Mirror mount, lens assembly and camera module

Abstract

The present application discloses a lens holder, a lens assembly and a camera module. The lens holder includes: a body, having a top surface, a bottom surface and a lens mounting hole extending from the top surface to the bottom surface; a support portion and a light shielding portion, both extending and protruding from the bottom surface of the body along the direction from the top surface of the body to the bottom surface of the body; the light shielding portion surrounds the lens mounting hole, and the support portion is located on the outside of the light shielding portion; a notch penetrating the side wall of the support portion is formed on the lower edge of the support portion, and the notch is used to accommodate electronic components; the spacing between the bottom surface of the light shielding portion and the bottom surface of the support portion is not greater than the thickness of the photosensitive chip corresponding to the lens mounting hole. The lens assembly includes a lens and the above-mentioned lens holder. The camera module includes a circuit board and the above-mentioned lens assembly. The embodiment of the present application can not only reduce the size and realize the miniaturization of the camera module without reducing the area of ​​the photosensitive chip and the number of electronic components, but also prevent stray light from irradiating the photosensitive chip.

Description

Technical Field

[0001] The present application relates to the technical field of optical elements, and in particular to a lens mount, a lens assembly and a camera module. Background Art

[0002] With the popularization of smart devices, the camera modules used in smart devices have developed and progressed rapidly, and miniaturization has become the development trend of camera modules. In order to meet people's ever-increasing demand for taking photos, the number of pixels in camera modules has increased, and the area of ​​photosensitive chips has gradually increased. Therefore, it is difficult to achieve miniaturization without reducing the area of ​​photosensitive chips and the number of electronic components.

[0003] Application Contents

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application embodiment proposes a lens holder, a lens assembly and a camera module to reduce the size and realize the miniaturization of the camera module without reducing the area of ​​the photosensitive chip and the number of electronic components, while preventing light leakage.

[0005] According to the first aspect of the present application, the lens holder includes: a main body, having a top surface, a bottom surface opposite to the top surface, and a lens mounting hole extending from the top surface to the bottom surface; and a supporting portion and a shading portion, both extending and protruding from the bottom surface of the main body along a direction from the top surface of the main body to the bottom surface of the main body, wherein the shading portion surrounds the lens mounting hole and the supporting portion is located on the outside of the shading portion; wherein a notch is formed on the lower edge of the supporting portion and passes through the side wall of the supporting portion, and the notch is used to accommodate electronic components; and the spacing between the bottom surface of the shading portion and the bottom surface of the supporting portion is no greater than the thickness of the photosensitive chip corresponding to the lens mounting hole.

[0006] According to one embodiment of the present application, the projection of the light-shielding portion on the horizontal plane falls into the projection of the photosensitive chip on the horizontal plane, and the distance between the bottom surface of the light-shielding portion and the bottom surface of the supporting portion is equal to the thickness of the photosensitive chip.

[0007] According to an embodiment of the present application, the bottom surface of the light shielding portion is an inclined surface.

[0008] According to one embodiment of the present application, the projection of the light shielding portion on the horizontal plane is located outside the projection of the photosensitive chip on the horizontal plane.

[0009] According to an embodiment of the present application, the support portion extends and protrudes from an edge of the bottom surface of the body.

[0010] According to an embodiment of the present application, a projection of the notch on the horizontal plane covers a projection of the electronic component on the horizontal plane.

[0011] According to the lens assembly of the embodiment of the second aspect of the present application, it includes: a lens; and a lens mount described in any one of the first aspects; wherein the lens is installed in the lens mounting hole of the lens mount.

[0012] The camera module according to the embodiment of the third aspect of the present application includes: a circuit board; and the lens assembly described in the second aspect; wherein the electronic components and the photosensitive chip corresponding to the lens mounting hole are mounted on the board surface of the circuit board, and the supporting part of the lens assembly is fixed to the circuit board.

[0013] According to an embodiment of the present application, an outer side wall of the support portion is flush with an edge of the circuit board, and a distance between the edge of the circuit board and an outer edge of the electronic component is no greater than 0.1 mm.

[0014] According to an embodiment of the present application, there are multiple electronic components, and the upper surfaces of the electronic components and the board surface of the circuit board between two adjacent electronic components are both adhesive coating areas.

[0015] The lens holder, lens assembly and camera module provided by the embodiment of the present application have a notch for accommodating electronic components on the lower edge of the support portion of the lens holder. After the lens holder is fixed to the circuit board, the electronic components installed on the circuit board are inserted into the notch of the support portion. Therefore, the horizontal size of the lens holder only needs to ensure that the space formed by the inner side wall of the support portion can accommodate the photosensitive chip, and no installation space is required for the electronic components, thereby significantly reducing the horizontal size of the lens holder. In addition, the lens holder can also be fixedly connected to the circuit board by means of the inner wall of the notch and the part of the support portion without the notch, so that the circuit board does not need to reserve a glue coating area on the periphery of the electronic components, thereby indirectly reducing the size of the camera module. In addition, since the bottom surface of the body of the lens holder in the embodiment of the present application is formed with a light shielding portion between the support portion and the lens mounting hole, and the distance between the bottom surface of the light shielding portion and the bottom surface of the support portion is not greater than the thickness of the photosensitive chip corresponding to the lens mounting hole, after the lens holder is fixed to the circuit board, the photosensitive area of ​​the photosensitive chip, that is, the area corresponding to the lens mounting hole on the upper surface of the photosensitive chip, will be surrounded by the light shielding portion, and the light shielding portion will completely block the light from the gap between the electronic components and the notch of the support portion, thereby preventing stray light from irradiating the photosensitive area of ​​the photosensitive chip. It can be seen that the embodiment of the present application can not only reduce the size and realize the miniaturization of the camera module without reducing the area of ​​the photosensitive chip and the number of electronic components, but also prevent stray light from irradiating the photosensitive chip.

[0016] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present application, nor is it intended to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Other features, purposes and advantages of the present application will become more apparent by reading the detailed description of the non-limiting embodiments made with reference to the following drawings. The drawings are used to better understand the present solution and do not constitute a limitation of the present application. In the drawings:

[0018] Figure 1 is one of the longitudinal cross-sectional schematic diagrams of the mirror holder according to the present application;

[0019] Figure 2 is a second longitudinal cross-sectional schematic diagram of the mirror holder according to the present application;

[0020] Figure 3 is one of the longitudinal cross-sectional schematic diagrams of the camera module according to the present application;

[0021] Figure 4 is a second longitudinal cross-sectional schematic diagram of a camera module according to the present application;

[0022] Figure 5 is a front view schematic diagram of a camera module according to the present application;

[0023] Figure 6 is a schematic top view of a circuit board according to the present application; and

[0024] Figure 7 It is a bottom view schematic diagram of a camera module (without circuit board) according to the present application.

[0025] Reference numerals:

[0026] 100, lens base; 110, body; 111, lens mounting hole; 112, top surface of body;

[0027] 113, bottom surface of the body; 120, support portion; 121, notch; 130, light shielding portion;

[0028] 200, lens; 300, circuit board; 301, adhesive coating area;

[0029] 310. Electronic components; 320. Photosensitive chips; 400. Filters; 500. Gold wires. DETAILED DESCRIPTION

[0030] In the description of the embodiments of the present application, it should be noted that the terms "longitudinal", "lateral", "upper", "lower", "top", "bottom", "inner", "outer", etc., indicating the orientation or state relationship, are based on the orientation or state relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0031] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0032] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0033] The following is a description of exemplary embodiments of the present application in conjunction with the accompanying drawings, including various details of the embodiments of the present application to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. Similarly, for the sake of clarity and conciseness, the description of well-known functions and structures is omitted in the following description.

[0034] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0035] like Figure 1 and Figure 2As shown, the embodiment of the present application provides a lens holder 100, which includes a body 110, a support portion 120 and a light shielding portion 130. The body 110 has a top surface, a bottom surface opposite to the top surface, and a lens mounting hole 111 that runs from the top surface to the bottom surface. The support portion 120 and the light shielding portion 130 both extend and protrude from the bottom surface 113 of the body in a direction from the top surface 112 of the body to the bottom surface 113 of the body. The light shielding portion 130 surrounds the lens mounting hole 111, and the support portion 120 is located outside the light shielding portion 130. A notch 121 that runs through the side wall of the support portion 120 is formed at the lower edge of the support portion 120, and the notch 121 is used to accommodate electronic components. The distance between the bottom surface of the light shielding portion 130 and the bottom surface of the support portion 120 is not greater than the thickness of the photosensitive chip corresponding to the lens mounting hole 111. As an example, the electronic components may be, but are not limited to, components such as resistors, capacitors, inductors, diodes or transistors.

[0036] like Figure 3 and Figure 4 As shown, the following is an explanation of the installation method of the lens holder 100 on the circuit board 300 in the embodiment of the present application: the board surface of the circuit board 300 includes a first installation area and a second installation area surrounding the first installation area, the photosensitive chip 320 is installed in the first installation area, and the electronic component 310 is installed in the second installation area.

[0037] When fixing the lens holder 100: first, apply adhesive such as thermosetting adhesive to the part of the second mounting area of ​​the circuit board 300 where the electronic component 310 is not mounted; then, apply thermosetting adhesive to the upper surface of the electronic component 310; then, align the lens mounting hole 111 of the lens holder 100 with the photosensitive chip 320, and align the notch 121 of the lens holder 100 with the corresponding electronic component 310, and then gradually move the lens holder 100 closer to the circuit board 300 until the bottom surface of the support portion 120 is in close contact with the board surface of the circuit board 300. Since the distance between the bottom surface of the light shielding portion 130 and the bottom surface of the support portion 120 is not greater than the thickness of the photosensitive chip 320 corresponding to the lens mounting hole 111, the photosensitive area of ​​the photosensitive chip 320, that is, the area on the upper surface of the photosensitive chip 320 corresponding to the lens mounting hole 111, is surrounded by the light shielding portion 130. Finally, the lens holder 100 and the circuit board 300 can be baked. After baking, the inner wall of the notch 121 is bonded to the electronic component 310 by means of a thermosetting adhesive, and the portion of the support portion 120 without the notch 121 is directly bonded to the board surface of the circuit board 300 by means of a thermosetting adhesive, so that the lens holder 100 is firmly fixed on the circuit board 300. It should be noted that, in addition to the bonding method, i.e., the method of applying adhesive, the lens holder 100 and the circuit board 300 can also be fixedly connected by other methods such as hot melt connection and welding.

[0038] As can be seen from the above, since the lower edge of the support portion 120 of the lens holder 100 in the embodiment of the present application is provided with a notch 121 for accommodating the electronic component 310, Figure 4 As shown, after the lens holder 100 is fixed on the circuit board 300, the electronic component 310 installed on the circuit board 300 is inserted into the notch 121 of the support part 120, so that the horizontal size of the lens holder 100 only needs to ensure that the space formed by the inner side wall of the support part 120 can accommodate the photosensitive chip 320, and there is no need to reserve installation space for the electronic component 310, thereby significantly reducing the horizontal size of the lens holder 100. In addition, the lens holder 100 can also be fixedly connected to the circuit board 300 by means of the inner wall of the notch 121 and the part of the support part 120 without the notch 121, so that the circuit board 300 does not need to reserve a glue coating area on the periphery of the electronic component 310, thereby indirectly reducing the size of the camera module. In addition, in order to facilitate installation and avoid damage to the electronic component 310, the size of the notch 121 is usually slightly larger than the size of the electronic component 310, that is, after the electronic component 310 is inserted into the notch 121, there is a certain gap between the electronic component 310 and the inner wall of the notch 121. If the lens holder 100 is fixedly connected to the circuit board 300 by adhesive, the gap may not be filled with adhesive and there is a risk of light leakage. However, since the bottom surface 113 of the body of the lens holder 100 in the embodiment of the present application is formed with a light shielding portion 130 between the support portion 120 and the lens mounting hole 111, and the distance between the bottom surface of the light shielding portion 130 and the bottom surface of the support portion 120 is not greater than the thickness of the photosensitive chip 320 corresponding to the lens mounting hole 111, after the lens holder 100 is fixed to the circuit board 300, the photosensitive area of ​​the photosensitive chip 320, that is, the area on the upper surface of the photosensitive chip 320 corresponding to the lens mounting hole 111, will be surrounded by the light shielding portion 130, and the light shielding portion 130 will completely block the light from the above gap, thereby preventing stray light from irradiating the photosensitive area of ​​the photosensitive chip 320. It can be seen that the lens holder 100 in the embodiment of the present application can not only reduce the size and realize the miniaturization of the camera module without reducing the area of ​​the photosensitive chip 320 and the number of electronic components 310, but also prevent stray light from irradiating the photosensitive chip 320.

[0039] There are many ways for the light shielding portion 130 to surround the light sensing area of ​​the light sensing chip 320, for example: Figure 5As shown, the projection of the light shielding portion 130 on the horizontal plane falls into the projection of the photosensitive chip 320 on the horizontal plane, and the distance between the bottom surface of the light shielding portion 130 and the bottom surface of the supporting portion 120 is equal to the thickness of the photosensitive chip 320. That is to say, after the lens holder 100 is fixed to the circuit board 300, the bottom surface of the light shielding portion 130 just contacts the edge of the photosensitive chip 320. For example, the photosensitive chip 320 is electrically connected to the circuit board 300 through the gold wire 500, and the light shielding portion 130 is located directly above the end of the gold wire 500 connected to the photosensitive chip 320. Since the distance between the bottom surface of the light shielding portion 130 and the bottom surface of the supporting portion 120 is equal to the thickness of the photosensitive chip 320, as shown in FIG. Figure 5 As shown, after the lens holder 100 is fixed to the circuit board 300, the bottom surface of the light shielding portion 130 just extends to the end where the gold wire 500 is connected to the photosensitive chip 320. In order to reduce the contact area between the light shielding portion 130 and the photosensitive chip 320, and thereby reduce the risk of the light shielding portion 130 scratching the photosensitive chip 320, the bottom surface of the light shielding portion 130 is a slope. The slope can be inclined upward from the side away from the lens mounting hole 111 to the side adjacent to the lens mounting hole 111, that is, the slope is gradually expanded in the direction away from the bottom surface 113 of the body; of course, the slope can also be inclined downward from the side away from the lens mounting hole 111 to the side adjacent to the lens mounting hole 111, that is, the slope is gradually contracted in the direction away from the bottom surface 113 of the body. Mode 2: The projection of the light shielding portion 130 on the horizontal plane is located outside the projection of the photosensitive chip 320 on the horizontal plane. In this case, the distance between the bottom surface of the light shielding portion 130 and the bottom surface of the supporting portion 120 is equal to or less than the thickness of the photosensitive chip 320. For example, the light shielding portion 130 is located directly above the end where the gold wire 500 is connected to the circuit board 300. If the distance between the bottom surface of the light shielding portion 130 and the bottom surface of the supporting portion 120 is zero, then after the lens holder 100 is fixed to the circuit board 300, the bottom surface of the light shielding portion 130 just extends to the end where the gold wire 500 is connected to the circuit board 300; if the distance between the bottom surface of the light shielding portion 130 and the bottom surface of the supporting portion 120 is greater than zero and less than the thickness of the photosensitive chip 320, then after the lens holder 100 is fixed to the circuit board 300, the light shielding portion 130 is suspended above the gold wire 500. Of course, the light shielding portion 130 can also be located at any other position between the supporting portion 120 and the lens mounting hole 111, as long as it can surround the photosensitive area of ​​the photosensitive chip 320. It should be noted that the “horizontal plane” in this embodiment refers to the plane parallel to the surface of the circuit board 300 when the circuit board 300 is placed horizontally after the lens holder 100 is fixed to the circuit board 300 .

[0040] In order to further reduce the size of the mirror base 100 in the horizontal direction, the support portion 120 extends and protrudes from the edge of the bottom surface 113 of the body. The support portion 120 can be arranged around the light shielding portion 130. The projection of the notch 121 of the support portion 120 in the horizontal plane covers the projection of the electronic component 310 in the horizontal plane, that is, after the mirror base 100 is fixed to the circuit board 300, the electronic component 310 is completely inserted into the support portion 120 of the mirror base 100. The advantage of such a setting is that, when the projection area of ​​the photosensitive chip 320, the electronic component 310 and the mirror base 100 in the horizontal direction remains unchanged, the contact area of ​​the support portion 120 with the circuit board 300 and the electronic component 310 can be increased, thereby improving the firmness of the support portion 120 on the circuit board 300.

[0041] In order to facilitate installation and avoid damage to the electronic component 310, the volume of the notch 121 is larger than the volume of the electronic component 310. The projection shape of the notch 121 on the horizontal plane and / or the vertical plane may be, but is not limited to, circular, elliptical, polygonal or irregular. For example, the notch 121 is a rectangular through hole whose projection shapes on the horizontal plane and the vertical plane are both rectangular, and at least one of the length, width and height of the notch 121 is larger than the corresponding size parameter of the electronic component 310. The following is an example in which the notch 121 is a rectangular through hole whose length, width and height are all larger than the corresponding size parameters of the electronic component 310 to illustrate the installation method of the mirror holder 100 on the circuit board 300:

[0042] like Figure 6As shown, if there are multiple electronic components 310, the upper surface of the electronic component 310 and the board surface of the circuit board 300 located between two adjacent electronic components 310 are both adhesive coating areas 301. During installation: first, thermosetting adhesive is coated on the surface of the electronic component 310 and the board surface of the circuit board 300 located between adjacent electronic components 310. In view of the fact that the length, width and height of the notch 121 are all greater than the corresponding size parameters of the electronic component 310, there is a certain gap between the electronic component 310 and the inner wall of the notch 121 after the electronic component 310 is inserted into the notch 121. Therefore, in order to fill the gap with thermosetting adhesive, the thickness of the thermosetting adhesive coated on the surface of the electronic component 310 must be greater than the distance between the upper surface of the electronic component 310 and the upper surface of the notch 121. For example, if the distance between the upper surface of the electronic component 310 and the upper surface of the notch 121 is 50um, a thermosetting adhesive with a thickness of 150um can be coated on the surface of the electronic component 310. Then, after aligning the lens mounting hole 111 of the lens holder 100 with the photosensitive chip 320 and aligning the notch 121 of the lens holder 100 with the corresponding electronic component 310, the lens holder 100 is gradually moved closer to the circuit board 300 until the bottom surface of the support portion 120 is in close contact with the board surface of the circuit board 300. In this process, part of the thermosetting adhesive coated on the upper surface of the electronic component 310 flows into the gap between the side wall of the electronic component 310 and the notch 121 under the pressure of the upper surface of the notch 121. Finally, the lens holder 100 and the circuit board 300 can be baked. After baking, the inner wall of the notch 121 is bonded to the electronic component 310 through the thermosetting adhesive, and the part of the support portion 120 without the notch 121 is directly bonded to the board surface of the circuit board 300 through the thermosetting adhesive. Due to the existence of the shading portion 130 , even if the thermosetting adhesive does not completely fill the gap between the electronic component 310 and the notch 121 , the shading portion 130 can block stray light penetrating through the gap to prevent the stray light from irradiating the photosensitive area of ​​the photosensitive chip 320 .

[0043] Since the mirror base 100 can be fixedly connected to the circuit board 300 by means of the inner wall of the notch 121 and the portion of the support portion 120 where the notch 121 is not provided, the circuit board 300 does not need to reserve a glue coating area on the periphery of the electronic component 310. Therefore, when the width of the projection of the notch 121 on the horizontal plane is greater than the width of the electronic component 310 on the horizontal plane, the distance between the outer edge of the support portion 120 and the outer edge of the electronic component 310 may be no greater than 0.1 mm, thereby further reducing the size of the mirror base 100 in the horizontal direction.

[0044] In addition, the embodiment of the present application further provides a lens assembly, which includes a lens 200 and the above-mentioned lens holder 100, and the lens 200 is installed in the lens mounting hole 111 of the lens holder 100. Among them, the lens 200 can be fixed in the lens mounting hole 111 by a detachable connection method such as a threaded connection or a snap-on connection, but is not limited to it. For example, the inner wall of the lens mounting hole 111 is formed with an internal thread, and the outer wall of the lens 200 is formed with an external thread that matches the internal thread. By adopting the above-mentioned lens holder 100, the lens assembly in the embodiment of the present application can not only reduce the size and realize the miniaturization of the camera module without reducing the area of ​​the photosensitive chip 320 and the number of electronic components 310, but also prevent stray light from irradiating the photosensitive chip 320.

[0045] The lens assembly further includes a filter 400 disposed opposite to the lens 200, and the filter 400 is disposed on the side of the lens 200 facing the bottom surface 113 of the body. The filter 400 can be fixed in the lens mounting hole 111 to reduce the size of the entire lens assembly along the optical axis direction of the lens 200. Of course, the filter 400 can also be fixed in the space formed by the inner side wall of the support portion 120. In order to facilitate maintenance and replacement, the filter 400 can also be detachably connected to the lens holder 100 by means of threaded connection or clamping.

[0046] As shown in Figure 3 Figure 7 As shown, the embodiment of the present application further provides a camera module, which includes a circuit board 300 and the above-mentioned lens assembly; wherein, the board surface of the circuit board 300 is mounted with electronic components 310 and a photosensitive chip 320 corresponding to the lens mounting hole 111, and the support portion 120 of the lens assembly is fixed to the circuit board 300. By adopting the above-mentioned lens assembly, the camera module in the embodiment of the present application can not only reduce the size without reducing the area of ​​the photosensitive chip 320 and the number of electronic components 310, and realize the miniaturization of the camera module, but also prevent stray light from irradiating the photosensitive chip 320.

[0047] Since the lens holder 100 can be fixedly connected to the circuit board 300 by means of the inner wall of the notch 121 and the part of the support part 120 where the notch 121 is not provided, the circuit board 300 does not need to reserve a glue coating area on the periphery of the electronic component 310, so the distance between the edge of the circuit board 300 and the outer edge of the electronic component 310 is not greater than 0.1 mm, and the outer side wall of the support part 120 is flush with the edge of the circuit board 300. After calculation, compared with the situation where the circuit board 300 needs to reserve an additional 0.3 mm glue coating area on the side of the electronic component 310 facing away from the photosensitive chip 320, the embodiment of the present application can reduce the area of ​​the circuit board 300 by 16.4%. Of course, when the distance between the edge of the circuit board 300 and the outer edge of the electronic component 310 is equal to zero, the edge of the circuit board 300, the outer edge of the electronic component 310 and the outer side wall of the support part 120 are exactly flush.

[0048] The above specific implementations do not constitute a limitation on the protection scope of this application. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of this application should be included in the protection scope of this application.

Claims

1. A mirror holder, characterized in that: include: A body having a top surface, a bottom surface opposite to the top surface, and a lens mounting hole extending from the top surface to the bottom surface; as well as The supporting portion and the light shielding portion both extend and protrude from the bottom surface of the body along a direction from the top surface of the body to the bottom surface of the body, wherein the light shielding portion surrounds the lens mounting hole, and the supporting portion is located outside the light shielding portion; Wherein, a notch penetrating through the side wall of the support portion is formed at the lower edge of the support portion, and the notch is used to accommodate electronic components; and The distance between the bottom surface of the shading portion and the bottom surface of the supporting portion is no greater than the thickness of the photosensitive chip corresponding to the lens mounting hole.

2. The mirror holder according to claim 1, wherein: The projection of the light-shielding portion on the horizontal plane falls into the projection of the photosensitive chip on the horizontal plane, and the distance between the bottom surface of the light-shielding portion and the bottom surface of the supporting portion is equal to the thickness of the photosensitive chip.

3. The mirror holder according to claim 2, wherein: The bottom surface of the light shielding portion is an inclined surface.

4. The mirror holder according to claim 1, wherein: The projection of the light shielding portion on the horizontal plane is located outside the projection of the photosensitive chip on the horizontal plane.

5. The mirror mount according to any one of claims 1 to 4, wherein: The support portion extends and protrudes from an edge of the bottom surface of the body.

6. The mirror mount according to any one of claims 1 to 4, wherein: The projection of the notch on the horizontal plane covers the projection of the electronic component on the horizontal plane.

7. A lens assembly, characterized in that: The lens assembly comprises: Lenses; and The mirror holder according to any one of claims 1 to 6; Wherein, the lens is installed in the lens installation hole of the lens holder.

8. A camera module, characterized in that: The camera module comprises: Circuit boards; and The lens assembly as claimed in claim 7; The electronic components and the photosensitive chip corresponding to the lens mounting hole are installed on the surface of the circuit board, and the supporting part of the lens assembly is fixed to the circuit board.

9. The camera module according to claim 8, wherein: The outer side wall of the support portion is flush with the edge of the circuit board, and the distance between the edge of the circuit board and the outer edge of the electronic component is no more than 0.1 mm.

10. The camera module according to claim 8, wherein: There are multiple electronic components, and the upper surfaces of the electronic components and the board surface of the circuit board between two adjacent electronic components are both adhesive coating areas.

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