PCB board correction device and method

Abstract

The present invention discloses a PCB board correction device and method, comprising a mounting frame, a lifting platform mounted on the mounting frame, two top plates symmetrically arranged about the center line of the mounting frame mounted on the lifting platform, and a gap left between the two top plates to facilitate air flow; a lifting mechanism is provided below the top plates, the lifting mechanism drives the top plates to move up and down; a pressure strip assembly is fixedly mounted on the mounting frame, the pressure strip assembly is combined with the top plates to press the PCB board, a avoidance hole adapted to the size of the PCB board is formed in the middle of the pressure strip assembly, and the PCB board is located between the top plates and the pressure strip assembly. The beneficial effects of the present invention are as follows: by placing the PCB board between the top plates and the pressure strip assembly, activating the lifting mechanism to drive the top plates to move upward, the PCB board is corrected under the interaction of the top plates and the pressure strip assembly, and by placing the PCB board in a rubbery state with strong plasticity on the top plates, the PCB board can achieve a correction effect.

Description

Technical Field

[0001] The present invention relates to the field of display screens, and in particular to a PCB board correction device and method. Background Art

[0002] With the continuous advancement of technology and the continuous iteration of display screen production techniques, the thickness of PCB boards has been continuously reduced to meet the development needs of high-quality displays. However, this has also caused problems. During the SMT process, when thinner PCBs, such as 1.2mm thick, are heated in the reflow oven, the reduced thickness of the PCB makes the IC side (the side where the components are mounted) more susceptible to irregular deformation such as PCB bending after printing and placement. This reduces the contact area between the clamping blocks on the PCB clamping fixture and the PCB, making the fixture unable to clamp the PCB. As a result, the PCB is prone to jitter and other phenomena during the subsequent placement process, leading to placement confusion, jump board errors, and other anomalies. This has become a technical pain point in the display screen industry for nearly a decade. Existing solutions mostly rely on manual correction after the AOI inspection system or visual inspection. However, manual correction is difficult to control, the correction quality cannot be guaranteed, and it is time-consuming and labor-intensive, seriously affecting production efficiency and product quality. To address this problem, we provide a PCB board correction device and method. Summary of the Invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a PCB board correction device and method.

[0004] The purpose of the present invention is achieved through the following technical solutions:

[0005] A PCB board correction device includes a mounting frame, a lifting platform installed on the mounting frame, two top plates symmetrically arranged about the center line of the mounting frame installed on the lifting platform, and a gap left between the two top plates to facilitate air flow; a lifting mechanism is provided below the top plates, which drives the top plates to move up and down; a pressure strip assembly is fixedly mounted on the mounting frame, which cooperates with the top plates to press and correct the PCB board; an avoidance hole is formed in the middle of the pressure strip assembly for avoiding components on the PCB board, and the PCB board is located between the top plates and the pressure strip assembly.

[0006] A further technical solution is that the top plate includes a top plate body installed on the lifting platform, and the top plate body is made of heat-dissipating metal material.

[0007] A further technical solution is that a plurality of grooves evenly arranged in a matrix are provided at the bottom of the top plate body.

[0008] A further technical solution is that a plurality of evenly distributed ventilation holes are provided through one side surface of the top plate body.

[0009] A further technical solution is that the pressure strip assembly includes a first pressure strip and a second pressure strip that are detachably mounted on the mounting frame, and the first pressure strip and the second pressure strip are symmetrically arranged with respect to the center line of the mounting frame. The mounting frame is also detachably mounted with a third pressure strip and a fourth pressure strip, and the two pressure strips are respectively close to the first pressure strip and the second pressure strip, and are connected to each other in the first position. The four parts of the first pressure strip, the second pressure strip, the third pressure strip and the fourth pressure strip form an avoidance hole for avoiding components on the PCB board.

[0010] A further technical solution is that the top plate body is made of aluminum.

[0011] A further technical solution is that the vent is connected to an air pump / fan.

[0012] The present invention also discloses a PCB board correction method, which is characterized by comprising:

[0013] S1: transport the PCB board to the reflow oven for heating;

[0014] S2: The PCB board heated in S1 to a temperature of 145°~155° is transported to the AOI machine through a conveying mechanism;

[0015] S3: The PCB board heated in S1 is transported to the AOI machine through the conveyor mechanism. The conveyor transfer time is 8s-15s. During the transfer process, the temperature of the PCB board drops to 115℃-130℃.

[0016] S4: Start the lifting mechanism to drive the top plate to move upward and combine with the holding bar assembly to press and correct the PCB board for 15S to 18S.

[0017] A further technical solution is that the reflow oven in S is a reflow oven with a closed cooling zone and a heating rod, so that the temperature of the PCB board can reach 120° C. to 130° C. after it comes out of the oven.

[0018] A further technical solution is that the reflow oven in S is a reflow oven with a closed cooling zone, and a heating device is provided between the reflow oven with a closed cooling zone and the AOI machine, and the heating device reheats the PCB board out of the reflow oven so that it reaches 120°C to 130°C before correction.

[0019] A further technical solution is that the reflow oven in S is a reflow oven without a cooling zone, which reduces the conveying distance from the reflow oven to the AOI machine, thereby slowing down the temperature drop rate of the PCB board during the conveying process, ensuring that the PCB board reaches 120℃~130℃ before correction.

[0020] The present invention has the following advantages:

[0021] 1. The present invention places the PCB between the top plate and the hold-down assembly, activates the lifting mechanism to drive the top plate upward, and thereby corrects the PCB through the interaction between the top plate and the hold-down assembly. Furthermore, by placing a PCB in a rubbery state with relatively strong plasticity on the top plate, the PCB can achieve a corrective effect.

[0022] 2. The present invention can reduce the weight of the top plate body and facilitate heat dissipation by providing a plurality of evenly arranged grooves on the top plate body. The top plate body is made of aluminum, which has the advantages of light weight and high thermal conductivity, and is convenient for rapid heat dissipation of the PCB board during correction.

[0023] 3. The present invention leaves a gap between the two top plate bodies to facilitate air flow, ventilation, and accelerate heat dissipation; and multiple ventilation holes are set through the side of the top plate body to facilitate ventilation and accelerate the heat dissipation of the PCB board, thereby facilitating the corrected PCB board to enter the next process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is an overall schematic diagram of the top plate of the present invention;

[0025] Figure 2 This is a schematic diagram of the installation of the top plate body of the present invention;

[0026] Figure 3 This is a schematic diagram of the installation of the top plate and pressure strip assembly of the present invention;

[0027] Figure 4 This is a schematic structural diagram of a layering assembly according to the present invention;

[0028] Figure 5 This is a schematic diagram of the back side of the top plate body of the present invention;

[0029] Figure 6 Schematic diagram of the correction method of the present invention;

[0030] Figure 7 A schematic diagram of a correction method according to the present invention;

[0031] Figure 8 This is a schematic diagram of the second correction method of the present invention;

[0032] Figure 9 Schematic diagram of the third correction method of the present invention.

[0033] In the figure: 1. Mounting frame; 2. Lifting platform; 3. Top plate; 31. Vent; 32. Top plate body; 33. Groove; 4. Bead assembly; 41. First bead; 42. Second bead; 43. Third bead; 44. Fourth bead. DETAILED DESCRIPTION

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0036] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other.

[0037] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0038] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is typically placed when in use, or are the orientations or positional relationships commonly understood by those skilled in the art. These terms are intended only to facilitate the description of the present invention and to simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0039] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0040] like Figure 1—5 shows an embodiment 1, a PCB board correction device, including a mounting frame 1, a lifting platform 2 is installed on the mounting frame 1, two top plates 3 are installed on the lifting platform 2, which are symmetrical with the center line of the mounting frame 1, and a gap is left between the two top plates 3 to facilitate air flow; a lifting mechanism is provided below the top plate 3, and the lifting mechanism drives the top plate 3 to move up and down; a pressure strip assembly 4 is fixedly installed on the mounting frame 1, and the pressure strip assembly 4 cooperates with the top plate 3 to press and correct the PCB board, and an avoidance hole is formed in the middle of the pressure strip assembly 4 for avoiding components on the PCB board, and the PCB board is located between the top plate 3 and the pressure strip assembly 4. When correcting the PCB board, the PCB board is transferred and placed between the top plate 3 and the pressure strip assembly 4, and then the lifting mechanism is started to move the lifting platform 2 and the top plate 3 upward, so as to press and correct the PCB board between the top plate 3 and the pressure strip assembly 4. The lifting mechanism can be a cylinder, or a motor drives the screw rod to move so that the lifting platform 2 and the top plate 3 are lifted and lowered. That is, as long as it is a linear motion mechanism that can lift the lifting platform 2 and the top plate 3, it will be fine. The lifting mechanism is a mechanism that people in this field can easily think of, including but not limited to the above-mentioned cylinder or motor drives the screw rod to move.

[0041] The top plate 3 includes a top plate body 32 installed on the lifting platform 2, and the top plate body 32 is made of a heat-dissipating metal material; the PCB board is placed on the top plate body 32, and the top plate body 32 supported by the heat-dissipating metal material can quickly cool the heated PCB board to a predetermined temperature so that it will not be delayed in entering the next process.

[0042] The top surface of the top plate body 32 is the plane in contact with the PCB board. The bottom of the top plate body 32 is provided with a plurality of grooves 33 evenly arranged in a matrix. The top plate body 32 is made of aluminum. The grooves 33 can reduce the weight of the top plate body 32, and this structure is also conducive to heat dissipation. Figure 1-Figure 3 as well as Figure 5 As shown, the side with the groove 33 is the bottom side, and the side without the groove 33 is the front side, which contacts the PCB board and dissipates heat from it.

[0043] A plurality of evenly distributed ventilation holes 31 are provided on one side of the top plate body 32, and the ventilation holes 31 are connected to an air pump / fan; air power equipment including but not limited to the air pump / fan is connected to the ventilation holes 31, so that the air flow around the top plate body 32 is accelerated, thereby being able to quickly take away the heat of the PCB board placed on the top plate body 32, achieving the effect of rapid heat dissipation, and allowing the PCB board to quickly dissipate heat and be shaped during correction, thereby preventing secondary deformation of the PCB board in subsequent operations.

[0044] The pressure strip assembly 4 includes a first pressure strip 41 and a second pressure strip 42 that can be detachably mounted on the mounting frame 1, and the first pressure strip 41 and the second pressure strip 42 are symmetrically arranged with respect to the center line of the mounting frame 1. The mounting frame 1 can also be detachably fixed with a third pressure strip 43 and a fourth pressure strip 44, and the two are respectively close to the first pressure strip 41 and the second pressure strip 42, and are connected to each other end to end. The first pressure strip 41, the second pressure strip 42, the third pressure strip 43 and the fourth pressure strip 44 are surrounded by a avoidance hole for avoiding components on the PCB board; the pressure strip assembly 4 is divided into four parts, and the avoidance hole formed in the middle prevents the components on the PCB board from being crushed. The four parts of the pressure strip assembly 4 are used to press the four edges of the PCB board respectively, thereby correcting the PCB board.

[0045] After conventional PCBs leave the oven, their temperature typically drops to 60-70°C at room temperature. At this temperature, the PCB's shape is essentially fixed, making it difficult to correct with external force. When the PCB is in a highly plastic, rubbery state, ideal for correction, the PCB temperature must reach approximately 150-180°C. Therefore, the PCBs must be heated to the ideal temperature after leaving the oven, transforming from a glassy state to a more plastic, rubbery state. External force is then applied to shape the PCBs. After shaping, the PCBs are then cooled to room temperature, returning to their glassy state. During this process, the PCB temperature must reach a critical value, known as the Tg value (approximately 150-180°C).

[0046] According to the working principle of the reflow oven, the purpose of the last temperature zone of the reflow oven is to solidify the solder paste. By eliminating this last temperature zone, the temperature of the PCB board can be reduced from the highest temperature of approximately 250°C to approximately 150-180°C. At this time, the solder paste is completely solidified and the PCB board is in a highly plastic rubber state. However, once the PCB board is out of the oven, its temperature drops rapidly. In batch production lines, it is difficult to control the appropriate correction time and method for the PCB board.

[0047] After the PCBs are released from the oven, they are inspected by an AOI machine, which takes approximately 18-20 seconds. Without increasing equipment costs, it is possible to use this time to perform press-fit corrections on the PCBs. This not only reduces costs without changing the production line, but also maximizes resources, improves efficiency, and is suitable for batch operations. However, 18-20 seconds is not enough time to cool the PCBs from 150-180°C to the optimal temperature of 60-70°C (which is the temperature that prevents further deformation). This long cooling time can affect subsequent production line operations and may even affect solder joints (180°C).

[0048] Based on the above analysis, although 150-180℃ is the ideal correction temperature for PCB boards, it is difficult to implement in practice (it requires eliminating the last temperature zone of the reflow oven), is costly, has low operability, is difficult to achieve, and the waiting time for cooling is too long, seriously affecting efficiency. Therefore, it is considered to lower the ideal correction temperature so that it can meet the correction temperature of the PCB board and ensure the correction effect, while shortening the cooling time and improving efficiency.

[0049] Therefore, we will determine the optimal correction temperature for PCB boards by simulating the PCB board's oven temperature, the room temperature under normal working conditions, the transfer time of the PCB board from the oven to the AOI machine for inspection, the PCB board's temperature before correction, the correction time, the temperature after correction, and the deformation of the PCB board after correction. Ultimately, we will develop a correction method and device that is easy to control, most suitable for industrial batch operations, and has the lowest cost.

[0050] The specific experiments are as follows:

[0051] (1) Experiment on simulating deformation of PCB board: Two PCB boards with a thickness of 1.2 mm were placed in an oven, heated to 125°C and pressed for 15 seconds (seconds) and 110°C and pressed for 20 seconds (seconds) and then cooled, respectively, to simulate the deformation effect of the IC side (i.e., the side where the components are mounted) after the oven. Then, manual correction was performed. The experimental data of simulating manual correction are as follows:

[0052]

[0053]

[0054] (2) Correction method experiment:

[0055] Method 1 (refer to Figure 7 )

[0056]

[0057] From the above, we can see that this solution raises the PCB board without any support in the middle, which causes the PCB board to deform in the opposite direction.

[0058] Method 2 (refer to Figure 8 )

[0059]

[0060] From the above, we can see that raising the middle of the PCB will also cause the PCB to deform in the opposite direction and increase the deformation.

[0061] Method 3 (refer to Figure 9 )

[0062]

[0063]

[0064] From the above, we can see that: when the PCB is placed on a flat surface and then pressed directly with a pressure strip, the deformation is significantly reduced.

[0065] Based on the above data, it can be seen that when the PCB board temperature is around 120°C, it still has plasticity. After flat pressing, the deformation is significantly reduced. Therefore, when the PCB board temperature is between 120°C and 130°C, with 120°C being the optimal temperature, and applying external pressure and fixed cooling on the flat surface, the PCB board deformation is kept within normal values, achieving a good correction effect. After a correction time of 15-18 seconds, the PCB board temperature approaches the normal oven temperature and is controllable. This application uses flat pressing to correct the PCB board.

[0066] At the same time, the correction scheme for the flat-pressed PCB board is as follows: since the above-mentioned 18-20 seconds is not enough to reduce the PCB board at a temperature of 150-180°C to a suitable temperature, when the oven temperature drops to 120-130°C (120°C is the best), it is cooled for 10 seconds during the transfer. Finally, the problem can be solved by the vent holes 31 opened on the top plate body 32 of the correction equipment of this application. The air pump / fan and other aerodynamic components are connected through the vent holes 31 to accelerate the heat dissipation of the PCB board, so that it can cool down quickly, and the heat dissipation is further accelerated by setting the groove 33. The top plate body 32 is made of aluminum, which has better thermal conductivity than other materials, and can further accelerate the heat dissipation of the PCB board, so that the temperature of the PCB board can be reduced to a suitable temperature in 18-20 seconds under various heat dissipation methods.

[0067] Reference Figure 6 A PCB board correction method as described above, comprising:

[0068] S1: transport the PCB board to the reflow oven for heating;

[0069] S2: The PCB board heated to a temperature of 145°-155°C in S1 is transported to the AOI machine via a conveying mechanism. The conveying mechanism can be understood as a conveyor belt, a transfer robot, or other transfer device that has a transfer effect and meets the actual transfer requirements of this application, including but not limited to the above-mentioned conveyor belt and transfer robot, and can also be a mechanism that can be conceived and implemented by those skilled in the art;

[0070] S3: The PCB board heated in S1 is conveyed to the AOI machine through a conveyor mechanism. The conveyor transfer time is 8s-15s. During the transfer process, the temperature of the PCB board drops to 115℃-130℃. The PCB board is conveyed and placed between the top plate 3 and the pressure bar assembly 4. At this time, the PCB board is in a rubber state with strong plasticity. The preferred rubber state temperature is 120℃. At this temperature, the PCB board is still plastic and there is no possibility of affecting the solder joints at 180℃.

[0071] S4: Start the lifting mechanism to drive the top plate 3 to move upward and combine with the pressure strip assembly 4 to press and correct the PCB board for 15S to 18S; the top plate 3 and the pressure strip assembly 4 cooperate to press and correct the PCB board at the same time. The preferred correction time is 18S, and the correction time can also be the time for PCB board inspection.

[0072] When the indoor ambient temperature is 24.6°C, the temperature of the PCB board after natural cooling in the oven drops from 150°C to 98°C-105°C. In the indoor environment, the temperature drops to 95°C-100°C after 5 seconds; the temperature is 91°C-96°C after 10 seconds; and the temperature is 90°C-95°C after 15 seconds. Therefore, in the indoor environment, the maximum temperature of the PCB board after passing through the reflow oven can only reach 105°C, which cannot meet the correction temperature. Therefore, in order to ensure the temperature of the PCB board, the reflow oven in S1 is a reflow oven with a closed cooling zone and a heating rod. The PCB board can reach 120°C-130°C after leaving the oven, and the preferred temperature is 120°C. At this temperature, the PCB board can still reach a rubber state.

[0073] Example 2: Reference Figure 6 , which is different from the above embodiment, is that the reflow oven in S1 can also be a reflow oven with the cooling zone closed, and a heating device is provided between the reflow oven with the cooling zone closed and the AOI machine. The heating device reheats the PCB board out of the reflow oven to a temperature of 120°C to 130°C before correction. Preferably, the heating device reheats the PCB board to a temperature of 120°C, at which time the PCB board is still in a rubber state, which is convenient for subsequent correction.

[0074] Example 3: Reference Figure 6 Unlike the above embodiment, the reflow oven in S1 can also be a reflow oven without the cooling zone, which reduces the transportation distance from the reflow oven to the AOI machine, thereby reducing the heat loss during the transportation of the PCB board and slowing down the temperature drop rate, so that the PCB board reaches a temperature of 120°C to 130°C in a rubber state before correction, with the preferred temperature being 120°C.

[0075] The working process of the present invention is as follows: first, the PCB is heated in a reflow furnace. After heating is completed, the heated PCB is transported to the AOI machine by a transfer conveyor mechanism. At this time, the PCB reaches a rubber-like temperature. Then, the lifting mechanism is activated to drive the lifting platform 2 and the top plate 3 to lift the PCB. Then, the top plate 3 and the pressure bar assembly 4 press the PCB for a period of time for correction. The top plate 3 accelerates the heat dissipation of the PCB so that the temperature can be reduced to a predetermined value during the inspection time, so that the final deformation of the PCB can meet production requirements.

[0076] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A PCB board correction device, characterized by: The utility model comprises a mounting frame (1), a lifting platform (2) is installed on the mounting frame (1), two top plates (3) are installed on the lifting platform (2) and are symmetrical with respect to the center line of the mounting frame (1), and a gap is left between the two top plates (3) to facilitate air flow; a lifting mechanism is provided below the top plates (3), and the lifting mechanism drives the top plates (3) to move up and down; a pressure strip assembly (4) is fixedly installed on the mounting frame (1), and the pressure strip assembly (4) cooperates with the top plates (3) to press and correct the PCB board; an avoidance hole for avoiding components on the PCB board is formed in the middle of the pressure strip assembly (4), and the PCB board is located between the top plates (3) and the pressure strip assembly (4); The top plate (3) comprises a top plate body (32) mounted on the lifting platform (2), and the top plate body (32) is made of a heat dissipating metal material; The bottom of the top plate body (32) is provided with a plurality of grooves (33) evenly arranged in a matrix manner; A plurality of evenly distributed ventilation holes (31) are provided through one side surface of the top plate body (32); The side with the groove (33) is the bottom side, and the side without the groove (33) is the front side, which contacts the PCB board and dissipates heat therefrom; The pressure strip assembly (4) comprises a first pressure strip (41) and a second pressure strip (42) which are detachably mounted on the mounting frame (1), and the first pressure strip (41) and the second pressure strip (42) are symmetrically arranged with respect to the center line of the mounting frame (1). A third pressure strip (43) and a fourth pressure strip (44) are also detachably mounted on the mounting frame (1), and the third pressure strip (43) and the fourth pressure strip (44) are respectively closely attached to the first pressure strip (41) and the second pressure strip (42) and connected to each other in the first position. The first pressure strip (41), the second pressure strip (42), the third pressure strip (43) and the fourth pressure strip (44) are surrounded by four parts to form an avoidance hole for avoiding components on the PCB board.

2. A PCB board correction device according to claim 1, characterized in that: The top plate body (32) is made of aluminum.

3. The PCB board correction device according to claim 1, characterized in that: The vent hole (31) is connected to an air pump / fan.

4. A correction method for a PCB correction device according to any one of claims 1 to 3, characterized in that: include: S1: transport the PCB board to the reflow oven for heating; S2: The PCB board heated in S1 to a temperature of 145°~155° is transported to the AOI machine through a conveying mechanism; S3: The PCB board heated in S1 is transported to the AOI machine through the conveyor mechanism. The conveyor transfer time is 8s-15s. During the transfer process, the temperature of the PCB board drops to 115℃-130℃. S4: Start the lifting mechanism to drive the top plate to move upward and combine with the holding bar assembly to press and correct the PCB for 15s to 18s.

5. The correction method of a PCB correction device according to claim 4, characterized in that: The reflow oven in S1 is a reflow oven with a closed cooling zone and a heating rod, and the temperature of the PCB board can reach 120° C. to 130° C. after it comes out of the oven.

6. The correction method for a PCB correction device according to claim 4, characterized in that: The reflow oven in S1 is a reflow oven with the cooling zone closed, and a heating device is provided between the reflow oven with the cooling zone closed and the AOI machine. The heating device reheats the PCB board out of the reflow oven to reach 120°C~130°C before correction.

7. The correction method for a PCB correction device according to claim 4, characterized in that: The reflow oven in S1 is a reflow oven without the cooling zone, which reduces the conveying distance from the reflow oven to the AOI machine, thereby slowing down the temperature drop rate of the PCB board during the conveying process, so that the PCB board reaches 120°C~130°C before correction.

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