Wafer detection module and method

Abstract

The present invention discloses a wafer detection module, comprising: a wafer box carrying platform, provided with a plurality of wafer box carrying positions with a hollow center for carrying a wafer box; a wafer detection device, comprising: a receiving integrated component and a light source integrated component, the receiving integrated component and the light source integrated component being respectively located at the bottom of the wafer box carrying platform and on both sides of the corresponding hollow positions; wherein the receiving integrated component is lifted and moved as a whole and rotated and swung to receive and redirect the transmitted light, the light source integrated component is lifted and moved as a whole and rotated and swung to integrate the light transmitted by the receiving integrated component, and optically scan the wafers in the wafer box through the hollow positions. The present invention also provides a wafer detection method. The wafer detection module and method provided by the present invention can detect whether the three-dimensional position or movement of the wafer box and the wafer is offset, and whether the wafer is damaged.

Description

Technical Field

[0001] The present invention relates to the field of wafer transmission, and in particular to a wafer detection module and method. Background Art

[0002] Semiconductor wafer wet tank cleaning equipment uses wafer transfer to move wafers or cassettes throughout the entire process, placing particular emphasis on achieving efficient wafer transfer within a specific timeframe. During wafer transfer, the wafers within the cassette must be maintained to ensure coordinated transfer and controllable operation. Damage to the cassette caused by various external forces, such as shaking, must be avoided. Therefore, cassette and wafer measurement, as well as cassette position detection, are essential during the transfer process.

[0003] The wafer has to adjust its direction during the transmission process. The wafer is relatively stable in the process of linear transmission. However, the speed of the wafer is not stable during the turning process, and it is easy to vibrate. Since the wafer is relatively brittle and there are multiple layers of wafers in the wafer box, the wafer is prone to oscillation during transmission, which makes the wafer prone to breakage and tilting. In the existing technology, support feet are often set at the supporting position of the wafer box, and pressure sensors are set in the support feet to detect the position and status of the wafer box. It is difficult to detect the status of the wafer in the wafer box in a timely manner. Summary of the Invention

[0004] In order to timely detect the status of a wafer box and wafers during the transmission process, the present invention provides a wafer detection module.

[0005] In a first aspect, the present invention provides a wafer detection module that adopts the following technical solutions:

[0006] A wafer detection module, comprising:

[0007] The wafer box carrying platform is provided with a plurality of wafer box carrying positions with a hollow center for carrying the wafer boxes;

[0008] The wafer detection device includes: a receiving integrated component and a light source integrated component, wherein the receiving integrated component and the light source integrated component are respectively located on both sides of the bottom of the wafer box carrying platform corresponding to the hollow position;

[0009] Among them, the receiving integrated component is lifted and moved as a whole and rotated and swung to receive and turn the transmitted light, and the light source integrated component is lifted and moved as a whole and rotated and swung to integrate the light transmitted by the receiving integrated component, and optically scan the wafers in the wafer box through the hollow position.

[0010] Optionally, the wafer detection device further includes a first motion component to drive the receiving integrated component to move up and down and rotate and swing as a whole;

[0011] The first motion component includes:

[0012] The first micro cylinder provides horizontal and steering motion power with a single cylinder;

[0013] a first micro damper, stabilizing the thrust of the micro cylinder;

[0014] The first steering gear structure is connected to the first micro cylinder and is used to perform an angular rotation action on the receiving integrated component.

[0015] Optionally, the light source integrated assembly includes: a light guide that can be rotated at a slight angle, a grating and a filter, and a shutter and an aperture structure, wherein the light guide is arranged at a direct position of the incident light, the grating and the filter are arranged perpendicular to the position of the light guide, and the shutter and the aperture structure are located above the grating and the filter, and correspond to the hollow position; after the light is transmitted through the light guide, it is filtered by the grating and the filter, and then the wafer is scanned in an arc shape through the shutter and the aperture structure.

[0016] Optionally, the light source integrated assembly includes a second motion assembly to drive the light source integrated assembly to move up and down and rotate and swing as a whole;

[0017] The second motion component includes:

[0018] The second micro cylinder provides the module with horizontal and steering movement power with a single cylinder;

[0019] a second micro damper for stabilizing the thrust of the micro cylinder;

[0020] A second steering gear structure is connected to a second micro cylinder and is used to perform an angular rotation action on the receiver integrated device;

[0021] The micro-magnetic brushless cylinder drives the light guide to rotate at a tiny angle by moving back and forth quickly.

[0022] Optionally, the steering angles of the first steering gear structure and the second steering gear structure are both 30 degrees, 45 degrees, 60 degrees, 75 degrees or 90 degrees.

[0023] Optionally, the receiving integrated component includes a first meniscus negative lens, a biconvex positive lens and a second meniscus negative lens arranged in sequence along the incident direction of the light.

[0024] Optionally, the wafer detection module further includes a spectrometer component for splitting the light before the receiving integrated component receives the light.

[0025] Optionally, the receiving integrated component and the light source integrated component are symmetrically distributed at a certain angle on both sides of the hollow position, and the light splitting component is arranged on one side of the light source integrated component.

[0026] Optionally, the wafer detection module also includes a detection integrated component for detecting light after the wafer is scanned and imaging the wafers in the wafer box.

[0027] Optionally, the wafer detection module further includes a wafer box positioning block, which is arranged around the hollow position on the wafer box carrying platform and is used to position the wafer box.

[0028] Optionally, a detection sensor is provided on the wafer box positioning block for detecting whether the wafer box is placed on the positioning feet of the wafer box positioning block.

[0029] Optionally, the wafer detection module is configured in the incoming and outgoing areas of the trough-type wet process equipment.

[0030] In a second aspect, the present invention provides a wafer detection method using the following technical solutions:

[0031] S1, the detection sensor detects that the wafer box is placed on the wafer box positioning block;

[0032] S2, the light source continuously emits light to the wafer box carrying platform;

[0033] S3, the receiving integrated component receives and turns the light for transmission;

[0034] S4. The light source integrated component integrates the light transmitted by the receiving integrated component and optically scans the wafers in the wafer box through the hollow position of the wafer box carrying platform.

[0035] Optionally, the receiving integrated component is lifted and moved as a whole and rotated and swung to receive and turn the light for transmission;

[0036] The light source integrated component is lifted, moved, rotated and swung as a whole to integrate the light transmitted by the receiving integrated component and optically scan the wafers in the wafer box through the hollow position.

[0037] Compared with the prior art, the present invention has the following beneficial effects:

[0038] The receiving integrated component and the light source integrated component in the present invention can be lifted, moved, rotated and swung as a whole to realize optical scanning of the wafers in the wafer box, and can directly detect the position, distance, offset and misalignment of the wafer box and the batch of wafers during the transfer process. Furthermore, the wafer detection module is integrated into the trough-type wet process equipment, which can greatly reduce the use of infrared optical sensors and even directly eliminate the use of multiple infrared optical sensors. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is a structural diagram of a wafer detection module of the present invention;

[0040] Figure 2 A top view of a wafer box according to the present invention;

[0041] Figure 3 This is a diagram showing the positional relationship between the wafer box and the wafer box positioning block under normal circumstances;

[0042] Figure 4 This is a diagram showing the position relationship between the wafer box and the wafer box positioning block under abnormal conditions of the present invention;

[0043] Figure 5 A schematic diagram of a wafer detection module of the present invention moving toward a side away from a wafer box;

[0044] Figure 6 A schematic diagram of the rotation of a light source integrated component and a receiving integrated component in a wafer detection module of the present invention;

[0045] Figure 7 This is a structural diagram of a receiving integrated component in a wafer detection module of the present invention;

[0046] Figure 8 This is a structural diagram of a light source integrated component in a wafer detection module of the present invention;

[0047] Figure 9 A diagram of a light path detected in a wafer detection module of the present invention;

[0048] Figure 10 This is a detection image of a wafer in a normal state in a wafer detection module of the present invention;

[0049] Figure 11 This is a detection diagram of a wafer in an abnormal state in a wafer detection module of the present invention.

[0050] In the figure: 1. Wafer box carrying platform; 2. Wafer box carrying position; 3. Wafer detection device; 31. Receiving integrated component; 311. First meniscus negative lens; 312. Biconvex positive lens; 313. Second meniscus negative lens; 32. Light source integrated component; 321. Light guide; 322. Grating and filter; 323. Shutter and aperture structure; 4. Spectral component; 5. Wafer box positioning block; 6. Wafer box; 7. Wafer. DETAILED DESCRIPTION

[0051] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0052] During the transfer process of the wafer 7 or the wafer box 6, it is necessary to keep the wafer box 6 in the wafer box 6 to ensure the coordination of the transfer process and the control of the entire process. It is necessary to avoid various external forces that may damage the wafer box 6 due to shaking. Therefore, it is necessary to measure the wafer box 6 and the wafer 7 during the transfer process and detect the position of the wafer box 6.

[0053] In conventional designs, multiple infrared optical sensors are configured on the mobile module or the platform that connects the mobile wafer box 6 for detection. Among them, the infrared optical sensor is usually set on the transfer platform and uses the wafer box 6 foot to sense. It can only use the light source to block to produce a detection effect. It is mainly used to determine whether the wafer box 6 has reached the positioning point during the transfer process, such as Figure 3 But when the wafer box 6 feet tilt, as shown Figure 4 As shown, the infrared optical sensor can only detect that the wafer box 6 reaches the positioning point, but cannot detect that the wafer box 6 is tilted (the wafer 7 is tilted).

[0054] Furthermore, multiple infrared optical sensors are mounted on the conveyor platform to facilitate multi-directional transfer of wafer cassettes 6. This sensor configuration typically requires specialized brackets. These sensors can only detect whether a target object, such as a wafer 7 or wafer cassette 6, is at a designated location or within the sensor's transmission and reception paths. This approach, in turn, limits the space and configuration of the infeed module.

[0055] Furthermore, for the configuration of a composite sensor for counting wafers 7 (in batches or single entry), if there are 10 wafers 7, 10 sensors are required. Then, this integrated sensor combination is integrated into a carrier, and when the wafer 7 passes by the sensor, it can be detected accordingly. Usually, this method requires combining a lifting device (such as an electric cylinder or a pneumatic cylinder) to directly mount the composite sensor for counting wafers 7 (in batches or single entry) on it, so that it moves up and down to detect and count the wafers 7.

[0056] As can be seen from the aforementioned types, infrared optical sensor detection methods are widely used to detect the specific position of wafers 7 or wafer cassettes 6. However, these methods only directly detect the position, which is a common single-point position detection method. They cannot fully and timely detect the status of wafer cassettes 6 and wafers 7 during transportation. To address these difficulties, the present invention provides an innovative wafer detection module.

[0057] Reference Figures 1 to 11 The present invention provides an embodiment of a wafer detection module, wherein the wafer detection module comprises:

[0058] The wafer box carrying platform 1 is provided with a plurality of wafer box carrying positions 2 with a hollow center, and the wafer box carrying positions 2 are used to carry the wafer boxes 6;

[0059] The wafer detection device 3 includes a receiving integrated component 31 and a light source integrated component 32 . The receiving integrated component 31 and the light source integrated component 32 are respectively located at the bottom of the wafer box carrying platform 1 and on both sides of the corresponding hollow position.

[0060] The receiving integrated component 31 is lifted, moved, rotated and swung as a whole to receive and turn the transmitted light, and the light source integrated component 32 is lifted, moved, rotated and swung as a whole to integrate the light transmitted by the receiving integrated component 31, and optically scan the wafer 7 in the wafer box 6 through the hollow position to receive imaging information at different angles and positions.

[0061] Specifically, the wafer detection device 3 includes a first motion component to drive the receiving integrated component 31 to move up and down and rotate and swing as a whole.

[0062] The first motion component includes:

[0063] The first micro cylinder provides horizontal and steering motion power with a single cylinder;

[0064] The first micro damper stabilizes the thrust of the micro cylinder;

[0065] The first steering gear structure is connected to the first micro cylinder and is used to rotate the receiving integrated component 31 . The receiving integrated component 31 is connected to the first steering gear structure.

[0066] Exemplarily, the first micro-cylinder is a brushless micro-magnetic flow cylinder that rapidly moves back and forth, driving the receiving assembly 31 to rotate slightly. The first diverter structure can be configured to rotate at angles of 30, 45, 60, 75, or 90 degrees. The first micro-cylinder and the first diverter structure can drive the entire receiving assembly 31 in both vertical and horizontal motions, enabling scanning and detection of wafers 7 at various positions and angles within the wafer cassette 6.

[0067] Correspondingly, the light source integrated assembly 32 includes a second motion assembly to drive the light source integrated assembly 32 to move up and down and rotate and swing as a whole.

[0068] The second motion component includes:

[0069] The second micro cylinder provides the module with horizontal and steering movement power with a single cylinder;

[0070] a second micro damper for stabilizing the thrust of the micro cylinder;

[0071] The second steering gear structure is connected to the second micro cylinder and is used to rotate the receiver integrated device at an angle.

[0072] Exemplarily, the second micro-cylinder is a brushless micro-magnetic cylinder that rapidly moves back and forth, causing the light guide 321 to rotate slightly. The second diverter structure can be configured to rotate at angles of 30, 45, 60, 75, or 90 degrees. The interaction between the second micro-cylinder and the second diverter structure drives the overall lift, movement, and rotation of the light source assembly 32, receiving light and detecting wafers 7 within the wafer cassette 6.

[0073] Further, such as Figure 7 As shown, the receiving integrated component 31 includes a first meniscus negative lens 311, a double convex positive lens 312 and a second meniscus negative lens 313 which are arranged in sequence along the incident direction of the light. The receiving integrated component 31 receives the light from the light source integrated component 32. The first meniscus negative lens 311, the double convex positive lens 312 and the second meniscus negative lens 313 receive and converge the light and direct it toward the light source integrated component 32, thereby improving the scanning and imaging effects of the wafer 7.

[0074] like Figure 8 As shown, the light source integrated assembly 32 includes a light guide 321 capable of slight angular rotation, a grating and filter 322, and a shutter and aperture structure 323. The light guide 321 is positioned directly in the direction of incident light. It can move and rotate, guiding light through the grating and filter 322, which then receive the light. The grating and filter 322 are positioned perpendicular to the light guide 321, filtering and modulating the light to improve imaging quality while also guiding the light.

[0075] The grating and filter 322 can rotate and translate to adjust the incident angle and position of the light, performing an arc scan on the wafer 7, thereby enabling scanning and detection of different positions on the wafer 7. The shutter and aperture structure 323 is located above the grating and filter 322 and corresponds to the hollowed-out position. The arc scanning area of ​​the light is parallel to the wafer 7, and the light finally passes through the shutter and aperture structure 322 to scan and detect the wafer 7.

[0076] After the light is transmitted through the light guide 321 , it is filtered and transmitted again through the grating and filter 322 , and finally passes through the shutter and aperture structure 323 to perform arc scanning on the wafer 7 , performing a full-scale scanning of the imaging information of the wafer 7 in the wafer box 6 .

[0077] Figure 10 and Figure 11 The optical path for wafer detection is shown from the side. Figure 10 The wafer 7 in the wafer box 6 is placed in a normal state. Figure 11 The wafers 7 in the wafer box 6 are placed in an abnormal (tilted) state, and the wafers 7 in the wafer box 6 are scanned to achieve effective detection of the wafers 7.

[0078] The wafer detection module provided in this example also includes a spectrometer component 4, which is used to split and transmit light before the receiving integrated component 31 receives the light. The receiving integrated component 31 and the light source integrated component 32 are symmetrically distributed on both sides of the hollow position at a certain angle, and the spectrometer component 4 is arranged on the side of the light source integrated component 32 close to the light source. Figure 9 A light path diagram for wafer scanning is shown, such as Figure 9 As shown, the receiving integrated component 31 and the light source integrated component 32 are distributed on both sides of the hollow position, and the light splitting component 4 is set on one side of the light source integrated component 32. After the light split by the light splitting component 4 is transmitted through the receiving integrated component 31 and the light source integrated component 32, the wafer 7 in the wafer box 6 is scanned through the hollow position. It should be noted that Figure 9 This is only the optical path design in one embodiment of the present invention. In other embodiments of the present invention, other optical path designs can also be used. It is only necessary to conduct light under the cooperation of the receiving integrated component 31 and the light source integrated component 32 of the present invention that can be lifted, moved, rotated and swung as a whole to achieve scanning and detection of the wafer 7. In addition, the optical path design of the receiving integrated component 31 and the light source integrated component that can be lifted, moved, rotated and swung as a whole can be adopted as follows: Figure 7 He Ru Figure 8 The optical component design in the embodiment realizes the light path direction, and other methods (such as Figure 9 )Optical component design.

[0079] Furthermore, the wafer detection module also includes a detection integrated component for detecting the light after the wafer 7 is scanned and imaging the wafer 7 in the wafer box 6.

[0080] The wafer detection module also includes a wafer box positioning block 5, such as Figure 1 and Figure 2 As shown, the wafer cassette 6 is positioned around the hollowed-out portion of the wafer cassette support platform 1. Detection sensors are provided on the wafer cassette positioning block 5 to detect whether the wafer cassette 6 is placed on the positioning feet of the wafer cassette positioning block 5. The wafer cassette positioning block 5 performs preliminary detection on the wafer cassette 6.

[0081] For example, the wafer detection module provided by the present invention can be directly configured in the loading and unloading areas (LD / ULD) of the trough-type wet process equipment. By improving the structural design of the wafer loading and unloading areas, a high-efficiency wafer transmission system is constructed to effectively transfer batch wafers 7 in the wafer box 6. While meeting the high wafer 7 throughput, it provides an effective solution to the safety issues of wafer 7 transmission and detection improvements.

[0082] Accordingly, the present invention also provides a wafer detection method comprising:

[0083] S1, the detection sensor detects that the wafer box 6 is placed on the wafer box positioning block 5;

[0084] S2, the light source continuously emits light to the wafer box carrying platform 1;

[0085] S3, the receiving integrated component 31 receives and turns the light for transmission;

[0086] S4 , the light source integrated component 32 integrates the light transmitted by the receiving integrated component 31 , and optically scans the wafers 7 in the wafer box 6 through the hollowed-out position of the wafer box carrying platform 1 .

[0087] The receiving integrated component 31 moves up and down and rotates and swings as a whole to receive and turn the transmitted light;

[0088] The light source integrated component 32 is lifted, moved, rotated and swung as a whole to integrate the light transmitted by the receiving integrated component 31 and optically scan the wafers 7 in the wafer box 6 through the hollow position.

[0089] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A wafer detection module, characterized in that: include: A wafer box carrying platform (1) is provided with a plurality of wafer box carrying positions (2) with hollowed-out centers for carrying wafer boxes; A wafer detection device (3) comprises: a receiving integrated component (31) and a light source integrated component (32), wherein the receiving integrated component (31) and the light source integrated component (32) are respectively located at the bottom of the wafer box carrying platform (1) and on both sides of the corresponding hollow position; The receiving integrated component (31) is moved up and down as a whole and rotated and swung to receive and turn the transmitted light, and the light source integrated component (32) is moved up and down as a whole and rotated and swung to integrate the light transmitted by the receiving integrated component (31) and optically scan the wafers in the wafer box through the hollow position; The light source integrated component (32) includes: a light guide (321) capable of micro-angle rotation, a grating and a filter (322), and a shutter and an aperture structure (323), wherein the light guide (321) is arranged at a direct position of the incident light, the grating and the filter (322) are arranged perpendicular to the position of the light guide (321), and the shutter and the aperture structure (323) are located above the grating and the filter (322) and corresponding to the hollow position; after the light is transmitted through the light guide (321), it is filtered by the grating and the filter (322), and then the wafer is arc-scanned through the shutter and the aperture structure (323); The receiving integrated component (31) comprises a first meniscus negative lens (311), a biconvex positive lens (312), and a second meniscus negative lens (313) which are sequentially arranged along the incident direction of light. It also includes a detection integrated component for detecting the light after the wafer is scanned and imaging the wafers in the wafer box.

2. The wafer detection module according to claim 1, wherein: The wafer detection device (3) further includes a first motion component to drive the receiving integrated component (31) to move upward and downward and rotate and swing as a whole; The first motion component includes: The first micro cylinder provides horizontal and steering motion power with a single cylinder; a first micro damper, stabilizing the thrust of the micro cylinder; The first steering gear structure is connected to the first micro cylinder and is used to perform an angular rotation action on the receiving integrated component (31).

3. The wafer detection module according to claim 2, wherein: The light source integrated component (32) includes a second motion component to drive the light source integrated component (32) to move upward and downward and rotate and swing as a whole; The second motion component includes: The second micro cylinder provides the module with horizontal and steering movement power with a single cylinder; a second micro damper for stabilizing the thrust of the micro cylinder; A second steering gear structure is connected to a second micro cylinder and is used to perform an angular rotation action on the receiver integrated device; The micro magnetic flow brushless cylinder drives the light guide plate (321) to rotate at a micro angle by rapidly moving back and forth.

4. The wafer detection module according to claim 3, characterized in that: The steering angles of the first steering gear structure and the second steering gear structure both include 30 degrees, 45 degrees, 60 degrees, 75 degrees or 90 degrees.

5. The wafer detection module according to claim 1, wherein: It also includes a light splitting component (4) for splitting the light before the receiving integrated component (31) receives the light.

6. The wafer detection module according to claim 5, characterized in that: The receiving integrated component (31) and the light source integrated component (32) are symmetrically distributed at a certain angle on both sides of the hollow position, and the light splitting component (4) is arranged on one side of the light source integrated component (32).

7. The wafer detection module according to claim 1, wherein: Also includes: Wafer box positioning blocks (5) are arranged around the hollowed-out positions on the wafer box carrying platform (1) and are used to position the wafer box.

8. The wafer detection module according to claim 7, characterized in that: The wafer box positioning block (5) is provided with a detection sensor for detecting whether the wafer box is placed on the positioning foot of the wafer box positioning block (5).

9. The wafer detection module according to claim 1, wherein: The wafer detection module is configured in the inlet and outlet areas of the trough-type wet process equipment.

10. A wafer detection method, used in a wafer detection module according to any one of claims 1 to 9, characterized in that: include: S1, the detection sensor detects that the wafer box is placed on the wafer box positioning block (5); S2, the light source continuously emits light toward the wafer box carrying platform (1); S3, a receiving integrated component (31) receives and turns the light for transmission; S4. The light source integrated component (32) integrates the light transmitted by the receiving integrated component (31), and optically scans the wafers in the wafer box through the hollowed-out position of the wafer box carrying platform (1).

11. The wafer detection method according to claim 10, wherein: The receiving integrated component (31) is lifted and moved as a whole and rotated and swung to receive and turn the light for transmission; The light source integrated component (32) is lifted, moved, rotated and swung as a whole to integrate the light transmitted by the receiving integrated component (31) and optically scan the wafers in the wafer box through the hollowed-out positions.

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