An electronic device

Abstract

This application discloses an electronic device belonging to the field of folding structure technology. The electronic device includes: a first housing and a second housing, which are rotatably connected to allow the electronic device to switch between an unfolded state and a folded state; a first support is disposed on the first housing, and a first magnetic element is disposed on the first support; a second support is disposed on the second housing, and a second magnetic element is disposed on the second support; wherein the shape of the first support can change with temperature. Within a first temperature range, the first support is in a first form, and when the electronic device is in the folded state, the distance between the first magnetic element and the second magnetic element is a first distance; within a second temperature range, the first support is in a second form, and when the electronic device is in the folded state, the distance between the first magnetic element and the second magnetic element is a second distance, and the first distance is less than the second distance.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of folding structures, and particularly relates to an electronic device. BACKGROUND

[0002] Generally, a torque hinge and a magnet can be arranged in the foldable device, and the torque hinge and the magnet can offset the rebound torque of the screen of the foldable device, so that the whole foldable device can be normally closed and opened.

[0003] However, when the temperature changes, especially when the temperature difference changes greatly, the rebound torque of the screen of the foldable device will fluctuate greatly, so that the whole foldable device cannot be normally closed and opened.

[0004] Therefore, the foldable device cannot be normally closed and opened when the temperature changes greatly. SUMMARY

[0005] The application aims to provide an electronic device, which can solve the problem that the foldable device cannot be normally closed and opened when the temperature changes greatly.

[0006] In a first aspect, an electronic device is provided, which comprises: a first shell and a second shell, the first shell and the second shell being rotationally connected to switch the electronic device between an unfolded state and a folded state; a first support is arranged on the first shell, and a first magnetic member is arranged on the first support; a second support is arranged on the second shell, and a second magnetic member is arranged on the second support; wherein the shape of the first support can change with the temperature, and in a first temperature range, the first support is in a first shape, and when the electronic device is in the folded state, the distance between the first magnetic member and the second magnetic member is a first distance; in a second temperature range, the first support is in a second shape, and when the electronic device is in the folded state, the distance between the first magnetic member and the second magnetic member is a second distance, and the first distance is less than the second distance.

[0007] In the embodiment of the present application, the electronic device comprises a first shell and a second shell connected by rotation, so that the electronic device can be unfolded and folded, and the first shell is provided with a first support, and the first support is provided with a first magnetic member, and the second shell is provided with a second support, and the second support is provided with a second magnetic member. Since the shape of the first support can change with temperature, in a first temperature range, the first support is in a first shape, and the distance between the first magnetic member and the second magnetic member is a first distance when the electronic device is in a folded state; in a second temperature range, the first support is in a second shape, and the distance between the first magnetic member and the second magnetic member is a second distance when the electronic device is in a folded state, and the first distance is less than the second distance, so that when the electronic device is in the first temperature range with a lower temperature value, the distance between the first magnetic member and the second magnetic member is smaller, and the magnetic attraction generated is larger, so as to offset the increased screen bounce force of the electronic device in the first temperature range, so that the electronic device can be normally closed; when the electronic device is in the second temperature range with a higher temperature value, the distance between the first magnetic member and the second magnetic member is larger, and the magnetic attraction generated is smaller, so as to balance the reduced screen bounce force of the electronic device in the second temperature range, so that the electronic device can be normally opened, so that the electronic device can be normally closed and opened even in the case of large temperature change. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 is a structural schematic diagram of an electronic device provided by the embodiment of the present application;

[0009] Figure 2 is one of the schematic diagrams of the first support provided by the embodiment of the present application;

[0010] Figure 3 is another schematic diagram of the first support provided by the embodiment of the present application;

[0011] Figure 4 is a third schematic diagram of the first support provided by the embodiment of the present application;

[0012] Figure 5 is one of the side view cross-sectional schematic diagrams of the electronic device provided by the embodiment of the present application;

[0013] Figure 6 is another side view cross-sectional schematic diagram of the electronic device provided by the embodiment of the present application;

[0014] Figure 7 is one of the exploded schematic diagrams of the electronic device provided by the embodiment of the present application;

[0015] Figure 8 is a third side view cross-sectional schematic diagram of the electronic device provided by the embodiment of the present application;

[0016] Figure 9 is a second exploded schematic view of an electronic device provided by an embodiment of the present application;

[0017] Figure 10 is a first structural schematic view of a first support provided by an embodiment of the present application;

[0018] Figure 11 is a second structural schematic view of a first support provided by an embodiment of the present application;

[0019] Figure 12 is a third exploded schematic view of an electronic device provided by an embodiment of the present application;

[0020] Figure 13 is a fourth exploded schematic view of an electronic device provided by an embodiment of the present application;

[0021] Figure 14 is a fourth side view schematic view of an electronic device provided by an embodiment of the present application;

[0022] Figure 15 is a third structural schematic view of a first support provided by an embodiment of the present application;

[0023] Figure 16 is a fourth structural schematic view of a first support provided by an embodiment of the present application;

[0024] Figure 17 is a fifth structural schematic view of a first support provided by an embodiment of the present application.

[0025] wherein the first housing-1, the second housing-2, the first support-3, the first magnetic member-4, the second support-5, the second magnetic member-6, the torque hinge-7, the first assembly slot-8, the second assembly slot-9, the accommodating slot-10, the first plate-shaped support-11, the first fixed part-12, the second fixed part-13, the first deformation part-14, the first reverse wrapping arm-15, the first C-shaped reverse wrapping arm-16, the first edge-17, the second edge-18, the third fixed part-19, the fourth fixed part-20, the second deformation part-21, the U-shaped support-22, the fifth fixed part-23, the sixth fixed part-24, the third deformation part-25, the clamping member-26, the second C-shaped reverse wrapping arm-27, the first position-28, the second position-29. DETAILED DESCRIPTION

[0026] Embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only, for the purpose of explanation, and are not to be understood as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of the present application.

[0027] The terms "first", "second" in the specification and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally means that the front and rear associated objects are in an "or" relationship.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0029] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0030] In the design of the existing foldable device, the electronic device can be folded closed because the torsion hinge and the magnetic part are arranged inside the electronic device. When the torque generated by the hinge torque and the magnetic attraction of the magnetic part is greater than the rebound torque of the screen of the electronic device, the electronic device can be normally closed. However, when the ambient temperature of the electronic device changes, especially when the temperature difference changes greatly, the rebound torque of the screen of the foldable device will fluctuate greatly, so that the whole foldable device cannot be normally closed and opened. For example: when the ambient temperature of the electronic device changes from 25℃ to -10℃, the rebound torque of the screen will increase by about 100N·mm. Since the hinge torque does not change with the change of temperature, that is, the hinge torque is the same under different temperature environments, and the distance of the magnetic part is constant, that is, the magnetic attraction does not change with the change of temperature. At this time, the foldable device cannot be normally closed. Conversely, when the ambient temperature of the electronic device changes from -10℃ to 25℃ when the electronic device is closed, the rebound torque of the screen will decrease. At this time, the foldable device cannot be normally opened.

[0031] In order to solve this technical problem, the embodiment of the present application adopts the following technical solution.

[0032] The electronic device provided by the embodiment of the present application is described below in combination with the drawings.

[0033] Figure 1 A possible structural schematic diagram of an electronic device provided by the embodiment of the present application is shown in FIG. 1. Figure 1As shown, the electronic device comprises a first shell 1 and a second shell 2, the first shell 1 and the second shell 2 are rotationally connected to switch the electronic device between an unfolded state and a folded state; the first shell 1 is provided with a first support 3, and the first support 3 is provided with a first magnetic piece 4; the second shell 2 is provided with a second support 5, and the second support 5 is provided with a second magnetic piece 6. Optionally, the electronic device in the embodiment of the present application can be any one of the following: a foldable device, a wearable device, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device, a mobile internet device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc., and can also be a server, a network attached storage (NAS), a personal computer (PC), a television (TV), a teller machine, or a self-service machine, etc.

[0034] The foldable device can be any one of the following: a foldable mobile phone, a foldable tablet computer, foldable smart glasses, a foldable palm computer, etc.

[0035] It should be noted that, Figure 1 The electronic device is taken as a foldable device (for example, a foldable mobile phone) as an example for description.

[0036] Optionally, in the embodiment of the present application, in combination with Figure 1 As shown, the electronic device can be folded by setting a torque hinge 7 between the first shell 1 and the second shell 2, so that the electronic device can be switched between the unfolded state and the folded state.

[0037] In the embodiment of the present application, in combination with Figure 1 As shown, the first shell 1 is further provided with a first assembly groove 8, and the second shell 2 is further provided with a second assembly groove 9; the first assembly groove 8 and the second assembly groove 9 are opposite when the electronic device is in the folded state; the first support 3 is arranged in the first assembly groove 8, and the second support 5 is arranged in the second assembly groove 9.

[0038] Optionally, in the embodiments of the present application, the first assembly groove 8 and the second assembly groove 9 can be arranged at positions symmetrical to the torque hinge 7 of the middle frame of the electronic device, for example, positions close to the edges of the middle frame of the electronic device, so that the first assembly groove 8 and the second assembly groove 9 can be completely opposite or partially opposite when the electronic device is in the folded state.

[0039] Optionally, in the embodiments of the present application, the first assembly groove 8 and the second assembly groove 9 can be arranged at positions symmetrical to the torque hinge 7 of the middle frame of the electronic device, for example, positions close to the edges of the middle frame of the electronic device, so that the first assembly groove 8 and the second assembly groove 9 can be completely opposite or partially opposite when the electronic device is in the folded state.

[0040] It can be understood that when the first assembly groove and the second assembly groove are symmetrical to the torque hinge and have the same shape and size, the first assembly groove and the second assembly groove can be completely opposite when the electronic device is in the folded state; when the first assembly groove and the second assembly groove are symmetrical to the torque hinge but have different shape and size, the first assembly groove and the second assembly groove are partially opposite when the electronic device is in the folded state.

[0041] Optionally, in the embodiments of the present application, the first assembly groove 8 and the second assembly groove 9 can be arranged at positions symmetrical to the torque hinge 7 of the middle frame of the electronic device, for example, positions close to the edges of the middle frame of the electronic device, so that the first assembly groove 8 and the second assembly groove 9 can be completely opposite or partially opposite when the electronic device is in the folded state. Figure 1 As shown in FIG. 1, a receiving groove 10 can be arranged at the opening of the first assembly groove 8, the receiving groove 10 is away from the groove bottom of the first assembly groove 8, the depth of the receiving groove 10 is less than the depth of the first assembly groove 8, and the shape and size of the receiving groove 10 are adapted to the shape and size of the first support 3.

[0042] It can be understood that the receiving groove is used to arrange the first support, and the first support is fixedly arranged in the receiving groove, so that the first support does not protrude from the plane of the middle frame of the electronic device, thereby avoiding affecting the assembly of other components (such as the screen) of the electronic device due to the protrusion of the first support from the plane of the middle frame of the electronic device.

[0043] Optionally, in the embodiments of the present application, the first support 3 is a shape memory alloy piece.

[0044] Further optionally, in the embodiments of the present application, the shape memory alloy piece can deform according to the change of the temperature of the environment.

[0045] Optionally, in the embodiments of the present application, the first support 3 can be fixedly arranged in the receiving groove 10 in any one of the following manners: laser welding, screw locking, double-sided adhesive bonding, point adhesive bonding, etc.

[0046] Optionally, in the embodiments of the present application, the first magnetic piece 4 is arranged on the side of the first support 3 close to the first assembly groove 8, so that the first magnetic piece 4 can move in the receiving cavity formed by the first support 3 and the first assembly groove 8.

[0047] Optionally, in the embodiments of the present application, the first magnetic member 4 can be any one of the following: a metal (for example, iron, nickel, cobalt, a partial alloy, etc.) having a natural magnet structure, a permanent magnet (for example, a magnet, a lodestone, etc.), an electromagnet, etc.

[0048] Optionally, in the embodiments of the present application, the first magnetic member 4 is fixedly connected with the first support 3 by an adhesive, or the first magnetic member 4 is fixedly connected with the first support 3 by a clamping structure.

[0049] In one example, the first support 3 is made of an alloy material, and the first magnetic member 4 is adsorbed on the first support 3. When the first support 3 deforms according to the change of the temperature of the environment, the first magnetic member 4 can be driven to move in a containing cavity enclosed by the first support 3 and the first assembly groove 8.

[0050] In another example, the first support 3 is provided with double-sided adhesive tape, and the first magnetic member 4 can be adhered to the first support 3 by the double-sided adhesive tape. When the first support 3 deforms according to the change of the temperature of the environment, the first magnetic member 4 can be driven to move in a containing cavity enclosed by the first support 3 and the first assembly groove 8.

[0051] In still another example, the first support 3 is provided with a clamping member for clamping the first magnetic member 4. When the first support 3 deforms according to the change of the temperature of the environment, the first magnetic member 4 can be driven to move in a containing cavity enclosed by the first support 3 and the first assembly groove 8.

[0052] In the embodiments of the present application, the shape of the first support 3 can change with the temperature. In a first temperature range, the first support 3 is in a first shape, and the distance between the first magnetic member 4 and the second magnetic member 6 is a first distance when the electronic device is in a folded state. In a second temperature range, the first support 3 is in a second shape, and the distance between the first magnetic member 4 and the second magnetic member 6 is a second distance when the electronic device is in a folded state, the first distance being smaller than the second distance.

[0053] Optionally, in the embodiments of the present application, when the first support 3 deforms according to the change of the temperature of the environment, the first magnetic member 4 can be driven to move in a containing cavity enclosed by the first support 3 and the first assembly groove 8 towards or away from the direction of the groove bottom of the first assembly groove 8, and the first magnetic member 4 can also be driven to move in the containing cavity along the plane direction of the slot opening of the first assembly groove 8, so as to change the distance between the first magnetic member 4 and the second magnetic member 6.

[0054] Optionally, in the embodiments of the present application, the second temperature range is a temperature interval range with a higher temperature value (for example, 25°C±5°C), and the first temperature range is a temperature interval range with a lower temperature value (for example, -10°C±5°C).

[0055] Optionally, in the embodiments of the present application, the first form and the second form are two different forms, which can be any of the following forms: an extended state, a contracted state, a state of bending towards a certain direction, and the like.

[0056] It can be understood that, in the first temperature range, when the first support is in the first form, the distance between the first magnetic member arranged on the first support and the second magnetic member is a first distance L1; in the second temperature range, when the first support is in the second form, the distance between the first magnetic member arranged on the first support and the second magnetic member is a second distance L2, wherein L1 is less than L2, and thus the magnetic attraction force between the first magnetic member and the second magnetic member in the first temperature range is greater than the magnetic attraction force between the first magnetic member and the second magnetic member in the second temperature range.

[0057] Optionally, in a possible implementation manner of the embodiments of the present application, the first support 3 can be a plate-shaped support. The plate-shaped support can be a support made of a memory alloy material (for example, a two-way shape memory alloy (for example, a titanium-nickel alloy, a gold-cadmium alloy, a copper-zinc alloy)), and the plate-shaped support presents different forms in different temperature environments. When the plate-shaped support is in the first temperature range (for example, -10°C), the plate-shaped support is in the first form, for example, an extended state, a state of bending towards a certain direction, and the like. When the plate-shaped support is in the second temperature range (for example, 25°C), the plate-shaped support is in the second form, for example, a contracted state, a state of bending towards another direction, and the like. Thus, the plate-shaped support can deform when the electronic device is in different temperature environments, so that the plate-shaped support can drive the first magnetic member 4 to move towards or away from the second magnetic member 6.

[0058] For example, as shown in FIG. 3, the first support 3 is a plate-shaped support, and the plate-shaped support presents different forms in different temperature environments. As shown in FIG. 3(a), when the plate-shaped support is in an environment of -10°C, the plate-shaped support is in an extended state. As shown in FIG. 3(b), when the plate-shaped support is in an environment of 25°C, the plate-shaped support bends downwards. Figure 2 Figure 2 Figure 2

[0059] In combination with FIG. 2, FIG. 3, and FIG. 4, the first support 3 is a plate-shaped support, and the plate-shaped support presents different forms in different temperature environments. As shown in FIG. 3(a), when the plate-shaped support is in an environment of -10°C, the plate-shaped support is in an extended state. As shown in FIG. 3(b), when the plate-shaped support is in an environment of 25°C, the plate-shaped support bends downwards. Figure 2 Figure 3 ​​​​As shown, when the electronic device is in an environment of -10℃, the first bracket 3 is in an extended state. At this time, the distance between the first magnetic element 4 and the second magnetic element 6 disposed on the first bracket 3 is L1, and the magnetic attraction force between the first magnetic element 4 and the second magnetic element 6 is the first magnetic attraction force; or, combined with Figure 2 ,like Figure 4 As shown, when the electronic device is in an environment of 25°C, the first bracket 3 bends downwards. At this time, the distance between the first magnetic component 4 and the second magnetic component 6 disposed on the first bracket 3 is L2, and the magnetic attraction force between the first magnetic component 4 and the second magnetic component 6 is the second magnetic attraction force. Since L1 is less than L2, the first magnetic attraction force is greater than the second magnetic attraction force.

[0060] It is understandable that electronic devices are in different temperature environments so that the first bracket can be in different states alternately, thereby changing the distance between the first magnetic component and the second magnetic component. This changes the magnetic attraction between the first magnetic component and the second magnetic component, thus balancing and adapting to the fluctuations in screen rebound force caused by temperature changes in the electronic device's screen.

[0061] Optionally, in another possible implementation of this application embodiment, the first support 3 can specifically be a U-shaped support. The U-shaped support can be a support made of a shape memory alloy material (e.g., a two-way shape memory alloy, such as a titanium-nickel alloy, a gold-cadmium alloy, or a copper-zinc alloy), and includes a snap-fit ​​structure for clamping the first magnetic component. Figure 5 As shown, when the electronic device is in an environment of -10℃, the first bracket 3 is in an extended state. At this time, the distance between the first magnetic element 4 and the second magnetic element 6 disposed on the first bracket 3 is L1, and the magnetic attraction force between the first magnetic element 4 and the second magnetic element 6 is the first magnetic attraction force; or, as Figure 6 As shown, when the electronic device is in an environment of 25°C, the first bracket 3 is in a folded state. At this time, the interaction distance between the first magnetic element 4 and the second magnetic element 6 disposed on the first bracket 3 is L2, and the magnetic attraction force between the first magnetic element 4 and the second magnetic element 6 is the second magnetic attraction force. Since L1 is less than L2, the first magnetic attraction force is greater than the second magnetic attraction force.

[0062] It is understandable that electronic devices are in different temperature environments so that the first support can be in different states alternately, thereby changing the interaction area between the first magnetic component and the second magnetic component. This changes the magnetic attraction between the first magnetic component and the second magnetic component, thus balancing and adapting to the fluctuations in screen rebound force caused by temperature changes in the electronic device's screen.

[0063] In the embodiments of the present application, the first support 3 can change its shape spontaneously according to temperature change, and does not need external force or other power source, thus saving the cost and durability of the electronic device.

[0064] In the embodiments of the present application, the electronic device comprises a first shell and a second shell connected by rotation, so that the electronic device can be unfolded and folded, and the first shell is provided with a first support, and the first support is provided with a first magnetic member, and the second shell is provided with a second support, and the second support is provided with a second magnetic member. Since the shape of the first support can change with temperature change, in a first temperature range, the first support is in a first shape, and the distance between the first magnetic member and the second magnetic member is a first distance when the electronic device is in a folded state; in a second temperature range, the first support is in a second shape, and the distance between the first magnetic member and the second magnetic member is a second distance when the electronic device is in a folded state, and the first distance is less than the second distance, so that when the electronic device is in a first temperature range with a lower temperature value, the distance between the first magnetic member and the second magnetic member is smaller, and the magnetic attraction generated is larger, so as to offset the increased screen bounce force of the electronic device in the first temperature range, so that the electronic device can be normally closed; when the electronic device is in a second temperature range with a higher temperature value, the distance between the first magnetic member and the second magnetic member is larger, and the magnetic attraction generated is smaller, so as to balance the reduced screen bounce force of the electronic device in the second temperature range, so that the electronic device can be normally opened, so that the electronic device can be normally closed and opened even in the case of large temperature change.

[0065] In the following, the first support will be taken as a plate-shaped support as an example for specific illustration.

[0066] Example one,

[0067] Optionally, in the embodiments of the present application, in combination with Figure 1 As shown in Figure 7 The above first support can be a first plate-shaped support 11.

[0068] Optionally, in the embodiments of the present application, the above first plate-shaped support 11 can be a two-way shape memory alloy plate designed and made of a memory alloy material, and the first plate-shaped support 11 presents different shapes in different temperature environments: when the first plate-shaped support 11 is in a first temperature range, it presents a first shape, for example: an extended state, a state of bending towards a certain direction, etc.; when the first plate-shaped support 11 is in a second temperature range, it presents a second shape, for example: a contracted state, a state of bending towards another direction, etc.

[0069] Optionally, in the embodiment of the present application, the first plate-shaped support 11 is fixedly arranged in the accommodating groove 10 at the groove opening of the first assembly groove 8, and the first magnetic member 4 can be fixed on the side of the first plate-shaped support 11 close to the first assembly groove 8 by adhesive or clamped and fixed on the side of the first plate-shaped support 11 close to the first assembly groove 8 by a clamping structure; and the second magnetic member 6 is fixedly arranged in the second assembly groove 9.

[0070] The shape of the first magnetic member 4 and the second magnetic member 6 can be any one of a cuboid, a cube, a cylinder, an elliptical cylinder, etc., and the shape of the first magnetic member 4 and the second magnetic member 6 can be the same or different.

[0071] Optionally, in the embodiment of the present application, the depth of the first assembly groove 8 is greater than the height of the first magnetic member 4, and a gap is left between the first magnetic member 4 and the first assembly groove 8, so that the first magnetic member 4 can move in the first assembly groove 8 in the direction towards or away from the groove bottom of the first assembly groove 8.

[0072] In the embodiment of the present application, in the process of changing the first plate-shaped support 11 from the first form to the second form, the first plate-shaped support 11 drives the first magnetic member 4 to move in the direction towards the groove bottom of the first assembly groove 8; and in the process of changing the first plate-shaped support 11 from the second form to the first form, the first plate-shaped support 11 drives the first magnetic member 4 to move in the direction away from the groove bottom of the first assembly groove 8.

[0073] Optionally, in the embodiment of the present application, the first form of the first plate-shaped support 11 can be an extended state, and the second form of the first plate-shaped support 11 can be a state of being bent in the direction towards the groove bottom of the first assembly groove 8.

[0074] For example, as shown in (a) of FIG. 1, when the first plate-shaped support 11 is at a first temperature of -10℃ (the first temperature is a temperature value in a first temperature range), the first plate-shaped support 11 is in an extended state, as shown in (b) of FIG. 1, when the first plate-shaped support 11 is at a second temperature of 25℃ (the second temperature is a temperature value in a second temperature range), the first plate-shaped support 11 is in a state of being bent in the direction towards the groove bottom of the first assembly groove 8. Figure 8 Figure 8 When the environmental temperature of the electronic device changes from the first temperature to the second temperature, in the process of changing the first plate-shaped support 11 from the first form to the second form, the first plate-shaped support 11 drives the first magnetic member 4 to move in the direction towards the groove bottom of the first assembly groove 8; and when the environmental temperature of the electronic device changes from the second temperature to the first temperature, in the process of changing the first plate-shaped support 11 from the second form to the first form, the first plate-shaped support 11 drives the first magnetic member 4 to move in the direction away from the groove bottom of the first assembly groove 8.

[0075] ​Thus, it can be seen that, due to the different temperature environments of the electronic device, the first bracket can drive the first magnetic component to move toward or away from the bottom of the first assembly groove, thereby changing the distance between the first magnetic component and the second magnetic component. This changes the magnetic attraction between the first magnetic component and the second magnetic component, thereby balancing and adapting to the fluctuations in the screen rebound force caused by temperature changes, so that the electronic device can be turned on and off normally in different temperature environments.

[0076] The structure of the first plate-shaped support 11 will be described in detail below.

[0077] Optionally, in the embodiments of this application, combined with Figure 7 ,like Figure 9 As shown, the first bracket 3 includes a first fixing part 12, a second fixing part 13 and a first deformation part 14. The first fixing part 12 and the second fixing part 13 are respectively fixedly connected to the groove wall of the first assembly groove 8. The first deformation part 14 is disposed between the first fixing part 12 and the second fixing part 13. The first magnetic element 4 is disposed on the side of the first deformation part 14 facing the bottom of the first assembly groove 8.

[0078] Optionally, in this embodiment of the application, the first fixing part 12 and the second fixing part 13 are used to fix the two ends of the first plate-shaped bracket 11 at the opening of the first assembly groove 8, respectively.

[0079] Specifically, the first fixing part 12 and the second fixing part 13 can be fixed to the wall of the receiving groove provided at the opening of the first assembly groove 8 by laser welding. The shape of the first fixing part 12 and the second fixing part 13 can be adapted to the shape and size of the receiving groove.

[0080] Optionally, in this embodiment of the application, when the ambient temperature of the first plate-shaped support 11 changes, the first deformation part 14 deforms, and the first deformation part 14 and the first magnetic element 4 are fixedly disposed together.

[0081] In one example, the first deformable part 14 can be fixed together with the first magnetic element 4 by applying adhesive or using double-sided adhesive on the side close to the first mounting groove 8.

[0082] In another example, the first deformable part 14 can be fixed together with the first magnetic part 4 by providing a snap-fit ​​member on the side close to the first mounting groove 8.

[0083] Optionally, in this embodiment, the first deformable part 14 can be integrally manufactured with the first fixing part 12 and the second fixing part 13, or it can be a component part made of a different material than the first fixing part 12 and the second fixing part 13. Specifically, the material of the first deformable part 14 can be a shape memory alloy material.

[0084] In this embodiment of the application, during the process of the first bracket 3 changing from the first form to the second form, the first deformable part 14 deforms in the direction toward the bottom of the first assembly groove 8; during the process of the first bracket 3 changing from the second form to the first form, the first deformable part 14 deforms in the direction away from the bottom of the first assembly groove 8.

[0085] Thus, it can be seen that since the first fixing part and the second fixing part of the first bracket are fixedly connected to the wall of the first assembly groove, the first bracket can be more firmly connected to the first assembly groove. Moreover, a first deformation part is provided between the first fixing part and the second fixing part, and a first magnetic element is also provided on the side of the first deformation part that is close to the first assembly groove. Thus, when the temperature changes, the first bracket can drive the first magnetic element to move through the first deformation part.

[0086] To ensure a more secure connection between the first bracket and the first magnetic component, a snap-fit ​​device can be installed on the first bracket. The following explanation uses the snap-fit ​​device as an example of a reverse-wrapping arm.

[0087] Optionally, in the embodiments of this application, combined with Figure 9 ,like Figure 10 As shown, the first plate-shaped support 11 further includes at least one first reverse arm 15, which is disposed on the side of the first deformable part 14 close to the first assembly groove 8.

[0088] In this embodiment of the application, the first anti-wrapping arm 15 and the first deformable part 14 together form an accommodating space for accommodating the first magnetic element 4.

[0089] Optionally, in this embodiment, the material of the at least one first reverse arm 15 may be the same as or different from the material of the first deformable part 14, and the at least one first reverse arm 15 may be integrally manufactured with the first deformable part 14; the shape and material of each of the at least one first reverse arm 15 may be the same or different; specifically, the shape of the at least one first reverse arm 15 may be C-shaped, L-shaped, etc.

[0090] Optionally, in the embodiments of the present application, the at least one first wrapping arm 15 can be arranged on the first edge of the one side of the first deformation part 14 close to the first assembly slot 8, can also be arranged on the second edge of the one side of the first deformation part 14 close to the first assembly slot 8, and can also be arranged on the first edge and the second edge of the one side of the first deformation part 14 close to the first assembly slot 8 respectively. The first edge and the second edge are two opposite edges of the one side of the first deformation part 14 close to the first assembly slot 8.

[0091] In one example, the at least one first wrapping arm 15 includes two C-shaped wrapping arms arranged on the first edge of the one side of the first deformation part 14 close to the first assembly slot 8. The two C-shaped wrapping arms and the first deformation part 14 enclose a containing space containing the first magnetic member 4.

[0092] In another example, as shown in Figure 11 The at least one first wrapping arm 15 includes two first C-shaped wrapping arms 16, one of which is arranged on the first edge 17 of the one side of the first deformation part 14 close to the first assembly slot 8, and the other is arranged on the second edge 18 of the one side of the first deformation part 14 close to the first assembly slot 8. The two first C-shaped wrapping arms 16 and the first deformation part 14 enclose a containing space containing the first magnetic member 4.

[0093] Therefore, since the first support includes at least one first wrapping arm, and the at least one first wrapping arm and the first deformation part enclose a containing space containing the first magnetic member, the first support can more firmly fix the first magnetic member.

[0094] Of course, two supports can also be arranged on the middle frame of the electronic device, so that when the electronic device is in an environment with large temperature changes, the electronic device can better balance and adapt to the fluctuation of the screen rebound force of the screen of the electronic device due to temperature changes. The following will be described in detail.

[0095] Optionally, in the embodiments of the present application, in combination with Figure 1 As shown in Figure 12 The second support 5 is arranged at the slot opening of the second assembly slot 9, and the one side of the second support 5 close to the second assembly slot 9 is provided with a second magnetic member 6.

[0096] Optionally, in the embodiments of the present application, the second support 5 can be a second plate-shaped support, which is symmetrically arranged with the first plate-shaped support 11 about the torque hinge 7 of the middle part of the electronic device.

[0097] In the embodiments of the present application, when the electronic device is in the first temperature range, the second support 5 is in the third form, and the distance between the first magnetic member 4 and the second magnetic member 6 is a third distance when the electronic device is in the folded state; in the second temperature range, the second support 5 is in the fourth form, and the distance between the first magnetic member 4 and the second magnetic member 6 is a fourth distance when the electronic device is in the folded state, and the third distance is less than the fourth distance.

[0098] Optionally, in the embodiments of the present application, the third form can be specifically a stretched state, and the fourth form can be specifically a state of being bent towards the bottom of the second assembly groove 9.

[0099] In the embodiments of the present application, in the process of changing the second support 5 from the third form to the fourth form, the second support 5 drives the second magnetic member 6 to move towards the bottom of the second assembly groove 9; in the process of changing the second support 5 from the fourth form to the third form, the second support 5 drives the second magnetic member 6 to move away from the bottom of the second assembly groove 9.

[0100] It can be understood that when the second support is in a lower temperature environment, it is in a stretched state; when the second support is in a higher temperature environment, it is in a state of being bent towards the bottom of the second assembly groove; when the temperature of the environment in which the electronic device is located changes from a lower temperature to a higher temperature, in the process of changing the second support from the third form to the fourth form, the second support drives the second magnetic member to move towards the bottom of the second assembly groove; when the temperature of the environment in which the electronic device is located changes from a higher temperature to a lower temperature, in the process of changing the second support from the fourth form to the third form, the second support drives the second magnetic member to move away from the bottom of the second assembly groove.

[0101] Therefore, as the electronic device is in different temperature environments, the second support can drive the second magnetic member to move towards or away from the bottom of the second assembly groove, so that the distance between the second magnetic member and the first magnetic member changes, which can change the magnetic attraction between the second magnetic member and the first magnetic member, thereby balancing the fluctuation of the screen rebound force of the screen of the electronic device due to temperature changes, so that the electronic device can be normally opened and closed in different temperature environments.

[0102] Of course, the second support and the first support can have the same structure, which will be described in detail below.

[0103] Optionally, in the embodiments of the present application, in combination with Figure 12 For example, Figure 13As shown, the second support 5 further comprises a third fixing portion 19 and a fourth fixing portion 20 fixedly connected with the slot wall of the second assembly slot 9 respectively, and a second deformation portion 21 arranged between the third fixing portion 19 and the fourth fixing portion 20, and the second magnetic member 6 is arranged on the side of the second deformation portion 21 facing the slot bottom of the second assembly slot 9.

[0104] Optionally, in the embodiment of the present application, the third fixing portion 19 and the fourth fixing portion 20 are used to fix the two ends of the second support 5 at the slot opening of the second assembly slot 9 respectively.

[0105] Specifically, the third fixing portion 19 and the fourth fixing portion 20 can be fixed on the slot wall of the accommodating groove 10 arranged at the slot opening of the second assembly slot 9 by laser welding, and the shapes of the third fixing portion 19 and the fourth fixing portion 20 can be adaptively arranged according to the shape and size of the accommodating groove.

[0106] Optionally, in the embodiment of the present application, when the ambient temperature of the second support 5 changes, the second deformation portion 21 deforms, and the second deformation portion 21 and the second magnetic member 6 are fixedly arranged together.

[0107] In one example, the second deformation portion 21 can be fixedly arranged with the second magnetic member by dispensing glue or arranging double-sided adhesive tape on the side close to the second assembly slot 9.

[0108] In another example, the second deformation portion 21 can be fixedly arranged with the second magnetic member 6 by arranging a clamping member on the side close to the second assembly slot 9.

[0109] Optionally, in the embodiment of the present application, the second deformation portion 21 can be an element part integrally made with the third fixing portion 19 and the fourth fixing portion 20, or can be an element part made of a material different from the third fixing portion 19 and the fourth fixing portion 20, and specifically, the material of the second deformation portion 21 can be a shape memory alloy material.

[0110] In the embodiment of the present application, in the process of changing the second support 5 from the third shape to the fourth shape, the second deformation portion 21 deforms in the direction towards the slot bottom of the second assembly slot 9; in the process of changing the second support 5 from the fourth shape to the third shape, the second deformation portion 21 deforms in the direction away from the slot bottom of the second assembly slot.

[0111] Therefore, the second support can be more firmly connected with the second assembly slot, and the third fixing part and the fourth fixing part are provided with the second deformation part, and the second magnetic member is further arranged on the side of the second deformation part close to the second assembly slot, so that the second support can drive the second magnetic member to move when the temperature changes.

[0112] In order to make the second support more firmly connected with the second magnetic member, a clamping member can also be arranged on the second support, and the following will be specifically described by taking the clamping member as an example.

[0113] Optionally, in the embodiment of the present application, the second support 5 further comprises at least one second reverse arm, and the at least one second reverse arm is arranged on the side of the second deformation part 21 close to the second assembly slot 9.

[0114] In the embodiment of the present application, the at least one second reverse arm and the second deformation part 21 enclose a containing space containing the second magnetic member 4.

[0115] Optionally, in the embodiment of the present application, the material of the at least one second reverse arm can be the same as or different from that of the second deformation part 21, and the at least one second reverse arm can be integrally made with the second deformation part 21; the shape and material of each second reverse arm in the at least one second reverse arm can be the same or different; specifically, the shape of the at least one second reverse arm can be C-shaped, L-shaped, etc.

[0116] It should be noted that the arrangement mode and shape of the at least one second reverse arm can refer to the related description of the arrangement mode and shape of the at least one first reverse arm 15, which will not be repeated here.

[0117] Therefore, the second support can be more firmly connected with the second assembly slot, and the third fixing part and the fourth fixing part are provided with the second deformation part, and the second magnetic member is further arranged on the side of the second deformation part close to the second assembly slot, so that the second support can drive the second magnetic member to move when the temperature changes.

[0118] The following will be specifically described by taking the first support as a U-shaped support as an example.

[0119] Example two,

[0120] Optionally, in the embodiment of the present application, the first support 3 can be a U-shaped support.

[0121] Specifically, the U-shaped support can be a foldable support made of a shape memory alloy material, which presents different shapes in different temperature environments: when the U-shaped support is in a first temperature range, it presents a first shape, for example, an extended state; when the U-shaped support is in a second temperature range, it presents a second shape, for example, a contracted state.

[0122] Optionally, in the embodiment of the present application, the first magnetic member 4 can be adsorbed and fixed on one side of the U-shaped support close to the first assembly groove 8 by magnetic attraction, or can be clamped and fixed on one side of the U-shaped support close to the first assembly groove 8 by a clamping structure; and the second magnetic member 6 is fixedly arranged in the second assembly groove 9.

[0123] Optionally, in the embodiment of the present application, the area of the bottom groove of the first assembly groove 8 is greater than the area of the surface of the first magnetic member 4 parallel to the bottom groove of the first assembly groove 8, and a gap is left between the first magnetic member 4 and the first assembly groove 8, so that the first magnetic member 4 can move in the first assembly groove 8 along a plane parallel to the groove opening of the first assembly groove 8.

[0124] In the embodiment of the present application, in the process of changing the first support 3 from the first shape to the second shape, the first support 3 drives the first magnetic member 4 to move in a first direction, so that the first magnetic member 4 and the second magnetic member 6 are dislocated; in the process of changing the first support 3 from the second shape to the first shape, the first support 3 drives the first magnetic member 4 to move in a second direction, so that the first magnetic member 4 and the second magnetic member 6 are opposite; the first direction and the second direction are parallel to the first plane, and the first direction and the second direction are opposite; the first plane is the plane in which the groove opening of the first assembly groove is located.

[0125] Optionally, in the embodiment of the present application, the first direction can be a direction parallel to the plane in which the groove opening of the first assembly groove 1 is located and towards the middle torque hinge of the electronic device; and the second direction can be a direction parallel to the plane in which the groove opening of the first assembly groove 1 is located and away from the middle torque hinge 7 of the electronic device.

[0126] It should be noted that the "first magnetic member and second magnetic member dislocation" can be understood as: the center points of the action surfaces (i.e., the overlapping surfaces of the vertical projections) between the first magnetic member and the second magnetic member are not opposite; and the "first magnetic member and second magnetic member opposite" can be understood as: the center points of the action surfaces (i.e., the overlapping surfaces of the vertical projections) between the first magnetic member and the second magnetic member are opposite.

[0127] For example, as shown in FIG. 1, the first magnetic member 4 and the second magnetic member 6 are dislocated, and the center points of the action surfaces (i.e., the overlapping surfaces of the vertical projections) between the first magnetic member 4 and the second magnetic member 6 are not opposite. Figure 14As shown in (a) of FIG. 1, the first support 3 is a U-shaped support 22, and the U-shaped support 22 is in an extended state when the U-shaped support 22 is in an environment at a first temperature of -10℃ (the first temperature is a temperature value in a first temperature range). As shown in (b) of FIG. 1, when the U-shaped support 22 is in an environment at a second temperature of 25℃ (the second temperature is a temperature value in a second temperature range), the U-shaped support 12 is in a contracted state. When the ambient temperature of the electronic device changes from the first temperature to the second temperature, the U-shaped support 22 drives the first magnetic part 4 to move in a direction parallel to the plane in which the slot of the first assembly groove 8 is located and toward the middle torque hinge 7 of the electronic device during the process in which the U-shaped support 22 changes from the first form to the second form. When the ambient temperature of the electronic device changes from the second temperature to the first temperature, the U-shaped support 22 drives the first magnetic part 4 to move in a direction parallel to the plane in which the slot of the first assembly groove 8 is located and away from the middle torque hinge 7 of the electronic device during the process in which the U-shaped support 22 changes from the second form to the first form. Figure 14

[0128] As can be seen, because the electronic device is in different temperature environments, the first support can drive the first magnetic part to move toward or away from the middle torque hinge of the electronic device, so that the acting area between the first magnetic part and the second magnetic part changes, which can change the magnetic attraction force between the first magnetic part and the second magnetic part, thereby balancing the fluctuation of the screen rebound force of the screen of the electronic device due to temperature changes, so that the electronic device can be normally opened and closed in different temperature environments.

[0129] The structure of the first support will be described below.

[0130] Optionally, as shown in (a) of FIG. 1, the first support 3 includes a first fixed part 21, a second fixed part 22, and a first deformation part 23. The first fixed part 21 is fixedly connected to the slot wall of the first assembly groove 8. The second fixed part 22 is arranged on the first fixed part 21. The first deformation part 23 is arranged between the first fixed part 21 and the second fixed part 22. Figure 15 Optionally, as shown in (a) of FIG. 1, the first support 3 includes a first fixed part 21, a second fixed part 22, and a first deformation part 23. The first fixed part 21 is fixedly connected to the slot wall of the first assembly groove 8. The second fixed part 22 is arranged on the first fixed part 21. The first deformation part 23 is arranged between the first fixed part 21 and the second fixed part 22.

[0131] Optionally, as shown in (a) of FIG. 1, the first support 3 includes a first fixed part 21, a second fixed part 22, and a first deformation part 23. The first fixed part 21 is fixedly connected to the slot wall of the first assembly groove 8. The second fixed part 22 is arranged on the first fixed part 21. The first deformation part 23 is arranged between the first fixed part 21 and the second fixed part 22.

[0132] Optionally, as shown in (a) of FIG. 1, the first support 3 includes a first fixed part 21, a second fixed part 22, and a first deformation part 23. The first fixed part 21 is fixedly connected to the slot wall of the first assembly groove 8. The second fixed part 22 is arranged on the first fixed part 21. The first deformation part 23 is arranged between the first fixed part 21 and the second fixed part 22.

[0133] ​In one example, the sixth fixing part 24 can be fixedly arranged with the first magnetic part 4 by being glued or provided with double-sided adhesive tape on the side close to the first assembly groove 8.

[0134] In another example, the sixth fixing part 24 can be fixedly arranged with the first magnetic part 4 by being provided with a clamping part on the side close to the first assembly groove 8.

[0135] Optionally, in the embodiment of the present application, the third deformation part 25 deforms when the ambient temperature of the first support 3 changes.

[0136] Optionally, in the embodiment of the present application, the third deformation part 25 can be an element part integrally made with the fifth fixing part 23 and the sixth fixing part 24, or can be an element part with different material from the fifth fixing part 23 and the sixth fixing part 24. Specifically, the material of the third deformation part 25 can be shape memory alloy material.

[0137] In the embodiment of the present application, in the process of changing the first support 3 from the first shape to the second shape, the third deformation part 25 contracts along the first direction; in the process of changing the first support 3 from the second shape to the first shape, the third deformation part 25 expands along the second direction.

[0138] It can be understood that the third deformation part is in the contracted shape at the second temperature with a higher temperature value, and in the process of changing the third deformation part from the expanded shape to the contracted shape when the environment of the electronic device changes from the first temperature to the second temperature, the third deformation part drives the first magnetic part to move along the plane parallel to the slot of the first assembly groove and towards the middle torque hinge of the electronic device; in the process of changing the third deformation part from the contracted shape to the expanded shape when the environment of the electronic device changes from the second temperature to the first temperature, the third deformation part drives the first magnetic part to move along the plane parallel to the slot of the first assembly groove and away from the middle torque hinge of the electronic device.

[0139] Therefore, it can be known that since the fifth fixing part of the first support is fixedly connected with the slot wall of the first assembly groove, the first support can be firmly connected with the first assembly groove, and the third deformation part is arranged between the fifth fixing part and the sixth fixing part, so that the first support can drive the first magnetic part arranged on the sixth fixing part to move through the third deformation part when the temperature changes.

[0140] Similarly, in order to make the first support more firmly connected with the first magnetic part, a clamping part can also be arranged on the first support, which will be specifically described below by taking the clamping part as an example.

[0141] Optionally, in the embodiment of the present application, in combination with Figure 15 For example, the first support 3 can be provided with a clamping part 24 on the side close to the first assembly groove 8, and the clamping part 24 is arranged to be in contact with the first magnetic part 4. Figure 16As shown, the first bracket 3 further includes at least one snap-fit ​​member 26, which is disposed on the end of the sixth fixing part 24 away from the fifth fixing part 23.

[0142] In this embodiment, the first magnetic component 4 is fixedly connected to the first bracket 3 via at least one snap-fit ​​component 26.

[0143] Optionally, in this embodiment, the at least one snap-fit ​​member 26 can be at least one third reverse arm. The material of the at least one third reverse arm can be the same as or different from the material of the third deformable part 25. The at least one third reverse arm can be a component part integrally formed with the third deformable part 25. The shape and material of each of the at least one third reverse arm can be the same or different. Specifically, the shape of the at least one third reverse arm can be C-shaped, L-shaped, etc.

[0144] For example, such as Figure 17 As shown, at least one snap-fit ​​member 26 includes two second C-shaped reverse-wrap arms 27, wherein one second C-shaped reverse-wrap arm 27 is disposed at a first position 28 on the end of the sixth fixing part 24 away from the fifth fixing part 23, and the other second C-shaped reverse-wrap arm 27 is disposed at a second position 29 on the end of the sixth fixing part 24 away from the fifth fixing part 23. The two second C-shaped reverse-wrap arms 27 and the sixth fixing part 24 together form an accommodating space for accommodating the first magnetic member 4.

[0145] Thus, since the first bracket includes at least one snap-fit ​​member, and the at least one snap-fit ​​member and the sixth fixing part together form an accommodating space for accommodating the first magnetic member, the first bracket can more firmly fix the first magnetic member.

[0146] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0147] The embodiments of the present application are described above with reference to the accompanying drawings, but the present application is not limited to the specific embodiments described above, and the specific embodiments described above are merely illustrative, but not restrictive, and a person of ordinary skill in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims.

Claims

1. An electronic device, comprising: The electronic device comprises: a first shell and a second shell, which are rotationally connected to switch the electronic device between an unfolded state and a folded state; a first support is arranged on the first shell, and a first magnetic member is arranged on the first support; a second support is arranged on the second shell, and a second magnetic member is arranged on the second support; wherein the shape of the first support can change with temperature, in a first temperature range, the first support is in a first shape, and the distance between the first magnetic member and the second magnetic member is a first distance when the electronic device is in the folded state; in a second temperature range, the first support is in a second shape, and the distance between the first magnetic member and the second magnetic member is a second distance when the electronic device is in the folded state, the first distance being smaller than the second distance; the first support is a shape memory alloy member; in the process of changing the first support from the first shape to the second shape, the first support drives the first magnetic member to move in a first direction, so that the first magnetic member and the second magnetic member are misaligned; a first magnetic attraction force exists between the first magnetic member and the second magnetic member; in the process of changing the first support from the second shape to the first shape, the first support drives the first magnetic member to move in a second direction, so that the first magnetic member and the second magnetic member are opposite to each other; a second magnetic attraction force exists between the first magnetic member and the second magnetic member; the second magnetic attraction force is greater than the first magnetic attraction force; the first direction and the second direction are parallel to a first plane, and the first direction and the second direction are opposite to each other; a first assembly groove is arranged on the first shell; the first plane is a plane where a groove opening of the first assembly groove is located.

2. The electronic device of claim 1, wherein, a second assembly groove is further arranged on the second shell; when the electronic device is in the folded state, the first assembly groove and the second assembly groove are opposite to each other; the first support is arranged in the first assembly groove, and the second support is arranged in the second assembly groove.

3. The electronic device of claim 2, wherein, the first support comprises a first fixed part, a second fixed part and a first deformation part, the first fixed part and the second fixed part are fixedly connected with groove walls of the first assembly groove respectively, the first deformation part is arranged between the first fixed part and the second fixed part, and the first magnetic member is arranged on a side of the first deformation part facing a groove bottom of the first assembly groove; wherein in the process of changing the first support from the first shape to the second shape, the first deformation part deforms in a direction towards the groove bottom of the first assembly groove; in the process of changing the first support from the second shape to the first shape, the first deformation part deforms in a direction away from the groove bottom of the first assembly groove.

4. The electronic device of claim 2, wherein, the second support is arranged at a groove opening of the second assembly groove, and the second magnetic member is arranged on a side of the second support close to the second assembly groove; In a case where the electronic device is in the first temperature range, the second support is in a third form, and a distance between the first magnetic member and the second magnetic member is a third distance when the electronic device is in a folded state; in a second temperature range, the second support is in a fourth form, and a distance between the first magnetic member and the second magnetic member is a fourth distance when the electronic device is in the folded state, the third distance being less than the fourth distance.

5. The electronic device of claim 4, wherein, The second support further includes: a third fixed part, a fourth fixed part and a second deformation part, the third fixed part and the fourth fixed part being fixedly connected with a groove wall of the second assembly groove respectively, the second deformation part being arranged between the third fixed part and the fourth fixed part, the second magnetic member being arranged on a side of the second deformation part facing a groove bottom of the second assembly groove; wherein, in a process in which the second support changes from the third form to the fourth form, the second deformation part deforms in a direction towards the groove bottom of the second assembly groove; in a process in which the second support changes from the fourth form to the third form, the second deformation part deforms in a direction away from the groove bottom of the second assembly groove.

6. The electronic device of claim 1, wherein, The first magnetic member is fixedly connected with the first support by adhesive, or the first magnetic member is fixedly connected with the first support by a clamping structure.

7. The electronic device of claim 4, wherein, The first support further includes: a fifth fixed part, a sixth fixed part and a third deformation part, the fifth fixed part being fixedly connected with a groove wall of the first assembly groove, the first magnetic member being arranged on a side of the sixth fixed part close to the first assembly groove; the third deformation part being arranged between the fifth fixed part and the sixth fixed part; wherein, in a process in which the first support changes from the first form to the second form, the third deformation part contracts along the first direction; in a process in which the first support changes from the second form to the first form, the third deformation part expands along the second direction.

8. The electronic device of claim 7, wherein, The first support further includes: at least one clamping member, the at least one clamping member being arranged on an end of the sixth fixed part away from the fifth fixed part; wherein, the first magnetic member is fixedly connected with the first support by the at least one clamping member.

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