Sensing device
By setting a protruding elastic component in the sensing device to change the volume of the sensing cavity, the problem of insufficient sensitivity of the sensing device is solved, the sensitivity and stability are improved, adhesion is prevented, and the reliability of the sensing device is ensured.
Patent Information
- Application Number
- CN202180012406.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-07-16
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2041-07-16
AI Technical Summary
Insufficient sensitivity of the sensing device affects the user experience and is related to the volume of the sensing cavity and the amount of volume change.
An elastic component with a protruding structure is incorporated into the sensing device. When it moves, the volume of the sensing cavity changes, thereby improving sensitivity. The protruding structure abuts against the second sidewall of the sensing cavity to reduce the contact area, prevent adhesion, and improve stability.
By increasing the volume change of the sensing cavity, the sensitivity and stability of the sensing device are improved, adhesion is prevented, and the reliability of the sensing device is ensured.
Smart Images

Figure CN116210232B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of sensors, and in particular to a sensing device having a protruding structure on a thin film. Background Technology
[0002] Sensors are commonly used detection devices. They convert acquired sensing signals into electrical signals or other desired forms of information output through internal transducers. Sensitivity represents the ratio of the sensor's output signal strength to its input signal strength. If the sensitivity is too low, it will negatively impact the user experience. During operation, the sensitivity of a sensor is related to the volume of its sensing cavity and the amount of volume change.
[0003] This application provides a sensing device that not only improves reliability but also effectively enhances the sensitivity of the sensing device. Summary of the Invention
[0004] A sensing device includes: an elastic member; a sensing cavity, the elastic member forming a first sidewall of the sensing cavity; and a transducer for acquiring a sensing signal and converting it into an electrical signal, the transducer being in communication with the sensing cavity, the sensing signal being related to a volume change of the sensing cavity, wherein the elastic member has a protruding structure on one side facing the sensing cavity, the elastic member responding to an external signal causing the protruding structure to move, the movement of the protruding structure changing the volume of the sensing cavity.
[0005] In some embodiments, the protrusion abuts against a second sidewall of the sensing cavity, the second sidewall being opposite to the first sidewall.
[0006] In some embodiments, the protrusion structure is elastic, and when the protrusion structure moves, the protrusion structure undergoes elastic deformation, which reduces and changes the volume of the sensing cavity.
[0007] In some embodiments, the protrusions are arranged in an array on at least a portion of the surface of the elastic member.
[0008] In some embodiments, the protrusion structure is at least one of a pyramid shape, a hemispherical shape, or a striped shape.
[0009] In some embodiments, the spacing between adjacent protrusions is 1 μm-2000 μm.
[0010] In some embodiments, the spacing between adjacent protrusions is 10 μm-500 μm.
[0011] In some embodiments, the height of the protrusion structure is 1μm-1000μm.
[0012] In some embodiments, the height of the protrusion structure is 10μm-300μm.
[0013] In some embodiments, the elastic component includes an elastic film and an elastic microstructure layer, wherein the protrusion structure is disposed on the elastic microstructure layer.
[0014] In some embodiments, the elastic microstructure layer and the elastic film are made of the same material.
[0015] In some embodiments, the elastic microstructure layer and the elastic film are made of different materials.
[0016] In some embodiments, the thickness of the elastic film is 0.1 μm-500 μm.
[0017] In some embodiments, the thickness of the elastic film is 1 μm-200 μm.
[0018] In some embodiments, the difference between the height of the protrusion structure and the height of the sensing cavity is within 10%.
[0019] In some embodiments, the sensing device further includes: a mass element disposed on the other side surface of the elastic member, the mass element and the elastic member jointly responsive to an external signal to generate vibration; and a housing in which the elastic member, the mass element, the sensing cavity and the transducer are housed.
[0020] In some embodiments, the transducer is an acoustic transducer.
[0021] In some embodiments, the elastic member is disposed above the acoustic transducer, and the sensing cavity is formed between the elastic member and the acoustic transducer.
[0022] In some embodiments, the outer edge of the elastic member is fixedly connected to the acoustic transducer via a sealing member, and the elastic member, the sealing member, and the acoustic transducer together form the sensing cavity.
[0023] In some embodiments, the outer edge of the elastic member is fixedly connected to the housing, and the elastic member, the housing, and the acoustic transducer together form the sensing cavity.
[0024] In some embodiments, the thickness of the mass unit is 1 μm-1000 μm.
[0025] In some embodiments, the thickness of the mass element is 50 μm-500 μm.
[0026] In some embodiments, the resonant frequency of the resonant system formed by the mass element and the elastic member is 1500Hz-6000Hz.
[0027] In some embodiments, the resonant frequency of the resonant system formed by the mass element and the elastic component is 1500Hz-3000Hz.
[0028] In some embodiments, the sensing device further includes: another elastic member, symmetrically disposed on both sides of the mass unit, the other elastic member being fixedly connected to the housing.
[0029] A sensing element includes: an elastic member; and a first sensing cavity, the elastic member forming a first sidewall of the first sensing cavity, wherein a protrusion structure is provided on the side of the elastic member facing the first sensing cavity, the elastic member responding to an external signal causing the protrusion structure to move, the movement of the protrusion structure changing the volume of the first sensing cavity.
[0030] In some embodiments, the sensing element is configured to be attached to a transducer, the transducer and the elastic member being placed opposite each other to form a closed sensing cavity, the transducer converting the volume change of the closed sensing cavity into an electrical signal.
[0031] A vibration sensing device includes an elastic vibrating component comprising a diaphragm and an acoustic transducer forming an acoustic cavity between the acoustic transducer and the elastic diaphragm. The acoustic transducer is used to acquire a sensing signal and convert it into an electrical signal. The sensing signal is related to the volume change of the acoustic cavity. The diaphragm has a protruding structure on one side facing the acoustic cavity. The elastic vibrating component responds to an external signal to move the protruding structure, and the movement of the protruding structure changes the volume of the acoustic cavity.
[0032] A sensing element includes: an elastic member; and a sensing cavity, the elastic member forming a first sidewall of the sensing cavity, wherein the elastic member has an elastic protrusion structure on a side surface facing the sensing cavity, the elastic protrusion structure having a Young's modulus of 100 kPa-1 MPa, the elastic member responding to an external signal to cause at least one of movement and deformation of the protrusion structure, the movement and deformation of the protrusion structure changing the volume of the sensing cavity. Attached Figure Description
[0033] This application will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote similar structures, wherein:
[0034] Figure 1These are structural block diagrams of a sensing device according to some embodiments of this application;
[0035] Figure 2 These are schematic diagrams of sensing devices according to some embodiments of this application;
[0036] Figure 3A and Figure 3B This is a cross-sectional schematic diagram showing the protruding structure abutting against the second sidewall of the sensing cavity according to some embodiments of this application;
[0037] Figure 4 This is a schematic diagram of the protrusion structure shown in some embodiments of this application;
[0038] Figure 5 This is a schematic diagram of the protrusion structure shown in other embodiments of this application;
[0039] Figure 6 This is a schematic diagram of the protrusion structure shown in some embodiments of this application;
[0040] Figure 7 These are schematic diagrams of sensing devices according to other embodiments of this application;
[0041] Figure 8 These are schematic diagrams of sensing devices according to some embodiments of this application;
[0042] Figure 9 These are schematic diagrams of sensing devices according to some embodiments of this application;
[0043] Figure 10 This is a schematic diagram showing the connection between the sensing element and the housing according to some embodiments of this application;
[0044] Figure 11 This is a simplified mechanical model schematic diagram of a system composed of elastic components and mass units according to some embodiments of this application. Detailed Implementation
[0045] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this application. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. It should be understood that these exemplary embodiments are given merely to enable those skilled in the art to better understand and implement the present invention, and are not intended to limit the scope of the present invention in any way. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.
[0046] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not specifically singular and may include plural forms. Generally, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements. The term "based on" means "at least partially based on." The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment." Definitions of other terms will be given in the description below.
[0047] Some embodiments of this application relate to a sensing device. The sensing device may include an elastic member, a sensing cavity, and a transducer. The elastic member forms a first sidewall of the sensing cavity. The transducer communicates with the sensing cavity and is used to acquire a sensing signal and convert it into an electrical signal, the sensing signal being related to the volume change of the sensing cavity. The sensitivity of the sensing device increases as the volume of the sensing cavity decreases and as the volume change increases. A protrusion structure is provided on the side of the elastic member facing the sensing cavity. The protrusion structure can reduce the volume of the sensing cavity, thereby increasing the sensitivity of the sensing device. In some embodiments, the protrusion structure can be configured to abut against a second sidewall of the sensing cavity. When the sensing device is in operation, the elastic member causes the protrusion structure to vibrate and compress against the second sidewall of the sensing cavity, thereby generating elastic deformation. When the protrusion structure undergoes elastic deformation, it can increase the volume change of the sensing cavity, thereby improving the sensitivity of the sensing device. In addition, the presence of the protruding structure can effectively reduce the contact area between the elastic component and the second sidewall of the sensing cavity, thus preventing adhesion to the second sidewall constituting the sensing cavity and effectively improving the stability and reliability of the sensing device.
[0048] Figure 1This is a schematic diagram of a sensing device according to some embodiments of this application. The sensing device 10 can acquire external signals and generate desired signals (e.g., electrical signals) based on these external signals. The external signals may include mechanical vibration signals, acoustic signals, optical signals, electrical signals, etc. The type of sensing device 10 may include, but is not limited to, pressure sensing devices, vibration sensing devices, tactile sensing devices, etc. In some embodiments, the sensing device 10 can be applied to mobile devices, wearable devices, virtual reality devices, augmented reality devices, etc., or any combination thereof. In some embodiments, mobile devices may include smartphones, tablets, personal digital assistants (PDAs), gaming devices, navigation devices, etc., or any combination thereof. In some embodiments, wearable devices may include smart bracelets, headphones, hearing aids, smart helmets, smartwatches, smart clothing, smart backpacks, smart accessories, etc., or any combination thereof. In some embodiments, virtual reality devices and / or augmented reality devices may include virtual reality helmets, virtual reality glasses, virtual reality patches, augmented reality helmets, augmented reality glasses, augmented reality patches, etc., or any combination thereof. For example, virtual reality devices and / or augmented reality devices may include Google Glass, Oculus Rift, HoloLens, Gear VR, etc.
[0049] like Figure 1 As shown, the sensing device 10 may include an elastic member 20, a transducer 30, a housing 40, and a sensing cavity 50. The interior of the housing 40 may have an accommodating space for accommodating at least one component of the sensing device 10. For example, the housing 40 may accommodate the elastic member 20 and other components (e.g., Figure 2 The mass unit 260 and sealing member 270 are shown. In some embodiments, the housing 40 may be connected to other components of the sensing device 10 (e.g., elastic member 20, transducer member 30, etc.) to form the accommodating space. For example, in Figure 2 In the embodiment shown, the housing 240 can be connected to the transducer 230 to form the accommodating space 241.
[0050] In some embodiments, the housing 40 may be configured in different shapes. For example, the housing 40 may be configured as a cube, cuboid, approximately cuboid (e.g., a structure in which the eight corners of a cuboid are replaced with arcs), ellipsoid, sphere, or any other arbitrary shape.
[0051] In some embodiments, the housing 40 may be made of a material with a certain hardness or strength, thereby protecting the sensing device 10 and its internal components (e.g., the elastic member 20). In some embodiments, the materials used to manufacture the housing 40 include, but are not limited to, PCB boards (such as FR-1 phenolic paperboard, FR-2 phenolic paperboard, FR-3 epoxy paperboard, FR-4 epoxy glass cloth board, CEM-1 epoxy glass cloth-paper composite board, CEM-3 epoxy glass cloth-glass board, etc.), acrylonitrile butadiene styrene copolymer (ABS), polystyrene (PS), high impact polystyrene (HIPS), polypropylene (PP), polyethylene terephthalate (PET), polyester (PES), polycarbonate (PC), polyamides (PA), polyvinyl chloride (PVC), polyurethanes (PU), polyvinylidene chloride (PE), polyethylene (PE), and polymethyl methacrylate (PMMA). The materials used include methacrylate (PMMA), polyetheretherketone (PEEK), phenolic resin (PF), urea-formaldehyde resin (UF), melamine-formaldehyde resin (MF), and any combination of metals, alloys (such as aluminum alloys, chromium-molybdenum steel, scandium alloys, magnesium alloys, titanium alloys, magnesium-lithium alloys, nickel alloys, etc.), glass fiber, or carbon fiber. In some embodiments, the material used to make the shell 40 is any combination of glass fiber, carbon fiber, and polycarbonate (PC), polyamides (PA), etc. In some embodiments, the material used to make the shell 40 can be a mixture of carbon fiber and polycarbonate (PC) in a certain proportion. In some embodiments, the material used to make the shell 40 can be a mixture of carbon fiber, glass fiber, and polycarbonate (PC) in a certain proportion.In some embodiments, the material used to make the housing 40 may be a mixture of glass fiber and polycarbonate (PC) in a certain proportion, or a mixture of glass fiber and polyamides (PA) in a certain proportion.
[0052] A sensing cavity 50 is disposed inside the sensing device 10. The sensing cavity 50 can be correlated with the sensing signal acquired by the transducer 30. The sensing cavity 50 can be a closed or semi-closed chamber formed by one or more components of the sensing device 10. In some embodiments, the sensing cavity 50 can be a closed or semi-closed chamber formed by the elastic member 20 and other components. For example, the sensing cavity 50 can be a closed cavity formed by the elastic member 20, the transducer 30, and the housing 40. The sensing cavity 50 has a certain volume and can be filled with gas. The gas can be a stable gas (e.g., a gas that is not easily liquefied, combustible, or explosive). For example, the gas can include air, nitrogen, inert gas, etc.
[0053] When the sensing device 10 is in operation, the volume of the sensing cavity 50 changes. The sensing cavity 50 includes at least two opposing sidewalls. The two opposing sidewalls include a first sidewall and a second sidewall. When the sensing device 10 is in operation, the first sidewall (or a portion of its structure disposed thereon) and / or the second sidewall (or a portion of its structure disposed thereon) of the sensing cavity 50 undergo relative displacement, resulting in a change in the volume of the sensing cavity 50. In some embodiments, the first sidewall and / or the second sidewall may be constituted by one or more components of the sensing device 10. Exemplarily, the first sidewall may be constituted by an elastic member 20 or one or more of its elements / units. The second sidewall may be constituted by a transducer member 30 or one or more of its elements / units. For example, during the operation of the sensing device 10, the elastic component 20 constituting the first sidewall of the sensing cavity 50 (or the microstructure, such as the protrusion structure, disposed on the surface of the elastic component 20 facing the sensing cavity 50 (also called the inner surface)) and / or the transducer component 30 constituting the second sidewall of the sensing cavity 50 will undergo relative motion under the influence of external vibration signals (for example, relative motion is generated due to the inconsistent vibration response of the first sidewall and the second sidewall). The distance between the inner surfaces of the first sidewall and the second sidewall changes, thereby causing the volume of the sensing cavity 50 to change.
[0054] A transducer 30 is an element capable of acquiring a sensing signal and converting it into a desired signal. The sensing signal may include an acoustic signal. In some embodiments, the transducer 30 can convert the sensing signal into an electrical signal. For example, the transducer 30 can convert an acoustic signal (e.g., sound pressure) into an electrical signal. As another example, the transducer 30 can convert a mechanical vibration signal into an electrical signal. The transducer 30 can communicate with the sensing cavity 50 and acquire the sensing signal. For example, a surface of the transducer 30 or its element / unit (e.g., the element in the transducer 30 used to acquire the sensing signal) can serve as a second sidewall of the sensing cavity 50. In this case, the transducer 30 communicates with the interior of the sensing cavity 50 and acquires the sensing signal. The sensing signal may be related to one or more parameters of the sensing cavity 50. The one or more parameters may include cavity height, size, volume change, air pressure, etc. In some embodiments, the sensing signal may be related to the volume change of the sensing cavity 50. For example, when the volume of the sensing cavity 50 changes, the pressure of the gas (e.g., air) filling the sensing cavity 50 changes. The elements in the transducer 30 used to acquire the sensing signal can acquire the pressure change and generate a corresponding electrical signal. In some embodiments, the transducer 30 can be an acoustic transducer. For example, the transducer 30 can be an air conduction microphone (also known as an air-conducting microphone). The air-conducting microphone can acquire the sound pressure change in the sensing cavity 50 and convert it into an electrical signal.
[0055] The elastic member 20 can vibrate or elastically deform in response to an external signal (e.g., vibration). As previously described, the elastic member 20 can form the first sidewall of the sensing cavity 50. When the elastic member 20 vibrates or elastically deforms, the position of the inner surface of the first sidewall changes. In some embodiments, the position of the second sidewall of the sensing cavity 50 remains fixed or substantially fixed. In this case, the distance between the inner surface of the first sidewall and the inner surface of the second sidewall changes relative to each other, and the volume of the sensing cavity 50 changes (assuming the sidewalls between the first and second sidewalls remain relatively fixed). In some embodiments, the position of the second sidewall of the sensing cavity 50 also changes. For example, both the second and first sidewalls of the sensing cavity 50 vibrate. If the vibration phase of the second sidewall differs from that of the first sidewall, the distance between the inner surface of the first sidewall and the inner surface of the second sidewall changes relative to each other, and the volume of the sensing cavity 50 changes (assuming the sidewalls between the first and second sidewalls remain relatively fixed). As another example, both the second and first sidewalls of the sensing cavity 50 undergo elastic deformation. If the elastic deformation of the second sidewall is different from that of the first sidewall, the distance between the inner surface of the first sidewall and the inner surface of the second sidewall changes, and the volume of the sensing cavity 50 changes (assuming that the sidewalls between the first and second sidewalls remain relatively fixed).
[0056] Exemplarily, the elastic member 20 and the transducer 30, or their components / units (e.g., the element in the transducer 30 for acquiring the sensing signal), can respectively constitute the first and second sidewalls of the sensing cavity 50. The external signal is mechanical vibration. The mechanical vibration is transmitted to the transducer 30 and the elastic member 20 through the housing 40. In response to the mechanical vibration, both the transducer 30 and the elastic member 20 vibrate. Due to the different vibration phases of the transducer 30 and the elastic member 20, the distance between the inner surfaces of the first and second sidewalls changes, and the volume of the sensing cavity 50 changes.
[0057] In some embodiments, a protrusion structure 23 may be provided on the inner surface of the elastic member 20 (i.e., the surface facing the sensing cavity 50). Figure 2 (The raised structure 223 is shown). The raised structure 23 may be disposed on at least a portion of the inner surface of the elastic member 20. In some embodiments, the raised structure 23 may be disposed on all areas of the inner surface of the elastic member 20. In some embodiments, the raised structure 23 may be disposed only on a portion of the inner surface of the elastic member 20. In some embodiments, the ratio of the area of the inner surface occupied by the raised structure 23 to the area of the inner surface of the elastic member 20 may be less than three-quarters. In some embodiments, the ratio of the area of the inner surface occupied by the raised structure 23 to the area of the inner surface of the elastic member 20 may be less than two-thirds. In some embodiments, the ratio of the area of the inner surface occupied by the raised structure 23 to the area of the inner surface of the elastic member 20 may be less than one-half. In some embodiments, the ratio of the area of the inner surface occupied by the raised structure 23 to the area of the inner surface of the elastic member 20 may be less than one-third. In some embodiments, the ratio of the area of the inner surface occupied by the raised structure 23 to the area of the inner surface of the elastic member 20 may be less than one-quarter. In some embodiments, the ratio of the area of the inner surface occupied by the raised structure 23 to the area of the inner surface of the elastic member 20 may be less than one-fifth. In some embodiments, the ratio of the area occupied by the protrusion 23 to the area of the inner surface of the elastic member 20 is less than one-sixth. For example, the inner surface of the elastic member 20 can be divided into a central portion and a peripheral portion. The protrusion 23 can be provided on the peripheral portion, while the central portion does not have the protrusion 23. The ratio of the area of the inner surface occupied by the peripheral portion to the area of the inner surface of the elastic member 20 can be less than three-quarters, two-thirds, one-half, one-third, one-quarter, one-fifth, one-sixth, etc.
[0058] The protruding structures 23 can be uniformly or non-uniformly disposed on the inner surface of the elastic member 20. In some embodiments, the protruding structures 23 can be arranged in an array on the inner surface of the elastic member 20. For example, adjacent protruding structures 23 are disposed at equal intervals on the inner surface of the elastic member 20. In some embodiments, the distribution of the protruding structures 23 on the inner surface of the elastic member 20 can be non-uniform. For example, the spacing between adjacent protruding structures 23 varies with the location of the protruding structures 23.
[0059] The protruding structure 23 may have a specific shape. In some embodiments, the specific shape includes regular shapes such as pyramid shape, hemispherical shape, striped shape, truncated pyramid shape, and cylindrical shape. In some embodiments, the specific shape may be any irregular shape.
[0060] For conventional elastic components excluding the protrusion structure 23, which serve as the first sidewall of the sensing cavity 50, during vibration, they may adhere to the second sidewall of the sensing cavity 50 (e.g., the transducer component 30) due to the large vibration amplitude, causing the sensing device 10 to malfunction. The presence of the protrusion structure 23 can effectively reduce the contact area between the elastic component 20 and the second sidewall of the sensing cavity 50, thus preventing adhesion to the second sidewall constituting the sensing cavity 50 and effectively improving the stability and reliability of the sensing device 10.
[0061] The protruding structure 23 can affect the sensitivity of the sensing device 10. Sensitivity is an important indicator reflecting the performance of the sensing device 10. Sensitivity can be understood as the magnitude of the response of the sensing device 10 to a specific external signal during operation. For the sensing device 10, the transducer 30 is connected to the sensing cavity 50. The sensing signal acquired by the transducer 30 is related to the volume change of the sensing cavity 50. The sensitivity of the sensing device 10 is related to the size and / or volume change of the sensing cavity 50. For the same external signal, the greater the volume change of the sensing cavity 50, the greater the response of the sensing device 10, and correspondingly, the higher the sensitivity of the sensing device 10; the smaller the volume of the sensing cavity 50, the greater the response of the sensing device 10, and correspondingly, the higher the sensitivity of the sensing device 10. Therefore, by changing the volume of the sensing cavity 50 and / or the amount of volume change of the sensing cavity 50 during the operation of the sensing device 10, the sensitivity of the sensing device 10 can be changed. Because the protruding structure 23 protrudes into the interior of the sensing cavity 50 and occupies part of the volume of the sensing cavity 50, the volume of the sensing cavity 50 is smaller than that of the elastic member 20 without the protruding structure 23, thus making the sensing device 10 more sensitive.
[0062] In some embodiments, the protruding structure 23 may have a certain degree of elasticity. Because the protruding structure 23 is elastic, it will undergo elastic deformation when subjected to external pressure. In some embodiments, the protruding structure 23 may abut against the second sidewall of the sensing cavity 50 (e.g., the surface of the transducer 30 or one or more of its components). When the protruding structure 23 abuts against the second sidewall of the sensing cavity 50, the vibration of the elastic component 20 will cause the protruding structure 23 to move. At this time, the protruding structure 23 is compressed against the second sidewall of the sensing cavity 50, causing the protruding structure 23 to undergo elastic deformation. This elastic deformation allows the protruding structure 23 to protrude further into the sensing cavity 50, reducing the volume of the sensing cavity 50. Therefore, the volume change of the sensing cavity 50 can be further increased, thereby improving the sensitivity of the sensing device 10. More details about the protruding structure and how the protruding structure improves the sensitivity of the sensing device can be found in [link to relevant documentation]. Figures 2 to 6 Specific implementation details are omitted here.
[0063] In some embodiments, the elastic member 20 may include an elastic film 21. A protrusion 23 may be disposed on the surface (i.e., the inner surface) of the elastic film 21 facing the sensing cavity 50. In some embodiments, the material used to fabricate the elastic film 21 may include polymers such as polyimide (PI), polydimethylsiloxane (PDMS), and polytetrafluoroethylene (PTFE). Further details regarding the elastic film can be found in [link to relevant documentation]. Figure 2 and Figure 7 The specific implementation examples are not described here.
[0064] The above description of the sensing device 10 is merely a specific example and should not be considered as the only feasible implementation. Obviously, those skilled in the art, after understanding the basic principles of the sensing device 10, may make various modifications and changes in form and detail to the specific manner and steps of implementing the sensing device 10 without departing from these principles; however, these modifications and changes remain within the scope of the above description. In some embodiments, the sensing device 10 may include one or more other components, such as a mass unit (e.g., Figure 2 The mass unit 260 shown), sealing unit (such as...) Figure 2 (e.g., the sealing component 270 shown) or any combination thereof. In some embodiments, multiple components of the sensing device 10 may be combined into a single component. For example, a mass element may be integrated onto an elastic component 20, together with the elastic component 20 forming a resonant system. The resonant system vibrates in response to an external signal. In some embodiments, a component of the sensing device 10 may be divided into one or more sub-components. For example, the elastic component 20 may be divided into an elastic film (e.g., a sealing component 270 shown) or any combination thereof. Figure 7 The elastic thin film 721 shown) and the elastic microstructure layer (such as) Figure 7 The elastic microstructure layer 725 is shown. The protrusion structure 23 is disposed on the elastic microstructure layer.
[0065] Figure 2 This is a schematic diagram of a sensing device according to some embodiments of this application. In this embodiment, the sensing device 210 can be a vibration sensing device. The vibration sensing device can collect vibration signals and convert them into electrical signals. For example, the sensing device 210 can be part of a microphone, such as a bone conduction microphone (also known as a bone conduction microphone). The bone conduction microphone can convert vibration signals into speech signals, for example, collecting vibration signals generated by facial muscles when a user speaks and converting the vibration signals into electrical signals containing speech information.
[0066] like Figure 2 As shown, the sensing device 210 may include an elastic member 220, a transducer 230, a housing 240, a mass unit 260, and a sealing member 270. The housing 240 may have a receiving space 241 for accommodating one or more components of the sensing device 210 (e.g., the elastic member 220, the mass unit 260, and the sealing member 270). In some embodiments, the housing 240 is a semi-enclosed housing, forming the receiving space 241 by connecting with the transducer 230. For example, the housing 240 covers the transducer 230 to form the receiving space 241.
[0067] In some embodiments, Figure 2 The sensing device 210 shown can be used as a vibration sensing device in the field of microphones, such as bone conduction microphones. For example, when applied to a bone conduction microphone, the sensing cavity 250 can also be called an acoustic cavity, and the transducer 230 can be an acoustic transducer. The acoustic transducer acquires the sound pressure changes of the acoustic cavity and converts them into electrical signals. In some embodiments, the elastic member 220 is disposed above the acoustic transducer (i.e., the transducer 230), and the sensing cavity 250 is formed between the elastic member 220 and the acoustic transducer.
[0068] The elastic component 220 may include an elastic membrane 221. A protrusion 223 is provided on the surface (also called the inner surface) of the elastic membrane 221 near the transducer 230. The protrusion 223 and the elastic membrane 221 (forming the first sidewall of the sensing cavity 250) can together with the transducer 230 (forming the second sidewall of the sensing cavity 250) to form the sensing cavity 250. For vibration sensing devices, the sensing cavity 250 may also be referred to as an acoustic cavity. The elastic membrane 221 may also be referred to as a diaphragm.
[0069] like Figure 2As shown, the outer edge of the elastic film 221 can be physically connected to the transducer 230. This physical connection can include bonding, nailing, snapping, and connection via additional connecting components (e.g., sealing component 270). For example, the outer edge of the elastic film 221 can be bonded to the transducer 230 with an adhesive to form the sensing cavity 250. However, adhesive bonding has poor sealing performance, which reduces the sensitivity of the sensing device 210 to some extent. In some embodiments, the top end of the protrusion 223 abuts against the surface of the transducer 230. The top end refers to the end of the protrusion 223 away from the elastic film 221. The connection between the top end of the protrusion 223, located around the elastic film 221, and the surface of the transducer 230 can be sealed by the sealing component 270, so that the protrusion 223, the elastic film 221, the sealing component 270, and the transducer 230 together form a closed sensing cavity 250. It is understood that the location of the sealing component 270 is not limited to the above description. In some embodiments, the sealing member 270 may not be limited to the connection between the top of the protrusion 223 and the surface of the transducer 230, but may also be disposed on the outer side of the protrusion 223 forming the sensing cavity 250 (i.e., the side of the protrusion 223 away from the sensing cavity 250). In some embodiments, to further improve sealing, a sealing structure may also be provided inside the sensing cavity 250. By sealing the connection between the elastic member 220 and the transducer 230 with the sealing member 270, the sealing performance of the entire sensing cavity 250 can be guaranteed, thereby effectively improving the reliability and stability of the sensing device 210. In some embodiments, the sealing member 270 may be made of materials such as silicone or rubber to further improve the sealing performance of the sealing member 270. In some embodiments, the type of sealing member 270 may include one or more of sealing rings, sealing gaskets, and sealing strips.
[0070] In some embodiments, the elastic film 221 may have a certain thickness, which refers to the dimension of the elastic film 221 in the first direction. For ease of understanding, the thickness of the elastic film 221 can be defined by... Figure 2 H3 in the figure represents the thickness of the elastic film 221. In some embodiments, the thickness H3 of the elastic film 221 can be in the range of 0.1 μm to 500 μm. In some embodiments, the thickness H3 of the elastic film 221 can be in the range of 0.2 μm to 400 μm. In some embodiments, the thickness H3 of the elastic film 221 can be in the range of 0.4 μm to 350 μm. In some embodiments, the thickness H3 of the elastic film 221 can be in the range of 0.6 μm to 300 μm. In some embodiments, the thickness H3 of the elastic film 221 can be in the range of 0.8 μm to 250 μm. In some embodiments, the thickness H3 of the elastic film can be in the range of 1 μm to 200 μm.
[0071] The mass element 260 can be connected to the elastic member 220 and located on the side of the elastic member 220 away from the sensing cavity 250. For example, the mass element 260 can be disposed on the elastic diaphragm 221, located on the side away from the sensing cavity 250. In response to the vibration of the housing 240 and / or the transducer 230, the mass element 260 and the elastic member 220 can together form a resonant system to generate vibration. The mass element 260 has a certain mass, thus increasing the vibration amplitude of the elastic member 220 relative to the housing 240, so that the volume change of the sensing cavity 250 can change significantly under the action of external vibrations of different intensities, thereby improving the sensitivity of the sensing device 210.
[0072] In some embodiments, the mass unit 260 can be a regular structure such as a cylinder, cube, or cuboid, or other irregular structures. Figure 2 As shown, the mass element 260 can be a cylindrical structure.
[0073] In some embodiments, the mass unit 260 may be made of a high-density material. Exemplarily, the mass unit 260 may be made of materials such as copper, iron, stainless steel, lead, tungsten, or molybdenum. In some embodiments, copper may be used to make the mass unit 260. In some embodiments, the mass unit 260 may be made of a material with a certain degree of elasticity. In some embodiments, the mass unit 260 made of the aforementioned elastic material may be disposed on the side of the elastic member 220 facing the transducer member 230. For example, a protrusion structure 223 may be directly disposed on the surface of the mass unit 260 facing the transducer member 230 (e.g., processed by cutting, injection molding, bonding, etc.). Since the mass unit 260 itself is elastic, the protrusion structure 223 disposed on the mass unit 260 also possesses elasticity. In this embodiment, the mass unit 260 can reduce the volume of the sensing cavity 250, thereby improving the sensitivity of the sensing device 210 to some extent. In some embodiments, the top end of the protrusion structure 223 disposed on the mass unit 260 may abut against the surface of the transducer member 230.
[0074] In some embodiments, the Young's modulus of the elastic film 221 and the Young's modulus of the mass unit 260 may have different values for different types and / or sizes of sensing devices 210. In some embodiments, the Young's modulus of the elastic film 221 may be less than 500 MPa. In some embodiments, the Young's modulus of the elastic film 221 may be less than 300 MPa. In some embodiments, the Young's modulus of the elastic film 221 may be less than 200 MPa. In some embodiments, the Young's modulus of the elastic film 221 may be less than 100 MPa. In some embodiments, the Young's modulus of the elastic film 221 may be less than 80 MPa. In some embodiments, the Young's modulus of the elastic film 221 may be less than 60 MPa. In some embodiments, the Young's modulus of the elastic film 221 may be less than 40 MPa. In some embodiments, the Young's modulus of the mass unit 260 may be greater than 10 GPa. In some embodiments, the Young's modulus of the mass unit 260 may be greater than 50 GPa. In some embodiments, the Young's modulus of the mass unit 260 may be greater than 80 GPa. In some embodiments, the Young's modulus of mass unit 260 may be greater than 100 GPa. In some embodiments, the Young's modulus of mass unit 260 may be greater than 200 GPa. In some embodiments, the Young's modulus of mass unit 260 may be greater than 500 GPa. In some embodiments, the Young's modulus of mass unit 260 may be greater than 1000 GPa.
[0075] In some embodiments, the mass unit 260 has a certain thickness. The thickness of the mass unit can refer to the dimension of the mass unit 260 in the first direction. For ease of understanding, the thickness of the mass unit 260 can be described by... Figure 2 H4 in the figure represents the thickness of the mass unit 260. In some embodiments, the thickness H4 of the mass unit 260 is in the range of 1 μm to 1000 μm. In some embodiments, the thickness H4 of the mass unit 260 is in the range of 10 μm to 900 μm. In some embodiments, the thickness H4 of the mass unit 260 is in the range of 20 μm to 800 μm. In some embodiments, the thickness H4 of the mass unit 260 is in the range of 30 μm to 700 μm. In some embodiments, the thickness H4 of the mass unit 260 is in the range of 40 μm to 600 μm. In some embodiments, the thickness H4 of the mass unit 260 is in the range of 50 μm to 500 μm.
[0076] For sensing devices 210 of different types and / or sizes, the ratio or difference between the thickness H4 of the mass unit 260 and the thickness H3 of the elastic film 221 is within a certain range. In some embodiments, the ratio of the thickness H4 of the mass unit 260 to the thickness H3 of the elastic film 221 is in the range of 1-100000. In some embodiments, the ratio of the thickness H4 of the mass unit 260 to the thickness H3 of the elastic film 221 is in the range of 1-50000. In some embodiments, the ratio of the thickness H4 of the mass unit 260 to the thickness H3 of the elastic film 221 is in the range of 10-10000. In some embodiments, the ratio of the thickness H4 of the mass unit 260 to the thickness H3 of the elastic film 221 is in the range of 100-5000. In some embodiments, the ratio of the thickness H4 of the mass unit 260 to the thickness H3 of the elastic film 221 is in the range of 100-1000. In some embodiments, the ratio of the thickness H4 of the mass unit 260 to the thickness H3 of the elastic film 221 is in the range of 100-5000. In some embodiments, the ratio of the thickness H4 of the mass unit 260 to the thickness H3 of the elastic film 221 is in the range of 500-2000.
[0077] In some embodiments, the mass unit 260 may be located in the middle of the elastic member 220 (e.g., the elastic film 221). The middle portion refers to the central part of the elastic member 220 in the second direction. For example, the elastic film 221 is circular, and the mass unit 260 has a cylindrical structure. The mass unit 260 may be disposed in the central portion of the elastic film 221. In some embodiments, the distance between the axis of the mass unit 260 and the center point of the elastic film 221 in the second direction may be less than a threshold distance. The threshold distance may be 50 μm, 0.1 mm, 0.5 mm, 1 mm, 2 mm, etc. In some embodiments, the center point of the elastic film 221 is on the axis of the mass unit 260. By disposing the mass unit 260 in the middle of the elastic film 221, the displacement of the mass unit 260 in the second direction can be reduced, thereby improving the sensitivity of the sensing device 210.
[0078] like Figure 2As shown, the projected area of the mass unit 260 in the first direction may be smaller than the projected area of the elastic member 220 in the first direction. For sensing devices 210 of different types and / or sizes, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the elastic member 220 in the first direction may be within a certain range. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the elastic member 220 in the first direction may be in the range of 0.05-0.95. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the elastic member 220 in the first direction may be in the range of 0.1-0.9. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the elastic member 220 in the first direction may be in the range of 0.2-0.9. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the elastic member 220 in the first direction may be in the range of 0.3-0.8. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the elastic member 220 in the first direction may be in the range of 0.4-0.7. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the elastic member 220 in the first direction may be in the range of 0.5-0.6.
[0079] For sensing devices 210 of different types and / or sizes, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction can be within a certain range. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction can be in the range of 0.05-0.95. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction can be in the range of 0.1-0.9. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction can be in the range of 0.2-0.9. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction can be in the range of 0.3-0.8. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction can be in the range of 0.4-0.7. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction may be in the range of 0.5-0.6.
[0080] In this embodiment, the elastic component 220 (e.g., elastic film 221) is more prone to elastic deformation than the housing 240, allowing the elastic component 220 to move relative to the housing 240. When external vibrations act on the housing 240, the housing 240, transducer 230, elastic component 220, and other components will all vibrate. Since the vibration phase of the elastic component 220 is different from that of the transducer 230, it can cause a change in the volume of the sensing cavity 250 (i.e., the acoustic cavity), resulting in a change in the sound pressure of the acoustic cavity. The transducer 230 converts this change into an electrical signal, thus achieving the pickup of bone conduction sound.
[0081] For ease of understanding, the structure consisting of the elastic component 220 (including the elastic membrane 221 and the protruding structure 223) and the mass unit 260 can be simplified and equated to the following: Figure 11 The mass-spring-damped system model shown has an elastic component 220 providing spring and damping action, and a mass element 260 providing mass action. When the system is in operation, it can be considered that the mass-spring-damped system model undergoes forced motion under the action of excitation force, and its vibration law conforms to the law of mass-spring-damped systems. Specifically, the motion of the system can be described by the differential equation of equation (1):
[0082]
[0083] Where M is the mass of the system, R is the damping of the system, K is the elastic coefficient of the system, F is the amplitude of the driving force, x is the displacement of the system, and ω is the angular frequency of the driving force. Based on formula (1), the steady-state displacement can be obtained as follows:
[0084] x = x a cos(ωt-θ) (2)
[0085] in,
[0086] Furthermore, based on equations (1) and (2), the normalized equation for the displacement amplitude ratio can be obtained:
[0087]
[0088] Where f can represent the system frequency, and f0 represents the system's resonant frequency. Q M It can represent the mechanical quality factor. It can represent the static displacement amplitude (or the displacement amplitude when ω = 0).
[0089] When the mass unit 260 vibrates under the excitation of an external vibration signal, it causes the volume V0 of the sensing cavity 250 to compress or expand. The volume change of the sensing cavity 250 during compression or expansion is ΔV. The sensitivity of the sensing device 210... That is, the sensitivity S of the sensing device 210 is directly proportional to the volume change ΔV of the sensing cavity 250 and inversely proportional to the volume V0 of the sensing cavity 250. Based on the above principle, in some embodiments, the sensitivity of the sensing device 210 can be improved by increasing the volume change ΔV of the sensing cavity 250 and / or by decreasing the volume V0 of the sensing cavity 250.
[0090] In some embodiments, the sensing cavity 250 is composed of an elastic member 220, a transducer 230, and other components. For example, the sensing cavity 250 is composed of an elastic member 220, a transducer 230, and a sealing member 270. In the above embodiments, the elastic member (e.g., the elastic film 221 and the protrusion structure 223) and the transducer (e.g., the transducer 230) serve as the first sidewall and the second sidewall of the sensing cavity 250, respectively. Therefore, the structure of the elastic member 220 and the transducer 230 will affect the volume V0 of the sensing cavity 250 of the sensing device 210 and the volume change ΔV of the sensing cavity 250 when the sensing device 210 is working. For the elastic member 220, since the protrusion structure 223 is provided on the inner surface of the elastic film 221 and the protrusion structure 223 protrudes into the sensing cavity 250, the volume V0 of the sensing cavity 250 is reduced, thereby improving the sensitivity of the sensing device 210.
[0091] In some embodiments, the volume V0 of the sensing cavity 250 is related to the density of the protrusions 223 constituting the sensing cavity 250. It is understood that the smaller the spacing between adjacent protrusions 223, the greater the density of the protrusions 223, and therefore the smaller the volume V0 of the sensing cavity 250 formed by the protrusions 223. The spacing between adjacent protrusions 223 can refer to the distance between the centers of adjacent protrusions 223. Here, the center can be understood as the centroid on the cross-section of the protrusion 223. For ease of explanation, the spacing between adjacent protrusions 223 can be defined as... Figure 2 L1 represents the distance between the tips or centers of adjacent protrusions. In some embodiments, the interval L1 between adjacent protrusions 223 can be in the range of 1 μm to 2000 μm. In some embodiments, the interval L1 between adjacent protrusions 223 can be in the range of 4 μm to 1500 μm. In some embodiments, the interval L1 between adjacent protrusions 223 can be in the range of 8 μm to 1000 μm. In some embodiments, the interval L1 between adjacent protrusions 223 can be in the range of 10 μm to 500 μm.
[0092] In some embodiments, the volume V0 of the sensing cavity 250 is related to the width of the protrusion structure 223. The width of the protrusion structure 223 can be understood as the dimension of the protrusion structure 223 in the second direction. For ease of explanation, the dimension of the protrusion structure 223 in the second direction can be described by... Figure 2 The width L2 is denoted by L2. In some embodiments, the width L2 of a single protrusion structure 223 can be in the range of 1 μm to 1000 μm. In some embodiments, the width L2 of a single protrusion structure 223 can be in the range of 2 μm to 800 μm. In some embodiments, the width L2 of a single protrusion structure 223 can be in the range of 3 μm to 600 μm. In some embodiments, the width L2 of a single protrusion structure 223 can be in the range of 6 μm to 400 μm. In some embodiments, the width of a single protrusion structure 223 can be in the range of 10 μm to 300 μm.
[0093] For sensing devices 210 of different types and / or sizes, the ratio of the width L2 of the protrusion 223 to the spacing L1 between adjacent protrusions 223 is within a certain range. In some embodiments, the ratio of the width L2 of the protrusion 223 to the spacing L1 between adjacent protrusions 223 is in the range of 0.05-20. In some embodiments, the ratio of the width L2 of the protrusion 223 to the spacing L1 between adjacent protrusions 223 is in the range of 0.1-20. In some embodiments, the ratio of the width L2 of the protrusion 223 to the spacing L1 between adjacent protrusions 223 is in the range of 0.1-10. In some embodiments, the ratio of the width L2 of the protrusion 223 to the spacing L1 between adjacent protrusions 223 is in the range of 0.5-8. In some embodiments, the ratio of the width L2 of the protrusion 223 to the spacing L1 between adjacent protrusions 223 is in the range of 1-6. In some embodiments, the ratio of the width L2 of the protrusion 223 to the spacing L1 between adjacent protrusions 223 is in the range of 2-4.
[0094] In some embodiments, the volume V0 of the sensing cavity 250 is related to the height H1 of the protrusion structure 223. The height of the protrusion structure 223 can be understood as the dimension of the protrusion structure 223 in the first direction when it is in its natural state (e.g., when the protrusion structure 223 is not subjected to compression and undergoes elastic deformation). For ease of explanation, the dimension of the protrusion structure 223 in the first direction can be described by... Figure 2H1 represents the height of the protrusion 223. In some embodiments, the height H1 of the protrusion 223 can be in the range of 1 μm to 1000 μm. In some embodiments, the height H1 of the protrusion 223 can be in the range of 2 μm to 800 μm. In some embodiments, the height H1 of the protrusion 223 can be in the range of 4 μm to 600 μm. In some embodiments, the height H1 of the protrusion 223 can be in the range of 6 μm to 500 μm. In some embodiments, the height H1 of the protrusion 223 can be in the range of 8 μm to 400 μm. In some embodiments, the height H1 of the protrusion 223 can be in the range of 10 μm to 300 μm.
[0095] In some embodiments, the difference between the height of the sensing cavity 250 and the height of the protrusion 223 is within a certain range. For example, at least part of the protrusion 223 may not contact the transducer 230. In this case, there is a certain gap between the protrusion 223 and the surface of the transducer 230. The gap between the protrusion 223 and the surface of the transducer 230 refers to the distance between the top of the protrusion 223 and the surface of the transducer 230. This gap can be formed during the processing of the protrusion 223 or the installation of the elastic member 220. The height of the sensing cavity 250 can be understood as the dimension of the sensing cavity 250 in a first direction in its natural state (e.g., when its first and second sidewalls do not vibrate or elastically deform). For ease of explanation, the dimension of the sensing cavity 250 in the first direction can be... Figure 2 H2 represents the height of the protrusion 223. In some embodiments, the difference between the height H1 of the protrusion 223 and the height H2 of the sensing cavity 250 may be within 20%. In some embodiments, the difference between the height H1 of the protrusion 223 and the height H2 of the sensing cavity 250 may be within 15%. In some embodiments, the difference between the height H1 of the protrusion 223 and the height H2 of the sensing cavity 250 may be within 10%. In some embodiments, the difference between the height H1 of the protrusion 223 and the height H2 of the sensing cavity 250 may be within 5%. In some embodiments, the gap between the protrusion 223 and the surface of the transducer 230 may be within 10 μm. In some embodiments, the gap between the protrusion 223 and the surface of the transducer 230 may be within 5 μm. In some embodiments, the gap between the protrusion 223 and the surface of the transducer 230 may be within 1 μm.
[0096] During the operation of the sensing device 210, after receiving an external signal (e.g., a vibration signal), the elastic component 220 will vibrate or undergo elastic deformation, causing the protruding structure 223 to move along... Figure 2The movement in the first direction causes the sensing cavity 250 to contract or expand, and the resulting volume change of the sensing cavity 250 can be expressed as ΔV1. Since the movement amplitude of the elastic member 220 and the protrusion structure 223 in the first direction is small, for example, the movement amplitude of the protrusion structure 223 in the first direction is usually less than 1 μm, the protrusion structure 223 may not come into contact with the surface of the transducer member 230 during this process. Therefore, ΔV1 is independent of the protrusion structure 223, and the value of ΔV1 is small.
[0097] For sensing devices 210 of different types and / or sizes, the ratio or difference between the height H1 of the protrusion structure 223 and the thickness H3 of the elastic film 221 is within a certain range. In some embodiments, the ratio of the height H1 of the protrusion structure 223 to the thickness H3 of the elastic film 221 is in the range of 0.5-500. In some embodiments, the ratio of the height H1 of the protrusion structure 223 to the thickness H3 of the elastic film 221 is in the range of 1-500. In some embodiments, the ratio of the height H1 of the protrusion structure 223 to the thickness H3 of the elastic film 221 is in the range of 1-200. In some embodiments, the ratio of the height H1 of the protrusion structure 223 to the thickness H3 of the elastic film 221 is in the range of 1-100. In some embodiments, the ratio of the height H1 of the protrusion structure 223 to the thickness H3 of the elastic film 221 is in the range of 10-90. In some embodiments, the ratio of the height H1 of the protrusion structure 223 to the thickness H3 of the elastic film 221 is in the range of 20-80. In some embodiments, the ratio of the height H1 of the protrusion structure 223 to the thickness H3 of the elastic film 221 is in the range of 40-60.
[0098] In some embodiments, the protrusion 223 may be in direct contact with the surface of the transducer 230. In this case, the height H1 of the protrusion 223 is the same as or similar to the height H2 of the sensing cavity 250. Figure 3A and 3B This is a schematic diagram showing the protruding structure abutting against the second sidewall of the sensing cavity, according to some embodiments of this application. For example... Figure 3AAs shown, the protruding structure 223 can abut against the second sidewall of the sensing cavity 250. The protruding structure 223 can have a certain degree of elasticity. In this embodiment, when the elastic component 220 is excited by an external force and moves, it will drive the protruding structure 223 to move in the direction of the transducer component 230. When the elastic component 220 and the protruding structure 223 move, the volume of the sensing cavity 250 will decrease, and the change in the volume of the sensing cavity 250 can be expressed as ΔV1. In addition, since the protruding structure 223 itself abuts against the transducer component 230, the protruding structure 223 will be squeezed against the transducer component 230 under the action of an external force. Since the protruding structure 223 itself has a certain degree of elasticity, the force generated by the squeezing will cause the protruding structure 223 to undergo elastic deformation. When the protruding structure 223 undergoes elastic deformation, it will further reduce the volume of the sensing cavity 250. Figure 3B The figure shows the amplitude of the movement of the protruding structure 223 in the first direction and the resulting elastic deformation. The solid line P1 shows the shape and position of the protruding structure 223 after compression. The dashed line P2 shows the shape and position of the protruding structure 223 before compression. As can be seen from the figure, the volume of the sensing cavity 250 is further reduced due to the elastic deformation of the protruding structure 223. For ease of description, the value of the volume change of the sensing cavity 250 caused by the compression between the protruding structure 223 and the second sidewall of the sensing cavity 250 can be expressed as ΔV2. Based on the above, if the protruding structure 223 abuts against the second sidewall of the sensing cavity 250, then during the operation of the sensing device 210, the volume change ΔV of the sensing cavity 250 is the sum of ΔV1 and ΔV2. Therefore, the volume change ΔV of the sensing cavity 250 is larger than ΔV1, which can further improve the sensitivity of the sensing device 210. Furthermore, due to the deformation of the protrusion structure 223, the size of the protrusion structure 223 in the first direction becomes smaller than that in its natural state. Therefore, the height H2 of the sensing cavity 250 is smaller than the size of the protrusion structure 223 in the first direction (i.e., H1) in its natural state.
[0099] In some embodiments, the volume change ΔV2 of the sensing cavity 250 may be related to the material of the protrusion structure 223. The protrusion structure 223 may be made of a material with specific properties. For example, the protrusion structure 223 may have a specific Young's modulus. In some embodiments, the Young's modulus of the protrusion structure 223 is 10 kPa-10 MPa. In some embodiments, the Young's modulus of the protrusion structure 223 is 20 kPa-8 MPa. In some embodiments, the Young's modulus of the protrusion structure 223 is 50 kPa-5 MPa. In some embodiments, the Young's modulus of the protrusion structure 223 is 80 kPa-2 MPa. In some embodiments, the Young's modulus of the protrusion structure 223 is 100 kPa-1 MPa. For sensing devices 210 of different types and / or sizes, the ratio or difference between the Young's modulus of the protrusion structure 223 and the Young's modulus of the elastic film 221 may be within a certain range. In some embodiments, the ratio of the Young's modulus 223 of the protrusion structure to the Young's modulus of the elastic film 221 can be in the range of 0.005-1. In some embodiments, the ratio of the Young's modulus 223 of the protrusion structure to the Young's modulus of the elastic film 221 can be in the range of 0.01-1. In some embodiments, the ratio of the Young's modulus 223 of the protrusion structure to the Young's modulus of the elastic film 221 can be in the range of 0.05-0.8. In some embodiments, the ratio of the Young's modulus 223 of the protrusion structure to the Young's modulus of the elastic film 221 can be in the range of 0.1-0.6. In some embodiments, the ratio of the Young's modulus 223 of the protrusion structure to the Young's modulus of the elastic film 221 can be in the range of 0.2-0.4.
[0100] In some embodiments, the material used to fabricate the protrusion structure 223 may include one or more of silicone, silicone gel, silicone rubber, polydimethylsiloxane (PDMS), and styrenic block copolymers (SBS) to ensure that the protrusion structure 223 has high elasticity and a larger elastic deformation when subjected to the same amount of external force, thereby resulting in a larger volume change ΔV2 of the sensing cavity 250.
[0101] In some embodiments, the volume change ΔV2 of the sensing cavity 250 may also be related to the shape of the protrusion structure 223. In some embodiments, the shape of the protrusion structure 223 may be various shapes. Figures 4-6 Three different shapes of protrusion structures are shown. Among them, Figure 4 The protruding structure 423 is pyramid-shaped and distributed in a dot array on the inner surface of the elastic component 420. Figure 5 The protruding structure 523 is hemispherical in shape and is distributed in a dot array on the inner surface of the elastic component 520. Figure 6The protrusions 623 are striped in shape and distributed in a linear array on the inner surface of the elastic member 620. It is understood that this is for illustrative purposes only and is not intended to limit the shape of the protrusions 223. The protrusions 223 can also be other possible shapes, such as trapezoidal, cylindrical, or ellipsoidal.
[0102] Reference Figure 4 The protrusion 223 is pyramidal in shape. Compared to other shapes (e.g., hemispherical), when the protrusion 223 is subjected to external force, the pyramidal shape causes stress concentration at the top. For protrusions 223 of different shapes, if their Young's modulus is the same, the pyramidal shape will have lower equivalent stiffness, lower elastic modulus, and greater elastic deformation, resulting in a larger volume change ΔV2 in the sensing cavity 250 and a greater increase in the sensitivity of the sensing device 210.
[0103] In some embodiments, the sensitivity of the sensing device 210 is related to the resonant frequency ω0 (i.e., f0 in formula (3)) of the system composed of the mass unit 260 and the elastic member 220. Specifically, When decrease When the sound pressure change Δp in the sensing cavity 250 of the sensing device 210 increases, the resonant frequency ω0 of the system decreases. The resonant frequency ω0 affects the sensitivity of the sensing device 210 within a certain frequency range before and after the resonant frequency. Therefore, when adjusting the sensitivity of the sensing device 210 by adjusting its resonant frequency, the influence of the frequency range on the sensitivity of the sensing device 210 needs to be considered. In some embodiments, the resonant frequency of the sensing device 210 is in the range of 1500Hz-6000Hz. In some embodiments, the resonant frequency of the sensing device 210 is in the range of 1500Hz-5000Hz. In some embodiments, the resonant frequency of the sensing device 210 is in the range of 1500Hz-4000Hz. In some embodiments, the resonant frequency of the sensing device 210 is in the range of 1500Hz-3000Hz.
[0104] Figure 7This is a schematic diagram of a sensing device according to other embodiments of this application. Similar to sensing device 210, sensing device 710 may include a transducer 230, a housing 240, a sensing cavity 250, a mass element 260, a sealing element 270, and an elastic element 720. The housing 240 covers the transducer 230, forming an accommodating space 241. The elastic element 720, the mass element 260, and the sealing element 270 can be accommodated in the accommodating space 241. The outer edge of the elastic element 720 is fixedly connected to the transducer 230 through the sealing element 270. The elastic element 720, the transducer 230, and the sealing element 270 together constitute the sensing cavity 250. The mass element 260 is disposed on the side of the elastic element 720 away from the sensing cavity 250, and is used to increase the vibration amplitude of the elastic element 720.
[0105] In some embodiments, Figure 7 The sensing device 710 shown can be used as a vibration sensing device in the field of microphones, such as bone conduction microphones. For example, when applied to a bone conduction microphone, the sensing cavity 250 can also be called an acoustic cavity, and the transducer 230 can be an acoustic transducer. The acoustic transducer acquires the sound pressure changes of the acoustic cavity and converts them into electrical signals.
[0106] and Figure 2 The sensor 210 shown is different in that... Figure 7In the sensing device 710 shown, the elastic component 720 may include an elastic film 721 and an elastic microstructure layer 725. One side of the elastic microstructure layer 725 is connected to the elastic film 721, and the other side surface is provided with a protrusion structure 223. Exemplarily, the protrusion structure 223 can be processed in two ways. In one way (1), grooves are etched on a silicon wafer, the shape of which corresponds to the shape of the protrusion structure 223 to be made. Then, a material for making the protrusion structure 223 (e.g., PDMS) is coated on the silicon wafer, and the PDMS fills the grooves in the silicon wafer and forms a PDMS film on the surface of the silicon wafer. Then, before the PDMS in the grooves and the PDMS film on the surface of the silicon wafer are cured, a material for making the elastic film 721, such as polyimide (PI), is coated on the surface of the PDMS film. Finally, the PDMS film, the elastic film 721, and the protrusion structure 223 are cured and then removed. In another way (2), grooves are also etched on the silicon wafer. Then, the material for fabricating the protrusion structure 223 (e.g., PDMS) is coated onto the silicon wafer. After the PDMS in the groove and the PDMS film on the silicon wafer surface have cured, the material for fabricating the elastic film 721 (e.g., PI) is coated onto the surface of the PDMS film, or adhesive is added before coating. Finally, the elastic film 721 is removed after curing. Both the protrusion structure 223 and the elastic film 721 processed using the above two methods contain a layer of PDMS film on their surfaces; this PDMS film is the elastic microstructure layer 725.
[0107] In some embodiments, the elastic microstructure layer 725 and the elastic film 721 can be made of the same material. For example, both the elastic microstructure layer 725 and the elastic film 721 can be made of PDMS. Specifically, when processing the protrusion structure 223, a layer of PDMS film can be coated on the surface of the PDMS film (i.e., the elastic microstructure layer 725) as the elastic film 721. In some embodiments, the elastic microstructure layer 725 and the elastic film 721 can be made of different materials. For example, the elastic microstructure layer 725 can be made of PDMS, while the elastic film 721 can be made of PI. Another example is that the elastic microstructure layer 725 can be made of PDMS, while the elastic film 721 can be made of polytetrafluoroethylene (PTFE).
[0108] In some embodiments, the thickness of the elastic film 721 may be the same as or different from the thickness of the elastic film 221 in the foregoing embodiments. The thickness of the elastic microstructure layer 725 refers to the dimension of the elastic microstructure layer 725 in the first direction, which can be determined by… Figure 7H5 represents the thickness of the elastic microstructure layer 725. In some embodiments, the thickness H5 of the elastic microstructure layer 725 can be in the range of 1 μm to 1000 μm. In some embodiments, the thickness H5 of the elastic microstructure layer 725 can be in the range of 10 μm to 200 μm. In some embodiments, the thickness H5 of the elastic microstructure layer 725 can be in the range of 20 μm to 100 μm.
[0109] In some embodiments, when comparing sensing devices 210 of different types and / or sizes, the ratio of the thickness H5 of the elastic microstructure layer 725 to the thickness of the elastic member 720 (i.e., the sum of H5 and H3) can be in the range of 0.5-1. In some embodiments, the ratio of the thickness H5 of the elastic microstructure layer 725 to the thickness of the elastic member 720 is in the range of 0.8-1. In some embodiments, the ratio of the thickness H5 of the elastic microstructure layer 725 to the thickness of the elastic member 720 is in the range of 0.9-1.
[0110] Figure 8 These are schematic diagrams of sensing devices according to some embodiments of this application. For example... Figure 8 As shown, the sensing device 810 may include a transducer 230, a housing 240, a sensing cavity 250, a mass unit 260, and an elastic member 820. In some embodiments, except for the sealing method of the sensing cavity 250, Figure 8 The sensor 810 shown is Figure 7 The sensing device 710 shown is similar. The outer edge of the elastic member 820 of the sensing device 810 is directly fixedly connected to the housing 240, thereby forming a sensing cavity 250 together with the transducer 230, the housing 240, and the elastic member 820. In some embodiments, the elastic member 820 may include an elastic film 821 and an elastic microstructure layer 825. The protrusion structure 223 may be part of the elastic microstructure layer 825. The side of the elastic microstructure layer 825 facing away from the sensing cavity 250 is connected to the elastic film 821. The side of the elastic microstructure layer 825 near the sensing cavity 250 is disposed on the protrusion structure 223. The elastic film 821 and / or the elastic microstructure layer 825 can be directly connected to the housing 240, and the connection method includes bonding, snap-fitting, riveting, nailing, etc. For example, Figure 8 As shown, the edge of the elastic film 821 can be directly embedded in the side wall of the housing 240, and the elastic microstructure layer 825 can be tightly attached to the inner wall of the housing 240 to ensure the sealing of the sensing cavity 250. In this embodiment, the elastic component 820 is directly connected to the housing 240, which on the one hand ensures that the sensing cavity 250 has good sealing performance, and on the other hand eliminates the need for sealing components, simplifying the structure of the sensing device 810 and simplifying the manufacturing process of the sensing device 810.
[0111] In some embodiments, when the elastic member 820 is directly connected to the housing 240, the projected area of the mass unit 260 in the first direction is smaller than the projected area of the sensing cavity 250 in the first direction. Specifically, if the elastic member 820 (e.g., the elastic film 821 or elastic microstructure layer 825 of the elastic member 820) is directly fixedly connected to the housing 240, the projected area of the sensing cavity 250 in the first direction needs to be larger than the projected area of the mass unit 260 in the first direction, so that the edge of the mass unit 260 has a certain gap with the housing 240, allowing the mass unit 260 to vibrate in the first direction. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction is in the range of 0.05-0.95. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction is in the range of 0.1-0.9. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction is in the range of 0.2-0.9. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction is in the range of 0.3-0.8. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction is in the range of 0.4-0.7. In some embodiments, the ratio of the projected area of the mass unit 260 in the first direction to the projected area of the sensing cavity 250 in the first direction is in the range of 0.5-0.6.
[0112] Figure 9 This is a schematic diagram of a sensing device according to some embodiments of this application. Figure 9 The sensor 910 shown and Figure 2 Similar to the sensor 210 shown, the difference is that the elastic component 920 of the sensor 910 includes a first elastic component 920-1 and a second elastic component 920-2. The first elastic component 920-1 and the second elastic component 920-2 are respectively disposed on both sides of the mass unit 260 in the first direction. Specifically, the first elastic component 920-1 is located on the side of the mass unit 260 closer to the transducer 230, and the second elastic component 920-2 is located on the side of the mass unit 260 away from the transducer 230. Similar to... Figure 2The elastic component 220 shown includes a first elastic component 920-1 comprising a first elastic film 221-1 and a first protrusion structure 223-1 disposed on the surface (also called the inner surface) of the first elastic film 221-1 facing the sensing cavity 250. The edge of the first protrusion structure 223-1 is sealed to the transducer component 230 via a first sealing component 270-1, such that the first elastic film 221-1, the first protrusion structure 223-1, the first sealing component 270-1, and the transducer component 230 together form the sensing cavity 250. The second elastic component 920-2 includes a second elastic film 221-2 and a second protrusion structure 223-2 disposed on the side of the second elastic film 221-2 away from the sensing cavity 250. The edge of the second protrusion structure 223-2 is sealed to the top wall of the housing 240 (i.e., the side of the housing 240 away from the transducer component 230) via the second sealing component 270-2.
[0113] In some embodiments, at least one of the first elastic member 920-1 and the second elastic member 920-2 may include an elastic microstructure layer (not shown in the figures). Taking the first elastic member 920-1 as an example, the first elastic member 920-1 may include a first elastic film 221-1 and a first elastic microstructure layer, the first elastic microstructure layer being disposed on the side of the first elastic film 221-1 facing the transducer 230. The side of the first elastic microstructure layer facing the transducer 230 includes a first protrusion structure 223-1. The first protrusion structure 223-1 may be a part of the first elastic microstructure layer. The elastic microstructure layer may be related to the elastic microstructure layer in one or more of the foregoing embodiments (e.g., Figure 7 The elastic microstructure layer 725 shown is the same as or similar to that shown, and will not be described again here.
[0114] like Figure 9 As shown, the first elastic component 920-1 and the second elastic component 920-2 are distributed on opposite sides of the mass unit 260 along the first direction. Here, the first elastic component 920-1 and the second elastic component 920-2 can be approximated as a single elastic component 920. For ease of description, the elastic component 920 formed by the first elastic component 920-1 and the second elastic component 920-2 can be referred to as the third elastic component. The centroid of the third elastic component coincides with or approximately coincides with the center of gravity of the mass unit 260, and the second elastic component 920-2 is sealed to the top wall of the housing 240 (i.e., the side of the housing 240 facing away from the transducer 230). This allows the third elastic component to have a higher response sensitivity to vibrations of the housing 240 in the first direction than to vibrations of the housing 240 in the second direction within the target frequency range (e.g., below 3000Hz).
[0115] In some embodiments, the third elastic member (i.e., elastic member 920) vibrates in a first direction in response to vibration of the housing 240. Vibration in the first direction can be considered as a target signal picked up by the sensing device 910 (e.g., a vibration sensing device), and vibration in the second direction can be considered as a noise signal. During operation of the sensing device 910, the response sensitivity of the third elastic member to vibration of the housing 240 in the second direction can be reduced by reducing the vibration generated by the third elastic member in the second direction, thereby improving the directional selectivity of the sensing device 910 and reducing the interference of noise signals on sound signals.
[0116] In some embodiments, when the third elastic member vibrates in response to the vibration of the housing 240, if the centroid of the third elastic member coincides with or approximately coincides with the center of gravity of the mass unit 260, and the second elastic member 920-2 is sealed to the top wall of the housing 240 (i.e., the side of the housing 240 facing away from the transducer 230), then the vibration of the mass unit 260 in the second direction can be reduced while maintaining the third elastic member's response sensitivity to the vibration of the housing 240 in the first direction substantially unchanged. This reduces the third elastic member's response sensitivity to the vibration of the housing 240 in the second direction, thereby improving the directional selectivity of the sensing device 910. It should be noted that the approximate coincidence of the centroid of the third elastic member with the center of gravity of the mass unit 260 can be understood as the third elastic member having a regular geometric structure with uniform density, thus its centroid and center of gravity are approximately coincident. The center of gravity of the third elastic member can be considered as the center of gravity of the mass unit 260. In this case, the centroid of the third elastic member can be considered to be approximately coincident with the center of gravity of the mass unit 260. In some embodiments, when the third elastic member is an irregular structure or has a non-uniform density, its actual center of gravity can be considered to approximately coincide with the center of gravity of the mass unit 260. Approximate coincidence means that the distance between the actual center of gravity or the centroid of the third elastic member and the center of gravity of the mass unit 260 is within a certain range, for example, less than 100 μm, less than 500 μm, less than 1 mm, less than 2 mm, less than 3 mm, less than 5 mm, less than 10 mm, etc.
[0117] When the centroid of the third elastic component coincides with or nearly coincides with the centroid of the mass unit 260, the resonant frequency of the third elastic component vibrating in the second direction can be shifted to a higher frequency without changing the resonant frequency of the third elastic component vibrating in the first direction. The resonant frequency of the third elastic component vibrating in the first direction can remain essentially unchanged; for example, the resonant frequency of the third elastic component vibrating in the first direction can be a frequency within a relatively strong frequency range perceived by the human ear (e.g., 20Hz-2000Hz, 2000Hz-3000Hz, etc.). Meanwhile, the resonant frequency of the third elastic component vibrating in the second direction can be shifted to a higher frequency range, falling within a relatively weak frequency range perceived by the human ear (e.g., 5000Hz-9000Hz, 1kHz-14kHz, etc.).
[0118] Figure 10 This is a schematic diagram of a sensing element according to some embodiments of this application. The sensing element 1010 can be a standalone component. The sensing element 1010 is assembled with a specific type of transducer (not shown) (e.g., by adhesive bonding or adhesion, or by other detachable means) to form a high-sensitivity sensing device (e.g., sensing device 10, sensing device 210). The specific type of transducer can generate a desired signal (e.g., an electrical signal) in response to changes in the volume of the first sensing cavity 1050. The specific type of transducer may include, for example, an acoustic transducer, such as an air conduction microphone.
[0119] like Figure 10 As shown, the sensing element 1010 may include a housing 240, a mass unit 260, a first sensing cavity 1050, and an elastic member 820. Figure 10 The elastic component 820, mass unit 260, and housing 240 shown can be coupled with Figure 8 The corresponding components or units of the sensing device 810 shown are the same or similar, and will not be described again here. The elastic member 820 can serve as the first sidewall of the first sensing cavity 1050, forming the first sensing cavity 1050 together with the housing 240. The first sensing cavity 1050 is a semi-enclosed structure. Furthermore, since the first sensing cavity 1050 of the sensing element 1010 is not enclosed, dust and impurities may enter the first sensing cavity 1050 during transportation and installation, affecting the performance of the sensing element 1010. Therefore, in some embodiments, a dustproof structure can be provided at the opening of the unenclosed sensing element 1010, i.e., on the opening side of the first sensing cavity 1050. Exemplary dustproof structures may include dustproof films, dust covers, etc.
[0120] The sensing element 1010, as an independent component, is connected to the specific type of transducer to form a sensing device (e.g., sensing device 10, sensing device 210). For example, the sensing element 1010 is attached to the transducer (e.g., including an acoustic transducer), and the transducer and the elastic member 820 are placed opposite each other to form a closed sensing cavity. The transducer converts the volume change of the closed sensing cavity into an electrical signal. In some embodiments, the transducer is connected to a connecting plate 1031. For example, the transducer is connected to the side of the connecting plate 1031 opposite to the sensing element 1010. The connecting plate 1031 can be a printed circuit board (PCB), such as a phenolic PCB paper substrate, a composite PCB substrate, a fiberglass PCB substrate, a metal PCB substrate, a multilayer PCB substrate, etc. In some embodiments, the connecting plate 1031 can be an FR-4 grade fiberglass PCB substrate made of epoxy fiberglass cloth. In some embodiments, the connecting plate 1031 can also be a flexible printed circuit board (FPC). The connecting plate 1031 can be equipped with circuits and other components (e.g., through laser etching, chemical etching, embedding, etc.), such as processors, memory, etc. In some embodiments, the transducer can be fixedly connected to the connecting plate 1031 by adhesive or metal pins. In some embodiments, the adhesive can be conductive adhesive (e.g., conductive silver paste, copper powder conductive adhesive, nickel-carbon conductive adhesive, silver-copper conductive adhesive, etc.). The conductive adhesive can be conductive glue, conductive film, conductive ring, conductive tape, etc. The connecting plate 1031 includes at least one opening 1033. The element in the transducer that acquires the sensing signal (e.g., the diaphragm of an air conduction microphone) can communicate with the first sensing cavity 1050 through the opening 1033.
[0121] By connecting the housing 240 of the sensing element 1010 to the connecting plate 1031, the sensing element 1010, the connecting plate 1031, and the transducer connected thereto can constitute a sensing device. The connection method between the housing 240 and the connecting plate 1031 can include bonding, snap-fitting, welding, riveting, nailing, etc. In this case, the elastic member 820, the housing 240, the connecting plate 1031, and the transducer's signal-acquiring element can collectively constitute a closed sensing cavity (such as sensing cavity 250). The first sensing cavity 1050 is a part of this closed sensing cavity (e.g., a sub-chamber). The connecting plate 1031 and the transducer's signal-acquiring element can constitute the second sidewall of the closed sensing cavity.
[0122] A protruding structure 823 is provided on the first sidewall formed by the elastic member 820. The protruding structure 823 can reduce the volume of the sensing cavity or part of the first sensing cavity 1050, thereby increasing the sensitivity of the sensing device. In some embodiments, when the sensing element 1010 and the transducer constitute a sensing device, the protruding structure can be configured to abut against the second sidewall of the sensing cavity. When the sensing element 1010 is in operation, the elastic member 820 drives the protruding structure 823 to vibrate and compress against the second sidewall of the sensing cavity, thereby generating elastic deformation. When the protruding structure undergoes elastic deformation, it can increase the volume change of the sensing cavity, thereby improving the sensitivity of the sensing element 1010. In addition, the presence of the protruding structure can effectively reduce the contact area between the elastic member 820 and the second sidewall of the sensing cavity, thus preventing adhesion to the second sidewall constituting the sensing cavity and improving the stability and reliability of the sensing element 1010.
[0123] It should be noted that the connecting plate 1031 can also be part of the sensing element 1010. A certain type of transducer component, connected to the connecting plate 1031, together with the sensing element 1010, constitutes a sensing device. In this case, the elastic component, the housing 240, and the connecting plate 1031 constitute a portion of the sensing cavity 1050.
[0124] The above description of the structure of the sensing element 1010 is merely a specific example and should not be considered as the only feasible implementation. Obviously, those skilled in the art, after understanding the basic principles of bone conduction loudspeakers, may make various modifications and changes in form and detail to the specific manner and steps of implementing the sensing element 1010 without departing from these principles; however, these modifications and changes remain within the scope of the above description. For example, the sensing element 1010 may not include the mass unit 260. As another example, when the sensing element 1010 is connected to the connecting plate 1031 of the acoustic transducer, the protruding structure 223 may not abut against the second sidewall formed by the connecting plate 1031.
[0125] The basic concepts have been described above. Obviously, for those skilled in the art, the above disclosure is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.
[0126] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.
[0127] Furthermore, those skilled in the art will understand that aspects of this application can be described and illustrated through several patentable types or situations, including any new and useful combination of processes, machines, products, or substances, or any new and useful improvements thereof. Accordingly, aspects of this application can be implemented entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. All of the above hardware or software may be referred to as a “data block,” “module,” “engine,” “unit,” “component,” or “system.” Furthermore, aspects of this application may be embodied as a computer product located on one or more computer-readable media, the product including computer-readable program code.
[0128] Furthermore, unless expressly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or other names described in this application are not intended to limit the order of the processes and methods of this application. Although some currently considered useful embodiments of the invention have been discussed in the foregoing disclosure by way of various examples, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments; rather, the claims are intended to cover all modifications and equivalent combinations that conform to the substance and scope of the embodiments of this application. For example, while the system components described above can be implemented by hardware devices, they can also be implemented solely by software solutions, such as installing the described system on existing servers or mobile devices.
[0129] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.
[0130] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with terms such as "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical data used in the specification and claims are approximate values, which may be changed according to the characteristics required by individual embodiments. In some embodiments, numerical data should take into account specified significant digits and employ general methods of digit reservation. Although the numerical ranges and data used to confirm their breadth in some embodiments of this application are approximate values, in specific embodiments, such numerical values are set as precisely as feasible.
[0131] Finally, it should be understood that the embodiments described in this application are merely illustrative of the principles of the embodiments of this application. Other modifications may also fall within the scope of this application. Therefore, alternative configurations of the embodiments of this application are considered as examples and not limitations, and are regarded as consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly described and illustrated in this application.
Claims
1. A sensing device, comprising: an elastic component; a sensing cavity, the elastic component constituting a first sidewall of the sensing cavity; and a transducing component for acquiring a sensing signal and converting it into an electrical signal, the transducing component being in communication with the sensing cavity, the sensing signal being related to a volume change of the sensing cavity, the transducing component constituting a second sidewall of the sensing cavity; wherein the elastic component is provided with a protruding structure on one side facing the sensing cavity, the protruding structure being moved by the elastic component in response to an external signal, the movement of the protruding structure changing the volume of the sensing cavity, the protruding structure abutting against the second sidewall of the sensing cavity, the second sidewall being opposite to the first sidewall, the protruding structure being elastic, the protruding structure being elastically deformed when the protruding structure is moved, the elastic deformation reducing the change of the volume of the sensing cavity, a spacing between adjacent protruding structures being 1 μm-2000 μm. 2.The sensing device of claim 1, wherein the protruding structure is arranged in an array on a surface of at least part of the elastic component. 3.The sensing device of claim 1, wherein the protruding structure is at least one of a pyramid shape, a semi-spherical shape, or a stripe shape. 4.The sensing device of claim 1, wherein the spacing between adjacent protruding structures is 10 μm-500 μm. 5.The sensing device of claim 1, wherein a height of the protruding structure is 1 μm-1000 μm. 6.The sensing device of any one of claims 1-5, wherein the height of the protruding structure is 10 μm-300 μm. 7.The sensing device of claim 1, wherein the elastic component comprises an elastic film and an elastic microstructure layer, the protruding structure being arranged on the elastic microstructure layer. 8.The sensing device of claim 7, wherein the elastic microstructure layer and the elastic film are made of the same material. 9.The sensing device of claim 7, wherein the elastic microstructure layer and the elastic film are made of different materials. 10.The sensing device of any one of claims 7-9, wherein a thickness of the elastic film is 0.1 μm-500 μm. 11.The sensing device of any one of claims 7-9, wherein the thickness of the elastic film is 1 μm-200 μm. 12.The sensing device of claim 9, wherein a difference between the height of the protruding structure and the height of the sensing cavity is within 10%. 13.The sensing device of any one of claims 1-5, 7-9, further comprising: a mass unit arranged on another surface of the elastic component, the mass unit and the elastic component collectively generating vibration in response to an external signal; and a housing, the elastic component, the mass unit, the sensing cavity, and the transducing component being accommodated in the housing. 14.The sensing device of claim 13, wherein the transducing component is an acoustic transducer. 15. The sensing device of claim 14, wherein the elastic member is disposed above the acoustic transducer and forms the sensing cavity between the elastic member and the acoustic transducer.
16. The sensing device of claim 15, wherein an outer edge of the elastic member is fixedly connected to the acoustic transducer by a sealing member, and the elastic member, the sealing member, and the acoustic transducer collectively form the sensing cavity.
17. The sensing device of claim 15, wherein an outer edge of the elastic member is fixedly connected to the housing, and the elastic member, the housing, and the acoustic transducer collectively form the sensing cavity.
18. The sensing device of claim 13, wherein the mass unit has a thickness of 1 μm - 1000 μm.
19. The sensing device of claim 13, wherein the mass unit has a thickness of 50 μm - 500 μm.
20. The sensing device of claim 13, wherein the mass unit and the elastic member form a resonant system having a resonant frequency of 1500 Hz - 6000 Hz.
21. The sensing device of claim 13, wherein the mass unit and the elastic member form a resonant system having a resonant frequency of 1500 Hz - 3000 Hz.
22. The sensing device of claim 13, further comprising: another elastic member symmetrically disposed on both sides of the mass unit, the other elastic member being fixedly connected to the housing.
23. A sensing element, comprising: an elastic member; and a first sensing cavity, the elastic member constituting a first side wall of the first sensing cavity, wherein the elastic member is provided with a protruding structure on a side facing the first sensing cavity, the elastic member causes the protruding structure to move in response to an external signal, the movement of the protruding structure changes a volume of the first sensing cavity, the protruding structure abuts a second side wall of the sensing cavity, the second side wall is opposite to the first side wall, the protruding structure has elasticity, the protruding structure produces elastic deformation when the protruding structure moves, the elastic deformation reduces the change in the volume of the sensing cavity, a spacing between adjacent protruding structures is 1 μm - 2000 μm.
24. The sensing element of claim 23, configured to be attached to a transducer, the transducer is placed opposite to the elastic member to form a closed sensing cavity, the transducer converts a volume change of the closed sensing cavity into an electrical signal.
25. A vibration sensing device, an elastic vibration member comprising a diaphragm; an acoustic transducer, the acoustic transducer and the diaphragm forming an acoustic cavity, the diaphragm constituting a first side wall of the acoustic cavity, the acoustic transducer being used to obtain a sensing signal and convert it into an electrical signal, the sensing signal being related to a volume change of the acoustic cavity, 26. The vibration sensing device of claim 25, wherein the diaphragm is provided with a protruding structure on a side facing the acoustic transducer, the diaphragm causes the protruding structure to move in response to an external signal, the movement of the protruding structure changes a volume of the acoustic cavity, the protruding structure abuts a second side wall of the acoustic cavity, the second side wall is opposite to the first side wall, the protruding structure has elasticity, the protruding structure produces elastic deformation when the protruding structure moves, the elastic deformation reduces the change in the volume of the sensing cavity, a spacing between adjacent protruding structures is 1 μm - 2000 μm. wherein The diaphragm is provided with a protruding structure on a side facing the acoustic cavity, the elastic vibration component causes the protruding structure to move in response to an external signal, the movement of the protruding structure changes the volume of the acoustic cavity, the protruding structure abuts a second side wall of the acoustic cavity, the second side wall is opposite to the first side wall, the protruding structure has elasticity, when the protruding structure moves, the protruding structure produces elastic deformation, the elastic deformation reduces the change in the volume of the acoustic cavity, the spacing between adjacent protruding structures is 1 μm -2000 μm.
26. A sensing element, comprising: an elastic component; and a sensing cavity, the elastic component constituting a first side wall of the sensing cavity, wherein the elastic component is provided with an elastic protruding structure on a side surface facing the sensing cavity, the Young's modulus of the elastic protruding structure is 100 kPa - 1MPa, the elastic component causes at least one of the movement and deformation of the protruding structure in response to an external signal, at least one of the movement and deformation of the protruding structure changes the volume of the sensing cavity, the protruding structure abuts a second side wall of the sensing cavity, the second side wall is opposite to the first side wall, the protruding structure has elasticity, when the protruding structure moves, the protruding structure produces elastic deformation, the elastic deformation reduces the change in the volume of the sensing cavity, the spacing between adjacent protruding structures is 1 μm -2000 μm.
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