Shunt welding device, welding method thereof, and computer readable storage medium

Abstract

The application discloses a shunt welding device and a welding processing method thereof and a computer readable storage medium, wherein the shunt welding device comprises a machine body, a heating mechanism and a temperature measuring mechanism, a welding space is formed in the machine body, the heating mechanism and the temperature measuring mechanism are arranged in the welding space, the machine body is provided with a vacuum pumping mechanism, and the welding processing method of the shunt welding device comprises the following steps: starting the heating mechanism to heat the alloy resistance; controlling the temperature measuring mechanism to monitor the surface temperature of the alloy resistance; after the surface temperature of the alloy resistance reaches a preset welding temperature, moving an integrated circuit board to the alloy resistance and pushing the integrated circuit board towards the alloy resistance so that the welding sites of the integrated circuit board and the alloy resistance are correspondingly welded in contact; and starting the vacuum pumping mechanism to form a vacuum environment in the welding space. The technical scheme aims to improve the production efficiency and the production qualified rate of the shunt welding device.

Description

Technical Field

[0001] This invention relates to the field of splitter manufacturing technology, and in particular to a splitter welding apparatus and welding method, as well as a computer-readable storage medium. Background Technology

[0002] Most existing shunt welding devices use hot air reflow soldering to weld the alloy resistors and integrated circuit boards of the shunt. This is achieved by attaching the alloy resistors to the integrated circuit boards and placing solder paste between them. The heated airflow is then blown onto the workpiece to melt the solder paste, thus achieving the welding of the two components.

[0003] However, hot air reflow soldering results in significant heat loss and low heating efficiency, impacting the production efficiency of the shunt. Furthermore, the reflow soldering process relies solely on hot air to melt the solder paste, which can lead to numerous air bubbles inside the melted solder paste, affecting the conductivity of the alloy resistor and the integrated circuit board and resulting in low soldering reliability. Additionally, the integrated circuit board typically integrates multiple components, which are susceptible to damage from the high-temperature airflow during hot air reflow soldering, leading to a low production yield of the shunt. Summary of the Invention

[0004] The main objective of this invention is to provide a shunt welding device and its welding process, as well as a computer-readable storage medium, which aims to improve the production efficiency and yield of the shunt welding device.

[0005] To achieve the above objectives, the shunt welding apparatus proposed in this invention includes a body, a heating mechanism, and a temperature measuring mechanism. A welding space is formed within the body, and the heating mechanism and the temperature measuring mechanism are disposed within the welding space. The body is equipped with a vacuuming mechanism. The welding process of the shunt welding apparatus includes the following steps:

[0006] The heating mechanism is activated to heat the alloy resistor;

[0007] The temperature measuring mechanism is controlled to monitor the surface temperature of the alloy resistor;

[0008] After the surface temperature of the alloy resistor reaches the preset welding temperature, the integrated circuit board is moved to the alloy resistor and pushed in the direction toward the alloy resistor so that the welding points of the integrated circuit board and the welding points of the alloy resistor make corresponding contact welding.

[0009] The vacuum pumping mechanism is activated to create a vacuum environment within the welding space.

[0010] Optionally, after activating the heating mechanism to heat the alloy resistor, the method further includes:

[0011] The temperature of the heating mechanism is obtained, and the heating rate of the heating mechanism is adjusted according to the temperature of the heating mechanism.

[0012] Optionally, the heating mechanism includes a heating platform, and the heating platform contains an electric heating structure. The step of obtaining the temperature of the heating mechanism and adjusting the heating rate of the heating mechanism based on the temperature of the heating mechanism includes:

[0013] The temperature of the heating stage is obtained, and a first input current is determined based on the temperature of the heating stage and a preset temperature rise threshold.

[0014] The input current of the electric heating structure is adjusted to the first input current.

[0015] Optionally, after the step of adjusting the input current of the electric heating structure to the first input current, the method further includes:

[0016] After a first preset time, the temperature of the heating stage and the surface temperature of the alloy resistor are obtained, and the second input current is determined based on the temperature of the heating stage and the surface temperature of the alloy resistor.

[0017] The input current of the electric heating structure is adjusted to the second input current.

[0018] Optionally, after the surface temperature of the alloy resistor reaches the preset welding temperature, the step of moving the integrated circuit board to the alloy resistor and pushing the integrated circuit board in the direction toward the alloy resistor so that the welding points of the integrated circuit board and the welding points of the alloy resistor make corresponding contact welding further includes:

[0019] The temperature of the heating platform is obtained, and the third input current is determined based on the temperature of the heating platform;

[0020] The input current of the electric heating structure is adjusted to the third input current.

[0021] Optionally, the welding device for the shunt further includes a fixing clamp and a pushing mechanism. The fixing clamp is located above the heating mechanism and has a support structure for holding the integrated circuit board. The support structure is arranged corresponding to the heating area of ​​the heating mechanism. The pushing mechanism is located on the side of the fixing clamp facing away from the heating mechanism. The step of moving the integrated circuit board to the alloy resistor after the surface temperature of the alloy resistor reaches the preset welding temperature, and pushing the integrated circuit board in the direction towards the alloy resistor so that the welding points of the integrated circuit board and the welding points of the alloy resistor correspond to each other for welding includes:

[0022] Solder paste is applied to the soldering points of the integrated circuit board, and the integrated circuit board is placed into the support structure of the fixing fixture;

[0023] The pushing mechanism is controlled to move the integrated circuit board toward the heating mechanism so that the welding points of the integrated circuit board and the welding points of the alloy resistor are in contact and welded.

[0024] Optionally, the pushing mechanism is equipped with a pressure detection unit. The step of controlling the pushing mechanism to move the integrated circuit board towards the heating mechanism, so that the soldering points of the integrated circuit board and the soldering points of the alloy resistor correspond to each other for soldering, includes:

[0025] The control pressure detection unit acquires the pressure value applied to the integrated circuit board by the pushing mechanism and compares the acquired pressure value with the preset pressure threshold.

[0026] If the pressure value obtained is greater than or equal to the pressure threshold, the control mechanism stops moving.

[0027] Optionally, the shunt welding device further includes a transport mechanism located within the welding space. The transport mechanism has a loading area, and the heating mechanism is located along the transport path of the transport mechanism. The transport mechanism has a positioning detection unit corresponding to the heating mechanism. Before activating the heating mechanism to heat the alloy resistor, the device further includes:

[0028] Place the alloy resistor into the loading area;

[0029] The transport mechanism is activated so that it drives the alloy resistor to the heating area of ​​the heating mechanism;

[0030] The positioning detection unit issues a positioning command for the alloy resistor, controls the transport mechanism to stop, and issues a start command to the heating mechanism.

[0031] In addition, to achieve the above objectives, this application also provides a shunt welding apparatus, including a memory, a processor, and a control program for the shunt welding apparatus stored in the memory and executable on the processor. When the processor executes the control program for the shunt welding apparatus, it implements the welding process method of the shunt welding apparatus as described above.

[0032] In addition, to achieve the above objectives, this application also provides a computer-readable storage medium storing a control program for a shunt welding apparatus, wherein the control program for the shunt welding apparatus, when executed by a processor, implements the steps of the welding process method of the shunt welding apparatus as described in any of the above claims.

[0033] This invention first heats the alloy resistor using a heating mechanism, and then controls a temperature measuring mechanism to monitor the surface temperature of the alloy resistor in real time during the heating process, allowing the user to monitor and adjust the temperature of the heating mechanism. Before the shunt welding device operates, the user can input the required temperature value for melting and welding the solder paste through the operation panel or control terminal of the shunt welding device. The control unit of the shunt welding device can then set the user-input temperature value as the preset welding temperature. When the heating mechanism heats the surface temperature of the alloy resistor to the preset welding temperature, the shunt welding device issues a welding start command, which moves the integrated circuit board above the alloy resistor and pushes it towards the alloy resistor. Solder paste can then be placed on the welding points of the alloy resistor before moving the integrated circuit board towards it. Alternatively, solder paste can be pre-applied to the welding points of the integrated circuit board, allowing it to contact both the alloy resistor and the integrated circuit board as the board moves. The heat transferred from the alloy resistor to the solder paste melts the solder paste, causing the welding points of the alloy resistor and the integrated circuit board to come into contact and weld together, thus achieving the welding process between the alloy resistor and the integrated circuit board. During the welding process, a vacuum environment is created in the welding space using a vacuum pumping mechanism. Under the pushing force of the integrated circuit board, air bubbles inside the molten solder paste are squeezed and extracted, effectively reducing the number of air bubbles in the solder paste between the alloy resistor welding point and the integrated circuit board welding point. This lowers the air bubble rate at the welding position in the shunt, ensuring stable and reliable conduction between the alloy resistor and the integrated circuit board, and further guaranteeing the production qualification rate and testing accuracy of the shunt. By heating the alloy resistor to the welding temperature before pushing the integrated circuit board to weld with the alloy resistor, damage to the components on the integrated circuit board due to high heat during the welding heating process can be effectively avoided. The pushing and vacuuming methods reduce the air bubble rate in the solder paste between the alloy resistor and the integrated circuit board. Therefore, using this shunt welding device to weld the alloy resistor and integrated circuit board of the shunt effectively ensures the structural stability and reliability of the production materials, improves the production qualification rate of the shunt welding device, and further enhances its practicality and reliability. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other embodiments can be obtained based on these drawings without creative effort.

[0035] Figure 1This is a schematic diagram of the hardware operating environment of an embodiment of the shunt welding device of the present invention;

[0036] Figure 2 This is a schematic flowchart of an embodiment of the welding process method of the shunt welding device of the present invention;

[0037] Figure 3 This is a schematic flowchart illustrating the adjustment of the heating rate of the heating mechanism in an embodiment of the welding process of the shunt welding device of the present invention.

[0038] Figure 4 This is a schematic diagram illustrating the process of adjusting the heating temperature of the heating mechanism during welding, according to an embodiment of the welding method of the shunt welding device of the present invention.

[0039] Figure 5 This is a schematic diagram illustrating the process of contact welding an integrated circuit board with an alloy resistor in an embodiment of the welding method of the shunt welding apparatus of the present invention.

[0040] Figure 6 This is a schematic diagram illustrating the process of detecting the pressure applied by the pushing mechanism during the welding process, according to an embodiment of the welding method of the shunt welding device of the present invention.

[0041] Figure 7 This is a schematic diagram illustrating the process of moving an alloy resistor to a heating mechanism for heating, according to an embodiment of the welding method of the shunt welding device of the present invention.

[0042] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0043] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0044] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0045] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the word "and / or" throughout the text means including three parallel solutions; taking "A and / or B" as an example, it includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0046] Most existing shunt welding devices employ hot air reflow soldering to weld the alloy resistors and integrated circuit boards of the shunt. This involves attaching the alloy resistors to the integrated circuit board and placing solder paste between them. Heated airflow is then used to melt the solder paste, achieving the welding process. However, hot air reflow soldering suffers from significant heat loss and low heating efficiency, impacting shunt production efficiency. Furthermore, the process of melting the solder paste with hot air during reflow soldering often results in numerous air bubbles after melting, affecting the conductivity of the alloy resistors and integrated circuit board and leading to low welding reliability. Additionally, the integrated circuit board typically integrates multiple components, which are susceptible to damage from the high-temperature airflow during hot air reflow soldering, resulting in a low shunt production yield. To address these issues, this invention proposes a welding method for a shunt welding device.

[0047] As one implementation scheme, Figure 1 This is a schematic diagram of the hardware operating environment of an embodiment of the shunt welding device of the present invention.

[0048] like Figure 1As shown, the shunt welding apparatus may include: a processor 1001, such as a CPU; a memory 1005; a user interface 1003; a network interface 1004; and a communication bus 1002. The communication bus 1002 is used to enable communication between these components. The user interface 1003 may include a display screen or an input unit such as a keyboard; optionally, the user interface 1003 may also include a standard wired interface or a wireless interface. The network interface 1004 may optionally include a standard wired interface or a wireless interface (such as a Wi-Fi interface). The memory 1005 may be a high-speed RAM or a stable, non-volatile memory, such as a disk drive. Optionally, the memory 1005 may also be a storage device independent of the aforementioned processor 1001.

[0049] Those skilled in the art will understand that Figure 1 The shunt welding apparatus architecture shown does not constitute a limitation on the shunt welding apparatus and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0050] like Figure 1 As shown, the memory 1005, which serves as a storage medium, may include an operating system, a network communication module, a user interface module, and a control program for the shunt welding apparatus. The operating system is a program that manages and controls the hardware and software resources of the shunt welding apparatus, the control program for the shunt welding apparatus, and the operation of other software or programs.

[0051] exist Figure 1 In the shunt welding device shown, the user interface 1003 is mainly used to connect to the terminal and communicate with the terminal; the network interface 1004 is mainly used to communicate with the back-end server; and the processor 1001 can be used to call the control program of the shunt welding device stored in the memory 1005.

[0052] In this embodiment, the shunt welding apparatus includes: a memory 1005, a processor 1001, and a control program for the shunt welding apparatus stored in the memory and executable on the processor. When the processor 1001 calls the control program for the shunt welding apparatus stored in the memory 1005, it executes the steps of the welding process method for the shunt welding apparatus described below.

[0053] This invention provides a welding process method for a shunt welding device, referring to... Figure 2 , Figure 2This is a flowchart illustrating an embodiment of the welding process method for a shunt welding apparatus according to the present invention. This application provides an embodiment of the welding process method for a shunt welding apparatus. It should be noted that although a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order. It is understood that a shunt can be formed by combining components formed by welding alloy resistors and integrated circuit boards, as well as other components used for current detection and analysis. The shunt welding apparatus can be used to correspondingly process and weld alloy resistors and integrated circuit boards, as well as to process other components in the shunt, thereby better realizing the mass production of the shunt. In this embodiment of the invention, the shunt welding apparatus includes a body, a heating mechanism, and a temperature measuring mechanism. A welding space is formed within the body, and the heating mechanism and the temperature measuring mechanism are disposed within the welding space. The body is equipped with a vacuuming mechanism. The welding process method of the shunt welding apparatus includes the following steps:

[0054] Step S10: Start the heating mechanism to heat the alloy resistor;

[0055] When the shunt welding device is operating, the heating mechanism can heat the alloy resistor through direct contact heat conduction or through infrared radiation. By adjusting the power of the heating mechanism, the heating efficiency and temperature can be more stably controlled. This allows the heating mechanism to quickly heat the alloy resistor to the required welding temperature and maintain that temperature better, meeting the time requirements of the welding operation and significantly reducing the welding heating process time, thus improving the welding efficiency of the shunt welding device. When the heating mechanism uses contact heat conduction to heat the alloy resistor, the heating structure can be controlled to heat only the area where the alloy resistor is located. In this case, a detection module can be installed on the heating mechanism to identify the location of the alloy resistor, allowing the heating mechanism to adjust the heating area in real time according to the position of the alloy resistor. This helps to reduce heat waste and allows the heating mechanism to concentrate the heating of the alloy resistor, further improving the practicality and reliability of the shunt welding device.

[0056] Step S30: Control the temperature measuring mechanism to monitor the surface temperature of the alloy resistor;

[0057] The temperature measuring mechanism can employ a movable temperature probe structure to measure the temperature of the alloy resistor. When the alloy resistor enters the welding space of the machine body and is located in the heating area of ​​the heating mechanism, a control command can be sent to the temperature measuring mechanism, causing it to move the temperature probe to contact and sample the surface temperature of the alloy resistor. Alternatively, the temperature measuring mechanism can use infrared radiation thermometry to measure the temperature of the alloy resistor. This allows the mechanism to receive the infrared radiation signal emitted by the alloy resistor, convert it into an electrical signal, and then sample and obtain the surface temperature of the alloy resistor. By monitoring the surface temperature of the alloy resistor during the heating process, real-time monitoring of the alloy resistor's surface temperature can be achieved. This allows for timely adjustments to the heating temperature of the alloy resistor during the welding operation, ensuring the normal operation of the welding process and further improving the reliability of the shunt welding device.

[0058] Step S50: After the surface temperature of the alloy resistor reaches the preset welding temperature, move the integrated circuit board to the alloy resistor and push the integrated circuit board in the direction toward the alloy resistor so that the welding points of the integrated circuit board and the welding points of the alloy resistor make corresponding contact welding.

[0059] The shunt welding device can also be equipped with an operating table or mobile control terminal for controlling the shunt welding device. Before the welding operation, the user can determine the required welding temperature of the alloy resistor based on the welding temperature requirements and thermal conductivity of the solder paste, and input this determined welding temperature into the control system of the shunt welding device as the preset welding temperature. Then, after the temperature measuring mechanism monitors the surface temperature of the alloy resistor and heats it to the preset welding temperature, it can send a start welding command to the control unit of the shunt welding device, controlling the robotic arm to pick up the integrated circuit board, move it to the alloy resistor, and push the integrated circuit board onto the alloy resistor; or, the integrated circuit board can be preset in the welding space before the welding operation, and when the alloy resistor is heated to the preset welding temperature, a moving mechanism can be set up to move the integrated circuit board to the alloy resistor for welding. At this point, when the integrated circuit board moves to the alloy resistor, the soldering points of the integrated circuit board and the soldering points of the alloy resistor can be aligned accordingly. Solder paste can be pre-attached to the soldering points of the integrated circuit board, or the solder paste can be placed between the integrated circuit board and the alloy resistor when the integrated circuit board moves towards the alloy resistor. Then, by pushing the integrated circuit board in the direction towards the alloy resistor, the heat on the alloy resistor can be transferred to the solder paste to melt the solder paste. The melted solder paste adheres to the soldering points of the integrated circuit board and the soldering points of the alloy resistor to achieve contact welding between the two, ensuring electrical conduction between the integrated circuit board and the alloy resistor, and realizing the welding process between the shunt alloy resistor and the integrated circuit board.

[0060] Because the heating mechanism heats the alloy resistor through direct contact or infrared radiation, the integrated circuit board is moved for welding only after the alloy resistor reaches the required welding temperature. During the heating process, the integrated circuit board can maintain a certain distance from the alloy resistor to prevent heat transfer from the alloy resistor to the integrated circuit board, which could affect the components on the integrated circuit board. This ensures the reliability and stability of the welding between the alloy resistor and the integrated circuit board, improving the welding pass rate of the shunt welding device and further enhancing its practicality and reliability. During welding, pushing the integrated circuit board towards the alloy resistor transfers the force applied to the integrated circuit board to the molten solder paste. This allows air bubbles in the solder paste to be squeezed out or broken under external force, reducing the air bubble rate in the solder paste connecting the alloy resistor and the integrated circuit board. This minimizes the impact of air bubbles on the conductivity of the alloy resistor and the integrated circuit board, further improving the production pass rate of the shunt.

[0061] Step S70: Control the vacuum pumping mechanism to start, so as to create a vacuum environment in the welding space.

[0062] Understandably, the machine body can be a shell structure with certain sealing performance. During the welding operation, the vacuum mechanism and the sealing structure of the machine body can create a vacuum processing environment in the welding space. When welding in a vacuum environment, the air bubbles carried in the molten solder paste can escape from the solder paste due to the vacuum negative pressure. This helps to better avoid the large number of air bubbles in the solder paste connecting the alloy resistor and the integrated circuit board after welding, which would affect the conductivity of both. This further improves the pass rate of shunt welding and enhances the practicality and reliability of the shunt welding device. The vacuum mechanism can be activated after the alloy resistor and integrated circuit board are placed into the welding space and the sealed body is closed. This allows the vacuum mechanism to gradually evacuate the welding space as the heating mechanism heats the alloy resistor. When the alloy resistor is heated to the preset welding temperature and the integrated circuit board is moved for welding, the vacuum level in the welding space is sufficient to remove air bubbles from the solder paste. Alternatively, the vacuum mechanism can be activated when the alloy resistor is heated to the preset welding temperature. This allows the integrated circuit board to be placed into the welding space during the heating process before the sealed body is closed. This improves the efficiency of processing and production by making better use of the gaps in the welding process. In this case, the vacuum mechanism can quickly increase the vacuum level in the welding space to a value suitable for removing air bubbles from the solder paste, ensuring that air bubbles in the solder paste can escape better when the integrated circuit unit is moved to the alloy resistor for welding.

[0063] This invention first heats the alloy resistor using a heating mechanism, and then controls a temperature measuring mechanism to monitor the surface temperature of the alloy resistor in real time during the heating process, allowing the user to monitor and adjust the temperature of the heating mechanism. Before the shunt welding device operates, the user can input the required temperature value for melting and welding the solder paste through the operation panel or control terminal of the shunt welding device. The control unit of the shunt welding device can then set the user-input temperature value as the preset welding temperature. When the heating mechanism heats the surface temperature of the alloy resistor to the preset welding temperature, the shunt welding device issues a welding start command, which moves the integrated circuit board above the alloy resistor and pushes it towards the alloy resistor. Solder paste can then be placed on the welding points of the alloy resistor before moving the integrated circuit board towards it. Alternatively, solder paste can be pre-applied to the welding points of the integrated circuit board, allowing it to contact both the alloy resistor and the integrated circuit board as the board moves. The heat transferred from the alloy resistor to the solder paste melts the solder paste, causing the welding points of the alloy resistor and the integrated circuit board to come into contact and weld together, thus achieving the welding process between the alloy resistor and the integrated circuit board. During the welding process, a vacuum environment is created in the welding space using a vacuum pumping mechanism. Under the pushing force of the integrated circuit board, air bubbles inside the molten solder paste are squeezed and extracted, effectively reducing the number of air bubbles in the solder paste between the alloy resistor welding point and the integrated circuit board welding point. This lowers the air bubble rate at the welding position in the shunt, ensuring stable and reliable conduction between the alloy resistor and the integrated circuit board, and further guaranteeing the production qualification rate and testing accuracy of the shunt. By heating the alloy resistor to the welding temperature before pushing the integrated circuit board to weld with the alloy resistor, damage to the components on the integrated circuit board due to high heat during the welding heating process can be effectively avoided. The pushing and vacuuming methods reduce the air bubble rate in the solder paste between the alloy resistor and the integrated circuit board. Therefore, using this shunt welding device to weld the alloy resistor and integrated circuit board of the shunt effectively ensures the structural stability and reliability of the production materials, improves the production qualification rate of the shunt welding device, and further enhances its practicality and reliability.

[0064] Furthermore, in one embodiment of the present invention, after the step of activating the heating mechanism to heat the alloy resistor, the method further includes:

[0065] Step S20: Obtain the temperature of the heating mechanism, and adjust the heating rate of the heating mechanism according to the temperature of the heating mechanism.

[0066] It is understandable that when the heating mechanism uses a contact heat conduction structure to heat the alloy resistor, a temperature measuring module can be installed in the heating mechanism to monitor its temperature. This allows for real-time monitoring of the heating mechanism's temperature during the heating process, which is beneficial for adjusting the heating rate based on parameters such as the initial temperature of the heating mechanism and the temperature difference between the heating mechanism and the alloy resistor during heating. This, in turn, improves the welding efficiency of the shunt welding device. Specifically, by adjusting the heating rate, the heating mechanism can have a three-stage heating process. The first stage is a rapid heating process. In this process, the heating mechanism can set a preset heating threshold slightly lower than the preset welding temperature based on the preset welding temperature and the thermal conductivity of the heating mechanism. Then, by increasing the heating power, the heating mechanism can quickly raise the temperature to the preset heating threshold, achieving rapid heating. After a certain period, once the heating mechanism reaches the preset heating threshold, it can enter the second stage, a temperature control transition process. In this process, the heating power of the heating mechanism can be controlled to achieve a gradual heating transition. The heating process begins with reaching the preset welding temperature. This ensures the alloy resistor can steadily reach the preset welding temperature under the heating mechanism, preventing temperature drift during the rapid heating phase. Once the heating mechanism has stably reached the preset welding temperature, it enters a third stage: a constant-temperature stage. In this stage, the heating mechanism maintains a constant temperature or stays within a specific range, providing a more stable welding temperature for the alloy resistor and integrated circuit unit. This allows the solder paste to fully dissolve and connect the alloy resistor and integrated circuit unit within a certain time, ensuring a high pass rate for shunt welding. Furthermore, adjusting the heating rate by monitoring the heating mechanism's temperature can further improve the production efficiency and quality of the shunt welding device, thus enhancing its reliability.

[0067] Among them, reference Figure 3 , Figure 3 This is a flowchart illustrating the adjustment of the heating rate of a heating mechanism according to an embodiment of the welding process method of the shunt welding apparatus of the present invention. In one embodiment of the present invention, the heating mechanism is provided with a heating platform, and the heating platform is provided with an electric heating structure. The step of obtaining the temperature of the heating mechanism and adjusting the heating rate of the heating mechanism according to the temperature of the heating mechanism includes:

[0068] Step S21: Obtain the temperature of the heating stage, and determine the first input current based on the temperature of the heating stage and the preset temperature rise threshold;

[0069] Step S23: Adjust the input current of the electric heating structure to the first input current.

[0070] Understandably, the electric heating structure can be a resistor module with a certain resistance value. Utilizing the characteristic of the resistor module heating up when energized, the electric heating structure can be placed in the heating platform and connected to a power source to heat the platform. When the heating mechanism receives a start command to heat the alloy resistor, the temperature measuring module inside the heating mechanism can first sample the initial temperature of the heating mechanism. By comparing this temperature with a preset temperature rise threshold, the amount of temperature rise required for the heating mechanism to reach the preset temperature rise threshold can be determined. At this point, since the resistance of the electric heating structure is a fixed value, the user can set a first preset time for the heating mechanism to rapidly heat up to the preset heating threshold according to the required welding processing time. Then, based on the first preset time, the resistance value of the electric heating structure, and the temperature rise obtained by comparison, the current value required for the electric heating structure to heat up to the preset heating threshold within the first preset time can be calculated using Joule's law. This current value is set as the first input current. By using the current converter module of the heating mechanism to adjust the input current of the electric heating structure, the input current of the electric heating structure can be controlled to the first input current when the heating mechanism starts to heat the alloy resistor. This allows the electric heating structure to heat up rapidly under the action of the first input current with a larger current value, and the heating table can heat up to the preset heating threshold within the first preset time, reducing the heating waiting time of the heating mechanism and helping to improve the production and processing efficiency of the shunt welding device.

[0071] Furthermore, in one embodiment of the present invention, after the step of adjusting the input current of the electric heating structure to the first input current, the method further includes:

[0072] Step S25: After the first preset time, obtain the temperature of the heating stage and the surface temperature of the alloy resistor, and determine the second input current based on the temperature of the heating stage and the surface temperature of the alloy resistor;

[0073] Step S27: Adjust the input current of the electric heating structure to the second input current.

[0074] The control system of the shunt welding device can be equipped with a timing unit. After calculating and adjusting the first input current for rapid heating of the electric heating structure to the first input current, the timing unit can be started. After a first preset time, which is the theoretical time for the electric heating structure to heat up to a preset heating threshold under the action of the first input current, the temperature of the heating platform can be obtained at this time. The heat dissipation loss of the heating platform in the environment can be calculated by comparing the temperature of the heating platform at this time with the preset heating threshold. At this time, the temperature measuring mechanism can also be controlled to feed back the heating temperature of the alloy resistor after the first preset time on the heating platform. By comparing the temperature of the alloy resistor at this time with the temperature of the heating platform, the heat conduction loss of the heating platform can be calculated. Then, based on the difference between the temperature of the alloy resistor at this time and the preset welding temperature, plus the heat dissipation loss and heat conduction loss of the heating platform, the temperature difference that the heating platform needs to raise to stably heat the alloy resistor to the preset welding temperature after the first preset time can be calculated. This effectively addresses the influence of environmental heat dissipation and its own heat conduction on the heating platform to determine the corresponding heating temperature to ensure that the alloy resistor is stably heated to the preset welding temperature. At this point, the user can set a first preset time followed by a second preset time to heat the alloy resistor to the preset welding temperature, based on the actual welding processing time requirements. Then, according to Joule's law, using the second preset time, the temperature difference that the electric heating structure still needs to increase, and the resistance of the electric heating structure, the current value required for the electric heating structure to steadily heat up to the alloy resistor reaching the preset welding temperature within the second preset time can be calculated. This current value is set as the second input current. By adjusting the input current of the electric heating structure using the current converter module of the heating mechanism, the input current of the electric heating structure after the first preset time can be controlled to be the second input current. This allows the electric heating structure to reduce its heating rate after rapid heating and ensures that the electric heating structure can gently heat the alloy resistor to the preset welding temperature. This helps prevent the alloy resistor from being in a continuously high-speed heating environment, which could lead to residual heat. It also avoids the temperature measuring mechanism detecting that the alloy resistor is still in the rapid heating process after reaching the preset welding temperature, which could cause the alloy resistor to overheat during welding. This further ensures the stable operation of the welding operation and improves the reliability and stability of the shunt welding device.

[0075] Furthermore, referring to Figure 4 , Figure 4 This is a schematic flowchart illustrating the process of adjusting the heating temperature of the heating mechanism during welding, according to an embodiment of the welding method of the shunt welding apparatus of the present invention. In one embodiment of the present invention, after the surface temperature of the alloy resistor reaches the preset welding temperature, the integrated circuit board is moved to the alloy resistor and pushed along the direction toward the alloy resistor so that the welding points of the integrated circuit board and the welding points of the alloy resistor make corresponding contact welding steps. The method further includes:

[0076] Step S501: Obtain the temperature of the heating platform, and determine the third input current based on the temperature of the heating platform;

[0077] Step S503: Adjust the input current of the electric heating structure to the third input current.

[0078] When the temperature of the alloy resistor stabilizes at the preset welding temperature monitored by the temperature measuring mechanism, it is necessary to control the heating stage to maintain a constant temperature to prevent the temperature of the heating stage from continuing to rise significantly. Maintaining the welding time at the preset welding temperature allows the solder paste to fully melt and connect the alloy resistor and the integrated circuit unit. At this point, when the alloy resistor stabilizes at the preset welding temperature, the heating mechanism can sample the temperature of the heating stage. Based on the current of the heating stage and the required welding time, the input current for maintaining this temperature is calculated according to Joule's law. This current value is set as the third input current. By using the current converter module of the heating mechanism to adjust the input current of the electric heating structure, the input current of the electric heating structure during the welding process between the alloy resistor and the integrated circuit board can be controlled as the third input current. This allows for better maintenance of the preset welding temperature for a certain welding time, enabling the solder paste to fully melt and connect the alloy resistor and the integrated circuit board. This further improves the welding stability and reliability of the alloy resistor and integrated circuit unit of the shunt, and increases the pass rate of the processed materials of the shunt welding device.

[0079] Reference Figure 5 , Figure 5 This is a schematic flowchart illustrating the contact welding process of an integrated circuit board and an alloy resistor according to an embodiment of the welding method of the shunt welding apparatus of the present invention. In one embodiment of the present invention, the welding apparatus of the shunt further includes a fixing clamp and a pushing mechanism. The fixing clamp is disposed above the heating mechanism and has a support structure for holding the integrated circuit board. The support structure is disposed corresponding to the heating area of ​​the heating mechanism. The pushing mechanism is disposed on the side of the fixing clamp opposite to the heating mechanism. The step of moving the integrated circuit board to the alloy resistor after the surface temperature of the alloy resistor reaches a preset welding temperature and pushing the integrated circuit board in the direction toward the alloy resistor so that the welding points of the integrated circuit board and the welding points of the alloy resistor make corresponding contact welding includes:

[0080] Step S51: Apply solder paste to the soldering points of the integrated circuit board and place the integrated circuit board into the support structure of the fixing fixture;

[0081] Step S53: Control the pushing mechanism to move the integrated circuit board in the direction toward the heating mechanism so that the welding points of the integrated circuit board and the welding points of the alloy resistor are in contact and welded.

[0082] It is understandable that the fixing fixture can be fixedly installed above the heating mechanism. In this case, the supporting structure can be a snap-on clamping structure. By clamping the integrated circuit board in the supporting structure, the pushing mechanism can move in the direction towards the alloy resistor, pushing the integrated circuit board away from the supporting structure and moving towards the alloy resistor to achieve the welding of the integrated circuit unit to the alloy resistor. Alternatively, the fixing fixture can be installed above the heating mechanism in a way that moves towards the heating mechanism. In this case, the supporting structure can be a fixing groove opened on the surface of the fixing fixture facing the heating mechanism. By pre-setting the integrated circuit board in the fixing groove, after the surface temperature of the alloy resistor is heated to the preset welding temperature, the pushing mechanism is controlled to act on the fixing fixture to drive the integrated circuit board towards the alloy resistor, so that the integrated circuit board is welded to the alloy resistor.

[0083] Therefore, before welding or during the heating process of the alloy resistor, solder paste can be applied to the welding points of the integrated circuit board, and the integrated circuit board can be placed in the support structure of the fixing fixture, so that the welding points of the integrated circuit board correspond to the welding points of the alloy resistor. Then, when the surface temperature of the alloy resistor is stably heated to the preset welding temperature, a control command can be sent to the pushing mechanism, causing the pushing mechanism to move towards the heating mechanism and push, driving the integrated circuit unit to move. This allows the solder paste attached to the integrated circuit unit to contact the surface of the alloy resistor, melt and connect the integrated circuit unit and the alloy resistor, realizing the welding operation. While the pushing mechanism is driving the integrated circuit unit to contact the alloy resistor for welding, the pressure applied by the pushing mechanism to the integrated circuit unit can be maintained. By utilizing the pushing force of the pushing mechanism, air bubbles in the solder paste can be better squeezed out, further reducing the air bubble rate in the solder paste after the alloy resistor and integrated circuit unit are welded, and further improving the processing reliability and yield of the shunt welding device.

[0084] Furthermore, referring to Figure 6 , Figure 6 This is a schematic flowchart illustrating the process of detecting the pressure applied by the pushing mechanism during welding, according to an embodiment of the welding method of the shunt welding apparatus of the present invention. In one embodiment of the present invention, the pushing mechanism is equipped with a pressure detection unit. The step of controlling the pushing mechanism to move the integrated circuit board in a direction toward the heating mechanism, so that the welding points of the integrated circuit board and the welding points of the alloy resistor correspond to each other for welding, includes:

[0085] Step S531: Control the pressure detection unit to acquire the pressure value applied to the integrated circuit board by the pushing mechanism, and compare the acquired pressure value with the preset pressure threshold;

[0086] Step S533: If the obtained pressure value is greater than or equal to the pressure threshold, control the pushing mechanism to stop moving.

[0087] Understandably, the pressure detection unit can be a pressure-sensitive module that senses the received pressure signal, converts it into an electrical signal, and then samples and detects the pressure value experienced by the pressure detection unit. In this case, by having the pressure detection unit contact the integrated circuit unit during the movement of the integrated circuit unit by the pushing mechanism acting on the fixed clamp, the pressure detection unit can sample the pushing force experienced by the integrated circuit unit in real time during its movement. This allows the user to monitor the pushing mechanism in real time regarding the pushing force experienced by the integrated circuit unit, ensuring that the alloy resistor and the integrated circuit unit are better pushed and welded together.

[0088] In the pushing mechanism, a pressure threshold can be set according to the force on the integrated circuit unit. Then, after the pressure detection unit samples the pushing force on the integrated circuit unit in real time, it can compare it with the pressure threshold. When the pushing force on the integrated circuit unit is detected to be greater than or equal to the pressure threshold, a command is sent to control the pushing mechanism to stop moving. This effectively avoids the integrated circuit unit from being damaged by excessive external force, ensuring the processing reliability of the shunt welding device and further improving the welding qualification rate of alloy resistors and integrated circuit units.

[0089] Reference Figure 7 , Figure 7 This is a schematic flowchart illustrating the process of moving an alloy resistor to a heating mechanism for heating, according to an embodiment of the welding method of the shunt welding apparatus of the present invention. In one embodiment, the shunt welding apparatus further includes a transport mechanism located within the welding space. The transport mechanism has a loading area, and the heating mechanism is located on the transport path of the transport mechanism. The transport mechanism has a positioning detection unit corresponding to the heating mechanism. Before the step of activating the heating mechanism to heat the alloy resistor, the process further includes:

[0090] Step S01: Place the alloy resistor into the loading area;

[0091] Step S03: Start the transport mechanism so that the transport mechanism drives the alloy resistor to the heating area of ​​the heating mechanism;

[0092] Step S05: The positioning detection unit issues an alloy resistor positioning command, controls the transport mechanism to stop, and issues a start command to the heating mechanism.

[0093] Understandably, the transport mechanism can be designed to support the alloy resistors, allowing users to neatly place them in the loading area and then stably transfer them to the heating area of ​​the heating mechanism. This ensures the alloy resistors are stably heated and can be soldered onto the integrated circuit board, improving the yield rate of the alloy resistors and integrated circuit units. The heating mechanism can be stably positioned below the transport mechanism, ensuring direct contact between the alloy resistors and the heating mechanism when the transport mechanism moves them to the heating area; alternatively, the heating mechanism can be movable, allowing the transport mechanism to move the alloy resistors vertically or horizontally to contact and heat them.

[0094] The alloy resistors can also be neatly positioned on a transport mechanism using a fixture, with the position of the alloy resistor in the fixture corresponding to the heating area of ​​the heating mechanism and the movement position of the integrated circuit unit. This allows the transport mechanism to simultaneously transport multiple alloy resistors to the heating mechanism for heating, better enabling mass production of the shunt. Once the alloy resistor is stably placed on the transport mechanism, the user can issue a start command to the transport mechanism via an operating interface or terminal device. Alternatively, an inductive switch can be installed on the transport mechanism to trigger its start when the alloy resistor is placed on it, allowing the transport mechanism to smoothly transport the alloy resistor to the heating area of ​​the heating mechanism for processing.

[0095] At the processing station corresponding to the moving position of the heating mechanism and the integrated circuit unit, a limit switch or infrared sensor switch can be installed to detect the position. When the transport mechanism moves the alloy resistor to the processing station, the position detection unit can be triggered, and the position detection unit can issue a stop movement command to the transport mechanism. This ensures that the transport mechanism can stably move the alloy resistor to the corresponding position for heating, welding of integrated circuit boards, and other operations, achieving precise positioning of the alloy resistor, ensuring the normal operation of the shunt welding device, and further improving the reliability and stability of the connection between the alloy resistor and the integrated circuit unit.

[0096] In addition, to achieve the above objectives, this application also provides a shunt welding apparatus, including a memory, a processor, and a control program for the shunt welding apparatus stored in the memory and executable on the processor. When the processor executes the control program for the shunt welding apparatus, it implements the welding process method of the shunt welding apparatus as described above.

[0097] Furthermore, embodiments of the present invention also propose a computer-readable storage medium. This computer-readable storage medium stores a shunt welding apparatus control program, which, when executed by a processor, implements the steps of the welding process method for the shunt welding apparatus as described above.

[0098] The method implemented when the shunt welding device control program running on the processor is executed can be referred to in various embodiments of the welding processing method of the shunt welding device of the present invention, and will not be repeated here.

[0099] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0100] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0101] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0102] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1The steps of the function specified in one or more boxes.

[0103] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent transformations made based on the inventive concept of the present invention and the contents of the specification and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method of welding processing of a shunt welding device, characterized by, The shunt welding device comprises a body, a heating mechanism and a temperature measuring mechanism, the body is internally formed with a welding space, the heating mechanism and the temperature measuring mechanism are arranged in the welding space, the body is provided with a vacuumizing mechanism, the shunt welding device further comprises a fixing clamp and a pushing mechanism, the fixing clamp is arranged above the heating mechanism, the fixing clamp is provided with a bearing structure for clamping an integrated circuit board, the bearing structure is arranged corresponding to a heating area of the heating mechanism, the pushing mechanism is arranged on a side of the fixing clamp away from the heating mechanism, the pushing mechanism is provided with a pressure detecting unit, the pushing mechanism is used to drive the integrated circuit board to move towards the heating mechanism, the pressure detecting unit is used to obtain a pressure value of the pushing mechanism applied to the integrated circuit board, and a welding processing method of the shunt welding device comprises the following steps. Start the heating mechanism to heat the alloy resistor; Control the temperature measuring mechanism to monitor the surface temperature of the alloy resistor; After the surface temperature of the alloy resistor reaches a preset welding temperature, move the integrated circuit board to the alloy resistor and push the integrated circuit board towards the alloy resistor to make the welding sites of the integrated circuit board and the alloy resistor correspondingly contact and weld; Control the vacuumizing mechanism to start to form a vacuum environment in the welding space.

2. The method of claim 1, wherein the welding process is a flow diverter welding process. After the step of starting the heating mechanism to heat the alloy resistor, further comprising: Obtain the temperature of the heating mechanism and adjust the heating rate of the heating mechanism according to the temperature of the heating mechanism.

3. The method of claim 2, wherein the welding process is performed by a shunt welding device. The heating mechanism is provided with a heating table, and the heating table is internally provided with an electric heating structure; In the step of obtaining the temperature of the heating mechanism and adjusting the heating rate of the heating mechanism according to the temperature of the heating mechanism, comprising: Obtain the temperature of the heating table, determine a first input current according to the temperature of the heating table and a preset heating threshold; Adjust the input current of the electric heating structure to the first input current.

4. The method of claim 3, wherein the welding is performed by a laser beam. After the step of adjusting the input current of the electric heating structure to the first input current, further comprising: After a first preset time, obtain the temperature of the heating table and the surface temperature of the alloy resistor, and determine a second input current according to the temperature of the heating table and the surface temperature of the alloy resistor; Adjust the input current of the electric heating structure to the second input current.

5. The method of claim 3, wherein the welding is performed by a laser beam. In the step of moving the integrated circuit board to the alloy resistor and pushing the integrated circuit board towards the alloy resistor to make the welding sites of the integrated circuit board and the alloy resistor correspondingly contact and weld after the surface temperature of the alloy resistor reaches a preset welding temperature, further comprising: Obtain the temperature of the heating table, and determine a third input current according to the temperature of the heating table; Adjust the input current of the electric heating structure to the third input current.

6. The method of welding of a shunt welding apparatus according to any one of claims 1 to 5, characterized in that, In the step of moving the integrated circuit board to the alloy resistor and pushing the integrated circuit board towards the alloy resistor to make the welding sites of the integrated circuit board and the alloy resistor correspondingly contact and weld after the surface temperature of the alloy resistor reaches a preset welding temperature, comprising: The solder paste is attached to the welding sites of the integrated circuit board, and the integrated circuit board is placed into the bearing structure of the fixing clamp; The pushing mechanism is controlled to move the integrated circuit board in the direction towards the heating mechanism, so that the welding sites of the integrated circuit board are in corresponding contact with the welding sites of the alloy resistor.

7. The welding process method of the shunt welding device as described in claim 6, characterized in that, In the step of controlling the pushing mechanism to move the integrated circuit board in the direction towards the heating mechanism, so that the welding sites of the integrated circuit board are in corresponding contact with the welding sites of the alloy resistor, the following steps are included: The pressure detection unit is controlled to obtain the pressure value applied by the pushing mechanism on the integrated circuit board, and compare the obtained pressure value with the preset pressure threshold value; If the obtained pressure value is greater than or equal to the pressure threshold value, the pushing mechanism is controlled to stop moving.

8. The method of welding of a shunt welding apparatus as claimed in any one of claims 1 to 5, wherein, The shunt welding device is also provided with a conveying mechanism, which is arranged in the welding space, and is provided with a feeding area. The heating mechanism is arranged on the transmission path of the conveying mechanism, and the conveying mechanism is provided with a position detection unit corresponding to the heating mechanism. Before the step of starting the heating mechanism to heat the alloy resistor, the following steps are further included: The alloy resistor is placed in the feeding area; The conveying mechanism is started to drive the alloy resistor to the heating area of the heating mechanism; The position detection unit sends an alloy resistor in-place instruction to control the conveying mechanism to stop, and sends a start instruction to the heating mechanism.

9. A shunt welding device characterized by, The control program of the shunt welding device is stored in the memory and can be run on the processor, and the processor executes the control program of the shunt welding device to realize the welding processing method of the shunt welding device as claimed in any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that, The control program of the shunt welding device is stored on the computer readable storage medium, and the control program of the shunt welding device is executed by the processor to realize the steps of the welding processing method of the shunt welding device as claimed in any one of claims 1 to 8.

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