A positioning and handling device for wafers

Abstract

The application provides a positioning and carrying device for a wafer, relates to the technical field of carrying devices, and comprises a support, a transverse carrying module arranged on the support, a first stepping motor, an output end of the first stepping motor, a first synchronous wheel assembly, a driving sliding block arranged on the surface of the first synchronous wheel assembly, a lifting module arranged at the bottom of the transverse carrying module, a second stepping motor, and a second synchronous wheel assembly arranged at the output end of the second stepping motor. In actual use, the transverse carrying module, the lifting module, a rotating assembly, a taking assembly and a measuring assembly are arranged, so that the positioning and carrying of the wafer are facilitated, the mechanical hand is fully utilized, and the device has the advantages of simple structure, low cost, short beat, and convenient operation.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of conveying devices, in particular to a positioning conveying device for wafers. BACKGROUND

[0002] A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and its raw material is silicon. After high-purity polycrystalline silicon is dissolved and added to a silicon crystal seed, a cylindrical single crystal silicon is formed by slowly pulling it out. In a traditional semiconductor device, a mechanical hand for conveying wafers generally takes a wafer from a flower basket, then places it in a special positioning mechanism for positioning, and then places it in a next process, which has a long beat and low space utilization rate around the mechanical hand. SUMMARY

[0003] The present application aims to solve the problems in the prior art and provides a positioning conveying device for wafers.

[0004] In order to achieve the above-mentioned purpose, the present application adopts the following technical scheme: a positioning conveying device for wafers, comprising a support, a horizontal transfer module is arranged on the support, the horizontal transfer module comprises a first stepper motor, the first stepper motor is mounted on the surface of the support, a first synchronous wheel assembly is mounted on the output end of the first stepper motor, a driving sliding block is arranged on the surface of the first synchronous wheel assembly, a lifting module is arranged at the bottom of the horizontal transfer module, the lifting module comprises a second stepper motor, the second stepper motor is arranged on one side of the support, a second synchronous wheel assembly is mounted on the output end of the second stepper motor, a ball screw is mounted on the surface of the second synchronous wheel assembly, a sliding block is sleeved on the outer surface of the ball screw, a rotating assembly is further arranged on the surface of the horizontal transfer module, the rotating assembly comprises a rotating mounting seat, the rotating mounting seat is mounted on the surface of the support, a third stepper motor is mounted on the bottom surface of the rotating mounting seat, a synchronous wheel is arranged on the output end of the third stepper motor, a driving rotating shaft is mounted on the top surface of the synchronous wheel, a material taking assembly is arranged above the rotating assembly, the material taking assembly comprises a fourth stepper motor, the fourth stepper motor is mounted on the rotating assembly, a wafer carrying plate is mounted on the output end of the fourth stepper motor, a wafer positioning plate is arranged on one side of the wafer carrying plate, a measuring assembly is arranged on one side of the material taking assembly, the measuring assembly comprises a pneumatic cylinder, the pneumatic cylinder is arranged on the material taking assembly, a linear guide rail is mounted on the output end of the pneumatic cylinder.

[0005] In order to connect the driving rotating shaft and the rotating mounting seat, the present application is improved, a limiting pin is arranged between the driving rotating shaft and the rotating mounting seat, and an adjusting screw is arranged between the rotating mounting seat and the support.

[0006] In order to improve the accuracy, a wafer positioning sensor is mounted on the surface of the wafer positioning plate.

[0007] To position the wafer, the present invention is improved in that the wafer positioning plates are symmetrically distributed on the wafer carrier plate, and one side of the wafer positioning plates has an arc-shaped structure.

[0008] To assist in scanning, the present invention is improved by mounting a measuring sensor on the surface of the linear guide rail.

[0009] Compared with the prior art, the advantages and positive effects of the present invention are as follows:

[0010] In practical use, this invention features a simple structure, low cost, short cycle time, and easy operation by setting up a horizontal transfer module, a lifting module, a rotating component, a material picking component, and a measuring component. This facilitates the positioning and handling of wafers and makes full use of the robotic arm. Attached Figure Description

[0011] Figure 1 This invention provides a schematic diagram of the overall structure of a positioning and handling device for wafers.

[0012] Figure 2 This invention proposes a positioning and handling device for wafers. Figure 1 Schematic diagram of the measurement component and material handling component;

[0013] Figure 3 This invention proposes a positioning and handling device for wafers. Figure 1 Schematic diagram of the rotating component structure;

[0014] Figure 4 This invention proposes a positioning and handling device for wafers. Figure 1 Schematic diagram of the lifting module structure;

[0015] Figure 5 This invention proposes a positioning and handling device for wafers. Figure 1 Schematic diagram of the transverse transfer module structure.

[0016] Legend:

[0017] 1. Measuring component; 2. Picking component; 3. Rotating component; 4. Lifting module; 5. Lateral transfer module; 6. Measuring sensor; 7. Wafer carrier plate; 8. Wafer positioning plate; 9. Wafer positioning sensor; 10. Stepper motor No. 3; 11. Cylinder; 12. Linear guide rail; 13. Stepper motor No. 4; 14. Synchronous pulley; 15. Drive rotary shaft; 16. Limit pin; 17. Rotary mounting base; 18. Adjusting screw; 19. Stepper motor No. 2; 20. Synchronous pulley No. 2 assembly; 21. Ball screw; 22. Slider; 23. Stepper motor No. 1; 24. Synchronous pulley No. 1 assembly; 25. Drive slider; 26. Support. Detailed Implementation

[0018] In order to enable a more clear understanding of the above-mentioned objects, features and advantages of the present application, the present application will be further described below with reference to the drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0019] In the following description, a large number of specific details are set forth in order to facilitate a thorough understanding of the present application, but the present application can also be implemented in other ways different from those described herein, and therefore the present application is not limited to the specific embodiments disclosed in the following description.

[0020] Embodiment one, please refer to Figures 1-5 The present application provides a technical solution: a positioning and carrying device for a wafer, comprising a support 26, the support 26 is provided with a horizontal transfer module 5, the horizontal transfer module 5 comprises a first stepper motor 23, the first stepper motor 23 is installed on the surface of the support 26, the output end of the first stepper motor 23 is installed with a first synchronous wheel assembly 24, the surface of the first synchronous wheel assembly 24 is provided with a driving sliding block 25, the bottom of the horizontal transfer module 5 is provided with a lifting module 4, the lifting module 4 comprises a second stepper motor 19, the second stepper motor 19 is arranged on one side of the support 26, the output end of the second stepper motor 19 is installed with a second synchronous wheel assembly 20, the surface of the second synchronous wheel assembly 20 is installed with a ball screw 21, the outer surface of the ball screw 21 is sleeved with a sliding block 22, the surface of the horizontal transfer module 5 is further provided with a rotating assembly 3, the rotating assembly 3 comprises a rotating mounting seat 17, a limiting pin 16 is arranged between the driving rotating shaft 15 and the rotating mounting seat 17, an adjusting screw 18 is arranged between the rotating mounting seat 17 and the support 26, by arranging the adjusting screw 18, the function of connecting the rotating mounting seat 17 is achieved.

[0021] Please refer to Figures 1-5, the bottom surface of the rotating mounting base 17 is provided with a third stepper motor 10, the output end of the third stepper motor 10 is provided with a synchronous wheel 14, the top surface of the synchronous wheel 14 is provided with a driving rotating shaft 15, the upper portion of the rotating assembly 3 is provided with a material taking assembly 2, the material taking assembly 2 comprises a fourth stepper motor 13, the fourth stepper motor 13 is mounted on the rotating assembly 3, the output end of the fourth stepper motor 13 is mounted with a wafer bearing plate 7, one side of the wafer bearing plate 7 is provided with a wafer positioning plate 8, the surface of the wafer positioning plate 8 is mounted with a wafer positioning sensor 9, the accuracy of wafer positioning is judged through the wafer positioning sensor 9, the wafer positioning plate 8 is symmetrically distributed on the wafer bearing plate 7, one side of the wafer positioning plate 8 is in an arc structure, one side of the material taking assembly 2 is provided with a measuring assembly 1, the measuring assembly 1 comprises a pneumatic cylinder 11, the pneumatic cylinder 11 is arranged on the material taking assembly 2, the output end of the pneumatic cylinder 11 is mounted with a linear guide rail 12, the surface of the linear guide rail 12 is mounted with a measuring sensor 6, the measuring sensor 6 is extended out through the linear guide rail 12, and the wafer in the flower basket is scanned.

[0022] Working principle: through the arrangement of the support 26, the transverse transfer module 5, the lifting module 4, the rotating assembly 3, the material taking assembly 2 and the measuring assembly 1, in actual use, the position of the wafer in the flower basket is judged through the measuring sensor 6, the wafer is carried through the arrangement of the wafer bearing plate 7 on the material taking assembly 2, the carried wafer is positioned through the arrangement of the wafer positioning plate 8, the accuracy of wafer positioning is judged through the wafer positioning sensor 9, the stepper motor is arranged on the rotating assembly 3, the material taking mechanism can be rotated by 270°, the lifting module 4 can carry wafers of different heights, the transverse transfer module 5 can carry wafers at different positions, the pneumatic cylinder 11 arranged in the measuring assembly 1 extends the measuring sensor 6 out through the linear guide rail 12, and the wafer in the flower basket is scanned, the wafer bearing plate 7 is driven to extend into the flower basket to take the wafer through the arrangement of the stepper motor in the material taking assembly 2, the wafer bearing plate is retracted, so that the wafer reaches the wafer positioning plate 8 for positioning, the accuracy of wafer positioning is judged through the wafer positioning sensor 9, the stepper motor arranged in the rotating assembly 3 is driven, the synchronous wheel 14 is mounted on the motor, the rotating shaft 15 is driven to rotate through the synchronous belt, the limiting pin 16 is arranged on the assembly, the rotating shaft is mounted on the rotating mounting base 17, the adjusting screw 18 is arranged on the rotating mounting base 17, the stepper motor arranged in the lifting module 4 drives the sliding block 22 to move up and down through the synchronous wheel 14 assembly, the transverse transfer module 5 is provided with a linear sliding rail, the stepper motor arranged therein drives the sliding block 25 to move transversely through the synchronous wheel 14 assembly, and the transfer module is mounted on the module mounting support 26.

[0023] The above merely describes preferred embodiments of the present application, but is not intended to limit the present application to other forms, any person skilled in the art can make changes or modifications to the above disclosed technical contents into equivalent embodiments with equivalent changes, and apply to other fields, but any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application without departing from the technical solution content of the present application still belongs to the protection scope of the present application technical solution.

Claims

1. A positioning and handling device for wafers, comprising a support (26), characterized in that: The support (26) is provided with a transverse moving module (5), the transverse moving module (5) comprises a first stepper motor (23), the first stepper motor (23) is installed on the surface of the support (26), the output end of the first stepper motor (23) is provided with a first synchronous wheel assembly (24), the surface of the first synchronous wheel assembly (24) is provided with a driving sliding block (25), the bottom of the transverse moving module (5) is provided with a lifting module (4), the lifting module (4) comprises a second stepper motor (19), the second stepper motor (19) is arranged on one side of the support (26), the output end of the second stepper motor (19) is provided with a second synchronous wheel assembly (20), the surface of the second synchronous wheel assembly (20) is provided with a ball screw (21), the outer surface of the ball screw (21) is provided with a sliding block (22), the surface of the transverse moving module (5) is further provided with a rotating assembly (3), the rotating assembly (3) comprises a rotating mounting base (17), the rotating mounting base (17) is installed on the surface of the support (26), the bottom surface of the rotating mounting base (17) is provided with a third stepper motor (10), the output end of the third stepper motor (10) is provided with a synchronous wheel (14), the top surface of the synchronous wheel (14) is provided with a driving rotating shaft (15), the upper portion of the rotating assembly (3) is provided with a material taking assembly (2), the material taking assembly (2) comprises a fourth stepper motor (13), the fourth stepper motor (13) is installed on the rotating assembly (3), the output end of the fourth stepper motor (13) is provided with a wafer bearing plate (7), one side of the wafer bearing plate (7) is provided with a wafer positioning plate (8), one side of the material taking assembly (2) is provided with a measuring assembly (1), the measuring assembly (1) comprises a pneumatic cylinder (11), the pneumatic cylinder (11) is arranged on the material taking assembly (2), the output end of the pneumatic cylinder (11) is provided with a linear guide rail (12).

2. The positioning and handling device for wafers according to claim 1, characterized in that: The driving rotating shaft (15) and the rotating mounting base (17) are provided with a limiting pin (16), and the rotating mounting base (17) and the support (26) are provided with an adjusting screw (18).

3. The positioning and handling device for wafers according to claim 1, characterized in that: The surface of the wafer positioning plate (8) is provided with a wafer positioning sensor (9).

4. The positioning and handling device for wafers according to claim 3, characterized in that: The wafer positioning plates (8) are symmetrically distributed on the wafer bearing plate (7), and one side of the wafer positioning plate (8) is in an arc structure.

5. The positioning and handling device for wafers according to claim 1, characterized in that: The surface of the linear guide rail (12) is provided with a measuring sensor (6).

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