Electronic device

Abstract

An electronic device includes a substrate and a plurality of first bonding pads. The substrate includes a bonding region. The plurality of first bonding pads is disposed on the substrate and in the bonding region. A portion of the plurality of first bonding pads is arranged along a first direction, and another portion of the plurality of first bonding pads is arranged along a second direction. The first direction and the second direction have an included angle therebetween, and the included angle is greater than 0 degrees and less than 90 degrees.

Description

Technical Field

[0001] This disclosure relates to an electronic device, and more particularly to an electronic device having a drive circuit. Background Technology

[0002] As electronic devices have evolved and their dimensions have continuously shrunk, numerous unresolved challenges have arisen in their manufacturing processes. The area for driver circuitry (such as integrated circuits) may be limited by routing requirements, making it impossible to meet bezel specifications. Furthermore, current driver circuit bonding can be prone to deformation, breakage, stress concentration, and uneven pressure. Therefore, while existing electronic devices generally meet these requirements, they are not entirely satisfactory in all aspects. Consequently, improvements to the structure of electronic devices are still needed to manufacture devices that meet product demands. Summary of the Invention

[0003] This disclosure provides an electronic device including a substrate and a plurality of first bonding pads. The substrate includes a bonding region. The plurality of first bonding pads are disposed on the substrate and in the bonding region. A portion of the plurality of first bonding pads are arranged along a first direction, and another portion of the plurality of first bonding pads are arranged along a second direction. An angle is formed between the first direction and the second direction, and the angle is greater than 0 degrees and less than 90 degrees. Attached Figure Description

[0004] This disclosure can be more fully understood by referring to the accompanying drawings and the following detailed description and examples, in which:

[0005] Figure 1 A schematic diagram of an electronic device according to some embodiments of the present disclosure is shown.

[0006] Figure 2 Some embodiments according to this disclosure are shown. Figure 1 A close-up view of the lower part of the electronic device.

[0007] Figure 3 This is a perspective view of the bonding pad of a driving circuit according to some embodiments of the present disclosure.

[0008] Figure 4 A schematic diagram of the bonding pads of a drive circuit according to some embodiments of the present disclosure is shown.

[0009] Figure 5 A schematic diagram of the joining area and a portion of the working area according to some embodiments of the present disclosure is shown.

[0010] Figure 6 Some embodiments according to this disclosure are shown. Figure 4A partial enlarged view of the bonding pads of the drive circuit, showing a portion of the first dummy bonding pad.

[0011] Figure 7 A schematic diagram of a first dummy pad or a second dummy pad according to some embodiments of the present disclosure is shown.

[0012] Figure 8 Some embodiments according to this disclosure are shown. Figure 1 A partial enlarged view of the lower part of the electronic device, in which the first dummy pad is particularly shown. Detailed Implementation

[0013] This disclosure will be more clearly understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and to maintain the simplicity of the drawings, many of the figures depict only a portion of the display device, and certain components in the figures are not drawn to scale. Furthermore, the number and dimensions of the components in the figures are for illustrative purposes only and are not intended to limit the scope of this disclosure. Additionally, similar and / or corresponding reference numerals may be used in different embodiments, merely to clearly describe some embodiments, and do not represent any association between the different embodiments and / or structures discussed.

[0014] Throughout this disclosure and in the appended claims, certain terms are used to refer to specific components. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same components. This document is not intended to distinguish between components that have the same function but different names. In the following description and claims, words such as "comprising," "containing," and "having" are open-ended terms and should therefore be interpreted as "containing but not limited to...". Thus, when the terms "comprising," "containing," and / or "having" are used in the description of this disclosure, they specify the presence of the corresponding feature, area, step, operation, and / or component, but do not exclude the presence of one or more of the corresponding feature, area, step, operation, and / or component.

[0015] Furthermore, relative terms such as "below" or "bottom" and "above" or "top" may be used in the embodiments to describe the relative relationship of one component of the figures to another component. It is understood that if the apparatus in the figures is flipped so that it is upside down, the component described as being on the "below" side will become the component on the "above" side.

[0016] When a component (e.g., an assembly, membrane, or region) is referred to as "on another component" or "connected to another component," it can be directly on or directly connected to another component, or there may be other components between them. Conversely, when a component is referred to as "directly on another component" or "directly connected to another component," there are no components between them. Furthermore, when a component is referred to as "on another component," the two components are vertically related in a planar view, and this component can be above or below the other component, depending on the orientation of the device. Additionally, the terms "electrically connected" or "electrically coupled" encompass any means of direct or indirect electrical connection.

[0017] The terms “approximately,” “equal to,” “equivalent to,” “same,” “substantially,” or “proximately” are generally interpreted as being within 20% of a given value or range, or as being within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

[0018] It is understood that although terms such as "first," "second," etc., may be used herein to describe various components, layers, and / or portions, these components, layers, and / or portions should not be limited by these terms, and these terms are only used to distinguish different components, layers, and / or portions. Therefore, a first component, layer, and / or portion discussed below may be referred to as a second component, layer, and / or portion without departing from the teaching of some embodiments of this disclosure. Furthermore, for the sake of brevity, terms such as "first," "second," etc., may not be used in the specification to distinguish different components. Without departing from the scope defined in the appended claims, the first and / or second components described in the claims may be interpreted as any component described in the specification.

[0019] In this disclosure, the thickness, length, and width can be measured using an optical microscope, and the thickness can be measured from a cross-sectional image in an electron microscope, but is not limited thereto. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error. If the first value equals the second value, it implies an error of approximately 10% between the first and second values; if the first direction is perpendicular to the second direction, the angle between the first and second directions may be between 80 and 100 degrees; if the first direction is parallel to the second direction, the angle between the first and second directions may be between 0 and 10 degrees.

[0020] It should be noted that the technical solutions provided in the different embodiments below can be substituted for, combined or mixed with each other to constitute another embodiment without violating the spirit of this disclosure.

[0021] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.

[0022] Electronic devices may include, but are not limited to, display devices, backlight devices, light-emitting devices, antenna devices, touch devices, sensing devices, or splicing devices. Electronic devices may be bendable or flexible. Display devices may be non-emissive or emissive. Electronic devices may include, for example, diodes, liquid crystals, light-emitting diodes (LEDs), quantum dots (QDs), fluorescence, phosphorescence, other suitable display media, or combinations thereof. Antenna devices may be liquid crystal type antenna devices or non-liquid crystal type antenna devices. Sensing devices may be sensing devices for capacitance, light, heat, or ultrasound, but are not limited to these. Electronic devices may include passive and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. Diodes may include light-emitting diodes or photodiodes. Light-emitting diodes (LEDs) may include, for example, organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, or quantum dot LEDs, but are not limited thereto. Splicing devices may be, for example, display splicing devices or antenna splicing devices, but are not limited thereto. It should be noted that electronic devices may be any combination of the foregoing, but are not limited thereto. The following description uses display devices as electronic devices or splicing devices to illustrate the content of this disclosure, but this disclosure is not limited thereto.

[0023] Please see Figure 1 , Figure 1A schematic diagram of an electronic device 100 according to some embodiments of the present disclosure is shown. The electronic device 100 may be a computer, tablet computer, wearable computer (e.g., smart watch, smart bracelet, smart glasses, etc.), smartphone, traditional cellphone, display device (e.g., monitor, virtual reality headset), etc., but is not limited thereto.

[0024] like Figure 1 As shown, the electronic device 100 may include a substrate 40, which includes a working region 10 and a peripheral region 20. The working region 10 may be, for example, an active region or a display region. The peripheral region 20 may be an active region or a non-display region. For example, the electronic device may also include a plurality of sub-pixels (not shown) disposed on the substrate 40, the area enclosed by the outermost edges of the plurality of sub-pixels being the working region 10, and the area outside the working region 10 being the peripheral region 20. The electronic device 100 may also include wires 30 disposed on the substrate 40. The material of the wires 30 may include, for example, molybdenum (Mo), titanium (Ti), tantalum (Ta), niobium (Nb), hafnium (Hf), nickel (Ni), chromium (Cr), cobalt (Co), zirconium (Zr), tungsten (W), aluminum (Al), copper (Cu), silver (Ag), other suitable metals, metal oxides (e.g., indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium germanium zinc oxide), or alloys or combinations of the above materials. This disclosure is not limited thereto, and the wires 30 may transmit current and / or signals. In some embodiments, thin-film transistors may be disposed on substrate 40. In other embodiments, the electronic device further includes another substrate (not shown) disposed corresponding to substrate 40, and a display medium may be disposed between substrate 40 and the other substrate. This disclosure is not limited thereto.

[0025] According to some embodiments of this disclosure, the peripheral region 20 is adjacent to the working region 10. For example, the peripheral region 20 may be located on the periphery of the working region 10, and the peripheral region 20 may surround the working region 10. A wire 30 may connect the working region 10 and the peripheral region 20. For example, the wire 30 may electrically connect the pixels (or light-emitting units) disposed in the working region 10 and the electronic components in the peripheral region 20 to each other, thereby allowing current and / or signal transmission between the working region 10 and the peripheral region 20.

[0026] Please see Figure 2 , Figure 2 Some embodiments according to this disclosure are shown. Figure 1 A partial enlarged view of the lower part of the electronic device 100. (See image below.) Figure 2 As shown, there may be a distance S1 between the lower edge 10LE of the working area 10 and the lower edge 20LE of the peripheral area 20; and the working area 10 may have a width 10W. According to some embodiments of this disclosure, the lower edge 20LE of the peripheral area 20 may be the lower edge of the substrate 40 of the electronic device 100.

[0027] Please continue reading. Figure 2 The surrounding area 20 may include a joining area 21. It should be noted that, for ease of understanding, in Figure 2 In the diagram, the extent of the joining region 21 is indicated by a dashed line. For example... Figure 2 As shown, the engagement region 21 may be located between the lower edge 10LE of the working region 10 and the lower edge 20LE of the peripheral region 20. According to some embodiments of this disclosure, the engagement region 21 may not contact the lower edge 10LE of the working region 10 or the lower edge 20LE of the peripheral region 20.

[0028] like Figure 2 As shown, the bonding region 21 can be connected to the pixels in the working region 10 via the wire 30 to allow current and / or signal transmission between the working region 10 and the bonding region 21.

[0029] Please see Figure 2 According to some embodiments of this disclosure, the bonding region 21 may, for example, be a region corresponding to a driving circuit (e.g., an integrated circuit).

[0030] According to some embodiments of this disclosure, the distance S1 can be less than 3200 micrometers (μm). Please refer to some embodiments of this disclosure. Figure 2The width 21LS' of the bonding region 21 along the first direction D1 (e.g., the maximum width along the first direction D1) can be less than or equal to the width 10W of the working region 10 along the first direction D1 (e.g., the maximum width along the first direction D1). In other embodiments, the width 21LS' of the bonding region 21 can also be considered as the width of the driving circuit (e.g., an integrated circuit) along the first direction D1, but this disclosure is not limited thereto. According to some embodiments of this disclosure, the ratio (21LS' / 10W) of the width 21LS' of the bonding region 21 to the width 10W of the working region 10 can be between 0 and 1 (0 ≤ 21LS' / 10W ≤ 1). According to some embodiments of this disclosure, the ratio (21LS' / 10W) of the width 21LS' of the bonding region 21 to the width 10W of the working region 10 can be between 0.172 and 0.258 (0.172 ≤ 21LS' / 10W ≤ 0.258). The first direction D1 of this disclosure can be, for example, the extension direction of a gate line (not shown), the fourth direction D4 can be, for example, perpendicular to the first direction D1, and the fifth direction D5 can be perpendicular to the first direction D1 and the fourth direction D4. The fifth direction D5 can be, for example, the normal direction of the electronic device 100, but this disclosure is not limited thereto.

[0031] Please see Figure 3 , Figure 3 This is a perspective view of the bonding pads of a drive circuit according to some embodiments of the present disclosure. Figure 3 As shown, the electronic device 100 may further include a driving circuit 50 disposed on the substrate 40 and corresponding to the bonding area 21 on the substrate 40, and the bonding pads of the driving circuit 50 (the configuration of which can be referred to) Figure 4 This can correspond to the bonding pads on substrate 40 (configuration can be found in the reference). Figure 5 They are electrically connected to each other. Figure 3 This is a perspective view that shows the bonding pads on the lower surface of the drive circuit 50.

[0032] like Figure 3 As shown, the drive circuit 50 may include a plurality of first bonding pads 511, a plurality of second bonding pads 521, a plurality of first dummy bonding pads 53, and a plurality of second dummy bonding pads 54. However, the detailed configuration of the first bonding pads 511, second bonding pads 521, first dummy bonding pads 53, and second dummy bonding pads 54 will be described in reference to... Figure 4 This will be explained together.

[0033] Please see Figure 4 , Figure 4 A schematic diagram of the configuration of the bonding pads of a drive circuit 50 (e.g., an integrated circuit) according to some embodiments of the present disclosure is shown.

[0034] Please continue reading. Figure 4 The plurality of second bonding pads 521 may be disposed farther from the upper edge 50UE of the driving circuit 50 than the plurality of first bonding pads 511. For example, the plurality of second bonding pads 521 may be disposed farther from the working area 10 than at least a portion of the plurality of first bonding pads 511. Moreover, at least a portion of the first bonding pads 511 is disposed between the upper edge 50UE and the second bonding pads 521. At least a portion of the first dummy pads 53 may be disposed between the first bonding pads 511 and the upper edge 50UE. The second dummy pads 54 may be disposed between the first bonding pads 511 and the second bonding pads 521.

[0035] A first portion 511a of the first bonding pads 511 is arranged along a first direction D1 (for example, it may be the X-axis), a second portion 511b of the first bonding pads 511 is arranged along a second direction D2 (as Figure 4 indicated by the arrow in), and a third portion 511c of the first bonding pads 511 is arranged along a third direction D3 (as Figure 4 indicated by the arrow in). It should be noted that for ease of understanding, in Figure 4 , the ranges of the first portion 511a, the second portion 511b, and the third portion 511c are respectively represented by dashed boxes.

[0036] Please refer to Figure 4 , in some embodiments, the upper edge 50UE of the driving circuit 50 may be parallel to the first direction D1, and the side edge 50WS of the driving circuit 50 may extend along a fourth direction D4 (for example, it may be the Y-axis), but the present disclosure is not limited thereto. According to some embodiments of the present disclosure, the upper edge 50UE of the driving circuit 50 may be perpendicular to the side edge 50WS of the driving circuit 50, but the present disclosure is not limited thereto.

[0037] According to some embodiments of the present disclosure, there is an included angle A1 between the first direction D1 and the second direction D2, and the included angle A1 is greater than 0 degrees and less than 90 degrees (0° < A1 < 90°). According to some embodiments of the present disclosure, there is an included angle A2 between the first direction D1 and the third direction D3, and the included angle A2 is greater than 0 degrees and less than 90 degrees (0° < A2 < 90°).

[0038] According to some embodiments of the present disclosure, the included angle A1 between the first direction D1 and the second direction D2 may be greater than or equal to 2 degrees and less than or equal to 20 degrees (2° ≤ A1 ≤ 20°). According to some embodiments of the present disclosure, the included angle A2 between the first direction D1 and the third direction D3 may be greater than or equal to 2 degrees and less than or equal to 20 degrees (2° ≤ A2 ≤ 20°).

[0039] As Figure 4As shown, the second portion 511b and the third portion 511c of the first bonding pad 511 can be located on both sides of the first portion 511a of the first bonding pad 511, respectively. For example, the second portion 511b and the third portion 511c of the first bonding pad 511 can be located on the left and right sides of the first portion 511a of the first bonding pad 511, respectively.

[0040] Furthermore, according to some embodiments of this disclosure, the second portion 511b of the first bonding pad 511 may be disposed adjacent to the first portion 511a of the first bonding pad 511, such that the second portion 511b of the first bonding pad 511 and the first portion 511a of the first bonding pad 511 are continuous.

[0041] Similarly, according to some embodiments of the present disclosure, the third portion 511c of the first bonding pad 511 may be disposed adjacent to the first portion 511a of the first bonding pad 511, such that the third portion 511c of the first bonding pad 511 and the first portion 511a of the first bonding pad 511 are continuous.

[0042] That is, the first portion 511a, the second portion 511b, and the third portion 511c of the first bonding pad 511 can be continuous.

[0043] In some embodiments, the first portion 511a of the first bonding pad 511 may be parallel to the upper edge 50UE of the drive circuit 50, the second portion 511b of the first bonding pad 511 may be away from the upper edge 50UE of the drive circuit 50 along the second direction D2, and the third portion 511c of the first bonding pad 511 may be away from the upper edge 50UE of the drive circuit 50 along the third direction D3, but this disclosure is not limited thereto.

[0044] Therefore, please refer to Figure 4 The end of the second portion 511b of the first bonding pad 511 may be a distance S2 from the upper edge 50UE of the drive circuit 50; and the end of the third portion 511c of the first bonding pad 511 may be a distance S3 from the upper edge 50UE of the drive circuit 50. For example, the bonding pad closest to the side 50WS in the second portion 511b of the first bonding pad 511 is a minimum distance S2 from the upper edge 50UE of the drive circuit 50 in the direction perpendicular to the first direction D1 (e.g., in the fourth direction D4); the bonding pad closest to the side 50WS in the third portion 511c of the first bonding pad 511 is a minimum distance S3 from the upper edge 50UE of the drive circuit 50 in the direction perpendicular to the first direction D1 (e.g., in the fourth direction D4).

[0045] According to some embodiments of this disclosure, the distance S2 between the end of the second portion 511b of the first bonding pad 511 and the upper edge 50UE of the drive circuit 50 can be equal to the distance S3 between the end of the third portion 511c of the first bonding pad 511 and the upper edge 50UE of the drive circuit 50 (S2 = S3).

[0046] According to some embodiments of this disclosure, the distance S2 between the end of the second portion 511b of the first bonding pad 511 and the upper edge 50UE of the drive circuit 50 can be greater than the distance S3 between the end of the third portion 511c of the first bonding pad 511 and the upper edge 50UE of the drive circuit 50 (S2>S3).

[0047] According to some embodiments of this disclosure, the distance S2 between the end of the second portion 511b of the first bonding pad 511 and the upper edge 50UE of the driving circuit 50 can be smaller than the distance S3 (S2) between the end of the third portion 511c of the first bonding pad 511 and the upper edge 50UE of the driving circuit 50. <S3)。

[0048] like Figure 4 As shown, according to some embodiments of this disclosure, the distance S2 between the end of the second portion 511b of the first bonding pad 511 and the upper edge 50UE of the drive circuit 50 can be between greater than 0 micrometers and less than or equal to the width 50WS' (0 micrometers) of the side edge 50WS of the drive circuit 50. <S2≤50WS’)。

[0049] According to some embodiments of this disclosure, the distance S2 between the end of the second portion 511b of the first bonding pad 511 and the upper edge 50UE of the drive circuit 50 can be between 400 micrometers or more and less than or equal to half the width 50WS' of the side edge 50WS of the drive circuit 50 (400 micrometers ≤ S2 ≤ 1 / 2 × 50WS').

[0050] According to some embodiments of this disclosure, the range of distance S3 between the end of the third portion 511c of the first bonding pad 511 and the upper edge 50UE of the drive circuit 50 may be the same as or similar to the distance S2 described above, and will not be repeated here.

[0051] Please continue reading. Figure 4 The second bonding pad 521 may be positioned close to the lower edge 50LE of the drive circuit 50, and the second bonding pad 521 may be arranged along the first direction D1.

[0052] Please continue reading. Figure 4The first portion 511a of the first bonding pad 511 may be spaced S4 from the second bonding pad 521 (e.g., the minimum distance in the fourth direction D1). According to some embodiments of this disclosure, the distance S4 between the first portion 511a of the first bonding pad 511 and the second bonding pad 521 may be greater than 0 micrometers and less than or equal to the width 50LS' (0 micrometers) of the drive circuit 50. <S4≤50LS’)。

[0053] According to some embodiments of this disclosure, the distance S4 between the first portion 511a of the first bonding pad 511 and the second bonding pad 521 can be greater than or equal to 500 micrometers and less than or equal to half of the width 50LS' of the drive circuit 50 (500 micrometers ≤ S4 ≤ 1 / 2 × 50LS').

[0054] like Figure 4 As shown, the first dummy pad 53 may include a first portion 53a and a second portion 53b. According to some embodiments of this disclosure, the first portion 53a and / or the second portion 53b of the first dummy pad 53 may be arranged along a first direction D1.

[0055] Please continue reading. Figure 4 The first portion 53a of the first dummy pad 53 may be disposed adjacent to the upper edge 50UE of the drive circuit 50, and the first portion 53a of the first dummy pad 53 may be disposed between the second portion 511b of the first bonding pad 511 and the upper edge 50UE of the drive circuit 50.

[0056] The second portion 53b of the first dummy pad 53 can be disposed adjacent to the upper edge 50UE of the drive circuit 50, and the second portion 53b of the first dummy pad 53 can be disposed between the third portion 511c of the first bonding pad 511 and the upper edge 50UE of the drive circuit 50. By disposing of the first dummy pad 53 and / or the second dummy pad 54, the probability of deformation, breakage, stress concentration and uneven pressure of the drive circuit 50 is reduced, thereby making the electronic device 100 have better reliability.

[0057] Figure 5 A schematic diagram is shown of a bonding region 21 and a portion of a working region 10 on a substrate 40 corresponding to a driving circuit according to some embodiments of the present disclosure. For example... Figure 5 As shown, the electronic device 100 further includes a plurality of first bonding pads 2111, a plurality of second bonding pads 2121, a plurality of first dummy pads 213, and a plurality of second dummy pads 214, wherein the plurality of first bonding pads 2111, the plurality of second bonding pads 2121, the plurality of first dummy pads 213, and the plurality of second dummy pads 214 are disposed on the substrate 40 and disposed in the bonding region 21.

[0058] The plurality of first bonding pads 2111 and / or the plurality of second bonding pads 2121 can be connected to the working area 10 by the wire 30 to allow current and / or signal transmission between the plurality of first bonding pads 2111 and the plurality of second bonding pads 2121 and the working area 10. However, the first dummy pad 213 and the second dummy pad 214 are not connected to the working area 10 by the wire 30, but the present disclosure is not limited thereto.

[0059] It should be specifically noted that Figure 5 the first bonding pad 2111, the second bonding pad 2121, the first dummy pad 213, and the second dummy pad 214 in Figure 4 can correspond to the first bonding pad 511, the second bonding pad 521, the first dummy pad 53, and the second dummy pad 54 in Figure 5 . Please continue to refer to

[0060] Similarly, the first bonding pad 2111 can include a first portion 2111a, a second portion 2111b, and a third portion 2111c. A first portion 2111a of the first bonding pad 2111 is arranged along a first direction D1 (for example, it can be the X axis), a second portion 2111b of the first bonding pad 2111 is arranged along a second direction D2, and a third portion 2111c of the first bonding pad 2111 is arranged along a third direction D3. Moreover, the first dummy pad 213 can include a first portion 213a and a second portion 213b.

[0061] It should be noted that, for the convenience of understanding, in Figure 5 the ranges of the first portion 2111a, the second portion 2111b, and the third portion 2111c are respectively represented by dashed lines.

[0062] According to some embodiments of the present disclosure, there is an included angle A1 between the first direction D1 and the second direction D2, and the included angle A1 is greater than 0 degrees and less than 90 degrees (0° < A1 < 90°). According to some embodiments of the present disclosure, there is an included angle A2 between the first direction D1 and the third direction D3, and the included angle A2 is greater than 0 degrees and less than 90 degrees (0° < A2 < 90°). According to some embodiments of the present disclosure, the included angle A1 between the first direction D1 and the second direction D2 can be greater than or equal to 2 degrees and less than or equal to 20 degrees (2° ≤ A1 ≤ 20°). According to some embodiments of the present disclosure, the included angle A2 between the first direction D1 and the third direction D3 can be greater than or equal to 2 degrees and less than or equal to 20 degrees (2° ≤ A2 ≤ 20°).

[0063] like Figure 5 As shown, the end of the second portion 2111b of the first bonding pad 2111 can be a distance S5 away from the lower edge 10LE of the working area 10; and the end of the third portion 2111c of the first bonding pad 2111 can be a distance S6 away from the lower edge 10LE of the working area 10.

[0064] For example, the mating pad closest to the mating region 21WS in the second part 2111b of the first mating pad 2111 is a minimum distance S5 from the lower edge 10LE of the working region 10 in the direction perpendicular to the first direction D1 (e.g., in the fourth direction D4); the mating pad closest to the side 50WS in the third part 2111c of the first mating pad 2111 is a minimum distance S6 from the lower edge 10LE of the working region 10 in the direction perpendicular to the first direction D1 (e.g., in the fourth direction D4).

[0065] According to some embodiments of this disclosure, the distance S5 between the end of the second portion 2111b of the first bonding pad 2111 and the lower edge 10LE of the working area 10 can be equal to the distance S6 between the end of the third portion 511c of the first bonding pad 2111 and the lower edge 10LE of the working area 10 (S5 = S6).

[0066] According to some embodiments of this disclosure, the distance S5 between the end of the second portion 2111b of the first bonding pad 2111 and the lower edge 10LE of the working area 10 can be greater than the distance S6 between the end of the third portion 2111c of the first bonding pad 2111 and the lower edge 10LE of the working area 10 (S5>S6).

[0067] According to some embodiments of this disclosure, the distance S5 between the end of the second portion 2111b of the first bonding pad 2111 and the lower edge 10LE of the working area 10 can be smaller than the distance S6 between the end of the third portion 2111c of the first bonding pad 2111 and the lower edge 10LE of the working area 10 (S5). <S6)。

[0068] Please continue reading. Figure 5 The second bonding pad 2121 may be positioned near the lower edge 21LE of the bonding area 21, and the second bonding pad 2121 may be arranged along the first direction D1.

[0069] like Figure 5As shown, the second mating pad 2121 can be spaced a distance S7 from the lower edge 10LE of the working area 10. For example, the lower edge of the second mating pad 2121 and the lower edge 10LE of the working area 10 are spaced a minimum distance S7 in a direction perpendicular to the first direction D1 (e.g., in the fourth direction D4).

[0070] like Figure 5 As shown, according to some embodiments of this disclosure, the distance S7 between the lower edge of the second bonding pad 2121 and the lower edge 10LE of the working area 10 can be greater than or equal to the distance S5 between the end of the second portion 2111b of the first bonding pad 2111 and the lower edge 10LE of the working area 10; and the distance S5 between the end of the second portion 2111b of the first bonding pad 2111 and the lower edge 10LE of the working area 10 can be greater than 0 micrometers (0 micrometers). <S5≤S7)。

[0071] According to some embodiments of this disclosure, the distance S7 between the lower edge of the second bonding pad 2121 and the lower edge 10LE of the working area 10 can be greater than or equal to the distance S5 between the end of the second portion 2111b of the first bonding pad 2111 and the lower edge 10LE of the working area 10; and the distance S5 between the end of the second portion 2111b of the first bonding pad 2111 and the lower edge 10LE of the working area 10 can be greater than or equal to 600 micrometers (600 micrometers ≤ S5 ≤ S7).

[0072] like Figure 5 As shown, according to some embodiments of this disclosure, the distance S7 between the lower edge of the second bonding pad 2121 and the lower edge 10LE of the working area 10 can be greater than or equal to the distance S6 between the end of the third portion 2111c of the first bonding pad 2111 and the lower edge 10LE of the working area 10. Furthermore, the distance S6 between the end of the third portion 2111c of the first bonding pad 2111 and the lower edge 10LE of the working area 10 can be greater than 0 micrometers (0 micrometers). <S6≤S7)。

[0073] According to some embodiments of this disclosure, the distance S7 between the lower edge of the second bonding pad 2121 and the lower edge 10LE of the working area 10 can be greater than or equal to the distance S6 between the end of the third portion 2111c of the first bonding pad 2111 and the lower edge 10LE of the working area 10. Furthermore, the distance S6 between the end of the third portion 2111c of the first bonding pad 2111 and the lower edge 10LE of the working area 10 can be greater than or equal to 600 micrometers (600 micrometers ≤ S6 ≤ S7).

[0074] Please continue reading. Figure 5At least a portion of the first dummy pad 213 may be disposed between the first mating pad 2111 and the working area 10. The second dummy pad 214 may be disposed between the first mating pad 2111 and the second mating pad 2121. The first portion 213a of the first dummy pad 213 may be disposed adjacent to the upper edge 21UE of the mating area 21, and the first portion 213a of the first dummy pad 213 may be disposed between the second portion 2111b of the first mating pad 2111 and the working area 10.

[0075] The second portion 213b of the first dummy pad 213 may be disposed adjacent to the upper edge 21UE of the mating area 21, and the second portion 213b of the first dummy pad 213 may be disposed between the third portion 2111c of the first mating pad 2111 and the working area 10. According to some embodiments of the present disclosure, the first portion 213a and / or the second portion 213b of the first dummy pad 213 may be arranged along the first direction D1.

[0076] Please see Figure 6 , Figure 6 Some embodiments according to this disclosure are shown. Figure 4 A partial enlarged view of the bonding pads of the drive circuit of the electronic device 100, showing a portion of the first dummy pad 53.

[0077] like Figure 6 As shown, the end of the first portion 53a of the first dummy pad 53 can be separated from the side 50WS of the drive circuit 50 by a distance S8. For example, the pad closest to the side 50WS of the drive circuit 50 in the first portion 53a of the first dummy pad 53 is separated from the side 50WS of the drive circuit 50 by a minimum distance S8 in the first direction D1. Furthermore, the distance S8 between the end of the first portion 53a of the first dummy pad 53 and the side 50WS of the drive circuit 50 can be greater than 0 micrometers (S8>0 micrometers).

[0078] According to some embodiments of this disclosure, the distance S8 between the end of the first portion 53a of the first dummy pad 53 and the side 50WS of the drive circuit 50 can be greater than or equal to 200 micrometers (S8≥200 micrometers).

[0079] Please see Figure 6The first portion 53a of the first dummy pad 53 can be spaced S9 away from the upper edge 50UE of the drive circuit 50. For example, the pad closest to the side 50WS of the first portion 53a of the first dummy pad 53 is spaced at a minimum distance S9 from the upper edge 50UE of the drive circuit 50 in a direction perpendicular to the first direction D1 (e.g., in the fourth direction D4). Furthermore, the distance S9 between the first portion 53a of the first dummy pad 53 and the upper edge 50UE of the drive circuit 50 can be greater than 0 micrometers (S9>0 micrometers).

[0080] According to some embodiments of this disclosure, the distance S9 between the first portion 53a of the first dummy pad 53 and the upper edge 50UE of the drive circuit 50 can be greater than 200 micrometers (S9≥200 micrometers).

[0081] Similarly, although not shown in the accompanying drawings, the end of the second portion 53b of the first dummy pad 53 may be a distance away from the other side 50WS of the drive circuit 50. Furthermore, the distance between the end of the second portion 53b of the first dummy pad 53 and the other side 50WS of the drive circuit 50 may be greater than 0 micrometers (>0 micrometers).

[0082] According to some embodiments of this disclosure, the distance between the end of the second portion 53b of the first dummy pad 53 and the other side 50WS of the drive circuit 50 can be greater than 200 micrometers (≥200 micrometers).

[0083] The second portion 53b of the first dummy pad 53 can be spaced a distance from the upper edge 50UE of the drive circuit 50. Furthermore, the distance between the second portion 53b of the first dummy pad 53 and the upper edge 50UE of the drive circuit 50 can be greater than 0 micrometers (>0 micrometers).

[0084] According to some embodiments of this disclosure, the distance between the second portion 53b of the first dummy pad 53 and the upper edge 50UE of the drive circuit 50 can be greater than 200 micrometers (≥200 micrometers).

[0085] Please see Figure 7 , Figure 7 A schematic diagram of a first dummy pad 53 or a second dummy pad 54 according to some embodiments of the present disclosure is shown. Figure 7 As shown, according to some embodiments of the present disclosure, each first dummy pad 53 may be rectangular, such as a square. According to some embodiments of the present disclosure, each first dummy pad 53 may be a square with a side length of 44 micrometers or more. In other embodiments, the first dummy pad 53 may be a non-rectangular pattern, but the present disclosure is not limited thereto.

[0086] According to some embodiments of the present disclosure, the pitch S10 between two adjacent first dummy pads 53 can be greater than 0 and less than or equal to 200 micrometers (0 < S10 ≤ 200 micrometers). For example, the pitch S10 is the center-to-center distance between two adjacent first dummy pads 53.

[0087] According to some embodiments of the present disclosure, the pitch S10 between two adjacent first dummy pads 53 can be greater than or equal to 88 micrometers and less than or equal to 200 micrometers (88 micrometers ≤ S10 ≤ 200 micrometers).

[0088] Please continue to refer to Figure 4 , according to some embodiments of the present disclosure, the second dummy pads 54 can be arranged along the first direction D1.

[0089] According to some embodiments of the present disclosure, the second dummy pads 54 can be disposed between the first bonding pad 511 and the second bonding pad 521. According to some embodiments of the present disclosure, the second dummy pads 54 can be disposed between the first portion 511a of the first bonding pad 511 and the second bonding pad 521. According to some embodiments of the present disclosure, the second dummy pads 54 can be arranged along the first direction D1.

[0090] According to some embodiments of the present disclosure, the distance between the second dummy pad 54 and the first portion 511a of the first bonding pad 511 (for example, the minimum distance in the fourth direction D4) can be equal to the distance between the second dummy pad 54 and the second bonding pad 521 (for example, the minimum distance in the fourth direction D4). That is to say, according to some embodiments of the present disclosure, the second dummy pad 54 can be disposed in the middle of the first portion 511a of the first bonding pad 511 and the second bonding pad 521.

[0091] According to some embodiments of the present disclosure, the distance between the second dummy pad 54 and the first portion 511a of the first bonding pad 511 can be greater than or less than the distance between the second dummy pad 54 and the second bonding pad 521, but the present disclosure is not limited thereto.

[0092] According to some embodiments of the present disclosure, a part of the second dummy pads 54 can be disposed between the second portion 511b of the first bonding pad 511 and the second bonding pad 521. According to some embodiments of the present disclosure, a part of the second dummy pads 54 can be disposed between the third portion 511c of the first bonding pad 511 and the second bonding pad 521, but the present disclosure is not limited thereto.

[0093] However, according to some embodiments of the present disclosure, the second dummy pads 54 can not be disposed between the second portion 511b of the first bonding pad 511 and the second bonding pad 521. According to some embodiments of the present disclosure, the second dummy pads 54 can not be disposed between the third portion 511c of the first bonding pad 511 and the second bonding pad 521.

[0094] Please continue to refer to Figure 4 , according to some embodiments of the present disclosure, the second dummy pad 54 may be disposed between the second portion 511b and the third portion 511c of the first bonding pad 511.

[0095] However, according to some embodiments of the present disclosure, the second dummy pad 54 may not be disposed between the second portion 511b and the third portion 511c of the first bonding pad 511.

[0096] Please refer to Figure 7 , according to some embodiments of the present disclosure, each second dummy pad 54 may have a rectangular shape, such as a square. According to some embodiments of the present disclosure, each second dummy pad 54 may be a square with a side length greater than or equal to 44 microns. In other embodiments, the second dummy pad 54 may be a non-rectangular pattern, but the present disclosure is not limited thereto.

[0097] According to some embodiments of the present disclosure, the pitch S11 between two adjacent second dummy pads 54 may be greater than 0 and less than or equal to 400 microns (0 < S11 ≤ 400 microns). For example, the pitch S11 is the center-to-center distance between two adjacent second dummy pads 54.

[0098] As Figure 7 shown, according to some embodiments of the present disclosure, the pitch S11 between two adjacent second dummy pads 54 may be greater than or equal to 88 microns and less than or equal to 400 microns (88 microns ≤ S11 ≤ 400 microns).

[0099] Please refer to Figure 8 , Figure 8 shows a partial enlarged view of the lower part of the electronic device 100 according to some embodiments of the present disclosure, in which a part of the first dummy pad 213 is particularly shown. Figure 1

[0100] As Figure 8 shown, the wire 30 may connect the working area 10 and the first bonding pad 2111. For example, the wire 30 may electrically connect the working area 10 and the first bonding pad 2111 to allow current and / or signal transmission between the working area 10 and the first bonding pad 2111.

[0101] Please continue to refer to Figure 8 , when viewed along a fifth direction D5 (e.g., it may be the Z-axis or the normal direction of the electronic device) perpendicular to the first direction D1 and the fourth direction D4, the wire 30 and the first dummy pad 213 may not overlap.

[0102] ​When viewed along the fifth direction D5, the conductor 30 is a minimum distance S12 from the nearest first dummy pad 213.

[0103] According to some embodiments of this disclosure, the minimum distance S12 between the conductor 30 and the nearest first dummy pad 213 can be greater than 0 (S12>0). According to some embodiments of this disclosure, the minimum distance S12 between the conductor 30 and the nearest first dummy pad 213 can be greater than or equal to 6 micrometers (S12≥6 micrometers).

[0104] The electronic device 100 of this disclosure embodiment can shorten the distance S1 between the lower edge of the working area 10 and the lower edge of the peripheral area 20. Therefore, the electronic device 100 of this disclosure embodiment can have the effect of miniaturizing the peripheral area 20.

[0105] The electronic device 100 of the present disclosure can improve the problems of deformation, cracking, stress concentration and uneven pressure of the drive circuit 50, so that the electronic device 100 has better reliability.

[0106] It should be noted that the features of the various embodiments of this disclosure can be arbitrarily combined and used as long as they do not violate the spirit of the invention or conflict with each other.

[0107] While embodiments and advantages of this disclosure have been described above, it should be understood that those skilled in the art can make various changes, substitutions, and modifications to this disclosure without departing from its spirit and scope. It should be noted that different embodiments can be arbitrarily combined to form other embodiments, as long as the combination conforms to the spirit of this disclosure. Furthermore, the scope of this disclosure is not limited to the processes, machines, manufacturing processes, compositions, apparatuses, methods, and steps described in the specific embodiments of the specification. Those skilled in the art can understand existing or developing processes, machines, manufacturing processes, compositions, apparatuses, methods, and steps from some embodiments of this disclosure. Therefore, the scope of this disclosure includes the aforementioned processes, machines, manufacturing processes, compositions, apparatuses, methods, and steps. Moreover, each of the appended claims constitutes a separate embodiment, and the scope of this disclosure further includes every combination of the appended claims and embodiments.

Claims

1. An electronic device comprising: A substrate, including a bonding region and a working region; as well as A plurality of first bonding pads are disposed on the substrate and in the bonding area; as well as A plurality of first dummy pads are disposed on the substrate and in the bonding area. A portion of the plurality of first bonding pads are arranged along a first direction, and another portion of the plurality of first bonding pads are arranged along a second direction. The first direction and the second direction have an included angle, and the included angle is greater than 0 degrees and less than 90 degrees. In a direction perpendicular to the first direction, the plurality of first dummy pads are located between the plurality of first mating pads and the working area, and In the first direction, the plurality of first dummy pads and the plurality of first mating pads do not overlap.

2. The electronic device as claimed in claim 1, characterized in that: The included angle is greater than or equal to 2 degrees and less than or equal to 20 degrees.

3. The electronic device of claim 1 further includes a plurality of first dummy pads disposed on the substrate and in the bonding region, and the substrate further includes a working area. The plurality of first dummy pads are disposed between the working area and the plurality of first mating pads in the other part.

4. The electronic device as claimed in claim 3, characterized in that: The plurality of first dummy pads are arranged along the first direction.

5. The electronic device of claim 3, further comprising: Multiple wires are disposed on the substrate, wherein the multiple wires connect the working area and the multiple first bonding pads. Its features are: The electronic device has a normal direction, and when viewed along this normal direction, the plurality of wires do not overlap with the plurality of first dummy pads.

6. The electronic device as claimed in claim 5, characterized in that: When viewed along the normal direction, at least one of the plurality of conductors is at a distance greater than or equal to 6 micrometers from the nearest first dummy pad.

7. The electronic device of claim 1, further comprising a plurality of second bonding pads and a plurality of second dummy pads disposed on the substrate and in the bonding region, and the substrate further comprising a working region. The plurality of second bonding pads are positioned further away from the working area than the plurality of first bonding pads, and The plurality of second dummy pads are disposed between the plurality of first mating pads and the plurality of second mating pads.

8. The electronic device as claimed in claim 7, characterized in that... The plurality of second bonding pads are arranged along the first direction.

9. The electronic device as claimed in claim 7, characterized in that: A third portion of the plurality of first bonding pads is arranged along a third direction, and The first direction and the third direction have an angle between them, and the angle is greater than 0 degrees and less than 90 degrees.

10. The electronic device as claimed in claim 9, characterized in that: The angle between the first direction and the third direction is greater than or equal to 2 degrees and less than or equal to 20 degrees.

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