A circuit board solder resist processing apparatus

Abstract

The application provides a circuit board solder mask processing equipment, which comprises a workbench, the top surface of the workbench is a groove structure, an oven is fixed on the top surface of the workbench, a heating plate is arranged in the oven, a support is fixed on the top surface of the workbench, a top plate is fixed between the top surface of the support and the top surface of the oven, a toothed plate is fixed on the top surface of the top plate, sliding rails are arranged on the two sides of the toothed plate, a fixed brush assembly and a coating assembly are arranged in the top plate, the coating assembly is preloaded with solder mask ink, the coating assembly is slidingly connected in the sliding rails, and a transfer assembly is slidingly arranged in the groove of the workbench. The lifting structure of the transfer assembly is lifted by the pushing and lifting assembly, the top surface of the circuit board is first extended to coat a layer of solder mask ink on the top surface of the circuit board, and when the circuit board is transferred into the oven, the lifting structure of the transfer assembly is completely lifted by the pushing and lifting assembly, the circuit board is completely extended for baking, the baking of the solder mask ink is accelerated, the operation is simple, and the efficiency of the circuit board solder mask processing is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board processing equipment, in particular to a circuit board solder mask processing equipment. BACKGROUND

[0002] The circuit board generally refers to a printed circuit board, and there are many types of circuit boards, such as ceramic circuit boards, circuit boards, PCB boards and aluminum substrates. The use of PCBs has been very widespread, involving most of the electrical equipment in the field. In the processing of PCBs, a solder mask layer needs to be coated on the circuit board, and the main function of the solder mask layer is to prevent solder overflow and cause short circuit of the circuit board, and also prevent water vapor erosion, copper oxidation and scratching, which plays an important role in the safety and stability of the circuit board.

[0003] In the processing of the solder mask layer on the circuit board, the circuit board is generally placed on a tray in the solder mask processing equipment, then the screen cover inside the equipment is placed on the circuit board, and then the solder mask ink is uniformly coated on the circuit board by using a brush, and then baking is performed, then a film is covered to cover the position where the window needs to be opened, and then it is transported to the inside of the exposure machine to be exposed to ultraviolet light to develop and solidify the solder mask ink on the circuit board, and finally the solder mask ink at the position where the window needs to be opened is cleaned.

[0004] In the above processing process, the circuit board is placed on the tray, in order to facilitate positioning and coating the solder mask ink on the circuit board, the circuit board is usually placed in the tray with a groove, only the top surface of the circuit board is extended out, although the circuit board can be positioned, when the circuit board is transferred for baking, only the uppermost solder mask layer conducts heat, and the periphery is blocked by the tray, resulting in poor heat conduction, reducing the baking efficiency and effect.

[0005] In summary, there is currently a need for a high-efficiency circuit board solder mask processing equipment. SUMMARY

[0006] In view of the deficiencies of the prior art, the present application provides a circuit board solder mask processing equipment to solve the problems mentioned in the background art.

[0007] To achieve the above purpose, the present application is realized by the following technical scheme:

[0008] The application discloses a circuit board solder mask processing equipment, which comprises a workbench, the top surface of the workbench is a groove structure, an oven is fixed on the top surface of the workbench, a heating plate is arranged in the oven, a support is fixed on the top surface of the workbench, a top plate is fixed between the top surface of the support and the top surface of the oven, a toothed plate is fixed on the top surface of the top plate, slide rails are arranged on the two sides of the toothed plate, a fixed brush assembly and a coating assembly are arranged in the top plate, the coating assembly is preloaded with solder mask ink, the coating assembly is slidably connected in the slide rails, a transfer assembly is slidably arranged in the groove of the workbench, the transfer assembly is used for transferring the circuit board by sliding in the groove of the workbench, a lifting structure is arranged in the transfer assembly and used for lifting and supporting the circuit board, a pushing and lifting assembly is arranged on the bottom surface of the groove of the workbench, the pushing and lifting assembly is arranged at the bottom of the transfer assembly, and the lifting structure of the transfer assembly is provided with three transfer states by being pushed by the pushing and lifting assembly.

[0009] The first transfer state is that the pushing and lifting assembly is arranged separately from the lifting structure of the transfer assembly, the lifting structure of the transfer assembly is not lifted, and the circuit board is accommodated in the transfer assembly.

[0010] The second transfer state is that the pushing and lifting assembly is slidably attached to the bottom of the lifting structure of the transfer assembly, the lifting structure of the transfer assembly is partially lifted, the top surface of the circuit board is extended out of the top of the transfer assembly, and the fixed brush assembly and the coating assembly cooperate to coat the solder mask ink on the top surface of the circuit board.

[0011] The third transfer state is that the pushing and lifting assembly is slidably attached to the bottom of the transfer assembly, the lifting structure of the transfer assembly is completely lifted, and the circuit board is completely extended out of the top of the transfer assembly, and the circuit board is moved to the bottom of the heating plate for heating by the transfer assembly.

[0012] Further, the transfer assembly comprises a transfer plate, a supporting plate and a first top block, the bottom surface of the transfer plate is a groove structure, the supporting plate is arranged in the transfer plate, the first top block is fixed on the bottom surface of the supporting plate and is composed of a lifting mechanism, the first top block penetrates the groove in the bottom surface of the transfer plate, a first insertion hole is formed in the top surface of the transfer plate, and the first insertion hole is used for positioning and connecting the fixed brush assembly in the second state.

[0013] Further, the transfer assembly further comprises a secondary plate and a plug rod, the plug rod is slidably inserted into the transfer plate, the secondary plate is fixed on the end of the plug rod away from the transfer plate, the secondary plate is arranged in close contact with the transfer plate in the first state and the second state, the secondary plate is arranged separately from the transfer plate in the third state, a second insertion hole is formed in the top surface of the secondary plate, and the second insertion hole is used for positioning and connecting the fixed brush assembly in the third state.

[0014] Further, the push-up assembly comprises a second top block, a connecting plate, a third top block, a push block and a second pneumatic rod, the connecting plate is attached to the bottom surface of the groove of the workbench, two connecting plates are arranged in parallel, the second top block and the third top block are fixed between the two connecting plates, the top ends of the second top block and the third top block are trapezoidal structures, the second top block is arranged at the bottom of the oven, the third top block is arranged at the bottom of the fixed brush assembly, the push block is fixed to the bottom surface of the second top block, the push block penetrates through the bottom of the workbench, the second pneumatic rod is fixed to the bottom surface of the workbench, and the telescopic end of the second pneumatic rod is connected to the side wall of the push block.

[0015] Further, the fixed brush assembly comprises a first pneumatic rod, a pressing plate, a first guide rod, a storage groove, a side plate, a fixed block, a fixed frame and a silk screen plate, the first pneumatic rod is arranged on the top surface of the top plate, the telescopic bottom end of the first pneumatic rod penetrates through the bottom surface of the top plate and is connected with the pressing plate, the storage groove is fixed to the side wall of the pressing plate, the fixed frame is connected to the side away from the pressing plate of the storage groove, the silk screen plate is arranged on the top surface of the fixed frame, two side plates are fixed perpendicularly to the side wall of the pressing plate, the fixed frame is arranged between the two side plates, and the fixed block is connected between the side wall of the side plate and the fixed frame.

[0016] Further, the bottom surface of the fixed frame is a chamfered structure.

[0017] Further, the bottom surface of the pressing plate is fixed with a positioning plug, the positioning plug is inserted into the first insertion hole in the second state, and the pressing plate is attached to the top surface of the transfer plate; the positioning plug is inserted into the second insertion hole in the third state, and the pressing plate is attached to the top surface of the auxiliary plate.

[0018] Further, the coating assembly comprises an ink storage box, a spring, a second guide rod, a sliding block, a sliding rod, a smearing brush, a gear and a motor, the ink storage box is fixed with a limiting block, the second guide rod penetrates through and is connected to the inside of the limiting block, the second guide rod is connected with the sliding block at the bottom end, the sliding block is slidingly inserted into the sliding rail, the top surface of the sliding block is rotatably provided with a roller, the roller is rollingly attached to the top surface of the sliding rail, the bottom surface of the ink storage box is connected with two sliding rods, the sliding rods penetrate through the inside of the top plate, the smearing brush is connected between the bottom ends of the two sliding rods, the gear is rotatably connected between the two sliding rods, the gear is meshingly connected to the top surface of the tooth plate, the motor is connected to one of the sliding rods penetrating through the side wall of the gear, and the motor is fixed to the side wall of the sliding rod.

[0019] This invention provides a circuit board solder resist layer processing device. Compared with the prior art, it has the following advantages: by placing the circuit board inside the transfer assembly for transfer, the circuit board can be positioned first. Then, during the sliding process of the transfer assembly inside the groove of the worktable, the lifting assembly pushes the lifting structure of the transfer assembly to rise, and the top surface of the circuit board extends first, so that a layer of solder resist ink can be applied to the top surface of the circuit board. Then, when the circuit board is transferred into the oven, the lifting assembly pushes the lifting structure of the transfer assembly to rise completely, and the circuit board extends completely for baking, which speeds up the baking of the solder resist ink and improves the efficiency of the circuit board solder resist layer processing. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A schematic diagram of the structure of a circuit board solder mask layer processing device according to the present invention is shown;

[0022] Figure 2 An exploded view of the overall structure of the present invention is shown;

[0023] Figure 3 A schematic diagram of the fixed brush assembly structure of the present invention is shown;

[0024] Figure 4 A schematic diagram of the coating assembly structure of the present invention is shown;

[0025] Figure 5 A cross-sectional view of the transfer component structure of the present invention is shown;

[0026] Figure 6 A schematic diagram of the connection structure between the worktable and the lifting assembly of the present invention is shown;

[0027] Figure 7 A cross-sectional view of the overall structure of the present invention in a first state is shown;

[0028] Figure 8 It shows Figure 7 Enlarged cross-sectional view of the structure at point A in the middle;

[0029] Figure 9 A cross-sectional view of the overall structure of the present invention in a second state after being coated with solder resist ink is shown;

[0030] Figure 10 It shows Figure 9 Enlarged cross-sectional view of the structure at point B in the middle section;

[0031] Figure 11 A third state structure cross-sectional view of the baking solder resist ink is shown;

[0032] As shown in the figure: 1, oven; 11, heating plate; 2, workbench; 21, support column; 3, transfer assembly; 31, transfer plate; 311, first jack; 32, insertion rod; 33, auxiliary plate; 331, second jack; 34, supporting plate; 35, first top block; 4, top plate; 41, toothed plate; 42, slide rail; 5, brush setting assembly; 51, first pneumatic rod; 52, pressing plate; 521, positioning plug; 53, first guide rod; 54, storage groove; 55, side plate; 56, fixing block; 57, fixing frame; 58, silk screen plate; 6, coating assembly; 61, ink storage box; 611, limiting block; 62, spring; 63, second guide rod; 64, sliding block; 641, roller; 65, sliding rod; 66, coating brush; 67, gear; 68, motor; 7, circuit board; 8, push-up assembly; 81, second top block; 82, connecting plate; 83, third top block; 84, push block; 85, second pneumatic rod. DETAILED DESCRIPTION

[0033] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application are described clearly and completely. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0034] Embodiment one

[0035] In order to solve the technical problems in the background art, the following circuit board solder resist layer processing equipment is given:

[0036] In combination with Figures 1-11As shown, the present application provides a kind of circuit board 7 solder mask processing equipment, including workbench 2, the top surface of workbench 2 is recess structure, workbench 2 top is fixed with oven 1, heating plate 11 is arranged in oven 1, workbench 2 top is fixed with support 21, support 21 top and oven 1 top are fixed with top plate 4, top plate 4 top is fixed with toothed plate 41, toothed plate 41 both sides are provided with slide rail 42, top plate 4 is internally provided with fixed brush assembly 5 and coating assembly 6, coating assembly 6 is preloaded with solder mask ink, coating assembly 6 is slidably connected in slide rail 42, the recess of workbench 2 is slidably provided with transfer assembly 3, transfer assembly 3 is transferred to circuit board 7 by sliding in the recess of workbench 2, transfer assembly 3 is provided with lifting structure and is used to lift support circuit board 7, the bottom surface of the recess of workbench 2 is provided with push lifting assembly 8, push lifting assembly 8 is arranged at the bottom of transfer assembly 3, and the lifting structure of transfer assembly 3 is provided with three transfer states by push lifting assembly 8:

[0037] The first transfer state: push lifting assembly 8 is arranged separately with the lifting structure of transfer assembly 3, the lifting structure of transfer assembly 3 is not raised, and circuit board 7 is received in transfer assembly 3;

[0038] The second transfer state: push lifting assembly 8 is slidably attached to the bottom of the lifting structure of transfer assembly 3, the lifting structure of transfer assembly 3 is partially raised, the top surface of circuit board 7 is extended outside the top of transfer assembly 3, and the fixed brush assembly 5 and the coating assembly 6 cooperate to coat solder mask ink on the top surface of circuit board 7;

[0039] The third transfer state: push lifting assembly 8 is slidably attached to the bottom of transfer assembly 3, the lifting structure of transfer assembly 3 is completely raised, and circuit board 7 is completely extended outside the top of transfer assembly 3, and circuit board 7 is moved to the bottom of heating plate 11 by transfer assembly 3 for heating;

[0040] By placing circuit board 7 in transfer assembly 3 for transfer, circuit board 7 can be positioned and placed first, then during the sliding process of transfer assembly 3 in the recess of workbench 2, the lifting structure of transfer assembly 3 is raised by push lifting assembly 8, the top surface of circuit board 7 is first extended, a layer of solder mask ink is coated on the top surface of circuit board 7, then when circuit board 7 is transferred to the inside of oven 1, the lifting structure of transfer assembly 3 is completely raised by push lifting assembly 8, circuit board 7 is completely extended for baking, the baking of solder mask ink is accelerated, and the efficiency of solder mask processing of circuit board 7 is improved.

[0041] In the embodiment, the transfer assembly 3 comprises a transfer plate 31, a supporting plate 34 and a first top block 35. The bottom surface of the transfer plate 31 is a groove structure. The supporting plate 34 is arranged in the transfer plate 31. The bottom surface of the supporting plate 34 is fixed with the first top block 35 which is a lifting mechanism. The first top block 35 penetrates the groove in the bottom surface of the transfer plate 31. The top surface of the transfer plate 31 is provided with a first insertion hole 311 which is used for positioning and connecting the fixing brush assembly 5 in the second state.

[0042] The first top block 35 is pushed to rise in the groove in the bottom surface of the transfer plate 31 so that the supporting plate 34 rises in the transfer plate 31. The adjustment operation is simple.

[0043] In the embodiment, the transfer assembly 3 further comprises a sub-plate 33 and a plug rod 32. The plug rod 32 is slidingly inserted into the transfer plate 31. The end of the plug rod 32 away from the transfer plate 31 is fixed with the sub-plate 33. The sub-plate 33 is arranged in close contact with the transfer plate 31 in the first state and the second state. The sub-plate 33 is arranged separately from the transfer plate 31 in the third state. The top surface of the sub-plate 33 is provided with a second insertion hole 331 which is used for positioning and connecting the fixing brush assembly 5 in the third state.

[0044] In the third state of the transfer of the circuit board 7 by the transfer plate 31, the sub-plate 33 is positioned by the fixing brush assembly 5 so as to limit the vertical direction of the transfer plate 31. The circuit board 7 can stably rise out of the transfer plate 31. The transfer plate 31 can further move into the oven 1 so as to ensure the baking efficiency of the circuit board 7.

[0045] In the embodiment, the push and lift assembly 8 comprises a second top block 81, a connecting plate 82, a third top block 83, a push block 84 and a second pneumatic rod 85. The connecting plate 82 is arranged in close contact with the groove bottom surface of the workbench 2. Two connecting plates 82 are arranged in parallel. The second top block 81 and the third top block 83 are fixed between the two connecting plates 82. The top ends of the second top block 81 and the third top block 83 are trapezoidal structures. The second top block 81 is arranged at the bottom of the oven 1. The third top block 83 is arranged at the bottom of the fixing brush assembly 5. The bottom surface of the second top block 81 is fixed with the push block 84 which is arranged at the bottom of the workbench 2. The second pneumatic rod 85 is fixed to the bottom surface of the workbench 2. The extension end of the second pneumatic rod 85 is connected to the side wall of the push block 84.

[0046] When the transfer plate 31 is at the bottom of the fixing brush assembly 5, the third top block 83 is pushed to the bottom of the first top block 35. When the transfer plate 31 moves into the oven 1, the second top block 81 is pushed so that the first top block 35 is completely inserted into the transfer plate 31. The operation is simple and convenient and ensures the flexibility of the movement of the transfer plate 31.

[0047] Embodiment Two

[0048] As Figures 1-4 andFigure 7 On the basis of the above-mentioned embodiments, the present embodiment further gives the following content:

[0049] In order to prevent the circuit board 7 from being unstable such as offset and vibration when the solder resist ink is coated on the circuit board 7, the following structure is adopted to solve the problem;

[0050] The brush fixing assembly 5 comprises a first pneumatic rod 51, a pressing plate 52, a first guide rod 53, a receiving groove 54, a side plate 55, a fixed block 56, a fixed frame 57 and a silk screen plate 58. The first pneumatic rod 51 is arranged on the top surface of the top plate 4. The bottom end of the first pneumatic rod 51 is connected with the pressing plate 52 and penetrates through the bottom surface of the top plate 4. The receiving groove 54 is fixed on the side wall of the pressing plate 52. The fixed frame 57 is connected with the side away from the pressing plate 52 of the receiving groove 54. The silk screen plate 58 is arranged on the top surface of the fixed frame 57. Two side plates 55 are vertically fixed on the side wall of the pressing plate 52. The fixed frame 57 is arranged between the two side plates 55. The fixed block 56 is connected between the side wall of the side plate 55 and the fixed frame 57.

[0051] The circuit board 7 is inserted into the fixed frame 57 until the silk screen plate 58 is attached to the top surface of the circuit board 7 by pushing the pressing plate 52 down by the first pneumatic rod 51, so that the circuit board 7 is positioned and the coating accuracy is ensured.

[0052] In the present embodiment, the inner wall bottom surface of the fixed frame 57 is a chamfer structure. When the circuit board 7 is inserted into the fixed frame 57, the circuit board 7 is adjusted along the chamfer structure to ensure the stability of the positioning and coating of the circuit board 7.

[0053] In the present embodiment, the bottom surface of the pressing plate 52 is fixed with a positioning plug 521. The positioning plug 521 is inserted into the first insertion hole 311 in the second state, and the pressing plate 52 is attached to the top surface of the transfer plate 31. The positioning plug 521 is inserted into the second insertion hole 331 in the third state, and the pressing plate 52 is attached to the top surface of the auxiliary plate 33.

[0054] In the second state and the third state, the pressing plate 52 is pressed on the top surface of the transfer plate 31 and the auxiliary plate 33 respectively, and the positioning plug 521 is inserted into the first insertion hole 311 or the second insertion hole 331, both of which are to limit the movement of the transfer plate 31 to ensure the stability and accuracy of the lifting and transfer of the circuit board 7 in the transfer plate 31.

[0055] In this embodiment, the coating assembly 6 includes an ink reservoir 61, a spring 62, a second guide rod 63, a slider 64, a slide bar 65, a coating brush 66, a gear 67, and a motor 68. A limit block 611 is fixed to the side wall of the ink reservoir 61. The second guide rod 63 is connected through the limit block 611. The bottom end of the second guide rod 63 is connected to the slider 64, which is slidably inserted into the slide rail 42. A roller 641 is rotatably mounted on the top surface of the slider 64, and the roller 641 rolls against the surface of the slide rail 42. Two slide rods 65 are connected to the top surface of the slide rail 42 and the bottom surface of the ink cartridge 61. The slide rods 65 pass through the interior of the top plate 4. A brush 66 is connected between the bottom ends of the two slide rods 65. A gear 67 is rotatably connected between the two slide rods 65. The gear 67 is meshed with the top surface of the gear plate 41. A motor 68 is connected to a slide rod 65 through one side of the gear 67. The motor 68 is fixed to the side wall of the slide rod 65. The ink cartridge 61, the slide rods 65 and the brush 66 are internally connected.

[0056] Working principle and usage process of this invention:

[0057] First press Figures 1-11 First, clean the dust off the surface of the circuit board 7. Place the circuit board 7 onto the tray 34 inside the transfer plate 31. Press the auxiliary plate 33 and the transfer plate 31 together. Then push the auxiliary plate 33 to allow the transfer plate 31 to enter the workbench 2 until the transfer plate 31 reaches the bottom of the fixed frame 57. Then activate the first pneumatic rod 51 to push the pressure plate 52 down to fit onto the transfer plate 31. Insert the positioning plug 521 into the first insertion hole 311. The fixed frame 57 fits onto the top surface of the transfer plate 31 along with the pressure plate 52.

[0058] As the pressure plate 52 descends, the storage tank 54 is pushed downward by the spring 62, which pushes the limiting block 611 downward, so that the application brush 66 always fits in the inside of the storage tank 54.

[0059] Then, the second pneumatic rod 85 is activated, pushing the push block 84. The connecting plate 82 slides on the bottom surface of the groove in the worktable 2, pushing the third top block 83 to the bottom surface of the first top block 35. The first top block 35 is pushed up by the third top block 83, causing the pallet 34 to rise inside the transfer plate 31, which in turn drives the circuit board 7 to rise. The circuit board 7 enters the fixed frame 57, and the top surface of the circuit board 7 is attached to the bottom surface of the screen plate 58.

[0060] The starting motor 68 drives the gear 67 to mesh on the toothed plate 41, which in turn drives the slide rod 65 to slide horizontally inside the top plate 4. This causes the coating brush 66 to slide out from inside the storage tank 54 and slide against the screen plate 58. During the sliding of the coating brush 66, the solder resist ink in the ink storage box 61 enters the coating brush 66 through the slide rod 65, and the coating brush 66 applies the solder resist ink to the screen plate 58 and the circuit board 7.

[0061] Then the first pneumatic rod 51 is started to pull the pressing plate 52 to rise, and then the sub-plate 33 is continuously pushed to make the transfer plate enter into the oven 1, until the sub-plate 33 reaches the bottom of the pressing plate 52, and then the first pneumatic rod 51 is started to press the pressing plate 52 tightly on the sub-plate 33, and the positioning plug 521 is inserted into the second positioning hole, the transfer plate 31 can only slide along the horizontal direction under the limitation of the slide rod 65, to prevent the transfer plate 31 from rising, and then the second pneumatic rod 85 is started to push the second top block 81 to move to the bottom surface of the transfer plate 31, the second top block 81 pushes the first top block 35 to completely rise into the inside of the transfer plate 31, the supporting plate 34 drives the circuit board 7 to rise and completely extend out of the inside of the transfer plate 31, and is close to the heating plate 11, the top surface and the surrounding of the circuit board 7 are heated by the heating plate 11 to bake the solder resist ink, then the transfer plate 31 is pushed, the inserting rod 32 slides in the inside of the transfer plate 31, to keep the transfer plate 31 moving and heating, and the processing of the solder resist layer on the circuit board 7 is completed;

[0062] Finally, the circuit board 7 extending out of the supporting plate 34 is taken off, the circuit board 7 can be taken out very conveniently for further processing, then the film is covered on the position needing to be windowed, and is transported into the inside of the exposure machine to be exposed by ultraviolet rays, to solidify the solder resist ink on the circuit board 7, and finally the solder resist ink of the position needing to be windowed is cleaned.

[0063] It should be noted that the relational terms herein such as first and second and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element preceded by "comprises... a" does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the recited element.

[0064] The above embodiments are only used to illustrate the technical solutions of the present application, rather than limit the present application; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements for some technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board solder resist layer processing equipment, characterized in that: The system includes a workbench with a recessed top surface. An oven is fixed to the top surface of the workbench, and a heating plate is installed inside the oven. A support column is fixed to the top surface of the workbench, and a top plate is fixed between the top surface of the support column and the top surface of the oven. A toothed plate is fixed to the top surface of the top plate, and slide rails are provided on both sides of the toothed plate. A fixed brush assembly and a coating assembly are installed through the top plate. The coating assembly is pre-filled with solder resist ink and is slidably connected to the slide rails. A transfer assembly is slidably installed inside the recess of the workbench. The transfer assembly is used to transfer circuit boards by sliding within the recess of the workbench. The transfer assembly has a lifting structure for lifting and supporting the circuit boards. A pushing assembly is provided on the bottom surface of the recess of the workbench and is located at the bottom of the transfer assembly. The lifting structure of the transfer assembly is pushed by the pushing assembly to achieve three transfer states: First transfer state: The lifting structure of the push component and the transfer component are separated, the lifting structure of the transfer component is not raised, and the circuit board is stored inside the transfer component; Second transfer state: The lifting component slides and fits against the bottom of the lifting structure of the transfer component, the lifting structure of the transfer component rises, the top surface of the circuit board extends out of the top of the transfer component, and the fixed brush component and the coating component work together to coat the top surface of the circuit board with solder resist ink. Third transfer state: The lifting component slides and fits against the bottom of the transfer component, the lifting structure of the transfer component rises completely, the circuit board extends completely out of the top of the transfer component, and the circuit board moves to the bottom of the heating plate for heating through the transfer component.

2. The circuit board solder mask layer processing equipment according to claim 1, characterized in that: The transfer assembly includes a transfer plate, a tray, and a first top block. The bottom surface of the transfer plate has a groove structure. The tray is fitted inside the transfer plate. The bottom surface of the tray is fixed with the first top block, which forms a lifting mechanism. The first top block passes through the groove on the bottom surface of the transfer plate. The top surface of the transfer plate has a first insertion hole, which is used for positioning and connecting the brush assembly in the second state.

3. The circuit board solder mask layer processing equipment according to claim 2, characterized in that: The transfer assembly also includes a sub-plate and a plug rod. The plug rod is slidably inserted into the interior of the transfer plate. The sub-plate is fixed at the end of the plug rod away from the transfer plate. The sub-plate is attached to the transfer plate in the first and second states. In the third state, the sub-plate is separated from the transfer plate. A second insertion hole is opened on the top surface of the sub-plate. The second insertion hole is used for positioning and connecting the brush assembly in the third state.

4. The circuit board solder mask layer processing equipment according to claim 1, characterized in that: The lifting assembly includes a second top block, a connecting plate, a third top block, a push block, and a second pneumatic rod. The connecting plate is attached to the bottom surface of the groove on the workbench. Two connecting plates are arranged in parallel. The second top block and the third top block are fixed between the two connecting plates. The tops of the second top block and the third top block are both trapezoidal structures. The second top block is located at the bottom of the oven, and the third top block is located at the bottom of the fixed brush assembly. The push block is fixed to the bottom surface of the second top block and extends through the bottom of the workbench. The second pneumatic rod is fixed to the bottom surface of the workbench, and the telescopic end of the second pneumatic rod is connected to the side wall of the push block.

5. The circuit board solder mask layer processing equipment according to claim 3, characterized in that: The fixed brush assembly includes a first pneumatic rod, a pressure plate, a first guide rod, a storage groove, a side plate, a fixing block, a fixing frame, and a wire mesh plate. The first pneumatic rod is disposed on the top surface of the top plate, and the telescopic bottom end of the first pneumatic rod passes through the bottom surface of the top plate and is connected to the pressure plate. The storage groove is fixed to the side wall of the pressure plate, and the fixing frame is connected to the side of the storage groove away from the pressure plate. The wire mesh plate is disposed on the top surface of the fixing frame. Two side plates are vertically fixed to the side wall of the pressure plate, and the fixing frame is disposed between the two side plates. A fixing block is connected between the side plates and the side wall of the fixing frame.

6. The circuit board solder mask layer processing equipment according to claim 5, characterized in that: The bottom surface of the inner wall of the fixed frame has a chamfered structure.

7. The circuit board solder mask layer processing equipment according to claim 5, characterized in that: A positioning plug is fixed to the bottom surface of the pressure plate. In the second state, the positioning plug is inserted into the first insertion hole, and the pressure plate is attached to the top surface of the transfer plate. In the third state, the positioning plug is inserted into the second insertion hole, and the pressure plate is attached to the top surface of the auxiliary plate.

8. The circuit board solder mask layer processing equipment according to claim 1, characterized in that: The coating assembly includes an ink reservoir, a spring, a second guide rod, a slider, a slide bar, an application brush, a gear, and a motor. A limit block is fixed to the side wall of the ink reservoir. The second guide rod passes through the limit block and is connected to the inside of the limit block. A slider is connected to the bottom end of the second guide rod and slides into the inside of the slide rail. A roller is rotatably mounted on the top surface of the slider and rolls against the top surface inside the slide rail. Two slide bars are connected to the bottom surface of the ink reservoir and pass through the inside of the top plate. An application brush is connected between the bottom ends of the two slide bars. A gear is rotatably connected between the two slide bars and meshes with the top surface of the gear plate. A motor is connected to a slide bar through one side of the gear and is fixed to the side wall of the slide bar. The ink reservoir, slide bars, and application brush are internally connected.

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