Heat conduction device, battery pack and electric device

Abstract

The application discloses a heat conduction device, a battery pack and an electric equipment. The heat conduction device comprises a first structure layer, a second structure layer and an intermediate layer assembly. The second structure layer is arranged along a first direction and is connected with the first structure layer. The intermediate layer assembly is located between the first structure layer and the second structure layer along the first direction and is connected with the first structure layer and the second structure layer. The intermediate layer assembly is provided with a through slot penetrating along the first direction. The first structure layer and the second structure layer cover the through slot and form a communicated flow channel. The heat conduction device is beneficial to simplifying a processing technology, reducing the thickness of each layer structure, reducing the total thickness of the heat conduction device, reducing the influence of the heat conduction device on the space utilization rate of the battery pack and reducing the cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of batteries, in particular to a heat conduction device, a battery pack and an electric device. BACKGROUND

[0002] The battery pack generates heat during operation. In order to reduce the influence of temperature rise on the battery pack, a heat dissipation device, such as a liquid cooling plate, is usually arranged in the battery pack. However, due to the structural characteristics of the liquid cooling plate, it occupies a large volume, reduces the space utilization rate of the battery pack, and the manufacturing cost of the liquid cooling plate is also high, which increases the manufacturing cost of the battery pack. SUMMARY

[0003] In view of the above situation, it is necessary to provide a heat conduction device which can reduce the cost of a battery pack containing the heat conduction device and reduce the influence on the space utilization rate of the battery pack.

[0004] Embodiments of the present application provide a heat conduction device, comprising a first structure layer, a second structure layer and an intermediate layer assembly, the second structure layer and the first structure layer are arranged along a first direction and connected to each other, and the intermediate layer assembly is located between the first structure layer and the second structure layer along the first direction and connects the first structure layer and the second structure layer. The intermediate layer assembly is provided with a through slot penetrating along the first direction, and the first structure layer and the second structure layer cover the through slot and form a communicating flow channel.

[0005] In the heat conduction device described above, the through slot is arranged by the intermediate layer assembly, and the first structure layer and the second structure layer cover the through slot and form a communicating flow channel, which is beneficial to simplify the processing technology of the heat conduction device, can reduce the thickness of each layer structure, reduce the total thickness of the heat conduction device, and also reduce the processing and manufacturing cost of the heat conduction device.

[0006] In some embodiments of the present application, the first structure layer is made of an aluminum plastic film layer or a polyimide film, which is beneficial to improve the flexibility of the first structure layer and facilitate the bending of the first structure layer, so that the heat conduction device can adapt to different application scenarios.

[0007] In some embodiments of the present application, the second structure layer is made of an aluminum plastic film layer or a polyimide film, which is beneficial to improve the flexibility of the second structure layer and facilitate the bending of the second structure layer, so that the heat conduction device can adapt to different application scenarios.

[0008] In some embodiments of the present application, the intermediate layer assembly is made of polycarbonate, carbon fiber or rubber, which is beneficial to improve the flexibility of the intermediate layer assembly and facilitate the bending of the intermediate layer assembly, so that the heat conduction device can adapt to different application scenarios, and also beneficial to improve the chemical stability of the intermediate layer assembly and reduce the risk of corrosion of the intermediate layer assembly by the cooling medium.

[0009] In some embodiments of the present application, the intermediate layer assembly is integrally connected with the first structural layer and the second structural layer through hot pressing, which is conducive to simplifying the assembly process of the heat conduction device, improving the assembly efficiency, and improving the sealing performance of the heat conduction device and reducing the risk of leakage of the cooling medium from the flow channel.

[0010] In some embodiments of the present application, the thickness of the first structural layer along the first direction is less than or equal to 1 mm, which is conducive to reducing the total thickness of the heat conduction device.

[0011] In some embodiments of the present application, the thickness of the second structural layer along the first direction is less than or equal to 1 mm, which is conducive to reducing the total thickness of the heat conduction device.

[0012] In some embodiments of the present application, the thickness of the intermediate layer assembly along the first direction is less than or equal to 1 mm, which is conducive to reducing the total thickness of the heat conduction device.

[0013] In some embodiments of the present application, the thickness of the first structural layer along the first direction is greater than or equal to 0.2 mm and less than or equal to 0.7 mm, which is conducive to further reducing the total thickness of the heat conduction device.

[0014] In some embodiments of the present application, the thickness of the second structural layer along the first direction is greater than or equal to 0.2 mm and less than or equal to 0.7 mm, which is conducive to further reducing the total thickness of the heat conduction device.

[0015] In some embodiments of the present application, the thickness of the intermediate layer assembly along the first direction is greater than or equal to 0.5 mm and less than or equal to 0.7 mm, which is conducive to further reducing the total thickness of the heat conduction device.

[0016] In some embodiments of the present application, the intermediate layer assembly is integrally formed, which facilitates the processing of the through groove and reduces the processing and manufacturing cost of the heat conduction device.

[0017] In some embodiments of the present application, the number of intermediate layer assemblies is multiple, and all the intermediate layer assemblies are stacked along the first direction. By adjusting the number of intermediate layer assemblies, the total thickness of the heat conduction device can be adjusted, so that the heat conduction device can be applied to different scenes, and the applicability of the heat conduction device is improved.

[0018] In some embodiments of the present application, the intermediate layer assembly comprises a frame and a plurality of flow guiding portions, the frame surrounds to form a containing portion penetrating along the first direction, and the plurality of flow guiding portions are arranged in the containing portion at intervals, and the gaps between different flow guiding portions and the gaps between the flow guiding portions and the frame form the through groove. The intermediate layer assembly is designed in a split type, which is conducive to further simplifying the processing and manufacturing process of the intermediate layer assembly and saving the manufacturing cost of the heat conduction device.

[0019] In some embodiments of the present application, the flow guide is a multi-layer structure, and part of the flow guide is arranged in a stacked manner along the first direction. By adjusting the number of stacked flow guides, the total thickness of the heat conduction device can be adjusted, so that the heat conduction device can be used in different application scenarios, and the applicability of the heat conduction device is improved.

[0020] In some embodiments of the present application, the heat conduction device is provided with a first opening and a second opening, the first opening and the second opening are communicated through the flow channel, the first opening is configured to input the heat conduction medium, and the second opening is configured to output the heat conduction medium. The cooling medium in the flow channel can form an external circulation through the first opening and the second opening, which is beneficial to further improve the cooling effect of the heat conduction device.

[0021] In some embodiments of the present application, the flow channel includes a first main flow channel, a second main flow channel and N branch flow channels, the first main flow channel is communicated with the first opening, the second main flow channel is communicated with the second opening, and the N branch flow channels are communicated with the first main flow channel and the second main flow channel, which is beneficial to improve the cooling area of the heat conduction device and improve the heat conduction effect between the heat conduction device and the battery cell.

[0022] In some embodiments of the present application, the cross-sectional area of each branch flow channel gradually increases in the direction away from the first opening. The flow rate of the cooling medium in the branch flow channel away from the first opening is slow, so the cross-sectional area of the branch flow channel away from the first opening is large, which is beneficial to reduce the cooling medium flow difference per unit time in different branch flow channels and improve the uniformity of the heat conduction effect at different positions of the heat conduction device.

[0023] Embodiments of the present application also provide a battery pack, which includes a shell, a plurality of battery cells and the heat conduction device of any one of the preceding embodiments, and the battery cells are arranged in the shell.

[0024] In the above battery pack, the through slot is arranged through the intermediate layer assembly, and the first structure layer and the second structure layer cover the through slot and form the communicated flow channel, which is beneficial to simplify the processing technology of the heat conduction device, reduce the thickness of each layer structure, reduce the total thickness of the heat conduction device, reduce the influence of the heat conduction device on the space utilization rate of the battery pack, reduce the influence of the low space utilization rate of the battery pack on the electrical equipment; it can also reduce the processing cost of the heat conduction device and reduce the manufacturing cost of the battery pack.

[0025] In some embodiments of the present application, at least part of the heat conduction device is located between two adjacent battery cells, the heat conduction device includes a bending portion, the heat conduction device is bent and deformed at the bending portion region, and the minimum bending radius of the bending portion is 2mm, which is beneficial to bend the heat conduction device to be connected to the battery cell, increase the area of the heat conduction device contacting the battery cell, and improve the heat conduction effect between the heat conduction device and the battery cell.

[0026] In some embodiments of the present application, the battery pack further comprises a cooling medium capable of flowing through the flow channel; the cooling medium comprises but is not limited to liquid pesticide, fluoride solution, water, glycol solution or deionized water solution.

[0027] The embodiments of the present application further provide a power consuming device comprising the battery pack according to any one of the preceding embodiments.

[0028] In the power consuming device described above, the heat conduction device of the battery pack is provided with a through slot through the intermediate layer assembly, and the first structural layer and the second structural layer cover the through slot and form a continuous flow channel, which is conducive to simplifying the processing technology of the heat conduction device, reducing the thickness of each layer structure, reducing the total thickness of the heat conduction device, reducing the influence of the heat conduction device on the space utilization rate of the battery pack, reducing the influence of the battery pack on the power consuming device due to the low space utilization rate; it can also reduce the processing cost of the heat conduction device, reduce the manufacturing cost of the battery pack, and reduce the manufacturing cost of the power consuming device.

[0029] In some embodiments of the present application, the power consuming device further comprises a flow guide device, the flow guide device is in communication with the flow channel, and the flow guide device can provide power to drive the cooling medium to flow. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 is a structural schematic diagram of the heat conduction device in an embodiment of the present application.

[0031] Figure 2 is an exploded view of the heat conduction device in an embodiment of the present application.

[0032] Figure 3 is a view of the heat conduction device in an embodiment of the present application along a first direction.

[0033] Figure 4 is a view of the heat conduction device in an embodiment of the present application along a first direction.

[0034] Figure 5 is a view of the intermediate layer assembly in an embodiment of the present application along a first direction.

[0035] Figure 6 is an exploded view of the intermediate layer assembly in an embodiment of the present application.

[0036] Figure 7 is a view of the intermediate layer assembly in an embodiment of the present application along a first direction.

[0037] Figure 8 is a view of the intermediate layer assembly in an embodiment of the present application along a first direction.

[0038] Figure 9 is an exploded view of the heat conduction device in an embodiment of the present application.

[0039] Figure 10 is a structural schematic diagram of an intermediate layer assembly in an embodiment of the present application.

[0040] Figure 11 is a view of an intermediate layer assembly in an embodiment of the present application along a first direction.

[0041] Figure 12 is a structural schematic diagram of a battery pack in an embodiment of the present application.

[0042] Figure 13 is a structural schematic diagram of a heat conduction device connected with a stacked cell in an embodiment of the present application.

[0043] Figure 14 is a structural schematic diagram of a cell in an embodiment of the present application.

[0044] Figure 15 is a structural schematic diagram of a heat conduction device connected with a stacked cell in an embodiment of the present application.

[0045] Figure 16 is a structural schematic diagram of an electrical equipment in an embodiment of the present application.

[0046] Main element symbol explanation

[0047] Battery pack 100

[0048] Heat conduction device 10

[0049] First structural layer 11

[0050] Second structural layer 12

[0051] Intermediate layer assembly 13

[0052] Through slot 131

[0053] Frame 132

[0054] Flow guide part 133

[0055] Accommodation part 134

[0056] Flow channel 14

[0057] First main flow channel 141

[0058] Second main flow channel 142

[0059] Branch flow channel 143

[0060] First branch flow channel 144

[0061] Branch flow first opening 1441

[0062] Branch second opening 1442

[0063] First opening 151

[0064] Second opening 152

[0065] Fusion zone 16

[0066] First connecting piece 171

[0067] Second connecting piece 172

[0068] Bent portion 18

[0069] Connecting portion 19

[0070] Shell 20

[0071] Battery cell 30

[0072] Electric device 200

[0073] First direction Z

[0074] Second direction Y

[0075] Third direction X

[0076] The following detailed description will further describe the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0077] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.

[0078] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or a middle element can be present at the same time. When an element is considered to be "arranged on" another element, it can be directly arranged on the other element or a middle element can be present at the same time. In the present application, unless otherwise specified and limited, the terms "mounting", "connection", "linking", "fixing" and the like should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through a middle medium, or internal connection of two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0079] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. All publications, patent applications, patents, and other references mentioned in this specification are herein incorporated by reference in their entirety for the purpose of describing and disclosing, for example, the methodologies described in such publications that might be used in connection with the application. Throughout this application the word "comprise" or variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated integer or group of integers but not the exclusion of any other integer or group of integers.

[0080] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified.

[0081] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearance of the phrase in various places in the specification is not necessarily all referring to the same embodiment, nor is it necessarily a separate or alternative embodiment to other embodiments. The various embodiments in the present application can be combined with each other, without conflict.

[0082] It should be noted that the thickness, length, width and other dimensions of various components in the embodiments of the present application shown in the drawings, and the overall thickness, length, width and other dimensions of the integrated device are only exemplary and should not constitute any limitation on the present application.

[0083] The embodiments of the present application provide a heat conduction device, comprising a first structure layer, a second structure layer and an intermediate layer assembly, the second structure layer and the first structure layer are arranged along a first direction and connected to each other, and the intermediate layer assembly is located between the first structure layer and the second structure layer along the first direction and connects the first structure layer and the second structure layer. The intermediate layer assembly is provided with a through slot penetrating along the first direction, and the first structure layer and the second structure layer cover the through slot and form a communicating flow channel.

[0084] In the heat conduction device described above, the through slot is provided by the intermediate layer assembly, and the first structure layer and the second structure layer cover the through slot and form a communicating flow channel, which is beneficial to simplify the processing technology of the heat conduction device, can reduce the thickness of each layer structure, reduce the total thickness of the heat conduction device, and also can reduce the processing cost of the heat conduction device.

[0085] The embodiments of the present application will be further described below with reference to the accompanying drawings.

[0086] As Figure 1 and Figure 2As shown, the embodiment of the present application provides a heat conduction device 10, comprising a first structural layer 11, a second structural layer 12 and an intermediate layer assembly 13, the second structural layer 12 is arranged along the first direction Z and connected with the first structural layer 11, the intermediate layer assembly 13 is located between the first structural layer 11 and the second structural layer 12 along the first direction Z and connects the first structural layer 11 and the second structural layer 12. The intermediate layer assembly 13 is provided with a through slot 131 penetrating along the first direction Z, and the first structural layer 11 and the second structural layer 12 both cover the through slot 131 and form a communicating flow channel 14.

[0087] In the heat conduction device 10 described above, the through slot 131 is arranged in the intermediate layer assembly 13, and the first structural layer 11 and the second structural layer 12 cover the through slot 131 and form the flow channel 14, which is beneficial to simplify the processing technology of the heat conduction device 10, can reduce the thickness of each layer structure, reduce the total thickness of the heat conduction device 10, and also can reduce the processing cost of the heat conduction device 10.

[0088] In an embodiment, the intermediate layer assembly 13 can be processed to form the through slot 131 by die cutting process. Compared with the traditional technology of punching a groove on the lower plate to form a flow channel 14, the intermediate layer assembly 13 is processed by die cutting process, which not only saves cost, but also is beneficial to thin the thickness of the intermediate layer assembly 13, thereby reducing the total thickness of the heat conduction device 10.

[0089] In an embodiment, during the flow of the heat conduction medium in the flow channel 14, the heat conduction medium can exchange heat with the heat conduction device 10, so as to change the temperature of the heat conduction device 10. In an embodiment, the heat conduction medium is a cooling medium, which can cool the heat conduction device 10. In an embodiment, the heat conduction medium is a heating medium, which can heat the heat conduction device 10.

[0090] As an example, the heat conduction medium is taken as a cooling medium for further description.

[0091] In an embodiment, the first structural layer 11 is made of an aluminum plastic film layer or a polyimide film, which is beneficial to improve the flexibility of the first structural layer 11, facilitate the bending of the first structural layer 11, so that the heat conduction device 10 can adapt to different application scenarios, and also is beneficial to improve the wear resistance of the first structural layer 11, reduce the risk of damage of the heat conduction device 10.

[0092] In an embodiment, the second structural layer 12 is made of an aluminum plastic film layer or a polyimide film, which is beneficial to improve the flexibility of the second structural layer 12, facilitate the bending of the second structural layer 12, so that the heat conduction device 10 can adapt to different application scenarios, and also is beneficial to improve the wear resistance of the second structural layer 12, reduce the risk of damage of the heat conduction device 10.

[0093] In an embodiment, the intermediate layer assembly 13 is made of polycarbonate, carbon fiber or rubber, which is advantageous for improving the flexibility of the intermediate layer assembly 13, facilitating the bending of the intermediate layer assembly 13, so that the heat conduction device 10 can adapt to different application scenarios, and the polycarbonate or carbon fiber material is also advantageous for improving the chemical stability of the intermediate layer assembly 13, reducing the risk of corrosion of the intermediate layer assembly 13 by the cooling medium.

[0094] In an embodiment, the thickness of the first structural layer 11 along the first direction Z is less than or equal to 1 mm, which is advantageous for reducing the total thickness of the heat conduction device 10, and also advantageous for improving the flexibility of the first structural layer 11, facilitating the bending of the first structural layer 11, so that the heat conduction device 10 can adapt to different application scenarios.

[0095] In an embodiment, the thickness of the first structural layer 11 along the first direction Z is greater than or equal to 0.2 mm and less than or equal to 0.7 mm, which is advantageous for further reducing the total thickness of the heat conduction device 10, and further advantageous for the bending of the first structural layer 11, so that the heat conduction device 10 can adapt to different application scenarios.

[0096] In an embodiment, the thickness of the first structural layer 11 along the first direction Z is any one of 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm and 1 mm, which is advantageous for reducing the total thickness of the heat conduction device 10, and also advantageous for the bending of the first structural layer 11, so that the heat conduction device 10 can adapt to different application scenarios.

[0097] In an embodiment, the thickness of the second structural layer 12 along the first direction Z is less than or equal to 1 mm, which is advantageous for reducing the total thickness of the heat conduction device 10, and also advantageous for the bending of the second structural layer 12, so that the heat conduction device 10 can adapt to different application scenarios.

[0098] In an embodiment, the thickness of the second structural layer 12 along the first direction Z is greater than or equal to 0.2 mm and less than or equal to 0.7 mm, which is advantageous for further reducing the total thickness of the heat conduction device 10, and further advantageous for the bending of the second structural layer 12, so that the heat conduction device 10 can adapt to different application scenarios.

[0099] In an embodiment, the thickness of the second structural layer 12 along the first direction Z is any one of 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm and 1 mm, which is advantageous for reducing the total thickness of the heat conduction device 10, and also advantageous for the bending of the second structural layer 12, so that the heat conduction device 10 can adapt to different application scenarios.

[0100] In an embodiment, the thickness of the intermediate layer assembly 13 along the first direction Z is less than or equal to 1 mm, which is conducive to reducing the overall thickness of the heat conduction device 10 and facilitating the bending of the intermediate layer assembly 13 so that the heat conduction device 10 can adapt to different application scenarios.

[0101] In an embodiment, the thickness of the intermediate layer assembly 13 along the first direction Z is greater than or equal to 0.5 mm and less than or equal to 0.7 mm, which is conducive to further reducing the overall thickness of the heat conduction device 10 and further facilitating the bending of the intermediate layer assembly 13 so that the heat conduction device 10 can adapt to different application scenarios.

[0102] In an embodiment, the thickness of the intermediate layer assembly 13 along the first direction Z is any one of 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm and 1 mm, which is conducive to reducing the overall thickness of the heat conduction device 10 and facilitating the bending of the intermediate layer assembly 13 so that the heat conduction device 10 can adapt to different application scenarios.

[0103] As shown in Figure 2 and Figure 3 In an embodiment, the intermediate layer assembly 13 is integrally connected with the first structural layer 11 and the second structural layer 12 through hot pressing, which is conducive to simplifying the assembly process of the heat conduction device 10, improving the assembly efficiency, and further improving the sealing performance of the heat conduction device 10 and reducing the risk of leakage of the cooling medium from the flow channel 14.

[0104] In an embodiment, the intermediate layer assembly 13 and the first structural layer 11 and the second structural layer 12 form a fusion zone 16 through hot pressing, and the fusion zone 16 is arranged around, and along the first direction Z, the projection of the flow channel 14 is located within the projection of the area surrounded by the fusion zone 16, which is not only conducive to improving the stability of the intermediate layer assembly 13 connecting the first structural layer 11 and the second structural layer 12 and improving the anti-vibration performance of the heat conduction device 10, but also conducive to improving the sealing performance of the heat conduction device 10 and reducing the risk of leakage of the cooling medium in the flow channel 14.

[0105] As shown in Figure 2 and Figure 4 In an embodiment, the first structural layer 11 and the second structural layer 12 form a fusion zone 16 through hot pressing, and the fusion zone 16 is arranged around, and along the first direction Z, the projection of the intermediate layer assembly 13 is located within the projection of the area surrounded by the fusion zone 16, which is conducive to reducing the area of the intermediate layer assembly 13, saving the amount of the intermediate layer assembly 13, and saving the manufacturing cost of the heat conduction device 10. Alternatively, along the first direction Z, the projection of the intermediate layer assembly 13 is separated from the projection of the fusion zone 16.

[0106] In an embodiment, one end of the intermediate layer assembly 13 is connected to the first structural layer 11 and the other end of the intermediate layer assembly 13 is connected to the second structural layer 12 along the first direction Z, and the first structural layer 11 and the second structural layer 12 clamp and fix the intermediate layer assembly 13, which is conducive to reducing the risk of the intermediate layer assembly 13 moving in the first structural layer 11 and the second structural layer 12, and improving the anti-vibration performance of the heat conduction device 10.

[0107] In an embodiment, the intermediate layer assembly 13 is integrally formed, which facilitates the processing of the through groove 131 and reduces the processing and manufacturing cost of the heat conduction device 10.

[0108] In an embodiment, the number of intermediate layer assemblies 13 is multiple (not shown in the figure), and all the intermediate layer assemblies 13 are stacked along the first direction Z. By adjusting the number of intermediate layer assemblies 13, the total thickness of the heat conduction device 10 can be adjusted, so that the heat conduction device 10 can be used in different application scenarios, and the applicability of the heat conduction device 10 is improved. For example, when the heat conduction device 10 needs to be applied to a scene with relatively tight space, by reducing the number of intermediate layer assemblies 13, the total thickness of the heat conduction device 10 can be reduced to reduce its impact on space; when the heat conduction device 10 needs to have a filling property, by increasing the number of intermediate layer assemblies 13, the total thickness of the heat conduction device 10 can be increased to make it play a filling role.

[0109] As shown in Figure 2 , Figure 5 and Figure 6 , in an embodiment, the intermediate layer assembly 13 is a split structure, including a frame 132 and a plurality of flow guide parts 133, the frame 132 surrounds to form a containing part 134 penetrating along the first direction Z, and the plurality of flow guide parts 133 are arranged in the containing part 134 at intervals, and the gaps between different flow guide parts 133 and the gaps between the flow guide parts 133 and the frame 132 form the through groove 131. The split design of the intermediate layer assembly 13 is conducive to further simplifying the processing and manufacturing process of the intermediate layer assembly 13 and saving the manufacturing cost of the heat conduction device 10.

[0110] In an embodiment, along the first direction Z, the first structural layer 11 and the second structural layer 12 clamp and fix the frame 132 and the flow guide part 133, which is conducive to reducing the risk of the frame 132 and the flow guide part 133 moving and improving the anti-vibration performance of the heat conduction device 10. The first structural layer 11 and the second structural layer 12 close the two ends of the through groove 131 along the first direction Z to form the flow channel 14.

[0111] In an embodiment, the flow guide part 133 is a multi-layer structure, and different layers of the flow guide part 133 are stacked along the first direction Z. By adjusting the number of stacked flow guide parts 133, the total thickness of the heat conduction device 10 can be adjusted, so that the heat conduction device 10 can be used in different application scenarios, and the applicability of the heat conduction device 10 is improved.

[0112] In an embodiment, the heat conduction device 10 is provided with a first opening 151 and a second opening 152, the first opening 151 and the second opening 152 are communicated through the flow channel 14, the first opening 151 is configured to input the cooling medium, and the second opening 152 is configured to output the cooling medium. By providing the first opening 151 and the second opening 152, the cooling medium can enter the flow channel 14 through the first opening 151 and flow out from the second opening 152, so that the cooling medium in the flow channel 14 can form an external circulation, which is beneficial to further improve the cooling effect of the heat conduction device 10.

[0113] In an embodiment, the first opening 151 is arranged in the first structural layer 11 and penetrates the first structural layer 11. In an embodiment, the first opening 151 is arranged in the second structural layer 12 and penetrates the second structural layer 12 (not shown in the figure). In an embodiment, the first opening 151 is arranged in the region where the first structural layer 11 and the second structural layer 12 are connected (not shown in the figure), for example, the first structural layer 11 and the second structural layer 12 are fused and connected by a hot pressing device, and the first opening 151 is arranged in the fusion region and penetrates the fusion region.

[0114] In an embodiment, the second opening 152 is arranged in the first structural layer 11 and penetrates the first structural layer 11. In an embodiment, the second opening 152 is arranged in the second structural layer 12 and penetrates the second structural layer 12 (not shown in the figure). In an embodiment, the second opening 152 is arranged in the region where the first structural layer 11 and the second structural layer 12 are connected (not shown in the figure), for example, the first structural layer 11 and the second structural layer 12 are fused and connected by a hot pressing device, and the second opening 152 is arranged in the fusion region and penetrates the fusion region.

[0115] As an example, the following is further described by taking an example that the first opening 151 and the second opening 152 are both arranged in the first structural layer 11 and penetrate the first structural layer 11.

[0116] In an embodiment, the flow channel 14 includes a first main flow channel 141, a second main flow channel 142, and N branch flow channels 143, the first main flow channel 141 is communicated with the first opening 151, the second main flow channel 142 is communicated with the second opening 152, and the N branch flow channels 143 are communicated with the first main flow channel 141 and the second main flow channel 142. After the cooling medium enters the first main flow channel 141 through the first opening 151, it enters each different branch flow channel 143 along the first main flow channel 141, and converges in the second main flow channel 142, and finally flows out from the second opening 152. By providing N branch flow channels 143, the cooling medium in the flow channel 14 can connect different regions of the first structural layer 11 and the second structural layer 12, improve the cooling area of the heat conduction device 10, and improve the cooling effect. Wherein, N is an integer greater than 1.

[0117] In an embodiment, the first opening 151 and the second opening 152 are located at the same end of the heat conduction device 10 along the second direction Y. The first opening 151 and the second opening 152 are arranged along the third direction X, the first main flow channel 141 and the second main flow channel 142 are arranged, and the N branch flow channels 143 are located between the first main flow channel 141 and the second main flow channel 142. Along the second direction Y, the N branch flow channels 143 are arranged, which is conducive to connecting the first structural layer 11 and the second structural layer 12 in different areas by the cooling medium in the flow channel 14, improving the cooling area of the heat conduction device 10, and improving the cooling effect. The second direction Y is perpendicular to the first direction Z, and the third direction X is perpendicular to the first direction Z and the second direction Y.

[0118] In an embodiment, as viewed along the first direction Z, each branch flow channel 143 is arranged to be bent, which is conducive to increasing the contact area between the cooling medium in the branch flow channel 143 and the first structural layer 11, and increasing the contact area between the cooling medium in the branch flow channel 143 and the second structural layer 12, improving the cooling area of the heat conduction device 10, and improving the cooling effect.

[0119] In an embodiment, along the direction opposite to the second direction Y, that is, along the direction away from the first opening 151, the cross-sectional area of each branch flow channel 143 gradually increases.

[0120] After the cooling medium enters the flow channel 14 through the first opening 151, it flows along the first main flow channel 141 and enters each branch flow channel 143. Along the direction away from the first opening 151, the flow rate of the cooling medium in the first main flow channel 141 becomes smaller and slower, resulting in that the flow rate and the flow per unit time of the cooling medium in the branch flow channel 143 away from the first opening 151 are small, and the heat dissipation effect of the first structural layer 11 and the second structural layer 12 away from the first opening 151 is poor. Along the direction away from the first opening 151, the cross-sectional area of each branch flow channel 143 gradually increases, which is conducive to balancing the flow of the cooling medium in different branch flow channels 143, balancing the heat dissipation effect of different areas of the first structural layer 11 and the second structural layer 12, and improving the uniformity of the heat conduction effect at different positions of the heat conduction device 10.

[0121] As Figure 2 and Figure 7As shown, in an embodiment, along the reverse direction of the second direction Y, the branch runner 143 farthest from the first opening 151 is defined as the first branch runner 144, the first branch runner 144 has a branch first opening 1441 and a branch second opening 1442, the branch first opening 1441 communicates with the first main runner 141, and the branch second opening 1442 communicates with the second main runner 142, the cooling medium in the first main runner 141 enters the first branch runner 144 through the branch first opening 1441, and enters the second main runner 142 through the branch second opening 1442.

[0122] In an embodiment, along the reverse direction of the second direction Y, the branch first opening 1441 is located at the end of the first main runner 141, which is conducive to increasing the area of the first main runner 141 filled with the cooling medium, increasing the area of the first structure layer 11 connected by the cooling medium, and increasing the area of the second structure layer 12 connected by the cooling medium, increasing the cooling area of the heat conduction device 10, and improving the cooling effect. At the same time, if the end of the first main runner 141 along the reverse direction of the second direction Y is separated from the branch first opening 1441, it is possible to cause the cooling medium to generate vortex flow in this area, resulting in excessive accumulation, affecting the uniformity of the heat conduction effect of the heat conduction device 10. While the end of the first main runner 141 along the reverse direction of the second direction Y is communicated with the branch first opening 1441, which is conducive to reducing the phenomenon of vortex flow of the cooling medium in this area, reducing the accumulation of the cooling medium in this area, and improving the uniformity of the heat conduction effect of the heat conduction device 10.

[0123] In an embodiment, along the reverse direction of the second direction Y, the branch second opening 1442 is located at the end of the second main runner 142, which is conducive to increasing the area of the second main runner 142 filled with the cooling medium, increasing the area of the first structure layer 11 connected by the cooling medium, and increasing the area of the second structure layer 12 connected by the cooling medium, increasing the cooling area of the heat conduction device 10, and improving the cooling effect. At the same time, if the end of the second main runner 142 along the reverse direction of the second direction Y is separated from the branch second opening 1442, it is possible to cause the cooling medium to generate vortex flow in this area, resulting in excessive accumulation, affecting the uniformity of the heat conduction effect of the heat conduction device 10. While the end of the second main runner 142 along the reverse direction of the second direction Y is communicated with the branch second opening 1442, which is conducive to reducing the phenomenon of vortex flow of the cooling medium in this area, reducing the accumulation of the cooling medium in this area, and improving the uniformity of the heat conduction effect of the heat conduction device 10.

[0124] As Figure 8As shown, in one embodiment, the first branch channel 144 has a plurality of branch first openings 1441, which are arranged along the second direction Y. This facilitates the entry of the cooling medium in the first main channel 141 into the first branch channel 144, and also helps to further reduce the phenomenon of eddies at the end of the first main channel 141, reduce the amount of cooling medium accumulating in this area, and improve the uniformity of the heat conduction effect of the heat conduction device 10.

[0125] In one embodiment, the first branch channel 144 has a plurality of branch second openings 1442, which are arranged along the second direction Y. This facilitates the entry of the cooling medium in the first branch channel 144 into the second main channel 142, and also helps to further reduce the phenomenon of eddies at the end of the second main channel 142, reduce the amount of cooling medium accumulating in this area, and improve the uniformity of the heat conduction effect of the heat conduction device 10.

[0126] like Figure 9 , Figure 10 and Figure 11 As shown, in one embodiment, a plurality of flow guides 133 are arranged along the second direction Y, the first main flow channel 141 and the second main flow channel 142 are respectively located at both ends of the intermediate layer assembly 13 along the third direction X, and the first opening 151 and the second opening 152 are respectively located at both ends of the first structural layer 11 along the third direction X.

[0127] In one embodiment, the flow guide 133 is a rib and extends along the third direction X, which helps to simplify the processing and manufacturing process of the flow guide 133, save the manufacturing cost of the flow guide 133, and also helps to arrange the flow guide 133, simplify the assembly process of the heat conduction device 10, and save the manufacturing cost of the heat conduction device 10.

[0128] In one embodiment, the cross-section of the flow guide 133 is rectangular along the cross-section perpendicular to the third direction X, and the length of the rectangle along the first direction Z is greater than its length along the second direction Y. This is beneficial to increase the size of the flow channel 14 along the first direction Z, increase the flow rate per unit area in the flow channel 14, and improve the cooling and heat dissipation effect of the heat conduction device 10.

[0129] In one embodiment, the cross-section of the flow guide 133 along the cross-section perpendicular to the third direction X is an inverted T-shape or an L-shape (not shown), which is beneficial for placing the flow guide 133 and for easy assembly.

[0130] like Figure 1 and Figure 2As shown, in an embodiment, the heat conduction device 10 further comprises a first connecting piece 171 and a second connecting piece 172, the first connecting piece 171 is arranged on the first structural layer 11 and communicates with the first opening 151, and the second connecting piece 172 is arranged on the first structural layer 11 and communicates with the second opening 152. By arranging the first connecting piece 171 and the second connecting piece 172, it is beneficial to externally connect the pipeline of the heat conduction device 10, to facilitate assembly, and to reduce the risk of leakage of the cooling medium at the first opening 151 or the second opening 152.

[0131] In summary, in the heat conduction device 10 of the present application, the through groove 131 is arranged in the intermediate layer assembly 13, and the first structural layer 11 and the second structural layer 12 cover the through groove 131 and form the flow channel 14, which is beneficial to simplify the processing technology of the heat conduction device 10, can reduce the thickness of each layer structure, reduce the total thickness of the heat conduction device 10, and also can reduce the processing cost of the heat conduction device 10.

[0132] As shown in Figure 12 and Figure 13 The embodiment of the present application also provides a battery pack 100, which comprises a housing 20, a plurality of battery cells 30, and the heat conduction device 10 of any one of the preceding embodiments, the battery cells 30 are arranged in the housing 20, and at least part of the heat conduction device 10 is located between two adjacent battery cells 30.

[0133] In the above-mentioned battery pack 100, by arranging at least part of the heat conduction device 10 between two adjacent battery cells 30, it is beneficial to adjust the temperature of the two battery cells 30 and improve the charge-discharge performance of the battery pack 100; further, by arranging the through groove 131 in the intermediate layer assembly 13, and covering the through groove 131 with the first structural layer 11 and the second structural layer 12 to form the flow channel 14, it is beneficial to simplify the processing technology of the heat conduction device 10, can reduce the thickness of each layer structure, reduce the total thickness of the heat conduction device 10, reduce the influence of the heat conduction device 10 on the space utilization rate of the battery pack 100, and reduce the influence of the low space utilization rate of the battery pack 100 on the electrical equipment 200; further, it can reduce the processing cost of the heat conduction device 10 and the manufacturing cost of the battery pack 100.

[0134] In an embodiment, the battery cell 30 is a soft-pack battery cell 30 or a square battery cell 30, and the plurality of battery cells 30 are arranged in a stacked manner.

[0135] In one embodiment, the heat-conducting device 10 includes a bending portion 18, in which the heat-conducting device 10 is bent and deformed. By providing the bending portion 18, it is beneficial to allow the heat-conducting device 10 to connect different battery cells 30 through deformation, so that the shape of the heat-conducting device 10 can adapt to different stacking forms of the battery cells 30, thereby increasing the contact area between the heat-conducting device 10 and the battery cells 30, improving the heat conduction effect between the heat-conducting device 10 and the battery cells 30, and also helping to reduce the impact of the heat-conducting device 10 on the internal space utilization of the battery pack 100, thereby increasing the energy density of the battery pack 100.

[0136] In one embodiment, the heat-conducting device 10 includes a plurality of bending portions 18 and a plurality of connecting portions 19. The plurality of connecting portions 19 are arranged along the stacking direction of the battery cells 30. Some connecting portions 19 are located between two adjacent battery cells 30 and connect the two battery cells 30. Two adjacent connecting portions 19 are connected by a bending portion 18. By providing a plurality of bending portions 18 and a plurality of connecting portions 19, it is beneficial to increase the contact area between the heat-conducting device 10 and the battery cells 30, thereby improving the heat conduction effect between the heat-conducting device 10 and the battery cells 30. In one embodiment, the different connecting portions 19 are parallel to each other along the stacking direction of the battery cells 30.

[0137] In one embodiment, the minimum bending radius of the bending portion 18 is 2 mm. This is beneficial for improving the bending deformation capability of the heat-conducting device 10, enhancing its applicability to the stacking configuration of the battery cells 30, increasing the contact area between the heat-conducting device 10 and the battery cells 30, improving the heat conduction effect between the heat-conducting device 10 and the battery cells 30, and also reducing the impact of the heat-conducting device 10 on the internal space utilization of the battery pack 100, thereby increasing the energy density of the battery pack 100. The bending radius of the bending portion 18 refers to the maximum inscribed circle radius of the bending portion 18; a smaller bending radius indicates a stronger deformation capability of the bending portion 18.

[0138] like Figure 14 and Figure 15 As shown, in one embodiment, the battery cell 30 is a cylindrical battery cell 30, and multiple battery cells 30 are stacked in a direction perpendicular to their axis.

[0139] In one embodiment, the heat-conducting device 10 includes a plurality of bends 18 connected end-to-end in sequence, with the bends 18 connecting to the surface of the battery cell 30. Viewed along the axial direction of the battery cell 30, some of the bends 18 are located between adjacent battery cells 30, and some bends 18 surround a certain battery cell 30. This is beneficial for increasing the contact area between the heat-conducting device 10 and the battery cell 30, improving the heat conduction effect between the heat-conducting device 10 and the battery cell 30, and also for reducing the impact of the heat-conducting device 10 on the internal space utilization of the battery pack 100, thereby increasing the energy density of the battery pack 100.

[0140] In an embodiment, the battery pack 100 further comprises a cooling medium, which is capable of flowing through the first opening 151, the flow channel 14 and the second opening 152, thereby taking away the heat on the surface of the heat conduction device 10, reducing the temperature of the battery cell 30, and reducing the influence of temperature rise on the performance of the battery pack 100.

[0141] In an embodiment, the cooling medium comprises, but is not limited to, liquid pesticide, fluoride solution, water, ethylene glycol aqueous solution or deionized water solution.

[0142] As shown in FIG. 1, an embodiment of the present application further provides a battery pack 100, which comprises the heat conduction device 10. Figure 16

[0143] In the above-mentioned electric device 200, the heat conduction device 10 of the battery pack 100 is provided with the through groove 131 through the intermediate layer assembly 13, and the first structural layer 11 and the second structural layer 12 cover the through groove 131 and form the continuous flow channel 14, which is beneficial to simplify the processing technology of the heat conduction device 10, reduce the thickness of each layer structure, reduce the total thickness of the heat conduction device 10, reduce the influence of the heat conduction device 10 on the space utilization rate of the battery pack 100, and reduce the influence of the battery pack 100 on the electric device 200 due to the low space utilization rate; it can also reduce the processing cost of the heat conduction device 10, reduce the manufacturing cost of the battery pack 100, and reduce the manufacturing cost of the electric device 200.

[0144] In an embodiment, the electric device 200 further comprises a flow guide device (not shown in the figure), which is connected to the first opening 151 and the second opening 152, and is capable of providing power to drive the cooling medium to flow.

[0145] In an embodiment, the electric device 200 comprises, but is not limited to, any one of the unmanned aerial vehicle, the electric scooter, the electric tool and the robot.

[0146] In addition, those skilled in the art can make other changes within the spirit of the present application, and of course, these changes made according to the spirit of the present application should be included in the scope disclosed by the present application.​

Claims

1. A heat-conducting device, characterized in that, include: First structural layer; The second structural layer is arranged and connected to the first structural layer along the first direction; An intermediate layer component is located between the first structural layer and the second structural layer along the first direction and connects the first structural layer and the second structural layer. The intermediate layer component is provided with a through groove that extends along the first direction. The first structural layer and the second structural layer both cover the through groove and form a connected flow channel. The heat-conducting device is provided with a first opening and a second opening, which are connected through the flow channel. The first opening is configured to input the heat-conducting medium, and the second opening is configured to output the heat-conducting medium. Along the second direction, the first opening and the second opening are located at the same end of the heat-conducting device, and the second direction is perpendicular to the first direction; the flow channel includes a first main channel, a second main channel and N branch channels, the first main channel is connected to the first opening, the second main channel is connected to the second opening, and the N branch channels are all connected to the first main channel and the second main channel, where N is an integer greater than 1; In the second direction, the cross-sectional area of ​​each of the branch channels gradually increases as it moves further away from the first opening.

2. The heat-conducting device as described in claim 1, characterized in that, The first structural layer is made of an aluminum-plastic film layer or a polyimide film; and / or, The second structural layer is made of an aluminum-plastic film layer or a polyimide film; and / or, The intermediate layer component is made of polycarbonate, carbon fiber, or rubber.

3. The heat-conducting device as described in claim 1, characterized in that, The intermediate layer component is integrally connected to the first structural layer and the second structural layer by hot pressing.

4. The heat-conducting device as described in claim 1, characterized in that, The thickness of the first structural layer along the first direction is less than or equal to 1 mm; and / or, The thickness of the second structural layer along the first direction is less than or equal to 1 mm; and / or, The thickness of the intermediate layer component along the first direction is less than or equal to 1 mm.

5. The heat-conducting device as described in claim 4, characterized in that, The thickness of the first structural layer along the first direction is greater than or equal to 0.2 mm and less than or equal to 0.7 mm; and / or, The thickness of the second structural layer along the first direction is greater than or equal to 0.2 mm and less than or equal to 0.7 mm; and / or, The thickness of the intermediate layer component along the first direction is greater than or equal to 0.5 mm and less than or equal to 0.7 mm.

6. The heat-conducting device as claimed in claim 1, characterized in that, The intermediate layer component is integrally molded.

7. The heat-conducting device as claimed in claim 1, characterized in that, The number of intermediate layer components is multiple, and all the intermediate layer components are stacked along the first direction.

8. The heat-conducting device as claimed in claim 1, characterized in that, The intermediate layer component includes: The border surrounds a receiving portion that extends through the first direction; Multiple flow guides are provided at intervals in the receiving portion, and the gaps between the different flow guides and the gap between the flow guides and the frame form the through groove.

9. The heat-conducting device as described in claim 8, characterized in that, The flow guide has a multi-layer structure, and some of the flow guides are stacked along the first direction.

10. A battery pack, characterized in that, include: case; Multiple battery cells are disposed within the housing; The heat-conducting device as described in any one of claims 1 to 9.

11. The battery pack as claimed in claim 10, characterized in that, At least a portion of the heat-conducting device is located between two adjacent battery cells. The heat-conducting device includes a bending portion, which is bent and deformed in the bending portion region. The minimum bending radius of the bending portion is 2 mm.

12. An electrical appliance, characterized in that, Includes the battery pack as described in any one of claims 10 or 11.

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