the application. BRIEF DESCRIPTION OF DRAWINGS

[0023] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, including the accompanying drawings, wherein:

[0024] Figure 1 is one of the structure schematic diagrams of the heat plate according to the embodiments of the present application;

[0025] Figure 2 is the second structure schematic diagram of the heat plate according to the embodiments of the present application;

[0026] Figure 3 is the installation structure schematic diagram of the capillary structure and the medium driver in the shell according to the embodiments of the present application;

[0027] Figure 4 is one of the structure schematic diagrams of the combination of the capillary structure and the thermoelectric module to control the energized operation of the medium driver according to the embodiments of the present application;

[0028] Figure 5 is the second structure schematic diagram of the combination of the capillary structure and the thermoelectric module to control the energized operation of the medium driver according to the embodiments of the present application.

[0029] Reference Signs:

[0030] 11, shell; 1101, accommodating cavity; 111, first cover plate; 112, second cover plate;

[0031] 12, capillary structure; 121, evaporation end; 122, condensation end; 1201, first conductive wire; 1202, second conductive wire; 1211, third conductive wire;

[0032] 13, medium driver;

[0033] 14, thermoelectric module; 141, P-type semiconductor; 142, N-type semiconductor. DETAILED DESCRIPTION

[0034] The embodiments of the present application will be described in detail below with reference to the drawings, in which the same or similar components have the same or similar reference numerals throughout. The embodiments described below through reference to the drawings are illustrative only, and are not to be construed as limiting the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of the present application.

[0035] The terms "first", "second" in the description and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally means that the front and rear associated objects are in an "or" relationship.

[0036] In the description of the present application, it should be understood that the terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "inner", "outer", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0037] In the description of the present application, it should be noted that unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0038] The following will be described in detail Figures 1-5 , the uniform heating plate and electronic equipment provided by the embodiments of the present application are described in detail through specific embodiments and application scenarios.

[0039] In the first aspect, as shown in Figure 1 and Figure 2 , the uniform heating plate according to some embodiments of the present application comprises: a shell 11, a capillary structure 12, a working medium, a medium driver 13 and a thermoelectric module 14. The working medium is not specifically shown in Figure 1 and Figure 2 .

[0040] The shell 11 is formed with a containing cavity 1101, and the capillary structure 12, the working medium and the medium driver 13 are arranged in the containing cavity 1101; the capillary structure 12 has an evaporation end 121 and a condensation end 122, the evaporation end 121 and the condensation end 122 are connected with the thermoelectric module 14 respectively, and the thermoelectric module 14 and the medium driver 13 are electrically connected.

[0041] Wherein, the temperature difference exists between the evaporation end 121 and the condensation end 122, and the thermoelectric module 14 generates electricity according to the temperature difference to drive the medium driver 13 to work; the medium driver 13 is used to drive at least part of the working medium to flow from the evaporation end 121 to the condensation end 122.

[0042] It can be understood that the vapor chamber is a heat dissipation device which uses the phase change cycle of the working medium to achieve the heat dissipation of the heat source inside the electronic device, and the working process mainly includes four stages of evaporation, convection, condensation and reflux.

[0043] In the evaporation stage, the liquid working medium absorbs heat at the evaporation end 121 of the capillary structure 12 to change into gaseous working medium; in the convection stage, the gaseous working medium flows from the evaporation end 121 of the capillary structure 12 to the condensation end 122 of the capillary structure 12 under the driving of the medium driver 13; in the condensation stage, the gaseous working medium condenses into liquid working medium when contacting the condensation end 122 and releases heat; in the reflux stage, the liquid working medium returns from the condensation end 122 of the capillary structure 12 to the evaporation end 121 of the capillary structure 12 by capillary suction, thereby completing a complete phase change cycle of the working medium. Wherein, the direction of the phase change cycle of the working medium is specifically shown by arrows in Figure 1 and Figure 2 .

[0044] Since the gaseous working medium flows from the evaporation end 121 of the capillary structure 12 to the condensation end 122 of the capillary structure 12 in the phase change cycle of the working medium, the medium driver 13 of the embodiment of the application can be a movable driving plate or a fixed fan to realize the directional driving of the gaseous working medium from the evaporation end 121 of the capillary structure 12 to the condensation end 122 of the capillary structure 12.

[0045] The thermoelectric module 14 can be a thermoelectric power generation structure based on the Seebeck effect. When the vapor chamber contacts the heat source near the evaporation end 121, the temperature of the evaporation end 121 of the capillary structure 12 is higher than that of the condensation end 122, and the thermoelectric module 14 can generate an electromotive force acting on the medium driver 13 under the action of the temperature difference between the evaporation end 121 and the condensation end 122, so as to ensure that the medium driver 13 can work.

[0046] Of course, in order to ensure the reliability of the operation of the medium driver 13, the thermoelectric module 14 can be connected with an energy storage module, and the energy storage module is connected with the medium driver 13. In this way, during the continuous or intermittent use of the vapor chamber, the electrical energy generated by the medium driver 13 is directly stored in the energy storage module, and the energy storage module provides working voltage for the medium driver 13.

[0047] In practical applications, the vapor chamber of the embodiment of the present application can be applied to electronic devices to dissipate heat from components on the circuit board in the electronic devices. Since the thermoelectric module 14 can generate electricity by using the temperature difference between the evaporation end 121 and the condensation end 122 to ensure the operation of the medium driver 13, the vapor chamber does not need an external power supply device, thereby reducing the power consumption of the electronic device.

[0048] As can be seen from the above, by arranging the medium driver 13 and the thermoelectric module 14 in the vapor chamber, since there is a temperature difference between the evaporation end and the condensation end of the capillary structure 12 in the vapor chamber, the thermoelectric module 14 can generate electricity by using the temperature difference to provide power for the operation of the medium driver 13, and then the medium driver 13 drives the working medium in the vapor chamber to flow from the evaporation end 121 to the condensation end 122, which helps to improve the phase change circulation efficiency of the working medium, thereby enhancing the heat dissipation effect of the vapor chamber and ensuring that the vapor chamber can be applied to heat dissipation scenarios with large heat generation of the heat source.

[0049] It should be pointed out here that the medium driver 13 of the embodiment is mainly used to drive the gaseous working medium to flow from the evaporation end 121 of the capillary structure 12 to the condensation end 122 of the capillary structure 12, but the medium driver 13 does not affect the return flow of the liquid working medium from the condensation end 122 to the evaporation end 121 of the capillary structure 12 in operation.

[0050] In some embodiments, the flow rate of the working medium when the temperature difference is a first threshold value is greater than the flow rate of the working medium when the temperature difference is a second threshold value; wherein the first threshold value is greater than the second threshold value.

[0051] Specifically, the flow rate of the working medium from the evaporation end 121 to the condensation end 122 is determined by the size of the electromotive force applied to the medium driver 13 by the thermoelectric module 14.

[0052] The greater the heat generation of the heat source, the greater the temperature difference between the evaporation end 121 and the condensation end 122, the greater the electromotive force generated by the thermoelectric module 14 acting on the medium driver 13, and the greater the flow rate of the working medium under the driving of the medium driver 13, which not only ensures that the gaseous working medium can reach the condensation end 122 of the capillary structure 12 and condense into liquid working medium, but also accelerates the flow rate of the working medium in the convection stage, thereby ensuring that the phase change circulation process of the working medium can be continuously carried out and maintaining a high circulation efficiency of the working medium, thereby improving the heat dissipation efficiency of the vapor chamber and preventing the temperature of the heat source from rising rapidly.

[0053] Correspondingly, when the heat generation amount of the heat source decreases, the temperature difference between the evaporation end 121 and the condensation end 122 decreases, the electromotive force generated by the thermoelectric module 14 acting on the medium driver 13 decreases, and the flow rate of the working medium driven by the medium driver 13 decreases, so that the heat spreader operates with relatively low heat dissipation efficiency.

[0054] Therefore, according to the change of the heat generation amount of the heat source, the heat dissipation efficiency of the heat spreader of the embodiment of the present application can be adaptively adjusted, so as to ensure that the heat generation temperature of the heat source is always maintained in the safe range, and the performance of the electronic equipment is not affected by the excessively high temperature of the heat source.

[0055] In some embodiments, as shown in Figure 2 The plurality of conductors are arranged side by side, one end of the plurality of conductors is formed as the evaporation end 121, and the other end of the plurality of conductors is formed as the condensation end 122.

[0056] It can be understood that the conductors can be metal conductors or graphite conductors. The metal conductors can be metal wires, and the graphite conductors can be graphite wires.

[0057] In actual application, the plurality of conductors are spaced apart from each other, the adjacent conductors are electrically isolated, and the plurality of conductors are arranged side by side to form the capillary structure 12.

[0058] When the working medium is in the reflux stage of the phase change cycle, the liquid working medium can move along the extension direction of the conductors under the guidance of the capillary suction to realize reflux from the condensation end 122 to the evaporation end 121.

[0059] In some embodiments, as shown in Figure 4 The thermoelectric module 14 includes a P-type semiconductor 141 and an N-type semiconductor 142.

[0060] The conductors include a first conductive wire 1201 and a second conductive wire 1202, and the first conductive wire 1201 and the second conductive wire 1202 are arranged alternately.

[0061] Both ends of the first conductive wire 1201 are provided with the P-type semiconductor 141, and both ends of the second conductive wire 1202 are provided with the N-type semiconductor 142; the P-type semiconductor 141 and the N-type semiconductor 142 are connected in series with the first conductive wire 1201 and the second conductive wire 1202 to form a thermocouple pair.

[0062] It can be understood that the first conductive wire 1201 and the second conductive wire 1202 are provided with a plurality of conductors, and the plurality of first conductive wires 1201 and the plurality of second conductive wires 1202 can be arranged along the length direction of the heat spreader, and the first conductive wire 1201 and the second conductive wire 1202 can be arranged alternately along the width direction of the heat spreader.

[0063] The first conductive wire 1201 and the second conductive wire 1202 are insulated from each other, and the first conductive wire 1201 and the second conductive wire 1202 are insulated from the shell 11 of the vapor chamber.

[0064] The first conductive wire 1201 and the second conductive wire 1202 are sequentially and alternately arranged, and the first conductive wire 1201 and the second conductive wire 1202 are sequentially and alternately connected through the P-type semiconductor 141 and the N-type semiconductor 142 to form a series power generation circuit. That is, the P-type semiconductor 141 and the N-type semiconductor 142 are connected in series as a galvanic couple through the first conductive wire 1201 and the second conductive wire 1202.

[0065] The first end of the series power generation circuit is the P-type semiconductor 141, the second end of the series power generation circuit is the N-type semiconductor 142, and the dielectric driver 13 is connected in series between the first end and the second end of the series power generation circuit.

[0066] Based on the above arrangement, the first conductive wire 1201 and the second conductive wire 1202 of the embodiment of the present application not only guide the liquid working medium to flow back from the condensation end 122 of the capillary structure 12 to the evaporation end 121, but also the first conductive wire 1201 serves as a wire for electrically connecting between two P-type semiconductors 141, and the second conductive wire 1202 serves as a wire for electrically connecting between two N-type semiconductors 142.

[0067] Since the evaporation end 121 of the capillary structure 12 is a high-temperature end, the condensation end 122 of the capillary structure 12 is a low-temperature end, and the plurality of first conductive wires 1201 and the plurality of second conductive wires 1202 are sequentially and alternately connected through the P-type semiconductor 141 and the N-type semiconductor 142, under the action of the temperature difference between the evaporation end 121 and the condensation end 122, the electrons and holes in the P-type semiconductor 141 and the N-type semiconductor 142 move directionally to generate an electric current, which flows sequentially along the first conductive wire 1201 and the second conductive wire 1202, thereby realizing the series connection of a plurality of power generation circuit units along the first conductive wire 1201 and the second conductive wire 1202, and obtaining a series power generation circuit capable of generating a potential difference between the two ends of the dielectric driver 13. In this embodiment, the flow direction of the current I in the first conductive wire 1201 and the second conductive wire 1202 is specifically shown by arrows. Figure 4

[0068] It can be seen that the embodiment of the present application not only realizes the integrated design of the thermoelectric module 14 and the capillary structure 12, and reduces the occupation of the internal space of the vapor chamber, but also based on the design of the series power generation circuit, the power generation current applied to the dielectric driver 13 can be ensured.

[0069] ​In some embodiments, to reduce the loss of the capillary structure 12 in use for current transmission, at least one of the first conductive wire 1201 and the second conductive wire 1202 comprises a metal conductor.

[0070] Optionally, both the first conductive wire 1201 and the second conductive wire 1202 adopt a metal conductor. Optionally, the metal conductor is a copper wire.

[0071] In some embodiments, as shown in FIG. 1, the thermoelectric module 14 of the present application comprises a P-type semiconductor 141 and an N-type semiconductor 142. Figure 5

[0072] The P-type semiconductor 141 is arranged at the evaporation end 121 of the capillary structure 12, and the N-type semiconductor 142 is arranged at the condensation end 122 of the capillary structure 12; the medium driver 13 is connected in series between the P-type semiconductor 141 and the N-type semiconductor 142.

[0073] Specifically, the capillary structure 12 of the present application can be arranged to comprise a plurality of third conductive wires 1211 arranged side by side. Optionally, the plurality of third conductive wires 1211 can be arranged to extend along the length direction of the vapor chamber, and the plurality of third conductive wires 1211 can be arranged alternately along the width direction of the vapor chamber.

[0074] Further, the plurality of third conductive wires 1211 of the present application are arranged to be insulated from each other, and each third conductive wire 1211 is arranged to be insulated from the shell 11 of the vapor chamber. At the same time, the portion of each third conductive wire 1211 corresponding to the evaporation end 121 is provided with a P-type semiconductor 141, and each P-type semiconductor 141 is connected to one end of the medium driver 13; the portion of each third conductive wire 1211 corresponding to the condensation end 122 is provided with an N-type semiconductor 142, and each N-type semiconductor 142 is connected to the other end of the medium driver 13.

[0075] Since the evaporation end 121 of the capillary structure 12 is a high-temperature end, and the condensation end 122 of the capillary structure 12 is a low-temperature end, under the action of the temperature difference between the evaporation end 121 and the condensation end 122, the electrons and holes in the P-type semiconductor 141 and the N-type semiconductor 142 move directionally, and along each third conductive wire 1211, a current flowing from the evaporation end 121 to the condensation end 122 is generated, thereby realizing the parallel connection of a plurality of power generation circuit units, and obtaining a parallel power generation circuit capable of generating a potential difference between the two ends of the medium driver 13. In the present embodiment, the flow direction of the current I in each third conductive wire 1211 is specifically shown by an arrow. Figure 5

[0076] ​​Therefore, the embodiment of the present application not only realizes the integrated design of the thermoelectric module 14 and the capillary structure 12, and reduces the occupation of the internal space of the vapor chamber, but also ensures the power generation voltage applied to the medium driver 13 based on the design of the parallel power generation circuit.

[0077] In some embodiments, as shown in Figure 1 and Figure 2 The medium driver 13 of the embodiment of the present application includes at least one of an air circulation fan, an air suction pump and an air blower.

[0078] Optionally, the medium driver 13 is configured as an air circulation fan, which is fixedly arranged in the accommodating cavity 1101, and is used to drive the gaseous working medium to flow from the evaporation end 121 of the capillary structure 12 to the condensation end 122 of the capillary structure 12.

[0079] When the heat generation of the heat source is greater, the temperature difference between the evaporation end 121 and the condensation end 122 is greater, the electromotive force generated by the thermoelectric module 14 acting on the air circulation fan is greater, the air circulation fan will operate at a relatively high speed, and the flow rate of the working medium under the driving of the air circulation fan is greater, thereby ensuring that the working medium can maintain a high circulation efficiency, and further improving the heat dissipation efficiency of the vapor chamber, preventing the temperature of the heat source from rising rapidly.

[0080] Correspondingly, when the heat generation of the heat source is reduced, the temperature difference between the evaporation end 121 and the condensation end 122 is reduced, the electromotive force generated by the thermoelectric module 14 acting on the air circulation fan is reduced, the air circulation fan operates at a relatively low speed, and the flow rate of the working medium under the driving of the air circulation fan is reduced, and the vapor chamber operates at a relatively small heat dissipation efficiency. At this time, the heat dissipation efficiency of the vapor chamber is equivalent to that of a conventional vapor chamber, and the noise of the air circulation fan during operation is smaller.

[0081] In some embodiments, as shown in Figures 1-3 The embodiment can be arranged between the evaporation end 121 and the condensation end 122 of the capillary structure 12 along the extension direction of the capillary structure 12, so as to conveniently drive the gaseous working medium to flow from the evaporation end 121 to the condensation end 122, and ensure the flow rate of the working medium.

[0082] Optionally, the medium driver 13 can be arranged at a middle position between the evaporation end 121 and the condensation end 122 along the extension direction of the capillary structure 12.

[0083] In some embodiments, as shown in Figure 1 and Figure 2As shown, the housing 11 of the vapor chamber includes a first cover plate 111 and a second cover plate 112; the first cover plate 111 and the second cover plate 112 are arranged in a stack, and a receiving cavity 1101 is formed between the first cover plate 111 and the second cover plate 112; the capillary structure 12 is arranged on the side of the second cover plate 112 facing the first cover plate 111, and the medium driver 13 is arranged between the capillary structure 12 and the first cover plate 111.

[0084] Specifically, the medium driver 13 can be an air circulation fan, and the rotation axis of the air circulation fan is perpendicular to the surface of the first cover plate 111 or the second cover plate 112.

[0085] In the thickness direction of the vapor chamber, the medium driver 13 can be arranged on the upper side of the capillary structure 12 to ensure that the medium driver 13 can reliably drive the gaseous working medium to flow from the evaporation end 121 to the condensation end 122, and prevent the working state of the medium driver 13 from affecting the backflow of the liquid working medium along the capillary structure 12.

[0086] In a second aspect, the embodiments of the present application provide an electronic device including the vapor chamber according to any one of the above.

[0087] In the electronic device, the circuit board, the vapor chamber, the graphite heat dissipation sheet, and the middle frame are arranged in a stack. The plurality of components on the side of the circuit board facing the vapor chamber can generate heat, and the plurality of components include a processor and a semiconductor power device. The plurality of components are in contact with the evaporation end of the vapor chamber.

[0088] Therefore, in actual application, the heat generated by the plurality of components on the circuit board can be dissipated by the vapor chamber, and the vapor chamber can quickly conduct the heat to the middle frame through the graphite heat dissipation sheet, thereby preventing the temperature of the plurality of components on the circuit board from being too high and ensuring the normal operation of the electronic device.

[0089] Since the electronic device according to the embodiments of the present application includes the vapor chamber, the specific structure of the vapor chamber is the same as that of the above-mentioned embodiments. Therefore, the electronic device according to the embodiments of the present application includes all the technical solutions of the above-mentioned embodiments, and at least has all the beneficial effects of the above-mentioned embodiments, which will not be repeated here.

[0090] In the present application, the electronic device can be a mobile terminal, such as a smart phone, a tablet personal computer (Tablet Personal Computer), a laptop computer (Laptop Computer), a personal digital assistant (personal digital assistant, PDA for short), a mobile Internet device (Mobile Internet Device, MID for short), or a wearable device (Wearable Device), and the like, and can also be other electronic devices, such as a digital camera, an electronic book, a navigator, and the like, which are not limited herein.

[0091] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0092] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A vapor chamber, characterized by, The application relates to a thermosiphon, which comprises a housing, a capillary structure, a working medium, a medium driver and a thermoelectric module. The housing is provided with a containing cavity, and the capillary structure, the working medium, the medium driver and the thermoelectric module are arranged in the containing cavity. The capillary structure has an evaporation end and a condensation end, and comprises a plurality of conductive bodies. The conductive bodies are arranged side by side, and one end of the conductive bodies is formed into the evaporation end, and the other end of the conductive bodies is formed into the condensation end. The evaporation end and the condensation end are connected with the thermoelectric module respectively, and the thermoelectric module and the medium driver are electrically connected.

2. The vapor chamber of claim 1, wherein The thermoelectric module generates electricity according to the temperature difference between the evaporation end and the condensation end, so as to drive the medium driver to work. The working medium has a flow rate when the temperature difference is a first threshold value, and the working medium has a flow rate when the temperature difference is a second threshold value.

3. The vapor chamber of claim 1, wherein The first threshold value is greater than the second threshold value. The thermoelectric module comprises a P-type semiconductor and an N-type semiconductor. The conductive bodies comprise first conductive wires and second conductive wires, and the first conductive wires and the second conductive wires are arranged alternately.

4. The vapor chamber of claim 3, wherein Both ends of the first conductive wires are provided with the P-type semiconductor, and both ends of the second conductive wires are provided with the N-type semiconductor.

5. The vapor chamber of claim 3, wherein The P-type semiconductor and the N-type semiconductor are connected in series through the first conductive wires and the second conductive wires to form a galvanic couple.

6. The vapor chamber of any one of claims 1 to 5, wherein At least one of the first conductive wires and the second conductive wires comprises a metal conductor.

7. The vapor chamber of any one of claims 1 to 5, wherein The P-type semiconductor is arranged at the evaporation end, and the N-type semiconductor is arranged at the condensation end.

8. The vapor chamber of any one of claims 1 to 5, wherein The medium driver is connected in series between the P-type semiconductor and the N-type semiconductor. The medium driver comprises at least one of an air circulation fan, an air suction pump and an air blower.

9. An electronic device, comprising: The medium driver is arranged between the evaporation end and the condensation end of the capillary structure along the extension direction of the capillary structure. The housing comprises a first cover plate and a second cover plate. The first cover plate and the second cover plate are arranged in a stack, and the containing cavity is formed between the first cover plate and the second cover plate. The capillary structure is arranged on the side of the second cover plate facing the first cover plate, and the medium driver is arranged between the capillary structure and the first cover plate. The application further relates to a thermosiphon comprising the thermosiphon according to any one of claims 1 to 8.

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