Sample pretreatment systems that can be used in vacuum interconnection
By designing a robotic arm in the sample pretreatment system to flip the sample tray substrate, the problem of inconsistent sample orientation in vacuum interconnection equipment was solved, enabling contamination-free interconnection of sample transfer between different vacuum devices and ensuring sample quality.
Patent Information
- Application Number
- CN202310117600.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-01-30
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2043-01-30
AI Technical Summary
Existing vacuum interconnection equipment cannot effectively solve the problem of different sample orientations between different large instruments, which makes the samples easily oxidized or contaminated during the transfer process.
Design a sample pretreatment system for vacuum interconnection, including a rapid sample introduction chamber assembly and a pretreatment main chamber assembly. A robotic arm is used to in-situ flip the substrate orientation of the sample holder to ensure that the substrate orientation remains matched during vacuum transfer between different vacuum devices.
It enables effective interconnection of samples between different vacuum devices, preventing samples from being oxidized or contaminated during transport and ensuring sample quality.
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Figure CN116202837B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of vacuum interconnection equipment technology, and in particular to a sample pretreatment system that can be used for vacuum interconnection. Background Technology
[0002] Vacuum interconnection equipment utilizes ultra-high vacuum pipelines to interconnect several large-scale instruments used for material growth, device fabrication, and testing analysis. This ensures that samples are not oxidized, contaminated, or damaged by the external atmospheric environment when transferred between different instruments. However, effectively interconnecting several large-scale instruments with different functions is the key to the success or failure of vacuum interconnection equipment development, and also the biggest challenge in achieving vacuum interconnection.
[0003] Different large instruments and equipment have different sample orientations. For example, some growth equipment, such as certain ALD and magnetron sputtering equipment, has the sample facing upwards, while some growth equipment, such as MBE equipment, has the sample facing downwards. Traditional vacuum interconnection equipment cannot solve this problem well. Summary of the Invention
[0004] This invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of this invention is to provide a sample pretreatment system that can be used for vacuum interconnection, enabling vacuum interconnection between different vacuum devices with samples facing different directions.
[0005] A sample pretreatment system for vacuum interconnection according to an embodiment of the present invention includes:
[0006] A rapid injection chamber assembly includes an injection chamber body and a first sample transfer rod. The injection chamber body defines an injection chamber, and the injection chamber body is provided with an inlet and outlet window. The first sample transfer rod is connected to the injection chamber body, and one end of the first sample transfer rod is retractably disposed in the injection chamber.
[0007] A pretreatment main chamber assembly includes a main chamber body, a sample stage, a second sample transfer rod, and a robotic arm. The main chamber body defines a main chamber, and the sample stage is located within the main chamber. The main chamber body is equipped with a first gate valve connected to the sample inlet chamber, a second gate valve for connecting to a first external vacuum device, and a third gate valve for connecting to a second external vacuum device. The second sample transfer rod is connected to the main chamber body, and one end of the second sample transfer rod is retractably disposed within the main chamber. The robotic arm is connected to the main chamber body, and one end of the robotic arm is retractably and rotatably extended into the main chamber.
[0008] The first sample transfer rod is used to transfer the sample holder between the sample inlet chamber, the sample stage, and the first vacuum device; the second sample transfer rod is used to transfer the sample holder between the sample stage and the second vacuum device; the robotic arm is used to flip the sample holder on the sample stage in situ so that the substrate of the sample holder faces upward or downward.
[0009] According to an embodiment of the present invention, a sample pretreatment system for vacuum interconnection can be used when the sample growth orientations in the first vacuum device and the second vacuum device are different. For example, the first vacuum device is a growth device where the sample grows upwards, such as certain ALD and magnetron sputtering devices, while the second vacuum device is a growth device where the sample grows downwards, such as an MBE device. The substrate orientation of the sample holder can be changed by in-situ flipping the sample holder using a robotic arm, thereby matching the substrate orientation of the sample holder in both the first and second vacuum devices with the sample growth orientation. This allows the sample in both the first and second vacuum devices to grow on the substrate. In other words, the sample pretreatment system for vacuum interconnection of the present invention can achieve vacuum interconnection between different vacuum devices with different sample orientations. Furthermore, the entire process of transferring the sample holder is carried out in a vacuum, effectively avoiding contamination of the sample on the substrate due to atmospheric exposure between different processes.
[0010] In some embodiments, the sample holder includes a sample holder body and a substrate, the substrate being embedded on one side of the sample holder body, and the edge of the sample holder body having a clamping portion for the robotic arm to grip.
[0011] In some embodiments, the sample holder is divided into a large sample holder and a small sample holder; the size of the large sample holder is larger than the size of the small sample holder.
[0012] In some embodiments, the first slide gate valve, the sample stage, and the second slide gate valve are arranged on the forward and backward path of the first sample transfer rod; the third slide gate valve and the sample stage are arranged on the forward and backward path of the second sample transfer rod.
[0013] In some embodiments, the progress path of the first sample transfer rod and the forward and backward path of the second sample transfer rod are arranged in a cross shape on the horizontal plane.
[0014] In some embodiments, the sample stage is a rotatable sample stage.
[0015] In some embodiments, the pretreatment main cavity assembly further includes a cleaning device disposed on the main cavity body for cleaning the substrate surface.
[0016] In some embodiments, the cleaning apparatus includes a heating stage and / or a plasma cleaner, wherein the heating stage heats the substrate to remove physical adsorption on the substrate surface, and the plasma cleaner uses a plasma of gas to remove chemical adsorption on the substrate surface.
[0017] In some embodiments, the rapid injection chamber assembly further includes a first pump group and a first vacuum gauge, the first pump group and the first vacuum gauge being disposed on the injection chamber body, and being used to regulate the vacuum level of the rapid injection chamber and to detect the vacuum level inside the rapid injection chamber, respectively; the pretreatment main chamber assembly further includes a second pump group and a second vacuum gauge, the second pump group and the first vacuum gauge being disposed on the main chamber body, and being used to adjust the vacuum level of the main chamber and to detect the vacuum level of the main chamber, respectively.
[0018] In some embodiments, a movable support is also included, on which the rapid injection chamber assembly and the pretreatment main chamber assembly are disposed.
[0019] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0020] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0021] Figure 1 This is a three-dimensional schematic diagram of a sample pretreatment system for vacuum interconnection according to an embodiment of the present invention;
[0022] Figure 2 A cross-sectional view of a sample holder for use in a vacuum interconnected sample pretreatment system according to an embodiment of the present invention;
[0023] Figure 3 This is a schematic diagram of a heated substrate for a sample pretreatment system that can be used for vacuum interconnection, according to an embodiment of the present invention.
[0024] Figure 4 This is a schematic diagram of a large sample holder for a sample pretreatment system that can be used in vacuum interconnection, according to an embodiment of the present invention.
[0025] Figure 5 This is a schematic diagram of a robotic arm performing in-situ flipping of a large sample holder in a sample pretreatment system applicable to vacuum interconnection, according to an embodiment of the present invention.
[0026] Figure 6 This is a schematic diagram of a small sample holder for a sample pretreatment system that can be used in vacuum interconnection, according to an embodiment of the present invention.
[0027] Figure 7This is a schematic diagram of a robotic arm performing in-situ flipping of a small sample holder in a sample pretreatment system that can be used for vacuum interconnection, according to an embodiment of the present invention.
[0028] Figure label:
[0029] A sample pretreatment system 1000 that can be used for vacuum interconnection;
[0030] Rapid sample injection chamber assembly 1; sample injection chamber 101; sample injection chamber 1011; sample inlet / outlet window 1012; first sample transfer rod 102; first pump group 103; first vacuum gauge 104; pretreatment main chamber assembly 2; main chamber 201; main chamber 2011; first gate valve 2012; second gate valve 2013; third gate valve 2014; sample stage 202; second sample transfer rod 203; robotic arm 204; second pump group 205; second vacuum gauge 206; cleaning device 207; heating stage 2071; plasma cleaner 2072; sample holder 3; substrate 301; sample holder body 302; clamped part 3021; auxiliary frame 303; movable support 4; first vacuum device A; second vacuum device B. Detailed Implementation
[0031] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.
[0032] The following is combined with Figures 1 to 7 This invention describes a sample pretreatment system 1000 that can be used for vacuum interconnection, according to an embodiment of the present invention.
[0033] like Figures 1 to 7 As shown, a sample pretreatment system 1000 for vacuum interconnection according to an embodiment of the present invention includes a rapid sample introduction chamber assembly 1 and a pretreatment main chamber assembly 2.
[0034] The rapid injection chamber assembly 1 includes an injection chamber 101 and a first sample transfer rod 102. An injection chamber 1011 is defined inside the injection chamber 101. An injection window 1012 is provided on the injection chamber 101. The first sample transfer rod 102 is connected to the injection chamber 101, and one end of the first sample transfer rod 102 is retractably disposed in the injection chamber 1011.
[0035] The pretreatment main chamber assembly 2 includes a main chamber 201, a sample stage 202, a second sample transfer rod 203, and a robot arm 204. The main chamber 201 defines a main chamber 2011, and the sample stage 202 is located in the main chamber 2011. The main chamber 201 is provided with a first gate valve 2012 connected to the sample inlet chamber 101, a second gate valve 2013 for connecting to a first vacuum device A, and a third gate valve 2014 for connecting to a second vacuum device B. The second sample transfer rod 203 is connected to the main chamber 201, and one end of the second sample transfer rod 203 is retractably disposed in the main chamber 2011. One end of the second sample transfer rod 203 and one end of the first sample transfer rod 102 are both sample placement ends, which can receive and transfer the sample holder 3. The robot arm 204 is connected to the main chamber 201, and one end of the robot arm 204 can retract and rotatably extend into the main chamber 2011. The first transfer rod 102 is used to transfer the sample holder 3 between the sample inlet chamber 1011, the sample stage 202 and the first vacuum device A; the second transfer rod 203 is used to transfer the sample holder 3 between the sample stage 202 and the second vacuum device B; the robot arm 204 is used to flip the sample holder 3 on the sample stage 202 in situ so that the substrate 301 of the sample holder 3 faces upward or downward.
[0036] The following describes a specific workflow of a sample pretreatment system 1000 for vacuum interconnection according to an embodiment of the present invention: (e.g.) Figure 2As shown, the sample holder 3 is connected to the first vacuum device A via the second gate valve 2013 and to the second vacuum device B via the third gate valve 2014. The sample holder 3 can enter the sample inlet chamber 1011 through the sample inlet / outlet window 1012 and be placed on the sample placement end of the first transfer rod 102, with the substrate 301 of the sample holder 3 facing downwards. By opening the first gate valve 2012, the first transfer rod 102 transfers the sample holder 3 to the sample stage 202. Then, the sample holder 3 needs to enter either the first vacuum device A or the second vacuum device B for sample growth. For ease of description, it is assumed here that the sample holder 3 first needs to enter the first vacuum equipment A for growth, and the substrate 301 of the sample holder 3 needs to face upward in the first vacuum equipment A. At this time, the sample holder 3 on the sample stage 202 can be picked up by the robot arm 204, rotated 180 degrees in place, and then placed back on the sample stage 202. By opening the second insert valve 2013, the first transfer rod 102 transfers the sample holder 3 from the sample stage 202 to the first vacuum equipment A. Then, the first transfer rod 102 returns to its original position, and the second insert valve 2013 and the first insert valve 2012 are closed. After the first vacuum equipment A process is completed, if the second vacuum equipment B process is required next, and the substrate 301 of the sample holder 3 needs to face downwards for the second vacuum equipment B process, the first sample transfer rod 102 will transfer the sample holder 3, which has completed the first vacuum equipment A process, from the first vacuum equipment A to the sample stage 202. The robotic arm 204 will then hold the sample holder 3, perform a 180° in-situ rotation, and place it back on the sample stage 202. By opening the third gate valve 2014, the second sample transfer rod 203 will then transfer the sample holder 3, which has completed the first vacuum equipment A process, from the sample stage 202 to the second vacuum equipment B. Then, the second sample transfer rod 203 will return to its original position, and the third gate valve 2014 will close. This allows the orientation of the substrate 301 of the sample holder 3 in different vacuum equipment to match the sample growth orientation, enabling samples from different vacuum equipment to grow on the substrate 301.
[0037] It should be noted that, under normal circumstances, when the sample pretreatment system 1000 of the present invention, which can be used for vacuum interconnection, is working, the sample injection chamber 1011 and the main chamber 2011 are in a vacuum. In this way, the entire process of transferring the sample tray 3 is carried out in a vacuum, which effectively avoids contamination of the sample on the substrate 301 due to exposure to the atmosphere between different processes.
[0038] According to the sample pretreatment system 1000 for vacuum interconnection of the present invention, when the sample growth orientations in the first vacuum device A and the second vacuum device B are different—for example, the first vacuum device A is a growth device with the sample growing upwards, such as certain ALD and magnetron sputtering devices, while the second vacuum device B is a growth device with the sample growing downwards, such as an MBE device—the orientation of the substrate 301 of the sample holder 3 can be changed by in-situ flipping the sample holder 3 using a robotic arm 204. This achieves matching of the substrate 301 orientation of the sample holder 3 in the first vacuum device A and the second vacuum device B with the sample growth orientation, allowing the samples in the first vacuum device A and the second vacuum device B to grow on the substrate 301. In other words, the sample pretreatment system 1000 for vacuum interconnection of the present invention can achieve vacuum interconnection between different vacuum devices with different sample orientations. Furthermore, the entire process of transferring the sample holder 3 is carried out in a vacuum, effectively avoiding contamination of the sample on the substrate 301 due to exposure to the atmosphere between different processes.
[0039] In some embodiments, such as Figures 4 to 7 As shown, the sample holder 3 includes a sample holder body 302 and a substrate 301. The substrate 301 is embedded on one side of the sample holder body 302, and the edge of the sample holder body 302 is provided with a clamping part 3021 for the robot arm 204 to grip. It can be understood that the sample holder body 302 supports the substrate 301, the substrate 301 is used for sample growth, and the clamping part 3021 on the edge of the sample holder body 302 facilitates gripping by the robot arm 204.
[0040] In some embodiments, such as Figures 4 to 7 As shown, sample holder 3 is divided into large sample holder 3 (see...) Figure 4 and Figure 5 ) and small sample holder 3 (see Figure 6 and Figure 7 The substrate 301 of the large sample holder 3 is larger than the substrate 301 of the small sample holder 3. For example, if the substrate 301 of the large sample holder 3 is circular with a radial dimension of 2 inches, then the sample grown on the substrate 301 of the large sample holder 3 can be circular with a radial dimension of 2 inches; if the substrate 301 of the small sample holder 3 is rectangular with a dimension of less than or equal to 10 mm * 10 mm, then the sample grown on the substrate 301 of the small sample holder 3 can be rectangular with a dimension of less than or equal to 10 mm * 10 mm. It should be noted that when using the small sample holder 3, an auxiliary frame 303 needs to be embedded in the sample holder body 302 of the small sample holder 3. This auxiliary frame 303 is similar to the sample holder body 302 of the large sample holder 3, so that the small sample holder 3 can be placed on one end of the first transfer rod 102 and the second transfer rod 203 through the auxiliary frame 303, which facilitates the transfer of the small sample holder 3 by the first transfer rod 102 and the second transfer rod 203.
[0041] In some embodiments, such as Figure 1 and Figure 2 As shown, the first slide gate valve 2012, the sample stage 202, and the second slide gate valve 2013 are arranged on the forward and backward path of the first sample transfer rod 102, so that the first sample transfer rod 102 can linearly transfer the sample holder 3 between the sample inlet chamber 1011, the sample stage 202, and the first vacuum device A; the third slide gate valve 2014 and the sample stage 202 are arranged on the forward and backward path of the second sample transfer rod 203, so that the second sample transfer rod 203 can linearly transfer the sample holder 3 between the sample stage 202 and the second vacuum device B.
[0042] In some embodiments, the progress path of the first sample transfer rod 102 and the forward and backward path of the second sample transfer rod 203 are arranged in a cross shape on the horizontal plane, which is a more reasonable layout.
[0043] In some embodiments, such as Figure 3 As shown, the sample stage 202 is a rotatable sample stage 202, which allows the first sample transfer rod 102, the second sample transfer rod 203 and the robot arm 204 to have different requirements for the direction of the sample tray 3. For example, when the sample tray 3 is transferred from the first sample transfer rod 102 to the second sample transfer rod 203, the sample tray 3 needs to be rotated 90° on the horizontal plane.
[0044] In some embodiments, such as Figure 1 As shown, the pretreatment main cavity assembly 2 also includes a cleaning device 207, which is disposed on the main cavity 201 and is used to clean the surface of the substrate 301 to ensure that the substrate 301 entering the first vacuum device A and the second vacuum device B is clean, so that the sample quality (i.e. the film quality) grown on the surface of the substrate 301 is high.
[0045] In some embodiments, the cleaning apparatus 207 includes a heating stage 2071 and / or a plasma cleaner 2072, wherein the heating stage 2071 heats the substrate 301 using a heating filament to remove physical adsorption on the surface of the substrate 301, and the plasma cleaner 2072 uses gas plasma to remove chemical adsorption on the surface of the substrate 301. Thus, the substrate 301 is treated to obtain a clean substrate 301 for subsequent sample growth, such as the epitaxial growth of a thin film.
[0046] In some embodiments, the heating stage 2071 is disposed on the upper side of the main cavity 201 and is linearly movable. It is understood that when the sample holder 3 is transferred from the sample inlet chamber 1011 to the sample stage 202, with the substrate 301 of the sample holder 3 facing downwards, the heating stage 2071 can move downwards to the vicinity of the substrate 301, and the substrate 301 can be heated by the heating filament, which can improve the efficiency of removing physical adsorption on the surface of the substrate 301.
[0047] In some embodiments, such as Figure 1 As shown, the rapid injection chamber assembly 1 also includes a first pump group 103 and a first vacuum gauge 104, which are disposed on the injection chamber 101 and are used to regulate the vacuum level of the rapid injection chamber and to detect the vacuum level inside the rapid injection chamber 101, respectively. The pretreatment main chamber assembly 2 also includes a second pump group 205 and a second vacuum gauge 206, which are disposed on the main chamber 201 and are used to regulate the vacuum level of the main chamber 2011 and to detect the vacuum level of the main chamber 2011, respectively. Understandably, the vacuum level of the sample injection chamber 1011 can be obtained through the first pump group 103 and the first vacuum gauge 104, which can meet the actual vacuum requirements of the sample injection chamber 1011; the vacuum level of the main chamber 2011 can be obtained through the second pump group 205 and the second vacuum gauge 206, which can meet the actual vacuum requirements of the main chamber 2011; after the sample holder 3 is placed into one end of the first transfer rod 102 in the sample injection chamber 1011 through the sample inlet / outlet window 1012, the sample injection chamber 1011 can be evacuated by the first pump group 103. When the vacuum level of the sample injection chamber 1011 is evacuated to a level close to that of the main chamber 2011, the first gate valve 2012 is opened, and then the first transfer rod 102 transfers the sample holder 3 to the sample stage 202. In most cases, the vacuum levels in the first vacuum equipment A and the second vacuum equipment B are different. For example, the first vacuum equipment A is a low-vacuum equipment such as magnetron sputtering and atomic deposition, while the second vacuum equipment B is an ultra-high vacuum equipment such as molecular epitaxy and many characterization equipment. After the process in the first vacuum equipment A is completed, the sample needs to be transferred to the second vacuum equipment B for the next process. The main chamber 2011 acts as a transfer station. With the opening and closing of the second gate valve 2013 and the third gate valve 2014, it can play a role in vacuum buffering, avoiding mutual interference between the vacuum levels of the first vacuum equipment A and the second vacuum equipment B, thus preventing cross-contamination.
[0048] In some embodiments, such as Figure 1 As shown, the system also includes a movable support 4, with the rapid sample injection chamber assembly 1 and the pretreatment main chamber assembly 2 mounted on the movable support 4. This facilitates the overall movement of the sample pretreatment system 1000, which can be used for vacuum interconnection according to this embodiment of the invention.
[0049] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0050] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims
1. A sample pretreatment system for use in vacuum interconnection, characterized in that, include: A rapid injection chamber assembly includes an injection chamber body and a first sample transfer rod. The injection chamber body defines an injection chamber, and the injection chamber body is provided with an inlet and outlet window. The first sample transfer rod is connected to the injection chamber body, and one end of the first sample transfer rod is retractably disposed in the injection chamber. A pretreatment main chamber assembly includes a main chamber body, a sample stage, a second sample transfer rod, and a robotic arm. The main chamber body defines a main chamber, and the sample stage is located within the main chamber. The main chamber body is equipped with a first gate valve connected to the sample inlet chamber, a second gate valve for connecting to a first external vacuum device, and a third gate valve for connecting to a second external vacuum device. The second sample transfer rod is connected to the main chamber body, and one end of the second sample transfer rod is retractably disposed within the main chamber. The robotic arm is connected to the main chamber body, and one end of the robotic arm is retractably and rotatably extended into the main chamber. The first sample transfer rod is used to transfer the sample tray between the sample inlet chamber, the sample stage, and the first vacuum device; the second sample transfer rod is used to transfer the sample tray between the sample stage and the second vacuum device; the robotic arm is used to perform in-situ flipping of the sample tray on the sample stage so that the substrate of the sample tray faces upward or downward; the first gate valve, the sample stage, and the second gate valve are arranged on the forward and backward path of the first sample transfer rod; the third gate valve and the sample stage are arranged on the forward and backward path of the second sample transfer rod, and the forward path of the first sample transfer rod and the forward and backward path of the second sample transfer rod are arranged in a cross shape on the horizontal plane.
2. The sample pretreatment system for vacuum interconnection according to claim 1, characterized in that, The sample holder includes a sample holder body and a substrate. The substrate is embedded on one side of the sample holder body, and the edge of the sample holder body is provided with a clamping part for the robotic arm to hold.
3. The sample pretreatment system for vacuum interconnection according to claim 2, characterized in that, The sample holder is divided into a large sample holder and a small sample holder; the size of the large sample holder is larger than the size of the small sample holder.
4. The sample pretreatment system for vacuum interconnection according to claim 1, characterized in that, The sample stage is a rotatable sample stage.
5. The sample pretreatment system for vacuum interconnection according to claim 1, characterized in that, The pretreatment main cavity assembly also includes a cleaning device disposed on the main cavity body for cleaning the substrate surface.
6. The sample pretreatment system for vacuum interconnection according to claim 5, characterized in that, The cleaning apparatus includes a heating stage and / or a plasma cleaner, wherein the heating stage heats the substrate to remove physical adsorption on the substrate surface, and the plasma cleaner uses gas plasma to remove chemical adsorption on the substrate surface.
7. The sample pretreatment system for vacuum interconnection according to claim 1, characterized in that, The rapid injection chamber assembly further includes a first pump group and a first vacuum gauge, which are disposed on the injection chamber body and are used to regulate the vacuum level of the rapid injection chamber and to detect the vacuum level inside the rapid injection chamber, respectively. The pretreatment main chamber assembly further includes a second pump group and a second vacuum gauge, which are disposed on the main chamber body and are used to regulate the vacuum level of the main chamber and to detect the vacuum level inside the main chamber, respectively.
8. The sample pretreatment system for vacuum interconnection according to claim 1, characterized in that, It also includes a movable support, on which the rapid injection chamber assembly and the pretreatment main chamber assembly are mounted.
Citation Information
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