Transfer device and transfer method for an electronic device

Abstract

The present invention discloses a transfer device and a transfer method for electronic devices, including a transfer substrate and a transfer head disposed on the transfer substrate; a position detection unit for detecting the position information of the electronic device on the transfer head; and a control unit connected to the position detection unit, where the control unit is configured to adjust the transfer path of the electronic device according to the position information. The technical solution provided by the embodiments of the present invention adjusts the transfer path of the electronic device according to the position information by the control unit, so that the electronic device can be accurately transferred to the target position of the receiving substrate, which can improve the efficiency of the electronic device transfer and the alignment accuracy.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of semiconductor manufacturing technology, and in particular, to a transfer device and a transfer method for electronic devices. Background Art

[0002] With the development of display technology, people have higher and higher requirements for the display effect of display devices. The use of micro-light-emitting devices can reduce the pixel pitch of the display panel from the millimeter level to the micron level, but the accuracy of the transfer and alignment of existing micro-light-emitting devices cannot meet the user's needs. Summary of the Invention

[0003] Embodiments of the present invention provide a transfer device and a transfer method for electronic devices to solve the problem that precise alignment cannot be achieved when transferring electronic devices.

[0004] Embodiments of the present invention provide a transfer device for electronic devices, including:

[0005] A transfer substrate;

[0006] A transfer head disposed on the transfer substrate;

[0007] A position detection unit for detecting the position information of the electronic device on the transfer head;

[0008] A control unit connected to the position detection unit for adjusting the transfer path of the electronic device according to the position information.

[0009] Optionally, a plurality of through holes are provided on the transfer head, and the control unit is used to control gas to be injected from the through holes to release the electronic device according to the position information and the target position information.

[0010] Optionally, the position detection unit includes:

[0011] An air flow detection device for detecting gas flow data;

[0012] The control unit is connected to the air flow detection device and is used to determine the position information of the electronic device on the transfer head according to the gas flow data;

[0013] The control unit is used to control the opening or closing of the through holes at different positions according to the position information and the target position information to adjust the transfer path of the electronic device.

[0014] Optionally, the air flow detection device is disposed in the through hole for detecting the gas flow data in each through hole;

[0015] The control unit is used to determine the position information of the electronic device according to the gas flow data of different through-holes; the control unit is also used to adjust the flow rate of the gas introduced from different through-holes according to the position information and the target position information, and release the electronic device with a preset initial velocity.

[0016] Optionally, the transfer device further includes:

[0017] A driving device, which is connected to the control unit and is used to respond to the first instruction of the control unit to introduce gas from the through-hole to release the electronic device with a preset initial velocity; or,

[0018] Respond to the second instruction of the control unit to discharge the gas from the through-hole to adsorb the electronic device to the transfer head;

[0019] Wherein, the first instruction is triggered by the transfer device when pre-placing the electronic device according to the position information and the target position information; the second instruction is triggered by the transfer device when pre-picking up the electronic device.

[0020] Optionally, the transfer device further includes:

[0021] An air path pipeline, which is connected to the driving device and the through-hole, and is used to form a gas path between the driving device and the through-hole;

[0022] An air path switch, which is arranged on the air path pipeline and is connected to the control unit, and is used to respond to the first instruction of the control unit to adjust the opening degree of the air path switch to release the electronic device with a preset initial velocity.

[0023] Optionally, an air path switch is provided for each through-hole, and the air path switches of different through-holes are independently controlled by the control unit;

[0024] The control unit is used to control the number of opened through-holes according to the position information and the target position information to adjust the transfer path of the electronic device.

[0025] Optionally, an air flow detection device is arranged on the transfer substrate, and the shape of the air flow detection device is mesh-shaped.

[0026] Optionally, the size of the transfer head is larger than the size of the electronic device;

[0027] The aperture of the through-hole is smaller than the size of the electronic device.

[0028] In a second aspect, an embodiment of the present invention provides a method for transferring an electronic device, which is executed by the transfer device described in the above embodiment, and specifically includes:

[0029] Obtain the position information of the electronic device on the transfer head;

[0030] Adjust the transfer path of the electronic device according to the position information.

[0031] The transfer device of the electronic device provided by the embodiment of the present invention detects the position information of the electronic device on the transfer head through the position detection unit, and adjusts the transfer path of the electronic device according to the position information through the control unit, so that the electronic device can be accurately transferred to the target position of the receiving substrate, which can improve the efficiency of the electronic device transfer and the alignment accuracy. Description of the Drawings

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments of the present invention. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the content of the embodiments of the present invention and these drawings.

[0033] Figure 1 It is a schematic structural diagram of a transfer device for an electronic device provided by an embodiment of the present invention;

[0034] Figure 2 It is a schematic diagram of a transfer process of an electronic device provided by an embodiment of the present invention;

[0035] Figure 3 It is a bottom view of the transfer head of a transfer device for an electronic device provided by an embodiment of the present invention;

[0036] Figure 4 It is a schematic diagram of another transfer process of an electronic device provided by an embodiment of the present invention;

[0037] Figure 5 It is a schematic structural diagram of a transfer device for an electronic device provided by an embodiment of the present invention;

[0038] Figure 6 It is a schematic structural diagram of another transfer device for an electronic device provided by an embodiment of the present invention;

[0039] Figure 7 It is a schematic structural diagram of yet another transfer device for an electronic device provided by an embodiment of the present invention;

[0040] Figure 8 It is a bottom view of the transfer head of another transfer device for an electronic device provided by an embodiment of the present invention;

[0041] Figure 9 It is a flowchart of a transfer method for an electronic device provided by an embodiment of the present invention;

[0042] Figure 10It is a flowchart of another method for transferring an electronic device provided by an embodiment of the present invention;

[0043] Figure 11 It is a flowchart of yet another method for transferring an electronic device provided by an embodiment of the present invention;

[0044] Figure 12 It is a flowchart of yet another method for transferring an electronic device provided by an embodiment of the present invention;

[0045] Figure 13 It is a flowchart of yet another method for transferring an electronic device provided by an embodiment of the present invention. Detailed implementation manners

[0046] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. Additionally, it should be noted that for the sake of description, only parts related to the present invention rather than all structures are shown in the drawings.

[0047] The electronic device of the embodiment of the present invention may include electronic components such as chips, chip resistors, and micro-light-emitting devices. The transfer device of the electronic device includes a transfer substrate, and the transfer substrate can transfer the electronic device to a receiving substrate. As the volume of the electronic device gradually decreases, problems such as low alignment accuracy are likely to occur during the transfer and alignment of the electronic device, affecting the reliability of the circuit connection of the electronic device.

[0048] Based on the above technical problems, the following solutions are proposed in this embodiment:

[0049] A transfer device for an electronic device provided by an embodiment of the present invention. Figure 1 It is a schematic structural diagram of a transfer device for an electronic device provided by an embodiment of the present invention. Figure 2 It is a schematic diagram of a transfer process of an electronic device provided by an embodiment of the present invention. Combining Figure 1 and Figure 2 , the electronic device 10 can be transferred to the receiving substrate 20 through the transfer device 100 of the electronic device. The receiving substrate 20 can be a circuit board or a carrier substrate to be transferred, etc., and no limitation is made here. Figure 1 Exemplarily shows the situation where the electronic device 10 is combined through the transfer device 100 of the electronic device, Figure 2 Exemplarily shows the situation where after the electronic device 10 is released through the transfer device 100 of the electronic device, the electronic device 10 is transferred onto the receiving substrate 20.

[0050] Figure 3 It is a bottom view of the transfer head of a transfer device for an electronic device provided by an embodiment of the present invention. Combining Figures 1 to 3, the transfer device 100 of the electronic device provided by the embodiment of the present invention includes a transfer substrate 1; a transfer head 2 disposed on the transfer substrate 1; a position detection unit 4 for detecting the position information of the electronic device 10 on the transfer head 2; a control unit 5 connected to the position detection unit 4, and the control unit 5 is configured to adjust the transfer path of the electronic device 10 according to the position information. Continue to refer to Figure 3 , a plurality of through holes 3 are further disposed on the transfer head 2.

[0051] Specifically, the transfer head 2 may be disposed entirely on the transfer substrate 1, or a plurality of transfer heads 2 arranged in an array may be disposed on the transfer substrate 1, Figure 1 and Figure 2 An example shows the case where the transfer substrate 1 includes a plurality of transfer heads 2 arranged in an array, and there is no limitation here. The transfer head 2 may be disposed on one side of the transfer substrate 1 adjacent to the electronic device 10 to be transferred, facilitating the direct contact between the transfer head 2 and the electronic device 10.

[0052] Refer to Figure 1 , the position detection unit 4 is used to detect the relative position information between the electronic device 10 and the transfer head 2. Exemplarily, in an alternative implementation, the position detection unit 4 may include a camera device, and the camera device determines the position of the electronic device 10 on the transfer head 2 by detecting the number of through holes 3 covered by the electronic device 10 on the transfer head 2. Or, in an alternative implementation, the position detection unit 4 may include a light detection device, and the light detection device can detect the position where the electronic device 10 blocks the light. The control unit 5 can determine the position of the electronic device 10 on the transfer head 2 according to the situation where the light detection device detects that the electronic device 10 blocks the light. Or, in another alternative implementation, the position detection unit 4 may include a pressure detection device, and the pressure detection device can detect the air pressure data in the through holes 3 covered by the electronic device 10. The control unit 5 determines the position of the electronic device 10 on the transfer head 2 according to the air pressure data in the through holes 3 covered by the electronic device 10 detected by the pressure detection device and the air pressure data in the through holes 3 not covered by the electronic device 10. The position detection unit 4 only needs to detect the relative position information between the electronic device 10 and the transfer head 2, and there is no limitation here.

[0053] Figure 4 is a schematic diagram of another transfer process of the electronic device provided by the embodiment of the present invention. Combining Figures 1 to 4, multiple through - holes 3 are provided on the transfer head 2, and the control unit 5 is configured to adjust the transfer path of the electronic device 10 according to the position information of the electronic device 10 on the transfer head 2. The transfer path of the electronic device 10 includes the transfer path between the release of the electronic device 10 from the transfer head 2 and the receiving substrate 20. Adjusting the transfer path of the electronic device 10 may include adjusting the transfer angle, transfer speed, or transfer trajectory of the electronic device 10, etc., which is not limited herein. Exemplarily, the transfer path of the electronic device 10 can be adjusted by adjusting the flow rate of the gas passing through the through - holes 3, or adjusting the number of the through - holes 3 for ventilation, or adjusting the position of the through - holes 3 for ventilation, etc. Multiple through - holes 3 are provided on the transfer head 2, and the multiple through - holes 3 can be arranged in an array as needed.

[0054] According to the position information of the electronic device 10 on the transfer substrate 1 transfer head 2 detected by the position detection unit 4, the control unit 5 can evaluate the position of the electronic device 10 from the release from the transfer head 2 to the receiving substrate 20. By adjusting the transfer path of the electronic device 10 according to the position information of the electronic device 10 on the transfer head 2, the control unit 5 can adjust the transfer path between the release of the electronic device 10 from the transfer head 2 and the receiving substrate 20, so that the electronic device 10 can be accurately transferred to the target position on the receiving substrate 20, improving the transfer efficiency and alignment accuracy of the electronic device 10. On the other hand, by providing the adsorption force in the way of vacuum adsorption and adsorbing the electronic device by filling gas, the transfer can be carried out any number of times, saving costs.

[0055] The transfer device of the electronic device provided in this embodiment detects the position information of the electronic device on the transfer head through the position detection unit, and adjusts the transfer path of the electronic device according to the position information by the control unit, so that the electronic device can be accurately transferred to the target position on the receiving substrate, which can improve the transfer efficiency and alignment accuracy of the electronic device.

[0056] Optionally, on the basis of the above - mentioned embodiment, continuing to combine Figure 3 and Figure 4 , the control unit 5 is configured to control the gas to be filled from the through - holes 3 to release the electronic device 10 according to the position information and the target position information.

[0057] Specifically, the electronic device 10 can be adsorbed on the transfer head 2 by evacuating the through-hole 3. After evacuating the through-hole 3, the pressure inside the through-hole 3 is less than the atmospheric pressure, so that the electronic device 10 can be pressed onto the surface of the transfer head 2 by the atmospheric pressure. The control unit 5 controls the gas to be filled into the through-hole 3, which can gradually increase the pressure inside the through-hole 3, so that the pressure inside the through-hole 3 is the same as or close to the atmospheric pressure, or the pressure inside the through-hole 3 is greater than the atmospheric pressure, thereby causing the electronic device 10 to be released from the transfer head 2. The target position information is the information of the target position where the electronic device 10 is transferred to the receiving substrate 20. The control unit 5 controls the gas to be filled into the through-hole 3 to release the electronic device 10 according to the position information of the electronic device 10 on the transfer head 2 and the target position information, so that the transfer path between the electronic device 10 released from the transfer head 2 to the receiving substrate 20 can be adjusted, enabling the electronic device 10 to be accurately transferred to the target position of the receiving substrate 20, and improving the transfer efficiency and alignment accuracy of the electronic device 10.

[0058] In an alternative embodiment, an adhesive layer can be provided on the surface of the transfer head 2, and the electronic device 10 is adhered to the transfer head 2 by the adhesive layer. The control unit 5 controls the gas to be filled into the through-hole 3, which can make the air pressure inside the through-hole 3 relatively high, so that the air pressure inside the through-hole 3 overcomes the adhesive force of the adhesive layer, thereby causing the electronic device 10 to be released from the transfer head 2.

[0059] In an alternative embodiment, the position detection unit can include a pressure detection device for detecting gas pressure information; the control unit is connected to the pressure detection device, and the control unit is used to determine the position information of the electronic device on the transfer head according to the gas pressure information; the control unit is used to control the opening or closing of the through-holes at different positions according to the position information and the target position information to adjust the transfer path of the electronic device.

[0060] Optionally, Figure 5 is a schematic structural diagram of a transfer device for an electronic device provided by an embodiment of the present invention. On the basis of the above embodiment, refer to Figure 5 , the position detection unit 4 can include an air flow detection device 41 for detecting gas flow data; the control unit 5 is connected to the air flow detection device 41, and the control unit 5 is used to determine the position information of the electronic device 10 on the transfer head 2 according to the gas flow data; the control unit 5 is used to control the opening or closing of the through-holes 3 at different positions according to the position information and the target position information to adjust the transfer path of the electronic device 10.

[0061] Specifically, the air flow detection device 41 may include a flow meter or other device for detecting the gas flow rate. The air flow detection device 41 can detect the gas flow rate data and transmit the detected gas flow rate data to the control unit 5. The control unit 5 can determine the position information of the electronic device 10 on the transfer head 2 according to the gas flow rate data. For example, the air flow detection device 41 can detect the gas flow rate data. The gas flow rate in the through hole 3 adsorbed with the electronic device 10 is small, and the gas flow rate in the through hole 3 not adsorbed with the electronic device 10 is large. By detecting the gas flow rate data of each through hole 3, the boundary position of the electronic device 10 can be determined. The control unit 5 controls the opening or closing of the through holes 3 at different positions according to the position information and the target position information to adjust the transfer path of the electronic device 10. Exemplarily, when the electronic device 10 is offset to the right side of the transfer head 2, the through hole 3 on the right side of the transfer head 2 corresponding to the electronic device 10 can be controlled to close, and the through hole 3 on the right side corresponding to the electronic device 10 can be controlled to open, so that the electronic device 10 can be adjusted to the left during transfer, realizing the accurate alignment of the electronic device 10 with the receiving substrate 20. Optionally, on the basis of the above embodiment, in combination with Figures 3 to 5 , the air flow detection device 41 can be arranged in the through hole 3. The air flow detection device 41 is used for detecting the gas flow rate data in each through hole 3; the control unit 5 is used for determining the position information of the electronic device 10 according to the gas flow rate data of different through holes 3; the control unit 5 is further used for adjusting the flow rate of the gas introduced from different through holes 3 according to the position information and the target position information, and releasing the electronic device 10 at a preset initial velocity.

[0062] Specifically, the air flow detection device 41 can be arranged in the through hole 3. The air flow detection device 41 is used for detecting the gas flow rate data in each through hole 3. Such an arrangement can enable the air flow detection device 41 to detect the gas flow rate data of each through hole 3, and the position of the electronic device 10 on the transfer head 2 can be accurately located according to the gas flow rate data of each through hole 3, and then the electronic device 10 can be transferred more precisely. The control unit 5 is further used for adjusting the flow rate of the gas introduced from different through holes 3 according to the position information, and releasing the electronic device 10 at a preset initial velocity. Such an arrangement can enable the flow rate of the gas introduced from different through holes 3 to be monitored, and the flow rate of the gas introduced from different through holes 3 can be adjusted more accurately, so that the electronic device 10 is released at a preset initial velocity, realizing precise control of the transfer trajectory of the electronic device 10, and further improving the transfer accuracy and alignment accuracy of the electronic device 10.

[0063] Optionally, on the basis of the above embodiment, continue to refer to Figure 3 and Figure 4 , the size of the transfer head 2 can be set to be larger than the size of the electronic device 10; the aperture of the through hole 3 is smaller than the size of the electronic device 10.

[0064] Specifically, the size of the electronic device 10 may be a size such as a side length or a diameter of the electronic device 10. When the transfer head 2 is rectangular, the size of the transfer head 2 may include a length of the transfer head 2, and the length of the transfer head 2 is greater than the length or the diameter of the electronic device 10. When the transfer head 2 is circular, the size of the transfer head 2 may include a diameter of the transfer head 2, and the diameter of the transfer head 2 is greater than the diameter or the length of the electronic device 10.

[0065] The size of the transfer head 2 is larger than that of the electronic device 10, so that the contact area between the electronic device 10 and the transfer head 2 can be larger, thereby improving the adsorption capacity of the transfer head 2 to the electronic device 10. When the electronic device 10 deviates to a certain extent during the transfer process, it is ensured that the transfer head 2 has enough area to stably contact with the electronic device 10, thereby increasing the contact area between the transfer head 2 and the electronic device 10 and improving the firmness of the transfer head 2 fixing the electronic device 10.

[0066] The aperture of the through hole 3 is smaller than the size of the electronic device 10, and may include the aperture of the through hole 3 being smaller than the minimum size of the electronic device 10. The aperture of the through hole 3 is set to be smaller than the size of the electronic device 10, so that the electronic device 10 can correspond to multiple through holes 3. On the one hand, by evacuating the through holes 3, the electronic device 10 is firmly adsorbed on the transfer head 2 due to the pressure difference. On the other hand, when the aperture of the through hole 3 is much smaller than the size of the electronic device 10, part of the through holes 3 arranged in an array are covered by the electronic device 10, and part of the through holes 3 arranged in an array are not covered by the electronic device 10. By detecting the gas flow data in each through hole 3, the position of the electronic device 10 on the transfer head 2 and the boundary of the electronic device 10 can be located, further improving the accuracy of the position information of the electronic device 10 on the transfer head 2.

[0067] Optional, Figure 6 FIG. 1 is a schematic diagram of the structure of another transfer device of an electronic device provided in an embodiment of the present invention. Figure 6 The electronic device transfer device 100 may further include a driving device 6, which is connected to the control unit 5. The driving device 6 is used to respond to a first instruction of the control unit 5 to inject gas from the through hole 3 to release the electronic device 10 at a preset initial velocity; or, respond to a second instruction of the control unit 5 to discharge gas from the through hole 3 to adsorb the electronic device 10 to the transfer head 2; wherein the first instruction is triggered when the electronic device transfer device 100 pre-places the electronic device 10 according to the position information and the target position information; and the second instruction is triggered when the electronic device transfer device 100 pre-picks up the electronic device 10.

[0068] Specifically, the driving device 6 can be arranged on the side of the transfer head 2 away from the electronic device 10. The driving device 6 can generate an air flow or discharge the air flow from the through hole 3, so that the inside of the through hole 3 is evacuated to a vacuum. The second instruction can be triggered when the transfer device 100 of the electronic device pre-picks up the electronic device 10, and the second instruction is output by the control unit 5. The driving device 6 can respond to the second instruction of the control unit 5, discharge the gas from the through hole 3 to adsorb the electronic device 10 to the transfer head 2, and realize the transfer head 2 of the transfer device to pick up the electronic device 10.

[0069] The first instruction can be triggered when the transfer device 100 of the electronic device pre-places the electronic device 10 according to the position information and the target position information, and the first instruction is output by the control unit 5. The driving device 6 can respond to the first instruction of the control unit 5, pour the gas into the through hole 3 to release the electronic device 10 at a preset initial velocity. Under the action of the preset initial velocity and the acceleration of gravity, the transfer head 2 of the transfer device transfers the electronic device 10 to the receiving substrate 20.

[0070] Optionally, Figure 7 is a schematic structural diagram of another transfer device for an electronic device provided by an embodiment of the present invention. On the basis of the above embodiment, refer to Figure 7 , the transfer device 100 for the electronic device may further include an air duct 7 and an air switch 8. The air duct 7 is connected to the driving device 6 and the through hole 3, and the air duct 7 is used to form a gas passage between the driving device 6 and the through hole 3. The air switch 8 is arranged on the air duct 7, and the air switch 8 is connected to the control unit 5. The air switch 8 is used to respond to the first instruction of the control unit 5 and adjust the opening degree of the air switch 8 to release the electronic device 10 at a preset initial velocity.

[0071] Specifically, the air duct 7 forms a gas passage between the driving device 6 and the through hole 3. The air switch 8 is arranged on the air duct 7. When the air switch 8 is opened or partially opened, the driving device 6 can evacuate the through hole 3 through the air duct 7, or the driving device 6 can pour gas into the through hole 3 through the air duct 7, so that the transfer head 2 releases the electronic device 10 at a preset initial velocity. When the air switch 8 is closed, the air switch 8 shuts off the gas passage formed by the driving device 6, the air duct 7 and the through hole 3, so that the air flow in the through hole 3 corresponding to the closed air switch 8 remains unchanged.

[0072] Optionally, on the basis of the above embodiment, continue to refer to Figure 7 , each through hole 3 is provided with an air switch 8, and the air switches 8 of different through holes 3 are independently controlled by the control unit 5. The control unit 5 is used to control the opening number of the through holes 3 according to the position information and the target position information to adjust the transfer path of the electronic device 10.

[0073] Specifically, the air circuit switches 8 of different through holes 3 are independently controlled by the control unit 5, so that the control unit 5 can control the conduction or closing of the air circuit switches 8 corresponding to the through holes 3 according to the position information of the electronic device 10 on the transfer head 2, and then control the number of through holes 3 that are opened, thereby adjusting the transfer path of the electronic device 10 according to the needs of the position information, and further improving the transfer accuracy of the transfer device for the electronic device 10.

[0074] Optionally, based on the above embodiment, continue to refer to Figure 7 The airflow detection device 41 is disposed on the transfer substrate 1 , and the shape of the airflow detection device 41 may be a mesh.

[0075] Specifically, the airflow detection device 41 can be arranged on the transfer substrate 1. The mesh airflow detection device 41 can allow the gas to pass through better and detect the flow rate of the gas while the gas passes through. On the other hand, the mesh airflow detection device 41 can be arranged on the transfer substrate 1 better, so that the transfer substrate 1 is thinner, and the mesh airflow detection device 41 is convenient to arrange, thereby reducing the process cost.

[0076] Optional, Figure 8 FIG. 1 is a bottom view of a transfer head of another electronic device transfer device provided by an embodiment of the present invention. Figure 3 , Figure 4 and Figure 8 The through hole 3 may include a first through hole 31 and a second through hole 32. The first through hole 31 is used to discharge gas from the first through hole 31 to adsorb the electronic device 10 to the transfer head 2. Exemplarily, the first through hole 31 may be a vacuum through hole.

[0077] The second through hole 32 is used to inject gas from the second through hole 32 to release the electronic device 10 at a preset initial velocity. Exemplarily, the second through hole 32 can be a through hole for injecting gas. The first through hole 31 and the second through hole 32 can be arranged at intervals. The shapes of the first through hole 31 and the second through hole 32 can be the same or different. The apertures of the first through hole 31 and the second through hole 32 can be the same or different, and there is no limitation here.

[0078] It should be noted that Figure 3 The example shows a situation where the first through hole and the second through hole are the same, that is, the through hole 3 can be used for both injecting gas and evacuating the inside of the through hole. Figure 8 The case where the shapes of the first through hole 31 and the second through hole 32 are different is shown by way of example, and no limitation is made herein.

[0079] Figure 9 FIG. 1 is a flow chart of a method for transferring an electronic device provided by an embodiment of the present invention. Figure 9The transfer method of the micro-light emitting device provided by the embodiment of the present invention includes:

[0080] S101, obtaining position information of the electronic device on the transfer head.

[0081] S102: Adjust the transfer path of the electronic device according to the position information.

[0082] Specific, combined Figure 1 , Figure 2 , Figure 4 and Figure 9 The transfer method of the micro-light-emitting device provided in this embodiment is performed by the transfer device 100 of the micro-light-emitting device, and the electronic device 10 can be transferred to the receiving substrate 20 by the transfer device 100 of the electronic device. The receiving substrate 20 can be a circuit board or a carrier substrate to be transferred, etc., which is not limited here. The electronic device 10 is combined by the transfer device 100 of the electronic device, and after being released by the transfer device 100 of the electronic device, the electronic device 10 is transferred to the receiving substrate 20. At least one surface of the receiving substrate 20 can be provided with a plurality of first electrodes arranged in an array, and the receiving substrate 20 is used to receive the micro-light-emitting device released from the transfer device 100 of the electronic device, and electrically connect the second electrode of the micro-light-emitting device to the first electrode.

[0083] The electronic device transfer device 100 transfers the micro-light-emitting device to the receiving substrate 20, so that the second electrode of the micro-light-emitting device is electrically connected to the first electrode on the receiving substrate 20. The micro-light-emitting device transfer method provided by the embodiment of the present invention realizes the mass transfer of micro-light-emitting devices and improves the transfer efficiency and alignment accuracy of the micro-light-emitting devices.

[0084] Figure 10 FIG. 1 is a flow chart of another method for transferring an electronic device provided by an embodiment of the present invention. Figure 10 , the transfer head of the transfer device 100 of the electronic device may be provided with a plurality of through holes;

[0085] The transfer method of the micro-light-emitting device provided in the embodiment of the present invention may include:

[0086] S101, obtaining position information of the electronic device on the transfer head.

[0087] S201 . According to the position information and the target position information, control gas to be injected from the through hole to release the electronic device.

[0088] Figure 11 FIG. 1 is a flow chart of another method for transferring an electronic device provided by an embodiment of the present invention. Figure 11, the transfer method of the micro-light-emitting device provided by the embodiment of the present invention may include:

[0089] S301. The gas flow detection device detects gas flow data;

[0090] S302. The control unit determines the position information of the electronic device on the transfer head according to the gas flow data;

[0091] S303. The control unit controls the opening or closing of the through holes at different positions according to the position information and the target position information to adjust the transfer path of the electronic device.

[0092] Figure 12 is a flowchart of another transfer method of the electronic device provided by the embodiment of the present invention. On the basis of the above embodiment, see Figure 12 , the transfer method of the micro-light-emitting device provided by the embodiment of the present invention may include: S401. The gas flow detection device detects the gas flow data in each through hole;

[0093] S402. The control unit determines the position information of the electronic device according to the gas flow data of different through holes;

[0094] S403. The control unit also adjusts the flow rate of the gas introduced from different through holes according to the position information and the target position information, and releases the electronic device at a preset initial speed.

[0095] Figure 13 is a flowchart of another transfer method of the electronic device provided by the embodiment of the present invention. On the basis of the above embodiment, see Figure 13 , the transfer method of the micro-light-emitting device provided by the embodiment of the present invention may include:

[0096] S101. Obtain the position information of the electronic device on the transfer head.

[0097] S501. The control unit controls the number of opened through holes according to the position information and the target position information to adjust the transfer path of the electronic device.

[0098] Note that the above is only the preferred embodiment of the present invention and the applied technical principle. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein. Various obvious changes, re-adjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A transfer device for an electronic device, characterized in that include: transferring the substrate; A transfer head disposed on the transfer substrate; A position detection unit, the position detection unit is used to detect the position information of the electronic device on the transfer head; a control unit, the control unit being connected to the position detection unit, and the control unit being used to adjust a transfer path of the electronic device according to the position information; The transfer head is provided with a plurality of through holes; The control unit is used to control the gas to be injected from the through hole to release the electronic device according to the position information and the target position information; The position detection unit comprises: An airflow detection device, wherein the airflow detection device is used to detect gas flow data; The control unit is connected to the airflow detection device, and the control unit is used to determine the position information of the electronic device on the transfer head according to the gas flow data; The control unit is used to control the opening or closing of the through holes at different positions according to the position information and the target position information, so as to adjust the transfer path of the electronic device.

2. The transfer device according to claim 1, characterized in that The airflow detection device is disposed in the through hole, and the airflow detection device is used to detect the gas flow data in each of the through holes; The control unit is used to determine the position information of the electronic device according to the gas flow data of different through holes; the control unit is also used to adjust the flow of gas injected from different through holes according to the position information and the target position information, and release the electronic device at a preset initial velocity.

3. The transfer device according to claim 1, characterized in that, The transfer device also includes: a driving device, the driving device being connected to the control unit, and the driving device being used to inject gas from the through hole to release the electronic device at a preset initial velocity in response to a first instruction from the control unit; or In response to a second instruction of the control unit, exhausting gas from the through hole to adsorb the electronic device to the transfer head; The first instruction is triggered when the transfer device pre-places the electronic device according to the position information and the target position information; the second instruction is triggered when the transfer device pre-picks up the electronic device.

4. The transfer device according to claim 3, wherein The transfer device also includes: An air pipeline, the air pipeline is connected to the driving device and the through hole, and the air pipeline is used to form a gas passage between the driving device and the through hole; An air circuit switch, wherein the air circuit switch is arranged on the air circuit pipeline, the air circuit switch is connected to the control unit, and the air circuit switch is used to adjust the opening degree of the air circuit switch in response to the first instruction of the control unit to release the electronic device at a preset initial velocity.

5. The transfer device according to claim 4, characterized in that Each of the through holes is provided with the gas circuit switch, and the gas circuit switches of different through holes are independently controlled by the control unit; The control unit is used to control the opening quantity of the through holes according to the position information and the target position information, so as to adjust the transfer path of the electronic device.

6. The transfer device according to claim 1 or 2, characterized in that an air flow detection device is disposed on the transfer substrate, and the air flow detection device is in a mesh shape.

7. The transfer device according to any one of claims 1 to 6, characterized in that the size of the transfer head is larger than the size of the electronic device; the aperture of the through hole is smaller than the size of the electronic device.

8. A transfer method for an electronic device, which is performed by using the transfer device according to any one of claims 1 to 7, characterized in that, comprising: obtaining position information of the electronic device on the transfer head; adjusting the transfer path of the electronic device according to the position information.

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