Glass Substrate Planar Grinding Equipment Leveling Method and Its Leveling Device

Abstract

The present invention discloses a leveling method and a leveling device for a glass substrate planar grinding equipment. The leveling method includes the following steps: S1, obtaining a balance plate perpendicular to the rotation axis of the grinding disc; S2, obtaining a plurality of contact rods whose contact ends are in the same plane as the dressing plane of the dressing plate; S3, ensuring that the dressing plate and the balance plate are in a parallel state; S4, the dressing plate performs a dressing operation on the grinding disc. When all the contact endpoints have the contact pressure applied by the grinding disc, the leveling work of the grinding disc is completed. In the present invention, through this leveling method and its leveling device, the automatic leveling of the glass substrate grinding disc is realized, the leveling efficiency is improved, and at the same time, during the leveling process, the perpendicularity between the grinding disc and the rotation axis of the grinding disc is realized, which helps the overall grinding equipment to form a long-term stable planar processing of the glass substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of auxiliary equipment for the production of photomasks, and particularly to a leveling method and a leveling device for a glass substrate planar grinding equipment. Background Art

[0002] A lithographic mask is formed by an opaque light-shielding film on a transparent substrate to form a mask pattern structure, and then the pattern information is transferred to the product substrate through an exposure process. The mask to be processed is composed of a glass substrate, a chromium layer, and a photoresist layer. The glass substrate needs to go through processes such as grinding, polishing, cleaning, and drying before film coating. Both grinding and polishing use grinding equipment. The grinding equipment grinds and polishes the surface of the glass substrate through a grinding disc to obtain a smooth and flat glass substrate surface.

[0003] During the use of the grinding disc of the grinding equipment, the surface of the grinding disc will experience wear and insufficient flatness. At this time, the grinding disc needs to be leveled to maintain the flatness of its grinding surface, and thus maintain the flatness of the glass substrate being ground. Generally, in the workshop, a single-layer hard leveling plate is placed between the grinding discs. The hard leveling plate is a plate-shaped object with a flat surface (after flatness detection). It is used to roughly polish the grinding surface between the grinding discs for a certain period of time, and then the flatness of the grinding disc is measured through a measuring rod (the flatness measuring device in Patent CN202719973U) to determine its flatness. The process is cumbersome, and this flatness can only ensure the flatness of the grinding disc. For a rotating grinding disc, if the grinding disc is not perpendicular to the rotating shaft, it will form an inclined plane for processing, and the eccentric movement is not conducive to the overall grinding equipment to form a long-term and stable planar processing of the glass substrate. Summary of the Invention

[0004] The purpose of the present invention is to improve the efficiency of the leveling work of the grinding disc of the glass substrate planar grinding equipment in the existing technology workshop. A leveling method and a leveling device for a glass substrate planar grinding equipment are proposed. Through this leveling method and leveling device, the automatic leveling of the glass substrate grinding disc is realized, the leveling efficiency is improved, and at the same time, during the leveling process, the perpendicularity between the grinding disc and the rotating shaft of the grinding disc is realized, which helps the overall grinding equipment to form a long-term and stable planar processing of the glass substrate.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A leveling method for a glass substrate planar grinding equipment, comprising the following steps:

[0007] S1: Obtain a balance plate perpendicular to the rotating shaft of the grinding disc, and the balance plate is used as the substrate surface for leveling.

[0008] S2: Use the leveling surface of the leveling plate to level the grinding disk. To ensure that the leveling surface of the leveling plate levels the grinding disk, several contact rods are set, and the contact ends of the contact rods are made to be in the same plane as the leveling surface of the leveling plate.

[0009] S3: Adjust the position state of the leveling plate to ensure that the leveling surface of the leveling plate is parallel to the balance plate, that is, keep the leveling surface of the leveling plate perpendicular to the rotating shaft of the grinding disk, which is used to keep the grinding disk perpendicular to the rotating shaft after leveling.

[0010] S4: The leveling plate levels the rotating grinding disk. When all the contact endpoints have the contact pressure applied by the grinding disk, the leveling work of the grinding disk is completed.

[0011] The above-mentioned leveling method for the glass substrate planar grinding equipment uses the balance plate perpendicular to the rotating shaft of the grinding disk as a reference, keeps the leveling surface of the leveling plate perpendicular to the rotating shaft of the grinding disk, and then the grinding disk obtains a flat grinding surface perpendicular to the rotating shaft of the grinding disk. This not only maintains the flatness of the grinding surface of the grinding plate for the glass substrate, but also realizes the perpendicular positioning of the grinding surface and its rotating shaft, avoiding the formation of an inclined plane during the rotation of the grinding disk, which may cause the glass substrate to be processed into an inclined plane.

[0012] The present invention also proposes a leveling device based on the above-mentioned leveling method for the glass substrate planar grinding equipment. The leveling device includes a frame, on which a leveling main body, a positioning movable cylinder, two extension members and a reflecting member are provided.

[0013] Further, the positioning movable cylinder is spherically connected to the frame through a rotating member, and the working end of the positioning movable cylinder is fixedly connected to the balance plate. An induction surface is provided on the positioning movable cylinder, and three non-collinear induction members are provided on the induction surface. The induction surface is arranged parallel to the balance plate. The extension members are rods perpendicular to the upper and lower grinding disk rotating shafts respectively, and the distances between the two extension members and the rotating member are equal. The reflecting member is located at the end of the extension member. The induction members are used to emit and receive laser, and the reflecting member is used to reflect laser.

[0014] The above three induction members respectively emit laser. After the reflecting member reflects the laser, it is received by the induction members. By adjusting the position of the positioning movable cylinder so that the time for each induction member to receive the corresponding laser reflected from the upper and lower reflecting members is the same, the positioning movable cylinder is in the target position, and at this time the balance plate is in the balanced position.

[0015] Further, the leveling main body includes an upper leveling plate, a lower leveling plate and a positioning sleeve. An upper contact plate is provided at the bottom of the upper leveling plate, and a lower contact plate is provided at the top of the lower leveling plate. The upper contact plate and the lower contact plate are fixedly connected. The sides of the upper contact plate and the lower contact plate are respectively slidably connected to the inner wall of the positioning sleeve. The inner wall of the positioning sleeve is an arc surface, and the upper contact plate and the lower contact plate can move relative to the positioning sleeve to adjust the positions of the upper contact plate and the lower contact plate.

[0016] Further, the balance plate is located between the upper contact plate and the lower contact plate, and the working end of the positioning movable cylinder penetrates through the positioning sleeve and is fixedly connected to the balance plate. An upper induction plate is arranged inside the upper contact plate, and a lower induction plate is arranged inside the lower contact plate. The upper induction plate and the lower induction plate are electrode plates with different charge properties, and the balance plate is a metal plate.

[0017] In the present invention, the upper contact plate is parallel to the grinding plane of the upper grinding flat plate, and the lower contact plate is parallel to the grinding plane of the lower grinding flat plate. When the upper contact plate and the lower contact plate are parallel to the balance plate, the capacitance value between the upper induction plate and the lower induction plate is C1; when the upper contact plate and the lower contact plate are not parallel to the balance plate, the capacitance value between the upper induction plate and the lower induction plate changes to C1. At this time, the upper contact plate and the lower contact plate adjust the positions of the upper induction plate and the lower induction plate by moving relative to the positioning sleeve, so as to maintain the parallel state between the upper contact plate and the lower contact plate and the balance plate, that is, to keep the grinding planes of the upper grinding flat plate and the lower grinding flat plate perpendicular to the rotating shaft of the grinding surface, and to avoid the influence of vibration on the position states of the upper grinding flat plate and the lower grinding flat plate during the grinding process.

[0018] Further, a plurality of contact rods are respectively arranged on the upper contact plate and the lower contact plate. The contact ends of the contact rods corresponding to the upper contact plate point upward, which is the upper contact end, and the upper contact end contacts the upper grinding disc. The contact ends of the contact rods corresponding to the lower contact plate point downward, which is the lower contact end, and the lower contact end is used to contact the lower grinding disc. Pressure sensors are arranged at both the upper contact end and the lower contact end.

[0019] Preferably, a dial indicator and a stopper are arranged on the above-mentioned contact rod. The detection end of the dial indicator is the contact end, and the stopper is used to limit the axial movement of the contact end. First, based on the flat plate, keep the contact ends of all contact rods in contact with the flat plate, and zero the dial indicator. At this time, all contact rods are in the same plane, and then use the stopper to limit the contact ends of the contact rods to keep them in the state of being in the same plane.

[0020] Further, synchronization boxes with the same quantity and positions corresponding to the contact rods are arranged on both the upper contact plate and the lower contact plate. A synchronization block is arranged inside the synchronization box. One end of the synchronization block is fixedly connected to the contact rod, and the other end of the synchronization block is connected to the inner wall of the synchronization box through a tension spring. The space of the synchronization box on the side where the tension spring is arranged for the synchronization block is filled with liquid.

[0021] Further, a pressure application cylinder is also arranged on the grinding main body. The space below the synchronization block is communicated with the pressure application cylinder through a connecting pipe and a return pipe respectively. The pressure application cylinder applies pressure to the liquid inside the synchronization box through the connecting pipe, and this pressure makes the tension spring in a stretched state, and the synchronization block is located at the limit position of the synchronization box. At this time, the contact ends of the contact rods and the grinding planes of the upper grinding flat plate and the lower grinding flat plate are in the same plane.

[0022] Furthermore, the connecting pipe includes an inner pipe and an outer pipe that are movably and sealingly sleeved. A constant-speed pump is provided at the outer pipe, and the constant-speed pump causes the liquid inside the pressure cylinder to enter the synchronization box at a certain speed. A one-way valve is provided on the return pipe, and the return pipe is used for the liquid inside the synchronization box to flow back into the pressure cylinder. The return pipe is communicated with the outer pipe through an overflow pipe, and an overflow valve is provided on the overflow pipe. The overflow pipe is used for the overflow of the liquid inside the connecting pipe.

[0023] Furthermore, a spherical liquid joint is provided at the top of the inner pipe, and a feed spherical surface that is concentric and matched with the spherical liquid joint is provided at the bottom of the synchronization box. The spherical liquid joint is hinged to the feed spherical surface, and the feed spherical surface is movably and sealingly connected to the synchronization box through a movable plate. Liquid through holes are provided on both the spherical liquid joint and the feed spherical surface. The liquid in the connecting pipe enters the synchronization box through the liquid through holes of the spherical liquid joint and the feed spherical surface for pressure application.

[0024] The axis of the pressure cylinder is parallel to the balance plate. When the connecting pipe is perpendicular to the contact plate, the liquid through hole flow rates of the spherical liquid joint and the feed spherical surface are the largest. When the upper contact plate and the lower contact plate are not parallel to the balance plate, the position of the synchronization box is twisted, the length of the connecting pipe changes, the movable plate of the synchronization box moves, the feed spherical surface of the synchronization box rotates relative to the spherical liquid joint, and the liquid through hole flow rates of the spherical liquid joint and the feed spherical surface become smaller. At this time, the internal hydraulic pressure of the connecting pipe increases, and part of the liquid directly enters the pressure cylinder through the overflow pipe. The liquid pressure inside the synchronization box is insufficient, the tension spring slightly returns, the synchronization block drives the contact rod to move, and the contact end of the contact rod leaves the plane where the dressing surface of the dressing plate is located. At this time, the contact end of the contact rod is not used for leveling work, avoiding the ineffective leveling measurement of the contact rod when the upper contact plate and the lower contact plate are not parallel to the balance plate.

[0025] The beneficial effects of the present invention are as follows:

[0026] (1) By setting a balance plate perpendicular to the grinding disc rotating shaft as a reference, the present glass substrate planar grinding equipment leveling method keeps the dressing surface of the dressing plate perpendicular to the grinding disc rotating shaft, and then the grinding disc obtains a flat grinding surface perpendicular to the grinding disc rotating shaft. This not only maintains the flatness of the grinding surface of the grinding plate for the glass substrate, but also realizes the perpendicular positioning of the grinding surface and its rotating shaft, avoiding the formation of an inclined plane on the glass substrate due to the skew of the grinding disc during rotation.

[0027] (2) The leveling device of the present glass substrate planar grinding equipment implements the leveling method, and automatically levels the grinding disc by dressing the grinding disc with the dressing plate. The leveling efficiency is high. During the leveling process, the parallel state between the dressing plate and the balance plate is always maintained, and the flatness control is carried out through the contact rod, so as to realize the flat treatment of the grinding surface perpendicular to its rotating shaft. Description of the Drawings

[0028] Figure 1 It is a step diagram of the leveling method for the planar grinding equipment of the glass substrate;

[0029] Figure 2 It is a structural schematic diagram of this leveling device;

[0030] Figure 3 It is a structural schematic diagram of the leveling main body of this leveling device;

[0031] Figure 4 It is a structural schematic diagram of the contact rod of this leveling device;

[0032] Figure 5 It is a positioning schematic diagram of the positioning movable cylinder of this leveling device;

[0033] Figure 6 It is a schematic diagram of the positional relationship between the induction surface of the positioning movable cylinder and the balance plate of this leveling device;

[0034] Figure 7 It is a schematic diagram of the induction plate and the balance plate of this leveling device.

[0035] In the figure: 1, frame; 2, leveling main body; 3, positioning movable cylinder; 4, induction part; 5, extension part; 6, reflection part; 7, contact rod; 8, balance plate; 9, synchronization box; 10, pressure cylinder; 11, connecting pipe; 12, return pipe; 31, rotating part; 21, upper leveling plate; 22, lower leveling plate; 23, positioning sleeve; 24, upper contact plate; 25, lower contact plate; 26, upper induction plate; 27, lower induction plate; 71, contact end; 72, limiter; 91, synchronization block; 92, tension spring; 93, movable plate; 94, feeding spherical surface; 111, inner pipe; 112, outer pipe; 113, constant speed pump; 121, one-way valve; 122, overflow pipe. Specific embodiments

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0037] Embodiment 1

[0038] Refer to Figure 1 , the leveling method for the planar grinding equipment of the glass substrate includes the following steps:

[0039] S1: Obtain a balance plate perpendicular to the rotating shaft of the grinding disc, and the balance plate is used as the base plate surface for leveling.

[0040] S2: Use the leveling surface of the leveling plate to level the grinding disc. To ensure that the leveling surface levels the grinding disc, several contact rods are set, and the contact ends of the contact rods are made to be in the same plane as the leveling surface of the leveling plate.

[0041] S3: Adjust the position state of the leveling plate to ensure that the leveling surface of the leveling plate is parallel to the balance plate, that is, keep the leveling surface of the leveling plate perpendicular to the axis of the grinding disc rotation, which is used to keep the grinding disc perpendicular to the axis of the grinding disc rotation after leveling.

[0042] S4: The leveling plate levels the rotating grinding disc. When all the contact endpoints have the contact pressure applied by the grinding disc, the leveling work of the grinding disc is completed.

[0043] The above-mentioned leveling method of the glass substrate planar grinding equipment uses the balance plate perpendicular to the axis of the grinding disc rotation as a reference, keeps the leveling surface of the leveling plate perpendicular to the axis of the grinding disc rotation, and then the grinding disc obtains a flat grinding surface perpendicular to the axis of the grinding disc rotation. It not only maintains the flatness of the grinding surface of the grinding plate for the glass substrate, but also realizes the perpendicular positioning of the grinding surface and its axis of rotation, avoiding the formation of an inclined plane during the rotation of the grinding disc and resulting in the processing of an inclined plane of the glass substrate.

[0044] Embodiment 2

[0045] The present invention also proposes a leveling device based on the leveling method of the glass substrate planar grinding equipment in Embodiment 1. Refer to Figure 2 , the leveling device includes a frame 1, on which a leveling main body 2, a positioning movable cylinder 3, two extension members 5 and a reflecting member 6 are provided.

[0046] Further, the positioning movable cylinder 3 is spherically hinged to the frame 1 through a rotating member 31, and the positioning movable cylinder 3 can rotate and move in space. The frame is provided with a positioning member for fixing the position of the positioning movable cylinder 3. The working end of the positioning movable cylinder 3 is fixedly connected to a balance plate 8. Refer to Figure 6 , an induction surface is provided on the positioning movable cylinder 3, and three non-collinear induction members 4 are provided on the induction surface. The induction surface is arranged parallel to the balance plate 8. The extension members 5 are rods perpendicular to the upper and lower grinding disc rotation axes respectively, and the distances between the two extension members 5 and the rotating member 31 are equal. The reflecting member 6 is located at the end of the extension member 5. The induction member 4 is used to emit and receive laser, and the reflecting member 6 is used to reflect laser.

[0047] Refer to Figure 5, the above three sensors 4 are located at positions O1, O2, and O3. The three sensors 4 respectively emit laser light, and after the reflector 6 reflects the laser light, it is received by the sensor 4. The position of the positioning movable cylinder 3 on the frame is adjusted so that when the time for each sensor 4 to receive the corresponding laser light reflected from the upper and lower reflectors 6 is the same, that is, the length of O1A is kept equal to the length of O1B, the length of O2A is kept equal to the length of O2B, and the length of O3A is kept equal to the length of O3B. At this time, the plane where O1, O2, and O3 are located can be made perpendicular to the straight line where AB is located. At this time, the positioning movable cylinder 3 is in the target position, and the balance plate 8 is in the balanced position.

[0048] Reference Figure 3 , the leveling main body 2 includes an upper leveling plate 21, a lower leveling plate 22, and a positioning sleeve 23. An upper contact plate 24 is provided at the bottom of the upper leveling plate 21, and a lower contact plate 25 is provided at the top of the lower leveling plate 22. The upper contact plate 24 and the lower contact plate 25 are fixedly connected. The sides of the upper contact plate 24 and the lower contact plate 25 are respectively slidably connected to the inner wall of the positioning sleeve 23. The inner wall of the positioning sleeve 23 is an arc surface, and the upper contact plate 24 and the lower contact plate 25 can move relative to the positioning sleeve 23 to adjust the positions of the upper contact plate 24 and the lower contact plate 25. The positioning sleeve 23 is provided with positioning members for the upper contact plate 24 and the lower contact plate 25.

[0049] Further, the balance plate 8 is located between the upper contact plate 24 and the lower contact plate 25. The working end of the positioning movable cylinder 3 passes through the positioning sleeve 23 and is fixedly connected to the balance plate 8. The balance plate 8 is located in the middle of the positioning sleeve 23. An upper induction plate 26 is provided inside the upper contact plate 24, and a lower induction plate 27 is provided inside the lower contact plate 25. Reference Figure 7 , the upper induction plate 26 and the lower induction plate 27 are electrode plates with different charge properties, and the balance plate 8 is a metal plate. A capacitor is formed between the upper induction plate 26 and the lower induction plate 27.

[0050] In this embodiment, the upper contact plate 24 is parallel to the leveling surface of the upper leveling plate 21, and the lower contact plate 25 is parallel to the leveling surface of the lower leveling plate 22. When the upper contact plate 24 and the lower contact plate 25 are parallel to the balance plate 8, the capacitance between the upper induction plate 26 and the lower induction plate 27 is C1; when the upper contact plate 24 and the lower contact plate 25 are not parallel to the balance plate 8, the capacitance C1 between the upper induction plate 26 and the lower induction plate 27 changes. At this time, the upper contact plate 24 and the lower contact plate 25 move relative to the positioning sleeve 23 to adjust the positions of the upper induction plate 26 and the lower induction plate 27, and maintain the parallel state between the upper contact plate 24 and the lower contact plate 25 and the balance plate 8, that is, keep the leveling surfaces of the upper leveling plate 21 and the lower leveling plate 22 perpendicular to the rotation axis of the grinding surface during the grinding process, and avoid the influence of vibration on the position state of the upper leveling plate 21 and the lower leveling plate 22 during the leveling process.

[0051] Further, a number of contact rods 7 are respectively arranged on the upper contact plate 24 and the lower contact plate 25. The contact ends 71 of the contact rods corresponding to the upper contact plate 24 point upward, which is the upper contact end, and the upper contact end contacts with the upper grinding plate. The contact ends 71 of the contact rods corresponding to the lower contact plate 25 point downward, which is the lower contact end, and the lower contact end is used to contact with the lower grinding plate. Pressure sensors are arranged at both the upper contact end and the lower contact end.

[0052] Reference Figure 4 , a dial indicator and a stopper 72 are arranged on the above-mentioned contact rod 7. The detection end of the dial indicator is the contact end 71, and the stopper 72 is used to limit the axial movement of the contact end 71. First, based on a flat plate, keep the contact ends of all the contact rods 7 in contact with the flat plate, and zero the dial indicator. At this time, all the contact rods 7 are in the same plane. Then, use the stopper 72 to limit the contact ends of the contact rods 7 to keep the contact ends of the contact rods 7 in the same plane state and in the same plane as the dressing plane of the dressing flat plate.

[0053] Further, synchronization boxes 9 corresponding to the contact rods 7 in terms of quantity and position are arranged on both the upper contact plate 24 and the lower contact plate 25. A synchronization block 91 is arranged inside the synchronization box 9. One end of the synchronization block 91 is fixedly connected to the contact rod 7, and the other end of the synchronization block 91 is connected to the inner wall of the synchronization box 9 through a tension spring 92. The synchronization box 9 is filled with liquid on the side where the tension spring 92 is arranged for the synchronization block 91.

[0054] A pressing cylinder 10 is further arranged on the dressing main body 2 in this embodiment. The space below the synchronization block 91 is respectively communicated with the pressing cylinder 10 through a connecting pipe 11 and a return pipe 12. The pressing cylinder 10 presses the liquid inside the synchronization box 9 through the connecting pipe 11. This pressure makes the tension spring 92 in a stretched state, and the synchronization block 91 is located at the limit position of the synchronization box 9. At this time, the contact ends of the contact rods 7 are in the same plane as the dressing planes of the upper dressing flat plate 21 and the lower dressing flat plate 22.

[0055] Further, the connecting pipe 11 includes an inner pipe 111 and an outer pipe 112 that are movably and sealingly sleeved. A constant-speed pump 113 is arranged at the outer pipe 112. The constant-speed pump 113 makes the liquid inside the pressing cylinder 10 enter the inside of the synchronization box 9 at a certain speed. A one-way valve 121 is arranged on the return pipe 12. The return pipe 12 is used for the liquid inside the synchronization box 9 to flow back into the pressing cylinder 10. The return pipe 12 is communicated with the outer pipe 112 through an overflow pipe 122. An overflow valve is arranged on the overflow pipe 122. The overflow pipe 122 is used for the overflow of the liquid inside the connecting pipe 11.

[0056] Furthermore, a spherical liquid joint is provided at the top of the inner tube 111, and a feed spherical surface 94 concentric and matching with the spherical liquid joint is provided at the bottom of the synchronous box 9. The spherical liquid joint is hinged to the feed spherical surface 94, and the feed spherical surface 94 is movably and hermetically connected to the synchronous box 9 through a movable plate 93. Liquid through holes are provided in both the spherical liquid joint and the feed spherical surface 94. The liquid in the connecting pipe 11 enters the interior of the synchronous box 9 through the liquid through holes of the spherical liquid joint and the feed spherical surface 94 for pressure application.

[0057] In this embodiment, the axis of the pressure application cylinder 10 is parallel to the balance plate 8. When the connecting pipe 11 is perpendicular to the contact plate 22, the flow rate of the liquid through holes of the spherical liquid joint and the feed spherical surface 94 is the largest. When the upper contact plate 24 and the lower contact plate 25 are not parallel to the balance plate 8, the position of the synchronous box 9 is twisted, the length of the connecting pipe 11 changes, the movable plate 93 of the synchronous box 9 moves, the feed spherical surface 94 of the synchronous box 9 rotates relative to the spherical liquid joint, and the flow rate of the liquid through holes of the spherical liquid joint and the feed spherical surface becomes smaller. At this time, the internal hydraulic pressure of the connecting pipe 11 increases, and part of the liquid directly enters the interior of the pressure application cylinder 10 through the overflow pipe 122. The liquid pressure inside the synchronous box 9 is insufficient, the tension spring 92 returns slightly, the synchronous block 91 drives the contact rod 7 to move, and the contact end of the contact rod 7 leaves the plane where the dressing plane of the dressing plate is located. At this time, the contact end of the contact rod 7 is not used for leveling work, avoiding the ineffective leveling measurement of the contact rod 7 when the upper contact plate 24 and the lower contact plate 25 are not parallel to the balance plate 8.

[0058] The leveling device for a glass substrate planar grinding device in this embodiment works in the following steps:

[0059] Step 1: Based on the flat plate, keep the dressing plane of the upper dressing plate 21 and the contact end of the corresponding contact rod 7 in contact with the flat plate, and zero the dial indicator. At this time, all the contact rods 7 are in the same plane. Then, use the limiter 72 to limit the contact end of the contact rod 7 to keep the dressing plane of the upper dressing plate 21 and the contact end of the corresponding contact rod 7 in the same plane state, and complete the leveling work of the dressing plane of the upper dressing plate 21; similarly, the leveling work of the dressing plane of the lower dressing plate 21.

[0060] Step 2: Place the dressing main body 2 between the two grinding discs, and install the extension member 5 at a suitable position on the grinding disc rotating shaft;

[0061] Step 2: The sensing members 4 respectively emit laser light and receive the laser light reflected by the reflecting members 6. Adjust the position of the positioning movable cylinder 3. When the time for each sensing member 4 to receive the corresponding laser light reflected from the upper and lower reflecting members 6 is the same, it is determined that the positioning movable cylinder 3 is in the target position, and at this time, the balance plate 8 is in the balanced position;

[0062] Meanwhile, adjust the positions of the upper contact plate 24 and the lower contact plate 25. The upper contact plate 24 and the lower contact plate 25 are movable relative to the positioning sleeve 23, and keep the upper contact plate 24 and the lower contact plate 25 parallel to the balance plate 8.

[0063] Step 3: Start the grinding equipment. The grinding disc rotates, and the upper flattening plate 21 and the lower flattening plate 22 respectively perform flattening operations on the upper and lower grinding discs; the positioning movable cylinder 3 expands and contracts, so that the flattening main body 2 moves radially on the upper and lower grinding discs, and keeps the overall flattening operation on the upper and lower grinding discs.

[0064] In the above process, when the upper contact plate 24 and the lower contact plate 25 are not parallel to the balance plate 8, the capacitance value C1 between the upper induction plate 26 and the lower induction plate 27 changes. At this time, the upper contact plate 24 and the lower contact plate 25 adjust the positions of the upper induction plate 26 and the lower induction plate 27 by moving relative to the positioning sleeve 23, and keep the parallel state between the upper contact plate 24 and the lower contact plate 25 and the balance plate 8, that is, keep the flattening surfaces of the upper flattening plate 21 and the lower flattening plate 22 perpendicular to the rotation axis of the grinding surface, so as to obtain a grinding disc surface perpendicular to the grinding axis;

[0065] The contact end 71 of the contact rod 7 can be used as a detection piece for the flatness of the grinding disc. When all the contact ends 71 are subjected to the contact pressure applied by the grinding disc, the leveling work of the grinding disc is completed.

[0066] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A leveling device for a planar grinding equipment of a glass substrate, characterized in that, It includes a leveling main body (2), a positioning movable cylinder (3), a contact rod (7) and a balance plate (8). The leveling main body (2) includes an upper leveling plate (21), a lower leveling plate (22) and a positioning sleeve (23). A upper contact plate (24) is arranged at the bottom of the upper leveling plate (21), and a lower contact plate (25) is arranged at the top of the lower leveling plate (22). The sides of the upper contact plate (24) and the lower contact plate (25) are respectively slidably connected to the inner wall of the positioning sleeve (23), and the inner wall of the positioning sleeve (23) is an arc surface; A number of contact rods (7) are respectively arranged on the upper contact plate (24) and the lower contact plate (25). The contact end (71) of the contact rod corresponding to the upper contact plate (24) points upward, and the contact end (71) of the contact rod corresponding to the lower contact plate (25) points downward; The positioning movable cylinder (3) is rotatably connected to the frame (1). The working end of the positioning movable cylinder (3) passes through the positioning sleeve (23) and is fixedly connected to the balance plate (8). The balance plate (8) is located between the upper contact plate (24) and the lower contact plate (25); An upper induction plate (26) is arranged inside the upper contact plate (24), and a lower induction plate (27) is arranged inside the lower contact plate (25). The upper induction plate (26) and the lower induction plate (27) are electrode plates with different charge properties, and the balance plate (8) is a metal plate; Synchronization boxes (9) with the same quantity and positions corresponding to the contact rods (7) are respectively arranged on the upper contact plate (24) and the lower contact plate (25); A synchronization block (91) is arranged inside the synchronization box (9). One end of the synchronization block (91) is fixedly connected to the contact rod (7), and the other end of the synchronization block (91) is connected to the inner wall of the synchronization box (9) through a tension spring (92); A pressure cylinder (10) is further arranged on the leveling main body (2). The space below the synchronization block (91) is respectively communicated with the pressure cylinder (10) through a connecting pipe (11) and a return pipe (12).

2. The leveling device according to claim 1, characterized in that, A dial indicator and a stopper (72) are arranged on the contact rod (7). The detection end of the dial indicator is the contact end (71), and the stopper (72) is used to limit the axial movement of the contact end (71).

3. The leveling device according to claim 2, wherein The connecting pipe (11) includes an inner pipe (111) and an outer pipe (112) that are movably and sealingly sleeved. A constant speed pump (113) is arranged at the outer pipe (112). A spherical liquid joint is arranged at the top of the inner pipe (111). A feed spherical surface (94) with the same center of the sphere and matching with the spherical liquid joint is arranged at the bottom of the synchronization box (9). Liquid through holes are arranged on both the spherical liquid joint and the feed spherical surface (94). The feed spherical surface (94) is movably and sealingly connected to the synchronization box (9) through a movable plate (93); The axis of the pressure cylinder (10) is parallel to the balance plate (8). When the connecting pipe (11) is perpendicular to the upper contact plate (24) or the lower contact plate (25), the liquid through hole flow rate of the spherical liquid joint and the feed spherical surface (94) is the largest; A one-way valve (121) is arranged on the return pipe (12). The return pipe (12) is communicated with the outer pipe (112) through an overflow pipe (122), and an overflow valve is arranged on the overflow pipe (122).

4. The leveling device according to any one of claims 1-3, characterized in that, The positioning movable cylinder (3) is spherically hinged to the frame (1) through a rotating member (31). An induction surface is provided on the positioning movable cylinder (3), and three non-collinear induction members (4) are provided on the induction surface. The induction surface is arranged parallel to the balance plate (8). The leveling device further includes two extension members (5) and a reflecting member (6). The extension members (5) are rods perpendicular to the upper and lower grinding disc rotating shafts respectively. The distances between the two extension members (5) and the rotating member (31) are equal. The reflecting member (6) is located at the end of the extension member (5). The induction member (4) is used for emitting and receiving laser, and the reflecting member (6) is used for reflecting laser.

5. A method for leveling a glass substrate planar grinding device, applied to the leveling device described in claim 1, characterized in that, It includes the following steps: S1: Obtain a balance plate perpendicular to the grinding disc rotating shaft. S2: Obtain a number of contact rods whose contact ends are in the same plane as the dressing surface of the dressing plate. S3: Ensure that the dressing plate and the balance plate are in a parallel state. S4: The dressing plate levels the grinding disc. When all the contact endpoints have the contact pressure applied by the grinding disc, the leveling work of the grinding disc is completed.

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