Cold Plate Assembly for Server, Server, and Operation and Maintenance Method of Cold Plate Assembly

Abstract

An embodiment of the present application provides a cold plate assembly for a server, a server, and an operation and maintenance method for the cold plate assembly. Among them, the cold plate assembly for the server includes: a first cold plate for dissipating heat from the CPU; a liquid cooling pipeline, the liquid cooling pipeline is communicated with the first cold plate; a shunt, the shunt is communicated with the liquid cooling pipeline, and the position between the shunt and the first cold plate is adjustably connected; a second cold plate for dissipating heat from the memory module, the second cold plate is communicated with the shunt, and can move relative to the memory slot under the drive of the shunt to avoid the memory module; an operation locking mechanism, the operation locking mechanism is arranged between the shunt and the first cold plate, and can control and lock the relative position between the shunt and the first cold plate. The present application solves the problem of friction and abrasion between the cold plate assembly and components during installation and maintenance on the surface of the cold plate assembly in the related art.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of server heat dissipation. Specifically, the present application relates to a cold plate assembly for a server, a server, and an operation and maintenance method for the cold plate assembly. Background Art

[0002] With the rapid application and popularization of information interconnection technology, as the carrier, the application volume of servers has increased rapidly. The local heat dissipation requirements of high-power and high-performance servers have become a major problem, especially the local efficient heat dissipation of components such as CPUs, DIMMs (memory), and HDDs (hard disks), which are the main heat-generating components.

[0003] The liquid cooling heat dissipation method is to take away heat through the heat exchange cooling method after physically contacting the liquid cooling medium with the components with heat dissipation requirements. The commonly used liquid cooling heat dissipation method in the current server heat dissipation field is to immerse the entire server in the cooling cabinet and achieve heat exchange through full immersion in the cold liquid medium. The traditional air cooling and full immersion heat dissipation methods are applicable to the overall heat dissipation of the server, with low local differentiation and are restricted by space or cost issues.

[0004] Recently, research and application of the attached heat conduction liquid cooling technology have begun in the field of server liquid cooling heat dissipation. Contact cold plate heat dissipation is adopted at positions such as the main components of the server, such as CPUs, DIMMs, and GPUs. The liquid cooling attached heat dissipation adopts heat conduction and heat convection technologies, and through a set of circulating refrigerant medium, heat interaction is realized on the surface of the components to be cooled, so as to achieve the purpose of cooling and heat dissipation.

[0005] Although the research and application of the attached cold plate heat dissipation happen to be beneficial to solve the heat dissipation problem of local devices, it also brings problems in attached installation operation and maintenance, such as the problem of friction and scratching between the cold plate assembly surface and the components during installation and maintenance. Summary of the Invention

[0006] The embodiments of the present application provide a cold plate assembly for a server, a server, and an operation and maintenance method for the cold plate assembly, so as to at least solve the problem of friction and scratching between the cold plate assembly surface and the components during installation and maintenance in the related art.

[0007] According to an embodiment of the present application, there is provided a cold plate assembly for a server, including: a first cold plate for cooling the CPU; a liquid cooling pipeline, the liquid cooling pipeline is communicated with the first cold plate; a shunt, the shunt is communicated with the liquid cooling pipeline, and the position between the shunt and the first cold plate is adjustably connected; a second cold plate for cooling the memory module, the second cold plate is communicated with the shunt and can move relative to the memory slot under the drive of the shunt to avoid the memory module; an operation locking mechanism, the operation locking mechanism is arranged between the shunt and the first cold plate and can control and lock the relative position between the shunt and the first cold plate.

[0008] In an exemplary embodiment, the diverter is movably arranged along the arrangement direction of a plurality of memory slots.

[0009] In an exemplary embodiment, the diverter extends along the arrangement direction of a plurality of memory slots, there are a plurality of second cold plates, and each second cold plate is arranged along the arrangement direction of the plurality of memory slots, and each second cold plate is communicated with the diverter.

[0010] In an exemplary embodiment, there are a plurality of diverters, and two ends of the second cold plate are respectively communicated with different diverters, and each diverter can move synchronously to drive the second cold plate to move.

[0011] In an exemplary embodiment, the operation locking mechanism includes: a connection bracket connected to the diverter; a sliding groove arranged on the first cold plate, the connection bracket extends into the sliding groove and can move in the sliding groove; a first locking member passing through the connection bracket and the sliding groove and capable of locking the connection bracket in the sliding groove.

[0012] In an exemplary embodiment, the sliding groove has a plurality of locking holes, the connection bracket has a connection hole, when the position of the connection bracket is adjusted, the connection hole is adjustably aligned with the locking hole, and the first locking member passes through the connection hole and the locking hole aligned with the connection hole to lock the connection bracket.

[0013] In an exemplary embodiment, the operation locking mechanism further includes: a support plate connected to the first cold plate, a sliding groove extending along the moving direction of the connection bracket is arranged on the support plate; a handle, a connection shaft of the handle is rotatably connected to the connection bracket, and the connection shaft passes through the sliding groove, the handle is swingably arranged, and when the handle swings, the connection shaft moves along the sliding groove to drive the connection bracket and the second cold plate to move.

[0014] In an exemplary embodiment, an arc-shaped groove is arranged on the surface of the first cold plate at the position of the support plate, an end of the handle has an arc-shaped structure, the arc-shaped structure is located in the arc-shaped groove and abuts against the arc-shaped surface of the arc-shaped groove, the inner wall of the arc-shaped groove has a protrusion, and the arc-shaped structure has a recess, and the protrusion is located in the recess.

[0015] In an exemplary embodiment, the cold plate assembly further includes: a bracket, the bracket and the operation locking mechanism are respectively located on opposite sides of the diverter, and the bracket supports the diverter; a second locking member passing through the bracket and the diverter and capable of connecting with the diverter to lock the diverter.

[0016] In an exemplary embodiment, the second locking member includes a fitting section and a threaded section, the diverter has a mounting hole, when the diverter moves, the fitting section cooperates with the mounting hole, and when the movement of the diverter is completed, the threaded section is in threaded cooperation with the mounting hole to lock the diverter.

[0017] In an exemplary embodiment, the cold plate assembly further includes a protective pad located on the outer peripheral side of the second cold plate, and the second cold plate exchanges heat with the memory module through the protective pad.

[0018] According to another embodiment of the present application, a server is provided, including the above-mentioned cold plate assembly for a server.

[0019] According to still another embodiment of the present application, an operation and maintenance method for a cold plate assembly is further provided. Using the above-mentioned cold plate assembly for a server, the operation and maintenance method includes: operating the locking mechanism to unlock the position of the diverter and drive the diverter to move, the diverter drives the second cold plate to move, and a gap of a predetermined size is formed between the second cold plate and the memory slot; when the operation of the memory module is completed, operate the locking mechanism to unlock the diverter and then act in the reverse direction, the locking mechanism drives the diverter to move in the reverse direction, the diverter drives the second cold plate to closely adhere to the memory module, and the locking mechanism locks the positions of the diverter and the second cold plate.

[0020] In an exemplary embodiment, when the locking mechanism unlocks the position of the diverter, the first locking member exits the sliding groove and unlocks the connecting bracket, then the handle swings, the connecting shaft of the handle moves in the sliding groove, the connecting shaft drives the connecting bracket to move, the connecting bracket drives the diverter and the second cold plate to move, and the position of the second cold plate is adjusted; when the locking mechanism locks the position of the diverter, the first locking member penetrates into the sliding groove, and the threaded section of the second locking member is threadedly engaged with the mounting hole to lock the connecting bracket.

[0021] In an exemplary embodiment, after the diverter drives the second cold plate to move to form a gap of a predetermined size with the memory slot, the locking mechanism locks the position of the diverter and keeps the second cold plate at the position where a gap of a predetermined size is formed with the memory slot.

[0022] The technical solution of this application is provided with a diverter. The diverter can transport the medium in the liquid cooling pipeline into the second cold plate, realizing the heat dissipation of the memory module by the second cold plate, that is, realizing liquid cooling attachment heat dissipation. At the same time, in this embodiment, the diverter is also set in an adjustable manner. Since the diverter and the second cold plate are connected together, adjusting the position of the diverter is also adjusting the position of the second cold plate. In this way, when the memory module needs to be inserted or removed, the position of the diverter can be unlocked by operating the locking mechanism first. At this time, the positions of the diverter and the second cold plate can be adjusted. Then, by manually operating the diverter and the second cold plate, or by operating the locking mechanism to drive the diverter and the second cold plate to move, a certain gap is left between the second cold plate and the memory slot. Then the memory module can be inserted or removed. At this time, due to the gap between the second cold plate and the memory slot, no friction or scraping will occur between the memory module and the second cold plate, thus ensuring the safety of the memory module, extending its life, and facilitating the operation and maintenance. After the memory module is inserted or removed, the diverter and the second cold plate are driven to the position where the second cold plate is in close contact with the memory module again by directly pushing manually or by operating the locking mechanism to drive. Then the locking mechanism is operated to lock the position of the diverter, thereby locking the position of the second cold plate and ensuring the heat dissipation effect of the second cold plate. The above setting method optimizes the second cold plate on the basis of ensuring reliable heat dissipation of the memory module, enabling the position of the second cold plate to be adjusted as needed, thus avoiding friction and scraping between the memory module and the second cold plate, ensuring the service life of the memory module. At the same time, when replacing the memory module, the entire liquid cooling module does not need to be disassembled, which is more convenient to use. Moreover, it is integrally installed in the internal space of the original device without changing the original structure, realizing the convenience of maintenance and repair. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic structural diagram when the cold plate assembly for the server of this application is installed and used;

[0024] Figure 2 is Figure 1 the schematic structural diagram of the cold plate assembly in

[0025] Figure 3 is Figure 1 the schematic structural diagram at the operation locking mechanism in

[0026] Figure 4 is Figure 1 the schematic structural diagram of the first cold plate in

[0027] Figure 5 is Figure 1 the schematic structural diagram at the diverter and the second cold plate in

[0028] Among them, the above-mentioned drawings include the following reference numerals:

[0029] 10. First cold plate; 20. Liquid cooling pipeline; 30. Shunt; 40. Second cold plate; 50. Operation locking mechanism; 51. Connection bracket; 52. Sliding groove; 521. Locking hole; 53. First locking member; 54. Support plate; 541. Chute; 55. Handle; 551. Connection shaft; 60. Bracket; 70. Second locking member; 80. Protection pad; 90. Memory module. Detailed implementation manner

[0030] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments may be combined with each other. The present invention will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0031] It should be pointed out that unless otherwise specified, all technical and scientific terms used in the present application have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs.

[0032] In the present invention, unless otherwise stated, the orientation words such as "upper, lower, top, bottom" are usually in the direction shown in the drawings, or in the vertical, perpendicular or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner, outer" refer to the inner and outer of the contour of each component itself, but the above orientation words do not limit the present invention.

[0033] The embodiments of the present application will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0034] In order to solve the problem of friction and abrasion between the surface of the cold plate assembly and components during installation and maintenance in the related art, the embodiments of the present application provide a cold plate assembly for a server, a server and an operation and maintenance method for the cold plate assembly.

[0035] As Figures 1 to 5 shown, a cold plate assembly for a server includes a first cold plate 10 for cooling the CPU, a liquid cooling pipeline 20, a shunt 30, a second cold plate 40 for cooling the memory module 90, and an operation locking mechanism 50. The liquid cooling pipeline 20 is communicated with the first cold plate 10; the shunt 30 is communicated with the liquid cooling pipeline 20, and the position between the shunt 30 and the first cold plate 10 is adjustably connected; the second cold plate 40 is communicated with the shunt 30 and can move relative to the memory slot driven by the shunt 30 to avoid the memory module 90; the operation locking mechanism 50 is arranged between the shunt 30 and the first cold plate 10 and can control and lock the relative position between the shunt 30 and the first cold plate 10.

[0036] In this embodiment, a diverter 30 is provided. The diverter 30 can deliver the medium in the liquid cooling pipeline 20 into the second cold plate 40, so as to realize the heat dissipation of the second cold plate 40 to the memory module 90, that is, to realize liquid cooling attachment type heat dissipation. At the same time, in this embodiment, the diverter 30 is also arranged in an adjustable manner. Since the diverter 30 and the second cold plate 40 are connected together, adjusting the position of the diverter 30 is essentially adjusting the position of the second cold plate 40. In this way, when the memory module 90 needs to be inserted or removed, the position of the diverter 30 can be unlocked by operating the locking mechanism 50 first. At this time, the positions of the diverter 30 and the second cold plate 40 can be adjusted. Then, by manually operating the diverter 30 and the second cold plate 40, or by operating the locking mechanism 50 to drive the diverter 30 and the second cold plate 40 to move, a certain gap is left between the second cold plate 40 and the memory slot. Then, the memory module 90 can be inserted or removed. At this time, due to the gap between the second cold plate 40 and the memory slot, the memory module 90 and the second cold plate 40 will not rub against each other, thus ensuring the safety of the memory module 90, extending its service life, and facilitating the operation and maintenance. After the memory module 90 is inserted or removed, the diverter 30 and the second cold plate 40 are driven to the position where the second cold plate 40 is in close contact with the memory module 90 again by directly pushing manually or by operating the locking mechanism 50 to drive. Then, the locking mechanism 50 is operated to lock the position of the diverter 30, thereby locking the position of the second cold plate 40 and ensuring the heat dissipation effect of the second cold plate 40. The above setting method optimizes the second cold plate 40 on the basis of ensuring reliable heat dissipation of the memory module 90, so that the position of the second cold plate 40 can be adjusted as needed, thus avoiding situations such as friction and abrasion between the memory module 90 and the second cold plate 40, ensuring the service life of the memory module 90. At the same time, when the memory module 90 is replaced, the entire liquid cooling module does not need to be disassembled, which is more convenient to use. Moreover, it is integrally installed in the internal space of the original device without changing the original structure, realizing the convenience of maintenance and repair.

[0037] It should be noted that when the cold plate assembly is installed, since the first cold plate 10 is used to dissipate heat from the CPU, the first cold plate 10 is generally fixedly installed. Therefore, the movable settings of the second cold plate 40 and the diverter 30 essentially change the positions of the second cold plate 40 and the diverter 30 relative to components such as the server motherboard and the memory module 90.

[0038] Preferably, the diverter 30 is movably arranged along the arrangement direction of multiple memory slots, that is Figure 1It generally moves in the left - right direction. In this way, on the one hand, it can ensure that there is a gap between the second cold plate 40 and the memory module 90 after movement, ensuring the effect of preventing scratching. On the other hand, the moving distance of the second cold plate 40 and the diverter 30 does not need to be too large, and the gap between the memory modules 90 can be fully utilized, thereby reducing space occupation and not affecting the original structural form of the server. Of course, the moving direction of the diverter 30 can also form a certain angle with the arrangement direction of the memory slots. For example, the diverter 30 and the second cold plate 40 are movably arranged along the direction parallel to the length of the memory module 90. At this time, the movement of the second cold plate 40 can also avoid the insertion and extraction operations of the memory module 90, but its movement requires more space.

[0039] As Figure 1 and Figure 2 shown, the diverter 30 of this embodiment is strip - shaped, and its length direction is the moving direction, that is, the diverter 30 extends along the arrangement direction of multiple memory slots. The inside of the diverter 30 is a hollow structure to achieve the circulation of the medium. Since the second cold plate 40 and the memory module 90 are generally arranged in parallel, in this way, the diverter 30 and the second cold plate 40 are perpendicularly arranged. Since there are generally multiple memory slots and memory modules 90, multiple second cold plates 40 are also provided in this embodiment. The second cold plates 40 are also arranged along the arrangement direction of multiple memory slots, and are all connected to the diverter 30. In this way, each memory slot corresponds to a second cold plate 40, so as to ensure that when the memory module 90 is fully inserted, each memory module 90 has a corresponding second cold plate 40 for heat dissipation, ensuring the heat dissipation effect.

[0040] As Figure 2 and Figure 5 shown, in addition to multiple second cold plates 40 that can be provided, multiple diverter 30 can also be provided, and both ends of the second cold plate 40 are respectively connected to different diverter 30. In this embodiment, two diverter 30 are provided and are respectively located at both ends of the second cold plate 40. That is to say, one end of all the second cold plates 40 is connected to the same diverter 30, and the other end is connected to another diverter 30. In this way, in addition to the effect of driving the second cold plate 40 to move, the diverter 30 can also disperse the medium in the liquid - cooling pipeline 20 into each second cold plate 40, conduct heat exchange with the memory module 90 to achieve heat dissipation, and the medium after heat exchange converges through the diverter 30 and returns to the liquid - cooling pipeline 20 for unified transportation. In this way, the liquid - cooling pipeline 20 can be adapted to the structure of the server, improving the overall adaptability of the cold - plate assembly on the basis of ensuring reliable heat dissipation of the memory module 90 and realizing the avoidance of the memory module 90. Of course, only one diverter 30 can also be provided, and the end of each second cold plate 40 without a diverter is directly connected to the same pipe section or cooperates with different interfaces of the server.

[0041] To ensure the stable and balanced movement of the second cold plate 40, in this embodiment, the cooperation modes between the two shunt devices 30 and the first cold plate 10 and the second cold plate 40 are exactly the same. In this way, when operating, the two shunt devices 30 can be operated simultaneously, and the two shunt devices 30 can move synchronously to drive the overall movement of the second cold plate 40, making the movement of the second cold plate 40 more stable and reliable, and avoiding the situation of damaging the memory module 90 due to unilateral movement. This is also one of the reasons for setting two shunt devices 30. If only one shunt device 30 is set, the second cold plate 40 will inevitably be stressed unilaterally, which is likely to cause uneven movement and thus have an adverse impact on the memory module 90. When only one shunt device 30 is set, a corresponding linkage structure can be considered to be set on the side of the second cold plate 40 where no shunt device 30 is set, and the linkage structure is in linkage cooperation with the shunt device 30, so as to realize the overall movement of the second cold plate 40.

[0042] Of course, the specific structural forms, settings, cooperation modes, etc. of the shunt device 30 and the second cold plate 40 are not limited to the above settings in this embodiment, and they can be changed and adjusted according to needs.

[0043] In this embodiment, multiple operation locking mechanisms 50 are also provided, specifically two. One operation locking mechanism 50 is provided between each shunt device 30 and the first cold plate 10. When manually operating, the two operation locking mechanisms 50 operate synchronously to ensure the overall movement of the second cold plate 40.

[0044] As Figure 3 and Figure 4 shown, the operation locking mechanism 50 of this embodiment includes a connection bracket 51, a sliding groove 52, and a first locking member 53. Among them, the connection bracket 51 is connected to the shunt device 30 through bolts and other components, and the two move synchronously. The sliding groove 52 is provided on the first cold plate 10, and the sliding groove 52 is extended and opened along the moving direction of the shunt device 30. A part of the connection bracket 51 can extend into the sliding groove 52 and can move in the sliding groove 52. In this way, when the connection bracket 51 moves in the sliding groove 52, it can drive the shunt device 30 to move synchronously, and the movement of the shunt device 30 can drive the movement of the second cold plate 40 to realize the adjustment of the position of the second cold plate 40. The first locking member 53 is inserted through the connection bracket 51 and the sliding groove 52, and can lock the connection bracket 51 in the sliding groove 52. The first locking member 53 can be a bolt or other components, and its main function is to lock the connection bracket 51 on the first cold plate 10, so as to lock the positions of the shunt device 30 and the second cold plate 40, realize the position locking of the second cold plate 40 after the installation of the memory module 90 is completed, avoid the random movement of the second cold plate 40, and ensure the heat dissipation effect and safety.

[0045] To ensure that the second cold plate 40 can be locked in both positions, the sliding groove 52 of this embodiment has a plurality of locking holes 521. Specifically, two locking holes 521 are provided in this embodiment. The two locking holes 521 are arranged along the moving direction of the diverter 30, and the two locking holes 521 can respectively correspond to the positions where the second cold plate 40 is in close contact with the memory module 90 and where there is a gap between the second cold plate 40 and the memory module 90. Correspondingly, the connecting bracket 51 has a connecting hole, and the connecting hole can be provided with only one or multiple ones. In this embodiment, only one connecting hole is provided. In this way, when the position of the connecting bracket 51 is adjusted, the connecting hole can be adjustably aligned and matched with different locking holes 521. At this time, the first locking member 53 is inserted into the connecting hole and the locking hole 521 aligned with the connecting hole, and the position of the connecting bracket 51 can be locked, and thus the positions of the diverter 30 and the second cold plate 40 are locked, so that the second cold plate 40 is maintained at the position in close contact with the memory module 90 or at the position with a gap between the second cold plate 40 and the memory module 90, avoiding the random movement of the second cold plate 40 during normal use and when inserting and removing the memory module 90.

[0046] In this embodiment, in addition to the above-mentioned locking part, the locking mechanism 50 itself also has an operable part, and the operator controls the movement of the diverter 30 and the second cold plate 40 by operating this operable part. The method of driving the diverter 30 to move by operating the locking mechanism 50 can prevent the operator from directly contacting components such as the second cold plate 40 and avoid affecting the components. Of course, this part can also not be provided. In this case, after unlocking, the second cold plate 40 can be moved by directly manually operating the diverter 30 or the second cold plate 40 by the operator.

[0047] Based on the above setting method of this embodiment, the operation locking mechanism 50 further includes a support plate 54 and a handle 55. Among them, the support plate 54 is fixedly connected to the first cold plate 10. The two can be an integral structure or a split structure. A chute 541 extending along the moving direction of the connecting bracket 51 is provided on the support plate 54. The chute 541 is opened on the upper surface of the support plate 54, so that it can also play a certain supporting role; one side of the handle 55 has a connecting shaft 551. A through hole is provided on the connecting bracket 51, and the size of the through hole is basically the same as that of the connecting shaft 551. The connecting shaft 551 is passed through the through hole and is rotatably connected to the connecting bracket 51. At the same time, the connecting shaft 551 is also passed through the chute 541. In this embodiment, the handle 55 is swingably arranged, and the supporting point of the swing of the handle 55 is not at the connecting shaft 551. A flanging structure convenient for operation is provided at the end of the handle 55 away from the connecting shaft 551. In this way, a grooved pin pair mechanism is formed between the handle 55 and the support plate 54. When the handle 55 swings, the connecting shaft 551 can move along the chute 541. Due to the cooperation between the connecting shaft 551 and the connecting bracket 51, the movement of the connecting shaft 551 drives the connecting bracket 51 to move, thereby realizing the movement of the second cold plate 40.

[0048] In an embodiment not shown, the handle 55 is arranged in the form of a toggle. The toggle is directly passed through the chute 541 and the through hole. When the operator needs to move the second cold plate 40, the toggle is directly toggled, and the toggle moves along the length direction of the chute 541, thereby driving the connecting bracket 51 and the second cold plate 40 to move.

[0049] On the surface of the first cold plate 10 of this embodiment at the position of the support plate 54, that is, on the upper surface at the bottom of the support plate 54, an arc groove is provided. Correspondingly, the end of the handle 55 has an arc structure, and the arc structure is located in the arc groove and abuts against the arc surface of the arc groove. In this way, when the handle 55 rotates, the surface of the arc structure cooperates with the inner wall surface of the arc groove to realize the movement of the connecting shaft 551 in the chute 541, avoiding situations such as jamming and interference.

[0050] Furthermore, in order to ensure the reliability of the swing of the handle 55, a protrusion is provided on the inner wall of the arc groove in this embodiment, and the arc structure has a concave portion. The protrusion is located in the concave portion, and the protrusion and the groove cooperate to support the swing of the handle 55, ensuring that the handle 55 swings in the expected manner.

[0051] Of course, the specific structure of the above-mentioned parts of the operation locking mechanism 50 for the operator to operate, the specific structure of the swing of the handle 55, etc. can all be changed accordingly as needed, and are not limited to the structural forms described in the above embodiments. Similarly, the structures of other parts of the operation locking mechanism 50 can also be adjusted accordingly. The locking part and the operating part in the operation locking mechanism 50 can be provided with only one part as needed, or both parts can be provided at the same time.

[0052] In this embodiment, the operation locking mechanism 50 is only provided at one end of the diverter 30. Therefore, in order to ensure reliable support for the diverter 30, the cold plate assembly of this embodiment further includes a bracket 60 and a second locking member 70. The bracket 60 and the operation locking mechanism 50 are respectively located on opposite sides of the diverter 30. In this way, the operation locking mechanism 50 and the bracket 60 support the diverter 30 from both ends respectively, ensuring the stability of the diverter 30. The second locking member 70 can axially pass through the housing, the bracket 60 and the diverter 30 in sequence and be connected to the diverter 30, so as to achieve a fixing effect.

[0053] Optionally, the second locking member 70 can adopt components such as a pin shaft that only has a supporting function, or components such as a bolt that has a locking function. As Figure 3 and Figure 5 shown, the second locking member 70 of this embodiment adopts a bolt, and the axial direction of the bolt includes a mating section and a threaded section. Correspondingly, the diverter 30 has a mounting hole, and the mounting hole is a threaded hole. Both the mating section and the threaded section can cooperate with the mounting hole. The difference is that the outer peripheral surface of the mating section is a smooth surface without threads, so its cooperation with the mounting hole only has a supporting effect and no locking effect, while the outer peripheral surface of the threaded section has threads, so it will be threadedly mated with the mounting hole to achieve a locking effect. In this way, when the diverter 30 is unlocked for movement adjustment, the mating section cooperates with the mounting hole, and at this time the mating section will not affect the movement of the diverter 30, thus ensuring the supporting effect and the movable effect of the diverter 30. When the movement of the diverter 30 is completed, after the first locking member 53 locks the position of the diverter 30, the operator can rotate the second locking member 70 to make the threaded section cooperate with the mounting hole. At this time, due to the threading effect between the threaded section and the mounting hole, this end of the diverter 30 is locked by the second locking member 70, so as to achieve the effect of locking the diverter 30.

[0054] In this embodiment, the cold plate assembly further includes a protective pad 80 located on the outer peripheral side of the second cold plate 40. When the second cold plate 40 is in close contact with the memory module 90, the protective pad 80 is the part directly in contact with the memory module 90. The second cold plate 40 exchanges heat with the memory module 90 through the protective pad 80, thereby avoiding direct contact between the second cold plate 40 and the memory module 90 through the protective pad 80, and further protecting the memory module 90. The specific type of the protective pad 80 can be selected accordingly as needed. For example, components such as a silicone pad are used. In this embodiment, a smooth PI plastic film is also covered on the surface of the silicone pad to further reduce wear.

[0055] The liquid cooling pipeline 20 of this embodiment may include multiple pipe segments. The pipe segments are connected to the first cold plate 10, the diverter 30, and the pipeline interface on the server as needed to form a complete liquid cooling loop. The pipe segments can be fixed by clamps. Specifically, the liquid cooling pipeline 20 of this embodiment includes an inlet pipe segment, an intermediate pipe segment, and an outlet pipe segment. One end of the inlet pipe segment is connected to the inlet port on the server chassis, and the other end is connected to the first cold plate 10. Both ends of the intermediate pipe segment are respectively connected to the first cold plate 10 and a diverter 30. One end of the outlet pipe segment is connected to the other diverter 30, and the other end is connected to the outlet port on the server chassis. At the same time, in this embodiment, a connector connection method is adopted between the intermediate pipe segment and the diverter 30, and between the outlet pipe segment and the other diverter 30 to achieve quick connection. The specific layout of the inlet pipe segment, the intermediate pipe segment, and the outlet pipe segment can be arranged in a straight line or bent according to the actual situation and requirements of the motherboard to adapt to different environments. When the medium flows, the medium flows into the inlet pipe segment from the inlet port on the server chassis, enters the first cold plate 10 from the inlet pipe segment, exchanges heat with the CPU to dissipate heat from the CPU, and the medium flowing out of the first cold plate 10 flows into a diverter 30 through the intermediate pipe segment. Through the diversion effect of the diverter 30, the medium is divided into multiple portions and flows into each second cold plate 40 respectively, and exchanges heat with the corresponding memory module 90 in each second cold plate 40 to dissipate heat from the memory module 90. The medium in each second cold plate 40 enters the other diverter 30 after heat exchange. Through the convergence effect of this diverter 30, it flows into the outlet pipe segment uniformly and flows out of the outlet port on the server chassis through the outlet pipe segment. In this way, the cycle is carried out to dissipate heat from the CPU and the memory module 90.

[0056] All the above-mentioned pipe segments in this embodiment adopt flexible hoses. In this way, on the one hand, when the diverter 30 moves, the pipe segments can be adjusted by themselves under the action of their own flexibility, so as to adapt to different positions of the diverter 30. On the other hand, during assembly, they can be bent and adjusted accordingly according to the different positions of components such as the CPU and memory module 90 in the server. Therefore, it has good adaptability to servers with different internal component positions, sizes, and types, can be applied to different server environments, and improves adaptability.

[0057] The cold plate assembly of this embodiment has the following characteristics:

[0058] 1. Without changing the server structure, it realizes the integrated integration of the liquid cooling system and server components;

[0059] 2. Adopts a groove pin pair mechanism or other mechanisms with the same function to realize the movement of the second cold plate 40, avoiding direct contact damage during the disassembly and assembly of the memory module 90;

[0060] 3. Adopts structures such as the first locking member 53 to cooperate with the groove pin pair mechanism to realize the integrated consolidation of the second cold plate 40 and the first cold plate 10 when the second cold plate 40 moves into place;

[0061] 4. Integrates multiple structures such as the sliding groove 541 and the groove pin pair mechanism to realize the integration of liquid cooling structural components;

[0062] 5. The outer surface of the second cold plate 40 is covered with a full-wrap silicone heat-conducting pad and a PI smooth plastic film is covered on the surface;

[0063] 6. Adopts surface attachment to achieve heat exchange, and different modules adopt cold plates with different structures to be attached to the surface;

[0064] 7. The module is designed in a split manner, and is integrally connected by a rigid bracket, and realizes flexible movement by using the groove pin pair mechanism, the sliding groove 52, and the second locking member 70.

[0065] This embodiment also provides a server, including the above-mentioned cold plate assembly for the server. The server may further include a chassis, a rack, a motherboard, a CPU, a memory module 90, etc. The specific structure can be set in a conventional manner and will not be elaborated in detail here.

[0066] Due to the overall modular setting of the cold plate assembly, during installation, the entire cold plate assembly can be placed at the corresponding position inside the chassis. The first cold plate 10 can be fixed through positioning, locking mechanisms, etc. The liquid cooling pipeline 20 can be fixed accordingly through clamps, and other positions can also be fixed as required, thus completing the installation of the cold plate assembly. Specifically, during installation, first place the entire cold plate assembly inside the chassis. Taking the locking and positioning of the first cold plate 10 as the reference, at the same time, the second locking member 70 falls into the support groove or through hole of the chassis. Align each component and place it at the corresponding position. The liquid cooling pipeline 20 is fixed through a clamp, thereby completing the installation of the entire cold plate assembly. Subsequently, by operating the locking mechanism 50 to control the movement of the second cold plate 40, the plugging and unplugging operation of the memory module 90 can be performed.

[0067] This embodiment also provides an operation and maintenance method for the cold plate assembly, which adopts the above-mentioned cold plate assembly for the server. The operation and maintenance method includes: unlocking the position of the diverter 30 by the operator operating the locking mechanism 50. After the diverter 30 is unlocked, continue to operate the locking mechanism 50. The locking mechanism 50 drives the diverter 30 to move. The diverter 30 drives the second cold plate 40 to move, and a predetermined gap is formed between the second cold plate 40 and the memory slot. At this time, the plugging operation of the memory module 90 can be performed. When the operation of the memory module 90 is completed, the operator unlocks the diverter 30 by operating the locking mechanism 50 and then operates the unlocking mechanism to act in the reverse direction. The locking mechanism 50 drives the diverter 30 to move in the reverse direction. The diverter 30 drives the second cold plate 40 to move in the reverse direction to tightly adhere to the memory module 90. Then, operate the locking mechanism 50 to lock the positions of the diverter 30 and the second cold plate 40, completing the process of plugging the memory module 90. When it is necessary to remove the memory module 90, the entire process is basically the same as the above.

[0068] Taking the plugging of the memory module 90 as an example, combined with the specific structure of the aforementioned cold plate assembly, the specific operations of the plugging process are as follows:

[0069] After the operator confirms the need to plug the memory module 90, the operator unscrews and removes the first locking member 53. The first locking member 53 exits the locking hole 521 and the connection hole on the sliding groove 52. The positions of the connection bracket 51, the diverter 30, and the second cold plate 40 are unlocked. Then manually rotate the handle 55. The handle 55 swings, and the connecting shaft 551 of the handle 55 moves in the sliding groove 541. The movement of the connecting shaft 551 drives the connection bracket 51 to move. The connection bracket 51 drives the diverter 30 and the second cold plate 40 to move, causing the second cold plate 40 to change its position and leaving a gap between the second cold plate 40 and the memory slot;

[0070] At this time, the connection hole is aligned with another locking hole 521. The operator re-inserts the first locking member 53 into the connection hole and the locking hole 521, and then tightens it, thereby locking the position of the connection bracket 51, and also locking the positions of the diverter 30 and the second cold plate 40, so that the second cold plate 40 is maintained at a position where a predetermined gap is formed between the second cold plate 40 and the memory slot;

[0071] Subsequently, the operator can insert the memory modules 90 one by one into the memory slots and lock the hippocampus heads;

[0072] After the insertion is completed, the operator loosens and unscrews the first locking member 53 again. The positions of the connection bracket 51, the diverter 30, and the second cold plate 40 are unlocked. Then, the operator rotates the handle 55 in the reverse direction. The connecting shaft 551 of the handle 55 drives the connection bracket 51 to move in the reverse direction, thereby driving the diverter 30 and the second cold plate 40 to move in the reverse direction, so that the second cold plate 40 is pressed against the memory module 90. It should be noted that the reverse here refers to the direction relative to the direction when the locking mechanism 50 is operated for the first time to unlock and move the diverter 30;

[0073] At this time, the connection hole is aligned with the original locking hole 521. The operator fixes the connection bracket 51 and the first cold plate 10 together through the first locking member 53, thereby locking the positions of the connection bracket 51, the diverter 30, and the second cold plate 40, so that the second cold plate 40 is maintained in contact with the memory module 90;

[0074] During the above entire process, the second locking member 70 always has its cooperating section engaged with the mounting hole, and it does not play a locking role for the diverter 30. After the memory module 90 is installed and the locking mechanism 50 locks the position of the diverter 30, the operator presses and rotates the second locking member 70 so that the threaded section of the second locking member 70 is threadedly engaged with the mounting hole, thereby locking the end of the connection bracket 51. Thus, the insertion process of the memory module 90 is completed. When using it next time, the second locking member 70 needs to be loosened first, and then the locking mechanism 50 needs to be operated.

[0075] If the memory module 90 needs to be removed for replacement or maintenance, the above process can also be followed.

[0076] It should be noted that the multiple in the above embodiments refers to at least two.

[0077] From the above description, it can be seen that in the above embodiments of the present invention, a diverter 30 is provided. The diverter 30 can transport the medium in the liquid cooling pipeline 20 into the second cold plate 40, so as to realize the heat dissipation of the second cold plate 40 to the memory module 90, that is, to realize liquid cooling attachment heat dissipation. At the same time, in this embodiment, the diverter 30 is also arranged in an adjustable manner. Since the diverter 30 and the second cold plate 40 are connected together, the adjustment of the position of the diverter 30 is also the adjustment of the position of the second cold plate 40. In this way, when the memory module 90 needs to be inserted or removed, the position of the diverter 30 can be unlocked by operating the locking mechanism 50 first. At this time, the positions of the diverter 30 and the second cold plate 40 can be adjusted. Then, by manually operating the diverter 30 and the second cold plate 40, or by operating the locking mechanism 50 to drive the diverter 30 and the second cold plate 40 to move, a certain gap is left between the second cold plate 40 and the memory slot. Then, the memory module 90 can be inserted or removed. At this time, due to the gap between the second cold plate 40 and the memory slot, no friction or abrasion will occur between the memory module 90 and the second cold plate 40, thus ensuring the safety of the memory module 90, extending its service life, and facilitating quick operation and maintenance. After the memory module 90 is inserted or removed, the diverter 30 and the second cold plate 40 are driven to the position where the second cold plate 40 is in close contact with the memory module 90 again by manually pushing directly or by operating the locking mechanism 50 to drive. Then, the locking mechanism 50 is operated to lock the position of the diverter 30, thereby locking the position of the second cold plate 40 and ensuring the heat dissipation effect of the second cold plate 40. The above setting method optimizes the second cold plate 40 on the basis of ensuring reliable heat dissipation of the memory module 90, so that the position of the second cold plate 40 can be adjusted as needed, thus avoiding friction and abrasion between the memory module 90 and the second cold plate 40, ensuring the service life of the memory module 90. At the same time, when the memory module 90 is replaced, the entire liquid cooling module does not need to be disassembled, which is more convenient to use. Moreover, it is integrally installed in the internal space of the original device without changing the original structure, realizing convenient maintenance and repair.

[0078] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0079] It should be noted that the terms used herein are only for describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0080] It should be noted that the terms "first", "second", etc. in the description, claims and above-mentioned drawings of the present application are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of the present application described here can be implemented in an order other than those illustrated or described here.

[0081] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modifications, equivalent replacements, improvements, etc. made within the principle of the present application shall be included within the protection scope of the present application.

Claims

1. A cold plate assembly for a server, characterized in that, comprising: a first cold plate (10) for cooling the CPU; a liquid cooling pipeline (20), the liquid cooling pipeline (20) being communicated with the first cold plate (10); a diverter (30), the diverter (30) being communicated with the liquid cooling pipeline (20), and the diverter (30) being connected to the first cold plate (10) with an adjustable position; a second cold plate (40) for cooling the memory module (90), the second cold plate (40) being communicated with the diverter (30) and being able to move relative to the memory slot under the drive of the diverter (30) to avoid the memory module (90); an operation locking mechanism (50), the operation locking mechanism (50) being arranged between the diverter (30) and the first cold plate (10) and being able to control and lock the relative position between the diverter (30) and the first cold plate (10); the operation locking mechanism (50) comprising: a connection bracket (51), the connection bracket (51) being connected to the diverter (30); a sliding groove (52), the sliding groove (52) being arranged on the first cold plate (10), the connection bracket (51) extending into the sliding groove (52) and being able to move in the sliding groove (52); a first locking member (53), the first locking member (53) being inserted through the connection bracket (51) and the sliding groove (52) and being able to lock the connection bracket (51) in the sliding groove (52); the operation locking mechanism (50) further comprising: a support plate (54), the support plate (54) being connected to the first cold plate (10), a sliding groove (541) extending along the moving direction of the connection bracket (51) being arranged on the support plate (54); a handle (55), a connection shaft (551) of the handle (55) being rotatably connected to the connection bracket (51), and the connection shaft (551) being inserted through the sliding groove (541), the handle (55) being swingably arranged, and when the handle (55) swings, the connection shaft (551) moves along the sliding groove (541) to drive the connection bracket (51) and the second cold plate (40) to move.

2. The cold plate assembly for a server according to claim 1, characterized in that, the diverter (30) is movably arranged along the arrangement direction of a plurality of memory slots.

3. The cold plate assembly for a server according to claim 1, characterized in that, the diverter (30) extends along the arrangement direction of a plurality of memory slots, the second cold plates (40) are multiple, and each of the second cold plates (40) is arranged along the arrangement direction of the plurality of memory slots, and each of the second cold plates (40) is communicated with the diverter (30).

4. The cold plate assembly for a server according to claim 1, characterized in that, The shunts (30) are multiple, and both ends of the second cold plate (40) are respectively communicated with different shunts (30), and each shunt (30) can move synchronously to drive the second cold plate (40) to move.

5. The cold plate assembly for a server according to any one of claims 1 to 4, wherein, the sliding groove (52) has a plurality of locking holes (521), the connecting bracket (51) has a connecting hole, when the position of the connecting bracket (51) is adjusted, the connecting hole is adjustably aligned and matched with the locking hole (521), and the first locking member (53) is inserted into the connecting hole and the locking hole (521) aligned with the connecting hole to lock the connecting bracket (51).

6. The cold plate assembly for a server according to any one of claims 1 to 4, wherein, the surface of the first cold plate (10) at the position of the support plate (54) is provided with an arc groove, the end of the handle (55) has an arc structure, the arc structure is located in the arc groove and abuts against the arc surface of the arc groove, the inner wall of the arc groove has a protrusion, and the arc structure has a recess, and the protrusion is located in the recess.

7. The cold plate assembly for a server according to any one of claims 1 to 4, wherein, the cold plate assembly further includes: a bracket (60), the bracket (60) and the operation locking mechanism (50) are respectively located on opposite sides of the shunt (30), and the bracket (60) supports the shunt (30); a second locking member (70), the second locking member (70) is inserted through the bracket (60) and the shunt (30) and can be connected to the shunt (30) to lock the shunt (30).

8. The cold plate assembly for a server according to claim 7, wherein, the second locking member (70) includes a fitting section and a threaded section, the shunt (30) has a mounting hole, when the shunt (30) moves, the fitting section is fitted with the mounting hole, and when the movement of the shunt (30) is completed, the threaded section is threadedly fitted with the mounting hole to lock the shunt (30).

9. The cold plate assembly for a server according to any one of claims 1 to 4, wherein, the cold plate assembly further includes a protection pad (80), the protection pad (80) is located on the outer peripheral side of the second cold plate (40), and the second cold plate (40) exchanges heat with the memory module (90) through the protection pad (80).

10. A server, wherein, it includes the cold plate assembly for a server according to any one of claims 1 to 9.

11. An operation and maintenance method for a cold plate assembly, wherein, using the cold plate assembly for a server according to any one of claims 1 to 9, the operation and maintenance method includes: The operation locking mechanism (50) unlocks the position of the diverter (30) and drives the diverter (30) to move. The diverter (30) drives the second cold plate (40) to move, and a gap of a predetermined size is formed between the second cold plate (40) and the memory slot. When the operation of the memory module (90) is completed, the operation locking mechanism (50) unlocks the diverter (30) and then moves in the reverse direction. The operation locking mechanism (50) drives the diverter (30) to move in the reverse direction. The diverter (30) drives the second cold plate (40) to be in close contact with the memory module (90), and the operation locking mechanism (50) locks the positions of the diverter (30) and the second cold plate (40).

12. The operation and maintenance method of the cold plate assembly according to claim 11, characterized in that When the operation locking mechanism (50) unlocks the position of the diverter (30), the first locking member (53) exits the sliding groove (52) and unlocks the connecting bracket (51). Then the handle (55) swings, and the connecting shaft (551) of the handle (55) moves in the sliding groove (541). The connecting shaft (551) drives the connecting bracket (51) to move. The connecting bracket (51) drives the diverter (30) and the second cold plate (40) to move, and the position of the second cold plate (40) is adjusted. When the operation locking mechanism (50) locks the position of the diverter (30), the first locking member (53) penetrates into the sliding groove (52), and the threaded section of the second locking member (70) is in threaded fit with the mounting hole to lock the connecting bracket (51).

13. The operation and maintenance method of the cold plate assembly according to claim 11, characterized in that After the diverter (30) drives the second cold plate (40) to move to form a gap of a predetermined size between the second cold plate and the memory slot, the operation locking mechanism (50) locks the position of the diverter (30) and keeps the second cold plate (40) at the position where a gap of a predetermined size is formed between the second cold plate and the memory slot.

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