Supply device and film forming device

Abstract

The present application provides a kind of supply device for inhibiting the supply of specified amount of electronic component and film forming device.The supply device of embodiment has: chute, with multiple chute holes that electronic component can pass through one by one;Mask, with mask hole overlapping with the chute, and for electronic component to be inserted via chute hole, covering part of electronic component;Accommodation part, accommodate multiple electronic components;And transfer mechanism, transfer electronic component between accommodation part and chute, and the transfer mechanism has: moving body, moves between accommodation part and chute;And adsorption part, is arranged on moving body, corresponds to the area of electronic component supplied in the chute, adsorbs electronic component by exerting adsorption force in the area extending in a plane, and releases electronic component by releasing adsorption force.

Description

TECHNICAL FIELD

[0001] The present application relates to a supply device and a film forming device. BACKGROUND

[0002] At present, as a chip-shaped electronic component used in various electronic circuits, an electronic component having external electrodes formed on both ends is very common. For example, a chip capacitor is formed by dividing a block obtained by laminating dielectric sheets having internal electrodes formed therein into a cuboid-shaped single sheet, and forming external electrodes by covering both side surfaces of the cuboid-shaped element with a conductive material connected to the internal electrodes.

[0003] As a method of forming the external electrodes, as shown in Patent Document 1, the following process is performed: by inserting the other end into a through-hole of a tape in such a manner that one end of the electronic component is exposed, covering the exposed portion except for the exposed portion with a paste of conductive material. In this case, the electronic component is fed into a hopper in a certain amount and supplied to a guide hole of a guide plate from a supply port, and the posture is changed in the guide hole. Subsequently, by moving the guide plate, the guide hole is aligned with the through-hole of the tape, and the electronic component of the guide hole is pushed to be inserted into the through-hole of the tape.

[0004] As a method of supplying such an electronic component to the guide plate in a certain amount, the following methods are considered.

[0005] (1) The total mass of a plurality of electronic components is measured, and the adjustment is performed in such a manner that the mass becomes a certain mass to be supplied

[0006] (2) The total volume of a plurality of electronic components is measured, and the adjustment is performed in such a manner that the volume becomes a certain volume to be supplied

[0007] (3) The supply is performed in accordance with each set of a plurality of electronic components falling from a funnel-shaped container in a certain time

[0008] [Related Art Documents]

[0009] [Patent Documents]

[0010] [Patent Document 1] Japanese Patent Laid-Open No. 09-22846 SUMMARY

[0011] [Problems to be Solved by the Invention]

[0012] However, the method of (1) requires a mass measuring mechanism, the method of (2) requires a volume measuring mechanism, and the method of (3) requires a time measuring mechanism, and furthermore, in these methods, a mechanism for stopping the supply based on the measurement result of each measuring mechanism is required. Also, in the method of (3), there is a problem of clogging of the funnel on the mechanism.

[0013] Further, the methods of (1) to (3) are capable of supplying a certain amount of electronic parts. However, the supplied electronic parts are difficult to be distributed to be equally spread over the supply ports and the guide holes. For example, if the electronic parts are excessively supplied in the hopper, a gap for changing the posture cannot be formed, resulting in a decrease in the probability of entering the supply ports and the guide holes. Further, even if the electronic parts are locally supplied and concentrated, the probability of entering the supply ports and the guide holes decreases. That is, in the entire hopper, the electronic parts need to be equally supplied without excess or deficiency, but the methods are difficult.

[0014] The present application has been made to solve the problems of the prior art as described above, and has an object to provide a supply device and a film forming device capable of equally supplying a certain amount of electronic parts with a simple mechanism.

[0015] [Technical Means for Solving the Problems]

[0016] To achieve the object, the supply device of the embodiment has: a chute having a plurality of chute holes through which electronic parts can pass one by one; a mask having mask holes overlapping the chute and covering a part of the electronic parts inserted through the chute holes; a housing portion housing a plurality of the electronic parts; and a transfer mechanism transferring the electronic parts between the housing portion and the chute, the transfer mechanism having: a moving body moving between the housing portion and the chute; and a suction portion provided to the moving body, corresponding to an area of the chute where the electronic parts are supplied, sucking the electronic parts by exerting a suction force in an area extending in a planar shape, and releasing the electronic parts by releasing the suction force.

[0017] Further, the film forming device of the embodiment includes the supply device and a film forming processing portion forming a film on the electronic parts.

[0018] [Effects of the Invention]

[0019] According to the present application, it is possible to provide a supply device and a film forming device capable of equally supplying a certain amount of electronic parts with a simple mechanism. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a perspective view (A), a cross-sectional view (B), and a perspective view (C) showing a state in which the electronic parts have entered the mask holes, of the electronic parts which are the supply targets in the embodiment.

[0021] Figure 2 is a simplified configuration diagram showing the film forming device of the embodiment.

[0022] Figure 3 is a plan view (A) and a partial cross-sectional side view (B) showing the supply device of the embodiment.

[0023] Figure 4 is a partial cross-sectional side view (A) showing the housing of the electronic parts, and a partial cross-sectional side view (B) showing the supply. Figure 3

[0024] Figure 5 is a plan view (A) showing the chute, and an A-A arrow cross-sectional view (B).

[0025] Figure 6 is a plan view (A) showing the mask, and a B-B arrow cross-sectional view (B).

[0026] Figure 7 is a plan view (A) showing the receiving table, and a C-C arrow cross-sectional view (B).

[0027] Figure 8 is a cross-sectional view showing a standby state (A) of the mask, and a mounted state (B) of the mask to the chute.

[0028] Figure 9 is a cross-sectional view showing a state (A) in which the adsorption portion is positioned on the mask, and a state (B) in which the electronic parts are dropped.

[0029] Figure 10 is a cross-sectional view showing a state (A) in which the mask is separated from the chute, and a state (B) in which the chute is moved in a horizontal direction.

[0030] Figure 11 is a cross-sectional view showing a state (A) in which the excess electronic parts are adsorbed, and a state (B) in which the pusher is lowered to hold the receiving table 250 to the holding hole.

[0031] Figure 12 (A) to (G) of FIG. 10 are explanatory diagrams showing the supply order of the electronic parts to the mask. Figure 12

[0032] (A) to (C) of FIG. 11 are explanatory diagrams showing the order of reversing the mask. Figure 13 Figure 13 [Explanation of Symbols]

[0033] 1: Film forming apparatus

[0034] 2: Supply apparatus

[0035] 3: Film forming processing portion

[0036] 4: Control apparatus

[0037] 31: Chamber

[0038] 32: Conveying portion

[0039] 33: Mask

[0040] ​​33: Pretreatment section

[0041] 34, 35: Film forming section

[0042] 210: Housing section

[0043] 211: Container

[0044] 211a: Partition

[0045] 211b: Inclined surface

[0046] 212: Support table

[0047] 212a: Leg portion

[0048] 220: Slide groove

[0049] 221: Plate body

[0050] 222: Slide groove hole

[0051] 223: Partition wall

[0052] 225: Partition

[0053] 230: Vibration mechanism

[0054] 231: Vibration table

[0055] 231b: Housing hole

[0056] 232: Base table

[0057] 240: Mask

[0058] 241: Plate body

[0059] 242: Mask hole

[0060] 243: Limiting hole

[0061] 244: Beam portion

[0062] 245: Partition

[0063] 250: Support table

[0064] 251: Plate body

[0065] 252: Support portion

[0066] 253: Limiting portion

[0067] 260: Interval adjustment portion

[0068] 261: Propeller

[0069] 261a: Placement table

[0070] 261b: Shaft

[0071] 261c: support portion

[0072] 261d: guide

[0073] 261e: movable body

[0074] 262: drive source

[0075] 270: moving mechanism

[0076] 280: transfer mechanism

[0077] 281: pickup mechanism

[0078] 282: guide mechanism

[0079] 283: moving body

[0080] 284: adsorption portion

[0081] 284a: adsorption plate

[0082] 284b: support plate

[0083] 284c: support

[0084] 285: adsorption force imparting portion

[0085] 285a: magnetic member

[0086] 285b: holding plate

[0087] 285c: abutting / separating mechanism

[0088] 286: support portion

[0089] 287: arm portion

[0090] 288: guide portion

[0091] 290: conveyance mechanism

[0092] 291: motor

[0093] 292: rotary table

[0094] 292a: holding hole

[0095] 311: exhaust portion

[0096] 321: rotary table

[0097] 322: drive source

[0098] 323: seal body

[0099] 324: propeller

[0100] 331: Processing Room

[0101] 341, 351: Film-forming chamber

[0102] 342, 352: Target

[0103] Axc, Axs, Axm: Axes

[0104] C: Electronic components

[0105] Dx: Distance traveled

[0106] Dz: Interval

[0107] E: Electrode

[0108] En: Internal electrode

[0109] F: Face

[0110] R: Electrode formation region

[0111] X, Y, Z: Direction. Detailed Implementation

[0112] The embodiments of the present invention (hereinafter referred to as "the embodiments") will be described in detail with reference to the accompanying drawings.

[0113] [Electronic Components]

[0114] like Figure 1 As shown in (A), the electronic component C formed by the film in this embodiment is a chip-shaped electronic component C with electrodes E formed at both ends using conductive material. Thus, the electronic component C has one end where the electrode E is formed and the other end. For example, components such as capacitors, resistors, coils, and inductors are included in the electronic component C. The electronic component C has a cuboid shape, a cube shape, or a thin plate shape, and the electrodes E are formed in close contact with each other in a box-like manner, covering a region containing a pair of opposite side surfaces. The region where the electrodes E are formed is designated as the electrode forming region R.

[0115] Figure 1(B) is a cross-sectional view of an electronic component C, which is a multilayer ceramic capacitor obtained by stacking dielectric sheets to form internal electrodes En. A pair of electrodes E formed on the outer surface of the electronic component C is a multilayer structure consisting of overlapping layers of multiple conductive materials, electrically connected to the internal electrodes En of the electronic component C. In this embodiment, copper (Cu) is deposited on titanium (Ti), which serves as a base layer for improving adhesion, to act as a seed layer for the electrodes E. Subsequently, by using the seed layer as a seed, copper (Cu) is deposited onto the electrode formation region R using electrolytic plating, thus completing the formation of the electronic component C with electrodes E. Since the base layer and the seed layer are also part of the electrodes E, in the following description of this embodiment, the deposition of these layers is also referred to as "deposition of electrodes E".

[0116] Furthermore, in the following description, the straight line passing through the center of the pair of side surfaces covered by electrode E will be referred to as the axis Axc of electronic component C. In this embodiment, for example, electronic component C can be a very small electronic component with a length of 0.6 mm in the axis Axc direction, a length of 0.2 mm in the axis Axc direction of electrode E, and a rectangular cross-section of 0.3 mm × 0.3 mm orthogonal to the axis Axc of electrode E. The present invention can be applied to electronic components C that are smaller or larger than this.

[0117] [summary]

[0118] like Figure 2 As shown, the film-forming apparatus 1 of this embodiment includes a supply device 2, a film-forming treatment unit 3, and a control device 4. For example... Figure 1 As shown in (C), the supply device 2 supplies the electronic component C to the film forming processing unit 3 by inserting it into the mask hole 242, thus covering the area other than one of the electrode forming regions R. The film forming processing unit 3 forms a film of electrode material in the exposed electrode forming region R. In the following description, the horizontal alignment direction of the supply device 2 and the film forming processing unit 3 is designated as the X direction, the orthogonal horizontal direction as the Y direction, and the vertical direction as the Z direction. The electronic component C is inserted into the mask hole 242 with its axis Axc along the Z direction. Furthermore, as described later, the mask hole 242 is provided in the mask 240.

[0119] [Supply device]

[0120] like Figure 3 (A) Figure 3 (B) Figure 4 (A) Figure 4As shown in (B) of FIG. 1, the supply device 2 has a housing section 210, a chute 220, a vibration mechanism 230, a mask 240, a receiving table 250, a spacing adjustment section 260, a moving mechanism 270, a transfer mechanism 280, and a conveyance mechanism 290.

[0121] (Housing section)

[0122] The housing section 210 houses a plurality of electronic parts C before formation of electrodes E, that is, before film formation. The housing section 210 has a container 211 and a support table 212. The container 211 is a box-shaped body with an upper portion open, and a plurality of partitions 211a as recesses are provided on a horizontal inner bottom portion. The plurality of partitions 211a are arranged in a matrix, and a plurality of electronic parts C that are previously put in are housed in each of the partitions 211a. A part of the inner side surface of the container 211 is structured so as to be an inclined surface 211b inclined toward the inner bottom portion, and the electronic parts C put in from the upper edge of the container 211 fall down toward the inner bottom portion. The support table 212 is a table that supports the container 211 in the horizontal direction, and the like. Figure 3 As shown in (B) of FIG. 1, the four leg portions 212a are provided on the placement surface of the supply device 2.

[0123] (Chute)

[0124] The chute 220 guides the plurality of electronic parts C transferred from the housing section 210 to each of the plurality of mask holes 242, respectively. As shown in (A) of FIG. 2, Figure 5 As shown in (B) of FIG. 2, Figure 5 The chute 220 has a plate body 221, a chute hole 222, and a spacing wall 223. The plate body 221 is a rectangular plate-shaped body. The chute hole 222 is a plurality of holes through which the electronic parts C can pass one by one. Each of the chute holes 222 penetrates in a direction orthogonal to the surface of the plate body 221, and guides the electronic parts C that pass through to the mask hole 242. The chute hole 222 is a quadrangular truncated pyramid shape that is enlarged toward the side into which the electronic parts C are inserted, that is, the upper end side, so that the electronic parts C easily enter. In addition, a straight line in the Z direction that passes through the center of the chute hole 222 is set as an axis Axs.

[0125] The spacing wall 223 is arranged in a lattice on the surface of the plate body 221. A plurality of rectangular regions surrounded by the spacing wall 223 constitute a plurality of partitions 225 arranged in a matrix. A plurality of chute holes 222 are formed in each of the partitions 225 in a matrix. That is, the spacing wall 223 includes a plurality of chute holes 222, and forms the partition 225 to which the electronic parts C are supplied. The position of each of the partitions 225 corresponds one-to-one to the position of each of the partitions 211a of the housing section 210.

[0126] Because the interior of the chute 220 is divided into multiple sections 225 by the partition walls 223, when guiding the electronic component C to the mask hole 242, as described later, even if the chute 220 vibrates, the electronic component C supplied to each section 225 will be prevented from moving to other sections 225 by the partition walls 223, and will instead enter the chute hole 222 within each section 225. Therefore, when the chute 220 vibrates, it can suppress the electronic component C from moving to other areas and becoming unevenly distributed.

[0127] Furthermore, because a large number of electronic components C are supplied and arranged at once, the plate 221 of the chute 220 has a large area, which may sometimes cause deflection, bending, or strain. If deflection, bending, or strain occurs, the electronic components C will tend to move to a specific part of the plate 221 and cannot be supplied evenly to the mask holes 242. Since the partition wall 223 is provided throughout the area of ​​the plate 221 where electronic components C are supplied, it functions as a beam, increasing the strength of the plate 221 and preventing deflection, bending, or strain.

[0128] Furthermore, the positions of each partition 225 of the slide 220 correspond one-to-one with the positions of each partition 211a of the receiving section 210. Moreover, by pre-quantitatively distributing and receiving multiple electronic components C in each partition 211a of the receiving section 210, and moving the received electronic components C to the corresponding partition 225 of the slide 220 according to the adsorption of each partition 211a, multiple electronic components C can be evenly distributed within the surface of the slide 220.

[0129] (Vibration Mechanism)

[0130] The vibration mechanism 230 facilitates the insertion of the electronic component C into the mask hole 242 by vibrating the slide 220 or the mask 240 (described later). Figure 3 (A) Figure 3 As shown in (B), the vibration mechanism 230 includes a vibration table 231 and a base 232. The vibration table 231 is a horizontally oriented plate. The base 232 is disposed on the mounting surface of the supply device 2 and supports the vibration table 231 at a position offset from the slide 220 in the X direction. That is, it is arranged in conjunction with the conveying mechanism 290 described later. Furthermore, the vibration table 231 is supported on the base 232 such that one end coincides with the mask 240 conveyed by the conveying mechanism 290 when viewed from above. In the portion of the vibration table 231 that overlaps with the mask 240 conveyed by the conveying mechanism 290 when viewed from above, a receiving hole 231b is provided for the mask 240 and the receiving platform 250 described later to be inserted. The slide 220 is horizontally supported on the vibration table 231 such that it is located above the receiving hole 231b.

[0131] The vibration table 231 is provided in a vibratable state by causing an oscillation body built in the base table 232 to act. Thus, the sash 220 supported on the vibration table 231 vibrates together with the vibration table 231. Also, the vibration is transmitted to the mask 240 and the receiving table 250 which are in contact with the sash 220, and vibration is performed. As the oscillation body, for example, an electromagnetic coil, a motor, a piezoelectric element is used. The vibration direction and the vibration strength can be appropriately set.

[0132] (mask)

[0133] As Figure 6 (A) of Figure 6 (B) of, the mask 240 has a plate body 241, mask holes 242, restriction holes 243, and beam portions 244. The plate body 241 is a circular plate-like member. The mask holes 242 are a plurality of holes through which the electronic parts C are inserted one by one via the sash holes 222 of the sash 220 overlapped with the mask 240, and cover a part of the electronic parts C. Each of the mask holes 242 is a corner column in which the axis Axc of the inserted electronic part C coincides in the vertical direction, and which penetrates in a direction orthogonal to the surface of the plate body 241. A straight line in the vertical direction passing through the center of the mask hole 242 is set as an axis Axm. The length in the axis Axm direction of the mask hole 242 is shorter than the length in the axis Axc direction of the electronic part C. More specifically, the length in the axis Axm direction of the mask hole 242 is the same as the length in the axis Axc direction of the region R other than the electrode formation region of the electronic part C. That is, the length in the axis Axm direction of the mask hole 242 is the same as the length of the region which is not sputtered in the axis Axc direction of the electronic part C (see (C) of Figure 1 ).

[0134] The size of the cross section orthogonal to the axis Axm of the mask hole 242 is only required to be such that the electronic part C falls and is inserted due to the weight, and the axis Axc becomes the vertical direction. That is, the inner diameter of the mask hole 242 has an inner diameter through which the electronic part C can pass, and the cross section orthogonal to the axis Axm of the mask hole 242 is slightly larger than the cross section orthogonal to the axis Axc of the electronic part C and smaller than the size which causes the axis Axc to be inserted inclined with respect to the vertical direction. However, it is set to be larger than the size which is required to be pressed in.

[0135] Further, in the case where the electrode E is formed by sputtering described later, the size of the cross section orthogonal to the axis Axm of the mask hole 242 is preferably smaller than the size into which the film forming material enters from the gap formed between the mask hole 242 and the electronic part C.

[0136] The mask hole 242 of the present embodiment covers the other regions in a state where only the electrode formation region R of the lower end of the inserted electronic part C is exposed, by being in contact with the receiving table 250 (see Figure 1(C)). Multiple mask holes 242 are arranged in a matrix within multiple partitions 245. The position of each partition 245 corresponds to the position of partition 225 of the overlapping groove 220, and the position of the mask holes 242 in each partition 245 corresponds to the position of the groove holes 222 in each partition 225. That is, the axis Axm of the mask hole 242 corresponds to the axis Axs of the groove hole 222, and the lower opening of the mask hole 242 matches the upper opening of the groove hole 222 without any horizontal offset (XY direction, θ direction), thus allowing the electronic component C to pass through.

[0137] The limiting hole 243 is a through hole used to align the mask 240 with the support platform 250 and prevent positional displacement by inserting the limiting portion 253 of the support platform 250 (described later). In this embodiment, the limiting hole 243 is cylindrical in shape, corresponding to the shape of the limiting portion 253. The beam portion 244 is a thin plate that is fixed on the lower surface of the plate 241 in such a way that the wall thickness increases in areas other than the partition 245, thereby increasing the strength of the plate 241 and preventing bending or strain.

[0138] (Supporting platform)

[0139] The support platform 250 is a platform that holds the mask 240 and connects to one end of the electronic component C inserted into the mask hole 242. In this embodiment, the electronic component C is inserted into the mask hole 242 in a vertical direction, so the end of the electronic component C that connects to the support platform 250 is the lower end, and the other end on the opposite side is the upper end. In the following description, one end of the electronic component C and the end of the mask hole 242 corresponding to it are referred to as the lower end, and the other end of the electronic component C and the end of the mask hole 242 corresponding to it are referred to as the upper end, but the orientation of the electronic component C and the mask hole 242 is not limited to this. Moreover, there is a possibility that both ends of the electronic component C are one end (lower end) and the other end (upper end).

[0140] like Figure 7 (A) Figure 7 As shown in (B), the support platform 250 has a plate 251, a support portion 252, and a limiting portion 253. The plate 251 is a circular plate-shaped member with the same diameter as the mask 240. The support portion 252 is a rectangular plate-shaped body fixed to one side of the plate 251. When the mask 240 overlaps the support platform 250, the support portion 252 is provided in each partition 245 at a position that blocks the lower end of the mask hole 242. In addition, the support portion 252 is provided at a position that does not overlap with the beam portion 244 of the mask 240.

[0141] The limiting part 253 is a cylindrical pin. The limiting part 253 is provided at a position corresponding to the limiting hole 243 of the mask 240. By inserting it into the limiting hole 243, the support platform 250 and the mask 240 are aligned and positional displacement is prevented.

[0142] (Interval adjustment section)

[0143] The interval adjustment section 260 (refer to Figure 3 (B)) adjusts the interval of the mutually facing surfaces of the chute 220 and the mask 240. Specifically, as described later, the interval of the chute 220 and the mask 240 is adjusted to be a position at which the mask 240 contacts the chute 220 (first position), a position at which the chute 220 and the mask 240 are moved horizontally relative to each other (second position), and a position at which the mask 240 and the support table 250 are held in the holding hole 292a (third position). That is, the interval adjustment section 260 of the present embodiment is a lifting mechanism that lifts the support table 250 and the mask 240 between the first position, the second position, and the third position.

[0144] Furthermore, the first position is a position at which the electronic component C is inserted into the mask 240 from the chute 220 by vibration (refer to Figure 9 (A) and Figure 9 (B) of FIG. 6), the second position is a position at which the mask 240 is separated from the chute 220 by the interval Dz and the upper end of the electronic component C inserted into the mask 240 does not interfere with the chute 220 (a position at which the chute 220 and the mask 240 are movable horizontally relative to each other) (refer to Figure 10 (A) and Figure 10 (B) of FIG. 7), and the third position is a position at which the chute 220 and the mask 240 are separated and stand by (refer to Figure 11 (B) of FIG. 8).

[0145] In addition, in order to be in a state in which the upper end of the electronic component C does not interfere with the chute 220 in the second position, the moving distance (amount of interval Dz) when the chute 220 and the mask 240 are moved relative to each other in the vertical direction (Z direction, axis Axs direction of the chute hole 222) by the interval adjustment section 260 is equal to or more than the length of the axis Axc direction of the electrode formation region R and equal to or less than the length of the axis Axc direction of the electronic component C (refer to Figure 10 (A) and Figure 12 (D) of FIG. 9).

[0146] The electrode formation region R is a region in which the electrode E is formed, and thus is formed corresponding to two poles of a pair. Therefore, between the pair of electrode formation regions R, a region in which the + and - of two electrodes E are separated is required. Therefore, the electrode formation region R becomes a region in which an interval for achieving such pole separation is reserved. For example, it is also possible to form only the face F at the lower end (refer to Figure 1(C) of FIG. 8, a gap is provided at a portion of the corner on the side connected to the surface F, and the entire portion other than this is provided as the other electrode E. That is, if the film formation region (electrode formation region R) is taken as a reference, the interval Dz is not more than the length in the axis Axc direction of the electronic component C. It is preferable to set this to a position as close as possible to the length in the axis Axc direction of the electrode formation region R, taking into account errors in positioning and the like when moving. Further, it is preferable to set the interval Dz to a distance that enables the following state, in which the electronic component C housed in the mask hole 242 is not sucked when suction is performed from above.

[0147] The interval adjustment section 260 has a pusher 261 and a drive source 262. The pusher 261 has a placement table 261a on which the receiving table 250 is mounted, and a shaft 261b that supports the placement table 261a. The drive source 262 is a motor that raises and lowers the shaft 261b.

[0148] (Moving mechanism)

[0149] The moving mechanism 270 is a mechanism that relatively moves the chute 220 and the mask 240 in the horizontal direction in a manner in which the axis Axs of the chute hole 222 and the axis Axm of the mask hole 242 are offset, in a state in which the upper end of the electronic component C does not interfere with the chute 220 (refer to (B) of FIG. 8, (E) of FIG. 8). The moving mechanism 270 of the present embodiment is provided between the placement table 261a and the shaft 261b, and moves the receiving table 250 and the mask 240 in the X direction by moving the placement table 261a. As the moving mechanism 270, for example, a pneumatic cylinder can be used. Figure 10 Figure 12

[0150] In order to enable this kind of movement, a support section 261c, a guide 261d, and a movable body 261e are further provided between the placement table 261a and the shaft 261b (refer to (C) of FIG. 8). The support section 261c is a plate-shaped member that is connected to the shaft 261b in a manner facing the placement table 261a. The guide 261d is a rod-shaped member that is fixed to the support section 261c in a manner extending in the X direction. The movable body 261e is a member that has a recess that is slidably inserted into the guide 261d. The recess portion of the movable body 261e is inserted into the guide 261d, and the portion on the opposite side of the recess portion is fixed to the placement table 261a. Figures 8-11

[0151] ​​​The cylinder of the moving mechanism 270 is fixed to the support 261c at a position that can push the movable body 261e. By pushing the movable body 261e with the moving mechanism 270, the movable body 261e and the mounting platform 261a connected thereto move along the guide 261d. For example, the moving mechanism 270 moves a distance Dx of about half the horizontal length of the mask hole 242, thus misaligning the axis Axs of the slide hole 222 with the axis Axm of the mask hole 242.

[0152] (Transfer mechanism)

[0153] The transfer mechanism 280 is a mechanism for transferring electronic component C between the receiving section 210 and the slide 220. The transfer mechanism 280 is also a removal mechanism for removing electronic components C other than those inserted into the mask hole 242 from the slide 220. Figure 3 (A) Figure 3 (B) Figure 4 (A) Figure 4 As shown in (B), the transfer mechanism 280 has a pick-up mechanism 281 and a guide mechanism 282.

[0154] The pickup mechanism 281 is a mechanism for picking up electronic component C from the receiving section 210 or the slide 220. The pickup mechanism 281 includes a movable body 283, an adsorption section 284, and an adsorption force applying section 285. The movable body 283 moves between the receiving section 210 and the slide 220. The movable body 283 is a prism-shaped structure with a widened end pyramid, and serves as a base member supporting the adsorption section 284 and the adsorption force applying section 285. The movable body 283 is movably disposed between the receiving section 210 and the slide 220 via a guide mechanism 282.

[0155] The adsorption unit 284 is a unit for adsorbing electronic component C in order to pick up electronic component C. The adsorption unit 284 has an adsorption plate 284a, a support plate 284b, and a support column 284c. The adsorption plate 284a is a component for adsorbing electronic component C. The adsorption plate 284a is a rectangular plate-shaped body respectively disposed at positions corresponding to each section 225 of the slide 220, and adsorbs electronic component C by applying magnetic force from the adsorption force imparting unit 285 described later. The horizontal plane of the adsorption plate 284a is smaller than the area surrounded by the partition wall 223 so as to be able to approach the slide hole 222 of each section 225. In addition, the position of each adsorption plate 284a also corresponds to each section 211a of the container 211.

[0156] That is, the adsorption section 284 is provided to the moving body 283, and the adsorption section 284 causes the adsorption force to act on the region that is spread in a planar shape in correspondence with the region in the chute 220 where the electronic component is supplied, thereby adsorbing the electronic component C, and releases the electronic component C by releasing the adsorption force. The adsorption section 284 is provided in a region corresponding to the partition 225 of the chute 220. The adsorption section 284 is not provided in a region not corresponding to the partition 225 of the chute 220.

[0157] The support plate 284b is a rectangular plate-shaped body on which the adsorption plate 284a is mounted. The size of the support plate 284b covers the entire region of the chute hole 222 in which the chute 220 is formed. The adsorption plate 284a and the support plate 284b are formed to have a thickness by a magnetic force. The material of the adsorption plate 284a and the support plate 284b is not particularly limited, and can be metal or a non-metal such as resin. For example, stainless steel is used as the adsorption plate 284a and the support plate 284b. The support pillar 284c is a support pillar that fixes the support plate 284b to the moving body 283. The upper end of the support pillar 284c is fixed to the bottom of the moving body 283, and the lower end is fixed to the support plate 284b. Thus, the support plate 284b is supported in the horizontal direction at a distance from the bottom surface of the moving body 283.

[0158] The adsorption force imparting section 285 imparts the adsorption force to the adsorption plate 284a. The adsorption force imparting section 285 imparts a magnetic force for adsorbing the electronic component C to the surface of the adsorption plate 284a facing the housing section 210 with the support plate 284b interposed therebetween. The adsorption force imparting section 285 has a magnetic member 285a, a holding plate 285b, and an approach / separation mechanism 285c. The magnetic member 285a is, for example, a permanent magnet. The horizontal surface of the magnetic member 285a has a size that is the same as that of the adsorption plate 284a. The size of the holding plate 285b is the same as that of the support plate 284b of the adsorption section 284, and the holding plate 285b is disposed between the support plate 284b, the holding plate 285b, and the bottom of the moving body 283. The magnetic member 285a is mounted at a position corresponding to each adsorption plate 284a with the support plate 284b interposed therebetween in the holding plate 285b.

[0159] The approach / separation mechanism 285c performs adsorption and release of the electronic component C by relatively moving the magnetic member 285a and the adsorption plate 284a. The approach / separation mechanism 285c of the present embodiment is provided to the bottom of the moving body 283, and supports the magnetic member 285a so as to be liftable and lowerable. As the approach / separation mechanism 285c, for example, an air cylinder is used. The approach / separation mechanism 285c supports the holding plate 285b in the horizontal direction, and causes the adsorption plate 284a to exert the adsorption force by the magnetic force via the support plate 284b by causing the magnetic member 285a to descend and contact the support plate 284b. Also, the approach / separation mechanism 285c loses the adsorption force by the magnetic force in the adsorption plate 284a by causing the magnetic member 285a to ascend and separate from the support plate 284b.

[0160] The guiding mechanism 282 is a mechanism that moves the movable body 283 between the receiving section 210 and the slide 220. The guiding mechanism 282 has a support section 286, an arm section 287, and a guide section 288. The support section 286 is a pair of corner pillar members erected on the support platform 212 of the receiving section 210. The arm section 287 is a horizontal corner pillar member supported by the support section 286, extending from above the container 211 towards above the receiving hole 231b of the vibration table 231. The guide section 288 is a two-axis movement mechanism combining linear guides in the X and Z directions, provided on the arm section 287. The movable body 283 is supported by a slider in the guide section 288. Thus, the guiding mechanism 282 can transfer the electronic component C adsorbed on the adsorption section 284 between the receiving section 210 and the slide 220.

[0161] (Transportation agency)

[0162] like Figure 3 (A) Figure 3 As shown in (B), the conveying mechanism 290 is a mechanism for conveying a mask 240 with electronic component C inserted into the mask hole 242 between the supply device 2 and the film forming processing unit 3. The conveying mechanism 290 of this embodiment has a rotary table 292 that rotates intermittently by a motor 291. A plurality of holding holes 292a, serving as through holes, are formed at equal intervals on the rotary table 292. The receiving platform 250 is held through these holding holes 292a.

[0163] A step is formed on the inner edge of the retaining hole 292a to hold the support platform 250 on which the mask 240 is placed (see reference). Figure 8 (A) Figure 8 (B)). The holding hole 292a comes directly below the receiving hole 231b of the vibration table 231 whenever the rotary table 292 stops due to intermittent rotation. The pusher 261 of the interval adjustment unit 260 is between the holding hole 292a and the receiving hole 231b of the rotary table 292, causing the support table 250 on which the mask 240 is mounted to move.

[0164] [Film Forming Treatment Department]

[0165] The film formation processing unit 3 is an apparatus for forming a film using plasma on the portion of the electronic component C exposed from the mask hole 242, i.e., the electrode formation region R. For example... Figure 2 As shown, the film-forming treatment unit 3 includes a chamber 31, a conveying unit 32, a pretreatment unit 33, a film-forming unit 34, and a film-forming unit 35. The chamber 31 is a container whose interior can be vacuumed using exhaust gas generated by the exhaust unit 311. The exhaust unit 311 has piping (not shown) connected to the exhaust port and an exhaust circuit. The conveying unit 32 includes a rotary table 321, a drive source 322, a sealing body 323, and a propeller 324.

[0166] The rotary table 321 is a circular platform that moves the receiving table 250, which is carried into the chamber 31, to each section of the pretreatment section 33, the film formation section 34, the film formation section 35, a load lock section described later, and the like by intermittently rotating. The seal body 323 is a member for sealing each section to be isolated from the chamber 31. The seal body 323, on which the receiving table 250 is placed, is held in a holding hole provided at the rotary table 321 at equal intervals. The pusher 324 raises and lowers the seal body 323 at a position corresponding to each section of the film formation processing section 3.

[0167] In addition, although not shown, the film formation processing section 3 has a carrying-in and carrying-out section that carries in and carries out the receiving table 250 on which the mask 240 is mounted into and out of the chamber 31, and a load lock section that can carry in and carry out the receiving table 250 on which the mask 240 is mounted into and out of the chamber 31 through the carrying-in and carrying-out section while maintaining a vacuum state in the chamber 31.

[0168] The pretreatment section 33 performs surface treatment on the electrode formation region R by plasma. The surface treatment is, for example, ion bombardment treatment that cleans the surface of the electrode formation region R by ions generated in a processing gas by plasma. The pretreatment section 33 has a processing chamber 331 provided on the top side of the chamber 31, sealed by the rising seal body 323, and performing surface treatment on the electrode formation region R exposed from the mask 240.

[0169] The film formation section 34 and the film formation section 35 perform film formation processing on the electrode formation region R of the electronic part C by sputtering. The sputtering is processing that causes film formation material shot from a target 342, a target 352 to be deposited on the surface of the electrode formation region R by ions generated in a sputtering gas by plasma. The film formation section 34 and the film formation section 35 have a film formation chamber 341 and a film formation chamber 351 provided on the top side of the chamber 31, sealed by the rising seal body 323, and performing film formation processing on the electrode formation region R exposed from the mask 240.

[0170] The target 342 and the target 352, which contain film formation material, are provided in the film formation chamber 341 and the film formation chamber 351. The target 342 and the target 352 are members formed of film formation material that is deposited on the electronic part C by sputtering. The target 342 and the target 352 are held in a back plate, not shown, and are connected to a power source via an electrode. As the film formation material of the base layer, for example, Ti is used, and as the seed layer of the electrode E, for example, Cu, Au, Ag, or the like is used. Among these, various materials can be applied as long as they are materials that can be formed by sputtering. In addition, in the present embodiment, the base layer is formed in the film formation section 34, and the seed layer of the electrode E is formed in the film formation section 35. As the material of the base layer, for example, titanium (Ti) is used, and as the material of the seed layer of the electrode E, for example, copper (Cu) is used.

[0171] Furthermore, in this embodiment, two film-forming sections 34 and 35 are provided to form a film consisting of a base layer and a seed layer. However, if a base layer is not required, only one film-forming section may be provided. Moreover, if more layers of film are required, two or more film-forming sections may be provided.

[0172] [Control Device]

[0173] Control device 4 is a device that controls the various parts of film-forming apparatus 1 (see reference). Figure 2 The control device 4 may, for example, be a computer operating according to a prescribed program. The control content of the control device 4 is programmed and executed by a processing device such as a programmable logic controller (PLC) or a central processing unit (CPU).

[0174] For example, the control device 4 controls the vibration of the vibration table 231 by the vibration mechanism 230, the lifting and lowering of the bearing table 250 and the mask 240 by the interval adjustment unit 260, the movement of the slide 220 by the moving mechanism 270, the input and removal of electronic components C by the transfer mechanism 280, the transport of the bearing table 250 by the transport mechanism 290, the transport of the chamber 31 of the bearing table 250 by the transport in and transport out unit, the plasma treatment by the pretreatment unit 33, the film formation treatment by the film formation unit 35, and the transport of the bearing table 250 by the transport unit 32 through the program described above.

[0175] [action]

[0176] The film-forming apparatus 1 of this embodiment described above, except as described above, is used in addition to the film-forming apparatus 1 described in the above embodiment. Figures 1-7 In addition, refer to Figures 8-13 The explanatory diagram illustrates the film formation process in electronic component C. Additionally, as a prerequisite for this explanation, such as... Figure 4 As shown in (A), multiple electronic components C are pre-placed into the container 211 of the receiving section 210, and multiple electronic components C are housed in each partition 211a. The number of electronic components C housed in each partition 211a is greater than the number of groove holes 222 in each partition 225 of the groove 220 and the number of mask holes 242 in each partition 245 of the mask 240. Moreover, by grinding or the like using a flat plate, the positions of the electronic components C housed in each partition 211a can be averaged so that they are evenly close within each partition 211a.

[0177] Moreover, such as Figure 8As shown in (A), a support platform 250 for mounting a mask 240 is placed on the mounting stage 261a of the thruster 261. At this time, the mask 240 and the support platform 250 are aligned and misalignment is prevented by inserting the limiting portion 253 of the support platform 250 into the limiting hole 243 of the mask 240. Furthermore, as... Figure 8 As shown in (B), the stage 261a rises via the pusher 261, thus reaching a first position where the mask 240 contacts the lower surface of the groove 220. At this time, the lower end of the groove hole 222 mates with the upper end of the mask hole 242. Moreover, at this time, the overlapping area of ​​the groove hole 222 and the mask hole 242 is larger than the area F in the direction orthogonal to the axis Axc of the electronic component C (refer to...). Figure 1 The area of ​​(C)).

[0178] (Supply Operations)

[0179] First, explain the supply operation of electronic component C. For example... Figure 4 As shown in (A), the moving body 283 of the pickup mechanism 281 is positioned above the container 211 by horizontal movement via the guide mechanism 282. At this time, as the holding plate 285b descends via the contact / separation mechanism 285c, the magnetic component 285a comes into contact with the support plate 284b, and the adsorption plate 284a exerts an adsorption force brought about by the magnetic force via the support plate 284b.

[0180] Next, the moving body 283 of the pickup mechanism 281 descends via the guide mechanism 282, thereby bringing each adsorption plate 284a close to each section 211a of the container 211. Thus, each adsorption plate 284a uses magnetic attraction to hold multiple electronic components C. Then, the moving body 283 of the pickup mechanism 281 rises via the guide mechanism 282 to pick up the electronic components C from the container 211. Subsequently, the moving body 283 moves horizontally via the guide mechanism 282 and is positioned above the chute 220. Furthermore, as... Figure 4 (B) Figure 9 (A) Figure 12 As shown in (A), the moving body 283 descends, while the adsorption plate 284a approaches the sections 225 of the chute 220.

[0181] Subsequently, as Figure 9 (B) Figure 12As shown in (B) of FIG. 27, the holding plate 285b is raised by the engagement / disengagement mechanism 285c, and the magnetic member 285a is disengaged from the support plate 284b, whereby the magnetic force acting on each of the adsorption plates 284a is released. Thus, the electronic component C adsorbed to each of the adsorption plates 284a falls down to each of the sections 225 of the chute 220. Also, the moving body 283 is raised by the guide mechanism 282, whereby the adsorption plates 284a are withdrawn from each of the sections 225 of the chute 220. In this way, the electronic component C is supplied to the chute 220. Subsequently, the holding plate 285b is lowered by the engagement / disengagement mechanism 285c, and the magnetic member 285a is engaged with the support plate 284b, whereby the state in which the magnetic force acts on each of the adsorption plates 284a is returned.

[0182] Also, the chute 220, the mask 240, and the receiving table 250 are vibrated by vibrating the vibration table 231 by the vibration mechanism 230. In this way, as shown in (A) of FIG. 28, the electronic component C housed in each of the sections 225 of the chute 220 is guided in a manner such that the axis Axc becomes the vertical direction during the passage through the chute hole 222, and falls into the mask hole 242. Figure 12

[0183] The electronic component C that has entered the mask hole 242 is engaged with the support portion 252 of the receiving table 250 at the lower end thereof, and only the electrode formation region R on the upper end side is exposed from the mask hole 242. The electrode formation region R exposed from the mask hole 242 enters the chute hole 222. Also, there is a case in which the electronic component C that has entered the mask hole 242 is overlaid with the electronic component C that has entered the chute hole 222.

[0184] Next, as shown in (A) of FIG. 29, Figure 10 Figure 12 (D) of FIG. 29, the mask 240 is separated from the lower surface of the chute 220 as the second position by lowering the placement table 261a by the interval adjustment portion 260. The interval Dz of the separation at this time is the same as the height of the electrode formation region R exposed from the mask hole 242. Thus, the boundary between the electronic component C that has entered the chute hole 222 and the electronic component C that has entered the mask hole 242 and the lower surface of the chute 220 become the same horizontal plane, and the chute 220 can be moved in the horizontal direction.

[0185] Also, as shown in (B) of FIG. 29, Figure 10 Figure 12 ​​​As shown in (E), the moving mechanism 270 moves the support platform 250, on which the mask 240 is placed, a distance Dx in the X direction. This distance Dx is approximately half the horizontal length of the mask hole 242. Thus, by deviating the axis Axs of the slide hole 222 from the axis Axm of the mask hole 242, the electronic component C that has entered the mask hole 242 is prevented from falling, and the bottom surface of the slide 220 restricts the vertical movement of the electronic component C that has entered the mask hole 242.

[0186] Furthermore, the movement distance Dx is not limited to approximately half the horizontal length of the mask hole 242. It is sufficient to prevent the electronic component C from falling through the slide hole 222 and restrict the vertical movement of the electronic component C already inside the mask hole 242. To prevent the electronic component C from moving between the slide hole 222 and the mask hole 242, it is sufficient to move to a position where the area of ​​the overlapping surface of the slide hole 222 and the mask hole 242 is less than the area of ​​the surface F in the direction orthogonal to the axis Axc of the electronic component C.

[0187] In this state, such as Figure 11 (A) Figure 12 As shown in (F), the moving body 283 is moved upwards and downwards by the guide mechanism 282, thereby causing the adsorption plate 284a to descend and approach each section 225 of the chute 220. Thereby, each adsorption plate 284a uses magnetic force to hold the electronic component C in each section 225. At this time, the magnetic force to be adsorbed acts not only on the electronic component C that has entered the chute hole 222, but also on the electronic component C that has entered the mask hole 242. However, the electronic component C that has entered the mask hole 242 is restricted in movement as described above, and therefore is not adsorbed. Furthermore, the moving body 283 rises by the guide mechanism 282, and the electronic component C is picked up from the chute 220 and removed. Subsequently, the moving body 283 moves horizontally upwards towards the container 211 by the guide mechanism 282. Then, the moving body 283 descends, and the adsorption plate 284a approaches each section 211a of the container 211 (see reference). Figure 4 (B) Figure 4 (A)).

[0188] Subsequently, by utilizing the contact / separation mechanism 285c, the holding plate 285b rises, and the magnetic component 285a leaves the support plate 284b, thereby releasing the magnetic force acting on each adsorption plate 284a. Therefore, the electronic component C adsorbed on each adsorption plate 284a falls into each section 211a of the container 211. Then, the moving body 283 rises via the guide mechanism 282, thereby removing the adsorption plates 284a from each section 211a of the container 211. Thus, the electronic component C is removed from the chute 220.

[0189] Next, as shown in (B) of FIG. 6, the support table 250 on which the mask 240 is placed is lowered by the descent of the placement table 261a of the pusher 261, and becomes a third position in which the support table 250 is held in the holding hole 292a of the rotary table 292. Thus, the mask 240 with the electronic component C inserted into the mask hole 242 is supplied to the rotary table 292 together with the support table 250. In addition, the moving mechanism 270 returns the support table 250 on which the mask 240 is placed to the initial position. Figure 11 Figure 12 Further, the pusher 261 is withdrawn from the support table 250 and the rotary table 292 by descent. Furthermore, the support table 250 held in the holding hole 292a comes to a position at which it can be carried in by the carry-in carry-out section, by intermittent rotation of the rotary table 292, and thus the carry-in carry-out section carries the support table 250 into the chamber 31 via the load interlock section, and mounts the seal body 323 on the rotary table 321.

[0190] Further, as shown in (B) of FIG. 6, the support table 250 on which the mask 240 is placed is lowered by the descent of the placement table 261a of the pusher 261, and becomes a third position in which the support table 250 is held in the holding hole 292a of the rotary table 292. Thus, the mask 240 with the electronic component C inserted into the mask hole 242 is supplied to the rotary table 292 together with the support table 250. In addition, the moving mechanism 270 returns the support table 250 on which the mask 240 is placed to the initial position.

[0191] Further, as shown in (B) of FIG. 6, the support table 250 on which the mask 240 is placed is lowered by the descent of the placement table 261a of the pusher 261, and becomes a third position in which the support table 250 is held in the holding hole 292a of the rotary table 292. Thus, the mask 240 with the electronic component C inserted into the mask hole 242 is supplied to the rotary table 292 together with the support table 250. In addition, the moving mechanism 270 returns the support table 250 on which the mask 240 is placed to the initial position. Figure 2 Further, as shown in (B) of FIG. 6, the support table 250 on which the mask 240 is placed is lowered by the descent of the placement table 261a of the pusher 261, and becomes a third position in which the support table 250 is held in the holding hole 292a of the rotary table 292. Thus, the mask 240 with the electronic component C inserted into the mask hole 242 is supplied to the rotary table 292 together with the support table 250. In addition, the moving mechanism 270 returns the support table 250 on which the mask 240 is placed to the initial position.

[0192] Further, as shown in (B) of FIG. 6, the support table 250 on which the mask 240 is placed is lowered by the descent of the placement table 261a of the pusher 261, and becomes a third position in which the support table 250 is held in the holding hole 292a of the rotary table 292. Thus, the mask 240 with the electronic component C inserted into the mask hole 242 is supplied to the rotary table 292 together with the support table 250. In addition, the moving mechanism 270 returns the support table 250 on which the mask 240 is placed to the initial position.

[0193] Next, in order to perform film formation on the electrode formation region R on the opposite side of the electrode formation region R on which film formation has been performed, the electronic component C is reversed. The mask 240 with the electronic component C on which film formation has been performed is carried to a prescribed position at which reversal is performed, together with the support table 250, by the rotary table 292. At the prescribed position, as shown in (A) of FIG. 7, the mask 240 on the support table 250 positioned at the prescribed position is overlaid with another support table 250 prepared separately, and as shown in (B) of FIG. 7, the support table 250 on which the mask 240 is placed is lowered by the descent of the placement table 261a of the pusher 261, and becomes a third position in which the support table 250 is held in the holding hole 292a of the rotary table 292.

[0194] Figure 13 Further, as shown in (B) of FIG. 6, the support table 250 on which the mask 240 is placed is lowered by the descent of the placement table 261a of the pusher 261, and becomes a third position in which the support table 250 is held in the holding hole 292a of the rotary table 292. Thus, the mask 240 with the electronic component C inserted into the mask hole 242 is supplied to the rotary table 292 together with the support table 250. In addition, the moving mechanism 270 returns the support table 250 on which the mask 240 is placed to the initial position. Figure 13 ​​The inversion is performed as shown in (B). Furthermore, the limiting portion 253 of the newly overlapping support platform 250 enters the limiting hole 243 of the mask 240 for alignment and to prevent misalignment. Moreover, the limiting portions 253 of the two overlapping support platforms 250 abut against each other, thereby defining the interval between the two support platforms 250.

[0195] The spacing between the two overlapping support platforms 250 is set to be the same as or slightly larger than the axial length of the electronic component C. The two support platforms 250 are of the same shape and size. Therefore, the protrusion of the limiting portion 253 of each support platform 250 is the same. Furthermore, the protrusion of the support portion 252 of each support platform 250 is the same. Therefore, twice the difference between the protrusions of the limiting portion 253 and the support portion 252 is set to be the same as or slightly larger than the axial length of the electronic component C. That is, the difference between the protrusions of the limiting portion 253 and the support portion 252 is set to be half the length set to be the same as or slightly larger than the axial length of the electronic component C. Moreover, the thickness of the plate body 241 of the mask 240 is thicker than the difference between the protrusions of the limiting portion 253 and the support portion 252, and thinner than twice the difference between the protrusions of the limiting portion 253 and the support portion 252. And this is the thickness at which the electrode forming region R of the electronic component C is exposed when it overlaps the support portion 252. Because of this dimensional relationship, the limiting part 253 of another support platform 250 can be inserted into the limiting hole 243 provided on the plate 241 of the mask 240 placed on one of the support platforms 250. Furthermore, even if the two overlapping support platforms 250 are reversed as a whole (or flipped), the electrode forming area R at the other end of the electronic component C on the other support platform 250, which is in contact with the other end, is the same as the amount of exposure before reversal.

[0196] The mask 240 is also inverted through this inversion, thus lowering it and contacting the lowered support platform 250. Consequently, the electrode formation region R in the electronic component C, which is opposite to the film-forming side, is exposed from the upper end of the mask hole 242. Furthermore, as... Figure 13 As shown in (C), the upper support platform 250 is removed. In this state, similarly as described above, the support platform 250 is moved into the chamber 31 of the film forming processing unit 3, and film forming processing is performed on the exposed electrode forming regions R. Thus, electrodes E are formed in the electrode forming regions R at both ends of the electronic component C. Furthermore, the overlapping or disassembly of the support platform 250 can be performed by a worker or by a robot, etc.

[0197] [Effect]

[0198] (1) The supply device 2 of the embodiment has a chute 220 having a plurality of chute holes 222 through which the electronic parts C can pass one by one, a mask 240 having mask holes 242 that overlap the chute 220 and cover a part of the electronic parts C through which the electronic parts C are inserted via the chute holes 222, a housing portion 210 that houses a plurality of electronic parts C, and a transfer mechanism 280 that transfers the electronic parts C between the housing portion 210 and the chute 220, the transfer mechanism 280 having a moving body 283 that moves between the housing portion 210 and the chute 220, and a suction portion 284 provided to the moving body 283, which, in correspondence with a region in the chute 220 in which the electronic parts C are supplied, suctions the electronic parts C by exerting a suction force in a region that extends in a planar shape and releases the electronic parts C by releasing the suction force. Further, there is a film formation processing portion 3 that forms a film using the electronic parts C supplied by the supply device 2.

[0199] Therefore, it is possible to provide the supply device 2 that can supply a constant amount of electronic parts uniformly with a simple structure and the film formation device 1. Specifically, the electronic parts C are suctioned in a region that extends in a planar shape and are released in the chute 220, so it is possible to make the supply amount per unit area constant in the region in the chute 220 in which the electronic parts C are supplied and to make the distribution in the plane uniform with a simple mechanism that does not require a measuring mechanism or the like. Thus, the probability of the electronic parts C entering the mask holes 242 is increased, and it is possible to prevent a decrease in yield. Note that the constant amount does not require the number of electronic parts C supplied each time to be exactly the same. Further, the uniformity does not require the interval of the electronic parts C supplied to be exactly constant and non-overlapping. In order to increase the probability of the electronic parts C entering the mask holes 242, it is only necessary to suppress the variation in the number and the concentration in the plane.

[0200] (2) The chute 220 is provided with a partition wall 223 that includes a plurality of chute holes 222 and forms a subregion 225 in which the electronic parts C are supplied. Therefore, when the chute 220 is vibrated to supply the electronic parts C from the chute holes 222 to the mask holes 242, movement to other regions in the chute 220 is prevented by the partition wall 223. Thus, the chute holes 222 in the subregion 225 in which the electronic parts C are supplied can be surely supplied from the chute holes 222 to the corresponding mask holes 242.

[0201] (3) The suction portion 284 is provided in a region corresponding to the subregion 225 of the chute 220. By suctioning and releasing the electronic parts C in a region corresponding to each subregion 225 of the chute 220, the electronic parts C can be supplied uniformly to each subregion 225.

[0202] (4) The housing section 210 is provided with a plurality of sub-sections 211a to which the electronic parts C are supplied, and the sub-sections of the chute 220 are provided at positions corresponding one-to-one to the plurality of sub-sections of the housing section. Thus, the electronic parts C can be supplied equally by previously adsorbing the electronic parts C in each sub-section 211a and moving to the corresponding sub-section 225 of the chute 220.

[0203] (5) The adsorption section 284 has an adsorption plate 284a to which the electronic parts C are adsorbed, and an adsorption force imparting section 285 that imparts an adsorption force to the adsorption plate 284a, and the adsorption force imparting section 285 has a magnetic member 285a and an approach / separation mechanism 285c that adsorbs and releases the electronic parts C by relatively moving the magnetic member 285a and the adsorption plate 284a.

[0204] Thus, by moving the magnetic member 285a with respect to the adsorption plate 284a, the adsorption and release of the electronic parts C over a prescribed range can be switched instantaneously, and the bias of the adsorption position and the falling position of the electronic parts C can be reduced.

[0205] The supply device 2 has a housing section 210 that houses a plurality of electronic parts C, and the transfer mechanism 280 has a guide mechanism 282 that transfers the electronic parts C between the housing section 210 and the chute 220. Thus, the supply and removal of the electronic parts C can be performed by a common mechanism.

[0206] [Modified Example]

[0207] The present embodiment also considers the following modified example.

[0208] (1) The magnetic member 285a of the adsorption force imparting section 285 is provided as a permanent magnet in the described configuration, but an electromagnet can also be used. In this case, there is no need to provide a mechanism that approaches and separates the magnetic member 285a, and the presence or absence of the adsorption force by the magnetic force can be switched by the on / off of the current. Also, even if the magnetic member 285a is an electromagnet, it can be combined with the mechanism that approaches and separates the magnetic member 285a. In this case, even small and light electronic parts C can be reliably released from the adsorption holding by the mechanism that reliably shields the influence of the magnetic force by approaching and separating the magnetic member 285a.

[0209] (2) The adsorption portion can have a suction port that holds the electronic component C by suction using negative pressure, and a suction pipe that supplies negative pressure to the suction port. In this case, the adsorption force imparting portion is connected to the suction pipe as a negative pressure generating circuit that imparts the adsorption force using negative pressure. Thus, even if the electronic component C is a material or shape that is not easily adsorbed using magnetic force, it can be adsorbed and held by suction using negative pressure, and the electronic component C can be supplied by releasing the adsorption by stopping the negative pressure. The opening area of the suction port is set to be smaller than the area of the smallest face of the electronic component C. The suction port can be a plurality of holes formed in the adsorption plate, or the suction port can be covered with a porous material having air permeability. Thus, the suction port is reduced in size, and the electronic component C can be prevented from being sucked into the suction pipe.

[0210] (3) The film forming processing portion 3 is not limited to a device that forms a film using sputtering. It can be a device that forms the electrode E by applying a conductive material to the electrode formation region R exposed from the mask hole 242 of the mask 240, or a device that forms the electrode E by dipping the electrode formation region R in a conductive material.

[0211] (4) The partition 225 of the chute 220 can be one or a plurality of partitions. The partition 245 of the mask 240 and the partition 211a of the housing portion 210 can be one or a plurality of partitions.

[0212] (5) The support table 250 can not have the support portion 252, and can be a flat surface. Also, the mask 240 can not have the beam portion 244, and can be a flat surface. The support table 250 and the mask 240 can be formed integrally even if they are fixed. The restriction portion 253 can be a member such as a pin, or can be a wall that surrounds the mask 240.

[0213] (6) The electrode formation region R can be a region of at least one end of the electronic component C as long as it is a region in which the outer surface of the electronic component C and the internal electrode En are electrically connected. For example, the electrode formation region R can be a region of both ends or only one end in the axis Axc direction of the electronic component C. That is, the film forming processing portion 3 can form a film on at least one end of the electronic component C.

[0214] Also, the electrode formation region R can be a partial region of the electronic component C, and for example, can be a box-shaped region that includes the face F in the axis Axc direction of the electronic component C, or can be only the face F in the axis Axc direction of the electronic component C (see (A) to (C) of FIG. 6). Figure 1 Figure 1 ​That is, the mask hole 242 can cover only a part of the electronic component C, and specifically includes a form in which a part or all of a side surface (a surface along the axis Axc) of the electronic component C is covered. In a case where the mask hole 242 covers all of the side surface of the electronic component C, the electronic component C is held in the mask hole 242 in a state in which only a surface F orthogonal to the axis Axc is exposed.

[0215] [Other Embodiments]

[0216] The above-described embodiments and modifications of each part of the present application are presented as an example, and are not intended to limit the scope of the application. The novel embodiments described above can be implemented in various other ways, and various omissions, substitutions, combinations, and modifications can be made without departing from the scope of the present application. These embodiments and modifications are included in the scope and spirit of the present application, and are included in the application described in the claims.

Claims

1. A supply device, comprising: a chute having a plurality of chute holes through which electronic parts can pass one by one; a mask having mask holes that overlap the chute and cover a portion of the electronic parts, into which the electronic parts are inserted via the chute holes; a housing section that houses a plurality of the electronic parts; and a transfer mechanism that transfers the electronic parts between the housing section and the chute, the transfer mechanism having: a moving body that moves between the housing section and the chute; and an adsorption section provided to the moving body, which, in correspondence with a region of the chute in which the electronic parts are supplied, adsorbs the electronic parts by exerting an adsorption force in a region that extends in a planar manner, and releases the electronic parts by releasing the adsorption force; a partition wall is provided in the chute, which divides the plurality of chute holes into one section, forming a plurality of sections in which the electronic parts are supplied.

2. The supply device according to claim 1, wherein the adsorption section is provided in a region corresponding to the section of the chute.

3. The supply device according to claim 1, wherein a plurality of sections in which the electronic parts are supplied are provided in the housing section, the section of the chute is provided with a plurality of sections in positions corresponding one-to-one to the plurality of sections of the housing section.

4. The supply device according to claim 1, wherein the adsorption section has: an adsorption plate that adsorbs the electronic parts; and an adsorption force imparting section that imparts an adsorption force to the adsorption plate, the adsorption force imparting section has a magnetic member, and a contact / separation mechanism that performs adsorption and adsorption release of the electronic parts by relatively moving the magnetic member and the adsorption plate.

5. The supply device according to claim 1, having an adsorption force imparting section that imparts an adsorption force to the adsorption section, the adsorption force imparting section is an electromagnet.

6. The supply device according to claim 1, wherein the adsorption section has: a suction port that sucks and holds the electronic parts using a negative pressure; and a suction pipe that supplies a negative pressure to the suction port.

7. A film formation device, comprising: the supply device according to any one of claims 1 to 6; and a film formation processing section that performs film formation on the electronic parts. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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