Substrate with buried copper block thermoelectric separation structure and manufacturing method thereof

Abstract

The present invention belongs to the technical field of printed circuit boards, and in particular relates to a substrate with a buried copper block thermoelectric separation structure and a manufacturing method thereof, including a glass fiber substrate and a copper block. An installation inner groove for embedding and placing the copper block is provided on the glass fiber substrate. A plurality of reinforcing half holes are evenly provided on the glass fiber substrate at the forming line position corresponding to the installation inner groove. A plurality of PTH holes are provided at the junction of the forming line position of the glass fiber substrate corresponding to the installation inner groove and the outer side of the copper block. Step grooves are etched on both the upper and lower side edges of the copper block. The outer sides of the glass fiber substrate and the copper block corresponding to the step grooves are filled with prepregs. Copper-free light boards are provided on both the upper and lower sides of the copper block. The present invention enhances the bonding force between the glass fiber substrate and the copper block, effectively improves the connection strength between the glass fiber substrate and the copper block, and improves the use stability of the entire glass fiber substrate.

Description

Technical Field

[0001] The present invention belongs to the technical field of printed circuit boards, and particularly relates to a substrate with a buried copper block thermoelectric separation structure and a manufacturing method thereof. Background Art

[0002] At present, the buried copper plates on the market are mainly applied to high heat dissipation scenarios. There are significant differences in the temperature coefficients between the copper blocks and the glass fiber boards, which often result in low bonding force between them after high temperature, and problems such as board explosion failure. At the same time, when there are differences in height and pressure between the thickness of the copper block and the thickness of the substrate, it is easy to cause pressure loss during lamination and poor bonding force.

[0003] Therefore, we propose a substrate with a buried copper block thermoelectric separation structure and a manufacturing method thereof to solve the above problems. Summary of the Invention

[0004] The purpose of the present invention is to provide a substrate with a buried copper block thermoelectric separation structure and a manufacturing method thereof for the above problems.

[0005] To achieve the above object, the present invention provides the following technical solution: A substrate with a buried copper block thermoelectric separation structure includes a glass fiber substrate and a copper block. An installation inner groove for embedding and placing the copper block is provided on the glass fiber substrate. A plurality of reinforcing half holes are evenly provided at the forming line position of the installation inner groove on the glass fiber substrate. A plurality of pth holes are provided at the junction of the forming line position of the installation inner groove on the glass fiber substrate and the outer side of the copper block. Step grooves are etched on both the upper and lower side edges of the copper block. The outer sides of the glass fiber substrate and the copper block corresponding to the step grooves are filled with prepregs. Copper-free light boards are provided on both the upper and lower sides of the copper block.

[0006] In the above substrate with a buried copper block thermoelectric separation structure, the material of the glass fiber substrate is selected with a TG value greater than 150 degrees.

[0007] In the above substrate with a buried copper block thermoelectric separation structure, the copper block and the installation inner groove are in a small clearance fit, that is, the outer shape of the copper block is +0 / -0.1mm, and the installation inner groove of the glass fiber substrate is +0.1 / -0mm.

[0008] In the above substrate with a buried copper block thermoelectric separation structure, the reinforcing half holes are provided at intervals of 5 - 10mm, and the diameter is 0.5 - 0.8mm.

[0009] In the above substrate with a buried copper block thermoelectric separation structure, the diameter of the pth hole is 1 - 2mm, and the pth holes are distributed according to the center of gravity distribution points of the copper block outer shape space.

[0010] In the above substrate with a buried copper block thermoelectric separation structure, the thickness of the copper-free light board is 0.5 - 1mm.

[0011] A manufacturing method of a substrate with a buried copper block thermoelectric separation structure, comprising the following steps:

[0012] S1. Cut a double-sided copper clad laminate with a suitable thickness, drill positioning holes, and strengthen half-holes at the installation inner groove positions of the buried copper blocks. Perform pretreatment, including wet film coating, pre-baking, exposure, development, etching, stripping, and routing, where routing is performed corresponding to the positions of the copper blocks;

[0013] S2. Cut copper blocks. The thickness of the copper blocks is the same as that after lamination with the fiberglass board. Drill reference holes, coat wet film on both sides, pre-bake, expose, and develop. Perform controlled-depth etching of 0.10 mm without stripping. Laser cut the copper blocks based on the holes. To facilitate the copper blocks to pass through the brownification process, a small built-in concave connection position is reserved at the outer shape of the copper blocks for convenient board separation;

[0014] S3. Cut suitable prepregs, drill reference holes, and route the positions of the protruding parts of the copper blocks;

[0015] S4. Cut a suitable copper-free light board with a thickness controlled within 0.5 - 1 mm, route holes at the boss positions of the copper blocks, with the same size as the routed positions of the prepregs;

[0016] S5. Brownify the fiberglass substrate and the copper blocks. Place the separated brownified copper blocks in the routed positions of the fiberglass substrate, add prepregs with routed holes above and below, place copper foils above and below, align the copper foils above and below with the copper-free light board with routed holes, and then perform lamination;

[0017] S6. After lamination, drill targets, perform pretreatment, coat wet film, pre-bake, align, expose, develop, etch, then strip, then drill holes, deposit copper, transfer patterns, plate copper and tin, strip, etch, strip tin, perform AOI, apply solder mask, print text, perform surface treatment, perform shaping, perform testing, perform appearance inspection, and perform packaging to complete the manufacture of the substrate.

[0018] Compared with the prior art, the present invention provides a substrate with a buried copper block thermoelectric separation structure and its manufacturing method, having the following beneficial effects:

[0019] The substrate with the buried copper block thermoelectric separation structure is composed of a glass fiber substrate, a copper block, an installation inner groove, a reinforced half hole, a PTH hole, a stepped groove, a prepreg, and a copper-free light board. The material of the glass fiber substrate is selected with a TG value greater than 150 degrees, effectively ensuring thermal stability. The outer shape of the copper block and the installation inner groove of the glass fiber substrate are in a small clearance fit, ensuring that there is a certain space for the resin in the prepreg to fully fill the space between them. At the same time, a reinforced half hole with a diameter of 0.5 - 0.8 mm is drilled at intervals of 5 - 10 mm at the forming line position of the glass fiber substrate corresponding to the installation inner groove, facilitating the resin in the prepreg to fully fill the device and effectively increasing the bonding force. At the same time, based on the design of the center of gravity distribution points of the outer shape space of the copper block on the inner and outer layers of the glass fiber substrate and the copper block, multiple PTH holes are set at appropriate positions at the junction of the two materials, playing a role similar to riveting and further increasing the installation bonding force. A certain depth of double-sided etching is performed on the edge of the copper block to form a stepped groove, enabling the inner side of the copper block to overlap with the hollowed prepreg, and forming a resin glass fiber coating up and down, enhancing the bonding force between the glass fiber substrate and the copper block. A reusable copper-free light board is configured on each of the upper and lower sides of the copper block and stacked on the upper and lower copper foils of the board to be laminated during lamination, ensuring that the lamination steel plate will not be lifted by the protruding part of the copper block higher than the glass fiber substrate, causing pressure loss, and ensuring the bonding force around the protruding part of the copper block, effectively improving the connection strength between the glass fiber substrate and the copper block and enhancing the use stability of the entire glass fiber substrate.

[0020] In summary, the present invention enhances the bonding force between the glass fiber substrate and the copper block, effectively improves the connection strength between the glass fiber substrate and the copper block, and enhances the use stability of the entire glass fiber substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a top view structural schematic diagram of the substrate with the buried copper block thermoelectric separation structure proposed by the present invention;

[0022] Figure 2 is a partial side view cross-sectional structural schematic diagram of the substrate with the buried copper block thermoelectric separation structure proposed by the present invention.

[0023] In the figure: 1. Glass fiber substrate; 2. Copper block; 3. Installation inner groove; 4. Reinforced half hole; 5. PTH hole; 6. Stepped groove; 7. Prepreg; 8. Copper-free light board; 9. Wet film. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] The following embodiments are only for illustrative purposes and are not intended to limit the scope of the present invention.

[0025] Please refer to Figure 1-2, a substrate with a buried copper block thermoelectric separation structure, comprising a glass fiber substrate 1 and a copper block 2. An installation inner groove 3 for embedding and placing the copper block 2 is formed on the glass fiber substrate 1. A plurality of reinforcing half holes 4 are evenly formed at the forming line position of the installation inner groove 3 on the glass fiber substrate 1. A plurality of pth holes 5 are arranged at the junction of the forming line position of the installation inner groove 3 on the glass fiber substrate 1 and the outer side of the copper block 2. Step grooves 6 are etched on both the upper and lower side edges of the copper block 2. The glass fiber substrate 1 and the copper block 2 are filled with prepreg 7 on the outer sides corresponding to the step grooves 6. Non-copper clad laminates 8 are provided on both the upper and lower sides of the copper block 2.

[0026] The material of the glass fiber substrate 1 is selected with a TG value greater than 150 degrees.

[0027] The copper block 2 and the installation inner groove 3 are in a small clearance fit, that is, the outer shape of the copper block 2 is +0 / -0.1mm, and the installation inner groove 3 of the glass fiber substrate 1 is +0.1 / -0mm.

[0028] The reinforcing half holes 4 are arranged at intervals of 5 to 10 mm, and the diameter is 0.5 to 0.8 mm.

[0029] The diameter of the pth holes 5 is 1 to 2 mm, and the pth holes 5 are arranged according to the center of gravity distribution points of the outer shape space of the copper block 2.

[0030] The thickness of the non-copper clad laminate 8 is 0.5 to 1 mm.

[0031] The operating principle of the present invention is described as follows: Drill positioning holes in a double-sided copper clad laminate with an appropriate thickness, and embed the reinforcing half holes 4 at the position of the installation inner groove 3 of the copper block 2. Perform pre-treatment, including wet film 9 coating, pre-baking, exposure, development, etching, stripping, and routing, where routing is performed corresponding to the position of the copper block 2; Cut the copper block 2, the thickness of the copper block 2 is the same as that after laminating with the fiberglass board, drill reference holes, coat the wet film 9 on both sides, pre-bake, expose, and develop, perform controlled-depth etching of 0.10 mm, without stripping, and perform laser cutting on the copper block 2 with the holes as the reference. To facilitate the brownification of the copper block 2, a small internal concave connection position is reserved at the outer shape of the copper block 2 to facilitate board separation; Cut an appropriate prepreg 7, drill reference holes and route the position of the protruding part of the copper block 2; Cut an appropriate copper-free light board 8 with a thickness controlled within 0.5 - 1 mm, route the boss position of the copper block 2, with the same size as the routed position of the prepreg 7; Brownify the fiberglass substrate 1 and the copper block 2, place the separated copper block 2 after brownification in the routed position of the fiberglass substrate 1, add the prepreg 7 with routed holes on the upper and lower sides, place copper foils on the upper and lower sides, place the copper-free light boards 8 with aligned routed holes on the upper and lower sides of the copper foils, and then perform lamination; After lamination, drill targets, perform pre-treatment, coat the wet film 9, pre-bake, align, expose, develop, etch, then perform stripping, then perform drilling, copper plating, pattern transfer, copper-tin plating, stripping, etching, tin stripping, AOI, solder mask, text, surface treatment, shaping, testing, appearance inspection, and packaging to complete the manufacture of the substrate. Through the provided fiberglass substrate 1, copper block 2, installation inner groove 3, reinforcing half holes 4, pth holes 5, stepped grooves 6, prepreg 7, and copper-free light board 8, the material selection of the fiberglass substrate 1 has a TG value greater than 150 degrees, effectively ensuring thermal stability. The outer shape of the copper block 2 and the installation inner groove 3 of the fiberglass substrate 1 have a small clearance fit, ensuring that there is a certain space for the resin in the prepreg 7 to fully fill the space between them. At the same time, at the forming line position of the fiberglass substrate 1 corresponding to the installation inner groove 3, reinforcing half holes 4 with a diameter of 0.5 - 0.8 mm are drilled at intervals of 5 - 10 mm, facilitating the resin in the prepreg 7 to fully fill the device and effectively increasing the bonding force. At the same time, based on the design of the center of gravity distribution point of the outer shape space of the copper block 2 on the inner and outer layers of the fiberglass substrate 1 and the copper block 2, multiple pth holes 5 are set at appropriate positions at the junction of the two materials, playing a role similar to riveting and further increasing the installation bonding force. Etch a certain depth on both sides of the edge of the copper block 2 to form stepped grooves 6, so that the inner side of the copper block 2 overlaps with the prepreg 7 with routed holes, and resin fiberglass coating is formed on the upper and lower sides, enhancing the bonding force between the fiberglass substrate 1 and the copper block 2. One reusable copper-free light board 8 is configured on each of the upper and lower sides of the copper block 2 and stacked on the upper and lower copper foils of the board to be laminated, ensuring that the pressing steel plate will not be lifted by the protruding part of the copper block 2 higher than the fiberglass substrate 1 to cause pressure loss, ensuring the bonding force around the protruding part of the copper block 2, effectively improving the connection strength between the fiberglass substrate 1 and the copper block 2, and improving the use stability of the entire fiberglass substrate 1.

[0032] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A substrate with a thermoelectric separation structure of buried copper blocks, comprising a glass fiber substrate (1) and copper blocks (2), characterized in that: An installation inner groove (3) for embedding and placing a copper block (2) is formed on the glass fiber substrate (1). A plurality of reinforcing half-holes (4) are evenly formed in the glass fiber substrate (1) at the forming line position corresponding to the installation inner groove (3). A plurality of pth holes (5) are arranged at the junction of the forming line position of the glass fiber substrate (1) corresponding to the installation inner groove (3) and the outer side of the copper block (2). Step grooves (6) are etched on both the upper and lower side edges of the copper block (2). The glass fiber substrate (1) and the copper block (2) are filled with prepregs (7) on the outer sides corresponding to the step grooves (6). Copper-free light boards (8) are provided on both the upper and lower sides of the copper block (2). The material of the glass fiber substrate (1) is selected with a TG value greater than 150 degrees. The copper block (2) and the installation inner groove (3) are in a small clearance fit, that is, the outer shape of the copper block (2) is +0 / -0.1mm, and the installation inner groove (3) of the glass fiber substrate (1) is +0.1 / -0mm. The reinforcing half-holes (4) are arranged at intervals of 5 to 10 mm, and the diameter is 0.5 to 0.8 mm. The diameter of the pth holes (5) is 1 to 2 mm. The pth holes (5) are distributed according to the center of gravity distribution points of the outer shape space of the copper block (2). The thickness of the copper-free light board (8) is 0.5 to 1 mm.

2. The manufacturing method of the substrate with a buried copper block thermoelectric separation structure according to claim 1, characterized in that: It includes the following steps: S1. Cut a double-sided copper clad laminate with a suitable thickness to drill positioning holes, embed the reinforcing half-holes (4) at the position of the installation inner groove (3) of the copper block (2), and perform pretreatment, including wet film (9) coating, pre-baking, exposure, development, etching, stripping, and routing, where the routing is performed corresponding to the position of the copper block (2); S2. Cut the copper block (2), the thickness of the copper block (2) is the same as that after lamination with the glass fiber board, drill reference holes, coat the wet film (9) on both sides, pre-bake, expose, and develop, perform controlled-depth etching of 0.10 mm, without stripping, and perform laser cutting of the copper block (2) based on the holes. To facilitate the brownification of the copper block (2), a small internal concave connection position is reserved at the outer shape of the copper block (2) for convenient board separation; S3. Cut a suitable prepreg (7), drill reference holes and route the protruding parts of the copper block (2); S4. Cut a suitable copper-free light board (8) with a thickness controlled within 0.5 to 1 mm, route the boss positions of the copper block (2), and the routed positions are the same size as those of the prepreg (7); S5. Brownify the glass fiber substrate (1) and the copper block (2), place the separated copper block (2) after brownification in the routed position of the glass fiber substrate (1), add the routed prepregs (7) above and below, place copper foils above and below, place the copper-free light boards (8) with routed holes aligned above and below the copper foils, and then perform lamination; S6. After lamination, drill targets, perform pretreatment, coat the wet film (9), pre-bake, align, expose, develop, etch, then perform stripping, then perform drilling, copper deposition, pattern transfer, copper-tin plating, stripping, etching, tin stripping, AOI, solder mask, text, surface treatment, forming, testing, appearance inspection, and packaging to complete the substrate manufacturing.

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