Liquid-cooled electrical equipment, powertrain, and vehicle

Abstract

The present invention provides a liquid-cooled electrical device, powertrain and vehicle, comprising a casing, a laminated water tank and a circuit module. The casing is provided with an external interface group, a first connection port group and a first liquid-cooling channel. The first liquid-cooling channel is isolated from the device mounting cavity, the external interface group is located on the outer wall of the casing, and the laminated water tank and the circuit module are arranged inside the casing. The laminated water tank is provided with a second connection port group and a second liquid-cooling channel, and the second connection port group is connected to the first connection port group. The circuit module includes a circuit board, a first electronic device and a second electronic device, which are then stacked in sequence along the thickness direction through the first liquid-cooling channel, the first electronic device, the second liquid-cooling channel, the second electronic device and the circuit board, so that the second electronic device and the second liquid-cooling channel form heat conduction, thereby achieving efficient liquid-cooling heat dissipation of the internal devices, and the stacked arrangement can effectively reduce the height in the thickness direction, which is convenient for controlling the overall height and volume of the electrical equipment.

Description

Technical Field

[0001] The present invention relates to the field of new energy equipment, and in particular to a liquid-cooled electrical device, a powertrain, and a vehicle. Background Art

[0002] New energy vehicles do not generate power by burning gasoline or diesel, so they have many characteristics such as environmental protection and low pollution. With the vigorous promotion and application of new energy power generation such as hydropower, wind power, solar power and nuclear power, many new energy vehicles are gradually being promoted and applied, such as new energy electric cars, new energy electric buses, new energy electric trucks, new energy electric cleaning vehicles, new energy electric rail vehicles, new energy electric flying vehicles, new energy electric shipping vehicles, etc.

[0003] New energy vehicles are generally equipped with batteries, motor control devices, chargers, motors and power generation devices, as well as chargers. The power device in the motor control device receives the DC power output by the battery, and converts the DC power into AC power for output to the motor. The motor then outputs a rotating driving force to drive the power generation devices such as wheels and blades, and then drives the vehicle to move forward. In addition, when the charger is charging the battery, its internal electronic components such as capacitors, inductors or transformer windings will generate a large amount of waste heat during operation. Therefore, it is necessary to carry out efficient heat dissipation treatment for the above-mentioned electronic devices that generate waste heat. With the rapid development of new energy vehicles, higher performance requirements are required for them. While meeting the requirements of high power and high performance, there are also higher requirements for heat dissipation performance.

[0004] In addition to using a liquid-cooled casing to dissipate heat from components close to the outer wall, it is also necessary to dissipate heat efficiently from components located inside. At the same time, it is also necessary to ensure that the entire electrical equipment has a smaller size so that the miniaturized body can adapt to more products and more fields. Summary of the Invention

[0005] A first object of the present invention is to provide an electrical device that utilizes liquid cooling to improve heat dissipation efficiency.

[0006] A second object of the present invention is to provide a powertrain having the above-mentioned electrical device.

[0007] A third object of the present invention is to provide a vehicle having the above-mentioned electrical device.

[0008] In order to achieve the first objective of the present invention, the present invention provides a liquid-cooled electrical device, comprising a housing, a laminated water tank, and a circuit module. The housing encloses a device installation cavity, and the housing is provided with an external interface group, a first connection port group, and a relatively closed first liquid cooling channel. The first liquid cooling channel is connected between the external interface group and the first connection port group. The first liquid cooling channel is isolated from the device installation cavity, and the external interface group is located on the outer wall of the housing. The laminated water tank is arranged in the device installation cavity, and the laminated water tank is provided with a second connection port group and a relatively closed second liquid cooling channel. The second connection port group is connected to the first connection port group. The circuit module is arranged in the device installation cavity, and the circuit module includes a circuit board, a first electronic device, and a second electronic device. The first electronic device and the second electronic device are respectively connected to the circuit board. The first liquid cooling channel, the first electronic device, the second liquid cooling channel, the second electronic device, and the circuit board are sequentially stacked in the thickness direction. The first electronic device forms a heat conduction with the first liquid cooling channel, and the second electronic device forms a heat conduction with the second liquid cooling channel.

[0009] It can be seen from the above scheme that the first liquid cooling channel on the casing cooperates with the first electronic device to conduct heat therewith, and then the first electronic device can dissipate heat through the first liquid cooling channel, and then the laminated water tank located in the device mounting cavity is connected to the first liquid cooling channel, and then the coolant flows into the device mounting cavity in a closed manner for heat dissipation, and then the first liquid cooling channel, the first electronic device, the second liquid cooling channel, the second electronic device and the circuit board are stacked in sequence along the thickness direction, so that the second electronic device and the second liquid cooling channel form heat conduction, thereby realizing efficient liquid cooling and heat dissipation of the internal devices, and the stacking setting can effectively reduce the height in the thickness direction, which is convenient for controlling the overall height and volume of the electrical equipment.

[0010] A further solution is that the laminated water tanks are arranged flat along a tiling direction, and the tiling direction is perpendicular to the thickness direction.

[0011] A further solution is to provide a first heat-conducting surface on the bottom side of the laminated water tank in the thickness direction. The first heat-conducting surface extends in the tiling direction and connects to the top surface of the first electronic device in the thickness direction to establish heat conduction. The first heat-conducting surface can be provided with a boss that cooperates with the first liquid cooling channel to fully surround the heat dissipation channel of the first electronic device.

[0012] A further solution is to provide a second heat-conducting surface on the top side of the laminated water tank in the thickness direction. The second heat-conducting surface extends along the tiling direction and connects to the bottom surface of the second electronic device in the thickness direction to form a heat conduction mechanism. The second heat-conducting surface can be provided with a boss to meet the heat dissipation requirements of heat-generating devices of different heights.

[0013] As can be seen from the above, the use of a flat and tiled laminated water tank can further reduce the size in the thickness direction, and since the laminated water tank is along the tiled direction, the first electronic device and the second electronic device are respectively connected to the first heat conduction plane and the second heat conduction plane to form heat conduction. Not only can the larger heat conduction plane be used to increase the thermal conductivity efficiency, but the first electronic device and the second electronic device can also be cooled at the same time, which can further improve the thermal conductivity efficiency in the device installation cavity.

[0014] A further solution is that a heat conductive block is provided in the first liquid cooling channel, and a device placement groove is provided on one side of the device mounting cavity. The device placement groove is connected to the device mounting cavity, and the first electronic device is arranged in the device placement groove and forms heat conduction with the groove wall of the device placement groove.

[0015] A further solution is that a plurality of heat-conducting blocks are provided in the first liquid-cooling channel, and the first liquid-cooling channel is provided with flow-conducting branches between the plurality of heat-conducting blocks.

[0016] As can be seen from the above, by digging the device placement groove, the first electronic device can be placed in the device placement groove, and the surrounding wall of the device placement groove is used to surround the first electronic device for heat conduction, which greatly improves the efficiency of heat conduction. Different device placement grooves can be opened according to the layout, number and volume of electronic devices, and the thermal conductivity efficiency of the surrounding wall of each heat-conducting block can be improved by opening the diversion branch.

[0017] A further solution is that the electrical equipment includes at least two laminated water tanks, at least two laminated water tanks are arranged in a laminated manner along the thickness direction, the second connection port group of one laminated water tank is connected to the second liquid cooling channel of another laminated water tank, the second liquid cooling channels of at least two laminated water tanks are connected to each other, and a device clamping groove is formed between two adjacent laminated water tanks.

[0018] A further solution is that the second connection port group includes at least two communicating holes and at least two communicating tubes, and a communicating tube of one laminated water tank is connected to a communicating hole of another laminated water tank.

[0019] As can be seen from the above, two or more stacked water tanks can be arranged in a stacked and connected manner, and electronic devices can be placed in the device clamping grooves, and then the stacked water tanks can be used for efficient heat dissipation, further improving the thermal conductivity range of the devices in the cavity, and the stacking arrangement of the water tanks can be easily realized by utilizing the stacking coordination of the connecting pipes and the connecting holes.

[0020] A further solution is that hollow holes are provided through the laminated water tank along the thickness direction, and the pins of the first electronic device pass through the hollow holes and are connected to the circuit board.

[0021] As can be seen from the above, the pins of the first electronic device pass through the hollow holes along the thickness direction, so the air-avoiding setting does not affect the electrical connection and circuit layout of the electronic device, and the laminated water tank can be closer to the first electronic device and conduct heat for the first electronic device.

[0022] A further solution is that a terminal connection seat is provided on the bottom surface of the circuit board in the thickness direction, a terminal connector is provided in the terminal connection seat, the fixed end of the terminal connector is welded to the circuit board, and the free end of the terminal connector is arranged in a spring-type manner. The pin of the first electronic device passes through the insertion port of the terminal connection seat and is connected to the free end of the terminal connector.

[0023] As can be seen from the above, in order to facilitate the arrangement of the laminated water tank, the pins of the first electronic device can be passed through the hollow hole and connected to the free end of the spring-type terminal connector, thereby facilitating the connection between the first electronic device and the circuit board, which is very suitable for automated production.

[0024] A further solution is that the insertion port is located in the hollow hole and close to the body of the first electronic component.

[0025] As can be seen from the above, the arrangement of the insertion port close to the first electronic device not only improves the connection stability, but also the terminal connection seat is located in the hollow hole for avoidance design, thereby making the device arrangement more compact and effectively reducing the height in the thickness direction.

[0026] A further solution is that the laminated water tank includes a lower bottom plate and an upper cover plate, the lower bottom plate is arranged as a straight plate, the lower bottom plate is penetrated by a lower through-hole, and the second connection port group is arranged on the lower bottom plate; the upper cover plate is penetrated by an upper through-hole, and the upper cover plate is provided with a flow channel groove on the outer periphery of the upper through-hole, the upper cover plate is covered and connected with the lower bottom plate, the upper through-hole and the lower through-hole are docked to form a hollow hole, the lower bottom plate is sealed connected to the outer edge of the flow channel groove, and the lower bottom plate and the flow channel groove form a second liquid cooling channel.

[0027] As can be seen from the above, by connecting the upper cover plate and the lower base plate to form a second liquid cooling channel, it is not only convenient to process the flow channel groove of the upper cover plate, but also convenient to use the flat plate cover to achieve a sealed connection with the outer edge, and arrange the flow channel groove on the outer periphery of the upper through-opening, thereby facilitating the flow direction planning of the second liquid cooling channel while setting the hollow hole.

[0028] A further solution is that the first connection port group includes at least two connection holes, and the second connection port group includes at least two protruding connection tubes, and one connection tube is inserted into one connection hole and communicated with the connection hole.

[0029] A further solution is that the two connecting holes are located on the same side, a first partition wall is provided between the two connecting holes, at least two connecting pipes are located on the same side, and the upper cover plate is provided with a second partition wall in the flow channel groove, the second partition wall is located between the two connecting pipes and is sealed with the lower base plate.

[0030] As can be seen from the above, by arranging at least two connecting holes, the flow direction of the coolant can be arranged in a unidirectional reciprocating manner, thereby making the coolant flow more evenly and over a larger range, thereby improving the heat conduction efficiency.

[0031] In order to achieve the second object of the present invention, the present invention provides a power assembly, including a motor and an electrical device as described above, wherein the electrical device is connected to the motor.

[0032] In order to achieve the third object of the present invention, the present invention provides a vehicle comprising the electrical device according to the above solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a structural diagram of an embodiment of an electrical device of the present invention.

[0034] Figure 2 This is a structural diagram of an embodiment of the electrical device of the present invention after omitting the cover.

[0035] Figure 3 It is a structural diagram of the first liquid cooling channel in an embodiment of the electrical equipment of the present invention.

[0036] Figure 4 It is an exploded view of an embodiment of the electrical device of the present invention.

[0037] Figure 5 It is a structural diagram of the housing at the device installation cavity in an embodiment of the electrical equipment of the present invention.

[0038] Figure 6 It is an exploded view of the laminated water tank in the embodiment of the electrical equipment of the present invention.

[0039] Figure 7 This is a structural diagram of an embodiment of the electrical equipment of the present invention after omitting the circuit board.

[0040] Figure 8 It is a cross-sectional view of the connection port group of an embodiment of the electrical device of the present invention.

[0041] Figure 9 It is a cross-sectional view of an embodiment of the electrical device of the present invention at a hollow hole.

[0042] Figure 10 It is a cross-sectional view of a laminated water tank at the rising liquid cooling branch in another embodiment of the electrical equipment of the present invention.

[0043] Figure 11It is a cross-sectional view of a laminated water tank at a descending liquid cooling branch in another embodiment of the electrical equipment of the present invention.

[0044] Figure 12 It is a schematic diagram of the arrangement of the second connection port group of the laminated water tank in another embodiment of the electrical equipment of the present invention.

[0045] The present invention will be further described below with reference to the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0046] Electrical equipment example:

[0047] Reference Figures 1 to 9 The electrical device 1 includes a housing 11, a laminated water tank 2, and a circuit module 3. The housing 11 defines a device installation cavity 112, within which the circuit module 3 is disposed. A cover (not shown) of the housing 11 covers the device installation cavity 112, thereby relatively sealing the device installation cavity 112. The housing 11 is provided with an external interface group, a first connection port group, and a relatively sealed first liquid cooling channel 13. The first liquid cooling channel 13 communicates between the external interface group and the first connection port group. The first liquid cooling channel 13 and the device installation cavity 112 are located on opposite sides and are isolated from each other by the bottom wall of the housing 11.

[0048] The external interface group is located on the outer wall of the housing 11 and includes two external interfaces 15, which are arranged side by side on the same side. The first connection port group is located on the inner side of the housing 11 and includes two connection holes 16, which are arranged side by side on the same side. The connection holes 16 connect between the first liquid cooling channel 13 and the device mounting cavity 112. Multiple heat conduction blocks 14 are arranged within the first liquid cooling channel 13 and between the external interface group and the first connection port group. The first liquid cooling channel 13 has multiple diversion branches 131 between the multiple heat conduction blocks 14. The multiple diversion branches 131 can be connected in series or in parallel according to actual needs and connect between the external interface group and the first connection port group. A first partition wall 132 is provided between the two connection holes 16, and the first partition wall 132 extends between the two external interfaces 15. The housing 11 can seal the first liquid cooling channel 13 through the sealing cover 12 to keep the first liquid cooling channel 13 relatively sealed. There are many ways to form the first liquid cooling channel 13. The housing 11 can also be integrally formed with the sealing cover 12.

[0049] The heat conductive block 14 is provided with multiple device placement grooves 141 and multiple device placement grooves 142 on one side of the device installation cavity 112. The device placement grooves 141 and 142 are both connected to the device installation cavity 112. The multiple device placement grooves 141 are located in the middle, and the device placement grooves 142 are respectively located on both sides of the device placement groove 141.

[0050] The laminated water tank 2 is provided with a second connection port group and a relatively closed second liquid cooling channel 24, and the laminated water tank 2 is provided with a plurality of hollow holes 23 along the thickness direction Z. Specifically, the laminated water tank 2 includes a lower base plate 22 and an upper cover plate 21. The lower base plate 22 is arranged as a straight plate. The lower base plate 22 is provided with a plurality of lower through-holes 221. The second connection port group is arranged on the lower base plate 22. The second connection port group includes at least two outwardly protruding connection pipes 222, and the connection pipes 222 are arranged side by side on the same side. The upper cover plate 21 is provided with a plurality of upper through-holes 211, and the upper cover plate 21 is provided with a flow channel trough 212 on the outer periphery of the upper through-holes 211. The upper cover plate 21 is covered and connected with the lower base plate 22, and the upper through-holes 211 and the lower through-holes 221 are connected to form a hollow hole 23. The lower base plate 22 is tightly connected with the outer edge 213 of the flow channel trough 212. The lower base plate 22 and the flow channel trough 212 form a second liquid cooling channel 24. The upper cover plate 21 is provided with a second partition wall 214 in the flow channel trough 212. The second partition wall 214 is located between the two connecting pipes 222 and is sealed with the lower base plate 22. It is connected to the outer edge 213 of the flow channel 212 through the second partition wall 214, and the second partition wall 214 is tightly connected with the lower base plate 22, so that the second liquid cooling channel 24 is arranged as a unidirectional bending reciprocating flow channel.

[0051] The laminated water tank 2 is arranged flat along the tiling direction X, and the tiling direction X is perpendicular to the thickness direction Z, that is, the laminated water tank 2 extends along a plane perpendicular to the thickness direction Z, and the lower base plate 22 is provided with a first heat-conducting plane 220 on the bottom side of the thickness direction Z, and the upper cover plate 21 is provided with a second heat-conducting plane 210 on the top side of the thickness direction Z. The first heat-conducting plane 220 and the second heat-conducting plane 210 extend along the tiling direction X, and the area of ​​the first heat-conducting plane 220 and the area of ​​the second heat-conducting plane 210 are both larger than the area of ​​the outer peripheral side wall.

[0052] The circuit module 3 includes a circuit board 30, multiple first electronic devices 32, multiple first electronic devices 33 and multiple second electronic devices 31. The first electronic devices are electronic devices with larger volume, including but not limited to capacitors, inductors, transformer windings and relays, etc. The second electronic devices are electronic devices with relatively smaller volume, including but not limited to power tubes, resistors, capacitors and inductors, etc. In this embodiment, the second electronic device 31 is a power tube, which is located in the middle of the circuit board 30 and welded to the circuit board 30, and the multiple first electronic devices 32 are located on the outer side of the circuit board 30 and welded to the circuit board 30.

[0053] During assembly, multiple first electronic devices 33 can be placed within 141 and potting compound can be injected to improve both insulation and thermal conductivity, allowing heat conduction between the first electronic devices 33 and the walls of the device placement slot 141. Subsequently, the laminated water reservoir 2 is positioned within the device mounting cavity 112, and the second connection port group is connected to the first connection port group. Specifically, a connecting tube 222 is inserted into and communicates with a connecting hole 16, thereby establishing communication between the first liquid cooling channel 13 and the second liquid cooling channel 24.

[0054] See also Figure 3 and Figure 6 Given the use of the first partition wall 132 and the second partition wall 214, the coolant input pipeline can be connected to the right external port 15. The coolant passes through the first liquid-cooling channel 13 on the right side, and is then input into the second liquid-cooling channel 2 on the right side through the right connection hole 16. The coolant then flows from the second liquid-cooling channel 2 on the left side through the left connection hole 16 and into the first liquid-cooling channel 13 on the left side. Finally, the coolant is output from the left external port 15, thus completing the double-layer liquid-cooling reciprocating flow. Of course, in addition to this embodiment, different flow channel directions can also be set according to actual needs, such as arranging the connection holes and connecting pipes on opposite sides to achieve a double-layer unidirectional flow, or using parallel flow channels to achieve a double-layer diverter flow, etc. The layout of the external ports can also be customized according to the actual product.

[0055] The circuit module 3 is then installed in the device mounting cavity 112. The first electronic devices 32 on either side are located in the device placement grooves 142 on either side. Potting compound can be injected to improve both insulation and thermal conductivity, allowing heat conduction between the first electronic devices 32 and the walls of the device placement grooves 142. Multiple second electronic devices 31 are arranged in a row and connected to the second thermally conductive surface 210 via thermal pads 311. This connects the second thermally conductive surface 210 and the bottom surfaces of the second electronic devices 31 in the thickness direction Z, allowing for heat conduction. The top surfaces of the second electronic devices 31 in the thickness direction Z can be mounted to the circuit board 30 using the SMT process, allowing some heat to be dissipated away from the circuit board 30. At the same time, since the first liquid-cooling channel 13, the first electronic device 33, the second liquid-cooling channel 24, the second electronic device 31 and the circuit board 30 are stacked in sequence along the thickness direction Z, the first heat-conducting plane 220 is connected to the top surface of the first electronic device 33 in the thickness direction Z and forms heat conduction, so that part of the heat of the first electronic device 33 can also be discharged from the second liquid-cooling channel 24.

[0056] In addition, a plurality of terminal connection seats 302 are provided on the bottom surface of the circuit board 30 in the thickness direction Z. The plurality of terminal connection seats 302 are located in the middle and correspond to the position of the hollow hole 23. A terminal connector 301 is provided in the terminal connection seat 302. The fixed end 304 of the terminal connector 301 is welded to the circuit board 30. The free end 305 of the terminal connector 301 is arranged in a butterfly-shaped spring-type arrangement. The insertion port 303 of the terminal connection seat 302 is located in the hollow hole 23 and close to the body of the first electronic device 33. The pin 331 of the first electronic device 33 passes through the hollow hole 23, and passes through the insertion port 303 of the terminal connection seat 302 and is connected to the free end 305 of the terminal connector 301, thereby realizing the electrical connection between the first electronic device 33 and the circuit board 30.

[0057] When the electrical device 1 is powered on and working, both the first electronic device and the second electronic device generate waste heat, which is heat-conducted between the first electronic device 32 on both sides and the first liquid-cooling channel 13, the first electronic device 33 in the middle and the first liquid-cooling channel 13 and the second liquid-cooling channel 24, and the second electronic device 31 and the second liquid-cooling channel 24 and the circuit board 30. The stacked device arrangement effectively improves the thermal conductivity of the electronic devices and effectively reduces the height in the thickness direction Z.

[0058] Of course, the above embodiments are only preferred embodiments of this case. In specific applications, the shape of the laminated water tank, the direction of the water channel, and the shape, number and position of the hollow holes can be determined according to the heat generation, volume and circuit layout of the electronic device. In some applications, hollow holes may not be provided, and the pins of the first electronic device can be connected to the circuit board from the outside of the laminated water tank, which can also achieve efficient laminated heat dissipation. In other applications, the second electronic device can also be a relatively large device. This case does not limit the volume relationship between the first electronic device and the second electronic device, nor does it limit the specific types or models of the first electronic device and the second electronic device, nor does it limit the specific length, width and height of the laminated water tank. As long as it meets the thermal conductivity relationship between the first liquid cooling channel, the second liquid cooling channel and the electrical device, it is within the effective protection scope of the present invention.

[0059] The electrical equipment in this case may include but is not limited to motor controllers, chargers, inverters or transformers.

[0060] Another embodiment of the electrical device:

[0061] Referring to the figure, in addition to the single-layer structure as in the above-mentioned embodiment, the laminated water tank can also be arranged in a laminated arrangement of at least two laminated water tanks. Specifically, the electrical equipment includes a laminated water tank 41, a laminated water tank 42 and a laminated water tank 43. The second connection port group of the laminated water tank 41 includes a connecting pipe 413, a connecting pipe 415, a connecting hole 414 and a connecting hole 416. The connecting pipe 413 and the connecting pipe 415 are located on the same side and are arranged at the lower end surface. The connecting pipe 413 and the connecting pipe 415 are respectively used to connect with the connecting hole 16. The connecting hole 414 and the connecting hole 416 are located at the upper end and on the side opposite to the connecting pipe 413. The second liquid cooling channel in the laminated water tank 41 is separated into liquid cooling branches 411 and liquid cooling branches 412 isolated from each other by a middle partition wall.

[0062] The laminated water tank 41, the laminated water tank 42 and the laminated water tank 43 are stacked in sequence along the thickness direction. The second connection port group of the laminated water tank 42 includes a connecting pipe 423, a connecting pipe 425, a connecting hole 424 and a connecting hole 426. The connecting pipe 423 and the connecting pipe 425 are located on the same side and are arranged at the lower end surface. The connecting pipe 423 and the connecting pipe 425 are used to connect with the connecting hole 414 and the connecting hole 416 respectively. The connecting hole 424 and the connecting hole 426 are located at the upper end and on the opposite side of the connecting pipe 423. The second liquid cooling channel in the laminated water tank 42 is divided into liquid cooling branches 421 and liquid cooling branches 422 isolated from each other by a middle partition wall.

[0063] The second connection port group of the laminated water tank 43 includes a connecting pipe 433, a connecting pipe 434, a connecting pipe 433 and a connecting pipe 434 located on the same side and arranged at the lower end surface, and the connecting pipe 423 and the connecting pipe 425 are respectively used to connect with the connecting hole 424 and the connecting hole 426. The second liquid cooling channel in the laminated water tank 43 is blocked by the middle partition wall to form a U-shaped channel, and the two sides of the U-shaped channel are respectively the liquid cooling branch 432 and the liquid cooling branch 431.

[0064] The second electronic device 31 can be disposed within a device slot formed between two adjacent laminated water reservoirs. The second electronic device 31 is positioned adjacent to the upper and lower laminated water reservoirs, thereby establishing heat conduction with the upper and lower laminated water reservoirs. The second electronic device 31 can also be disposed on the upper surface of the topmost laminated water reservoir 43 to establish heat conduction. Furthermore, the laminated water reservoirs 41, 42, and 43 can each be vertically penetrated with hollow holes 417, 427, and 437 at corresponding locations. Different electronic devices can be connected to the circuit board or other devices above through the hollow holes 417, 427, and 437 according to connection requirements.

[0065] During liquid cooling, the cooling liquid is input upward from the connecting pipe 413, passes through the liquid cooling branch 411, the connecting hole 414, and the connecting pipe 423 to enter the liquid cooling branch 421, and then input upward through the connecting hole 424, passes through the connecting pipe 433, the liquid cooling branch 431, the liquid cooling branch 432, the connecting pipe 434, and the connecting hole 426 to enter the liquid cooling branch 422, and finally is input from the connecting pipe 425 and the connecting hole 416 to the liquid cooling branch 412, and is output from the connecting pipe 415 to the connecting hole 16, which not only realizes the interconnection of the three second liquid cooling channels, but also realizes the connection with the first liquid cooling channel. Through the unidirectional multi-layer bending and reciprocating flow channel arrangement, the heat dissipation efficiency of the components in the cavity is further improved.

[0066] Powertrain Example:

[0067] The powertrain includes a motor and an electrical device as described above. The electrical device is an electrode controller, which is connected to the motor to realize drive control of the motor. The powertrain can be integrated with a transmission or not.

[0068] Vehicle Example:

[0069] The vehicle includes electrical equipment as described above, and the vehicle can be a new energy electric car, a new energy electric bus, a new energy electric truck, a new energy electric cleaning vehicle, a new energy electric rail vehicle, a new energy electric flying vehicle, a new energy electric shipping vehicle, etc.

[0070] As can be seen from the above, the first liquid cooling channel on the casing cooperates with the first electronic device to conduct heat therewith, and then the first electronic device can dissipate heat through the first liquid cooling channel, and then the laminated water tank located in the device mounting cavity is connected to the first liquid cooling channel, and then the coolant is sealed and flows into the device mounting cavity for heat dissipation, and then the first liquid cooling channel, the first electronic device, the second liquid cooling channel, the second electronic device and the circuit board are stacked in sequence along the thickness direction, so that the second electronic device and the second liquid cooling channel form heat conduction, thereby realizing efficient liquid cooling and heat dissipation of the internal devices, and the stacking setting can effectively reduce the height in the thickness direction, which is convenient for controlling the overall height and volume of the electrical equipment.

Claims

1. A liquid-cooled electrical device, characterized in that: include: A housing, the housing enclosing a device mounting cavity, the housing being provided with an external interface group, a first connection port group, and a relatively sealed first liquid cooling channel, the first liquid cooling channel communicating between the external interface group and the first connection port group, the first liquid cooling channel being isolated from the device mounting cavity, the external interface group being located on an outer wall of the housing, and the first connection port group being located on an inner side of the housing; A laminated water tank, the laminated water tank being arranged in the device mounting cavity, the laminated water tank being provided with a second connection port group and a relatively closed second liquid cooling channel, the second connection port group being connected to the first connection port group; A circuit module is arranged in the device mounting cavity, and the circuit module includes a circuit board, a first electronic device, and a second electronic device. The first electronic device and the second electronic device are respectively connected to the circuit board. The first liquid-cooling channel, the first electronic device, the second liquid-cooling channel, the second electronic device, and the circuit board are stacked in sequence along the thickness direction. The first electronic device forms heat conduction with the first liquid-cooling channel, and the second electronic device forms heat conduction with the second liquid-cooling channel.

2. The electrical device according to claim 1, wherein: The laminated water tank is arranged flatly along a tiling direction, and the tiling direction is perpendicular to the thickness direction.

3. The electrical device according to claim 2, wherein: The laminated water tank is provided with a first heat-conducting plane on the bottom side in the thickness direction. The first heat-conducting plane extends along the tiling direction. The first heat-conducting plane is connected to the top surface of the first electronic device in the thickness direction to form heat conduction.

4. The electrical device according to claim 2, wherein: The laminated water tank is provided with a second heat-conducting plane on the top side in the thickness direction. The second heat-conducting plane extends along the tiling direction. The second heat-conducting plane is connected to the bottom surface of the second electronic device in the thickness direction to form heat conduction.

5. The electrical device according to claim 1, wherein: A heat conduction block is provided in the first liquid cooling channel, and a device placement groove is provided on one side of the device installation cavity. The device placement groove is communicated with the device installation cavity, and the first electronic device is provided in the device placement groove and forms heat conduction with the groove wall of the device placement groove.

6. The electrical device according to claim 5, characterized in that: A plurality of heat-conducting blocks are arranged in the first liquid-cooling channel, and a flow-conducting branch is arranged between the plurality of heat-conducting blocks in the first liquid-cooling channel.

7. The electrical device according to claim 1, characterized in that: The electrical equipment includes at least two laminated water tanks, and at least two of the laminated water tanks are arranged in a laminated manner along the thickness direction. The second connection port group of one laminated water tank is connected to the second liquid cooling channel of another laminated water tank. The second liquid cooling channels of at least two of the laminated water tanks are connected to each other, and a device clamping groove is formed between two adjacent laminated water tanks.

8. The electrical device according to claim 7, characterized in that: The second connection port group includes at least two communicating holes and at least two communicating tubes, and one communicating tube of one of the laminated water tanks is connected to one of the communicating holes of another of the laminated water tanks.

9. The electrical device according to any one of claims 1 to 8, characterized in that: The laminated water tank is provided with hollow holes along the thickness direction, and the pins of the first electronic device pass through the hollow holes to be connected to the circuit board.

10. The electrical device according to claim 9, characterized in that: The circuit board is provided with a terminal connection seat on the bottom surface in the thickness direction, and a terminal connector is provided in the terminal connection seat. The fixed end of the terminal connector is welded to the circuit board, and the free end of the terminal connector is arranged in a spring-type manner. The pin of the first electronic device passes through the insertion port of the terminal connection seat and is connected to the free end of the terminal connector.

11. The electrical device according to claim 10, characterized in that: The insertion port is located in the hollow hole and close to the body of the first electronic component.

12. The electrical device according to claim 9, characterized in that: The laminated water tank includes a lower bottom plate and an upper cover plate, wherein the lower bottom plate is arranged in a straight plate, a lower through-hole is provided through the lower bottom plate, and the second connection port group is provided on the lower bottom plate; The upper cover plate is provided with an upper through-opening, and the upper cover plate is provided with a flow channel groove on the periphery of the upper through-opening. The upper cover plate is covered and connected with the lower base plate, and the upper through-opening and the lower through-opening are docked to form the hollow hole. The lower base plate is tightly connected to the outer edge of the flow channel groove, and the lower base plate and the flow channel groove form the second liquid cooling channel.

13. The electrical device according to claim 12, characterized in that: The first connection port group includes at least two connection holes, and the second connection port group includes at least two outwardly protruding connection tubes, one of the connection tubes is inserted into one of the connection holes and communicates with the connection hole.

14. The electrical device according to claim 13, characterized in that: The two connecting holes are located on the same side, a first partition wall is provided between the two connecting holes, at least two connecting pipes are located on the same side, the upper cover plate is provided with a second partition wall in the flow channel groove, the second partition wall is located between the two connecting pipes and is sealed with the lower base plate.

15. A powertrain, characterized in that: The invention comprises a motor and the electrical device according to any one of claims 1 to 14, wherein the electrical device is connected to the motor.

16. A means of transport, characterized in that The electrical device comprises the electrical device according to any one of claims 1 to 14.

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