Cross cavity structure and manufacturing method thereof, microwave circuit, and electronic equipment

Abstract

The present invention provides a cross cavity structure and a manufacturing method thereof, a microwave circuit, and an electronic device. The structure comprises: a first cavity, a second cavity, and a cover plate, wherein the first cavity and the second cavity intersect each other, a first groove is provided on the cavity wall of the second cavity, a partition beam is provided on the cover plate, a partition board is connected to the partition beam, and the partition board is inserted into the first groove. The present invention can improve the cross resonance of the cavity.

Description

Technical Field

[0001] The present invention relates to the technical field of microwave circuits, and in particular to a cross cavity structure and a manufacturing method thereof, a microwave circuit, and an electronic device. Background Art

[0002] In the information age, microwave circuits have played a huge application value in many fields and have had a profound impact on many industries and fields.

[0003] In microwave circuit design, cavity intersections are often involved. The intersection of cavities will cause the local widening of the signal transmission cavity, which will in turn cause cavity resonance and the risk of self-excitation of components in the circuit. However, when encountering a cross-cavity situation, traditional structural design is difficult to ensure that cavity resonance will not be caused. In addition, existing remedial measures cannot solve the problem of cavity resonance.

[0004] Therefore, there is an urgent need for a structure that can satisfy cavity crossing without causing a sudden change in the width of the signal transmission cavity. Summary of the invention

[0005] The embodiments of the present invention provide a cross cavity structure and a manufacturing method thereof, a microwave circuit, and an electronic device to solve the problem of cavity resonance caused by cavity crossover in the prior art.

[0006] In a first aspect, an embodiment of the present invention provides a cross cavity structure, comprising a first cavity, a second cavity and a cover plate; the first cavity and the second cavity cross each other, and the cover plate is placed on the first cavity and the second cavity;

[0007] A first groove is provided on the cavity wall of the second cavity, a partition beam is provided on the cover plate, a partition plate is connected to the partition beam, and the partition plate is inserted into the first groove.

[0008] In a possible implementation, a second groove and a third groove for placing the strip line are provided on the cavity wall of the second cavity, the second groove is perpendicular to the first groove, and the third groove is perpendicular to the first groove.

[0009] In a possible implementation manner, the second groove is located below the first groove, the third groove is located below the first groove, and the second groove and the third groove are located at the same height.

[0010] In a possible implementation manner, a bonding wire is provided at an intersection of the second groove and the first cavity, and a bonding wire is provided at an intersection of the third groove and the first cavity.

[0011] In a possible implementation manner, a depth of the first groove is greater than a depth of the first cavity.

[0012] In a possible implementation manner, the connection between the cover plate and the first cavity and the connection between the cover plate and the second cavity are both fixed by screws or sealing welding.

[0013] In a possible implementation, the partition plate, the partition beam and the cover plate are all made of metal.

[0014] In a second aspect, an embodiment of the present invention provides a method for manufacturing a cross cavity structure, comprising:

[0015] A first cavity and a second cavity that intersect each other are designed according to a preset circuit, and a second groove and a third groove are provided on the second cavity;

[0016] Processing a cover plate corresponding to the first cavity and the second cavity;

[0017] Two partition beams are processed on the cover plate, and the partition beams are respectively connected with partition plates;

[0018] A first groove corresponding to the partition is dug out on the cavity wall of the second cavity, the second groove is located below the first groove, and the third groove is located below the first groove;

[0019] After the cover plate is placed on the first cavity and the second cavity, the connection between the cover plate and the first cavity and the connection between the cover plate and the second cavity are fixed by screws or sealing welding.

[0020] In a third aspect, an embodiment of the present invention provides a microwave circuit, comprising a cross-cavity structure as described in any one of the first aspects.

[0021] In a fourth aspect, an embodiment of the present invention provides an electronic device, comprising the microwave circuit as described in the third aspect.

[0022] An embodiment of the present invention provides a cross-cavity structure and a manufacturing method thereof, a microwave circuit, and an electronic device. The cross-cavity structure includes a first cavity, a second cavity, and a cover plate. The first cavity and the second cavity intersect with each other. The cover plate is placed on the mutually intersecting first cavity and second cavity. The partition on the partition beam can separate the first cavity and the second cavity, so as to maintain the width of the signal transmission cavity. A first groove is provided on the cavity wall of the second cavity, a partition beam is provided on the cover plate, and a partition is connected to the partition beam. The partition is inserted into the first groove, so that the intersection of the first cavity and the second cavity is sealed more tightly, thereby improving the resonance of the cross-cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 is a schematic structural diagram of a first cavity, a second cavity and a cover plate provided in an embodiment of the present invention;

[0025] Figure 2 is a schematic diagram of the overall structure of the cross cavity provided by an embodiment of the present invention;

[0026] Figure 3 It is a flow chart for implementing a method for manufacturing a cross cavity structure provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0027] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present invention. However, it should be clear to those skilled in the art that the present invention may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present invention.

[0028] In order to make the purpose, technical solutions and advantages of the present invention more clear, specific embodiments will be described below in conjunction with the accompanying drawings.

[0029] As described in the relevant technology, microwave circuits have played a huge application value in many fields and have had a profound impact on many industries and fields.

[0030] Microwave devices are indispensable in mobile communication network coverage. Commonly used microwave devices mainly include phase shifters, power dividers, filters, couplers, duplexers, etc. The quality of their performance can affect the quality of the entire network coverage, so the importance of microwave devices in the field of mobile communications is self-evident.

[0031] In microwave circuit design, cavity intersections are often involved. The intersection of cavities will cause local widening of the signal transmission cavity, which will in turn cause cavity resonance and the risk of self-excitation of components in the circuit. The main problem after cavity intersection is that the intersection of cavities will cause local widening of the cavity, which will cause resonance of the signal transmission cavity. If the resonance point falls within the frequency band used by the circuit, it will cause circuit self-excitation. Even if it falls outside the passband, out-of-band self-excitation may occur.

[0032] The traditional solution is to stick absorbing materials on the cover plate above the cavity components after the circuit is self-excited, change the cavity resonance frequency and move the resonance point out of the working band. This is a remedial measure. When the working frequency band of the circuit is very wide, it may not be possible to move the resonance point out of the band. In addition, the absorbing material is generally a non-metallic material, and the firmness of the bonding with the metal cover plate cannot be guaranteed. Moreover, the characteristics of the absorbing material will change over time, and the problem cannot be guaranteed to be solved stably. The absorbing material may also release some gas, which may affect the performance of the components in the airtight cavity. Therefore, when encountering a cross-cavity situation, it is difficult for the traditional structural design to ensure that the cavity resonance will not be caused, and the remedial measures taken also cannot solve the problem.

[0033] In order to solve the problems in the prior art, the embodiments of the present invention provide a cross cavity structure and a manufacturing method thereof, a microwave circuit, and an electronic device. The cross cavity structure provided by the embodiments of the present invention is first introduced below.

[0034] like Figure 1 The structural schematic diagram of the first cavity, the second cavity and the cover plate shown in the figure, the cross cavity structure provided by the embodiment of the present invention includes a first cavity 1, a second cavity 2 and a cover plate 3; the first cavity 1 and the second cavity 2 cross each other, the cover plate 3 is placed on the first cavity 1 and the second cavity 2, a first groove 21 is provided on the cavity wall of the second cavity 2, a partition beam 31 is provided on the cover plate 3, a partition plate 32 is connected to the partition beam 31, and the partition plate 32 is inserted into the first groove 21.

[0035] Specifically, a partition beam 31 is provided on the cover plate 3 , a partition plate 32 is connected to the partition beam 31 , and a width of the partition beam 31 is greater than an inner width of the second cavity 2 .

[0036] In one embodiment, the cavity is used for a resonant circuit in the microwave band, which is a closed metal cavity with a strip line on the cavity. When the signal propagates on the strip line, the signal will emit some electric and magnetic fields between the conductor and its reference plane. As the signal switches between high and low states (digital signals) or oscillates at a certain frequency (analog signals), the signal will generate a wave that propagates away from the strip line, but due to the presence of the cavity, the wave will be confined in the cavity.

[0037] Specifically, a first groove 21 is provided on the cavity wall of the second cavity 2, and the partition 32 can be inserted into the first groove 21. The partition 32 better isolates the first cavity 1 and the second cavity 2, ensuring that the width of the signal transmission cavity does not change suddenly.

[0038] like Figure 2 The schematic diagram of the overall structure of the cross cavity shown in the figure shows that a second groove 22 and a third groove 23 for placing the strip line are provided on the cavity wall of the second cavity 2, the second groove 22 is perpendicular to the first groove 21, and the third groove 23 is perpendicular to the first groove 21.

[0039] In some embodiments, the second groove 22 is located below the first groove 21 , the third groove 23 is located below the first groove 21 , and the second groove 22 and the third groove 23 are located at the same height.

[0040] Specifically, the second groove 22 and the third groove 23 are used to place a microstrip line 24, which is a microwave transmission line composed of a single conductor strip supported on a dielectric substrate. It is suitable for making a planar structure transmission line for microwave integrated circuits. Compared with metal waveguides, it has small size, light weight, wide frequency band, high reliability and low manufacturing cost; but the loss is slightly larger and the power capacity is small. Due to the development of microwave low-loss dielectric materials and microwave semiconductor devices, microwave integrated circuits have been formed, making microstrip lines widely used, and various types of microstrip lines have appeared one after another. It is generally manufactured using thin film technology.

[0041] In some embodiments, a bonding wire 25 is disposed at the intersection of the second groove 22 and the first cavity 1 , and a bonding wire 25 is disposed at the intersection of the third groove 23 and the first cavity 1 .

[0042] Specifically, the bottom cavity wall of the second cavity 2 where it does not intersect with the first cavity 1 is not on the same horizontal line as the bottom cavity wall of the first cavity 1 . At the intersection of the first cavity 1 and the second cavity 2 , the signal is transmitted on the bonding wire 25 .

[0043] In some embodiments, the independent part of the second cavity 2, that is, the part that does not intersect with the first cavity 1, can be divided into a first independent part 26 and a second independent part 27. The second groove 22 is located on the bottom cavity wall of the first independent part 26, and the third groove 23 is located on the bottom cavity wall of the second independent part 27. When the signal passes through the connection between the first independent part 26 and the first cavity 1, it is transmitted on the bonding wire 25; when the signal passes through the connection between the second independent part 27 and the first cavity 1, it is transmitted on the bonding wire 25.

[0044] Specifically, bonding wire 25 is a fine metal wire inner lead, which can realize electrical connection between the input / output bonding points of the chip circuit and the inner contact points of the lead frame when assembling semiconductor devices and integrated circuits. The quality of the bonding effect directly affects the performance of the integrated circuit. Bonding wire 25 is one of the five basic materials in the overall IC packaging material market. It is an inner lead material with excellent electrical, thermal, mechanical properties and excellent chemical stability. It is an important structural material for manufacturing integrated circuits and discrete devices.

[0045] In some embodiments, the depth of the first groove 21 is greater than the depth of the first cavity 1 .

[0046] In some embodiments, the width of the partition beam 31 is greater than the inner width of the second cavity 2 , and the width of the first groove 21 is slightly greater than the width of the partition plate 32 , so as to ensure that the partition plate 32 can be smoothly inserted into the first groove 21 .

[0047] In some embodiments, the connection between the cover plate 3 and the first cavity 1 and the connection between the cover plate 3 and the second cavity 2 are both fixed by screws or sealing welding.

[0048] In an embodiment of the present invention, a cross cavity structure is provided, including a first cavity, a second cavity and a cover plate. The first cavity and the second cavity intersect with each other. The cover plate is placed on the intersecting first cavity and second cavity. The partition on the partition beam can separate the first cavity and the second cavity, so as to maintain the width of the signal transmission cavity. A first groove is provided on the cavity wall of the second cavity. A partition beam is provided on the cover plate. The partition beam is connected to the partition beam. The partition plate is inserted into the first groove, so that the intersection of the first cavity and the second cavity is sealed more tightly, thereby improving the resonance of the cross cavity.

[0049] It should be understood that the order of execution of the steps in the above embodiment does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present invention.

[0050] The following is an embodiment of the method for manufacturing the cross cavity structure of the present invention. For details not described in detail, reference may be made to the corresponding method embodiments described above.

[0051] Figure 3 The following is a flowchart of a method for manufacturing a cross cavity structure according to an embodiment of the present invention. For ease of explanation, only the part related to the embodiment of the present invention is shown, which is described in detail as follows:

[0052] like Figure 3 As shown, the manufacturing method of the cross cavity structure includes the following steps:

[0053] S301. Design a first cavity and a second cavity that intersect each other according to a preset circuit, and the second cavity is provided with a second groove and a third groove.

[0054] S302, processing a cover plate corresponding to the first cavity and the second cavity.

[0055] S303, two partition beams are processed on the cover plate, and the partition beams are respectively connected with partition plates.

[0056] S304, digging a first groove corresponding to the partition on the cavity wall of the second cavity, the second groove is located at the lower side of the first groove, and the third groove is located at the lower side of the first groove.

[0057] S305: After placing the cover plate on the first cavity and the second cavity, fix the connection between the cover plate and the first cavity and the connection between the cover plate and the second cavity by screws or sealing welding.

[0058] In an embodiment of the present invention, a method for manufacturing a cross cavity structure is provided, wherein a first cavity and a second cavity that intersect each other are designed according to a preset circuit, and a second groove and a third groove are provided on the second cavity; a cover plate corresponding to the first cavity and the second cavity is processed; two partition beams are processed on the cover plate, and the partition beams are respectively connected to the partition plates; a first groove corresponding to the partition plate is dug out on the cavity wall of the second cavity, the second groove is located on the lower side of the first groove, and the third groove is located on the lower side of the first groove; after the cover plate is placed on the first cavity and the second cavity, the connection between the cover plate and the first cavity and the connection between the cover plate and the second cavity are fixed by screws or sealing welding, and this method can ensure that the width of the signal transmission cavity does not change suddenly.

[0059] The embodiment of the present invention provides a microwave circuit, including the cross cavity structure of any of the above embodiments. Because the microwave circuit of this embodiment includes the cross cavity structure of any of the above embodiments, the microwave circuit of this embodiment at least includes the beneficial effects corresponding to the cross cavity structure of any of the above embodiments.

[0060] An embodiment of the present invention provides an electronic device, including the microwave circuit of any of the above embodiments. Since the electronic device of this embodiment includes the microwave circuit of any of the above embodiments, the electronic device of this embodiment at least has the beneficial effects corresponding to the microwave circuit of any of the above embodiments.

[0061] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A cross cavity structure, characterized in that: It comprises a first cavity, a second cavity and a cover plate; the first cavity and the second cavity intersect each other, and the cover plate is placed on the first cavity and the second cavity; A first groove is provided on the cavity wall of the second cavity, a partition beam is provided on the cover plate, a partition board is connected to the partition beam, and the partition board is inserted into the first groove; a second groove and a third groove for placing the strip line are provided on the cavity wall of the second cavity, the second groove is perpendicular to the first groove, and the third groove is perpendicular to the first groove; the second groove and the third groove are located at the same height; Among them, the cross-cavity structure is manufactured by the following method: according to a preset circuit design, a first cavity and a second cavity that intersect each other are formed, and a second groove and a third groove are provided on the second cavity; a cover plate corresponding to the first cavity and the second cavity is processed; two partition beams are processed on the cover plate, and partitions are respectively connected to the partition beams; a first groove corresponding to the partition is dug out on the cavity wall of the second cavity, the second groove is located on the lower side of the first groove, and the third groove is located on the lower side of the first groove; after placing the cover plate on the first cavity and the second cavity, the connection between the cover plate and the first cavity and the connection between the cover plate and the second cavity are fixed by screws or sealing welding.

2. The cross cavity structure according to claim 1, characterized in that: A bonding wire is provided at the intersection of the second groove and the first cavity, and a bonding wire is provided at the intersection of the third groove and the first cavity.

3. The cross cavity structure according to claim 1, characterized in that: The depth of the first groove is greater than the depth of the first cavity.

4. The cross cavity structure according to claim 1, characterized in that: The connection between the cover plate and the first cavity and the connection between the cover plate and the second cavity are both fixed by screws or sealing welding.

5. The cross cavity structure according to claim 1, characterized in that: The partition plate, the partition beam and the cover plate are all made of metal.

6. A method for manufacturing a cross cavity structure, characterized in that: include: A first cavity and a second cavity intersecting each other are designed according to a preset circuit, and a second groove and a third groove for placing the strip line are provided on the second cavity; the second groove and the third groove are located at the same height; Processing a cover plate corresponding to the first cavity and the second cavity; Two partition beams are processed on the cover plate, and the partition beams are respectively connected with partition plates; A first groove corresponding to the partition is dug out on the cavity wall of the second cavity, the second groove is located below the first groove, and the third groove is located below the first groove; the second groove is perpendicular to the first groove, and the third groove is perpendicular to the first groove; After the cover plate is placed on the first cavity and the second cavity, the connection between the cover plate and the first cavity and the connection between the cover plate and the second cavity are fixed by screws or sealing welding.

7. A microwave circuit, characterized in that: It comprises a cross cavity structure as described in any one of claims 1-5.

8. An electronic device, characterized in that: Comprising the microwave circuit as claimed in claim 7.

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