A printed wiring board short repair method and apparatus

Abstract

The present application relates to the technical field of printed circuit board repair, and particularly relates to a printed circuit board short circuit repair method and device. The printed circuit board short circuit repair method comprises the following steps: S1: obtaining an image of a to-be-repaired area of a to-be-repaired circuit board to determine the size, shape and position of the to-be-repaired area; S2: adjusting the size of a rectangular laser spot according to the obtained image information of the to-be-repaired area, and focusing the focal point of the rectangular laser spot on the surface of the to-be-repaired area to remove the copper layer of the to-be-repaired area; S3: reducing the irradiation power of the rectangular laser spot, and focusing the focal point of the rectangular laser spot on the surface of the to-be-repaired area to clean the residual products of the to-be-repaired area. The printed circuit board short circuit repair device adopts the above-mentioned printed circuit board short circuit repair method, realizes the short circuit repair of the printed circuit board, and can avoid the damage of the residual products after repair to the normal copper layer and the substrate, improves the repair efficiency, and also improves the repair effect.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board repair technology, and in particular to a method and apparatus for repairing short circuits in printed circuit boards. Background Technology

[0002] Printed circuit boards (PCBs) are crucial electronic components, serving as both the support structure and the carrier for electrical interconnections. The manufacturing process of PCBs includes key steps such as exposure, development, electroplating, and etching. Due to various process issues that can arise at each stage, short circuits may occur in certain areas, rendering the entire PCB unusable. With the increasing density of conductive lines and decreasing linewidth in PCBs, short circuits are becoming more frequent, resulting in significant economic losses.

[0003] Currently, to repair localized short circuits in printed circuit boards (PCBs), laser beams are mostly used to fill and scan the area to be repaired. However, because the laser beam itself produces a circular spot, excess energy exists within the outline of this spot, causing excessive burning to the substrate during the removal process. Therefore, relatively weak laser energy is used, requiring multiple fill scans of the area to be repaired. For large areas, this significantly increases repair time and reduces repair efficiency. Furthermore, multiple fill scans can easily lead to a large amount of black copper oxide residue remaining around the area to be repaired. This necessitates acquiring new images of the residue and repeating the fill scan, further reducing repair efficiency and effectiveness.

[0004] Therefore, there is an urgent need to invent a method and device for repairing short circuits in printed circuit boards to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide a method and apparatus for repairing short circuits in printed circuit boards, so as to achieve short circuit repair of printed circuit boards and avoid damage to the normal copper layer and substrate caused by residual products after repair, thereby improving repair efficiency and repair effect.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A method for repairing short circuits on printed circuit boards includes the following steps:

[0008] S1: Obtain an image of the area to be repaired on the circuit board to be repaired, so as to determine the size, shape and location of the area to be repaired;

[0009] S2: Adjust the size of the rectangular laser spot according to the image information of the area to be repaired, and focus the rectangular laser spot on the surface of the area to be repaired to remove the copper layer of the area to be repaired;

[0010] S3: Reduce the irradiation power of the rectangular laser spot and focus the rectangular laser spot on the surface of the area to be repaired, so as to clean the residual products in the area to be repaired.

[0011] As a preferred embodiment, the following steps are included after step S3:

[0012] S4: Acquire an image of the area to be repaired, and determine whether the area to be repaired meets the repair requirements;

[0013] If so, then perform steps S1 to S3 on the next area to be repaired of the circuit board to be repaired;

[0014] If not, continue performing steps S1 to S3 on the area to be repaired.

[0015] As a preferred embodiment, in step S2, when the size of the area to be repaired is greater than the maximum size of the rectangular laser spot, the rectangular laser spot is adjusted to the maximum size, and the rectangular laser spot and the area to be repaired are moved relative to each other so that the rectangular laser spot fills and scans the surface of the area to be repaired.

[0016] When the size of the area to be repaired is not greater than the maximum size of the rectangular laser spot, the size of the rectangular laser spot is adjusted to match the size of the area to be repaired, so that the rectangular laser spot covers and irradiates the surface of the area to be repaired.

[0017] As a preferred embodiment, in step S2, the irradiation power of the rectangular laser spot is 100μJ to 1000μJ.

[0018] As a preferred embodiment, the length of the rectangular laser spot ranges from 1 μm to 250 μm, and the width of the rectangular laser spot ranges from 1 μm to 250 μm.

[0019] As a preferred embodiment, in steps S1 and S4, an image of the area to be repaired is acquired under a 10x magnification lens; in step S2, the size of the rectangular laser spot is adjusted under a 50x magnification lens.

[0020] A printed circuit board (PCB) short-circuit repair device is provided, which repairs the PCB to be repaired using the PCB short-circuit repair method described above. The PCB short-circuit repair device includes:

[0021] A laser optical system, comprising a laser, a spot adjuster, and a laser focuser arranged sequentially along the laser beam irradiation path, wherein the laser is configured to emit a laser beam, the spot adjuster is configured to adjust the received laser beam into a rectangular laser spot of a desired size, and the laser focuser is configured to focus the received rectangular laser spot onto the surface of the area to be repaired.

[0022] A visual imaging system configured to acquire an image of the area to be repaired on the circuit board to be repaired, and a spot adjuster adjusting the size of the rectangular laser spot based on the image information acquired by the visual imaging system; and

[0023] A translational motion system includes a Y-axis transfer platform and an X-axis transfer module. The Y-axis transfer platform is located below the laser focuser and is configured to move the circuit board to be repaired along the Y-axis direction. The X-axis transfer module is configured to synchronously move the laser optical system and the visual imaging system along the X-axis direction.

[0024] As a preferred embodiment, the spot adjuster includes:

[0025] The first driving component, the first baffle, and the second baffle are provided. The first driving component is disposed on the X-axis transfer module. The first baffle and the second baffle are arranged at intervals along a first direction. The first driving component can synchronously drive the first baffle and the second baffle to move closer or further away from each other.

[0026] The second driving member, the third baffle, and the fourth baffle are provided. The second driving member is disposed on the X-axis transfer module. The third baffle and the fourth baffle are arranged at intervals along the second direction. The second driving member can synchronously drive the third baffle and the fourth baffle to move closer to or further away from each other. The second direction is perpendicular to the first direction.

[0027] The first baffle, the second baffle, the third baffle, and the fourth baffle are arranged in a grid pattern and form a rectangular slit in the middle. The laser beam is emitted through the rectangular slit. The size of the rectangular laser spot emitted from the rectangular slit can be adjusted by adjusting the size of the rectangular slit.

[0028] As a preferred embodiment, the laser focuser includes a laser focusing lens group and a third driving member. The third driving member is disposed on the X-axis transfer module. The laser focusing lens group is disposed opposite to the spot adjuster. The third driving member is configured to drive the laser focusing lens group to move toward or away from the spot adjuster.

[0029] As a preferred embodiment, the laser focusing lens assembly is made of multiple optical lenses.

[0030] As a preferred embodiment, the Y-axis transplanting platform includes:

[0031] Y-axis transfer module; and

[0032] A support platform is disposed below the laser focuser. The support platform is used to support the circuit board to be repaired. The Y-axis transfer module is configured to drive the support platform to move along the Y-axis direction.

[0033] The beneficial effects of this invention are:

[0034] This invention provides a method for repairing short circuits in printed circuit boards. It utilizes a shaped rectangular laser spot focused on the surface of the area to be repaired to remove the copper layer. The shaped rectangular laser spot has uniform energy, allowing for a single high-peak-energy laser removal operation, significantly improving repair efficiency and effectiveness. Furthermore, using a uniformly energetic rectangular laser spot eliminates the need for multiple scans of the area to be repaired, leaving only a small amount of residual material. Therefore, simply reducing the laser spot's irradiation power is sufficient to clean away the residual material, eliminating the need to re-acquire images of the residual material or readjust the laser spot size. This further improves repair efficiency and prevents damage to surrounding healthy copper layers and the substrate from residual material after repair.

[0035] The present invention also provides a short circuit repair device for printed circuit boards. The device uses the above-mentioned short circuit repair method for printed circuit boards to repair the area to be repaired on the circuit board, thereby avoiding damage to the surrounding normal copper layer and substrate caused by residual products after repair, and greatly improving the repair efficiency and repair effect. Attached Figure Description

[0036] Figure 1 This is a flowchart of the printed circuit board short circuit repair method provided in the embodiments of the present invention;

[0037] Figure 2 This is a schematic diagram of the printed circuit board short circuit repair device provided in an embodiment of the present invention;

[0038] Figure 3 This is a schematic diagram of the beam adjuster provided in an embodiment of the present invention;

[0039] Figure 4 This is a schematic diagram showing the positional arrangement of the baffles in the light spot adjuster provided in an embodiment of the present invention.

[0040] In the picture:

[0041] 1. Laser optical system; 11. Laser; 12. Beam adjuster; 121. First driving element; 122. First baffle; 123. Second baffle; 124. Second driving element; 125. Third baffle; 126. Fourth baffle; 127. Rectangular slit; 13. Laser focuser;

[0042] 2. Visual imaging system; 21. Observation lens; 22. Lens group; 23. Visual imaging module; 24. CCD camera; 25. Light source;

[0043] 3. Translation system; 31. Y-axis transplanting platform; 311. Y-axis transplanting module; 312. Bearing platform; 32. X-axis transplanting module. Detailed Implementation

[0044] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0045] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0046] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0047] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0048] Currently, to repair localized short circuits in printed circuit boards (PCBs), laser beams are mostly used to fill and scan the area to be repaired. However, because the laser beam itself produces a circular spot, excess energy exists within the outline of this spot, causing excessive burning to the substrate during the removal process. Therefore, relatively weak laser energy is used, requiring multiple fill scans of the area to be repaired. For large areas, this significantly increases repair time and reduces repair efficiency. Furthermore, multiple fill scans can easily lead to a large amount of black copper oxide residue remaining around the area to be repaired. This necessitates acquiring new images of the residue and repeating the fill scan, further reducing repair efficiency and effectiveness.

[0049] To solve the above problems, such as Figure 1 As shown, this embodiment provides a method for repairing short circuits on printed circuit boards, including the following steps:

[0050] S1: Obtain an image of the area to be repaired on the circuit board to determine the size, shape, and location of the area to be repaired;

[0051] S2: Adjust the size of the rectangular laser spot according to the image information of the area to be repaired, and focus the rectangular laser spot on the surface of the area to be repaired to remove the copper layer of the area to be repaired;

[0052] S3: Reduce the irradiation power of the rectangular laser spot and focus the rectangular laser spot on the surface of the area to be repaired to remove residual products in the area to be repaired.

[0053] This printed circuit board short-circuit repair method uses a shaped rectangular laser spot focused on the surface of the area to be repaired to remove the copper layer. The shaped rectangular laser spot has uniform energy, allowing for a single high-peak-energy laser removal operation, significantly improving repair efficiency and effectiveness. Furthermore, using a uniformly energetic rectangular laser spot eliminates the need for multiple scans of the area to be repaired, leaving only a small amount of residual material. Therefore, simply reducing the laser spot's irradiation power and cleaning the residual material is sufficient; there's no need to re-acquire images of the residual material or readjust the laser spot size, further improving repair efficiency and preventing damage to surrounding healthy copper layers and the substrate from residual material.

[0054] It should be noted that in this embodiment, because the laser beam is shaped and a shaped rectangular laser spot is used for the removal operation, a narrow-pulse high-peak-energy laser can be selected, which can vaporize the copper layer instantly, thus eliminating the need for multiple scans of the area to be repaired. Furthermore, by shaping the laser beam, this embodiment creates a rectangular laser spot with uniform energy at its end. When the area to be repaired is focused, the copper layer is heated evenly, without excess energy burning the substrate and causing damage. Compared to the circular spot at the end of a traditional unshaped laser beam, the rectangular laser spot has no excess energy in its outline but has a steeper edge transition, resulting in higher energy transfer efficiency and a smaller heat-affected zone.

[0055] It should be noted that in step S2, the irradiation power of the rectangular laser spot is 100μJ to 1000μJ, thereby ensuring that the rectangular laser spot can vaporize the copper layer instantly. Since the irradiation power of the rectangular laser spot in step S3 is less than that in step S2, when cleaning the residual products, it can prevent the use of excessively high power laser spots from causing decomposition and damage to the substrate.

[0056] Specifically, in step S2, when the size of the area to be repaired is larger than the maximum size of the rectangular laser spot, the rectangular laser spot is adjusted to its maximum size, and the rectangular laser spot and the area to be repaired are moved relative to each other so that the rectangular laser spot fills and scans the surface of the area to be repaired. When the size of the area to be repaired is not larger than the maximum size of the rectangular laser spot, the size of the rectangular laser spot is adjusted to match the size of the area to be repaired so that the rectangular laser spot covers and irradiates the surface of the area to be repaired. This setting method adjusts the size of the rectangular laser spot according to the size of the area to be repaired. For small areas to be repaired, there is no need for filling scanning; direct coverage irradiation is sufficient, further improving repair efficiency. It should be noted that in this embodiment, the length of the rectangular laser spot ranges from 1μm to 250μm, and the width of the rectangular laser spot ranges from 1μm to 250μm. For example, when the size of the area to be repaired is 50x100μm, the size of the rectangular laser spot can be directly set to 50x100μm to cover and irradiate the surface of the area to be repaired. When the area to be repaired is 300x300μm, the size of the rectangular laser spot can be directly set to the maximum size of 250x250μm, and then a filling scan can be performed on the area to be repaired. It should be noted that when performing a filling scan on the area to be repaired, the scanning speed range is 10mm / s to 300mm / s, and the irradiation of the rectangular laser spot can be intermittent or continuous, depending on the displacement.

[0057] In addition, such as Figure 1As shown, the following steps are included after step S3:

[0058] S4: Acquire an image of the area to be repaired and determine whether the area to be repaired meets the repair requirements;

[0059] If so, then perform steps S1 to S3 on the next area to be repaired on the circuit board to be repaired;

[0060] If not, continue with steps S1 to S3 for the area to be repaired.

[0061] The printed circuit board short circuit repair method provided in this embodiment, through the above operations, after the repair operation of the area to be repaired is completed, the area to be repaired is tested to ensure that the repair of the area to be repaired meets the repair requirements.

[0062] Preferably, in steps S1 and S4, an image of the area to be repaired is acquired under a 10x magnification lens to ensure accurate acquisition of image information such as the size, shape, and position of the area to be repaired. In step S2, the size of the rectangular laser spot is adjusted under a 50x magnification lens to ensure accurate adjustment of the size of the rectangular laser spot.

[0063] like Figure 2 As shown, this embodiment also provides a printed circuit board short-circuit repair device, which uses the above-mentioned printed circuit board short-circuit repair method to repair the circuit board to be repaired. In this embodiment, the printed circuit board short-circuit repair device includes a laser optical system 1, a visual imaging system 2, and a translational motion system 3. The laser optical system 1 includes a laser 11, a spot adjuster 12, and a laser focuser 13 arranged sequentially along the laser beam irradiation path. The laser 11 is used to emit a laser beam, the spot adjuster 12 is used to adjust the received laser beam into a rectangular laser spot of the required size, and the laser focuser 13 is used to focus the received rectangular laser spot onto the surface of the area to be repaired. The visual imaging system 2 is used to acquire an image of the area to be repaired on the circuit board to be repaired. The spot adjuster 12 adjusts the size of the rectangular laser spot according to the image information acquired by the visual imaging system 2. The translational motion system 3 includes a Y-axis transfer platform 31 and an X-axis transfer module 32. The Y-axis transfer platform 31 is located below the laser focuser 13. Figure 2 The Y-axis transfer platform 31 (in the negative direction of the Z-axis) is used to move the circuit board to be repaired along the Y-axis, and the X-axis transfer module 32 is used to synchronously move the laser optical system 1 and the vision imaging system 2 along the X-axis, thereby ensuring that the laser optical system 1 accurately illuminates the area to be repaired and that the vision imaging system 2 accurately acquires image information of the area to be repaired. It should be noted that the Y-axis transfer platform 31 and the X-axis transfer module 32 also move accordingly based on the image information acquired by the vision imaging system 2.

[0064] The printed circuit board short circuit repair device provided in this embodiment uses the above-mentioned printed circuit board short circuit repair method to repair the area to be repaired on the circuit board, avoiding damage to the surrounding normal copper layer and substrate caused by residual products after repair, and greatly improving the repair efficiency and repair effect.

[0065] It should be noted that the laser focuser 13 includes a laser focusing lens assembly and a third driving component. The third driving component is mounted on the X-axis transfer module 32. The laser focusing lens assembly is positioned opposite the spot adjuster 12. The third driving component is used to drive the laser focusing lens assembly to move closer to or further away from the spot adjuster 12, so that the focal point of the rectangular laser spot is on the surface of the area to be repaired. The third driving component can be adjusted using a lead screw and nut. Since the specific structure and focusing principle of the laser focusing lens assembly are existing technologies, they will not be described in detail here.

[0066] It should be noted that the X-axis transfer module 32 is a conventional servo motor lead screw module, which will not be described in detail here. Furthermore, the Y-axis transfer platform 31 includes a Y-axis transfer module 311 and a support platform 312. The support platform 312 is positioned below the laser focuser 13 and is used to support the circuit board to be repaired. The Y-axis transfer module 311 drives the support platform 312 to move along the Y-axis. The Y-axis transfer module 311 is also a conventional servo motor lead screw module, which will not be described in detail here. It should be noted that both the Y-axis transfer module 311 and the X-axis transfer module 32 move accordingly based on the image information acquired by the vision imaging system 2, and the positioning accuracy of the Y-axis transfer module 311 and the X-axis transfer module 32 is ±0.1μm.

[0067] In this embodiment, as Figure 1 As shown, the visual imaging system 2 includes an observation lens 21, a lens group 22, a visual imaging module 23, a CCD camera 24, and a light source 25. The observation lens 21 is positioned above the support platform 312 (in the positive direction of the Z-axis in the figure). Above the observation lens 21, along the optical path, the lens group 22, the visual imaging module 23, and the CCD camera 24 are sequentially arranged. The light source 25 provides light to the observation lens 21, ensuring that the observation lens 21 can more clearly observe the image information of the area to be repaired on the support platform 312. Since the functions and specific working principles of each component in the visual imaging system 2 are existing technologies, they will not be described in detail here. It should be noted that the observation lens 21 is available in 10x and 50x magnification versions; the appropriate magnification can be selected according to requirements.

[0068] Now combined Figure 3 and Figure 4 The specific structure of the beam adjuster 12 is described below, such as... Figure 3 and Figure 4 As shown, the spot adjuster 12 includes a first drive member 121, a first baffle 122, a second baffle 123, a second drive member 124, a third baffle 125, and a fourth baffle 126. The first drive member 121 and the second drive member 124 are both mounted on the X-axis transfer module 32. The first baffle 122 and the second baffle 123 are arranged at intervals along a first direction. The first drive member 121 can synchronously drive the first baffle 122 and the second baffle 123 to move closer or further apart. The third baffle 125 and the fourth baffle 126 are arranged at intervals along a second direction. The second drive member 124... 4. The third baffle 125 and the fourth baffle 126 can be synchronously driven to move closer or further apart. The second direction and the first direction are perpendicular to each other. The first baffle 122, the second baffle 123, the third baffle 125, and the fourth baffle 126 are arranged in a "well" shape, forming a rectangular slit 127 in the middle. The laser beam emitted by the laser 11 is emitted through the rectangular slit 127. The first driving member 121 and the second driving member 124 move by adjusting the corresponding baffles, thereby adjusting the size of the rectangular slit 127, and thus adjusting the size of the rectangular laser spot emitted from the rectangular slit 127. It should be noted that in this embodiment, the first baffle 122 and the second baffle 123 are arranged at intervals along the X-axis direction, and the third baffle 125 and the fourth baffle 126 are arranged at intervals along the Y-axis direction. The first driving member 121 and the second driving member 124 are both motor screw modules, thereby ensuring the adjustment accuracy of each baffle.

[0069] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A method of repairing a short circuit of a printed wiring board, characterized by, Includes the following steps: S1: Obtain an image of the area to be repaired on the circuit board to be repaired, so as to determine the size, shape and location of the area to be repaired; S2: Adjust the size of the rectangular laser spot according to the image information of the area to be repaired, and focus the rectangular laser spot on the surface of the area to be repaired to remove the copper layer of the area to be repaired; S3: Reduce the irradiation power of the rectangular laser spot and focus the rectangular laser spot on the surface of the area to be repaired, so as to clean the residual products in the area to be repaired; In step S2, when the size of the area to be repaired is larger than the maximum size of the rectangular laser spot, the rectangular laser spot is adjusted to the maximum size, and the rectangular laser spot and the area to be repaired are moved relative to each other so that the rectangular laser spot fills the surface of the area to be repaired. When the size of the area to be repaired is not greater than the maximum size of the rectangular laser spot, the size of the rectangular laser spot is adjusted to match the size of the area to be repaired, so that the rectangular laser spot covers and irradiates the surface of the area to be repaired.

2. The printed wiring board short repair method according to claim 1, characterized by, The following steps are included after step S3: S4: Acquire an image of the area to be repaired, and determine whether the area to be repaired meets the repair requirements; If so, then perform steps S1 to S3 on the next area to be repaired of the circuit board to be repaired; If not, continue performing steps S1 to S3 on the area to be repaired.

3. The printed wiring board short repair method according to any one of claims 1 to 2, characterized by, The length of the rectangular laser spot ranges from 1 μm to 250 μm, and the width of the rectangular laser spot ranges from 1 μm to 250 μm.

4. The printed wiring board short repair method according to claim 2, characterized by, In steps S1 and S4, an image of the area to be repaired is acquired under a 10x magnification lens; in step S2, the size of the rectangular laser spot is adjusted under a 50x magnification lens.

5. A printed wiring board short repair apparatus characterized by comprising: The printed circuit board short circuit repair method according to any one of claims 1 to 4 is used to repair the circuit board to be repaired, wherein the printed circuit board short circuit repair device comprises: A laser optical system (1) includes a laser (11), a spot adjuster (12), and a laser focuser (13) arranged sequentially along the laser beam irradiation path. The laser (11) is configured to emit a laser beam, the spot adjuster (12) is configured to adjust the received laser beam into a rectangular laser spot of a required size, and the laser focuser (13) is configured to focus the received rectangular laser spot onto the surface of the area to be repaired. A visual imaging system (2) is configured to acquire an image of the area to be repaired on the circuit board to be repaired, and the spot adjuster (12) adjusts the size of the rectangular laser spot according to the image information acquired by the visual imaging system (2); and Translational motion system (3), the translational motion system (3) includes a Y-axis transfer platform (31) and an X-axis transfer module (32). The Y-axis transfer platform (31) is located below the laser focuser (13). The Y-axis transfer platform (31) is configured to drive the circuit board to be repaired to move along the Y-axis direction. The X-axis transfer module (32) is configured to synchronously drive the laser optical system (1) and the visual imaging system (2) to move along the X-axis direction.

6. The printed wiring board short repair apparatus according to claim 5, characterized by The spot adjuster (12) includes: The first driving member (121), the first baffle (122), and the second baffle (123) are provided on the X-axis transfer module (32). The first baffle (122) and the second baffle (123) are arranged at intervals along the first direction. The first driving member (121) can synchronously drive the first baffle (122) and the second baffle (123) to move closer to or further away from each other. The second drive member (124), the third baffle (125), and the fourth baffle (126) are arranged at intervals along the second direction. The second drive member (124) can synchronously drive the third baffle (125) and the fourth baffle (126) to move closer to or further away from each other. The second direction is perpendicular to the first direction. The first baffle (122), the second baffle (123), the third baffle (125), and the fourth baffle (126) are arranged in a "well" shape and form a rectangular slit (127) in the middle. The laser beam is emitted through the rectangular slit (127). The size of the rectangular laser spot emitted from the rectangular slit (127) can be adjusted by adjusting the size of the rectangular slit (127).

7. The printed wiring board short repair apparatus according to claim 5, characterized by The laser focuser (13) includes a laser focusing lens group and a third driving member. The third driving member is disposed on the X-axis transfer module (32). The laser focusing lens group is disposed opposite to the spot adjuster (12). The third driving member is configured to drive the laser focusing lens group to move toward or away from the spot adjuster (12).

8. The printed wiring board short repair apparatus according to claim 5, characterized by The Y-axis transplanting platform (31) includes: Y-axis transplanting module (311); and A support platform (312) is disposed below the laser focuser (13). The support platform (312) is used to support the circuit board to be repaired. The Y-axis transfer module (311) is configured to drive the support platform (312) to move along the Y-axis direction.

Images