Circuit board, method of manufacturing circuit board, and server

Abstract

The application discloses a circuit board, a circuit board manufacturing method and a server, and relates to the technical field of circuit boards. The circuit board comprises a top layer, a bottom layer, a plurality of middle layers and a plurality of groups of hole structures which are opened in the top layer and extend to the bottom layer; a copper-plated short pin is arranged in the hole structure; a first end of the copper-plated short pin is connected with a bonding pad in the top layer, and a second end of the copper-plated short pin is connected with a signal line in the middle layer; the copper-plated short pins in the same group of hole structures are connected with the same middle layer; and the copper-plated short pins in different groups of hole structures are connected with different middle layers. The circuit board provided by the application can prevent signal crosstalk, and improves the quality of signal transmission and the space utilization of the circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of servers, in particular to a circuit board, a circuit board manufacturing method and a server. BACKGROUND

[0002] With the rapid development of information technology, electronic products are increasingly developing towards high performance, thereby causing the signal transmission rate on the printed circuit board (PCB) in the electronic product to be increasingly fast.

[0003] When the electrical signal transmission rate is increasingly fast, the existing circuit board design and high-speed signal connector are difficult to meet the signal transmission performance requirements, resulting in signal reflection and antenna radiation effects in the signal transmission process, and serious signal crosstalk problems, causing signal integrity distortion. SUMMARY

[0004] In a first aspect, the present application provides a circuit board, comprising:

[0005] a top layer, a bottom layer, a plurality of intermediate layers, and a plurality of groups of hole structures opening in the top layer and extending to the bottom layer;

[0006] a copper-plated short pin is arranged in the hole structure; a first end of the copper-plated short pin is connected with a pad in the top layer, and a second end of the copper-plated short pin is connected with a signal line in the intermediate layer;

[0007] The intermediate layers connected by the copper-plated short pins in the hole structures in the same group are the same; and the intermediate layers connected by the copper-plated short pins in the hole structures in different groups are different.

[0008] In some embodiments, the plurality of groups of hole structures are arranged in ascending order of hole structure depth along a preset direction in the circuit board;

[0009] The preset direction is from a side of the circuit board close to a processor to a side of the circuit board away from the processor.

[0010] In some embodiments, the spacing distance between the hole structures in the same group is smaller than the spacing distance between the hole structures in different groups.

[0011] In some embodiments, the copper-plated short pin is a hollow pin structure for crimping a fish-eye pin.

[0012] In a second aspect, the present application provides a server, comprising:

[0013] The circuit board described above, and a plurality of groups of fish-eye pins;

[0014] Each group of fish-eye pins is crimped to a corresponding group of hole structures in the circuit board;

[0015] The length of each group of fish-eye pins is determined based on the length of the copper-plated short pin in the corresponding group of hole structures and a preset length difference.

[0016] In a third aspect, the present application provides a circuit board manufacturing method applied to any of the above-mentioned circuit boards, comprising:

[0017] determining a to-be-processed circuit board and a current to-be-processed hole structure;

[0018] drilling the to-be-processed circuit board based on the hole type of the current to-be-processed hole structure and the position of the intermediate layer connected with the copper-plated short pin in the to-be-processed circuit board, to obtain a processing result of the current to-be-processed hole structure;

[0019] obtaining the circuit board based on the processing result of each to-be-processed hole structure.

[0020] In some embodiments, the drilling the to-be-processed circuit board based on the hole type of the current to-be-processed hole structure and the position of the intermediate layer connected with the copper-plated short pin in the to-be-processed circuit board, to obtain a processing result of the current to-be-processed hole structure, comprises:

[0021] in the case that the current to-be-processed hole structure is a blind hole, determining a processing depth of the current to-be-processed hole structure based on the position of the intermediate layer connected with the copper-plated short pin in the to-be-processed circuit board;

[0022] drilling a blind hole corresponding to the current to-be-processed hole structure at a pad corresponding to the current to-be-processed hole structure based on the processing depth, to obtain the blind hole corresponding to the current to-be-processed hole structure;

[0023] electroplating copper on the inner wall of the blind hole to obtain a copper-plated short pin corresponding to the current to-be-processed hole structure;

[0024] obtaining the processing result of the current to-be-processed hole structure based on the blind hole and the copper-plated short pin corresponding to the current to-be-processed hole structure.

[0025] In some embodiments, the drilling the to-be-processed circuit board based on the hole type of the current to-be-processed hole structure and the position of the intermediate layer connected with the copper-plated short pin in the to-be-processed circuit board, to obtain a processing result of the current to-be-processed hole structure, comprises:

[0026] in the case that the current to-be-processed hole structure is a via hole, determining a back-drilling processing depth of the current to-be-processed hole structure based on the position of the intermediate layer connected with the copper-plated short pin in the to-be-processed circuit board and the thickness of the to-be-processed circuit board;

[0027] performing first drilling at a pad corresponding to the current hole structure to be processed to obtain a through hole corresponding to the current hole structure to be processed;

[0028] electroplating copper on the inner wall of the through hole, and performing second drilling along the central axis direction of the through hole at the bottom layer of the circuit board based on the back drilling processing depth to obtain a copper-plated short post corresponding to the current hole structure to be processed;

[0029] obtaining a processing result of the current hole structure to be processed based on the through hole and the copper-plated short post corresponding to the current hole structure to be processed;

[0030] The second drilling corresponds to a drilling diameter greater than a drilling diameter corresponding to the first drilling.

[0031] In a fourth aspect, the present application provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor executes the program to implement the method of any of the above.

[0032] In a fifth aspect, the present application provides a non-transitory computer readable storage medium having a computer program stored thereon, and the computer program is executable by a processor to implement the method of any of the above.

[0033] The circuit board, the circuit board manufacturing method and the server provided by the present application can connect the signal lines of each intermediate layer to the pads in the top layer by setting multiple groups of hole structures in the circuit board and setting copper-plated short posts in the hole structures, connect the copper-plated short posts in the hole structures of the same group to the same intermediate layer and connect the copper-plated short posts in the hole structures of different groups to different intermediate layers to arrange the signal lines of each group in different layers of the circuit board, thereby improving the space utilization efficiency of the circuit board, connect the first ends of the copper-plated short posts in each group of hole structures to the pads in the top layer and the second ends to the signal lines in the corresponding intermediate layer, and arrange the signal lines of each group in different layers of the circuit board to prevent mutual crosstalk between the signal lines of each group and improve the quality of signal transmission and the integrity of signals. BRIEF DESCRIPTION OF DRAWINGS

[0034] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application.

[0035] In order to more clearly illustrate the technical solutions in the present application or the prior art, the accompanying drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0036] Figure 1 is a sectional view of a circuit board provided by one embodiment of the present application;

[0037] Figure 2 is a top view of a circuit board provided by another embodiment of the present application;

[0038] Figure 3 is a sectional view of a circuit board provided by yet another embodiment of the present application;

[0039] Figure 4 is a structural schematic diagram of a server provided by one embodiment of the present application;

[0040] Figure 5 is a flow schematic diagram of a circuit board manufacturing method provided by one embodiment of the present application;

[0041] Figure 6 is a structural schematic diagram of an electronic device provided by one embodiment of the present application. DETAILED DESCRIPTION

[0042] In order to make the personnel in the art better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person of ordinary skill in the art without making creative labor should belong to the protection scope of the present application.

[0043] It should be noted that the terms "first", "second", and the like in the present application are used to distinguish similar objects, and do not necessarily indicate a specific order or a chronological sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0044] Figure 1 is a sectional view of a circuit board provided by one embodiment of the present application; as Figure 1 shown, the circuit board includes:

[0045] a top layer 110, a bottom layer 120, a plurality of intermediate layers 130, and a plurality of groups of hole structures 140 opening in the top layer 110 and extending to the bottom layer;

[0046] The hole structure 140 is provided with a copper-plated short pin 150; a first end of the copper-plated short pin 150 is connected with a pad 160 in the top layer 110, and a second end of the copper-plated short pin 150 is connected with a signal line in the middle layer 130;

[0047] The middle layers 130 connected by the copper-plated short pins 150 in the hole structures 140 in the same group are the same; the middle layers 130 connected by the copper-plated short pins 150 in the hole structures 140 in different groups are different.

[0048] Specifically, the circuit board according to the embodiment of the present application comprises, from top to bottom, a top layer, a plurality of middle layers and a bottom layer. The top layer of the circuit board has a plurality of openings, and the plurality of openings all extend to the bottom layer of the circuit board to form a plurality of groups of hole structures.

[0049] The top layer of the circuit board is further provided with a plurality of pads, and the circuit board can be directly connected with external lines through the pads. In order to connect the signal lines (not shown in the figure) in each layer inside the circuit board with the pads in the top layer, the copper-plated short pins are arranged in the hole structures.

[0050] A first end of the copper-plated short pin is connected with a pad in the top layer, and a second end of the copper-plated short pin is connected with a signal line in the middle layer. The copper-plated short pin can connect the signal lines in each layer inside the circuit board with the pads in the top layer.

[0051] The circuit board has a plurality of groups of hole structures, and each group of hole structures can be the same or different. The hole structures in the same group are the same. For example, Figure 1 as shown in FIG. 1, Figure 1 the circuit board comprises three groups of hole structures, and the three groups of hole structures are different. For convenience of viewing, Figure 1 only one hole structure in each group of hole structures is shown in FIG. 1. From left to right, the first group of hole structures is a blind hole structure; the second group of hole structures is a through hole structure; and the third group of hole structures is a through hole structure.

[0052] The middle layers connected by the copper-plated short pins in the same group of hole structures are the same, i.e., the copper-plated short pins in the same group of hole structures are all connected with signal lines in the same layer; the middle layers connected by the copper-plated short pins in each group of hole structures are different, i.e., the copper-plated short pins in different groups of hole structures are connected with signal lines in different layers.

[0053] For example, the circuit board comprises 12 layers, the first group of copper-plated short pins are all connected with signal lines in the 4th middle layer, the second group of copper-plated short pins are all connected with signal lines in the 6th middle layer, and the third group of copper-plated short pins are all connected with signal lines in the 11th middle layer.

[0054] The circuit board provided by the embodiment of the present application can connect the signal lines of each intermediate layer with the pads in the top layer by arranging multiple groups of hole structures in the circuit board and arranging copper-plated short posts in the hole structures, connect the copper-plated short posts in the hole structures in the same group with the same intermediate layer, and connect the copper-plated short posts in the hole structures in different groups with different intermediate layers, so that the signal lines in each group can be arranged in different layers in the circuit board, thereby improving the space utilization efficiency of the circuit board; and the signal lines in each group can be prevented from interfering with each other by connecting the first ends of the copper-plated short posts in each group of hole structures with the pads in the top layer, connecting the second ends of the copper-plated short posts with the signal lines in the corresponding intermediate layer, and arranging the signal lines in each group in different layers in the circuit board, thereby improving the quality of signal transmission and the integrity of signals.

[0055] In some embodiments, the multiple groups of hole structures are arranged in the circuit board along a preset direction in ascending order of hole structure depth;

[0056] The preset direction is from the side of the circuit board close to the processor to the side of the circuit board away from the processor.

[0057] Specifically, in order to further improve the space utilization efficiency of the circuit board and the quality of signal transmission of the circuit board, the preset direction is set according to the position of the processor and the circuit board, and the side of the circuit board close to the processor is directed to the side of the circuit board away from the processor as the preset direction, so as to facilitate the connection of the signal lines in the circuit board with the processor.

[0058] The multiple groups of hole structures are arranged in the circuit board along the preset direction in ascending order of hole structure depth, until the hole structure is a through hole structure.

[0059] For example, Figure 1 The processor (not shown in the figure) in the circuit board is on the left side of the circuit board, and the circuit board from left to right is the side of the circuit board close to the processor to the side of the circuit board away from the processor, that is, Figure 1 The circuit board in the circuit board from left to right is the preset direction, and the depth of the hole structure increases in turn until the hole structure is a through hole structure.

[0060] In which, the depth of the hole structure closest to the processor can be zero, that is, multiple ball grid array (BGA) surface mount pads in the form of package can be directly arranged on the top surface of the top layer of the circuit board, the first group of signal lines is directly connected with the surface mount pads, the horizontal diameter of the surface mount pads can be 0.6mm-0.8mm, and the vertical length can be 0.2mm.

[0061] The circuit board provided by the embodiment of the present application can insert fish-eye pins with different lengths and connect with signal lines of different layers, can prevent Stub length from being too long (Stub is the length of the excess copper remaining on the signal line in the via on the circuit board), and will not cause problems such as signal rise time extension, transmission rate reduction, impedance discontinuity caused by reflection, signal integrity problems such as loss, and problems caused by noise interference on the signal, thereby ensuring the transmission stability of the signal and improving the quality of signal transmission.

[0062] In some embodiments, the copper-plated short pin is a hollow column structure for crimping the fish-eye pin.

[0063] Specifically, the depth of the copper-plated short pin can increase in the preset direction in turn. Figure 1 As can be seen from FIG. 1, the depth of the copper-plated short pin increases in turn from left to right.

[0064] The copper-plated short pin is a hollow column structure and can be used for crimping the fish-eye pin.

[0065] The circuit board provided by the embodiment of the present application can crimp the fish-eye pin by setting the copper-plated short pin as a hollow column structure, thereby ensuring the transmission stability of the signal and improving the quality of signal transmission.

[0066] Figure 2 FIG. 1 is a top view of a circuit board provided by another embodiment of the present application; as shown in FIG. 1, the interval distance between the same group of hole structures is smaller than the interval distance between different groups of hole structures. Figure 2

[0067] Specifically, Figure 2 FIG. 1 includes three groups of hole structures, and each group of hole structures includes 30 holes. It should be noted that Figure 2 The structure in FIG. 1 is only an example, and the number of groups and the number of hole structures can be set according to actual conditions.

[0068] In order to facilitate the connection of the signal line, the interval distance between the same group of hole structures is small, and the interval distance between different groups of hole structures is large.

[0069] The circuit board provided by the embodiment of the present application can not only facilitate the connection of different signal lines, but also prevent signal crosstalk, improve the quality of signal transmission, and improve the space utilization efficiency of the circuit board.

[0070] Figure 3 FIG. 2 is a sectional view of the circuit board provided by another embodiment of the present application; as shown in FIG. 2, the circuit board is a PCB and includes: Figure 3 ​​

[0071] The PCB includes four groups of hole structures. The first group of hole structures 350 corresponds to the first signal layer 310; the second group of hole structures 360 corresponds to the second signal layer 320; the third group of hole structures 370 corresponds to the third signal layer 330; and the fourth group of hole structures 380 corresponds to the fourth signal layer 340.

[0072] The signal lines in the first signal layer and the second signal layer are used for high-speed signal transmission, and the signal lines in the third signal layer and the fourth signal layer are used for high-speed signal reception. Each signal layer is arranged at a different layer of the PCB.

[0073] For example, if the PCB includes L1 to L13 layers, the L1 layer is a top layer (TOP layer), the L2 to L11 layers are a plurality of middle layers, and the L13 layer is a bottom layer (BOTTOM layer). The first signal layer can be selected from the L1 layer to the L3 layer; the second signal layer can be selected from the L3 layer to the L5 layer; the third signal layer and the fourth signal layer can be selected from the L6 layer to the L11 layer, and the number of layers of the fourth signal layer is greater than that of the third signal layer.

[0074] The first signal layer of the PCB can be arranged at a top layer or a second middle layer of the PCB. If the first signal layer of the PCB is arranged at the top layer of the PCB, the length of the first group of hole structures corresponding to the first signal layer is zero, and a surface-mounted land in the form of a BGA package is welded on the top surface of the first signal layer, and at this time, the surface-mounted land is equivalent to the first group of hole structures. The horizontal diameter of the surface-mounted land ranges from 0.6 mm to 0.8 mm, and the vertical length is 0.2 mm.

[0075] If the first signal layer of the PCB is a second middle layer of the PCB, the length of the first group of hole structures corresponding to the first signal layer is less than the length of the second group of hole structures corresponding to the second signal layer, the first group of hole structures is arranged at the innermost side of the PCB, and the first group of hole structures is a blind hole structure. The blind hole is opened on the surface-mounted land and extends to the bottom layer of the PCB, and the length of the blind hole is determined according to the length of the first group of hole structures.

[0076] The second signal layer of the PCB can be arranged at any one of the second middle layer to the fourth middle layer of the PCB. The length of the fisheye pin corresponding to the second signal layer is 0.43 mm; the second group of hole structures is a blind hole structure, and the length of the blind hole is 0.5 mm±0.05 mm.

[0077] The third signal layer of the PCB can be arranged in any one of the intermediate layers close to the bottom layer of the PCB. The length of the fisheye pin corresponding to the third signal layer is 1.2 mm, and the third group of hole structures are through hole structures. The initial through hole is drilled at the crimping position of the fisheye pin corresponding to the third signal layer, and the final through hole is obtained by back drilling the initial through hole after copper plating according to the depth of the third signal layer. The final through hole structure is the third group of hole structures. After back drilling, no copper plating is performed.

[0078] The fourth signal layer of the PCB can be arranged in any one of the intermediate layers close to the bottom layer of the PCB. The length of the fisheye pin corresponding to the fourth signal layer is 1.2 mm or 1.6 mm, and increasing the length of the fisheye pin corresponding to the fourth signal layer can enhance the connection strength of the high-speed crimping connector and the PCB. The fourth group of hole structures are through hole structures. If the thickness of the PCB is 1.6 mm and the length of the fisheye pin corresponding to the fourth signal layer is 1.2 mm, back drilling is required, and the back drilling method is the same as that of the third group of hole structures, which will not be described here. If the thickness of the PCB and the length of the fisheye pin corresponding to the fourth signal layer are both 1.6 mm, back drilling is not required.

[0079] The circuit board provided by the embodiments of the present application has different signal layers corresponding to each group of hole structures, so that the high-speed signal fan-out does not affect each other. By layering the high-speed transmission signals and receiving signals, the signal crosstalk is reduced, and the high-speed signal transmission quality is improved. By arranging the blind hole, the wiring space of the lower layers of the PCB is not occupied, the high-speed signal fan-out space of the third signal layer and the fourth signal layer is increased, which is more conducive to the wiring of the signal lines. The PCB can fan-out all the signal lines through the four signal layers, greatly reducing the number of layers of the PCB, reducing the manufacturing cost of the PCB, reducing or removing the stub of the corresponding signal line, and improving the integrity of the high-speed signal.

[0080] Figure 4 is a structural schematic diagram of a server provided by an embodiment of the present application; as Figure 4 shown, the 400 server provided by the embodiments of the present application includes the above-mentioned circuit board 410 and a plurality of fisheye pins 420;

[0081] Each group of fisheye pins is crimped to the corresponding group of hole structures in the circuit board.

[0082] The length of each group of fisheye pins is determined based on the length of the copper-plated short column in the corresponding group of hole structures and a preset length difference.

[0083] Specifically, the length of the fish-eye pin cannot be too short, otherwise it cannot be stably crimped with the corresponding copper-plated stub; the length of the fish-eye pin also cannot be too long, otherwise the stub length is too long, which will affect the integrity of the high-speed transmission signal and reduce the quality of signal transmission, if the length of the fish-eye pin is greater than the length of the corresponding copper-plated stub plus the preset length difference.

[0084] In the printed circuit board, if the stub length of the high-speed signal is less than or equal to 10 mils (mil), the requirement of the integrity of the high-speed transmission signal is met, so the preset length difference can be set to 0.254 mm (10 mils = 0.254 mm).

[0085] In order to match the length of the fish-eye pin with the length of the copper-plated stub, the length of the fish-eye pin can be set according to the length of the copper-plated stub and the preset length difference.

[0086] The length of the fish-eye pin can be subtracted from the length of the copper-plated stub to obtain the length difference, and the absolute value of the length difference needs to be less than the preset length difference. That is, the length range of the fish-eye pin is the length of the copper-plated stub minus the preset length difference to the length of the copper-plated stub plus the preset length difference.

[0087] However, the length range of the fish-eye pin obtained by the above calculation method is large, and the length of the copper-plated stub may have an error, in order to reduce the risk of mismatching the length of the fish-eye pin with the length of the copper-plated stub, the length of the fish-eye pin can be specifically set according to the actual situation.

[0088] For example, the length of the copper-plated stub is 0.5 mm ± 0.05 mm, and the preset length difference is 0.254 mm, then the length range of the fish-eye pin is preliminarily calculated as 0.246 mm to 0.754 mm. The length of the fish-eye pin can be set to 0.43 mm.

[0089] The server provided by the embodiment of the present application includes the circuit board and a plurality of groups of fish-eye pins, and the length of each group of fish-eye pins is determined based on the length of the copper-plated stub in the corresponding group of hole structures and the preset length difference, which can reduce the stub length of the high-speed signal and improve the transmission quality of the signal.

[0090] Figure 5 is a flowchart of the circuit board manufacturing method provided by an embodiment of the present application; as shown in Figure 5 the method includes steps 510, 520 and 530. The method flow steps are only used as one possible implementation of the present application.

[0091] Step 510, determine the circuit board to be processed and the current hole structure to be processed.

[0092] In step 520, based on the hole type of the current hole structure to be processed and the position of the intermediate layer connected by the copper-plated short pin in the current hole structure to be processed in the circuit board to be processed, drilling is performed on the circuit board to be processed to obtain a processing result of the current hole structure to be processed.

[0093] In step 530, based on the processing result of each hole structure to be processed, a circuit board is obtained.

[0094] The hole type of the current hole structure to be processed includes a blind hole and a through hole.

[0095] In the case of the current hole structure to be processed being a blind hole, based on the position of the intermediate layer connected by the copper-plated short pin in the current hole structure to be processed in the circuit board to be processed, the processing depth of the current hole structure to be processed is determined.

[0096] Based on the processing depth, drilling is performed at the pad corresponding to the current hole structure to be processed to obtain a blind hole corresponding to the current hole structure to be processed.

[0097] Copper is electroplated on the inner wall of the blind hole to obtain a copper-plated short pin corresponding to the current hole structure to be processed.

[0098] Based on the blind hole and the copper-plated short pin corresponding to the current hole structure to be processed, a processing result of the current hole structure to be processed is obtained.

[0099] Specifically, if the current hole structure to be processed is a blind hole, the depth of the intermediate layer connected by the copper-plated short pin in the current hole structure to be processed in the circuit board to be processed is determined, which is the processing depth of the current hole structure to be processed. According to the processing depth, drilling is performed at the pad corresponding to the current hole structure to be processed to obtain a blind hole corresponding to the current hole structure to be processed. Copper plating treatment is performed on the inner wall of the blind hole to obtain a copper-plated short pin corresponding to the current hole structure to be processed. Based on the blind hole and the copper-plated short pin corresponding to the current hole structure to be processed, a processing result of the current hole structure to be processed is obtained.

[0100] In the case of the current hole structure to be processed being a through hole, based on the position of the intermediate layer connected by the copper-plated short pin in the current hole structure to be processed in the circuit board to be processed and the thickness of the circuit board to be processed, the back drilling processing depth of the current hole structure to be processed is determined.

[0101] In step 520, based on the hole type of the current hole structure to be processed and the position of the intermediate layer connected by the copper-plated short pin in the current hole structure to be processed in the circuit board to be processed, drilling is performed on the circuit board to be processed to obtain a processing result of the current hole structure to be processed.

[0102] In step 520, based on the hole type of the current hole structure to be processed and the position of the intermediate layer connected by the copper-plated short pin in the current hole structure to be processed in the circuit board to be processed, drilling is performed on the circuit board to be processed to obtain a processing result of the current hole structure to be processed.

[0103] The processing result of the current hole structure is obtained based on the via hole and the plated stub corresponding to the current hole structure.

[0104] The drilling diameter corresponding to the second drilling is greater than the drilling diameter corresponding to the first drilling.

[0105] Specifically, if the current hole structure is a via hole, the back drilling depth needs to be determined. The depth of the intermediate layer connected by the plated stub in the current hole structure in the circuit board to be processed is obtained, and the overall thickness of the circuit board to be processed is obtained. The overall thickness of the circuit board to be processed is subtracted by the depth of the intermediate layer connected by the plated stub in the current hole structure in the circuit board to be processed, and the back drilling depth can be obtained. Back drilling can reduce the stub length.

[0106] The first drilling is performed at the pad corresponding to the current hole structure to obtain a via hole corresponding to the current hole structure, the inner wall of the via hole is plated with copper, the second drilling is performed along the central axis direction of the via hole at the bottom layer of the circuit board to be processed according to the obtained back drilling depth, to obtain a plated stub corresponding to the current hole structure, and the processing result of the current hole structure is obtained based on the via hole and the plated stub corresponding to the current hole structure.

[0107] In order to drill out all the copper close to the bottom layer, the drilling diameter corresponding to the second drilling is greater than the drilling diameter corresponding to the first drilling.

[0108] The circuit board manufacturing method provided by the embodiments of the present application can obtain the current hole structure by using different processing techniques for different hole structures, can reduce the length of the high-speed signal stub by back drilling the via hole, can improve the signal transmission efficiency, can layer and fan out the high-speed signal by obtaining the position of the intermediate layer connected by the plated stub in the circuit board to be processed, can reduce the crosstalk between signals, can ensure the integrity of the signal, and can improve the space utilization of the circuit board.

[0109] It should be noted that each embodiment of the present application can be freely combined, the order can be changed or the embodiments can be executed independently, and the fixed execution order is not required.

[0110] Figure 6 The structural schematic diagram of the electronic device provided by one embodiment of the present application is shown in FIG. 1. Figure 6As shown, the electronic device can include a processor 610, a communications interface 620, a memory 630, and a communications bus 640, wherein the processor 610, the communications interface 620, and the memory 630 complete mutual communication through the communications bus 640. The processor 610 can invoke a logical command in the memory 630 to execute a circuit board manufacturing method, which includes:

[0111] determining a to-be-processed circuit board and a current to-be-processed hole structure;

[0112] based on a hole type of the current to-be-processed hole structure and a position of a copper-plated short post connected intermediate layer in the to-be-processed circuit board in the current to-be-processed hole structure, drilling the to-be-processed circuit board to obtain a processing result of the current to-be-processed hole structure;

[0113] obtaining the circuit board based on the processing result of each to-be-processed hole structure.

[0114] In addition, the logical command in the memory described above can be implemented in the form of a software function unit and sold or used as an independent product, which can be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application essentially or the part that contributes to the prior art or part of the technical solutions can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a plurality of commands to make a computer device (which can be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the methods described in various embodiments of the present application. The foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk, and various media that can store program codes.

[0115] The processor in the electronic device provided by the embodiments of the present application can invoke the logical instructions in the memory to implement the above-mentioned method, and the specific implementation manners and the same beneficial effects as the foregoing method implementation manners are consistent, and will not be described here.

[0116] The embodiments of the present application also provide a non-transitory computer-readable storage medium, which stores a computer program, and the computer program is executed by a processor to implement the method provided by each of the above embodiments.

[0117] The specific implementation manners and the same beneficial effects as the foregoing method implementation manners are consistent, and will not be described here.

[0118] The embodiment of the present application provides a computer program product, comprising a computer program, which realizes the method as described above when executed by a processor.

[0119] The device embodiments described above are merely illustrative, wherein the units described as separate components can or can not be physically separate, and the components displayed as units can or can not be physical units, i.e., can be located in one place, or can be distributed on multiple network units. Part or all of the modules can be selected to achieve the purpose of the embodiment scheme according to actual needs. Those skilled in the art can understand and implement without creative labor.

[0120] Through the above description of the embodiments, those skilled in the art can clearly understand that the embodiments can be realized by means of software and the necessary universal hardware platforms, and of course can also be realized by hardware. Based on such understanding, the above technical solutions can be embodied in the form of software products, and the computer software products can be stored in a computer readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and include a plurality of instructions to make a computer device (which can be a personal computer, a server, or a network device, etc.) execute the methods described in each embodiment or some parts of the embodiments.

[0121] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board, characterized in that, It includes a top layer, a bottom layer, multiple intermediate layers, and a multi-set of perforated structures that open in the top layer and extend into the bottom layer; The hole structure is provided with copper-plated short posts; the first end of the copper-plated short posts is connected to the pads in the top layer, and the second end of the copper-plated short posts is connected to the signal lines in the intermediate layer. The intermediate layers connected by the copper-plated short posts in the same group of hole structures are the same; the intermediate layers connected by the copper-plated short posts in different groups of hole structures are different; the spacing between the same group of hole structures is smaller than the spacing between different groups of hole structures, and the hole structure includes blind holes; The copper-plated short post is a hollow post structure used for crimping fisheye pins. The length range of the fisheye pin is: the length of the copper-plated short post minus a preset length difference to the length of the copper-plated short post plus the preset length difference. The multiple sets of hole structures are arranged in ascending order of hole structure depth along a preset direction in the circuit board; The preset direction is from the side of the circuit board closer to the processor to the side of the circuit board farther from the processor.

2. A server, characterized in that, Includes the circuit board as described in claim 1, and multiple sets of fisheye pins; Each set of fisheye pins is crimped to the corresponding set of hole structures in the circuit board; The length of each group of fisheye pins is determined based on the length of the copper-plated short pins in the corresponding group of hole structures and a preset length difference. The length range of the fisheye pins is: the length of the copper-plated short pin minus the preset length difference to the length of the copper-plated short pin plus the preset length difference.

3. A method for manufacturing a circuit board, characterized in that, Applied to the circuit board of claim 1, comprising: Determine the circuit board to be processed and the current hole structure to be processed; Based on the hole type of the current hole structure to be processed, and the position of the intermediate layer connected by the copper-plated short posts in the current hole structure to be processed in the circuit board to be processed, the circuit board to be processed is drilled to obtain the processing result of the current hole structure to be processed; The circuit board is obtained based on the processing results of each hole structure to be processed.

4. The circuit board manufacturing method according to claim 3, characterized in that, The process of drilling holes in the circuit board to be processed based on the hole type of the current hole structure and the position of the intermediate layer connected by the copper-plated short posts in the current hole structure, to obtain the processing result of the current hole structure, includes: When the current hole structure to be processed is a blind hole, the processing depth of the current hole structure is determined based on the position of the intermediate layer connected by the copper-plated short posts in the current hole structure on the circuit board to be processed. Based on the processing depth, a hole is drilled at the pad corresponding to the current hole structure to be processed to obtain a blind hole corresponding to the current hole structure to be processed. Copper is electroplated onto the inner wall of the blind hole to obtain a copper-plated short post corresponding to the current hole structure to be processed. Based on the blind holes and copper-plated short posts corresponding to the current hole structure to be processed, the processing result of the current hole structure to be processed is obtained.

5. The circuit board manufacturing method according to claim 3, characterized in that, The process of drilling holes in the circuit board to be processed based on the hole type of the current hole structure and the position of the intermediate layer connected by the copper-plated short posts in the current hole structure, to obtain the processing result of the current hole structure, includes: When the current hole structure to be processed is a through hole, the back drilling depth of the current hole structure is determined based on the position of the intermediate layer connected by the copper-plated short posts in the current hole structure in the circuit board to be processed, and the thickness of the circuit board to be processed. A first drilling is performed at the pad corresponding to the current hole structure to be processed to obtain a through hole corresponding to the current hole structure to be processed. Copper is electroplated on the inner wall of the through hole, and a second drilling is performed on the bottom layer of the circuit board to be processed along the central axis of the through hole based on the back drilling depth, to obtain the copper-plated short post corresponding to the current hole structure to be processed. Based on the through holes and copper-plated short posts corresponding to the current hole structure to be processed, the processing result of the current hole structure to be processed is obtained; The diameter of the second borehole is greater than the diameter of the first borehole.

6. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the circuit board manufacturing method as described in any one of claims 3 to 5.

7. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the circuit board manufacturing method as described in any one of claims 3 to 5.

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