A porous semi-broken overflow adhesive waste disposal process

By using a multi-hole semi-broken overflow adhesive removal process, which utilizes multiple processing stations and the bonding and punching of release film, the problem of difficult adhesive removal in inner holes has been solved, thereby improving production yield and efficiency.

CN116160757BActive Publication Date: 2025-10-28厦门美塑新质科技有限公司
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Patent Information

Application Number
CN202211661970.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-12-23
Publication Date
2025-10-28
Estimated Expiration
2042-12-23

AI Technical Summary

Technical Problem

In the existing process, it is difficult to remove excess glue when the inner hole is partially cut, which makes it difficult to handle waste and affects production yield and efficiency.

Method used

The process employs a multi-hole semi-cut overflow adhesive removal technology. Through multiple processing stations and the bonding and punching of the release film, the material is first completely cut and then partially cut. The waste material is transferred to another release film, and finally the overflow adhesive is removed by bonding, thus achieving complete removal of overflow adhesive from the inner hole.

Benefits of technology

It effectively eliminates the problem of difficult waste removal due to glue overflow in the inner hole, and improves production yield and efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention provides a process for solving the problem of overflowing adhesive in porous semi-continuous release film. For this type of difficult-to-remove overflowing adhesive, the inner hole is first designed to be completely cut off to absorb the waste. Then, the inner hole is partially cut off by transferring the positioning hole to another release film and punching through the film replacement. This process completely eliminates the problem of difficult-to-remove overflowing adhesive in the inner hole, and improves the yield and production efficiency.
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Description

Technical Field

[0001] This invention relates to a processing technology, and more particularly to a processing technology for adding web to foam. Background Technology

[0002] The existing process results in partial cutting of the inner hole, glue overflow at the edge of the inner hole, difficulty in removing waste material from the inner hole, and direct fuzzing of the glue tape at the edge of the inner hole. Summary of the Invention

[0003] The main technical problem to be solved by the present invention is to provide a process for removing excess glue from porous semi-broken holes, which completely eliminates the problem of difficult waste removal of excess glue from inner holes and improves yield and production efficiency.

[0004] To solve the above-mentioned technical problems, the present invention provides a porous semi-broken overflow adhesive waste disposal process, comprising the following steps:

[0005] 1) The first release film and foam adhesive are conveyed to the first processing station. During the conveying process, there is a preset angle between the release film and the foam adhesive, and the release surface of the release film faces upward. At the first processing station, the release surface of the release film is bonded to the adhesive surface of the foam adhesive, and the paper attached to the foam adhesive is removed.

[0006] 2) At the second processing station, the release surface of the second release film is bonded to the side of the foam adhesive away from the first release film;

[0007] 3) At the third processing station, use a flat knife to punch the second release film surface, completely cut off all holes and remove waste, cut the upper and lower edge knives halfway to the blue film, and remove the surface matte film;

[0008] 3) At the fourth processing station, the release surface of the third release film is bonded to the non-release surface of the second release film, and then the adhesive surface of the protective film is bonded to the non-release surface of the third release film;

[0009] 4) At the fifth processing station, use a flat knife to punch the protective film surface, completely cutting off all holes to remove waste, and partially cutting off the lettering to the first release film;

[0010] 5) At the sixth processing station, flip the strip 180° and remove the first release film, then attach the release surface of the fourth release film to the adhesive surface with foam adhesive.

[0011] 6) At the seventh processing station, use a flat knife to punch the fourth release film surface, cutting all the cut lines halfway to the protective film, removing the outer blue film and glue waste, and removing the surface matte film by adhesive bonding.

[0012] 7) At the eighth processing station, apply transparent tape to the non-release surface of the fourth release film;

[0013] 8) At the ninth processing station, use a flat knife to cut the transparent tape side, cutting halfway down to the protective film, and remove the waste from the top and bottom ends of the fog film; peel off the protective film, attach the white grid paper to the blue film side of the product, and roll up the finished product with the inward side.

[0014] Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0015] This invention provides a process for solving the problem of overflowing adhesive in porous semi-continuous release film. For this type of difficult-to-remove overflowing adhesive, the inner hole is first designed to be completely cut off to absorb the waste. Then, the inner hole is partially cut off by transferring the positioning hole to another release film and punching through the film replacement. This process completely eliminates the problem of difficult-to-remove overflowing adhesive in the inner hole, and improves the yield and production efficiency. Attached Figure Description

[0016] Figures 1-9 This is a schematic diagram of each processing station in a preferred embodiment of the present invention;

[0017] Figure 10 This is a product layering diagram for different stages in a preferred embodiment of the present invention. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0019] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed", "equipped", "sleeved / connected", "connected", etc., should be interpreted broadly. For example, "connection" can be a wall-mounted connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0021] refer to Figures 1-10 This embodiment provides a process for resolving overflow adhesive waste in porous semi-continuous joints, including the following steps:

[0022] 1) The first release film RC-8015L and foam adhesive 5230BRZ are conveyed to the first processing station. During the conveying process, there is a preset angle between the release film and the foam adhesive 5230BRZ, and the release surface of the release film faces upward. At the first processing station, the release surface of the release film is bonded to the adhesive surface of the foam adhesive 5230BRZ, and the paper attached to the foam adhesive 5230BRZ is removed.

[0023] 2) At the second processing station, the release surface of the second release film HFP2505Y-C is bonded to the side of the foam adhesive 5230BRZ away from the first release film RC-8015L;

[0024] 3) At the third processing station, use a flat knife to punch the second release film HFP2505Y-C surface, completely cut all holes to remove waste, and cut the upper and lower edge knives halfway to the blue film to remove the surface matte film;

[0025] 3) At the fourth processing station, the release surface of the third release film PTD075L4050 is bonded to the non-release surface of the second release film HFP2505Y-C, and then the adhesive surface of the protective film 506T is bonded to the non-release surface of the third release film PTD075L4050.

[0026] 4) At the fifth processing station, use a flat knife to punch the 506T side of the protective film, completely cut off all holes to remove waste, and partially cut off the lettering to the first release film RC-8015L;

[0027] 5) At the sixth processing station, flip the strip 180° and remove the first release film RC-8015L. Then, attach the release surface of the fourth release film HFP2505Y-C to the adhesive surface of the foam adhesive 5230BRZ.

[0028] 6) At the seventh processing station, use a flat knife to punch the fourth release film HFP2505Y-C side, cutting all the cut lines halfway down to the protective film 506T, removing the outer blue film and adhesive waste, and removing the surface matte film by adhesive bonding.

[0029] 7) At the eighth processing station, apply transparent tape to the non-release surface of the fourth release film HFP2505Y-C;

[0030] 8) At the ninth processing station, use a flat knife to cut the transparent tape side, cutting halfway down to the protective film 506T, and remove the waste from the top and bottom ends of the fog film; peel off the protective film 506T, attach the white grid paper to the blue film side of the product, and roll up the finished product with the inward side.

[0031] The above description is merely a preferred embodiment of the present invention, but the design concept of the present invention is not limited thereto. Any non-substantial modifications made to the present invention by those skilled in the art within the scope of the technology disclosed in the present invention using this concept shall be deemed as an infringement of the protection scope of the present invention.

Claims

1. A process for handling overflow adhesive waste in porous semi-broken structures, characterized in that, Includes the following steps: 1) The first release film and foam adhesive are conveyed to the first processing station. During the conveying process, there is a preset angle between the release film and the foam adhesive, and the release surface of the release film faces upward. At the first processing station, the release surface of the release film is bonded to the adhesive surface of the foam adhesive, and the paper attached to the foam adhesive is removed. 2) At the second processing station, the release surface of the second release film is bonded to the side of the foam adhesive away from the first release film; 3) At the third processing station, use a flat knife to punch the second release film surface, completely cut off all holes to remove waste, and cut the upper and lower edge knives halfway to the blue film to remove the surface matte film; 3) At the fourth processing station, the release surface of the third release film is bonded to the non-release surface of the second release film, and then the adhesive surface of the protective film is bonded to the non-release surface of the third release film; 4) At the fifth processing station, use a flat knife to punch the protective film surface, completely cutting off all holes to remove waste, and cutting halfway down to the first release film; 5) At the sixth processing station, flip the strip 180° and remove the first release film, then attach the release surface of the fourth release film to the adhesive surface of the foam adhesive. 6) At the seventh processing station, use a flat knife to punch the fourth release film surface, cutting all the cut lines halfway to the protective film, removing the outer blue film and glue waste, and removing the surface matte film by adhesive bonding. 7) At the eighth processing station, apply transparent tape to the non-release surface of the fourth release film; 8) At the ninth processing station, use a flat knife to cut the transparent tape side, cutting halfway down to the protective film, and remove the waste from the top and bottom ends of the fog film; peel off the protective film, attach the white grid paper to the blue film side of the product, and roll up the finished product with the inward side.

Citation Information

Patent Citations

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