Layer offset detection methods and apparatus, electronic equipment and storage media
By calculating the displacement, expansion, contraction, and rotation offset of the PCB sub-substrate and combining it with simulated point coordinates, the problem of accurately quantifying PCB layer offset in existing technologies has been solved, enabling accurate quantitative control of PCB layer offset and reducing the defect rate.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- GUANGZHOU FASTPRINT CIRCUIT TECH CO LTD
- Filing Date
- 2023-02-16
- Publication Date
- 2026-06-02
Smart Images
Figure CN116228847B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of PCB inspection technology, and in particular to a layer offset detection method and apparatus, electronic equipment and storage medium. Background Technology
[0002] Currently, printed circuit boards (PCBs) are composed of multiple substrates. These multiple substrates are laminated together to form a PCB. During the lamination process, misalignment can occur between the multiple substrates, a phenomenon known as layer misalignment. If the layer misalignment exceeds a certain value, it can cause defects such as open circuits and short circuits in the finished PCB, leading to an increased PCB defect rate.
[0003] In related technologies, calibration circles with overlapping projection positions are set on each layer of the PCB substrate, and the tangency of the calibration circles is detected using an X-ray drilling machine to determine whether the PCB has layer misalignment. However, the above method can only determine whether the PCB has layer misalignment, but cannot obtain the specific layer misalignment situation of the PCB, thus making it impossible to accurately quantify when controlling the layer misalignment of the PCB. Summary of the Invention
[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a layer offset detection method, which can achieve accurate and quantitative control of PCB layer offset.
[0005] The present invention also proposes a layer offset detection device, an electronic device applying the above-described layer offset detection method, and a computer-readable storage medium applying the above-described layer offset detection method.
[0006] A layer offset detection method according to a first aspect of the present invention is used to detect layer offset of a test board, the test board comprising a plurality of sub-substrates, each sub-substrate having a marking circle; the layer offset detection method includes:
[0007] Obtain the substrate parameters of the sub-substrate; wherein, the substrate parameters include the actual center point coordinates of the sub-substrate and the actual center coordinates of the marked circle;
[0008] The initial displacement offset of each sub-substrate is calculated based on the actual center point coordinates; wherein, the initial displacement offset with the largest value is taken as the target displacement offset.
[0009] The initial expansion / contraction offset of each sub-substrate is calculated based on the actual center coordinates; wherein, the initial expansion / contraction offset with the largest value is taken as the target expansion / contraction offset.
[0010] The actual centerline data of each sub-substrate is obtained based on the actual center coordinates and the actual center point coordinates, and the initial rotational offset of each sub-substrate is calculated based on the actual centerline data; wherein, the initial rotational offset with the largest value is taken as the target rotational offset.
[0011] The target simulation point coordinate set is obtained based on the initial displacement offset, the initial expansion and contraction offset, the initial rotation offset, and the preset initial simulation point coordinates;
[0012] The initial whole-board offset of each sub-substrate is calculated based on the target simulation point coordinate set; wherein, the initial whole-board offset with the largest value is taken as the target whole-board offset;
[0013] Layer offset detection is performed on the test board based on the target expansion / contraction offset, the target displacement offset, the target rotation offset, and the target overall board offset to obtain the layer offset detection result.
[0014] The layer offset detection method according to embodiments of the present invention has at least the following beneficial effects: The initial displacement offset of each sub-substrate is calculated based on the actual center point coordinates. The initial expansion / contraction offset of each sub-substrate is calculated based on the actual center coordinates. The actual centerline data of each sub-substrate is obtained based on the actual center coordinates and the actual center point coordinates, and the initial rotation offset of each sub-substrate is calculated based on the actual centerline data. A target simulation point coordinate set is obtained based on the initial displacement offset, the initial expansion / contraction offset, the initial rotation offset, and preset initial simulation point coordinates. The initial overall offset of each sub-substrate is calculated based on the target simulation point coordinate set. Specifically, the initial displacement offset with the largest value is taken as the target displacement offset, the initial expansion / contraction offset with the largest value is taken as the target expansion / contraction offset, the initial rotation offset with the largest value is taken as the target rotation offset, and the initial overall offset with the largest value is taken as the target overall offset. Finally, layer offset detection is performed on the test board based on the target expansion / contraction offset, the target displacement offset, the target rotation offset, and the target overall offset to obtain the layer offset detection result. The layer offset detection method in this embodiment can detect and analyze the layer offset of the PCB based on the offset of the three parts of displacement, expansion and contraction, and rotation, as well as the offset of the entire PCB board, thereby achieving accurate and quantitative control of PCB layer offset.
[0015] According to some embodiments of the present invention, the step of calculating the initial displacement offset of each sub-substrate based on the actual center point coordinates includes:
[0016] The coordinates of the reference center point are obtained by filtering the coordinates of the multiple actual center points.
[0017] The relative center point coordinates are obtained based on the actual center point coordinates and the reference center point coordinates.
[0018] The initial displacement offset of each sub-substrate is calculated based on the coordinates of the relative center point.
[0019] According to some embodiments of the present invention, the calculation of the initial expansion / contraction offset of each sub-substrate based on the actual center coordinates includes:
[0020] The actual target spacing of the marked circles on each of the sub-sub-substrates is obtained based on the actual center coordinates of the circles.
[0021] The initial expansion / contraction offset of each sub-substrate is calculated based on the actual target spacing.
[0022] According to some embodiments of the present invention, the step of calculating the initial expansion / contraction offset of each sub-substrate based on the actual target spacing includes:
[0023] By filtering multiple actual target spacings, a reference target spacing is obtained;
[0024] The expansion / contraction ratio of each sub-substrate is obtained based on the actual target spacing and the reference target spacing.
[0025] The initial expansion / contraction offset of each sub-substrate is calculated based on the expansion / contraction ratio.
[0026] According to some embodiments of the present invention, obtaining the actual centerline data of each sub-substrate based on the actual center coordinates and the actual center point coordinates, and calculating the initial rotational offset of each sub-substrate based on the actual centerline data, includes:
[0027] The actual centerline data of each sub-substrate is obtained based on the actual center coordinates and the actual center point coordinates;
[0028] The actual centerline data is filtered to obtain reference centerline data;
[0029] Based on the actual centerline data and the reference centerline data, the relative angle difference of each sub-substrate is obtained;
[0030] The initial rotational offset of each sub-substrate is calculated based on the relative angle difference.
[0031] According to some embodiments of the present invention, obtaining the target simulation point coordinate set based on the initial displacement offset, the initial expansion / contraction offset, the initial rotation offset, and the preset initial simulation point coordinates includes:
[0032] The average offset data is obtained by averaging the initial displacement offset, the initial expansion / contraction offset, and the initial rotation offset.
[0033] The coordinates of the initial simulation point are adjusted based on the average offset data, and the coordinates of the first target simulation point are calculated.
[0034] The coordinates of the initial simulated point are adjusted based on the initial displacement offset, the initial expansion offset, and the initial rotation offset, and the coordinates of the second target simulated point are calculated.
[0035] The target simulation point coordinate set is obtained based on the coordinates of the first target simulation point and the coordinates of the second target simulation point.
[0036] According to some embodiments of the present invention, the step of averaging the initial displacement offset, the initial expansion / contraction offset, and the initial rotation offset to obtain average offset data includes:
[0037] The initial displacement offset of all the sub-sub-substrates is averaged to obtain the average displacement offset.
[0038] The initial expansion / contraction offset of all the sub-substrates is averaged to obtain the average expansion / contraction offset.
[0039] The initial rotational offset of all the sub-sub-substrates is averaged to obtain the average rotational offset.
[0040] The average offset data is obtained based on the average displacement offset, the average expansion / contraction offset, and the average rotation offset.
[0041] A layer offset detection apparatus according to a second aspect embodiment of the present invention includes:
[0042] A substrate parameter acquisition module is used to acquire substrate parameters of sub-substrates; wherein, the board under test includes multiple sub-substrates, each sub-substrates is provided with a mark circle, and the substrate parameters include the actual center point coordinates of the sub-substrates and the actual center coordinates of the mark circle;
[0043] The displacement offset calculation module is used to calculate the initial displacement offset of each sub-substrate based on the actual center point coordinates; wherein, the initial displacement offset with the largest value is taken as the target displacement offset.
[0044] The expansion and contraction offset calculation module is used to calculate the initial expansion and contraction offset of each sub-substrate based on the actual center coordinates; wherein, the initial expansion and contraction offset with the largest value is taken as the target expansion and contraction offset.
[0045] The rotation offset calculation module, wherein the rotation offset acquisition module is used to obtain the actual centerline data of each sub-substrate based on the actual center coordinates and the actual center point coordinates, and to calculate the initial rotation offset of each sub-substrate based on the actual centerline data; wherein the initial rotation offset with the largest value is taken as the target rotation offset;
[0046] The simulated point coordinate calculation module, wherein the simulated point coordinate acquisition module is used to obtain the target simulated point coordinate group based on the initial displacement offset, the initial expansion offset, the initial rotation offset, and the preset initial simulated point coordinates;
[0047] The whole board offset calculation module is used to calculate the initial whole board offset of each sub-substrate based on the target simulation point coordinate group; wherein, the initial whole board offset with the largest value is taken as the target whole board offset.
[0048] A layer offset detection module is used to perform layer offset detection on the board under test based on the target expansion / contraction offset, the target displacement offset, the target rotation offset, and the target overall board offset, and obtain the layer offset detection result.
[0049] The layer offset detection device according to the embodiments of the present invention has at least the following beneficial effects: by adopting the above-described layer offset detection method, accurate and quantitative control of PCB layer offset is achieved.
[0050] An electronic device according to a third aspect embodiment of the present invention includes:
[0051] At least one memory;
[0052] At least one processor;
[0053] At least one computer program;
[0054] The computer program is stored in the memory, and the processor executes the at least one computer program to implement the layer bias detection method of the first aspect embodiment described above.
[0055] A computer-readable storage medium according to a fourth aspect embodiment of the present invention includes:
[0056] The computer-readable storage medium stores computer-executable instructions for causing a computer to perform the layer bias detection method of the first aspect embodiment described above.
[0057] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0058] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:
[0059] Figure 1 This is a flowchart of a specific embodiment of the layer offset detection method of the present invention;
[0060] Figure 2 This is a schematic diagram of a specific embodiment of the sub-substrate of the present invention;
[0061] Figure 3 for Figure 1 A flowchart illustrating the specific method of step S200;
[0062] Figure 4 A schematic diagram of a specific embodiment of a sub-substrate and a reference sub-substrate;
[0063] Figure 5 for Figure 1 A flowchart illustrating the specific method of step S300;
[0064] Figure 6 This is a schematic diagram of a specific embodiment of the target spacing on the sub-substrate of the present invention;
[0065] Figure 7 for Figure 5 A flowchart illustrating the specific method of step S320;
[0066] Figure 8 A schematic diagram of another specific embodiment of the sub-substrate and the reference sub-substrate;
[0067] Figure 9 for Figure 1 A flowchart illustrating the specific method of step S400;
[0068] Figure 10 A schematic diagram of another specific embodiment of the sub-substrate and the reference sub-substrate;
[0069] Figure 11 for Figure 1 A flowchart illustrating the specific method of step S500;
[0070] Figure 12 for Figure 11 A flowchart illustrating the specific method of step S510;
[0071] Figure 13 This is a block diagram of a layer offset detection device provided in an embodiment of the present invention;
[0072] Figure 14 A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present invention.
[0073] Figure label:
[0074] Sub-substrate 100, reference sub-substrate 110, marking circle 200, substrate parameter acquisition module 310, displacement offset calculation module 320, expansion and contraction offset calculation module 330, rotation offset calculation module 340, simulated point coordinate calculation module 350, whole board offset calculation module 360, layer offset detection module 370, processor 410, memory 420, input / output interface 430, communication interface 440, bus 450. Detailed Implementation
[0075] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.
[0076] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.
[0077] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0078] In the description of this invention, unless otherwise explicitly defined, terms such as "setting," "installing," and "connecting" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.
[0079] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0080] like Figure 1 As shown, this embodiment of the invention provides a layer offset detection method for detecting layer offset in a test board. The test board includes multiple sub-substrates, each of which has a marking circle. The layer offset detection method includes, but is not limited to, steps S100 to S700, which are described in detail below.
[0081] Step S100: Obtain the substrate parameters of the sub-substrate; wherein, the substrate parameters include the actual center point coordinates of the sub-substrate and the actual center coordinates of the marked circle.
[0082] Step S200: Calculate the initial displacement offset of each sub-substrate based on the actual center point coordinates; wherein, the initial displacement offset with the largest value is taken as the target displacement offset.
[0083] Step S300: Calculate the initial expansion / contraction offset of each sub-substrate based on the actual center coordinates; wherein, the initial expansion / contraction offset with the largest value is taken as the target expansion / contraction offset.
[0084] Step S400: Obtain the actual centerline data of each sub-substrate based on the actual center coordinates and the actual center point coordinates, and calculate the initial rotation offset of each sub-substrate based on the actual centerline data; wherein, the initial rotation offset with the largest value is taken as the target rotation offset.
[0085] Step S500: Obtain the target simulation point coordinate set based on the initial displacement offset, initial expansion offset, initial rotation offset, and preset initial simulation point coordinates.
[0086] Step S600: Calculate the initial whole board offset of each sub-substrate based on the target simulation point coordinate group; wherein, the initial whole board offset with the largest value is taken as the target whole board offset.
[0087] Step S700: Perform layer offset detection on the test board based on the target expansion / contraction offset, target displacement offset, target rotation offset, and target overall board offset to obtain the layer offset detection result.
[0088] In step S100 of some embodiments, the board under test is a PCB, and a board under test includes multiple sub-substrates stacked together. Each sub-substrate has a marking circle, for example, referring to... Figure 2 Each sub-substrate has a rectangular lamination surface, with a marking circle at each of its four corners. These four marking circles are symmetrical about the center point of the sub-substrate. Before lamination, each sub-substrate has the same specifications (such as length, width, and thickness), and the marking circles on each sub-substrate are positioned identically. Ideally, without any layer misalignment after lamination, the marking circles on each sub-substrate in the PCB will perfectly overlap.
[0089] Obtain the substrate parameters for each sub-substrate in the board under test. These parameters include the actual center point coordinates of each sub-substrate and the actual center coordinates of the marked circles on each sub-substrate. The substrate parameters can be obtained by measuring the PCB using an X-ray drilling machine. (Refer to...) Figure 2 O1 is the center point of the sub-substrate, and the coordinates of this center point are the actual center point coordinates of the sub-substrate. O2 is the center of the marked circle in the sub-substrate, and the coordinates of this center are the actual center coordinates of the marked circle.
[0090] In step S200 of some embodiments, when a layer misalignment occurs due to relative displacement between the sub-substrates during the lamination operation, it is necessary to determine the layer misalignment of the board under test based on the offset of the center point on each sub-substrate. The initial displacement offset of each sub-substrate can be calculated using the actual center point coordinates in the substrate parameters. This initial displacement offset characterizes the offset of each sub-substrate when relative displacement occurs between the sub-substrates of the board under test after lamination. After calculating the initial displacement offset of each sub-substrate, the initial displacement offset with the largest value is taken as the target displacement offset.
[0091] In step S300 of some embodiments, when expansion or contraction occurs between the sub-substrates after the lamination operation, resulting in layer misalignment, it is necessary to determine the layer misalignment of the board under test based on the offset of the center of the marked circle on each sub-substrate. The initial expansion / contraction offset of each sub-substrate can be calculated using the actual center coordinates in the substrate parameters. This initial expansion / contraction offset characterizes the offset of each sub-substrate when expansion or contraction occurs between the sub-substrates of the board under test after lamination. After calculating the initial expansion / contraction offset of each sub-substrate, the initial expansion / contraction offset with the largest value is taken as the target expansion / contraction offset.
[0092] In step S400 of some embodiments, when layer misalignment occurs due to rotation between the sub-substrates after the lamination operation, it is necessary to determine the layer misalignment of the test board based on the offset of the centerline of each sub-substrate. The actual centerline data of each sub-substrate is obtained by fitting the actual center coordinates and actual center point coordinates from the substrate parameters using the least squares method. The initial rotational offset of each sub-substrate can be calculated based on this actual centerline data. This initial rotational offset characterizes the offset of each sub-substrate when rotation occurs between the sub-substrates of the test board after lamination. After calculating the initial rotational offset of each sub-substrate, the initial rotational offset with the largest value is taken as the target rotational offset.
[0093] In step S500 of some embodiments, the target simulation point coordinate set is obtained based on the initial displacement offset, initial expansion / contraction offset, initial rotation offset, and preset initial simulation point coordinates obtained above. The initial simulation point coordinates are the coordinates of the simulation point on the sub-substrate, referring to... Figure 2The simulation points are the four points A1, A2, A3, and A4 on the sub-substrate that are farthest from the center point O1, i.e., the four simulation points are located at the four apex corners of the sub-substrate. Based on the initial displacement offset, initial expansion / contraction offset, and initial rotation offset of each sub-substrate, the coordinates of the initial simulation points are transformed to calculate the target simulation point coordinate set. This target simulation point coordinate set is the set of simulation point coordinates for all sub-substrates.
[0094] In step S600 of some embodiments, the initial overall offset of each sub-substrate can be calculated based on the obtained target simulation point coordinate set. This initial overall offset is used to characterize the overall offset of each sub-substrate after lamination. After calculating the initial overall offset of each sub-substrate, the initial overall offset with the largest value is taken as the target overall offset.
[0095] In step S700 of some embodiments, layer offset detection is performed on the test board based on the target expansion / contraction offset, target displacement offset, target rotation offset, and target overall board offset obtained above, to obtain a layer offset detection result. This layer offset detection result includes the specific influencing parameters of the three factors causing layer offset—displacement, expansion / contraction, and rotation—of the test board, as well as the maximum layer offset of the entire test board. Through the layer offset detection result, accurate and quantitative control of PCB layer offset can be achieved.
[0096] According to the layer misalignment detection method of this invention, the initial displacement offset and the target displacement offset are calculated based on the actual center point coordinates. The initial expansion / contraction offset and the target expansion / contraction offset are calculated based on the actual center point coordinates. The actual centerline data of each sub-substrate is obtained based on the actual center point coordinates and the actual center point coordinates, and the initial rotation offset and the target rotation offset are calculated based on the actual centerline data. The target simulation point coordinate set is obtained based on the initial displacement offset, the initial expansion / contraction offset, the initial rotation offset, and the preset initial simulation point coordinates. The initial overall board offset and the target overall board offset are calculated based on the target simulation point coordinate set. Finally, layer misalignment detection is performed on the board under test based on the target expansion / contraction offset, the target displacement offset, the target rotation offset, and the target overall board offset to obtain the layer misalignment detection result. The layer misalignment detection method of this embodiment can detect and analyze the layer misalignment of the PCB based on the offsets of displacement, expansion / contraction, and rotation, as well as the offset of the entire PCB board, thereby achieving accurate and quantitative control of PCB layer misalignment.
[0097] like Figure 3 As shown, in some embodiments of the present invention, step S200 includes, but is not limited to, steps S210 to S230, which will be described in detail below.
[0098] Step S210: Filter the coordinates of multiple actual center points to obtain the coordinates of the reference center point.
[0099] Step S220: Obtain the relative center point coordinates based on the actual center point coordinates and the reference center point coordinates.
[0100] Step S230: Calculate the initial displacement offset of each sub-substrate based on the coordinates of the relative center point.
[0101] In step S210 of some embodiments, any one of the actual center point coordinates of all sub-substrates is selected as the reference center point coordinate, and the sub-substrates where the reference center point is located are the reference sub-substrates.
[0102] In step S220 of some embodiments, the reference center point coordinates are used as the origin, and the actual center point coordinates of each sub-substrate are adjusted to obtain the relative center point coordinates of each sub-substrate. For example, referencing Figure 4 The coordinates of the actual center point O1r of a sub-substrate 100 are (x1, y1), and the coordinates of the reference center point O1c of the reference sub-substrate 110 are (x0, y0). Then the coordinates of the relative center point of the sub-substrate 100 are (x1-x0, y1-y0).
[0103] In step S230 of some embodiments, the initial displacement offset of each sub-substrate is calculated based on the coordinates of the relative center point. For example, refer to... Figure 4 The coordinates of the actual center point O1r of the sub-substrate 100 are (x1, y1), the coordinates of the reference center point O1c of the reference sub-substrate 110 are (x0, y0), and the coordinates of the relative center point of the sub-substrate 100 are (Gx, Gy), where Gx = x1 - x0 and Gy = y1 - y0. Then the initial displacement L1 of the sub-substrate can be calculated by the following formula (1):
[0104] L1=(Gx 2 +Gy 2 ) 0.5 =((x1-x0) 2 +(y1-y0) 2 ) 0.5 Equation (1)
[0105] Similarly, the initial displacement offset of all sub-sub-substrates can be calculated using the above method.
[0106] like Figure 5 As shown, in some embodiments of the present invention, step S300 includes, but is not limited to, steps S310 to S320, which will be described in detail below.
[0107] Step S310: Obtain the actual target spacing of the marked circles on each sub-substrate based on the actual center coordinates.
[0108] Step S320: Calculate the initial expansion / contraction offset of each sub-substrate based on the actual target spacing.
[0109] In step S310 of some embodiments, the actual target spacing of the marking circles can be calculated based on the actual center coordinates of the marking circles on the sub-substrate. For example, refer to... Figure 6 The sub-substrate 100 has four marking circles 200, which are symmetrical about the center point of the sub-substrate 100. After obtaining the actual center coordinates of each marking circle 200 on the sub-substrate 100, the four actual target spacings Fx, Nx, Lx, and Rx can be calculated. The actual target spacing is the distance between the centers of two adjacent marking circles 200. Similarly, the actual target spacing can be obtained for other sub-substrates in the same way.
[0110] In step S320 of some embodiments, after obtaining the actual target spacing of all marked circles on each sub-substrate, the initial expansion / contraction offset of each sub-substrate can be calculated based on the actual target spacing between the sub-substrates.
[0111] like Figure 7 As shown, in some embodiments of the present invention, step S320 includes, but is not limited to, steps S321 to S323, which will be described in detail below.
[0112] Step S321: Filter multiple actual target spacings to obtain the reference target spacing.
[0113] Step S322: Based on the actual target spacing and the reference target spacing, obtain the expansion / contraction ratio of each sub-substrate.
[0114] Step S323: Calculate the initial expansion / contraction offset of each sub-substrate based on the expansion / contraction ratio.
[0115] In step S321 of some embodiments, any one of the actual target spacings of all sub-sub-substrates is selected as a reference target spacing. The sub-substrates in which the reference target spacing is located are the reference sub-substrates, and the marking circle in the reference sub-substrates is the reference marking circle.
[0116] In step S322 of some embodiments, the expansion / contraction ratio of each sub-substrate is calculated based on the actual target spacing and the reference target spacing. For example, refer to... Figure 8 Taking one actual target spacing Fx1 of a sub-substrate 100 as an example, and the reference target spacing of the reference sub-substrate 110 as Fx0, the expansion / contraction ratio corresponding to the actual target spacing Fx1 in the sub-substrate 100 is Rf = Fx1 / Fx0. Similarly, the remaining expansion / contraction ratios Rn, Rl, and Rr in the sub-substrate 100 can be calculated.
[0117] In step S323 of some embodiments, after obtaining all the expansion / contraction ratios of each sub-substrate, the long-side expansion / contraction ratio Sx and the short-side expansion / contraction ratio Sy of each sub-substrate are calculated respectively. For example, the expansion / contraction ratios corresponding to the four actual target spacings in a sub-substrate are Rf, Rn, Rl, and Rr, respectively. (Refer to...) Figure 6 Fx corresponds to the expansion / contraction ratio Rf, Nx corresponds to the expansion / contraction ratio Rn, Lx corresponds to the expansion / contraction ratio Rl, and Rx corresponds to the expansion / contraction ratio Rr. Among them, Rf and Rn are the expansion / contraction ratios corresponding to the distance between two actual targets with relatively longer widths, and Rl and Rr are the expansion / contraction ratios corresponding to the distance between two actual targets with relatively shorter widths. Thus, the expansion / contraction ratio of the long side Sx = (Rf + Rn) / 2 and the expansion / contraction ratio of the short side Sy = (Rl + Rr) / 2 can be calculated. Suppose that the expansion / contraction ratios of the long side of any two sub-substrates in the test board are Sx1 and Sx2, and the expansion / contraction ratios of the short side are Sy1 and Sy2, then the initial expansion / contraction offset L2 of the sub-substrates 100 can be calculated by the following formula (2):
[0118] L2 = C * ((Sx1 - Sx2)) 2 +(Sy1-Sy2) 2 ) 0.5 Equation (2)
[0119] In equation (2), C is the distance between any point Pc on the sub-substrate 100 and the center point of the sub-substrate 100. The specific position of the arbitrary point Pc can be adaptively adjusted according to the test position of the test board as needed.
[0120] Similarly, the initial expansion and contraction offset of all sub-substrates can be calculated using the above method.
[0121] like Figure 9 As shown, in some embodiments of the present invention, step S400 includes, but is not limited to, steps S410 to S440, which will be described in detail below.
[0122] Step S410: Obtain the actual centerline data of each sub-substrate based on the actual center coordinates and the actual center point coordinates.
[0123] Step S420: Filter the actual centerline data to obtain reference centerline data.
[0124] Step S430: Based on the actual centerline data and the reference centerline data, obtain the relative angle difference of each sub-substrate.
[0125] Step S440: Calculate the initial rotational offset of each sub-substrate based on the relative angle difference.
[0126] In step S410 of some embodiments, the actual centerline data of the corresponding sub-substrate is obtained based on the actual center coordinates and actual center point coordinates of each sub-substrate. (Refer to...) Figure 2 After obtaining the actual center coordinates of the four marked circles 200 in the sub-substrate 100 and the actual center point coordinates of the center point O1 of the sub-substrate 100, the center line D of the sub-substrate 100 can be fitted based on the actual center point coordinates and the coordinates of the four actual circle centers, using the least squares algorithm. Figure 2 Any one of the center lines D is taken as the actual center line data of the sub-substrate 100. In this way, the actual center line data of each sub-substrate in the board under test can be obtained.
[0127] In step S420 of some embodiments, any one of the actual centerline data of all sub-substrates is selected as the reference centerline data. The sub-substrates in which the reference centerline data is located are the reference sub-substrates, and the center point of the reference sub-substrates is the reference center point.
[0128] In step S430 of some embodiments, the relative angle difference of each sub-substrate is calculated based on the actual centerline data and the reference centerline data. For example, referring to... Figure 10 If the actual centerline of sub-substrate 100 is D1 and the reference centerline of reference sub-substrate 110 is D2, then the relative angle difference of sub-substrate 100 is the angle ΔTh between the actual centerline D1 and the reference centerline D0. Similarly, the relative angle difference of each sub-substrate in the test board can be obtained in the above manner.
[0129] In step S440 of some embodiments, after obtaining the relative angle difference of each sub-substrate, the initial rotational offset of each sub-substrate is calculated based on the relative angle difference. (Refer to...) Figure 10 The actual centerline of sub-substrate 100 is D1, the reference centerline of reference sub-substrate 110 is D0, the relative angle difference of sub-substrate 100 is ΔTh, and the distance between any point P1 on sub-substrate 100 and the center point O1 of sub-substrate 100 is C. P0 is a point on reference sub-substrate 110 corresponding to point P1 on sub-substrate 100. Since the center point positions of reference sub-substrate 110 and sub-substrate 100 are the same, the distance between point P0 and the center point O1 of sub-substrate 100 is also C. The specific positions of any points P1 and P0 can be adaptively adjusted according to the test position of the test board as needed. Therefore, the initial rotation offset L3 of sub-substrate 100 can be calculated by the following formula (3):
[0130] L3=(2C 2 (1-cos(ΔTh))) 0.5 Equation (3)
[0131] Similarly, the initial rotational offset of all sub-sub-substrates can be calculated using the above method.
[0132] like Figure 11 As shown, in some embodiments of the present invention, step S500 includes, but is not limited to, steps S510 to S540, which will be described in detail below.
[0133] Step S510: Perform averaging on the initial displacement offset, initial expansion / contraction offset, and initial rotation offset to obtain the average offset data.
[0134] Step S520: Adjust the initial simulation point coordinates based on the average offset data, and calculate the coordinates of the first target simulation point.
[0135] Step S530: Adjust the coordinates of the initial simulation point based on the initial displacement offset, initial expansion offset, and initial rotation offset, and calculate the coordinates of the second target simulation point.
[0136] Step S540: Obtain the target simulation point coordinate set based on the coordinates of the first target simulation point and the second target simulation point.
[0137] In step S510 of some embodiments, the initial displacement offset, initial expansion / contraction offset, and initial rotation offset are averaged to obtain average offset data. This average offset data can be regarded as data describing the offset of a virtual average sub-substrate, which is used to describe the average position of each sub-substrate.
[0138] In step S520 of some embodiments, the initial simulation point coordinates are adjusted based on the obtained average offset data to obtain the coordinates of the first target simulation point. The initial simulation point coordinates are the coordinates of the simulation point on the sub-substrate, referring to... Figure 2 The simulation points are the four points A1, A2, A3, and A4 on the sub-substrate that are farthest from the center point O1, i.e., the four simulation points are located at the four corners of the sub-substrate. The coordinates of the initial simulation points are adjusted using the average offset data, which means substituting the coordinates of the initial simulation points into the offset data of the average virtual layer to obtain the coordinates of the simulation points in the average virtual layer. These coordinates are the coordinates of the first target point.
[0139] In step S530 of some embodiments, the initial simulation point coordinates are adjusted according to the initial displacement offset, initial displacement offset, and initial rotation offset of each sub-substrate, so as to obtain the second target simulation point coordinates of each sub-substrate.
[0140] In step S540 of some embodiments, the target simulation point coordinate group can be obtained by combining the coordinates of the first target simulation point and the coordinates of the second target simulation point of each sub-substrate.
[0141] In step S600 of some embodiments, the distance between the first target simulation point and the second target simulation point of each sub-substrate is calculated using the coordinates of the first target simulation point and the coordinates of the second target simulation point of each sub-substrate, and this distance is used as the initial whole board offset.
[0142] like Figure 12 As shown, in some embodiments of the present invention, step S510 includes, but is not limited to, steps S511 to S514, which will be described in detail below.
[0143] Step S511: Average the initial displacement offset of all sub-sub-substrates to obtain the average displacement offset.
[0144] Step S512: Average the initial expansion and contraction offsets of all sub-substrates to obtain the average expansion and contraction offset.
[0145] Step S513: Average the initial rotation offset of all sub-sub-substrates to obtain the average rotation offset.
[0146] Step S514: Obtain the average offset data based on the average displacement offset, average expansion and contraction offset, and average rotation offset.
[0147] In step S511 of some embodiments, the initial displacement offset of all sub-sub-substrates is averaged to obtain the average displacement offset. The average displacement offset can be regarded as offset data describing the displacement of a virtual average sub-sub-substrates due to displacement, which is used to describe the average position of each sub-sub-substrates.
[0148] In step S512 of some embodiments, the initial expansion / contraction offset of all sub-substrates is averaged to obtain the average expansion / contraction offset. The average expansion / contraction offset can be regarded as offset data describing the offset of a virtual average sub-substrates due to expansion or contraction.
[0149] In step S513 of some embodiments, the initial rotational offset of all sub-substrates is averaged to obtain the average rotational offset. The average rotational offset can be regarded as offset data describing the offset of a virtual average sub-substrates due to rotation.
[0150] In step S514 of some embodiments, the average displacement offset, average expansion offset, and average rotation offset are combined to obtain the average offset data.
[0151] like Figure 13 As shown, this embodiment of the invention also provides a layer offset detection device, including:
[0152] The substrate parameter acquisition module 310 is used to acquire the substrate parameters of the sub-substrates; wherein, the board under test includes multiple sub-substrates, each sub-substrates is provided with a mark circle, and the substrate parameters include the actual center point coordinates of the sub-substrates and the actual center coordinates of the mark circle.
[0153] The displacement offset calculation module 320 is used to calculate the initial displacement offset of each sub-substrate based on the actual center point coordinates; wherein, the initial displacement offset with the largest value is taken as the target displacement offset.
[0154] The expansion and contraction offset calculation module 330 is used to calculate the initial expansion and contraction offset of each sub-substrate based on the actual center coordinates; wherein, the initial expansion and contraction offset with the largest value is taken as the target expansion and contraction offset.
[0155] The rotation offset calculation module 340 is used to obtain the actual centerline data of each sub-substrate based on the actual center coordinates and the actual center point coordinates, and to calculate the initial rotation offset of each sub-substrate based on the actual centerline data; wherein, the initial rotation offset with the largest value is taken as the target rotation offset.
[0156] The simulation point coordinate calculation module 350 is used to obtain the target simulation point coordinate set based on the initial displacement offset, initial expansion offset, initial rotation offset, and preset initial simulation point coordinates.
[0157] The whole board offset calculation module 360 is used to calculate the initial whole board offset of each sub-substrate based on the target simulation point coordinate group; wherein, the initial whole board offset with the largest value is taken as the target whole board offset.
[0158] The layer offset detection module 370 is used to perform layer offset detection on the test board based on the target expansion and contraction offset, target displacement offset, target rotation offset, and target overall board offset, and obtain the layer offset detection result.
[0159] It is evident that the content of the above-described layer offset detection method embodiments is applicable to this layer offset detection device embodiment. The specific functions implemented by this layer offset detection device embodiment are the same as those of the above-described layer offset detection method embodiments, and the beneficial effects achieved are also the same as those achieved by the above-described layer offset detection method embodiments.
[0160] The following is combined with Figure 14 The electronic device according to embodiments of the present invention will be described in detail.
[0161] like Figure 14 , Figure 14 The hardware structure of an electronic device according to another embodiment is illustrated. The electronic device includes:
[0162] The processor 410 can be implemented using a general-purpose central processing unit (CPU), microprocessor, application specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this disclosure.
[0163] The memory 420 can be implemented as a read-only memory (ROM), static storage device, dynamic storage device, or random access memory (RAM). The memory 420 can store the operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 420 and called and executed by the processor 410 to execute the layer offset detection method of the embodiments of this disclosure.
[0164] Input / output interface 430 is used to realize information input and output;
[0165] The communication interface 440 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).
[0166] Bus 450 transmits information between various components of the device (e.g., processor 410, memory 420, input / output interface 430, and communication interface 440);
[0167] The processor 410, memory 420, input / output interface 430 and communication interface 440 are connected to each other within the device via bus 450.
[0168] This invention also provides a computer-readable storage medium storing computer-executable instructions for causing a computer to perform the layer offset detection method as described in any of the above embodiments.
[0169] It is evident that the content of the above-described layer offset detection method embodiments is applicable to this computer-readable storage medium embodiment. The specific functions implemented by this computer-readable storage medium embodiment are the same as those of the above-described layer offset detection method embodiments, and the beneficial effects achieved are also the same as those achieved by the above-described layer offset detection method embodiments.
[0170] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.
[0171] Those skilled in the art will understand that all or some of the steps in the methods disclosed above, as well as the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, or suitable combinations thereof.
[0172] The terms "first," "second," "third," "fourth," etc. (if present) in the specification and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0173] It should be understood that in this invention, "at least one (item)" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.
[0174] In the several embodiments provided by this invention, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.
[0175] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.
[0176] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.
[0177] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions to cause an electronic device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing programs, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0178] The preferred embodiments of the present disclosure have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present disclosure. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and spirit of the present disclosure shall be within the scope of the claims of the present disclosure.
Claims
1. A layer offset detection method, characterized in that, A method for detecting layer misalignment in a test board, wherein the test board comprises multiple sub-substrates, each sub-substrate having a marking circle; the layer misalignment detection method includes: Obtain the substrate parameters of the sub-substrate; wherein, the substrate parameters include the actual center point coordinates of the sub-substrate and the actual center coordinates of the marked circle; The relative center point coordinates are obtained based on the actual center point coordinates and the reference center point coordinates, and the initial displacement offset of each sub-substrate is calculated based on the relative center point coordinates; wherein, the initial displacement offset with the largest value is taken as the target displacement offset, and the reference center point coordinates are obtained by filtering multiple actual center point coordinates. The initial displacement offset is used to characterize the offset of each sub-substrate when relative displacement occurs between the sub-substrates of the test board after pressing. The actual target spacing of the marked circles on each sub-substrate is obtained according to the actual center coordinates, and the initial expansion and contraction offset of each sub-substrate is calculated according to the actual target spacing; wherein, the initial expansion and contraction offset with the largest value is taken as the target expansion and contraction offset, and the initial expansion and contraction offset is used to characterize the offset of each sub-substrate when expansion or contraction occurs between the sub-substrates of the test board after pressing. The actual centerline data of each sub-substrate is obtained based on the actual center coordinates and the actual center point coordinates. The actual centerline data is then filtered to obtain reference centerline data. Based on the actual centerline data and the reference centerline data, the relative angle difference of each sub-substrate is obtained. The initial rotational offset of each sub-substrate is then calculated based on the relative angle difference. The initial rotational offset with the largest value is taken as the target rotational offset. The initial rotational offset is used to characterize the offset of each sub-substrate when rotation occurs between the sub-substrates of the test board after lamination. The initial displacement offset, the initial expansion / contraction offset, and the initial rotation offset are averaged to obtain average offset data. The preset initial simulation point coordinates are adjusted based on the average offset data to calculate the first target simulation point coordinates. The initial simulation point coordinates are then adjusted based on the initial displacement offset, the initial expansion / contraction offset, and the initial rotation offset to calculate the second target simulation point coordinates. Finally, a target simulation point coordinate set is obtained based on the first target simulation point coordinates and the second target simulation point coordinates. The target simulation point coordinate set is the set of simulation point coordinates of all the sub-substrates. Based on the coordinates of the first target simulation point and the coordinates of the second target simulation point of each sub-substrate, the distance between the first target simulation point and the second target simulation point of each sub-substrate is calculated, and the initial whole-board offset of each sub-substrate is determined based on the calculated distance; wherein, the initial whole-board offset with the largest value is taken as the target whole-board offset, and the initial whole-board offset is used to characterize the overall offset of each sub-substrate after lamination. Layer offset detection is performed on the test board based on the target expansion / contraction offset, the target displacement offset, the target rotation offset, and the target overall board offset to obtain the layer offset detection result.
2. The layer offset detection method according to claim 1, characterized in that, The calculation of the initial expansion / contraction offset of each sub-substrate based on the actual target spacing includes: By filtering multiple actual target spacings, a reference target spacing is obtained; The expansion / contraction ratio of each sub-substrate is obtained based on the actual target spacing and the reference target spacing. The initial expansion / contraction offset of each sub-substrate is calculated based on the expansion / contraction ratio.
3. The layer offset detection method according to claim 1, characterized in that, The step of averaging the initial displacement offset, the initial expansion / contraction offset, and the initial rotation offset to obtain average offset data includes: The initial displacement offset of all the sub-sub-substrates is averaged to obtain the average displacement offset. The initial expansion / contraction offset of all the sub-substrates is averaged to obtain the average expansion / contraction offset. The initial rotational offset of all the sub-sub-substrates is averaged to obtain the average rotational offset. The average offset data is obtained based on the average displacement offset, the average expansion / contraction offset, and the average rotation offset.
4. A layer misalignment detection device, characterized in that, include: A substrate parameter acquisition module is used to acquire substrate parameters of sub-substrates; wherein, the board under test includes multiple sub-substrates, each sub-substrates is provided with a mark circle, and the substrate parameters include the actual center point coordinates of the sub-substrates and the actual center coordinates of the mark circle; The displacement offset calculation module, wherein the displacement offset acquisition module is used to obtain the relative center point coordinates based on the actual center point coordinates and the reference center point coordinates, and to calculate the initial displacement offset of each sub-substrate based on the relative center point coordinates; wherein, the initial displacement offset with the largest value is taken as the target displacement offset, and the reference center point coordinates are obtained by filtering multiple actual center point coordinates, and the initial displacement offset is used to characterize the offset of each sub-substrate when relative displacement occurs between the sub-substrates of the test board after pressing; The expansion and contraction offset calculation module is used to obtain the actual target spacing of the marked circles on each sub-substrate based on the actual center coordinates, and to calculate the initial expansion and contraction offset of each sub-substrate based on the actual target spacing; wherein, the initial expansion and contraction offset with the largest value is taken as the target expansion and contraction offset, and the initial expansion and contraction offset is used to characterize the offset of each sub-substrate when expansion or contraction occurs between the sub-substrates of the test board after pressing; The rotation offset calculation module, and the rotation offset acquisition module, are used to obtain the actual centerline data of each sub-substrate based on the actual center coordinates and the actual center point coordinates, filter the actual centerline data to obtain reference centerline data, obtain the relative angle difference of each sub-substrate based on the actual centerline data and the reference centerline data, and calculate the initial rotation offset of each sub-substrate based on the relative angle difference; wherein, the initial rotation offset with the largest value is taken as the target rotation offset, and the initial rotation offset is used to characterize the offset of each sub-substrate when rotation occurs between the sub-substrates of the test board after lamination; The simulated point coordinate calculation module is used to perform mean processing to obtain average offset data, adjust the preset initial simulated point coordinates according to the average offset data, calculate the first target simulated point coordinates, and adjust the initial simulated point coordinates according to the initial displacement offset, the initial expansion offset, and the initial rotation offset to calculate the second target simulated point coordinates. Based on the first target simulated point coordinates and the second target simulated point coordinates, a target simulated point coordinate group is obtained, which is the set of simulated point coordinates of all the sub-substrates. The whole board offset calculation module is used to calculate the distance between the first target simulation point and the second target simulation point of each sub-substrate based on the coordinates of the first target simulation point and the coordinates of the second target simulation point of each sub-substrate, and to determine the initial whole board offset of each sub-substrate based on the calculated distance; wherein, the initial whole board offset with the largest value is taken as the target whole board offset, and the initial whole board offset is used to characterize the overall offset of each sub-substrate after lamination; A layer offset detection module is used to perform layer offset detection on the board under test based on the target expansion / contraction offset, the target displacement offset, the target rotation offset, and the target overall board offset, and obtain the layer offset detection result.
5. An electronic device, characterized in that, include: At least one memory; At least one processor; At least one computer program; The computer program is stored in the memory, and the processor executes the at least one computer program to implement the layer offset detection method as described in any one of claims 1 to 3.
6. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions for causing a computer to perform the layer offset detection method as described in any one of claims 1 to 3.