A chip writing number machine

Abstract

The application discloses a chip writing number machine, comprising: a feeding device, a manipulator, a plurality of writing number assemblies, a visual assembly and a receiving device; the feeding device is provided with a conveying belt to convey chips to be written; the plurality of writing number assemblies are distributed on both sides of the conveying belt; the manipulator is provided with a mounting plate, a plurality of suction assemblies and a moving driving assembly; a vacuum suction head is suitable for suction of chips, the suction assembly comprises a support, a first rotary driving element, the vacuum suction head and a first linear module; the moving driving assembly is connected with the mounting plate to drive the plurality of vacuum suction heads to move between the conveying belt, the plurality of writing number assemblies and the receiving device; the visual assembly is arranged above the conveying belt to visually position the chips on the conveying belt; the receiving device is provided with a tool moving between a receiving position and a discharging position; the chip writing number machine has high versatility, simple structure and can improve the writing number efficiency of the chips.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing technology, and in particular to a chip writing machine. Background Technology

[0002] During chip manufacturing, the process typically involves laser engraving, program downloading, functional testing, functional coding, and packaging. Functional coding involves writing the chip's functional information and other data into the chip using a coding device. However, chip coding machines in related technologies have limited efficiency due to their robotic arms employing a large R-axis structure. Furthermore, the layout of the internal components of the coding machine also contributes to the low efficiency of chip coding. Summary of the Invention

[0003] The present invention aims to at least partially solve one of the technical problems in the aforementioned technologies. Therefore, the object of the present invention is to provide a chip writing machine that can improve the efficiency of chip writing.

[0004] To achieve the above objectives, embodiments of the present invention provide a chip writing machine, which includes: a feeding device, a robotic arm, several writing components, a vision component, and a receiving device;

[0005] The feeding device has a conveyor belt for conveying the chip to be written;

[0006] Several of the writing components are distributed on both sides of the conveyor belt;

[0007] The robotic arm has a mounting plate, several adsorption components, and a movement drive component. The adsorption components are arranged at intervals on the mounting plate. Each adsorption component includes a support, a first rotary drive, a vacuum adsorption head, and a first linear module. The vacuum adsorption head is adapted to adsorb chips. The first rotary drive is disposed on the support and connected to the vacuum adsorption head to drive the vacuum adsorption head to rotate and adjust the orientation of the chip. The first linear module is connected to the support to drive the vacuum adsorption head to move up and down to pick up and place chips. The movement drive component is connected to the mounting plate to drive the several vacuum adsorption heads to move between the conveyor belt, the several writing components, and the receiving device.

[0008] The vision component is positioned above the conveyor belt to perform visual positioning of the chips on the conveyor belt.

[0009] The receiving device has a tooling that moves between a receiving position and a discharging position, and the tooling is provided with a plurality of receiving slots suitable for placing chips.

[0010] According to an embodiment of the present invention, the chip writing machine controls the rotation of each vacuum adsorption head through each first rotary drive component, which can be used in conjunction with the vision component to adjust the orientation of each chip, so that the chip can be accurately placed on the writing position of the writing component. The chip is transferred by the first linear module and the moving drive component, which can eliminate the R-axis structure of the robot arm. Several writing components are set on both sides of the conveyor belt, which can perform writing operations on multiple chips at the same time, thereby improving the efficiency of chip writing.

[0011] In addition, the chip writing machine proposed above according to the present invention may also have the following additional technical features:

[0012] Optionally, the feeding device includes a first support, a first roller, a second roller, a conveyor belt, an auxiliary roller, and a second rotary drive component;

[0013] The first roller is rotatably mounted on the first support and located at the beginning of the conveying direction;

[0014] The second roller is rotatably mounted on the first support and located at the end of the conveying direction;

[0015] The conveyor belt connects the first roller and the second roller;

[0016] The auxiliary roller is rotatably disposed outside the first roller and / or the second roller and pushes the conveyor belt portion outward away from the first roller and / or the second roller, and the diameter of the auxiliary roller is smaller than that of the first roller and the second roller;

[0017] The second rotary drive is connected to the conveyor belt to drive the conveyor belt to rotate.

[0018] Furthermore, the second rotary drive component includes a drive roller, two redirecting rollers, and a motor. The motor is connected to the drive roller, and the two redirecting rollers are arranged on both sides of the drive roller in a one-to-one correspondence. The belt connects the two redirecting rollers and the drive roller.

[0019] Optionally, the writing assembly includes a base and a writing part, a pressing part, and a first moving drive member disposed on the base;

[0020] The writing section has a second bracket, a plurality of writing boards and a plurality of driving boards. The plurality of writing boards are arranged at intervals on the second bracket to place a plurality of chips. The plurality of driving boards are connected to the plurality of writing boards in a one-to-one correspondence to drive each writing board to write functional information into its corresponding chip.

[0021] The clamping part includes a support plate, a clamping drive component, and a plurality of clamping blocks. The plurality of clamping blocks are arranged at intervals on the support plate. The clamping drive component is connected to the support plate to drive the support plate to move the plurality of clamping blocks toward or away from the writing board, thereby clamping or releasing each chip with each written board.

[0022] The first moving drive unit is connected to the clamping part to drive the clamping part to move and avoid the chip when it is transferred to the writing board.

[0023] Furthermore, the clamping drive is adapted to drive the support plate to move up and down.

[0024] Furthermore, the first moving drive is connected to the pressing drive and is adapted to drive the pressing drive to move horizontally between a first position and a second position. In the first position, the plurality of pressing blocks are aligned with the chips on the plurality of writing boards, and in the second position, the plurality of pressing blocks are offset from the plurality of writing boards.

[0025] Optionally, the first rotary drive component is a micro motor, and the vacuum suction head is connected to the power output shaft of the micro motor.

[0026] Optionally, the first linear module includes a motor and a synchronous belt pulley transmission structure, the support is disposed on the synchronous belt pulley transmission structure, and the motor is connected to the synchronous belt pulley transmission structure.

[0027] Optionally, the motion drive assembly includes an X-axis motion drive and a Y-axis motion drive, the mounting plate is disposed on the moving end of the Y-axis motion drive, and the Y-axis motion drive is disposed on the moving end of the X-axis motion drive.

[0028] Optionally, the receiving device includes a third support and a second linear module;

[0029] The third bracket is set on the workbench of the number writing machine;

[0030] The second linear module is mounted on the third bracket and extends from the writing machine to the unloading and packaging station;

[0031] The tooling is mounted on the moving end of the second linear module to move between the receiving position and the unloading position by being driven by the second linear module. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of a serial number writer according to an embodiment of the present invention;

[0033] Figure 2 This is a schematic diagram of a robotic arm according to an embodiment of the present invention;

[0034] Figure 3 This is a partial schematic diagram of a robotic arm according to an embodiment of the present invention;

[0035] Figure 4 This is a schematic diagram of a chip adsorption assembly according to an embodiment of the present invention;

[0036] Figure 5 This is a schematic diagram of the writing component according to an embodiment of the present invention;

[0037] Figure 6 This is a schematic diagram of a receiving device according to an embodiment of the present invention;

[0038] Figure 7 This is a schematic diagram of a feeding device according to an embodiment of the present invention;

[0039] Explanation of reference numerals in the attached drawings: Robotic arm 1, Chip adsorption assembly 11, First motor 1111, Drive wheel 1112, Synchronous belt 1113, First linear module 1114, Support 1118, Inductive switch 1116, First rotary drive component 1117, Driven wheel 1115, Vacuum adsorption head 1119, First connecting plate 1121, First mounting plate 112, Vertical mounting plate 113, Horizontal mounting plate 114, Lifting drive assembly 111, Second moving drive assembly 13, X-axis moving drive component 131, Y-axis moving drive component 132, Writing assembly 2, Base 24, Pressing part 21, Support plate 2111, Pressing block 2112, Pressing drive component 2113. Number writing section 22, number writing plate 2211, drive plate 2212, bracket 2213, first moving drive assembly 23, second connecting plate 2311, moving drive component 2312, moving pair 2313, receiving device 3, bracket 31, linear module 32, tooling 33, receiving groove 3331, positioning hole 3333, second mounting plate 34, positioning column 3331, feeding device 4, frame 411, first roller 412, second roller 413, belt 414, auxiliary roller 415, drive roller 416, redirecting roller 417, second motor 418, first gear 419, second gear 421, synchronous belt 422, vision assembly 5, worktable 6. Detailed Implementation

[0040] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0041] To better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the invention to those skilled in the art.

[0042] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0043] The chip writing machine according to an embodiment of the present invention is described below with reference to the accompanying drawings. It includes: a feeding device 4, a robotic arm 1, a plurality of writing components 2, a vision component 5, and a receiving device 3 disposed on a worktable 6.

[0044] Specifically, the feeding device 4 has a conveyor belt to transport chips to be written; several writing components 2 are distributed on both sides of the conveyor belt; the robotic arm 1 has a first mounting plate 112, several chip adsorption components 1119, and a second moving drive component 13. The chip adsorption components 1119 are arranged at intervals on the mounting plate. Each chip adsorption component 1119 includes a support 1118, a first rotary drive component 1117, a vacuum adsorption head 1119, and a first linear module 1114. The vacuum adsorption head 1119 is adapted to adsorb chips. The first rotary drive component 1117 is disposed on the support 1118 and connected to the vacuum adsorption head 1119. 9. The first linear module 1114 is connected to the support 1118 to drive the vacuum adsorption head 1119 to move up and down to pick up and put in the chip. The second moving drive assembly 13 is connected to the first mounting plate 112 to drive several vacuum adsorption heads 1119 to move between the conveyor belt, several writing assemblies 2 and receiving device 3. The vision assembly 5 is set above the conveyor belt to perform visual positioning of the chip on the conveyor belt. The receiving device 3 has a tooling 33 that moves between the receiving position and the unloading position. The tooling 33 is provided with several receiving slots 3331 suitable for placing the chip.

[0045] Therefore, according to the chip writing machine of the present invention, each vacuum suction head 1119 is rotated by each first rotary drive component 1117, which can be used in conjunction with the vision component 5 to adjust the orientation of each chip, so that the chip can be accurately placed on the writing position of the writing component 2. The chip is transferred by the first linear module 1114 and the second motion drive component 13, which can eliminate the R-axis structure of the robot arm. Several writing components 2 are set on both sides of the conveyor belt, which can perform writing operations on multiple chips at the same time, thereby improving the efficiency of chip writing.

[0046] like Figure 7As shown, the feeding device 4 is suitable for conveying chips. The feeding device 4 includes a frame 411, a first roller 412, a belt 414, an auxiliary roller 415, and a rotary drive.

[0047] Specifically, the first roller 412 is rotatably mounted on the frame 411 and located at the beginning of the conveying direction; the first roller 412 is rotatably mounted on the frame 411 and located at the end of the conveying direction; the belt 414 connects the first roller 412 and the first roller 412; the auxiliary roller 415 is rotatably mounted outside the first roller 412 and / or the first roller 412 and pushes part of the belt 414 outward away from the first roller 412 and / or the first roller 412, and the diameter of the auxiliary roller 415 is smaller than that of the first roller 412 and the first roller 412; the rotation drive is connected to the belt 414 to drive the belt 414 to rotate.

[0048] In other words, compared to existing belt conveyors, this embodiment uses an auxiliary roller 415, which is located outside the roller at the beginning or end of the conveying direction. The diameter of the auxiliary roller 415 is smaller than the diameter of the roller at the beginning or end of the conveying direction, so that the belt 414 at the beginning or end of the conveying direction has a smaller curvature.

[0049] Therefore, according to the embodiment of the present invention, the feeding device 4, by setting the auxiliary roller 415, makes the belt 414 at the beginning or end of the conveying direction have a small arc shape. In this way, when docking with another conveyor belt, the gap between the two can be reduced, and small-sized chips are prevented from falling into the gap. This makes the feeding device applicable to the use of chips of various sizes and specifications, improves the versatility of the feeding device, and reduces costs.

[0050] It is understandable that the auxiliary roller 415 can be set separately on the outside of the roller at the beginning of the conveying direction, or separately on the outside of the roller at the end of the conveying direction, or an auxiliary roller 415 can be set on the outside of both the roller at the beginning and the roller at the end of the conveying direction, so that the feeding device can be better connected with other conveyor belts.

[0051] In some examples, the belt 414 on the auxiliary roller 415 forms an inclined surface with respect to the belt 414 on the first roller 412 or the belt 414 on the first roller 412. Specifically, the inclined surface is inclined downwards from the auxiliary roller 415 to the first roller 412 or the first roller 412. This results in a slight curvature at the belt 414 corresponding to the auxiliary roller 415.

[0052] The rotary drive includes a drive roller 416, two redirecting rollers 417, and a second motor 418. The second motor 418 is connected to the drive roller 416. The two redirecting rollers 417 are arranged on opposite sides of the drive roller 416. A belt 414 connects the two redirecting rollers 417 and the drive roller 416. Thus, the second motor 418 drives the drive roller 416 to rotate, which in turn drives the belt 414 to rotate. The modified roller 107 also serves to tension the belt 414.

[0053] The belt 414 can be connected to the rollers in the following ways: the belt 414 is connected in sequence to the drive roller 416, a modified roller 107, an auxiliary roller 415, a first roller 412, another modified roller 107; or the belt 414 is connected in sequence to the drive roller 416, a modified roller 107, a first roller 412, an auxiliary roller 415, another modified roller 107; or the belt 414 is connected in sequence to the drive roller 416, a modified roller 107, an auxiliary roller 415, a first roller 412, another auxiliary roller 415, another modified roller 107.

[0054] The drive roller 416 is equipped with a first gear 419, and the power output shaft of the second motor 418 is equipped with a second gear 421. The first gear 419 and the second gear 421 are connected by a synchronous belt 422. Thus, the second motor 418 drives the drive roller 416 to rotate.

[0055] like Figures 2-4 As shown, the robotic arm 1 includes: a first mounting plate 112, a plurality of chip adsorption components 11, and a second motion drive component 13.

[0056] Specifically, if the chip adsorption components 11 are arranged at intervals on the first mounting plate 112, the chip adsorption components 11 include a support 1118, a first rotary drive 1117, a vacuum adsorption head 1119, and a first linear module 1114. The vacuum adsorption head 1119 is suitable for adsorbing chips. The first rotary drive 1117 is disposed on the support 1118 and connected to the vacuum adsorption head 1119 to drive the vacuum adsorption head 1119 to rotate and adjust the orientation of the chip. The first linear module 1114 is connected to the support 1118 to drive the vacuum adsorption head 1119 to move up and down to pick up and put down the chip. If the vacuum adsorption heads 1119 of the chip adsorption components 11 are on the same horizontal plane, the second moving drive component 13 is connected to the first mounting plate 112 to drive several vacuum adsorption heads to move between the chip conveyor belt and the writing position.

[0057] Therefore, by setting a first linear module 1114 on each chip adsorption assembly 11 to control the movement of the vacuum adsorption head 1119, each chip can be individually picked up and placed. Compared with the lead screw spline shaft in related technologies, the position of the first linear module 1114 on the first mounting plate 112 can be manually adjusted, so that the gap between multiple chip adsorption assemblies can be adjusted to accommodate the writing operation of chips of different specifications. In addition, by controlling the rotation of each vacuum adsorption head 1119 through each first rotary drive 1117, the orientation of each chip can be adjusted in conjunction with the vision device on the writing machine, so that the chip can be accurately placed in the writing machine.

[0058] The second motion drive assembly 13 includes an X-axis motion drive 301 and a Y-axis motion drive 132. The first mounting plate 112 is disposed on the moving end of the Y-axis motion drive 132, and the Y-axis motion drive 132 is disposed on the moving end of the X-axis motion drive 131. The second motion drive assembly 13 is connected to the first mounting plate 112 to drive a plurality of vacuum suction heads to move between the chip conveyor belt and the writing position.

[0059] like Figure 2 and Figure 3 As shown, the first mounting plate 112 is vertically arranged and is connected to a horizontal connecting plate, which is set on the vertical connecting plate. Thus, the first mounting plate 112 can be moved in the X and Y directions by the second motion drive assembly 13.

[0060] like Figures 2-4 As shown, a plurality of chip adsorption components 11 are arranged horizontally at intervals on the first mounting plate 112, and each first linear module 1114 is arranged vertically. This ensures that the vacuum adsorption heads 1119 of the plurality of chip adsorption components 11 are on the same horizontal plane. The number of chip adsorption components 11 can be as follows: Figure 2 There are 8 chips in total. Each group of four chips is used to transfer the chips from the conveyor belt to the writing position for writing. Another group of four chips is used to transfer the written chips from the writing position to the conveyor belt for the next processing step. This reduces the transfer action of the second moving drive component 13 and improves production efficiency.

[0061] like Figure 2 and Figure 3 As shown, the chip adsorption assembly 11 is adapted to pick up and place chips and adjust their orientation. The gap between the chip adsorption assemblies 11 can be adjusted to accommodate the writing operation of chips of different specifications. The chip adsorption assembly includes: a support 1118, a first rotary drive 1117, a vacuum adsorption head 1119, and a first motor 1111.

[0062] Specifically, the vacuum adsorption head 1119 is suitable for adsorbing chips. A first rotary drive component 1117 is mounted on the support 1118 and connected to the vacuum adsorption head 1119 to drive its rotation, thereby adjusting the chip's orientation. A first motor 1111 is connected to the support 1118 to drive the vacuum adsorption head 1119 to move up and down to pick up and place chips. The first linear module 1114 in the lifting drive assembly 101 can be adjusted according to the chip specifications, allowing for adjustment of the gaps between the chip adsorption assemblies 11 to accommodate the production of chips of different specifications. This enhances the equipment's versatility and improves the efficiency of switching between different chip specifications, thereby increasing overall production efficiency.

[0063] In other words, when multiple chips are transported, their postures (or orientations) differ, making it impossible to accurately position them at the writing location when they are transferred to the writing component. The chip adsorption component 11 controls the rotation of the vacuum adsorption head 1119 individually through the first rotary drive component 1117. This, in conjunction with the vision device on the writing machine, allows for the adjustment of the orientation of each chip before it is placed at the writing location. The movement of the vacuum adsorption head 1119 is also controlled individually by the first motor 1111, enabling the individual handling of chips of various specifications. This allows for both individual chip handling and precise placement within the writing machine. Furthermore, when switching between production of chips of different specifications, the gap between the chip adsorption components 10 can be adjusted simply by adjusting the first linear module 1114, thus achieving rapid production switching, reducing equipment investment costs, and improving chip production efficiency.

[0064] like Figure 3 and Figure 4 As shown, for the induction switch 1116, the induction switch 1116 is adapted to sense the sensing plate on the connecting plate 1121. The sensing plate is set on the connecting plate 1121. The lifting drive assembly 101 drives the connecting plate 1121 to lift and lower, thereby synchronously driving the support 1118 set on the first connecting plate 1121 to lift and lower, thereby ensuring that the vacuum adsorption head 1119 is in the correct working position.

[0065] According to the chip adsorption assembly 11 of the present invention, the first rotary drive 1117 independently controls the rotation of the vacuum adsorption head 1119, which can be used in conjunction with the vision device on the writing machine to adjust the orientation of each chip. The lifting drive 101 independently controls the movement of the vacuum adsorption head 1119, which can individually pick up and put down each chip. By adjusting the gap between the chip adsorption assemblies 11, it is possible to achieve both individual picking up and putting down of multiple chips and individual adjustment of the posture of each chip, which can more accurately place the chips in the writing machine and quickly switch between the production of chips of different specifications, thereby improving the pass rate of chip production.

[0066] like Figure 5As shown, the writing component 2 is adapted to write functional information to the chip. The writing component includes a clamping part 21, a first moving drive component 23, and a writing part 22.

[0067] Specifically, the writing section 22 has a support 2213, a plurality of writing boards 2211, and a plurality of driving boards 2212. The plurality of writing boards 2211 are arranged at intervals on the support 2213 to place a plurality of chips. The plurality of driving boards 2212 are connected to the plurality of writing boards 2211 one by one to drive each writing board 2211 to write functional information into its corresponding chip. The clamping section 21 includes a support plate 2111, a clamping driving member 2113, and a plurality of pressing blocks 2112. The plurality of pressing blocks 2112 are arranged at intervals on the support plate 2111. The clamping driving member 2113 is connected to the support plate 2111 to drive the support plate 2111 to move the plurality of pressing blocks 2112 toward or away from the writing boards 2211 to clamp or release each chip with each written board 1031. The first moving driving component 23 is connected to the clamping section to drive the clamping section 21 to move and avoid the chip when it is transferred to the writing board 2211.

[0068] In other words, a number of writing boards 2211, a number of driver boards 2212, and a number of pressure blocks 2112 are matched one-to-one to enable the simultaneous writing of functional information to multiple chips.

[0069] According to the embodiment of the present invention, the writing component 2 is connected to the clamping part 21 by the first moving drive component 23 to drive the clamping part 21 to move, so as to avoid the chip when it is transferred to the writing board 2211. The clamping drive component 2113 is connected to the support plate 2111 to drive the support plate 2111 to drive several pressure blocks 2112 to move toward or away from the writing board 2211, thereby pressing or releasing each chip with each writing board 2211. Through the one-to-one correspondence between multiple writing boards 2211 and multiple drive boards 2212, functional information is written into the corresponding chip. Thus, multiple chips can be written simultaneously, the writing efficiency is higher, thereby improving the chip production efficiency, and the entire writing component has a simple structure.

[0070] The number of writing board 2211, drive board 2212 and pressure block 2112 can be designed according to actual needs.

[0071] Therefore, by cooperating with multiple writing boards 2211, multiple driver blocks 1033, and multiple pressure blocks 2112, multiple chips can be written with functional information simultaneously. The structure is compact, saving space on the host, reducing equipment manufacturing costs, and improving production efficiency.

[0072] like Figure 5As shown, for the pressing part 21, its pressing drive 2113 is adapted to drive the support plate 2111 to move up and down. In this way, through the up and down movement, a number of pressing blocks 2112 move toward or away from the writing plate 2211.

[0073] Specifically, the clamping drive 2113 includes two lifting cylinders, which are connected to the two ends of the support plate 2111 in a one-to-one correspondence; thereby, by the simultaneous action of the two lifting cylinders, a number of pressure blocks 2112 on the support plate 2111 are driven to move toward or away from the writing plate 2211.

[0074] Furthermore, a plurality of pressure blocks 2112 are disposed on the side of the support plate 2111 facing the writing plate 2211. It can be understood that the pressure blocks 2112 are disposed on the bottom surface of the support plate 2111. The number of pressure blocks 2112 can be as follows: Figure 1 The four pressure blocks 2112 are arranged at intervals on the bottom surface of the support plate 2111, with the pressing surfaces of the four pressure blocks 2112 facing the writing plate 2211. For example... Figure 5 As shown, for the first moving drive assembly 23, the first moving drive assembly 23 is connected to the pressing drive member 2113 and is adapted to drive the pressing drive member 2113 to move horizontally between a first position and a second position. In the first position, a plurality of pressing blocks 2112 are aligned with chips on a plurality of writing boards 2211. In the second position, a plurality of pressing blocks 2112 are offset from a plurality of writing boards 2211.

[0075] Specifically, the first moving drive assembly 23 includes a moving drive member 2312 and a moving pair 2313. The pressing drive member 2113 is disposed on the moving pair 2313, and the moving drive member 2312 is connected to the moving pair 2313. The moving pair 2313 includes a linear guide rail and a slider, thereby driving the pressing part 21 to move between a first position (the clearance position when the chip is transferred to the writing board 2211) and a second position (the alignment position between the pressing block 2112 and the chip on the writing board 2211) through the movement of the moving drive member 2312, thus realizing the conversion between the clearance position and the pressing position.

[0076] For the pressing drive 2113 on the pressing part 21, which consists of two lifting cylinders, the first moving drive assembly 23 can be provided with two corresponding moving pairs 2313. The two moving pairs 2313 are connected by a connecting plate 2311, so that only one moving cylinder is needed. The two ends of the connecting plate 2311 are connected to the left and right moving pairs 2313 respectively. Thus, by the action of the moving drive 2312, the pressing part 21 on the connecting plate 2311 is driven to move between the first position (the pressing block 2112 is offset from the writing plate 2211) and the second position (the pressing block 2112 is directly above the writing plate 2211), thereby realizing the conversion between the avoidance position and the pressing position.

[0077] like Figure 5 As shown, for the writing section 22, a plurality of writing boards 2211 are spaced apart on the top of its support 2213, and a plurality of corresponding drive boards 2212 are spaced apart below the writing boards 2211. The number of writing boards 2211 and drive boards 2212 can be as follows: Figure 1 There are four of them, so it is possible to write the function number of four chips at the same time.

[0078] The drive boards 2212 in the writing section 22 are arranged at intervals below the bracket 2213. In this way, the space below the bracket 2213 can be used in a reasonable way, and the drive boards 2212 can be directly connected to the writing board 2211 for communication.

[0079] like Figure 6 As shown, the receiving device 3 of the chip writing machine according to an embodiment of the present invention is adapted to transfer the chip after the writing machine has completed writing to the unloading and packaging machine. The receiving device includes a bracket 31, a linear module 32, and a tooling 33.

[0080] Specifically, the bracket 31 is set on the worktable 6 of the writing machine; the linear module 32 is set on the bracket 31 and extends from the writing machine to the unloading and packaging station; the tooling 33 is set on the moving end of the linear module 32, and the tooling 33 defines a number of spaced receiving slots 3331, which are suitable for receiving chips from the writing machine.

[0081] In other words, the chip can be transferred from the writing machine to the unloading and packaging station via the bracket 31 and the linear module 32. The tooling 33 moves on the linear module 32.

[0082] Therefore, according to the chip writing machine receiving device 3 of the present invention, the linear module 32 drives the fixture 33 to move back and forth between the writing machine and the unloading and packaging station. The fixture 33 is provided with multiple receiving slots 3331, so that the chips written by the writing machine can be picked up and placed by the robot arm into the receiving slots 3331 on the fixture 33, and then transferred to the next station. Through the cooperation of the fixture 33 and the linear module 32, it can be ensured that multiple chips after writing can be accurately transferred to the unloading and packaging station.

[0083] In some examples, linear module 32 is a linear motor module. Fixture 33 is provided on the slide of the linear motor module.

[0084] For the installation of tooling 33, a second mounting plate 34 can be fixed on the slide of the linear motor module. A positioning post 3331 is provided on the second mounting plate 34, and a positioning hole 3333 is correspondingly provided on tooling 33. The positioning post 3331 is inserted into the positioning hole 3333, so that tooling 33 can be detachably mounted on the second mounting plate 34.

[0085] For the receiving groove 3331 on the tooling 33, multiple receiving grooves 3331 are provided, for example Figure 2 In this example, four receiving slots 3331 are spaced apart, with one chip placed in each slot 3331. Of course, in other examples, the number of receiving slots 3331 can be designed reasonably according to actual needs.

[0086] Specifically, the top of the receiving slot 3331 is open, and the chip is picked up from the top of the receiving slot 3331 and placed into the receiving slot 3331 by a robotic arm.

[0087] The inner wall of the receiving groove 3331 has several inclined surfaces, which, together with the bottom of the receiving groove 3331, define the chip receiving space. In this way, by setting the inclined surfaces, the chip can be limited within the receiving space by contacting the edge of the chip with the inclined surfaces.

[0088] Furthermore, the size of the receiving space gradually decreases from the top to the bottom of the receiving tray 3331. That is, the area of ​​the receiving space at the top of the receiving tray 3331 is larger than the area of ​​the receiving space at the bottom of the receiving tray 3331. In this way, the chip can be positioned while facilitating chip placement and removal.

[0089] In addition, a protective cover can be installed on the part of the bracket 31 that does not contact the worktable of the writing machine to protect the chip, tooling 33, etc.

[0090] To better understand this embodiment, the workflow of this embodiment is further explained as follows: First, several chips are conveyed from the feeding device 4 to the area below the vision device 5. After the vision device 5 makes a judgment, it drives the robot arm 1 to move onto the feeding device 4 to pick up the chips. Then, after adjusting the orientation of the chips, they are placed on the writing board 2211. The writing component 2 presses the chips firmly onto the writing board 2211 and writes the functional information onto the chips through the writing board 2211. After the chips are written, the robot arm 1 picks up the chips and transfers them to the tooling 33 of the receiving device 3. The receiving device 3 then transfers the chips to the next process.

[0091] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0092] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0093] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0094] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0095] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0096] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A chip writing machine, characterized in that, include: Feeding device, robotic arm, several writing components, vision components and receiving device; The feeding device has a conveyor belt for conveying the chip to be written; Several of the writing components are distributed on both sides of the conveyor belt; The robotic arm has a mounting plate, several adsorption components, and a movement drive component. The adsorption components are arranged at intervals on the mounting plate. Each adsorption component includes a support, a first rotary drive, a vacuum adsorption head, and a first linear module. The vacuum adsorption head is adapted to adsorb chips. The first rotary drive is disposed on the support and connected to the vacuum adsorption head to drive the vacuum adsorption head to rotate and adjust the orientation of the chip. The first linear module is connected to the support to drive the vacuum adsorption head to move up and down to pick up and place chips. The movement drive component is connected to the mounting plate to drive the several vacuum adsorption heads to move between the conveyor belt, the several writing components, and the receiving device. The vision component is positioned above the conveyor belt to perform visual positioning of the chips on the conveyor belt. The receiving device has a tooling that moves between a receiving position and a discharging position, and the tooling is provided with a plurality of receiving slots suitable for placing chips.

2. The chip writing machine as described in claim 1, characterized in that, The feeding device includes a first support, a first roller, a second roller, an auxiliary roller, and a second rotary drive component; The first roller is rotatably mounted on the first support and located at the beginning of the conveying direction; The second roller is rotatably mounted on the first support and located at the end of the conveying direction; The conveyor belt connects the first roller and the second roller; The auxiliary roller is rotatably disposed outside the first roller and / or the second roller and pushes the conveyor belt portion outward away from the first roller and / or the second roller, and the diameter of the auxiliary roller is smaller than that of the first roller and the second roller; The second rotary drive is connected to the conveyor belt to drive the conveyor belt to rotate.

3. The chip writing machine as described in claim 2, characterized in that, The second rotary drive component includes a drive roller, two redirecting rollers, and a motor. The motor is connected to the drive roller, and the two redirecting rollers are arranged on both sides of the drive roller in a one-to-one correspondence. The conveyor belt connects the two redirecting rollers and the drive roller.

4. The chip writing machine as described in claim 1, characterized in that, The writing component includes a base and a writing part, a pressing part and a first moving drive component disposed on the base; The writing section has a second bracket, a plurality of writing boards and a plurality of driving boards. The plurality of writing boards are arranged at intervals on the second bracket to place a plurality of chips. The plurality of driving boards are connected to the plurality of writing boards one-to-one to drive each writing board to write functional information into its corresponding chip. The clamping part includes a support plate, a clamping drive component, and a plurality of clamping blocks. The plurality of clamping blocks are arranged at intervals on the support plate. The clamping drive component is connected to the support plate to drive the support plate to move the plurality of clamping blocks toward or away from the writing board, thereby clamping or releasing each chip from each writing board. The first moving drive unit is connected to the clamping part to drive the clamping part to move and avoid the chip when it is transferred to the writing board.

5. The chip writing machine as described in claim 4, characterized in that, The clamping drive is adapted to drive the support plate to move up and down.

6. The chip writing machine as described in claim 4, characterized in that, The first moving drive is connected to the pressing drive and is adapted to drive the pressing drive to move horizontally between a first position and a second position. In the first position, the plurality of pressing blocks are aligned with the chips on the plurality of writing boards. In the second position, the plurality of pressing blocks are offset from the plurality of writing boards.

7. The chip writing machine as described in claim 1, characterized in that, The first rotary drive component is a micro motor, and the vacuum suction head is connected to the power output shaft of the micro motor.

8. The chip writing machine as described in claim 1, characterized in that, The first linear module includes a motor and a synchronous belt pulley transmission structure. The support is mounted on the synchronous belt pulley transmission structure, and the motor is connected to the synchronous belt pulley transmission structure.

9. The chip writing machine as described in claim 1, characterized in that, The motion drive assembly includes an X-axis motion drive component and a Y-axis motion drive component. The mounting plate is disposed on the moving end of the Y-axis motion drive component, and the Y-axis motion drive component is disposed on the moving end of the X-axis motion drive component.

10. The chip writing machine as described in claim 1, characterized in that, The receiving device includes a third support and a second linear module; The third bracket is set on the workbench of the number writing machine; The second linear module is mounted on the third bracket and extends from the writing machine to the unloading and packaging station; The tooling is mounted on the moving end of the second linear module to move between the receiving position and the unloading position by being driven by the second linear module.

Images