Micro copper pillar processing technology and micro copper pillar

Abstract

The present application relates to a kind of micro copper column processing technology and micro copper column, process includes using cutting machine on copper foil along the first direction cuts a round trip;Cutting machine is along with the second direction perpendicular to the first direction along with initial position as benchmark moves set distance, cuts a round trip along the first direction;Cutting machine is along with the third direction opposite to the second direction along with initial position as benchmark moves set distance, cuts a round trip along the first direction;Using initial position's cutting machine along with the fourth direction perpendicular to the first direction cuts a round trip;Cutting machine is along with the second direction along with initial position as benchmark moves set distance, cuts a round trip along the fourth direction;Cutting machine is along with the third direction along with initial position as benchmark moves set distance, cuts a round trip along the fourth direction;Remove the burr on copper column, obtain micro copper column product.The present application process is simple and easy to operate, can high efficiency, low cost while completing micro copper column processing with high quality machining precision.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of copper column processing, in particular to a micro copper column processing technology and a micro copper column. BACKGROUND

[0002] The micro copper column is mostly applied to chips, and the processing requirement thereof is very high. For example, the processing requirement of the micro copper column is as follows: 1) the size of the product is required to be 0.5mm*0.5mm*0.7mm; 2) the size precision of the product is required to be ±0.01mm; and 3) the six surfaces of the processed copper column are required to be smooth and flat without defects, especially the 12 edges are required to be straight and smooth with an R angle of 0.05mm-0.1mm without breakpoints, sharp corners and burrs. In order to meet the above high-quality processing requirement, the prior art mostly adopts a precision stamping method to process the micro copper column. Generally, a copper wire or a copper sheet is used for stamping processing to form the micro copper column. When the copper wire is used for stamping processing, only a single copper wire can be stamped and processed at a time, and the working efficiency is low. In addition, when the copper sheet is used for stamping processing, the processing surface of the copper sheet is prone to collapse and deformation, and thus further shaping operation is required, and the process is relatively complicated. Moreover, at least one set of mold is required for the precision stamping process, and the mold opening cost is high.

[0003] Therefore, it is urgent to provide a micro copper column processing technology to overcome the above-mentioned defects in the prior art. SUMMARY

[0004] Therefore, the technical problem to be solved by the present application is to overcome the technical defects in the prior art, and to provide a micro copper column processing technology and a micro copper column, which is simple and easy to implement, can efficiently and low-costly complete the micro copper column processing, and has high-quality processing precision.

[0005] To solve the above technical problem, the present application provides a micro copper column processing technology, which comprises the following steps:

[0006] S1: using a cutting machine to cut a first knife along a first direction on a copper foil to be processed, and cutting a second knife along the same path in the opposite direction, and returning the cutting machine to the initial position;

[0007] S2: moving the cutting machine by a set distance along a second direction based on the initial position, using the moved cutting machine to cut a third knife along the first direction on the copper foil, and cutting a fourth knife along the same path in the opposite direction, wherein the second direction is perpendicular to the first direction;

[0008] S3: moving the cutting machine by a set distance along a third direction based on the initial position, using the moved cutting machine to cut a fifth knife along the first direction on the copper foil, and cutting a sixth knife along the same path in the opposite direction, wherein the third direction is opposite to the second direction;

[0009] S4: moving the cutting machine to an initial position, cutting a seventh cut on the copper foil along a fourth direction using the cutting machine, and cutting an eighth cut along the same path in the opposite direction, and the cutting machine returns to the initial position, wherein the fourth direction is perpendicular to the first direction;

[0010] S5: moving the cutting machine a set distance along the second direction based on the initial position, cutting a ninth cut on the copper foil along the fourth direction using the moved cutting machine, and cutting a tenth cut along the same path in the opposite direction;

[0011] S6: moving the cutting machine a set distance along the third direction based on the initial position, cutting an eleventh cut on the copper foil along the fourth direction using the moved cutting machine, and cutting a twelfth cut along the same path in the opposite direction;

[0012] S7: removing burrs on the copper pillar after cutting to obtain a micro copper pillar product.

[0013] In an embodiment of the present application, in steps S1-S6, the height of the copper foil to be processed is the same as the height of the micro copper pillar product.

[0014] In an embodiment of the present application, in steps S1-S6, the cutting machine is used to cut through the entire copper foil when cutting the copper foil to be processed.

[0015] In an embodiment of the present application, in steps S1-S6, the cutting machine includes a plurality of saw blades, and the plurality of saw blades are arranged at intervals, and the distance between adjacent two saw blades is equal to the length and / or width of the micro copper pillar product.

[0016] In an embodiment of the present application, the cutting machine further includes a connecting column, and the plurality of saw blades are uniformly arranged on the connecting column.

[0017] In an embodiment of the present application, the cutting surface of the saw blade is a plane, and the side surface adjacent to the cutting surface of the saw blade has roughness.

[0018] In an embodiment of the present application, in step S1, before cutting the copper foil to be processed using the cutting machine, the copper foil to be processed is fixed on a rotatable cutting platform.

[0019] In an embodiment of the present application, in step S4, the position of the cutting machine is unchanged, and the cutting direction of the cutting machine is changed by rotating the cutting platform.

[0020] In an embodiment of the present application, in step S7, the burrs on the copper pillar after cutting are removed by grinding.

[0021] In addition, the present application also provides a micro copper pillar, which is prepared by using the micro copper pillar processing process as described above.

[0022] The above technical solution of the present application has the following advantages compared with the prior art:

[0023] The micro copper column processing technology and the micro copper column are simple and easy to implement, and can complete the micro copper column processing with high efficiency, low cost and high processing precision. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to make the content of the present application more easily understood, the present application will be further described in detail below according to specific embodiments of the present application and in conjunction with the drawings.

[0025] Fig. 1 The flowchart of the micro copper column processing technology proposed by the present application.

[0026] Fig. 2 The state diagram of the cutting machine cutting the copper foil in the micro copper column processing technology proposed by the present application.

[0027] Fig. 3 The structure diagram of the cutting machine in the micro copper column processing technology proposed by the present application.

[0028] Fig. 4 The micro copper column product diagram prepared by the micro copper column processing technology proposed by the present application.

[0029] Figure legend: 1, cutting platform; 21, saw blade; 22, connecting column; 3, micro copper column product. DETAILED DESCRIPTION

[0030] The present application will be further described below in conjunction with the drawings and specific embodiments, so that those skilled in the art can better understand the present application and implement it, but the embodiments are not as a limitation on the present application.

[0031] Referring to Figs. 1 to 4 The embodiment of the present application provides a micro copper column processing technology, which comprises the following steps:

[0032] S1: using a cutting machine to cut a first knife on the copper foil to be processed along a first direction, and cutting a second knife along the same path in the opposite direction, the cutting machine returns to the initial position;

[0033] S2: the cutting machine moves a set distance along a second direction based on the initial position, and uses the moved cutting machine to cut a third knife on the copper foil along the first direction, and cuts a fourth knife along the same path in the opposite direction, wherein the second direction is perpendicular to the first direction;

[0034] S3: The cutting machine moves a set distance along the third direction based on the initial position, and uses the moved cutting machine to cut a fifth knife on the copper foil along the first direction and a sixth knife along the reverse direction of the same path;

[0035] S4: The cutting machine is moved to the initial position, and uses the cutting machine to cut a seventh knife on the copper foil along the fourth direction and an eighth knife along the reverse direction of the same path, and the cutting machine returns to the initial position, wherein the fourth direction is perpendicular to the first direction;

[0036] S5: The cutting machine moves a set distance along the second direction based on the initial position, and uses the moved cutting machine to cut a ninth knife on the copper foil along the fourth direction and a tenth knife along the reverse direction of the same path;

[0037] S6: The cutting machine moves a set distance along the third direction based on the initial position, and uses the moved cutting machine to cut an eleventh knife on the copper foil along the fourth direction and a twelfth knife along the reverse direction of the same path;

[0038] S7: The burrs on the copper pillar after cutting are removed to obtain a micro copper pillar product 3.

[0039] The micro copper pillar processing process has the advantages of simple process, high efficiency, low cost, and high processing precision.

[0040] In step S1, before the cutting machine is used to cut the copper foil to be processed, the copper foil to be processed is fixed on the rotatable cutting platform 1, so that in step S4, the position of the cutting machine is unchanged, and the cutting direction of the cutting machine is changed by rotating the cutting platform 1, for example, the cutting platform 1 is rotated by 90°, so that the cutting accuracy of the cutting machine can be ensured at all times.

[0041] In steps S1-S6, the cutting machine includes a plurality of saw blades 21 and a connecting column 22, the plurality of saw blades 21 are arranged at intervals, the plurality of saw blades 21 are uniformly arranged on the connecting column 22, and the distance between adjacent two saw blades 21 is equal to the length and / or width of the micro copper pillar product 3; in the embodiment, the length of the micro copper pillar product 3 is equal to the width, and of course the distance between adjacent two saw blades 21 is adjustable, which can adapt to the sizes of micro copper pillar products 3 of various specifications.

[0042] Further, in steps S1-S6, the height of the copper foil to be processed is the same as the height of the micro copper pillar product 3, that is, no cutting operation is required in terms of height, only the length and width of the micro copper pillar product 3 need to be cut, and in this embodiment, the length and width of the micro copper pillar product 3 are equal, that is, the spacing between the two adjacent saw blades 21 only needs to be adjusted once during the entire processing process, further simplifying the micro copper pillar processing process.

[0043] In steps S2, S3, S5 and S6, the cutting machine moves a set distance along the second direction or the third direction based on the initial position, so that burrs on the surface of the micro copper pillar product 3 can be removed.

[0044] Further, the copper foil is mostly red copper, which is soft and sticky, and the cutting surface is prone to burrs, so the cutting surface of the saw blade 21 is a plane, and the side surface adjacent to the cutting surface of the saw blade 21 has roughness, which can be used to eliminate 80-90% of the burrs left on the surface of the product.

[0045] Secondly, in step S7, the burrs on the copper pillar after cutting are removed by grinding, so that the remaining burrs on the surface of the micro copper pillar are removed by grinding to obtain a qualified micro copper pillar product 3.

[0046] The following will be described in detail in the form of examples.

[0047] Step one: place the copper foil with a thickness of 0.7mm on the cutting platform 1 and fix it.

[0048] Step two: adjust the multiple saw blades 21 with a thickness of 0.2mm to have a spacing of 0.5mm between adjacent saw blades 21.

[0049] Step three: adjust the working parameters of the cutting machine, at this time the saw blade 21 is in the original position.

[0050] Step four: cut a horizontal cut on the copper foil, which penetrates the entire copper foil.

[0051] Step five: cut a horizontal cut in the opposite direction along the same path, and the saw blade 21 returns to the original position.

[0052] Step six: move the saw blade 21 left by 0.02mm, and cut back and forth.

[0053] Step seven: the saw blade 21 returns to the original position.

[0054] Step eight: move the saw blade 21 right by 0.02mm, and cut back and forth.

[0055] Step nine: the saw blade 21 returns to the original position.

[0056] Step 10: Rotate the cutting platform 1 by 90 degrees.

[0057] Step 11: Make a longitudinal cut with saw blade 21.

[0058] Step 12: The saw blade 21 makes a reverse cut along the same path, and then returns the saw blade 21 to its original position.

[0059] Step 13: Move saw blade 21 to the left by 0.02mm and make one round cut.

[0060] Step Fourteen: Move the saw blade 21 0.02mm to the right and make one round trip cut.

[0061] Step 15: The cutting of the miniature copper pillar is complete.

[0062] Step 16: Grind to remove the burrs on the micro copper pillars to obtain micro copper pillar product 3.

[0063] Corresponding to the above-described embodiment of a micro copper column processing technology, this embodiment of the invention also provides a micro copper column, which is manufactured using the micro copper column processing technology described above.

[0064] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A process for processing miniature copper pillars, characterized in that: include: S1: Use a cutting machine to make a first cut along the first direction on the copper foil to be processed, and then make a second cut in the opposite direction along the same path. The cutting machine returns to the initial position. S2: The cutting machine moves a set distance along the second direction with the initial position as a reference, and uses the moved cutting machine to make a third cut on the copper foil along the first direction, and makes a fourth cut in the opposite direction along the same path, wherein the second direction is perpendicular to the first direction; S3: The cutting machine moves a set distance along a third direction based on the initial position, and then makes a fifth cut on the copper foil along the first direction, and makes a sixth cut in the opposite direction along the same path, wherein the third direction is opposite to the second direction; S4: Move the cutting machine to the initial position, use the cutting machine to make a seventh cut on the copper foil along the fourth direction, and make an eighth cut in the opposite direction along the same path. The cutting machine returns to the initial position, wherein the fourth direction is perpendicular to the first direction. S5: The cutting machine moves a set distance along the second direction based on the initial position, and then uses the moved cutting machine to make a ninth cut on the copper foil along the fourth direction, and then makes a tenth cut in the opposite direction along the same path. S6: The cutting machine moves a set distance along the third direction based on the initial position, and then makes an eleventh cut on the copper foil along the fourth direction using the moved cutting machine, and makes a twelfth cut in the opposite direction along the same path. S7: Remove the burrs from the cut copper pillar to obtain the miniature copper pillar product.

2. The micro copper pillar processing technology according to claim 1, characterized in that: In steps S1-S6, the height of the copper foil to be processed is the same as the height of the miniature copper pillar product.

3. The micro-copper pillar processing technology according to claim 1, characterized in that: In steps S1-S6, when using a cutting machine to cut the copper foil to be processed, it is necessary to cut through the entire copper foil.

4. A micro copper pillar processing technology according to claim 1, 2, or 3, characterized in that: In steps S1-S6, the cutting machine includes multiple saw blades, which are spaced apart, and the distance between two adjacent saw blades is equal to the length and / or width of the miniature copper pillar product.

5. The micro copper pillar processing technology according to claim 4, characterized in that: The cutting machine also includes a connecting column, on which multiple saw blades are evenly arranged.

6. The micro copper pillar processing technology according to claim 4, characterized in that: The cutting surface of the saw blade is flat, and the side of the saw blade adjacent to the cutting surface has roughness.

7. The micro copper pillar processing technology according to claim 1, characterized in that: In step S1, before using a cutting machine to cut the copper foil to be processed, the copper foil to be processed is fixed on a rotatable cutting platform.

8. The micro copper pillar processing technology according to claim 7, characterized in that: In step S4, the position of the cutting machine remains unchanged, and the cutting direction of the cutting machine is changed by rotating the cutting platform.

9. The micro copper pillar processing technology according to claim 1, characterized in that: In step S7, burrs on the copper pillar after cutting are removed by grinding.

10. A miniature copper pillar, characterized in that: The miniature copper pillar is manufactured using a miniature copper pillar processing technology as described in any one of claims 1-9.

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