Flexible vapor chamber

Abstract

A flexible vapor chamber includes a first flexible housing, a second flexible housing, a plurality of capillary strips, and a plurality of internal capillary layers. The capillary strips are mounted between the first flexible housing and the second flexible housing, and the internal capillary layers are disposed between the first flexible housing and the second flexible housing and the capillary strips to improve heat dissipation efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to a vapor chamber, and in particular, to a flexible vapor chamber. BACKGROUND

[0002] With the increasing of the computer operation ability, the temperature control of various processors and other electronic components is more and more important. When the operation speed of the working chip (i.e. heat source) in the electronic device is continuously improved, the environmental temperature in the system is increased, and thus the system stability is reduced. In order to solve the problem, the vapor chamber is contacted with the working chip, so that the heat energy of the working chip can be discharged out of the system through the vapor chamber, to control the temperature of the electronic device, and thus maintain the stability of the electronic device.

[0003] In addition, due to the configuration requirement or the convenience of carrying, some electronic devices cannot use the hard vapor chamber. Therefore, the demand for flexible vapor chamber arises at the historic moment. However, in the face of the increasing technological progress, the heat conduction of the existing flexible vapor chamber still has the problem of poor efficiency, so there is still room for improvement to improve the efficiency of the flexible vapor chamber in the electronic device, which is the challenge faced by the relevant industry. SUMMARY

[0004] An object of the present application is to provide a flexible vapor chamber to solve the problems mentioned in the prior art.

[0005] An embodiment of the present application provides a flexible vapor chamber. The flexible vapor chamber includes a first flexible housing, a second flexible housing, a plurality of capillary strips, and a plurality of internal capillary layers. The capillary strips are installed between the first flexible housing and the second flexible housing, and the internal capillary layers are arranged between the capillary strips and the first flexible housing and the second flexible housing.

[0006] In some embodiments, the internal capillary layer includes a plurality of metal capillary wire meshes, a plurality of perforations, or a polymer mesh layer, and the plurality of capillary strips includes a plurality of capillary fiber strips.

[0007] In some embodiments, the internal capillary layer can further include a plurality of staggered perforations, and the staggered perforations on adjacent internal capillary layers at least partially overlap.

[0008] In some embodiments, the internal capillary layer includes a plurality of cross-shaped perforations.

[0009] In some embodiments, at least one of the first flexible housing and the second flexible housing includes a flexible resin housing.

[0010] In some embodiments, the material of the flexible resin housing is polyimide.

[0011] In some embodiments, the surface of the flexible resin housing includes a surface roughening layer, a nickel plating layer, and a copper plating layer.

[0012] In some embodiments, the surface roughening layer, the nickel plating layer, and the copper plating layer are sequentially formed on the surface of the flexible resin housing.

[0013] In some embodiments, the flexible resin housing further includes a first reservoir, a second reservoir, and a plurality of connecting reservoirs connecting between the first reservoir and the second reservoir.

[0014] In some embodiments, the capillary strips span across the connecting reservoirs.

[0015] In some embodiments, the flexible resin housing further includes a first adhesive surrounding the periphery of the flexible resin housing, and a second adhesive surrounding the inner side of the first adhesive.

[0016] In some embodiments, the inner capillary layer extends to the locations of the first adhesive and the second adhesive, such that the first adhesive and the second adhesive penetrate into a portion of the inner capillary layer.

[0017] In some embodiments, the flexible vapor chamber further includes a plurality of support columns formed between the inner capillary layer and arranged between the capillary strips.

[0018] In some embodiments, the first flexible housing, the second flexible housing, the capillary strips, and the inner capillary layer are further used to form a flexible connecting portion to be joined to a first vapor chamber.

[0019] In some embodiments, the flexible connecting portion is further joined to a second vapor chamber, and the flexible connecting portion is disposed between the first vapor chamber and the second vapor chamber.

[0020] In some embodiments, the first vapor chamber and the second vapor chamber respectively include a first housing and a second housing, and a first adhesive and a second adhesive are arranged around the portions of the first housing and the second housing that are not joined to the flexible connecting portion to adhere to each other, wherein the second adhesive surrounds the inner side of the first adhesive.

[0021] In some embodiments, the inner capillary layer extends to the locations of the first adhesive and the second adhesive, such that the first adhesive and the second adhesive penetrate into a portion of the inner capillary layer.

[0022] In some embodiments, the first vapor chamber and the second vapor chamber respectively include a first housing and a second housing, and a plurality of degassing ports are further formed on the first housing or the second housing, and a plurality of sealing films are respectively used to seal the degassing ports after the flexible vapor chamber is filled with liquid and degassed.

[0023] In some embodiments, the material of the sealing film is the same as the material of the first shell and the second shell.

[0024] In some embodiments, the first and second vapor chambers are preferably metal vapor chambers.

[0025] In some embodiments, the flexible vapor chamber further comprises a water injection pipe formed on one side of the flexible connecting portion.

[0026] Thus, by the above-mentioned structures of the embodiments, the flexible vapor chamber can be provided to be installed in the foldable electronic device, thereby reducing the operating temperature of the electronic components in the foldable electronic device. In addition, the flexible vapor chamber can be combined with one or more metal vapor chambers to improve the heat dissipation efficiency of the flexible vapor chamber. Furthermore, the capillary long strips penetrating through both ends and the internal capillary layer can further increase the heat dissipation efficiency of the flexible vapor chamber. The internal capillary layer can further comprise perforations to store the working fluid. In addition, the flexible vapor chamber can hide the water injection pipe in the rotation shaft or the folding mechanism of the electronic device.

[0027] The above merely illustrates the problems to be solved by the present application, the technical means for solving the problems, and the effects thereof. The specific details of the present application will be described in the following embodiments and related drawings. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to make the above and other purposes, features, advantages and embodiments of the present application more obvious and easy to understand, the following describes the drawings:

[0029] Figure 1 is a perspective view of a flexible vapor chamber according to an embodiment of the present application;

[0030] Figure 2 is a partial side view of the flexible vapor chamber of Figure 1

[0031] Figure 3 is a schematic view of an internal capillary layer of the flexible vapor chamber of Figure 1

[0032] is a schematic view of an embodiment of a flexible shell of the flexible vapor chamber of Figure 4 Figure 1 is a schematic view of another embodiment of the flexible shell of the flexible vapor chamber of

[0033] Figure 5 Figure 1 is a schematic view of another embodiment of the flexible shell of the flexible vapor chamber of

[0034] Figure 6 is a schematic view of another embodiment of the flexible shell of the flexible vapor chamber of Figure 1 ​​​FIG. 1 is a schematic view of another embodiment of a flexible housing of a flexible vapor chamber;

[0035] Figure 7 FIG. 2 is a schematic view of a flexible vapor chamber and a water injection tube disposed thereon;

[0036] Figure 8 FIG. 3 is a schematic view of an embodiment of a first vapor chamber and a second vapor chamber of a flexible vapor chamber. Figure 1

[0037] In the drawings, the following reference numerals are used:

[0038] 100: flexible vapor chamber

[0039] 110: first vapor chamber

[0040] 112: first housing

[0041] 114: second housing

[0042] 120: flexible connecting portion

[0043] 130: second vapor chamber

[0044] 132: first housing

[0045] 134: second housing

[0046] 140: capillary strip

[0047] 150: support column

[0048] 210: first flexible housing

[0049] 220: second flexible housing

[0050] 230: internal capillary layer

[0051] 310: first perforation

[0052] 320: second perforation

[0053] 410: surface roughening layer

[0054] 420: nickel plating layer

[0055] 430: copper plating layer

[0056] 510: flexible frame

[0057] 512: first connecting portion

[0058] 514: second connecting portion

[0059] 516: first liquid storage groove

[0060] ​518: second reservoir

[0061] 520: connecting reservoir

[0062] 610: first bonding glue

[0063] 620: second bonding glue

[0064] 710: water injection tube

[0065] 810: gas vent

[0066] 820: gas vent

[0067] 830: sealing film

[0068] 840: sealing film DETAILED DESCRIPTION

[0069] Embodiments of the present application will be described below with reference to the drawings. Numerous specific details will be set forth in the following description in order to provide a thorough understanding. However, it will be appreciated that these specific details are not intended to limit the present application. Rather, they are included merely for the purposes of explanation. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing an embodiment of the present application.

[0070] Figure 1 is a perspective view of a flexible vapor chamber, and Figure 2 is a side view of a portion of a flexible vapor chamber, Figure 3 is a view of an internal wicking layer of a flexible vapor chamber. Figure 4 to Figure 6 is a view of several embodiments of a flexible housing of a flexible vapor chamber, and Figure 7 is a perspective view of a flexible vapor chamber with a water injection tube disposed thereon. Furthermore, Figure 8 is a view of an embodiment of a first vapor chamber and a second vapor chamber in a flexible vapor chamber.

[0071] As Figure 1 and Figure 2As shown, the flexible vapor chamber 100 includes a flexible connecting portion 120, which includes a first flexible housing 210, a second flexible housing 220, a plurality of capillary strips 140, and a plurality of internal capillary layers 230. The plurality of capillary strips 140 are mounted between the first flexible housing 210 and the second flexible housing 220 and extend to both ends of the flexible vapor chamber 100. The plurality of internal capillary layers 230 are disposed between the capillary strips 140 and the first flexible housing 210 and the second flexible housing 220. The flexible connecting portion 120 can be formed as a flexible vapor chamber alone to dissipate heat from a heat source or in combination with a vapor chamber, such as the first vapor chamber 110 and / or the second vapor chamber 130, to dissipate heat from a heat source.

[0072] In some embodiments, the internal capillary layer 230 includes an internal metal or polymer mesh layer, such as a metal or polymer capillary mesh or sheet. In some embodiments, the internal capillary layer 230 includes, for example, a metal capillary mesh layer, a polymer capillary mesh layer, a metal sheet, or a polymer sheet.

[0073] In some embodiments, referring to Figure 3 As shown, the two internal capillary layers 230 each include a plurality of first perforations 310 and a plurality of second perforations 320, such as a plurality of staggered perforations, the first perforations 310 and the second perforations 320 being through opposite surfaces of the respective internal capillary layer 230. In some embodiments, the staggered perforations on two adjacent internal capillary layers 230 at least partially overlap to increase the water storage capacity of the internal capillary layer 230. In one embodiment, the first perforations 310 and the second perforations 320 can be any geometric shape, such as a cross shape, but the present application is not limited thereto.

[0074] In some embodiments, the first flexible housing 210 and the second flexible housing 220 can be a flexible resin housing. In some embodiments, the material of the flexible resin housing is a polyimide (PI), but the present application is not limited thereto.

[0075] In some embodiments, referring to Figure 4 to Figure 6 As shown, the first flexible housing 210 is taken as an example, and the second flexible housing 220 can be formed by the same process and structure as the first flexible housing 210.

[0076] The surface of the first flexible housing 210 can further include a surface roughening layer 410, a nickel plating layer 420, and a copper plating layer 430 to form a capillary structure. In one embodiment, the nickel plating layer 420 is formed on the surface roughening layer 410, and the copper plating layer 430 is formed on the nickel plating layer 420, but the present application is not limited thereto. In addition, the first flexible housing 210 can be bonded with the second flexible housing 220 and / or the first flexible housing 210 with the second flexible housing 220 and the housings of the first and second vapor chambers 110 and 130. For example, after the first and second flexible housings 210 and 220 are surface treated (e.g., the surface roughening layer 410) and metal plated (e.g., the nickel plating layer 420 and the copper plating layer 430), the bonding is performed in a vacuum low-temperature environment. In some embodiments, the bonding is performed at a pressure of 1*10 -3 ~1*10 -7 torr and a temperature of 250°C to 500°C.

[0077] Preferably, the housings of the first and second vapor chambers 110 and 130, and the housing of the flexible connecting portion 120 can also be simultaneously or sequentially bonded using the vacuum low-temperature process to simultaneously or sequentially bond the flexible connecting portion 120 with the first and second vapor chambers 110 and 130, so that the chambers in the flexible connecting portion 120 and the first and second vapor chambers 110 and 130 are in communication with each other.

[0078] Referring to Figure 5 As shown in the drawings, in some embodiments, the first flexible housing 210, for example, a flexible resin housing, can be a flexible channel frame 510. The first flexible housing 210 further includes a first liquid storage channel 516, a second liquid storage channel 518, and a plurality of connecting liquid storage channels 520. The connecting liquid storage channels 520 are connected between the first and second liquid storage channels 516 and 518 to increase the storage space of the working fluid in the flexible vapor chamber 100. In one embodiment, the capillary strips 140 cross the connecting liquid storage channels 520, but the present application is not limited thereto.

[0079] Referring to Figure 6As shown in the figure, in some embodiments, taking the first flexible housing 210 as an example, the first flexible housing 210 can be bonded to the second flexible housing 220 using a first adhesive 610 and a second adhesive 620, or bonded to the housing of the heat exchanger. The first adhesive 610 surrounds the first flexible housing 210, while the second adhesive 620 surrounds the inner side of the first adhesive 610 to seal the flexible heat exchanger 100. In some embodiments, the first adhesive 610 is, for example, an epoxy resin protective adhesive, and the second adhesive 620 is, for example, a vacuum adhesive. In some embodiments, the internal capillary layer 230 extends to the location of the first adhesive 610 and the second adhesive 620 (i.e., the bonding area), allowing the first adhesive 610 and the second adhesive 620 to penetrate into a portion of the internal capillary layer 230, thereby improving the adhesion.

[0080] In some embodiments, the flexible heat exchanger 100 may be formed using the flexible connector 120 to bend the heat exchanger as required, in order to reduce the temperature of a heat source. However, the flexible heat exchanger 100 may also be connected to at least one metal heat exchanger using the flexible connector 120 to reduce the temperature of the heat source.

[0081] For example, the flexible connection 120 can further connect the first heat exchanger 110 and / or the second heat exchanger 130. The first heat exchanger 110 includes a first housing 112 and a second housing 114, while the second heat exchanger 130 includes a first housing 132 and a second housing 134. In some embodiments, the first heat exchanger 110 and the second heat exchanger 130 can be like... Figure 6 In the first flexible housing 210, a first adhesive 610 and a second adhesive 620 are disposed around the portions of the first housing 112 and the first housing 132 that are not engaged with the flexible connection portion 120, so as to bond with the corresponding second housing 114 or the second housing 134. In some embodiments, an internal capillary layer 230 extends to the location of the first adhesive 610 and the second adhesive 620 (i.e., the bonding area), so that the first adhesive 610 and the second adhesive 620 penetrate into a portion of the internal capillary layer 230, thereby improving the adhesion.

[0082] See also Figure 5 As shown in the figure, the first connecting portion 512 and the second connecting portion 514 of the flexible groove frame 510 can be used to engage with the outer surface of the housing of the first heat exchange plate 110 and the second heat exchange plate 130 to seal the first heat exchange plate 110, the second heat exchange plate 130 and the flexible connecting portion 120, and allow the working fluid to flow in the first heat exchange plate 110, the second heat exchange plate 130 and the flexible connecting portion 120.

[0083] See also Figure 1and Figure 2 In some embodiments, the capillary strip 140 preferably extends from one end of the first thermal plate 110, through the flexible connection 120, and to one end of the second thermal plate 130, to span across both ends of the flexible thermal plate 100. The capillary strip 140 is preferably a capillary fiber strip made of a fiber material.

[0084] In some embodiments, the internal capillary layer 230 preferably also extends from one end of the first thermal plate 110, through the flexible connection 120, and to one end of the second thermal plate 130, to span across both ends of the flexible thermal plate 100.

[0085] In some embodiments, the flexible thermal plate 100 can further comprise a plurality of support columns 150 formed between the internal capillary layers 230 and arranged between the capillary strips 140 to provide housing support strength for the first thermal plate 110 and the second thermal plate 130 to avoid deformation when the flexible thermal plate 100 is bent. In some embodiments, the support columns 150 are powder metallurgy support columns.

[0086] In some embodiments, the first thermal plate 110 and the second thermal plate 130 are preferably metal thermal plates, such as non-bendable metal thermal plates.

[0087] In some embodiments, referring to Figure 7 As shown in the figure, the flexible thermal plate 100 further comprises a water injection pipe 710 formed on one side of the flexible connection 120. In some embodiments, the flexible connection 120 can be arranged at a rotation shaft or a bending mechanism of an electronic device, and the water injection pipe 710 can be hidden in the rotation shaft or the bending mechanism. However, the flexible thermal plate 100 of the present application can also arrange a plurality of water injection pipes 710 on the surfaces of the first thermal plate 110 and the second thermal plate 130, which also do not deviate from the spirit and protection scope of the present application.

[0088] Referring to Figure 8 As shown in the figure, the first thermal plate 110 is taken as an example for illustration, but it can also be arranged on the second thermal plate 130, which also do not deviate from the spirit and protection scope of the present application.

[0089] On the first housing 112 or the second housing 114 of the first vapor chamber 110, a gas outlet 810 and a gas outlet 820 can be formed to perform liquid injection and degassing of the vacuum cavity of the flexible vapor chamber 100, and then the gas outlet 810 and the gas outlet 820 are sealed by a sealing film 830 and a sealing film 840, respectively. For example, the sealing film 830 and the sealing film 840 are glued to seal the gas outlet 810 and the gas outlet 820 to seal the vacuum cavity, and there is no need to set a water injection pipe and to perform a tail removal process, which is more conducive to controlling the water injection and degassing conditions to form a tailless vapor chamber.

[0090] In some embodiments, the gas outlet 810 and the gas outlet 820 are mainly arranged on the housing of the first vapor chamber 110 and / or the second vapor chamber 130, and the sealing film 830 and the sealing film 840 can have the same material as the housing of the vapor chamber.

[0091] In some embodiments, the first housing 112 and the second housing 114 of the first vapor chamber 110 can be joined by a vacuum low-temperature diffusion process, a laser bonding process, gluing, or resistance welding.

[0092] In some embodiments, the capillary structure, the air flow channel, or the water storage tank in the vacuum cavity can be connected to the gas outlet 810 and the gas outlet 820, etc. through the plurality of gas outlets to improve the efficiency and quality of water injection and degassing.

[0093] Therefore, the flexible vapor chamber required by the above-mentioned embodiments can be provided to be installed in the foldable electronic device, so as to reduce the working temperature of the electronic components in the foldable electronic device. In addition, the flexible vapor chamber can be combined with one or more metal vapor chambers to improve the heat dissipation efficiency of the flexible vapor chamber. Furthermore, the capillary long strip penetrating through both ends and the internal capillary layer can further increase the heat dissipation efficiency of the flexible vapor chamber. The internal capillary layer can further include perforations to store working fluid. In addition, the flexible vapor chamber can hide the water injection pipe in the rotating shaft or the folding mechanism of the electronic device.

[0094] Finally, the above-mentioned embodiments are not intended to limit the present application, and any person skilled in the art can make various modifications and improvements without departing from the spirit and scope of the present application, which can be protected in the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims

1. A flexible vapor chamber, characterized by, The flexible resin casing further comprises: a first reservoir; a second reservoir; and a plurality of connecting reservoirs connected between the first reservoir and the second reservoir. The plurality of internal capillary layers comprises a plurality of metal capillary wire meshes, a plurality of perforations or a plurality of polymer mesh layers, and the plurality of capillary strips comprises a plurality of capillary fiber strips. The plurality of internal capillary layers respectively comprises a plurality of staggered perforations, and the staggered perforations on two adjacent internal capillary layers partially overlap. The plurality of internal capillary layers respectively comprises a plurality of cross-shaped perforations. The material of the flexible resin casing is polyimide. The surface of the flexible resin casing comprises a surface roughening layer, a nickel plating layer and a copper plating layer.

2. The flexible vapor chamber of claim 1, wherein, The surface roughening layer, the nickel plating layer and the copper plating layer are sequentially formed on the surface of the flexible resin casing.

3. The flexible vapor chamber of claim 1, wherein The plurality of capillary strips span across the plurality of connecting reservoirs.

4. The flexible vapor chamber of claim 1, wherein, The flexible resin casing further comprises:

5. The flexible vapor chamber of claim 1, wherein, a first bonding glue surrounding the periphery of the flexible resin casing; and 6. The flexible vapor chamber of claim 1, wherein, a second bonding glue surrounding the inside of the first bonding glue.

7. The flexible vapor chamber of claim 6, wherein, The internal capillary layers extend to the positions of the first bonding glue and the second bonding glue, so that the first bonding glue and the second bonding glue penetrate into a part of the internal capillary layers.

8. The flexible vapor chamber of claim 1, wherein, Further comprising a plurality of support columns formed between the plurality of internal capillary layers and arranged between the plurality of capillary strips.

9. The flexible vapor chamber of claim 1, wherein, The first flexible casing, the second flexible casing, the plurality of capillary strips and the plurality of internal capillary layers form a flexible connecting portion to be bonded to a first vapor chamber. The flexible connecting portion further bonds a second vapor chamber, and the flexible connecting portion is arranged between the first vapor chamber and the second vapor chamber. The first vapor chamber and the second vapor chamber respectively comprise a first casing and a second casing, and the periphery of the part of the first casing and the second casing not bonded to the flexible connecting portion is provided with a first bonding glue and a second bonding glue to adhere to each other, wherein the second bonding glue surrounds the inside of the first bonding glue.

10. The flexible vapor chamber of claim 9, wherein, The internal capillary layers extend to the positions of the first bonding glue and the second bonding glue, so that the first bonding glue and the second bonding glue penetrate into a part of the internal capillary layers.

11. The flexible vapor chamber of claim 1, wherein, The first vapor chamber and the second vapor chamber respectively comprise a first casing and a second casing, and the first casing or the second casing further comprises a plurality of degassing ports, which are sealed by a plurality of sealing films after the flexible vapor chamber is filled with liquid and degassed.

12. The flexible vapor chamber of claim 1, wherein, The material of the plurality of sealing films is the same as the material of the first casing and the second casing.

13. The flexible vapor chamber of claim 12, wherein, The first vapor chamber and the second vapor chamber are both metal vapor chambers.

14. The flexible vapor chamber of claim 13, wherein, ​ 15. The flexible vapor chamber of claim 14, wherein, ​ 16. The flexible vapor chamber of claim 13, wherein, ​ 17. The flexible vapor chamber of claim 16, wherein, ​ 18. The flexible vapor chamber of claim 13, wherein, ​ 19. The flexible vapor chamber of claim 13, wherein, More include a water pipe, formed in the flexible connection part of a side.

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