A method and system for measuring the dimensions of bonding wires in the radio frequency channel of a multi-chip component

Abstract

This invention discloses a method and system for measuring the dimensions of bonding wires in the radio frequency (RF) channel of a multi-chip component, belonging to the field of integrated circuit packaging. The measurement system includes a measurement system control module, a working platform, a motion module, a vision module, and probe and sensor modules. Based on this measurement system, a measurement method is proposed, including: Step S1: Establishing a standard measurement model for the bonding wire dimensions; Step S2: Preparing and confirming the part to be measured; Step S3: Editing the measurement program; Step S4: Executing the measurement program; Step S5: Generating a measurement result report. This invention can significantly improve the reliability and efficiency of measurement results, helping to enhance the quality control capabilities of the gold wire bonding production process in the RF channel of multi-chip components and shorten the RF channel production cycle.

Description

Technical Field

[0001] This invention belongs to the field of integrated circuit packaging and relates to a method for measuring the size of bonding wires, specifically a method and system for measuring the size of bonding wires in the radio frequency channel of a multi-chip assembly. Background Technology

[0002] The statements in this section are provided only as background information in relation to this disclosure and may not constitute prior art.

[0003] A multi-chip module (MCM) is a microelectronic component that assembles bare chips, discrete components, and other parts onto a high-density interconnect substrate, interconnects them, and packages them to achieve specific functions. It is characterized by high density, high performance, and high reliability, and is a core component in electronic products such as navigation devices, automotive radars, signal receivers / transmitters, and phased array antennas, responsible for electromagnetic signal reception, transmission, and processing. The radio frequency channel (RF Channel) is a core component of the MCM, and its performance has a decisive impact on the performance indicators and reliability of electronic products. A typical RF Channel (NB) usually consists of various chips, circuit boards, transmission lines, passive components such as resistors, inductors, and capacitors. The signal connections between these components are typically achieved through gold wire bonding, making the quality and effectiveness of the gold wire bonding crucial to the performance of the RF Channel.

[0004] Please see Figure 2-1 , Figure 2-2 , Figure 2-3 , Figure 2-4 Simulations were performed on the bonding wire dimensional parameter H2, ranging from 50 micrometers to 150 micrometers in 50-micrometer increments. Simulation curves showed that, with other parameters fixed, H2 gradually decreased from 150 micrometers to 50 micrometers while the 18GHz–40GHz band was maintained. Figure 2-1 The standing wave ratio also changed from 1.44 to 1.22. Figure 2-2 Insertion loss decreased from 0.38 dB to 0.27 dB. Simulations were performed on the bonding wire dimension parameter D, with a simulation range of 200 μm–400 μm and a step size of 50 μm. The simulation results show that, with other parameters fixed, as D gradually decreased from 400 μm to 200 μm, the standing wave ratio (SWR) at 18 GHz–40 GHz also changed from 1.59 to 1.32. Figure 2-3 Insertion loss changed from 0.48 dB to 0.32 dB. Figure 2-4 Therefore, simulation and experimental results show that the dimensions of the gold wire bonding have a decisive influence on the quality and effect of gold wire bonding.

[0005] Therefore, in actual production, it is necessary to master reliable and efficient gold wire bonding size detection technology to ensure accurate evaluation and reliable optimization of the quality and effect of gold wire bonding, thereby ensuring the performance and reliability of the radio frequency channel and better supporting the production and application of electronic products.

[0006] Chinese patent CN216348358 U discloses a touch-alarm detection device for measuring the straightness of nickel-titanium alloy wire, improving measurement efficiency and enhancing detection accuracy. Chinese patent CN215004761U discloses a detection device for platinum wire, solving the problem of time-consuming and labor-intensive traditional detection methods. Chinese patent CN113570550 A discloses a method for detecting the bonding dimensions of gold wire based on three-dimensional point clouds and mathematical algorithms, aiming to solve the problem of automated detection of gold wire bonding dimensions for automated detection of gold wire morphology features. These patents demonstrate that contact measurement and three-dimensional optical measurement can improve measurement efficiency and detection accuracy in the detection of the size and morphology of gold or alloy wires. These patents show that it is feasible to use contact and optical methods combined with mathematical algorithms for detecting filamentous metal materials, even gold wire.

[0007] Typically, gold wire bonding within the RF channel is manufactured using automated gold wire bonding equipment, resulting in high production efficiency, speed, and a large number of gold wires bonded with high density and diverse bonding structures. Furthermore, measuring the bonding wires using optical methods presents a challenge: in the gold wire bonding of the RF channel (NB), the gold wires are typically bonded between chip pads, between chip pads and chip pads, and between chip pads. To improve RF signal transmission performance, gold plating is commonly used for the surface metal of the pads, and numerous circuit patterns on the chip and chip surfaces are also gold-plated. The gold surface layer formed by the above-mentioned gold plating process has high purity. The background color of the pads and circuit patterns usually has very little contrast with the color of the gold wire. Optical measurement methods face significant challenges in terms of image acquisition speed, accuracy, and completeness. Even with high-performance image acquisition systems and powerful image analysis algorithms, it is difficult to achieve dimensional measurement of NB gold wire bonding in the RF channel. This is the focus and difficulty of research on dimensional measurement technology of gold wire bonding in the RF channel in the industry, and it also greatly restricts the application scenarios and potential of AOI (Automated Optical Inspection) equipment in the measurement and inspection of gold wire bonding in the RF channel. The method for measuring the dimensional of bonding wire needs to be able to adapt well to the optical and other physical characteristics of the bonding wire and its bonding environment.

[0008] Therefore, it is necessary to propose a technical means for measuring the size of bonding wires in the RF channel of multi-chip components, taking into account the characteristics and requirements of bonding wire size measurement, in order to solve the problems of high complexity, good timeliness requirements and difficulty in optical detection applications in bonding wire size measurement. Summary of the Invention

[0009] The purpose of this invention is to address the problems existing in the prior art and, based on the technical characteristics of gold wire bonding production in the RF channel of multi-chip components, provide a method and system for measuring the size of bonding wires in the RF channel of multi-chip components. This method and system can be used to reliably and efficiently measure the size of bonding wires in the RF channel of multi-chip components, significantly improving the quality control capability of the gold wire bonding production process and shortening the product production cycle. It solves the problems of high complexity in bonding wire size measurement, high timeliness requirements, and difficulty in optical detection applications.

[0010] The technical solution of the present invention is as follows:

[0011] A multi-chip component RF channel internal bonding wire dimension measurement system includes:

[0012] The measurement system control module is used to edit the measurement program, drive the rest of the system to execute the measurement program, and analyze the measurement results of the received electrical and force signals to generate a measurement report.

[0013] A work platform, which is used to place the workpiece to be measured, install the motion module and other parts included in the system;

[0014] The motion module is used to execute the motion actions set in the measurement program under the drive of the measurement system control module, so that the probe moves to the designated point according to the specified speed and accuracy requirements;

[0015] The vision module is used to acquire image information and height information within the bonding wire area of ​​the workpiece to be measured.

[0016] The probe and sensor module is used to contact the bonding wire in the workpiece under the drive of the measurement system control module and the control of the motion module, to acquire the mechanical and electrical signals after contact and feed them back to the measurement system control module.

[0017] Furthermore, the measurement system control module includes: a host computer, a slave computer, a communication line, a computer program, and a data output interface;

[0018] The motion includes motion with three degrees of freedom: X, Y, and Z; the motion action includes: measuring the movement and stopping of the probe, and feeding back the XYZ coordinate data during the movement and stopping of the probe;

[0019] The vision module includes: a light source, an industrial camera, image analysis software, and a laser height measuring instrument;

[0020] The probe and sensor module includes: a probe support, a probe, a force sensor, and an ammeter.

[0021] Furthermore, the acquisition and feedback methods for force and electrical signals are as follows:

[0022] Step A: Before the probe comes into contact with the bonding wire, the force sensor has no sensing signal, while the ammeter has signal A1;

[0023] Step B: Once the probe comes into contact with the bonding wire, the force sensor senses the force signal, and the ammeter reading will change from A1 to A2.

[0024] Step C: When the measurement system control module receives one or both of the force signal and the electrical signal change signal, it immediately controls the motion mechanism to stop moving and records the probe's XYZ coordinate data, using this data as the position of a point in the shape of the bonding wire curve;

[0025] Step D: After recording is completed, guided by the image module, measure the next point along the extension direction of the bonding wire, and then begin steps B and C.

[0026] A method for measuring the size of bonding wires within the RF channel of a multi-chip component, based on the aforementioned system for measuring the size of bonding wires within the RF channel of a multi-chip component, includes:

[0027] Step S1: Establish a standard measurement model for the dimensions of the bonding wire;

[0028] Step S2: Preparation and confirmation of the part to be measured;

[0029] Step S3: Edit the measurement program;

[0030] Step S4: Execute the measurement procedure;

[0031] Step S5: Measurement result report generated.

[0032] Furthermore, the bonding wire includes: two pads and a gold wire formed between the two pads by a gold wire bonding process;

[0033] The standard measurement model refers to the requirement to output results in a preset format after each measurement. The results include: a list of geometric parameters of the gold wire shape, a curve fitting function for the gold wire shape, and the coordinate values ​​of each point within the curve.

[0034] The list of geometric parameters for the gold wire shape includes:

[0035] The Z-axis height difference H0 between the horizontal plane where the highest point P of the bonding wire is located and the horizontal plane used for assembling chips, passive devices, and circuit boards;

[0036] The Z-axis height difference H1 between the horizontal plane where the highest point P of the bonding wire is located and the horizontal plane where one of the pads is located;

[0037] The Z-axis height difference H2 between the horizontal plane where the highest point P of the bonding wire is located and the horizontal plane where another pad is located;

[0038] The straight-line distance D between the bonding wire solder joints on the two pads;

[0039] The height difference H3 between the two pad planes.

[0040] Further, step S2 includes:

[0041] Inspect the gold wire bonding quality of the part to be measured. The quality status includes: whether there is a cold solder joint, whether the gold wire arc has collapsed, whether there is a solder joint falling off, and whether there is a missing solder joint.

[0042] If the quality condition does not meet the quality inspection requirements, suspend the measurement and replace it with a piece that meets the quality inspection requirements;

[0043] The part to be measured, which meets the quality inspection requirements, is correctly placed in the measurement system.

[0044] Furthermore, the measurement program is used to drive the measurement system to execute and automatically complete all measurement actions;

[0045] The measurement procedure includes: setting the XYZ coordinate reference point, starting the task, identifying and locating Mark points in the XY plane under image recognition guidance, automatically calibrating the Z-axis height with laser positioning assistance, moving the measurement probe device under image guidance above the workpiece to be measured, taking pictures of the gold wire bonding area and performing image analysis, moving the measurement probe above the bonding wire, completing contact with the gold wire and acquiring and recording signals point by point along the extension direction of the gold wire in a step-by-step manner, confirming the completion of measurement data acquisition in the control software, returning the measurement probe to its original position, automatically generating a measurement report, and ending the measurement.

[0046] The device to be measured refers to the entire radio frequency channel or a part of the radio frequency channel that contains one or more bonding wire structures to be measured.

[0047] The point-by-point method refers to setting points along the extension direction of the gold wire by moving a certain distance, the certain moving distance being no more than 10 micrometers; the stepping method starts from one end of the bonding gold wire and ends at the other end, completing all measurements within the length range of the gold wire according to the set moving distance.

[0048] Further, step S3 includes:

[0049] Probe motion control commands;

[0050] Coordinate calibration command;

[0051] Image recognition and guidance instructions;

[0052] Commands for acquiring force and electrical signal change signals;

[0053] Automatic fitting command for the bonding wire curve based on the acquired measurement signal;

[0054] The editing of the measurement program is completed within the measurement system control module.

[0055] Furthermore, the execution of the measurement program involves calling the correct version of the measurement program corresponding to the part to be measured, driving the measurement system to start execution, acquiring measurement signals, determining the position information of each contact point, generating the shape of the bonding wire, and monitoring the measurement system to complete all the contents of the measurement program.

[0056] The drive measurement system is executed in the manner that the bonding wire size measurement should start from the lower end of the solder pad;

[0057] The measurement signal includes a force signal and an electrical signal. The measurement signal is acquired by driving the measurement probe to contact the bonding wire. After contact, there will be a certain action and reaction force between the wire and the probe, and the force signal is acquired. At the same time, the contact between the probe and the wire will cause a change in the electrical signal being transmitted in the wire, and the amount of change in the electrical signal is acquired.

[0058] The determination of the position information of each contact point includes: the motion control of the measuring probe is based on a calibrated XYZ coordinate system; the calibration of the XYZ coordinate system refers to specifying the XY reference plane and the reference point in the Z direction during the measurement program editing; the motion of the measuring probe is under program control, and each position has a precise XYZ coordinate value; when the probe contacts the gold wire according to the step set by the measurement program and senses a change in force or electrical signal, the XYZ coordinate value Li (Xi, Yi, Zi) of the probe position at that moment is recorded.

[0059] The parameters obtained in the execution of the measurement program include: obtaining the values ​​of H1, H2, and H3 through laser height measurement; obtaining the value of D through image analysis based on the acquired image of the part to be measured; obtaining the value of H3 by calculating the values ​​of H1 and H2; and obtaining the XYZ coordinate values ​​of each position point within the bonding wire curve by recording the probe position.

[0060] The generated bonding wire shape refers to the continuous numerical curve of the bonding wire generated by the computer program in the measurement system through mathematical algorithm fitting based on the obtained position information of the contact points.

[0061] Furthermore, the measurement report includes: measurement time, measurement personnel, and measurement part number, wherein the measurement time is automatically generated by the measurement system, and the measurement personnel and measurement part number are entered into the measurement system manually or by scanning a barcode; a gold wire bonding morphology image, which can be displayed and viewed in measurement diagram or top view mode; a list of gold wire bonding parameters, and the XYZ coordinate values ​​of each point that makes up the gold wire bonding morphology image.

[0062] Compared with existing technologies, the advantages of this invention are:

[0063] A method and system for measuring the dimensions of bonding wires in the radio frequency (RF) channel of a multi-chip component is provided. This method can significantly improve the reliability and efficiency of measurement results, and help improve the quality control capability of the RF channel bonding production process and shorten the RF channel production cycle. Attached Figure Description

[0064] Figure 1 A schematic diagram of a multi-chip component radio frequency channel bonding wire dimension measurement system is shown.

[0065] Figure 2-1 , Figure 2-2 , Figure 2-3 , Figure 2-4 Simulation results showing the effect of bonding wire size on RF channel performance are presented;

[0066] Figure 3 The standard model for measuring the bonding wire dimensions within the radio frequency channel as described in this invention and its measurement parameters are shown.

[0067] Figure 4 The probe's movement path during the measurement process is shown;

[0068] Figure 5 The structure of the probe and force sensor is shown;

[0069] Figure 6 This illustrates a measurement scenario where the probe is not in contact with the bonding wire during the measurement process;

[0070] Figure 7 This illustrates the measurement scenario where the probe comes into contact with the bonding wire during the measurement process;

[0071] Figure 8 A flowchart is shown for a method of measuring the size of bonding wires within the radio frequency channel of a multi-chip component. Detailed Implementation

[0072] It should be noted that relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0073] The features and performance of the present invention will be further described in detail below with reference to embodiments.

[0074] Example 1

[0075] Please see Figure 1-8 A multi-chip component RF channel internal bonding wire size measurement system, specifically comprising:

[0076] The measurement system control module is used to edit the measurement program, drive the rest of the system to execute the measurement program, and analyze the measurement results of the received electrical and force signals to generate a measurement report. Specifically, the measurement system control module is used to edit the measurement program for the workpiece, drive the various components of the system to execute the measurement program, analyze the measurement data, generate a measurement report, and output the measurement report. This measurement system control module can be implemented through a program to achieve steps S1-S6.

[0077] A working platform is used to place the workpiece to be measured, install the motion module and other parts included in the system, and ensure that no shaking or vibration occurs during the measurement process that may affect the measurement accuracy. Preferably, the placement of the workpiece includes: ① the area for placing the workpiece should be square; ② the fixing method of the workpiece includes, but is not limited to, adhesive bonding and mechanical fixing. That is, the working platform provides a stable working environment for the measurement execution process and eliminates factors such as vibration that may affect the measurement process. Preferably, the self-weight of the working platform should be more than 100 kg, and the optional materials of the working platform include, but are not limited to, marble and cast iron. The working platform can be achieved by machining to realize step S4.

[0078] The motion module is used to execute the motion actions set in the measurement program under the drive of the measurement system control module, so that the probe moves to the designated point according to the specified speed and accuracy requirements;

[0079] The vision module is used to acquire image information and height information within the bonding wire area of ​​the workpiece to be measured; including but not limited to... Figure 3 The parameter information shown refers to the position information acquired by the vision module during the bonding wire measurement process, including but not limited to: the XY plane position of the pad, the position information of the bonding wire in the XY plane, and the pad height information. The pad position is determined by acquiring the pad position in the XY plane and the position of the reference point in the XY plane. The position information of the bonding wire in the XY plane is determined by acquiring the wire position in the XY plane and the position of the reference point in the XY plane. The pad height information is determined by acquiring the Z-axis height of the pad and the Z-axis reference point height through laser height measurement. The vision module is used to guide the probe to a designated position and along a designated path. The designated position refers to the starting pad position, and the designated path refers to the straight line direction of the wire from the starting pad to another pad. Preferably, the vision module can be developed and implemented through an industrial vision system combined with certain programs. This module is used to implement step S04.

[0080] The probe and sensor module, driven by the measurement system control module and controlled by the motion module, contacts the bonding wire in the workpiece to be measured, acquires the mechanical and electrical signals after contact, and feeds them back to the measurement system control module. Specifically, the probe and sensor module contacts the bonding wire in the workpiece to acquire force and electrical signal changes during the measurement process, and transmits the acquired signals to the measurement system control module. This module can be implemented by selecting force sensors and ammeters that meet accuracy requirements, combined with a specific assembly process.

[0081] The optimized measurement system control module generates measurement report data in a format that is compatible with the enterprise's manufacturing execution system, process design system, and quality management system, enabling convenient transmission of measurement report data.

[0082] In this embodiment, specifically, the measurement system control module includes, but is not limited to: a host computer, a slave computer, a communication line, a computer program, and a data output interface;

[0083] The motion includes: motion with three degrees of freedom: X, Y, and Z; the motion action includes, but is not limited to: measuring the movement and stopping of the probe, and feeding back the XYZ coordinate data during the movement and stopping of the probe; preferably, the motion module has the following characteristics: ① motion positioning accuracy is better than 1 micrometer; ② it can record and feed back the position information of the motion process in real time; ③ it can move in a stepping manner with a stepping accuracy better than 5 micrometers;

[0084] The vision module includes, but is not limited to: a light source, an industrial camera, image analysis software, and a laser height measuring instrument;

[0085] The probe and sensor module includes: a probe support, a probe, a force sensor, and an ammeter; preferably, the force sensor should have a sensing accuracy better than 10. -4 Newton, the current measurement accuracy of the ammeter should be better than 10. -4 Ampere; the structure of the probe and force sensor module is as follows Figure 5 As shown, the force sensor is mounted on the probe support NB. The connection method between the force sensor and the probe support includes, but is not limited to, adhesive bonding and welding. The connection method between the force sensor and the probe includes direct connection or connection through a dielectric material. The shape of the probe includes, but is not limited to, spherical and conical shapes. The material selection for the probe includes, but is not limited to, metals and dielectric materials.

[0086] In this embodiment, the specific methods for acquiring and feeding back force and electrical signals are as follows:

[0087] Step A: Before the probe comes into contact with the bonding wire, the force sensor has no sensing signal, while the ammeter has signal A1;

[0088] Step B: Once the probe comes into contact with the bonding wire, the force sensor senses the force signal, and the ammeter reading will change from A1 to A2.

[0089] Step C: When the measurement system control module receives one or both of the force signal and the electrical signal change signal, it immediately controls the motion mechanism to stop moving and records the probe's XYZ coordinate data, using this data as the position of a point in the shape of the bonding wire curve;

[0090] Step D: After recording is completed, guided by the image module, measure the next point along the extension direction of the bonding wire, and then begin steps B and C.

[0091] A method for measuring the size of bonding wires within the RF channel of a multi-chip component, based on the aforementioned system for measuring the size of bonding wires within the RF channel of a multi-chip component, includes:

[0092] Step S1: Establish a standard measurement model for the dimensions of the bonding wire;

[0093] Step S2: Preparation and confirmation of the part to be measured;

[0094] Step S3: Edit the measurement program;

[0095] Step S4: Execute the measurement procedure;

[0096] Step S5: Measurement result report generated.

[0097] In this embodiment, specifically, the bonding wire includes: two pads and a gold wire formed between the two pads by a gold wire bonding process; it should be noted that the characteristics of the two pads include, but are not limited to: ① the pad size is square, rectangular, or circular, and its single-side length or diameter is between 50 micrometers and 100 micrometers; ② the two pads can be any one or both of the following: pads on an unpackaged bare die, pads on a circuit chip, and gold-plated layers on resistors or capacitors; ③ the bare die includes gallium arsenide dies, gallium nitride dies, and silicon dies, and the circuit chip includes alumina-based circuit chips, LTCC (Low Temperature Coated) chips, etc. Cerimacs (low-temperature co-fired ceramic) circuit chips and microwave printed circuit chips, wherein the resistors are chip resistors and thin-film resistors, and the capacitors are chip capacitors; the main difference of the gold wires lies in the diameter of the gold wires, the purity of the gold wires is 99.99% or higher, and the diameter of the gold wires includes, but is not limited to, 12 micrometers, 25 micrometers, and 40 micrometers; the gold wire bonding includes ball bonding and wedge bonding processes;

[0098] The standard measurement model refers to the requirement to output results in a preset format after each measurement. The results include: a list of geometric parameters of the gold wire shape, a curve fitting function for the gold wire shape, and the coordinate values ​​of each point within the curve.

[0099] Please see Figure 3 The list of geometric parameters for the gold wire shape includes:

[0100] The Z-axis height difference H0 between the horizontal plane where the highest point P of the bonding wire is located and the horizontal plane used for assembling chips, passive devices, and circuit boards;

[0101] The Z-axis height difference H1 between the horizontal plane where the highest point P of the bonding wire is located and the horizontal plane where one of the pads (i.e., pad 1 in the figure) is located;

[0102] The Z-axis height difference H2 between the horizontal plane where the highest point P of the bonding wire is located and the horizontal plane where another pad (i.e., pad 2 in the figure) is located;

[0103] The straight-line distance D between the bonding wire solder joints on the two pads;

[0104] The height difference H3 between the two pad planes;

[0105] The values ​​of H0, H1, H2, and D are all obtained by measurement, and the height difference H3 between the two pad planes is obtained by calculation; the accuracy of H0, H1, H2, H3, and D is micrometers or better.

[0106] In this embodiment, specifically, step S2 includes:

[0107] The quality of the gold wire bonding of the part to be measured is inspected. The quality status includes: whether there is a cold solder joint, whether the gold wire arc has collapsed, whether there is a solder joint falling off, and whether there is a missing solder joint. Preferably, the quality status of the gold wire bonding is inspected visually with a microscope, that is, the quality status of the part to be measured is confirmed by visual means with the aid of a microscope.

[0108] The part to be measured refers to the part to be measured that has the pad features, gold wire bonding process features, and gold wire size features described in step S1;

[0109] If the quality condition does not meet the quality inspection requirements, suspend the measurement and replace it with a piece that meets the quality inspection requirements;

[0110] The part to be measured, which meets the quality inspection requirements, should be correctly placed in the measurement system;

[0111] Preferably, the confirmation of the sample to be measured includes: ① confirming the sample number; ② if the above quality status is "no", then discard the sample and select a new sample to be measured or make a new sample to be measured.

[0112] In this embodiment, specifically, the measurement program is used to drive the measurement system to execute and automatically complete all measurement actions;

[0113] The measurement procedure includes: setting the XYZ coordinate reference point, starting the task, identifying and locating Mark points in the XY plane under image recognition guidance, automatically calibrating the Z-axis height with laser positioning assistance, moving the measurement probe device under image guidance above the workpiece to be measured, taking pictures of the gold wire bonding area and performing image analysis, moving the measurement probe above the bonding wire, completing contact with the gold wire and acquiring and recording signals point by point along the extension direction of the gold wire in a step-by-step manner, confirming the completion of measurement data acquisition in the control software, returning the measurement probe to its original position, automatically generating a measurement report, and ending the measurement.

[0114] The device to be measured refers to the entire radio frequency channel or a part of the radio frequency channel that contains one or more bonding wire structures to be measured.

[0115] The point-by-point method refers to setting points along the extension direction of the gold wire by moving a certain distance, the certain moving distance being no more than 10 micrometers; the stepping method starts from one end of the bonding gold wire and ends at the other end, completing all measurements within the length range of the gold wire according to the set moving distance.

[0116] In this embodiment, specifically, step S3 includes:

[0117] Probe motion control commands;

[0118] Coordinate calibration command;

[0119] Image recognition and guidance instructions;

[0120] Commands for acquiring force and electrical signal change signals;

[0121] Automatic fitting command for the bonding wire curve based on the acquired measurement signal;

[0122] The editing of the measurement program is completed within the measurement system control module.

[0123] The edited measurement program includes, but is not limited to: ① probe motion control commands, including but not limited to motion speed, step accuracy, and stop commands; ② coordinate calibration commands, including XY plane reference point calibration and Z-axis reference point calibration; ③ image recognition and guidance commands, including but not limited to bonding wire region recognition commands, probe motion guidance commands, and laser height measurement commands; ④ commands for acquiring force and electrical signal change signals; and ⑤ commands for automatically fitting the bonding wire curve based on the acquired measurement signals.

[0124] The editing of the measurement program is completed within the measurement system control module.

[0125] In this embodiment, specifically, the execution of the measurement program involves calling the correct version of the measurement program corresponding to the part to be measured, driving the measurement system to start execution, acquiring measurement signals, determining the position information of each contact point, generating the shape of the bonding wire, and monitoring the measurement system to complete all the contents of the measurement program.

[0126] The drive measurement system is executed in the manner that the bonding wire size measurement should start from the lower end of the solder pad;

[0127] The measurement signal includes a force signal and an electrical signal. The measurement signal is acquired by driving the measurement probe to contact the bonding wire. After contact, there will be a certain action and reaction force between the wire and the probe, and the force signal is acquired. At the same time, the contact between the probe and the wire will cause a change in the electrical signal being transmitted in the wire, and the amount of change in the electrical signal is acquired.

[0128] The determination of the position information of each contact point includes: the motion control of the measuring probe is based on a calibrated XYZ coordinate system; the calibration of the XYZ coordinate system refers to specifying the XY reference plane and the reference point in the Z direction during the measurement program editing; the motion of the measuring probe is under program control, and each position has a precise XYZ coordinate value; when the probe contacts the gold wire according to the step set by the measurement program and senses a change in force or electrical signal, the XYZ coordinate value Li (Xi, Yi, Zi) of the probe position at that moment is recorded.

[0129] The parameters obtained in the execution of the measurement program include: obtaining the values ​​of H1, H2, and H3 through laser height measurement; obtaining the value of D through image analysis based on the acquired image of the part to be measured; obtaining the value of H3 by calculating the values ​​of H1 and H2; and obtaining the XYZ coordinate values ​​of each position point within the bonding wire curve by recording the probe position.

[0130] The generated bonding wire shape refers to the continuous numerical curve of the bonding wire generated by the computer program in the measurement system through a mathematical algorithm fitting based on the obtained position information of the contact points. The mathematical algorithm includes, but is not limited to, difference approximation, multi-form approximation, and smooth approximation. The mathematical algorithm can be implemented by the computer program in the control module of the measurement system, or it can be developed in other external software and then called by the computer program in the control module of the measurement system. The other external software includes, but is not limited to, Matlab and Origin.

[0131] In this embodiment, specifically, the measurement report includes: measurement time, measurement personnel, and measurement part number, wherein the measurement time is automatically generated by the measurement system, and the measurement personnel and measurement part number are entered into the measurement system manually or by scanning a barcode; a gold wire bonding morphology image, which can be displayed and viewed in measurement diagram or top view mode; a list of gold wire bonding parameters, and the XYZ coordinate values ​​of each point that makes up the gold wire bonding morphology image; wherein the list of gold wire bonding parameters includes, but is not limited to, H0, H1, H2, H3, and D;

[0132] The measurement report generation refers to the automatic generation by the measurement system control module after the measurement is completed, under the control of the measurement program.

[0133] The output measurement report refers to the data output to other relevant information systems through the data interface of the measurement system control module. These other information systems include, but are not limited to, manufacturing execution systems and quality management systems.

[0134] In this embodiment, specifically, after step S5, step S6 can be further added;

[0135] Step S6: Manual confirmation and output of results;

[0136] The manual verification of results refers to the review and confirmation by designated personnel after the measurement report is generated. If verification is successful, the measurement report is numbered and output. If verification fails, the measurement is repeated.

[0137] The embodiments described above merely illustrate specific implementation methods of this application, and while the descriptions are detailed and specific, they should not be construed as limiting the scope of protection of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the technical solution of this application, and these modifications and improvements all fall within the scope of protection of this application.

[0138] This background section is provided to generally present the context of the invention. The work of the currently named inventors, the work to the extent described in this background section, and aspects of this section that did not constitute prior art at the time of application are neither expressly nor impliedly acknowledged as prior art to the invention.

Claims

1. A system for measuring the dimensions of bonding wires within the radio frequency channel of a multi-chip component, characterized in that, include: The measurement system control module is used to edit the measurement program, drive the rest of the system to execute the measurement program, and analyze the measurement results of the received electrical and force signals to generate a measurement report. A work platform, which is used to place the workpiece to be measured, install the motion module and other parts included in the system; The motion module is used to execute the motion actions set in the measurement program under the drive of the measurement system control module, so that the probe moves to the designated point according to the specified speed and accuracy requirements; The vision module is used to acquire image information and height information within the bonding wire area of ​​the workpiece to be measured. The probe and sensor module is used to contact the bonding wire in the workpiece under the drive of the measurement system control module and the control of the motion module, to acquire the mechanical and electrical signals after contact and feed them back to the measurement system control module. The probe and sensor module includes: a probe support, a probe, a force sensor, and an ammeter; The methods for acquiring and feeding back force and electrical signals are as follows: Step A: Before the probe comes into contact with the bonding wire, the force sensor has no sensing signal, while the ammeter has signal A1; Step B: Once the probe comes into contact with the bonding wire, the force sensor senses the force signal, and the ammeter reading will change from A1 to A2. Step C: When the measurement system control module receives one or both of the force signal and the electrical signal change signal, it immediately controls the motion mechanism to stop moving and records the probe's XYZ coordinate data, using this data as the position of a point in the shape of the bonding wire curve; Step D: After recording is completed, guided by the image module, measure the next point along the extension direction of the bonding wire, and then begin steps B and C.

2. The multi-chip component RF channel internal bonding wire size measurement system according to claim 1, characterized in that, The measurement system control module includes: a host computer, a slave computer, a communication line, a computer program, and a data output interface; The motion includes motion with three degrees of freedom: X, Y, and Z; the motion action includes: measuring the movement and stopping of the probe, and feeding back the XYZ coordinate data during the movement and stopping of the probe; The vision module includes: a light source, an industrial camera, image analysis software, and a laser altimeter.

3. A method for measuring the dimensions of bonding wires within the radio frequency channel of a multi-chip component, characterized in that, A multi-chip component RF channel internal bonding wire size measurement system according to claim 1 or 2 includes: Step S1: Establish a standard measurement model for the dimensions of the bonding wire; Step S2: Preparation and confirmation of the part to be measured; Step S3: Edit the measurement program; Step S4: Execute the measurement procedure; Step S5: Generate measurement result report; The bonding wire includes: two pads and a gold wire formed between the two pads by a gold wire bonding process; The standard measurement model refers to the requirement to output results in a preset format after each measurement. The results include: a list of geometric parameters of the gold wire shape, a curve fitting function for the gold wire shape, and the coordinate values ​​of each point within the curve. The list of geometric parameters for the gold wire shape includes: The Z-axis height difference H0 between the horizontal plane where the highest point P of the bonding wire is located and the horizontal plane used for assembling chips, passive devices, and circuit boards; The Z-axis height difference H1 between the horizontal plane where the highest point P of the bonding wire is located and the horizontal plane where one of the pads is located; The Z-axis height difference H2 between the horizontal plane where the highest point P of the bonding wire is located and the horizontal plane where another pad is located; The straight-line distance D between the bonding wire solder joints on the two pads; The height difference H3 between the two pad planes; The measurement program is used to drive the measurement system to execute and automatically complete all measurement actions; The measurement procedure includes: setting the XYZ coordinate reference point, starting the task, identifying and locating Mark points in the XY plane under image recognition guidance, automatically calibrating the Z-axis height with laser positioning assistance, moving the measurement probe device under image guidance above the workpiece to be measured, taking pictures of the gold wire bonding area and performing image analysis, moving the measurement probe above the bonding wire, completing contact with the gold wire and acquiring and recording signals point by point along the extension direction of the gold wire in a step-by-step manner, confirming the completion of measurement data acquisition in the control software, returning the measurement probe to its original position, automatically generating a measurement report, and ending the measurement. The device to be measured refers to the entire radio frequency channel or a part of the radio frequency channel that contains one or more bonding wire structures to be measured. The point-by-point method refers to setting points along the extension direction of the gold wire by moving a certain distance, where the certain moving distance is no more than 10 micrometers; the stepping method starts from one end of the bonding gold wire and ends at the other end, completing all measurements within the length range of the gold wire according to the moving distance.

4. The method for measuring the size of the bonding wire in the radio frequency channel of a multi-chip component according to claim 3, characterized in that, Step S2 includes: Inspect the gold wire bonding quality of the part to be measured. The quality status includes: whether there is a cold solder joint, whether the gold wire arc has collapsed, whether there is a solder joint falling off, and whether there is a missing solder joint. If the quality condition does not meet the quality inspection requirements, suspend the measurement and replace it with a piece that meets the quality inspection requirements; The part to be measured, which meets the quality inspection requirements, is correctly placed in the measurement system.

5. The method for measuring the size of the bonding wire in the radio frequency channel of a multi-chip component according to claim 4, characterized in that, Step S3 includes: Probe motion control commands; Coordinate calibration command; Image recognition and guidance instructions; Commands for acquiring force and electrical signal change signals; Automatic fitting command for the bonding wire curve based on the acquired measurement signal; The editing of the measurement program is completed within the measurement system control module.

6. The method for measuring the size of the bonding wire in the radio frequency channel of a multi-chip component according to claim 5, characterized in that, The execution of the measurement program involves calling the correct version of the measurement program corresponding to the workpiece to be measured, driving the measurement system to start execution, acquiring measurement signals, determining the position information of each contact point, generating the shape of the bonding wire, and monitoring the measurement system to complete all the contents of the measurement program. The drive measurement system is executed in the manner that the bonding wire size measurement should start from the lower end of the solder pad; The measurement signal includes a force signal and an electrical signal. The measurement signal is acquired by driving the measurement probe to contact the bonding wire. After contact, there will be a certain action and reaction force between the wire and the probe, and the force signal is acquired. At the same time, the contact between the probe and the wire will cause a change in the electrical signal being transmitted in the wire, and the amount of change in the electrical signal is acquired. The determination of the position information of each contact point includes: the motion control of the measuring probe is based on a calibrated XYZ coordinate system; the calibration of the XYZ coordinate system refers to specifying the XY reference plane and the reference point in the Z direction during the measurement program editing; the movement of the measuring probe is under program control, and each position has a precise XYZ coordinate value; when the probe contacts the gold wire according to the steps set in the measurement program and senses a change in force or electrical signal, the XYZ coordinate value Li (Xi, Yi, Zi) of the probe position at that moment is recorded. The parameters obtained in the execution of the measurement program include: obtaining the values ​​of H1, H2, and H3 through laser height measurement; obtaining the value of D through image analysis based on the acquired image of the part to be measured; obtaining the value of H3 by calculating the values ​​of H1 and H2; and obtaining the XYZ coordinate values ​​of each position point within the bonding wire curve by recording the probe position. The generated bonding wire shape refers to the continuous numerical curve of the bonding wire generated by the computer program in the measurement system through mathematical algorithm fitting based on the obtained position information of the contact points.

7. The method for measuring the size of the bonding wire in the radio frequency channel of a multi-chip component according to claim 6, characterized in that, The measurement report includes: measurement time, measurement personnel, and measurement part number, wherein the measurement time is automatically generated by the measurement system, and the measurement personnel and measurement part number are entered into the measurement system manually or by scanning a barcode with a barcode scanner; a gold wire bonding morphology image, which can be viewed as a measurement diagram; a list of gold wire bonding parameters, and the XYZ coordinate values ​​of each point that makes up the gold wire bonding morphology image.

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