Electronic package module and method of manufacturing the same

Abstract

An electronic package module and a manufacturing method thereof are provided. The method includes forming a carrier substrate. Then, a portion of the carrier substrate is removed to form an opening, and the opening communicates surfaces of opposite sides of the carrier substrate. A fixture is disposed on the carrier substrate to overlap the opening, and a first electronic component is disposed on one of the surfaces. A second electronic component is disposed on the fixture so that the second electronic component passes through the opening. The second electronic component is electrically connected to the carrier substrate, and a sealing layer is formed on the carrier substrate to cover the first electronic component and the second electronic component. In this way, a difference between a top surface of the first electronic component and a top surface of the second electronic component is reduced, and thus a thickness of the electronic package module is reduced.

Description

Technical Field

[0001] This invention relates to an electronic packaging module, and more particularly to a component-embedded packaging module and its manufacturing method. Background Technology

[0002] Surface mount technology (SMT) is a process that uses solder to mount electronic components onto the surface of a circuit board. SMT frees electronic components from the minimum size limitations of traditional solder pads, allowing them to be shrunk to a much smaller size, thus significantly improving the thinness and lightness of electronic products. However, even though the size of electronic components has been reduced due to the development of SMT, there are still bottlenecks that are difficult to overcome in practical applications.

[0003] The package module contains relatively small active elements and relatively large passive elements. When electronic components of different sizes are placed on the surface of the same circuit board, the height of the tops of the components will be inconsistent. In order for the encapsulation layer to cover the taller electronic components, the overall size (i.e., thickness) of the package module is limited by the height of the larger electronic components and cannot be easily reduced.

[0004] On the other hand, if passive and active components are placed on different planes, for example, passive components are placed on the motherboard while active components are placed on the circuit board on the motherboard, then to completely electromagnetically shield these electronic components, the electromagnetic shielding layer must cover not only the circuit board but also a portion of the motherboard. This not only increases the size of the packaged module but also increases the difficulty of manufacturing the electromagnetic shielding layer. Summary of the Invention

[0005] Therefore, the present invention provides an electronic packaging module and a method for manufacturing the same, thereby reducing the thickness of the electronic packaging module.

[0006] This invention provides a method for manufacturing an electronic packaging module, comprising: forming a carrier circuit board, the carrier circuit board including a first surface and a second surface, wherein the first surface and the second surface are respectively located on both sides of the carrier circuit board; removing a portion of the carrier circuit board to form an opening, the opening extending along the normal direction of the carrier circuit board and connecting the first surface and the second surface; disposing a fixture on the carrier circuit board, wherein the fixture overlaps with the opening; disposing a first electronic component on the first surface of the carrier circuit board; disposing a second electronic component on the fixture, such that the second electronic component passes through the opening; electrically connecting the second electronic component to the carrier circuit board; and after electrically connecting the second electronic component and the carrier circuit board, forming a first sealing layer on the carrier circuit board, the first sealing layer covering the first electronic component and the second electronic component.

[0007] The present invention also provides an electronic packaging module comprising a carrier circuit board, the carrier circuit board including an opening, a first surface, and a second surface opposite to the first surface, wherein the opening connects the first surface and the second surface of the carrier circuit board. The electronic packaging module further includes a first electronic component and a second electronic component, the first electronic component being located on the first surface of the carrier circuit board, and the second electronic component being located within the opening and electrically connected to the carrier circuit board. The electronic packaging module further includes a first sealing layer covering the first electronic component and the second electronic component, wherein the thickness of the first electronic component is less than the thickness of the second electronic component.

[0008] Based on the above, this invention places thicker electronic components within an opening in the carrier circuit board and electrically connects them to the carrier circuit board, while other thinner electronic components are disposed on the surface of the carrier circuit board. This reduces the gap between the top surfaces of these two types of electronic components, thereby reducing the thickness of the sealing layer and achieving the effect of a thinner electronic packaging module. Attached Figure Description

[0009] Figures 1A to 1G A cross-sectional view illustrating a method for manufacturing an electronic packaging module according to an embodiment of the present invention is shown.

[0010] Figure 2 Draw Figure 1D The top view.

[0011] Figures 3A to 3B A cross-sectional view illustrating a method for manufacturing an electronic packaging module according to an embodiment of the present invention is shown.

[0012] Figure 4 A cross-sectional view of an electronic packaging module according to another embodiment of the present invention is shown.

[0013] Figure 5 A cross-sectional view of an electronic packaging module according to another embodiment of the present invention is shown.

[0014] The reference numerals in the attached figures are explained as follows:

[0015] 10: Carrier circuit board

[0016] 100f, 100s, 106s: Surface

[0017] 103: Intermediate substrate

[0018] 103i: Interface

[0019] 104, 404: Solder joints

[0020] 108: Connecting pad

[0021] 120d: Boundary

[0022] 140: Fixture

[0023] 30, 40, 50: Electronic packaging modules

[0024] 320: Sealed structure

[0025] N1: Normal direction

[0026] 100: Circuit board

[0027] 102, 160a, 160b: Electronic components

[0028] 103o, 120: Opening

[0029] 106, 180: Sealing layer

[0030] 170: Welding materials

[0031] 190: Conductive layer

[0032] 30w: Sidewall

[0033] 30': Electronic package unit

[0034] 401: Motherboard

[0035] T1, T2, T3: Thickness Detailed Implementation

[0036] At least one embodiment of the present invention discloses a method for manufacturing an electronic packaging module, comprising: Figures 1A to 1G The invention will be described by referring to a series of steps in the present invention to illustrate at least one embodiment. Please refer to... Figure 1A First, a circuit board 100 is provided, which has a surface 100f and a surface 100s opposite to the surface 100f. Next, as... Figure 1BAs shown, electronic components 102 and an intermediate substrate 103 are disposed on a circuit board 100. Both the electronic components 102 and the intermediate substrate 103 are located on surface 100s, and in the accompanying drawings of this embodiment, two electronic components 102 are shown for illustration. However, the present invention is not limited thereto, and the number of electronic components 102 may be one or more, for example, one or three.

[0037] In some embodiments, the circuit board 100 may further include at least one solder mask (not shown) that covers the surface 100s of the circuit board 100 and exposes multiple pads (not shown) on the surface 100s. Electronic components 102 are then soldered to the circuit board 100 via these pads using multiple solder joints 104 to electrically connect the electronic components 102 to the circuit board 100. These solder joints 104 may be solder balls, copper pillars, or various connection structures suitable for electrical connection. Furthermore, in other embodiments, the electronic components 102 may be electrically connected to the circuit board 100 using wire bonding. The electronic components 102 may be packaged chips or unpackaged dies.

[0038] Please continue to refer to this. Figure 1B Similar to how electronic component 102 is connected to circuit board 100, intermediate substrate 103 is also electrically connected to circuit board 100 via pads (not shown) exposed on circuit board 100 using multiple solder points 104. Intermediate substrate 103 includes a contact surface 103i, which faces away from surface 100s of circuit board 100. In this embodiment, there is one intermediate substrate 103, which includes an opening 103o, and electronic component 102 is disposed in the opening 103o. In other embodiments of the invention, the number of intermediate substrates 103 is not limited to one, and each intermediate substrate 103 may include more than one (e.g., one) opening 103o.

[0039] Please refer to Figure 1C After the electronic component 102 and the intermediate substrate 103 are disposed on the circuit board 100, a sealing layer 106 is formed on the surface 100s. The sealing layer 106 covers the electronic component 102 and the intermediate substrate 103, and has a surface 106s that is away from the circuit board 100. The material of this sealing layer 106 may include an insulating material such as an organic resin (e.g., epoxy resin) or similar materials. Thus, a carrier circuit board 10 comprising the circuit board 100, the electronic component 102, the intermediate substrate 103, and the sealing layer 106 is formed. Figure 1CAs shown, surface 100f and surface 106s are located on both sides of the carrier circuit board 10, in other words, the carrier circuit board 10 includes surface 100f and surface 106s that are opposite to each other.

[0040] Please continue to refer to this. Figure 1D A portion of the carrier circuit board 10 can be removed by means such as mechanical cutting, laser cutting, or ion beam cutting to form an opening 120. The opening 120 extends along the normal direction N1 of the carrier circuit board 10 and connects the surface 100f and the surface 106s. Specifically, a portion of the circuit board 100 and a portion of the sealing layer 106 are removed, and the two removed portions overlap each other in the normal direction N1 to form an opening 120 that completely penetrates the carrier circuit board 10.

[0041] like Figure 2 As shown in the top view of the carrier circuit board 10, in this embodiment, the number of openings 120 is one, and the boundary line 120d where the opening 120 intersects with the surface 100f (and the surface 106s) can be rectangular. However, in this invention, the number of openings 120 in the carrier circuit board 10 is not limited to one, but can be more than one, and the boundary line 120d where it intersects with the surface 100f (and the surface 106s) can be of any shape, such as circular or square. Furthermore, in other embodiments, the opening 120 can also be a non-closed strip.

[0042] Please refer to Figure 1E After forming the opening 120, a fixing element 140 is provided on the carrier circuit board 10, and this fixing element 140 overlaps with the opening 120. For example, in this embodiment, adhesive tape (i.e., tape) is applied to the surface 106s of the carrier circuit board 10. Figure 1E The tape (140) covers the opening 120. In order to adhere to the surface for 106 seconds, the tape in this embodiment completely covers the opening 120 and extends beyond the boundary 120d. It is worth noting that in other embodiments of the invention, the tape 140 is not limited to tape, but may be other devices with a fixing function.

[0043] Next, as Figure 1F As shown, electronic components 160a are disposed on surface 100f of the carrier circuit board 10. Furthermore, Figure 1F The step also includes placing an electronic component 160b on the adhesive 140 and allowing the electronic component 160b to pass through the opening 120. The electronic component 160b can directly contact the adhesive 140. For example, the electronic component 160b is attached to an adhesive tape (i.e.,...). Figure 1E It is attached to the anchor 140 and fixed with tape.

[0044] In this embodiment, the thickness of the electronic component 160b is greater than the thickness of the supporting circuit board 10. Therefore, when the electronic component 160b is disposed on the anchor 140, the top of the electronic component 160b protrudes from the surface 100f. Specifically, as Figure 1F As shown, electronic component 160b not only protrudes from surface 100f, but also from surface 100s (please refer to...). Figure 1E However, the present invention is not limited thereto, and the thickness of electronic component 160b may also be less than or equal to the thickness of the carrier circuit board 10. It should be particularly noted that the number of electronic components 160a and 160b is not limited to that in this embodiment (e.g., Figure 1F The quantity shown in the figure.

[0045] In some embodiments of the present invention, electronic component 160a is smaller than electronic component 160b. For example, the volume of an active component is generally smaller than that of a passive component; electronic component 160a can be an active component such as a transistor, while electronic component 160b can be a passive component such as an inductor or a capacitor. However, in other embodiments of the present invention, the types of electronic components 160a and 160b are not limited thereto.

[0046] Please continue to refer to this. Figure 1F Similar to how electronic component 102 is connected to circuit board 100, electronic component 160a is also electrically connected to circuit board 100 via multiple solder points 104 and multiple pads (not shown) exposed on surface 100f of circuit board 100. In other embodiments, electronic component 160a can also be electrically connected to circuit board 100 using wire bonding.

[0047] On the other hand, the electronic component 160b is electrically connected to the carrier circuit board 10 by soldering. Specifically, in this embodiment, the electronic component 160b and the pads 108 on the carrier circuit board 10 are connected by solder jetting using soldering material 170. The soldering material 170 may include solder such as copper paste or silver paste, and the soldering material 170 is disposed on the surface 100f and the electronic component 160b, connecting the surface 100f and the electronic component 160b. However, the method of connecting the electronic component 160b on the carrier circuit board 10 is not limited to solder jetting; other soldering methods may also be used.

[0048] After electrically connecting the electronic component 160b and the carrier circuit board 10, a sealing layer 180 is formed on the surface 100f of the carrier circuit board 10. Please refer to... Figure 1GThe sealing layer 180 covers electronic components 160a and 160b. In this embodiment, the sealing layer 180 completely covers electronic component 160a except at the connection between electronic component 160a and solder joint 104. However, in other embodiments of the invention, other portions of electronic component 160a, such as... Figure 1F The upper surface of the electronic component 160a can also be exposed outside the sealing layer 180.

[0049] On the other hand, since the bottom of electronic component 160b is in direct contact with the fixation 140, the sealing layer 180 covers all parts except the bottom of electronic component 160b and the connection with solder material 170. In other embodiments of the invention, other parts of electronic component 160b may also be exposed outside the sealing layer 180. The material of the sealing layer 180 may include insulating materials such as organic resins (e.g., epoxy resin) or similar materials, and may be the same as the material of sealing layer 106.

[0050] Please refer to Figure 3A After forming the sealing layer 180, the adhesive 140 (i.e., the tape in this embodiment) is removed. However, the present invention is not limited to this; the adhesive 140 may also remain on the surface 106s without removal. Next, the circuit board 100, sealing layer 106, sealing layer 180, and intermediate substrate 103 can be cut by means such as mechanical cutting, laser cutting, or ion beam cutting to form a structure as described above. Figure 3A The electronic packaging unit 30' shown is shown.

[0051] After completing the cutting steps, such as Figure 3B As shown, a conductive layer 190 is deposited on the sealing layer 180. To achieve electromagnetic shielding, the conductive layer 190 must cover electronic components 160a and 160b. Specifically, in this embodiment, the conductive layer 190 completely covers the sealing layer 180, and consequently completely covers electronic components 160a and 160b. Furthermore, the conductive layer 190 also completely covers the sidewalls 30w of the electronic package unit 30', ensuring that the sides of electronic components 160a and 160b are also shielded. The material of the conductive layer 190 can include metals (e.g., copper, nickel, or alloys), conductive adhesives, or other materials, and can be deposited by spraying, sputtering, chemical plating, or similar methods.

[0052] Thus, this invention also discloses an electronic packaging module, the structure of which can be found in at least one embodiment. Figure 3BAs shown, the electronic packaging module 30 of this embodiment includes a carrier circuit board 10, electronic components 160a and 160b, and a sealing layer 180. The carrier circuit board 10 includes a circuit substrate 100, electronic components 102, an intermediate substrate 103, and a sealing layer 106. The circuit substrate 100 has a surface 100f and a surface 100s opposite to the surface 100f, and the electronic components 102 and the intermediate substrate 103 are both located on the surface 100s of the circuit substrate 100. The sealing layer 106 is also located on the surface 100s of the circuit substrate 100 and covers the electronic components 102.

[0053] Please continue to refer to this. Figure 3B The carrier circuit board 10 also includes an opening 120, a surface 100f, and a surface 106s opposite to the surface 100f, with the opening 120 connecting the surface 100f and the surface 106s of the carrier circuit board 10. An electronic component 160a is located on the surface 100f of the carrier circuit board 10, wherein electronic component 160a, electronic component 102, and the intermediate substrate 103 are electrically connected to the circuit board 100 via solder joints 104. On the other hand, an electronic component 160b is located within the opening 120 of the carrier circuit board 10 and is electrically connected to the carrier circuit board 10 by soldering material 170 to a pad 108 on the circuit board 100.

[0054] Although in such Figure 3B In the illustrated embodiment, the electronic packaging module 30 includes a sealing layer 180 and a sealing layer 106, wherein the sealing layer 180 covers electronic components 160a and 160b, and the sealing layer 106 covers electronic component 102. However, since the sealing layer 180 and the sealing layer 106 typically contain the same material, the boundary between them can be ignored, and they can be considered as a single sealed structure 320.

[0055] It should be particularly noted that in various embodiments of the present invention, the thickness T1 of electronic component 160a is less than the thickness T2 of electronic component 160b. Furthermore, when other embodiments of the present invention include electronic component 102, the thickness T3 of electronic component 102 is also less than the thickness T2 of electronic component 160b. It is worth mentioning that in another embodiment of the present invention, the electronic packaging module 30 further includes a retainer 140 located at one end of the opening 120 and overlapping the opening 120. The retainer 140 connects to the electronic component 160b, and the retainer 140 can directly contact the electronic component 160b.

[0056] Please return Figure 3BThe electronic packaging module 30 further includes a conductive layer 190, which is located on the sealing layer 180 and completely covers electronic components 160a and 160b. However, in other embodiments of the invention, the electronic packaging module may not include a conductive layer. Therefore, the electronic packaging module 30 is not limited to including a conductive layer 190.

[0057] Please refer to Figure 4 In another embodiment of the invention, the electronic packaging module 40 further includes a motherboard 401, which is electrically connected to the carrier circuit board 10 via a plurality of solder joints 404. These solder joints 404 are similar to solder joints 104 and may be solder balls, copper pillars, or various connection structures suitable for electrical connection. More specifically, the solder joints 404 are connected to the contact surfaces 103i of the interposer substrate 103, and the interposer substrate 103 is electrically connected to the motherboard 401 via pads (not shown) exposed on the motherboard 401, wherein the contact surfaces 103i of the interposer substrate 103 face the motherboard 401. Furthermore, the electronic packaging module 40 in this embodiment may also include a retainer 140.

[0058] Although the above Figures 1A to 1C In one embodiment, the step of forming the carrier circuit board 10 includes setting electronic components 102 and an intermediate substrate 103 on the circuit substrate 100, and also includes forming a sealing layer 106 on the circuit substrate 100. However, in another embodiment of the present invention, all of the above steps can be omitted. In other words, the carrier circuit board 10 may only include the circuit substrate 100, and subsequent processes can be directly performed on the circuit substrate 100. Figures 1D to 1G as well as Figure 3A The steps. After these steps, a shape is formed as follows. Figure 5 The electronic packaging module 50 shown.

[0059] The main difference between electronic packaging module 50 and electronic packaging module 30 is that electronic packaging module 30 is a double-sided encapsulation module, while electronic packaging module 50 is a single-sided encapsulation module. That is, in Figure 3B In the electronic packaging module 30, electronic components (electronic component 160a and electronic component 102) are provided on both sides (surface 100f and surface 100s) of the circuit board 100, and Figure 5 The electronic packaging module 50 has electronic components 160a only on one side (surface 100f) of the circuit board 100. In addition, the electronic packaging module 50 may also include a conductive layer 190 as in the electronic packaging module 30 to electromagnetically shield electronic components 160a and 160b.

[0060] The electronic packaging module 50 may also include, for example, Figure 4 The motherboard 401 shown. It should be noted that, since the carrier circuit board 10 in this embodiment only includes the circuit board 100, therefore... Figure 1C The surfaces of the carrier circuit board 10 on both sides are equivalent to Figure 5 The circuit board 100 has two opposing surfaces 100f and 100s. Therefore, the carrier circuit board 10 is electrically connected to the motherboard 401 via multiple solder points 404, and these solder points 404 are disposed on the surface 100s of the circuit board 100. Furthermore, the electronic packaging module 50 may also include a retainer 140, which must be disposed on the surface 100s of the circuit board 100.

[0061] In summary, in this invention, the electronic components located on the surface of the circuit board are thinner, while the electronic components located in the openings of the supporting circuit board are thicker. This configuration ensures that the top surface of the thicker electronic component does not protrude too much from the top surface of the thinner electronic component, and can even be flush with or lower than the top surface of the thinner electronic component. When the difference between the top surfaces of the electronic components is reduced, it is no longer necessary to increase the thickness of the sealing layer to cover the more protruding electronic components. Therefore, the thickness of the electronic packaging module can be reduced, thereby achieving the effect of thinner and lighter electronic devices, and also helping to save on the material cost of the sealing layer.

[0062] Although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A method for manufacturing an electronic packaging module, characterized in that, The method includes: A carrier circuit board is formed, comprising a first surface and a second surface, wherein the first surface and the second surface are respectively located on both sides of the carrier circuit board; A portion of the carrier circuit board is removed to form an opening, wherein the opening extends along the normal direction of the carrier circuit board and connects the first surface and the second surface; A fixation element is provided on the carrier circuit board, and the fixation element is attached to the second surface of the carrier circuit board, wherein the fixation element overlaps with the opening; A first electronic component is disposed on the first surface of the carrier circuit board; A second electronic component is disposed on the fixation material, such that the second electronic component passes through the opening; The second electronic component is electrically connected to the carrier circuit board; as well as After electrically connecting the second electronic component and the carrier circuit board, a first sealing layer is formed on the carrier circuit board, wherein the first sealing layer covers the first electronic component and the second electronic component, and the step of electrically connecting the second electronic component to the carrier circuit board includes: A pad on the carrier circuit board and the second electronic component are connected by a soldering material using a soldering method, wherein the soldering material is disposed on the first surface and the second electronic component; The steps for forming the carrier circuit board include: A third electronic component is disposed on a circuit board having a first surface and a third surface opposite the first surface, wherein the third electronic component is located on the third surface, and wherein after a second electronic component is disposed on the adhesive, the second electronic component protrudes from the first surface and the third surface; and A second sealing layer is formed on the third surface to cover the third electronic component, wherein the second sealing layer has the second surface.

2. The manufacturing method of the electronic packaging module as described in claim 1, characterized in that, The steps for setting the fixation include: An adhesive tape is attached to the second surface, wherein the adhesive tape covers the opening.

3. The manufacturing method of the electronic packaging module as described in claim 1, characterized in that, After the first sealing layer is formed, the adhesive is removed.

4. The manufacturing method of the electronic packaging module as described in claim 1, characterized in that, Also includes: A conductive layer is deposited on the first sealing layer, and the conductive layer covers the first electronic component and the second electronic component.

5. An electronic packaging module, characterized in that, Include: A carrier circuit board includes an opening, a first surface, and a second surface opposite to the first surface, the opening communicating between the first surface and the second surface of the carrier circuit board; A first electronic component is located on the first surface of the carrier circuit board; A second electronic component is located within the opening and is electrically connected to the carrier circuit board; A first sealing layer covers the first electronic component and the second electronic component; The thickness of the first electronic component is less than the thickness of the second electronic component; as well as Welding material is disposed on the first surface and the second electronic component, and connects the first surface and the second electronic component; The carrier circuit board further includes: A circuit board having a first surface and a third surface opposite to the first surface; A third electronic component is located on the third surface of the circuit board; as well as A second sealing layer is located on the third surface of the circuit board and covers the third electronic component, wherein the second electronic component protrudes from the first surface and the third surface.

6. The electronic packaging module as described in claim 5, characterized in that, Also includes: An anchor is located at one end of the opening and overlaps the opening, wherein the anchor is connected to the second electronic component.

7. The electronic packaging module as described in claim 5, characterized in that, Also includes: A carrier board is electrically connected to the carrier circuit board.

8. The electronic packaging module as described in claim 5, characterized in that, Also includes: A conductive layer is located on the first sealing layer and completely covers the first electronic component and the second electronic component.

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