Flexible cover plate and manufacturing method thereof, display module, and display device

Abstract

The present disclosure relates to a flexible cover plate, which includes a base film and a first hardened layer. The first hardened layer includes a prestressed portion and a stress-free portion. The shrinkage rate of the prestressed portion is greater than that of the stress-free portion, so that the prestressed portion has a greater internal stress than the stress-free portion, which will drive the base film on one side of the first hardened layer to deform, thereby deforming the bending area of ​​the flexible cover plate. After deformation, a preset depression will appear in the bending area of ​​the flexible cover plate. After folding outward, the crease position of the flexible cover plate is still depressed, so the flexible cover plate can reduce the crease. When the flexible cover plate is folded inward, the depression can offset the bending creep in the opposite direction during the bending process, and for the flexible cover plate that is folded outward and then inward, the reverse folding phenomenon can be prevented. The present disclosure also provides a display module including the above-mentioned flexible cover plate. The present disclosure also provides a display device including the above-mentioned display module.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a flexible cover plate and a manufacturing method thereof, a display module, and a display device. Background Art

[0002] With the development of foldable display devices, a single folding function can no longer meet everyone's needs. There is a demand for new forms and more advanced user experience. Two-way bending is one of the development directions.

[0003] After the flexible cover is folded outward, the creep of the polymer will leave a certain bulge in the folded area. If it is bent inward again, the bulge will not be able to sink and will fold back, which will cause damage to the display module.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Summary of the Invention

[0005] The purpose of the present disclosure is to overcome the problem that the protruding portion of the flexible cover cannot be sunken and folds back when it is bent inward after being folded outward, and to provide a flexible cover and a manufacturing method thereof, a display module and a display device.

[0006] According to one aspect of the present disclosure, a flexible cover plate is provided, which has a bending area and straight areas located at both ends of the bending area along the extension direction of the cover plate, and is characterized in that, along the thickness direction of the flexible cover plate, the flexible cover plate includes a base film and a first hardened layer; the first hardened layer is arranged on one side of the base film, and the first hardened layer has a prestressed portion and stress-free portions located on both sides of the prestressed portion, the prestressed portion is located in the bending area, and the stress-free portion is located in the straight area, and the shrinkage rate of the prestressed portion is greater than the shrinkage rate of the stress-free portion.

[0007] In one embodiment of the present disclosure, along the thickness direction of the flexible cover plate, the base film includes at least a partial reinforcement layer, the reinforcement layer includes a first reinforcement part and a second reinforcement part located on both sides of the first reinforcement part, the first reinforcement part is located in the bending area, the second reinforcement part is located in the straight area, and the tension of the first reinforcement part is greater than that of the second reinforcement part.

[0008] In one embodiment of the present disclosure, the orthographic projection of the first reinforcement portion on the base film coincides with the orthographic projection of the prestressed portion on the base film, and the orthographic projection of the second reinforcement portion on the base film coincides with the orthographic projection of the stress-free portion on the base film.

[0009] In one embodiment of the present disclosure, along the thickness direction of the flexible cover plate, the base film includes a non-reinforced layer and a reinforced layer, the non-reinforced layer is arranged adjacent to the first hardened layer, and the reinforced layer is arranged on the side of the non-reinforced layer away from the first hardened layer, and the tension of the non-reinforced layer is less than the tension of the reinforced layer.

[0010] In one embodiment of the present disclosure, the supporting flexible cover plate further includes a second hardening layer, and the second hardening layer is provided on a side of the base film away from the first hardening layer.

[0011] In one embodiment of the present disclosure, the material of the base film includes one or more of polyimide, polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, polyurethane, polyaramid, and acrylic.

[0012] In one embodiment of the present disclosure, the material of the first hardening layer includes acrylate.

[0013] According to another aspect of the present disclosure, a method for manufacturing a flexible cover is provided, the method comprising: providing a base film; forming a prestressed portion and a stress-free portion on one side of the base film, so that the shrinkage rate of the prestressed portion is greater than the shrinkage rate of the stress-free portion.

[0014] In one embodiment of the present disclosure, a prestressed portion and a stress-free portion are formed on one side of the base film so that the shrinkage rate of the prestressed portion is greater than the shrinkage rate of the stress-free portion, comprising: applying a first solution to a portion of the base film located in a bending area and curing it to form a prestressed portion, wherein the solid content in the first solution is 20% to 40%; applying a second solution to a portion of the base film located in a straight area and curing it to form a stress-free portion, wherein the solid content in the second solution is 10% to 30%.

[0015] In one embodiment of the present disclosure, the first solution includes a first monomer, which is an acrylate system, and the second solution includes a second monomer, which is a polyurethane system or a polyimide system.

[0016] In one embodiment of the present disclosure, the solidification time of the first solution is 10 min-30 min, and the solidification time of the second solution is 0.5 min-10 min.

[0017] In one embodiment of the present disclosure, the method further includes: soaking the portion of the base film located in the bent area with a first strengthening liquid; soaking the portion of the base film located in the straight area with a second strengthening liquid; the concentration of the first strengthening liquid is greater than the concentration of the second strengthening liquid, and / or the soaking time of the first strengthening liquid is greater than the soaking time of the second strengthening liquid.

[0018] According to another aspect of the present disclosure, a display module is provided, comprising the flexible cover provided in any one aspect of the present disclosure.

[0019] According to yet another aspect of the present disclosure, a display device is provided, comprising the display module provided by yet another aspect of the present disclosure.

[0020] The flexible cover plate disclosed in the present invention includes a base film and a first hardened layer. The first hardened layer includes a prestressed portion and a stress-free portion. The shrinkage rate of the prestressed portion is greater than that of the stress-free portion, so that the prestressed portion has a greater internal stress than the stress-free portion, which will drive the base film on one side of the first hardened layer to deform, thereby deforming the bending area of ​​the flexible cover plate. After deformation, a preset depression will appear in the bending area of ​​the flexible cover plate. After folding outward, the crease position of the flexible cover plate is still depressed, so the flexible cover plate can reduce the crease. When the flexible cover plate is folded inward, the depression can offset the bending creep in the opposite direction during the bending process. For the flexible cover plate that is folded outward and then inward, the reverse folding phenomenon can be prevented.

[0021] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0023] Figure 1 This is a schematic diagram of a flexible cover plate folded outward according to an embodiment of the present disclosure.

[0024] Figure 2 This is a schematic diagram of a flexible cover plate according to an embodiment of the present disclosure after being folded outward and then flattened.

[0025] Figure 3 This is a schematic diagram of a flexible cover plate folded inward and then folded back according to an embodiment of the present disclosure.

[0026] Figure 4 This is a schematic diagram of another flexible cover plate according to an embodiment of the present disclosure in a state where the cover plate is folded inward but not folded back.

[0027] Figure 5 This is a top view of another flexible cover plate involved in an embodiment of the present disclosure.

[0028] Figure 6 It is a cross-sectional schematic diagram of another flexible cover involved in an embodiment of the present disclosure.

[0029] Figure 7 This is a schematic diagram of another flexible cover plate according to an embodiment of the present disclosure having a preset depression in the bending area.

[0030] Figure 8 This is a cross-sectional schematic diagram of another flexible cover plate involved in an embodiment of the present disclosure.

[0031] Figure 9 Schematic cross-sectional view of another flexible cover according to an embodiment of the present disclosure.

[0032] Figure 10 This is a flow chart of another method for manufacturing a flexible cover according to an embodiment of the present disclosure.

[0033] Figure 11 Schematic diagram of the structure of the display substrate involved in the embodiment of the present disclosure.

[0034] In the figure: 1-array substrate, 11-base substrate, 12-buffer layer, 13-driving circuit layer, 131-active layer, 1311-active portion, 132-gate insulating layer, 133-gate layer, 1331-gate, 134-interlayer dielectric layer, 135-source and drain metal layer, 1351-source electrode, 1352-drain electrode, 136-protective layer, 137-planarization layer; 2-pixel layer, 21-pixel definition layer, 22-stacked electroluminescent device, 221-first electrode, 222-light-emitting layer group, 223- Second electrode, 3-encapsulation layer group, 31-first inorganic encapsulation layer, 32-organic encapsulation layer, 33-second inorganic encapsulation layer; 4-color filter substrate, 41-black matrix, 42-sub-filter unit, 43-encapsulation substrate, 5-flexible cover, 501-bending area, 502-straight area, 51-base film, 511-reinforcement layer, 5111-first reinforcement part, 5112-second reinforcement part, 512-non-reinforcement layer, 52-first hardened layer, 521-prestressed part, 522-stress-free part, 53-second hardened layer. DETAILED DESCRIPTION

[0035] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the figures represent identical or similar structures, and thus their detailed descriptions will be omitted. Furthermore, the figures are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0036] Although relative terms such as "upper" and "lower" are used in this specification to describe the relationship of one illustrated component to another, these terms are used herein for convenience only, such as in accordance with the orientation of the illustrations in the accompanying drawings. It will be understood that if the illustrated device were flipped upside down, the component described as "upper" would become the component "lower." When a structure is referred to as "on" another structure, this may mean that the structure is integrally formed with the other structure, that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via the other structure.

[0037] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express open-ended inclusion and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used only as labels and are not intended to limit the quantity of their objects.

[0038] like Figure 1 As shown, after the flexible cover plate 5 is folded outward, a certain bulge will remain in the bending area 501 due to the creep of the polymer. Figure 2 As shown in FIG, after the flexible display panel is folded outward and flattened, the creep of the polymer will cause the display panel to bulge at the crease position. Figure 3 As shown, if the device is bent inward again in the convex state, the protrusion cannot be sunken, the position of the protrusion maintains the same deformation direction, and a reverse bending phenomenon occurs, which may cause damage to the display module.

[0039] Based on this, the embodiment of the present disclosure provides a flexible cover. Figures 4 to 10 As shown, along the extension direction of the cover plate, the flexible cover plate 5 has a bending area 501 and straight areas 502 located at both ends of the bending area 501. Along the thickness direction of the flexible cover plate 5, the flexible cover plate 5 includes a base film 51 and a first hardening layer 52. The first hardening layer 52 is arranged on one side of the base film 51. The first hardening layer 52 has a prestressed portion 521 and a stress-free portion 522 located on both sides of the prestressed portion 521. The prestressed portion 521 is located in the bending area 501, and the stress-free portion 522 is located in the straight area 502. The shrinkage rate of the prestressed portion 521 is greater than the shrinkage rate of the stress-free portion 522.

[0040] The first hardened layer 52 includes a prestressed portion 521 and a stress-free portion 522. The shrinkage rate of the prestressed portion 521 is greater than that of the stress-free portion 522, so that the prestressed portion 521 has a greater internal stress than the stress-free portion 522, which will drive the base film 51 on one side of the first hardened layer 52 to deform, thereby deforming the bending area 501 of the flexible cover plate 5. After deformation, a preset depression will appear in the bending area 501 of the flexible cover plate 5. After folding outward, the crease position of the flexible cover plate 5 is still depressed, which can reduce the crease. When the flexible cover plate 5 is folded inward, the depression can offset the bending creep in the opposite direction during the bending process. Therefore, the flexible cover plate 5 presents the following for the flexible cover plate 5 that is folded outward and then folded inward. Figure 4 The state shown can prevent the occurrence of folding.

[0041] like Figure 5 and Figure 6 As shown, along the extension direction of the flexible cover plate 5, the flexible cover plate 5 has a bent region 501 and straight regions 502 located at both ends of the bent region 501. Along the thickness direction of the flexible cover plate 5, the flexible cover plate 5 includes a base film 51 and a first hardening layer 52, which is provided on one side of the base film 51. The material of the base film 51 can be, but is not limited to, one or more of polyimide, polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, polyurethane, polyaramid, and acrylic. The primary material of the first hardening layer 52 is a coating made primarily of acrylic acid.

[0042] The portion of the first hardened layer 52 located in the bending area 501 is defined as a prestressed portion 521, and the portion of the first hardened layer 52 located in the straight area 502 is defined as a stress-free portion 522. The portion of the first hardened layer 52 located in the bending area 501 has a greater shrinkage rate or greater internal stress than the portion located in the straight area 502, that is, the prestressed portion 521 has a greater shrinkage rate or greater internal stress than the stress-free portion 522.

[0043] like Figure 7 As shown, the prestressed portion 521 will cause the base film 51 to deform, and a preset depression will appear on the deformed flexible cover plate 5. The depression can offset the bending creep in the opposite direction during the bending process. The flexible cover plate 5 can reduce creases and prevent the occurrence of reverse folding for products that are folded outward and then inward.

[0044] like Figure 8As shown, the first hardened layer 52 and the base membrane 51 in the figure can be combined to enhance the prestressing setting based on the inherent strengthening properties of the base membrane 51. Along the thickness direction of the cover plate, the base membrane 51 includes a non-reinforced layer 512 and a strengthened layer 511. The non-reinforced layer 512 is arranged adjacent to the first hardened layer 52, and the strengthened layer 511 is arranged on the side of the non-reinforced layer 512 away from the first hardened layer 52. The non-reinforced layer 512 can be considered to be tension-free relative to the strengthened layer 511.

[0045] The portion of the reinforcement layer 511 located in the bent region 501 is defined as a first reinforcement portion 5111, and the portion of the reinforcement layer 511 located in the straight region 502 is defined as a second reinforcement portion 5112. The tension in the portion of the reinforcement layer 511 located in the bent region 501 is greater than the tension in the portion located in the straight region 502. In other words, the tension in the first reinforcement portion 5111 is greater than the tension in the second reinforcement portion 5112. This structure causes the non-reinforced layer 512 to deform downward, causing the base film 51 to warp upward, thereby causing the flexible cover 5 to experience a greater degree of pre-deformation.

[0046] In order to synchronize the deformation of the base film 51 and the deformation area of ​​the first hardening layer 52 and ensure the pre-deformation effect of the flexible cover plate 5, the orthographic projection of the first reinforcing portion 5111 on the base film 51 coincides with the orthographic projection of the prestressed portion 521 on the base film 51, and the orthographic projection of the second reinforcing portion 5112 on the base film 51 coincides with the orthographic projection of the unstressed portion 522 on the base film 51.

[0047] like Figure 9 As shown, the flexible cover plate 5 may further include a second hardened layer 53. The second hardened layer 53 is disposed on the side of the base film 51 facing away from the first hardened layer 52, that is, the second hardened layer 53 is disposed on the side of the non-reinforced layer 512 facing away from the first hardened layer 52. It is understood that the first hardened layer 52 and the second hardened layer 53 are disposed on opposite sides of the base film 51. The first hardened layer 52 and the second hardened layer 53 provide double-sided protection for the flexible cover plate 5, effectively protecting the base film 51. They have high hardness, good wear resistance, and excellent deformation resistance.

[0048] The present disclosure also provides a method for manufacturing a flexible cover. Figure 10 As shown, the method includes:

[0049] Step S10, providing a base film;

[0050] In step S20 , a prestressed portion and a stress-free portion are formed on one side of the base film, so that the shrinkage rate of the prestressed portion is greater than that of the stress-free portion.

[0051] The beneficial effects of this manufacturing method can be referred to the beneficial effects of the flexible cover plate, and will not be described in detail here.

[0052] See also Figures 4 to 9The manufacturing method of the flexible cover plate involved in the present disclosure is described in detail below with reference to specific embodiments.

[0053] In step S20 , a prestressed portion 521 and a stress-free portion 522 are formed on one side of the base film 51 , such that a shrinkage rate of the prestressed portion 521 is greater than a shrinkage rate of the stress-free portion 522 .

[0054] The first solution is applied to the portion of the base film 51 located in the bending area 501 and solidified to form a prestressed portion 521; the second solution is applied to the portion of the base film 51 located in the straight area 502 and solidified to form a stress-free portion 522. The prestressed portion 521 and the stress-free portions 522 on both sides constitute a first hardened layer 52.

[0055] Specifically, the first solution is placed in a container of a coating device and then applied to the prestressed portion 521 of the base film 51 using a roller. The second solution is placed in a container of the coating device and then applied to the unstressed portion 522 of the base film 51 using a roller. The base film 51 coated with the first and second solutions is then placed in an oven for a baking time of 10 minutes to 2 hours.

[0056] The solution for preparing the first hardened layer 52 is formed by mixing the desired monomers with a solvent. To ensure that the shrinkage of the prestressed portion 521 is greater than that of the unstressed portion 522, different monomers are used to prepare the solutions. A first monomer is mixed with the solvent to form a first solution, and a second monomer is mixed with the solvent to form a second solution. The first monomer can be an acrylate or polyurethane system, while the second solution can be a polyurethane or polyimide system.

[0057] According to the requirements, the solid content in the solution can generally be designed to be 10% to 40%. On the basis of the above, it can also be achieved by distinguishing the solid content of the solution of the stress-free part 522 and the prestressed part 521, setting the solid content of the first solution to 20% to 40% and the solid content of the second solution to 10% to 30%. It should be noted that the solid content refers to the mass percentage remaining after the solution is heated. The greater the solid content of the solution, the smaller the shrinkage after solidification.

[0058] The curing time can also be varied. The curing time of the solution in the prestressed portion 521 can be set to 10-30 minutes, while the curing time of the solution in the stress-free portion 522 can be set to 0.5-10 minutes. It should be noted that the curing time refers to the duration of heating, and the heating stage is the volatilization stage of the solvent in the solution. The longer the heating time, the more complete the solvent volatilization, which in turn makes the shrinkage rate of the prestressed portion 521 greater than the shrinkage rate of the stress-free portion 522.

[0059] The pre-deformation of the bending region 501 of the flexible cover 5 can be increased by differentiating the tension of the base film 51 in the bending region 501 and the straight region 502. The base film 51 can be partially strengthened by physical or chemical strengthening to form a strengthening layer 511. The strengthening layer 511 can be formed by soaking the base film 51 in a strengthening liquid. The first strengthening portion 5111 and the second strengthening portion 5112 can be distinguished by differentiating the concentration of the strengthening liquid. Specifically, the first strengthening portion 5111 can be soaked in a first strengthening liquid and the second strengthening portion 5112 can be soaked in a second strengthening liquid, with the concentration of the first strengthening liquid being greater than the concentration of the second strengthening liquid. The first strengthening portion 5111 and the second strengthening portion 5112 can also be distinguished by differentiating the soaking time of different regions, with the soaking time of the first strengthening liquid being greater than the soaking time of the second strengthening liquid.

[0060] The present disclosure also provides a display module. The display module includes a display substrate and the aforementioned flexible cover plate. The flexible cover plate is typically positioned on the non-display side of the display substrate and secured together via an optical adhesive layer. It should be noted that, to achieve flexible display, the display substrate is typically an OLED display substrate.

[0061] like Figure 11 As shown, the display substrate includes an array substrate 1 and a pixel layer 2. The array substrate 1 includes a base substrate 11. A buffer layer 12 is provided on one side of the base substrate 11. A driving circuit layer is provided on the side of the buffer layer 12 away from the base substrate 11. The pixel layer 2 is provided on the side of the driving circuit layer away from the base substrate 11.

[0062] In one embodiment of the present disclosure, the base substrate 11 may be a base substrate of an inorganic material or a base substrate of an organic material. For example, in one embodiment of the present disclosure, the base substrate 11 may be made of a glass material such as soda-lime glass, quartz glass, or sapphire glass, or may be made of a metal material such as stainless steel, aluminum, or nickel.

[0063] In another embodiment of the present disclosure, the material of the base substrate 11 can be polymethyl methacrylate (PMMA), polyvinyl alcohol (PVA), polyvinyl phenol (PVP), polyether sulfone (PES), polyimide, polyamide, polyacetal, polycarbonate (PC), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or a combination thereof.

[0064] In another embodiment of the present disclosure, the substrate 11 may be a flexible substrate. For example, the substrate 11 may be made of polyimide (PI). The substrate 11 may also be a composite of multiple layers. For example, in one embodiment of the present disclosure, the substrate 11 may include a bottom film layer, a pressure-sensitive adhesive layer, a first polyimide layer, and a second polyimide layer stacked in sequence.

[0065] The driving circuit layer 13 may include multiple driving circuit areas. Any driving circuit area may include a transistor and a storage capacitor. The transistor may be a thin film transistor, which may be selected from a top-gate thin film transistor, a bottom-gate thin film transistor, or a dual-gate thin film transistor.

[0066] The material of the active layer of the thin film transistor can be amorphous silicon semiconductor material, low-temperature polysilicon semiconductor material, metal oxide semiconductor material, organic semiconductor material or other types of semiconductor materials; the thin film transistor can be an N-type thin film transistor or a P-type thin film transistor.

[0067] A transistor may have a first terminal, a second terminal, and a control terminal. One of the first terminal and the second terminal may be a source region of the transistor and the other may be a drain region of the transistor. The control terminal may be a gate of the transistor. It is understood that the source region and the drain region of a transistor are two relative and interchangeable concepts. When the operating state of the transistor changes, for example, when the direction of current changes, the source region and the drain region of the transistor may be interchangeable.

[0068] In the present disclosure, the driving circuit layer 13 may include a transistor layer, an interlayer dielectric layer 134, and a source-drain metal layer 135 sequentially stacked on the base substrate 11. The transistor layer is provided with an active portion and a gate of the transistor, and the source-drain metal layer 135 is electrically connected to the source and drain of the transistor. Alternatively, the transistor layer may include an active layer 131, a gate insulating layer 132, and a gate layer 133 stacked between the base substrate 11 and the interlayer dielectric layer 134. The positional relationship of each film layer may be determined based on the film layer structure of the thin film transistor.

[0069] In some embodiments, the active layer 131 can be used to form the active portion 1311 of the transistor. The active portion 1311 of the semiconductor includes a channel region and a source region and a drain region located on both sides of the channel region; wherein the channel region can maintain semiconductor properties, and the semiconductor material of the source region and the drain region is partially or completely conductive. The gate layer 133 can be used to form gate layer wiring such as scan wiring, can also be used to form the gate of the transistor, and can also be used to form part or all of the electrode plate of the storage capacitor. The source and drain metal layer 135 can be used to form source and drain metal layer wiring such as source, drain, data wiring, and power wiring.

[0070] Taking a top-gate thin film transistor as an example, the thin film transistor may include an active portion 1311, a gate insulating layer 132, a gate 1331, a source electrode 1351, and a drain electrode 1352, wherein:

[0071] The active portion 1311 is disposed on one side of the base substrate 11 and may be made of polysilicon, amorphous silicon, etc. The active portion 1311 may include a channel region and two source and drain regions of different doping types located on both sides of the channel region.

[0072] The gate insulating layer 132 may cover the active portion 1311 and the base substrate 11 , and the gate insulating layer 132 may be made of an insulating material such as silicon oxide.

[0073] The gate 1331 is arranged on a side of the gate insulating layer 132 away from the base substrate 11 and is directly opposite to the active portion 1311, that is, the projection of the gate 1331 on the base substrate 11 is located within the projection range of the active portion 1311 on the base substrate 11. For example, the projection of the gate 1331 on the base substrate 11 coincides with the projection of the channel region of the active portion 1311 on the base substrate 11.

[0074] The thin film transistor further includes an interlayer dielectric layer 134 . The interlayer dielectric layer 134 is disposed on a side of the gate 1331 away from the base substrate 11 . The interlayer dielectric layer 134 covers the gate 1331 and the gate insulating layer 132 . The interlayer dielectric layer 134 is made of insulating material.

[0075] The source 1351 and the drain 1352 are arranged on the surface of the interlayer dielectric layer 134 away from the base substrate 11, and the source 1351 and the drain 1352 are connected to the active part 1311. For example, the source 1351 and the drain 1352 are respectively connected to the source region and the drain region of the corresponding active part 1311 through vias.

[0076] A protective layer 136 is provided on the side of the source electrode 1351 and the drain electrode 1352 away from the base substrate 11. The protective layer 136 covers the source electrode 1351 and the drain electrode 1352. A planarization layer 137 is provided on the side of the source electrode 1351 and the drain electrode 1352 away from the base substrate 11. The planarization layer 137 is provided on the side of the protective layer 136 away from the base substrate 112. The planarization layer 137 covers the protective layer 136, and the surface of the planarization layer 137 away from the base substrate 11 is flat.

[0077] The pixel layer 2 includes a pixel definition layer 21 and multiple stacked electroluminescent devices 22. The pixel definition layer 21 is disposed on one side of the base substrate 11. The pixel definition layer 21 is provided with multiple pixel openings 2311. The multiple stacked electroluminescent devices 22 are respectively disposed within the pixel openings 2311 and located in the light-emitting area 100. The driving circuit layer 13 controls the emission of different stacked electroluminescent devices 22, enabling the pixel layer 2 to realize the image display function.

[0078] Specifically, the source electrode 1351 can be connected to the first electrode 221 of the stacked electroluminescent device 22. A signal can be applied to the first electrode 221 to drive the stacked electroluminescent device 22 to emit light. The specific light-emitting principle is not described in detail here. At least part of the stacked electroluminescent device can adopt any of the stacked electroluminescent devices described above. The structure and materials of the stacked electroluminescent device have been described in detail and are not further described here.

[0079] Typically, when displaying an image, the stacked electroluminescent device 22 needs to form a plurality of pixels. Each pixel may typically include three stacked electroluminescent devices 22 of different colors. The stacked electroluminescent devices 22 may be divided into a red stacked electroluminescent device, a green stacked electroluminescent device, and a blue stacked electroluminescent device according to the different luminescent colors.

[0080] An encapsulation layer group 3 is provided on the side of the pixel layer 2 away from the base substrate 131, thereby encapsulating the pixel layer 2 and preventing corrosion by water and oxygen. The encapsulation layer group 3 can be a single-layer or multi-layer structure, and the material of the encapsulation layer group 3 can include organic or inorganic materials, which are not particularly limited here.

[0081] In this embodiment, the encapsulation layer group 3 may include a first inorganic encapsulation layer 31, an organic encapsulation layer 32 and a second inorganic encapsulation layer 33. The first inorganic encapsulation layer 31 is arranged on the side of the pixel layer 2 away from the base substrate 131, the organic encapsulation layer 32 is arranged on the side of the first inorganic encapsulation layer 31 away from the base substrate 131, and the second inorganic encapsulation layer 33 is arranged on the side of the organic encapsulation layer 32 away from the base substrate 131.

[0082] A color filter substrate 4 can be set on the side of the packaging layer group 3 away from the driving backplane 22. The color filter substrate 4 includes a packaging substrate 43. A black matrix 41 is provided on one side of the packaging substrate 43. An opening area array is defined on the black matrix 41. The opening area array includes multiple opening area rows arranged along the row direction. Each opening area row includes multiple opening areas. A sub-filter unit 42 is provided in each opening area. The colors of two adjacent sub-filter units 42 in the opening area row are different. Multiple sub-filter units 42 located in the same opening area row constitute multiple filter units. Usually, one filter unit 240 can include a red sub-filter unit, a green sub-filter unit and a blue sub-filter unit.

[0083] The present disclosure also provides a display device, which may include the display module mentioned above. The specific structure and beneficial effects of the display module have been described in detail above, so they will not be repeated here.

[0084] It should be noted that, in addition to the display module, the display device also includes other necessary components and components, such as a housing, a circuit board, a power cord, etc. Those skilled in the art can make corresponding supplements based on the specific usage requirements of the display device, which will not be repeated here.

[0085] The display device can be a traditional electronic device, such as a mobile phone, a computer, a television, and a camcorder, or it can be an emerging wearable device, such as a virtual reality device and an augmented reality device, which are not listed here one by one.

[0086] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the appended claims.

Claims

1. A flexible cover plate, wherein the flexible cover plate has a bending area and straight areas at both ends of the bending area along the extension direction of the cover plate, characterized in that: Along the thickness direction of the flexible cover plate, the flexible cover plate includes: basement membrane; The first hardened layer is arranged on one side of the base film. The first hardened layer has a prestressed portion and stress-free portions located on both sides of the prestressed portion. The prestressed portion is located in the bending area, and the stress-free portion is located in the straight area. The shrinkage rate of the prestressed portion is greater than the shrinkage rate of the stress-free portion, so that the prestressed portion has a greater internal stress than the stress-free portion, driving the base film on one side of the first hardened layer to deform.

2. The flexible cover according to claim 1, wherein: Along the thickness direction of the flexible cover plate, the base film includes at least a partial reinforcement layer, and the reinforcement layer includes a first reinforcement part and a second reinforcement part located on both sides of the first reinforcement part. The first reinforcement part is located in the bending area, and the second reinforcement part is located in the straight area. The tension of the first reinforcement part is greater than that of the second reinforcement part.

3. The flexible cover according to claim 2, wherein: The orthographic projection of the first reinforcement portion on the base film coincides with the orthographic projection of the prestressed portion on the base film, and the orthographic projection of the second reinforcement portion on the base film coincides with the orthographic projection of the stress-free portion on the base film.

4. The flexible cover according to claim 2, wherein: Along the thickness direction of the flexible cover plate, the base film includes a non-reinforced layer and a reinforced layer. The non-reinforced layer is arranged adjacent to the first hardened layer, and the reinforced layer is arranged on the side of the non-reinforced layer away from the first hardened layer. The tension of the non-reinforced layer is less than the tension of the reinforced layer.

5. The flexible cover according to claim 1 or 2, characterized in that: The flexible cover further includes a second hardening layer, which is arranged on a side of the base film away from the first hardening layer.

6. The flexible cover according to claim 1, wherein: The material of the base film includes one or more of polyimide, polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, polyurethane, polyaramid, and acrylic.

7. The flexible cover according to claim 1, wherein: The material of the first hardening layer includes acrylate.

8. A method for manufacturing the flexible cover according to claim 1, characterized in that: The method comprises: providing a basement membrane; A prestressed portion and a non-stressed portion are formed on one side of the base film, such that a shrinkage rate of the prestressed portion is greater than a shrinkage rate of the non-stressed portion.

9. The method for manufacturing a flexible cover according to claim 8, wherein: Forming a prestressed portion and a stress-free portion on one side of the base film so that the shrinkage rate of the prestressed portion is greater than the shrinkage rate of the stress-free portion comprises: Applying a first solution to the portion of the base film located in the bending area and curing the solution to form a prestressed portion, wherein the solid content of the first solution is 20% to 40%; A second solution is applied to a portion of the base film located in the flat area and solidified to form a stress-free portion, wherein the solid content of the second solution is 10% to 30%.

10. The method for manufacturing a flexible cover according to claim 9, wherein: The first solution includes a first monomer, which is an acrylate system. The second solution includes a second monomer, which is a polyurethane system or a polyimide system.

11. The method for manufacturing a flexible cover according to claim 9 or 10, characterized in that: The solidification time of the first solution is 10 min to 30 min, and the solidification time of the second solution is 0.5 min to 10 min.

12. The method for manufacturing a flexible cover according to claim 11, wherein: The method is used to manufacture the flexible cover according to claim 2, and the method further comprises: Soaking the portion of the base film located in the bending area with a first strengthening liquid; Soaking the portion of the base film located in the flat area with a second strengthening liquid; The concentration of the first strengthening liquid is greater than that of the second strengthening liquid, and / or the immersion time of the first strengthening liquid is greater than that of the second strengthening liquid.

13. A display module, characterized in that: The flexible cover comprises the flexible cover according to any one of claims 1 to 7.

14. A display device, characterized in that: Including the display module according to claim 13.

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