A pre-alignment device for multi-specification gap wafers

Abstract

This invention provides a pre-alignment device for notched wafers of various sizes, including a suction cup and an alignment device. One side of the suction cup is an adsorption surface, on which concentric first and second adsorption grooves are provided. The alignment device is fixedly installed on the other side of the suction cup. The alignment device includes a support plate, a rocker plate, an upper plate, and a lower plate. The support plate and the rocker plate are respectively hinged to the two ends of the upper and lower plates, forming a four-bar linkage between the upper and lower plates. A compression spring is provided between the lower plate and the support plate. An adjusting screw is provided on the support plate, passing through the support plate and abutting against the lower plate. The lower plate rotates around the hinge point of the support plate and the rocker plate by the screwing in. A first cam bearing follower is provided on the support plate, and a second cam bearing follower is provided on the rocker plate. The top of the first cam bearing follower is lower than the adsorption surface, and the top of the second cam bearing follower is higher than the adsorption surface. This invention can achieve pre-alignment of notched wafers of different sizes, saving time and economic costs.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of wafer processing, in particular to a pre-alignment device for multi-specification notch wafers. BACKGROUND

[0002] The pre-alignment function is applied in photolithography and other semiconductor devices. As a notch wafer pre-alignment device, it must be efficient, reliable, and accurate. Existing devices can only pre-align single size specification notch wafers. Due to the needs of scientific research users, scientific research often requires frequent replacement of different specification size notch wafers for product research. Current photolithography equipment mostly only pre-aligns single specification notch wafers, and cannot meet the needs of "one machine with multiple uses". Since photolithography machines are expensive, replacing equipment requires a large amount of capital and time, which greatly increases production and operation costs. Therefore, how to solve the above technical problems has become the research direction of technical personnel in this field. SUMMARY

[0003] The present application aims to overcome the shortcomings of the prior art and provide a pre-alignment device for multi-specification notch wafers to solve the technical problems raised in the background.

[0004] The purpose of the present application is achieved by the following technical solutions:

[0005] A pre-alignment device for multi-specification notch wafers, comprising a chuck and an alignment device, one side of the chuck being an adsorption surface, the adsorption surface being provided with concentric first and second adsorption grooves, the alignment device being fixedly installed on the other side of the chuck, the alignment device comprising a support plate, a hinged plate, an upper plate, and a lower plate, the support plate and the hinged plate being respectively hinged at both ends of the upper plate and the lower plate and forming a four-bar linkage structure between the upper plate and the lower plate, a compression spring being provided between the lower plate and the support plate, an adjusting jackscrew being provided on the support plate, the adjusting jackscrew penetrating through the support plate and abutting against the lower plate, the lower plate being rotatable about the hinge joints of the support plate and the hinged plate through the rotation of the adjusting jackscrew, a second cam bearing follower being provided on the support plate, and a first cam bearing follower being provided on the hinged plate, the top of the first cam bearing follower being lower than the adsorption surface, and the top of the second cam bearing follower being higher than the adsorption surface.

[0006] In the above summary, further, one end of the lower plate is provided with an abutting portion, and the adjusting jackscrew penetrates through the support plate and abuts against the surface of the abutting portion.

[0007] In the above summary, further, the support plate is provided with a mounting portion, the first cam bearing follower is mounted on the mounting portion, the mounting portion is further provided with a first mounting hole, the lower plate is provided with a second mounting hole, the compression spring is sleeved between the lower plate and the support plate through the first mounting hole and the second mounting hole, and the upper plate is provided with a groove matched with the mounting portion.

[0008] Further, the upper plate is provided with first hinge parts at both ends, the lower plate is provided with second hinge parts at both ends, and the support plate and the cantilevered plate are hingedly connected to both ends of the upper plate and the lower plate through the first hinge parts, the second hinge parts and the pin.

[0009] Further, the chuck is provided with a mounting groove, the alignment device is mounted in the mounting groove, the mounting groove is further provided with a first through hole and a second through hole, a first cam follower is arranged in the first through hole, and a second cam follower is arranged in the second through hole.

[0010] Further, the surfaces of the first adsorption groove and the second adsorption groove are provided with convex particles.

[0011] Further, the chuck is further provided with a fixing hole for mounting the chuck.

[0012] The present application has the following beneficial effects:

[0013] The present application can realize pre-alignment of notched wafers of different sizes, saves time and economic cost, and realizes the function of "one machine for multiple uses". BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 Fig. 1 is a structural schematic diagram of the present application;

[0015] Figure 2 Fig. 2 is another structural schematic diagram of the present application;

[0016] Figure 3 Fig. 3 is a connection schematic diagram between the chuck and the alignment device of the present application;

[0017] Figure 4 Fig. 4 is a structural schematic diagram of the alignment device of the present application;

[0018] Figure 5 Fig. 5 is an exploded schematic diagram of the alignment device of the present application;

[0019] Figure 6 Fig. 6 is another exploded schematic diagram of the alignment device of the present application;

[0020] Figure 7 Fig. 7 is a use state diagram of the alignment device of the present application;

[0021] Figure 8 Fig. 8 is a schematic diagram of the present application and a small wafer mounting structure;

[0022] Figure 9 Fig. 9 is another use state diagram of the alignment device of the present application;

[0023] Figure 10Figure 1 is a schematic diagram of a large wafer mounting structure according to the present application.

[0024] In the figure, 1 is a suction cup, 1.1 is a first suction groove, 1.2 is a second suction groove, 1.3 is a mounting groove, 1.4 is a first through hole, 1.5 is a second through hole, 1.6 is a convex particle, 1.7 is a fixing hole, 2 is an alignment device, 2.1 is a support plate, 2.11 is a mounting portion, 2.12 is a first mounting hole, 2.2 is a flap, 2.3 is an upper plate, 2.31 is a groove, 2.32 is a first hinge portion, 2.4 is a lower plate, 2.41 is an abutting portion, 2.42 is a second hinge portion, 2.43 is a second mounting hole, 2.5 is a compression spring, 2.6 is an adjusting jackscrew, 2.7 is a first cam bearing follower, 2.8 is a second cam bearing follower, 2.9 is a pin, 3 is a small wafer, and 4 is a large wafer. DETAILED DESCRIPTION

[0025] The present application is described below by way of specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present application from the disclosure. The present application can also be implemented or applied by different specific embodiments, and various modifications or changes can be made to the details in the specification without departing from the spirit of the present application. It should be noted that the following examples and features in the examples can be combined with each other without conflict.

[0026] It should be noted that the drawings provided in the following examples only schematically illustrate the basic concept of the present application, and only the components related to the present application are shown in the drawings, not the number, shape and size of the components when actually implemented. The actual implementation of each component can be a random change, and the component layout pattern can be more complex.

[0027] Embodiment:

[0028] A pre-alignment device for multi-specification gap wafers is described below with reference to the accompanying drawings, in which Figure 1 -FIG. 1 is a schematic diagram of a large wafer mounting structure according to the present application. Figure 3 As shown, it comprises a suction cup 1 and an alignment device 2, the suction cup 1 is provided with a mounting groove 1.3 and a fixing hole 1.7 for mounting the suction cup 1, the alignment device 2 is mounted in the mounting groove 1.3, one side of the suction cup 1 is a suction surface, the suction surface is provided with a concentric first suction groove 1.1 and a second suction groove 1.2, the surfaces of the first suction groove 1.1 and the second suction groove 1.2 are provided with convex particles 1.6, the alignment device 2 is fixedly mounted on the other side of the suction cup 1, and the alignment device 2 is provided with a first through hole 1.4, a second through hole 1.5, a first cam bearing follower 2.7, a second cam bearing follower 2.8, a pin 2.9, a compression spring 2.5, a support plate 2.1, a mounting portion 2.11, a first mounting hole 2.12, a flap 2.2, an upper plate 2.3, a groove 2.31, a first hinge portion 2.32, a lower plate 2.4, an abutting portion 2.41, a second hinge portion 2.42, a second mounting hole 2.43, an adjusting jackscrew 2.6, and a second mounting hole 2.43. Figure 4 -FIG. 1 is a schematic diagram of a large wafer mounting structure according to the present application. Figure 6As shown, the alignment device 2 comprises a support plate 2.1, a rocker plate 2.2, an upper plate 2.3 and a lower plate 2.4, the support plate 2.1 and the rocker plate 2.2 are respectively hinged at two ends of the upper plate 2.3 and the lower plate 2.4 and form a four-bar linkage structure between the upper plate 2.3 and the lower plate 2.4, specifically, two ends of the upper plate 2.3 are respectively provided with first hinge parts 2.32, two ends of the lower plate 2.4 are provided with second hinge parts 2.42, the support plate 2.1 and the rocker plate 2.2 are hinged at two ends of the upper plate 2.3 and the lower plate 2.4 through the first hinge parts 2.32, the second hinge parts 2.42 and the pin 2.9.

[0029] A compression spring 2.5 is arranged between the lower plate 2.4 and the support plate 2.1, the mounting part 2.11 is further provided with a first mounting hole 2.12, the lower plate 2.4 is provided with a second mounting hole 2.43, the compression spring 2.5 is sleeved between the lower plate 2.4 and the support plate 2.1 through the first mounting hole 2.12 and the second mounting hole 2.43, the support plate 2.1 is provided with an adjusting jackscrew 2.6, one end of the lower plate 2.4 is provided with an abutting part 2.41, the adjusting jackscrew 2.6 passes through the support plate 2.1 and abuts against the surface of the abutting part 2.41 of the lower plate 2.4, the lower plate 2.4 rotates around the hinge part of the support plate 2.1 and the rocker plate 2.2 through the screwing of the adjusting jackscrew 2.6.

[0030] The mounting part 2.11 of the support plate 2.1 is provided with a second cam bearing follower 2.8, the upper plate 2.3 is provided with a groove 2.31 matched with the mounting part 2.12, the rocker plate 2.2 is provided with a first cam bearing follower 2.7, the mounting groove 1.3 is further provided with a first through hole 1.4 and a second through hole 1.5, the first cam bearing follower 2.7 is arranged in the first through hole 1.4, the second cam bearing follower 2.8 is arranged in the second through hole 1.5, the top of the first cam bearing follower 2.7 is lower than the adsorption surface of the suction disc 1, and the top of the second cam bearing follower 2.8 is higher than the adsorption surface of the suction disc 1.

[0031] In the use of the present application, please refer to the attached Figure 7 -attached Figure 8 As shown, when the small wafer 3 is pre-aligned, the adjusting jackscrew 2.6 is rotated inward by a tool, the adjusting jackscrew 2.6 moves downward on the support plate 2.1, the end part of the adjusting jackscrew 2.6 applies force to the abutting part 2.41 of the lower plate 2.4, so that the lower plate 2.4 rotates around the hinge part, the lower plate 2.4 rotates together with the upper plate 2.3 and the rocker plate 2.2, and at the same time, the compression spring 2.5 is pressed, so that the compression spring 2.5 is in a compressed state, the first cam bearing follower 2.7 moves along the first through hole 1.4 to the adsorption surface of the suction disc 1, and finally, the top of the first cam bearing follower 2.7 is higher than the adsorption surface of the suction disc 1, at this time, the structure of the alignment device 2 is as shown in the attached Figure 7As shown in the figure, finally the small wafer 3 can be placed on the first adsorption surface 1.1, and the notch of the small wafer 3 is disposed on the shaft of the first cam bearing follower 2.7, thereby completing the pre-alignment of the small wafer 3 (as shown in the figure). Figure 8

[0032] When the pre-alignment of the large wafer 4 is needed, the tool is used to rotate the adjusting jackscrew 2.6 outward. During the rotation, the compression spring 2.5 releases the elastic force, and the rocker block 2.2, the upper plate 2.3 and the lower plate 2.4 in the four-bar linkage structure return to the initial position. The first cam bearing follower 2.7 installed on the rocker block 2.2 is retracted into the first through hole 1.4 of the chuck 1, and the top of the first cam bearing follower 2.7 is lower than the adsorption surface of the chuck 1. At this time, the mechanism of the alignment device 2 is as shown in the figure. Figure 9 Figure 10

[0033] The above-described embodiments only express the specific implementation of the present application, and the description is more specific and detailed, but it cannot be understood as the limitation of the patent scope of the present application. It should be noted that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application.​​​

Claims

1. A pre-alignment device for multi-specification gap wafers, characterized by, The utility model discloses a suction cup and alignment device, one side of the suction cup is suction surface, and the concentric first suction groove and second suction groove are arranged on the suction surface, and the alignment device is fixedly installed on the other side of the suction cup, and the alignment device includes support plate, warping plate, upper plate and lower plate, the support plate and warping plate are hinged on both ends of the upper plate and lower plate respectively and form four-bar linkage structure between the upper plate and lower plate, the compression spring is arranged between the lower plate and support plate, the adjusting jack is equipped on the support plate, the adjusting jack passes through the support plate and abuts against the lower plate, the lower plate rotates around the hinge of the support plate and warping plate through the screwing of adjusting jack, the second cam bearing follower is equipped on the support plate, the first cam bearing follower is equipped on the warping plate, the top of first cam bearing follower is lower than the suction surface, and the top of second cam bearing follower is higher than the suction surface.

2. A pre-alignment device for multi-specification notch wafers according to claim 1, wherein, One end of the lower plate is provided with an abutting portion, and the adjusting jack passes through the support plate and abuts against the surface of the abutting portion.

3. A pre-alignment device for multi-specification notch wafers as claimed in claim 1, wherein, The support plate is provided with a mounting portion, the first cam bearing follower is mounted on the mounting portion, the mounting portion is further provided with a first mounting hole, the lower plate is provided with a second mounting hole, the compression spring is sleeved between the lower plate and support plate through the first mounting hole and second mounting hole, and the upper plate is provided with a groove matched with the mounting portion.

4. The pre-alignment device for multi-specification notch wafers according to claim 1, wherein, Both ends of the upper plate are respectively provided with first hinge portions, both ends of the lower plate are respectively provided with second hinge portions, and the support plate and warping plate are hinged on both ends of the upper plate and lower plate through the first hinge portions, second hinge portions and pins.

5. A pre-alignment device for multi-specification notch wafers as recited in claim 1, wherein, The suction cup is provided with a mounting groove, and the alignment device is mounted in the mounting groove, the mounting groove is further provided with a first through hole and a second through hole, the first cam bearing follower is arranged in the first through hole, and the second cam bearing follower is arranged in the second through hole.

6. A pre-alignment device for multi-specification notch wafers as recited in claim 1, wherein, The surfaces of the first suction groove and second suction groove are provided with convex particles.

7. A pre-alignment device for multi-specification notch wafers as defined in claim 1, wherein, The suction cup is further provided with a fixing hole for mounting the suction cup.

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